JP3468105B2 - Multilayer ceramic electronic component and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic electronic component, and more particularly, to a multilayer ceramic electronic component having a laminated structure in which a large number of internal electrodes are arranged in a ceramic with ceramic layers interposed therebetween, and a method for manufacturing the same.

[0002]

2. Description of the Related Art For example, a chip type monolithic ceramic capacitor, which is one of typical monolithic ceramic electronic components, is disclosed in, for example, FIG.
As shown in (c), the plurality of internal electrodes 51 are arranged so as to face each other with the ceramic layer 52 forming the ceramic capacitor element (chip) 61 interposed therebetween, and
The internal electrode 51 has a structure in which it is alternately drawn out to the opposite end faces 53a and 53b and connected to the external electrodes 54a and 54b. 7A is a perspective view, FIG. 7B is a front sectional view, and FIG. 7C is a side sectional view.

Such a monolithic ceramic capacitor is
Usually, it is manufactured through the steps described below.

(1) A ceramic green sheet to be an individual dielectric layer (ceramic layer) is formed by a method such as a doctor blade method. (2) Then, a conductive paste to be internal electrodes is printed on the surface of the ceramic green sheet to form an electrode printed sheet. (3) Then, a predetermined number of the electrode printing sheets are laminated, and ceramic green sheets (cover sheets) on which no conductive paste is printed are laminated on the upper and lower surfaces of both sides and pressure-bonded to form a laminated pressure-bonded body. . (4) Next, the laminated pressure-bonded body is fired. (5) After that, external electrodes that are electrically connected to the internal electrodes are formed at predetermined positions of the fired laminated crimp body (ceramic capacitor element) to obtain a laminated ceramic capacitor as shown in FIG.

Usually, in the laminated pressure-bonded body, ceramic green sheets having a large number of internal electrode patterns arranged in a matrix are laminated and pressure-bonded so that a large number of ceramic capacitor elements (chips) can be manufactured collectively. The laminated pressure-bonded body (mother laminated pressure-bonded body) is cut at a predetermined position to cut out individual elements and then fired.

By the way, in the monolithic ceramic capacitor manufactured as described above, in order to increase the acquired capacitance, the ceramic green sheet (dielectric layer) is used.
The number of stacked layers is increased. However, as the number of stacked layers increases, the thickness of the internal electrodes affects the area of the upper surface 61a of the multilayer ceramic capacitor (chip 61) corresponding to the portion where the internal electrodes 51 and the ceramic layers 52 overlap, as shown in FIG. A non-negligible step U occurs between 62 and a region 63 corresponding to a portion where only the ceramic layer 52 where the internal electrode 51 is not disposed is laminated.

As a result, when the monolithic ceramic capacitor 61 is mounted on a circuit board or the like, when the monolithic ceramic capacitor 61 is attempted to be vacuum adsorbed from the upper surface 61a side by the vacuum adsorption nozzle 64, as shown in FIG. There is a problem in that a gap G is formed between the suction port at the tip of the device and the monolithic ceramic capacitor, and a suction leak occurs so that the monolithic ceramic capacitor cannot be reliably adsorbed.

In order to solve such a problem, therefore, a method has been proposed in which the direction of the monolithic ceramic capacitor is selected and the surface other than the upper surface 61a having the step U is used as the suction surface. In the case of, there is a problem that the load of direction selection is large, which becomes a factor that hinders the improvement of productivity.

Further, a method of reducing the thickness of the internal electrode may be considered in order to suppress the occurrence of a step due to the thickness of the internal electrode. However, if the thickness of the internal electrode is reduced, the continuity of the internal electrode deteriorates. However, there is a problem that it causes a large decrease in electrostatic capacity.

The above-mentioned problems are not limited to the monolithic ceramic capacitors, but also apply to other monolithic ceramic electronic components such as a monolithic varistor and a monolithic LC composite component.

The present invention solves the above-mentioned problems, and it is possible to surely perform vacuum suction with a vacuum suction nozzle, and a multilayer ceramic electronic component that does not cause a decrease in electrostatic capacitance, and the same. It is intended to provide a manufacturing method.

[0012]

In order to achieve the above object, in the method for manufacturing a laminated ceramic electronic component according to the present invention (claim 1) , a plurality of internal electrodes are arranged so as to face each other with a ceramic layer interposed therebetween. A method of manufacturing a laminated ceramic electronic component having a laminated structure provided and picked up by a vacuum adsorption method, comprising a laminated body of a ceramic layer and an internal electrode.
In the process of crimping the
150 μm formed on the surface that becomes the adsorption surface when
Cut and polish oversteps, and attach to the vacuum suction surface 1
Cutting grinding to prevent the formation of steps exceeding 50 μm
It has a polishing process , and the cutting and polishing process is
Conducted before the firing of the laminated body of the Mick layer and the internal electrode
It is characterized by being done.

Crimping the laminated body of the ceramic layer and the internal electrode
When picking up by the vacuum adsorption method in the process of
Step over 150 μm formed on the surface that becomes the suction surface
By cutting and polishing the difference, surface to be the suction surface (e.g., inner electrode arrangement surface parallel to the top surface) by such step more than 150μm to is not formed, it can be reliably vacuum suction by the vacuum suction nozzle This makes it possible to improve the mounting reliability. Also, the cutting and polishing of the adsorption surface is baked.
By doing it before, it is possible to perform cutting and polishing efficiently.
Become Noh. Also, before dividing into individual chips, the mother
By cutting and polishing at the stage of laminated pressure-bonded body,
Improves productivity by enabling efficient cutting and polishing.
Can be raised.

The method for manufacturing a laminated ceramic electronic component according to a second aspect is characterized in that the thickness of the ceramic layer interposed between the internal electrodes is 10 μm or less, and the number of laminated ceramic layers is 100 or more. There is.

As described above, the thickness of the ceramic layer is 10
μm or less, the laminated number of stacked ceramic layers is 100 or greater
In the case of ceramic electronic parts, a large step is likely to occur due to the influence of the thickness of the internal electrodes,
By performing the cutting and polishing process so that a step exceeding m is not formed, it is possible to reliably perform vacuum suction using the vacuum suction nozzle, and it is possible to improve mounting reliability.

Further, in the method for manufacturing a monolithic ceramic electronic component according to a third aspect of the present invention, the suction surface to be cut and polished is a surface parallel to the internal electrode arrangement surface of the laminated body of the internal electrodes and the ceramic layer. It has a feature.

In the case of an electronic component having a small ceramic layer thickness and a large number of laminated layers, a large step is likely to occur on a pair of surfaces parallel to the internal electrode mounting surface due to the influence of the internal electrode thickness.
Of the pair of surfaces, the surface serving as the suction surface is subjected to cutting and polishing so as not to form a step of more than 150 μm, so that vacuum suction can be reliably performed using the vacuum suction nozzle. Can be effectively described. In addition, since it is not necessary to limit the thickness of the internal electrode in order to prevent the step from becoming large due to the influence of the thickness of the internal electrode, it is possible to reduce the acquired capacitance due to the decrease in the continuity of the internal electrode. It is possible to prevent it and obtain a desired capacitance.

In the method for manufacturing a monolithic ceramic electronic component according to a fourth aspect of the present invention, the method for cutting and polishing the adsorption surface is as follows.
At least one selected from a method of pressing against a lapping machine, a method of cutting with a cutting blade, and a method of spraying abrasive grains
It is characterized by using a seed method.

As a method of cutting and polishing the adsorption surface, a method of pressing against a lapping machine, a method of cutting with a cutting blade,
By using the method of spraying abrasive grains, the adsorption surface can be efficiently cut and polished, and the present invention can be further effectively demonstrated.

Further, the multilayer ceramic electronic component of the present invention (claim 5 ) has a structure in which a plurality of internal electrodes are arranged so as to face each other with a ceramic layer interposed therebetween, and is picked up by a vacuum adsorption method. It is a monolithic ceramic electronic component, in which a laminate of a ceramic layer and an internal electrode is pressure bonded.
In step, it puts upon being picked up by a vacuum adsorption method
Steps exceeding 150 μm formed on the surface that becomes the suction surface
However, before firing the laminated body of ceramic layers and internal electrodes
It has been cut and polished on the floor and the suction surface that is vacuum-sucked has 1
The feature is that no step of 50 μm or more is formed.

In the multilayer ceramic electronic component of the present invention, the suction surface is subjected to the cutting and polishing process so as not to form a step exceeding 150 μm, so that the vacuum suction nozzle can surely perform vacuum suction. The mounting reliability can be improved.

Further, the laminated ceramic electronic component according to claim 6, the thickness of the ceramic layers interposed between the internal electrodes 1
0 μm or less, and the number of laminated ceramic layers is 100
It is characterized by the above.

As mentioned above, the thickness of the ceramic layer is 10
In the case of electronic components with a ceramic layer thickness of 100 μm or less and a thickness of 100 μm or less, a large step is likely to occur due to the influence of the thickness of the internal electrodes, but cutting and polishing are performed so that the step that exceeds 150 μm is not formed on the suction surface. Since the processing is performed, the vacuum suction nozzle can surely perform the vacuum suction, and the mounting reliability can be further improved.

Further, the laminated ceramic electronic component according to claim 7 is characterized in that the suction surface, which has been cut and polished, is a surface parallel to the internal electrode arrangement surface of the laminated body of the internal electrode and the ceramic layer. There is.

In the case of an electronic component in which the thickness of the ceramic layer is small and the number of laminated layers is large, a large step is likely to occur on the surface parallel to the internal electrode arrangement surface due to the thickness of the internal electrode. When cutting and polishing is performed on the surface to be formed so as not to form a step difference of more than 150 μm, the suction surface can be surely vacuum-sucked by the vacuum suction nozzle, and the present invention can be more effectively realized. it can.
In addition, since it is not necessary to limit the thickness of the internal electrode in order to prevent the step from becoming large due to the influence of the thickness of the internal electrode, it is possible to reduce the acquired capacitance due to the decrease in the continuity of the internal electrode. It is possible to prevent it and obtain a desired capacitance.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION The features of the present invention will be described below in more detail with reference to the embodiments of the present invention.
In the following embodiments, a laminated ceramic capacitor will be described as an example of the laminated ceramic electronic component.

As shown in FIGS. 1A to 1C, the laminated ceramic capacitor of this embodiment has a plurality of internal electrodes 1
However, for example, the thickness is 10 μm or less (6 μm in this embodiment).
m) are arranged so as to face each other with the ceramic layer 2 interposed therebetween, and the internal electrodes 1 are alternately drawn out to the opposite end faces 3a, 3b of the ceramic capacitor element (chip) 11 so that the external electrodes 4a, It has a structure connected to 4b. In the laminated ceramic capacitor of this embodiment, the number of laminated ceramic layers is 230.

Further, in this laminated ceramic capacitor,
On the upper surface (adsorption surface) 11a of the pair of surfaces substantially parallel to the surface on which the internal electrode 1 is arranged, the size of the step U (the height difference between the high position and the low position) does not exceed 150 μm. The cutting and polishing process is applied.

Next, a method of manufacturing this laminated ceramic capacitor will be described. (1) First, a ceramic green sheet having a thickness of 6 μm is formed by a doctor blade method, and a nickel conductive paste is added to the ceramic green sheet.
By a screen printing method, printing was performed to a thickness of 1 to 1.5 μm to prepare a ceramic green sheet (electrode printed sheet) in which a plurality of internal electrode patterns were arranged at predetermined positions. (2) Next, a ceramic green sheet that is a cover sheet on which the internal electrode pattern is not printed is stacked, and a predetermined number of electrode printed sheets are stacked on it, and
Further thereon, a ceramic green sheet (cover sheet) on which no conductive paste was printed was laminated. The thickness of the cover sheet was set in consideration of the amount of cutting and polishing after pressure bonding. (3) Next, this laminated body was inserted into a press die, and pressure was applied to the laminate for pressure bonding. At this time, one surface parallel to the internal electrode arrangement surface of the laminated body is covered with an elastic sheet, and the other surface and side surface are crimped so that a rigid body abuts, and as shown in FIG. A laminated pressure-bonded body (mother laminated pressure-bonded body) 13 in which a plurality of internal electrodes 1 were arranged so as to face each other with a ceramic layer 2 interposed therebetween was obtained. When pressure-bonded by the above method, the amount of plastic deformation of the surface covered with the sheet made of an elastic body is large, and the amount of deformation is small on the other surface. One side 11
It will be formed only in a. (4) Then, the laminated pressure-bonded body 13 thus obtained
Before cutting into individual elements, as shown in FIG. 3, the surface 11a of the laminated pressure-bonded body 13 was cut and polished so that the step U was 150 μm or less. Incidentally, the cutting and polishing is, for example,
It can be carried out by a method of pressing it against a lapping machine, a method of cutting with a cutting blade, a method of spraying abrasive grains, and the like, and it is also possible to use other methods. (5) Next, the laminated pressure-bonded body 13 is cut, individual elements (chips) are cut out, and after firing under predetermined conditions, external electrodes are formed to obtain a laminated ceramic capacitor as shown in FIG. Obtained.

In the monolithic ceramic capacitor obtained as described above, since the surface (adsorption surface) 11a does not have a step exceeding 150 μm, it is possible to surely perform vacuum adsorption by the vacuum adsorption nozzle.

Further, since it is not necessary to limit the thickness of the internal electrode for the purpose of preventing the step difference from becoming large, it is possible to prevent the decrease of the acquired capacitance due to the decrease of the continuity of the internal electrode, and to reduce the desired capacitance. It is possible to obtain the capacitance of.

Further, since the cutting and polishing are performed before firing and before dividing into individual chips, it is possible to easily perform the cutting and polishing without the need for direction selection. Productivity can be improved.

Further, in the laminated ceramic capacitor of the above-described embodiment, when the amount of cutting and polishing of the surface 11a of the laminated pressure-bonded body 13 is changed to change the size of the step, the rate of occurrence of suction failure during mounting (failure) The rate) is shown in Table 1 and FIG.

[0034]

[Table 1]

To measure the rate of occurrence of this suction failure, hold the parts on a long tape, and identify the directionality of the four surfaces (upper surface / lower surface and both side surfaces) parallel to the pull-out direction of the internal electrodes. Instead, it was carried out by vacuum suction with a vacuum suction nozzle.

In Table 1, the defective rate is the number of laminated ceramic capacitors that cannot be mounted on the land of the substrate after being sucked by the vacuum suction nozzle from the holding state by the long tape. It is a ratio to the number (however, the total number of samples n = 1 × 10 ⁵ pieces).

The cutting and polishing amount Y indicates the cutting and polishing amount in the thickness direction of the laminated pressure-bonded body 13 before firing, as shown in FIG. 5 (a). Further, as shown in FIG. 5B, the size X of the step indicates the distance from the highest position of the center of the upper surface 11a of the laminated ceramic capacitor, which is a product after firing, to the shoulder.

The level difference on the surface (lower surface) covered with a rigid body during pressure bonding except the surface 11a of the ceramic capacitor element (chip) 11 was about 64 μm, and the level difference on the side surface formed by cutting was about 69 μm. .

Therefore, when measuring the adsorption failure rate under the above conditions, the probability that the surface 11a covered with the elastic sheet at the time of pressure bonding will be sucked by the vacuum suction nozzle is 25%. Then, depending on the size of the step U on the surface 11a, a suction failure may or may not occur. On the other hand, since the surfaces other than the surface 11a are crimped in a state of being in contact with the rigid body at the time of crimping, they are substantially flat and no suction failure occurs.

Therefore, if the adsorption failure rate in Table 1 is 10%, it means that 10% of the 25% of the surface 11a adsorbed has a failure, and the actual failure rate is 40%.
((10/25) × 100 = 40).

From this point of view, when looking at Table 1, in the case of Sample No. 1 in which cutting and polishing were not performed at all, the level difference was 2
When it is 00 μm or more, the adsorption failure rate is 14.6%, and the actual failure rate is (14.6 / 25) × 100 = 5.
It will be 8.4%.

On the other hand, cutting and polishing were carried out to obtain a step difference of 204.6.
In the case of Sample No. 2 having μm, the adsorption failure rate is somewhat reduced, but the failure rate is still 10.4% (actual failure rate is 41.6%).

On the other hand, if the step is 150 μm or less,
In the case of Sample No. 3 with 48.1 μm, the defective rate of adsorption was greatly reduced to 0.36% (actual defective rate was 1.44%), and Sample No. 4 with a smaller step was used. ~
In No. 6, no defective adsorption was observed.

From this result, it is understood that the step must be 150 μm or less in order to significantly reduce the occurrence rate of the suction failure.

In the above embodiment, a laminated ceramic capacitor has been described as an example, but the present invention is not limited to a laminated ceramic capacitor, and a laminated varistor and laminated L capacitor.
It can be applied to other monolithic ceramic electronic parts such as C composite parts, and in that case, the same effect can be obtained.

In the above embodiment, the case where the unfired laminated pressure-bonded body is cut and polished has been described as an example, but it is also possible to perform the cutting and polishing at a stage after firing.

As for the suction failure, as shown in FIG. 6, the vacuum suction nozzle 14 causes the flat portion 1 of the suction surface (upper surface) 11a.
It is preferable that the suction surface (upper surface) 11a be formed with a flat portion 15 that is as wide as possible because it is generated by a vacuum leak from the gap G that is deviated from 5. Specifically, for example, 60% of the suction surface 11a
By forming the flat surface 15 as described above,
Adsorption failure can be significantly reduced.

The invention of the present application is not limited to the above-mentioned embodiment in other respects as well, and it is possible to change the thickness of the ceramic layers, the number of laminated layers, the thickness of the internal electrodes, etc. within the scope of the invention. It is possible to add applications and modifications of.

[0049]

As described above, the method for manufacturing a laminated ceramic electronic component according to the present invention (Claim 1) comprises a ceramic layer and a ceramic layer.
In the process of pressure-bonding the laminated body of internal electrodes, the vacuum adsorption method is used.
Formed on the surface that becomes the suction surface when picked up.
The step difference of more than 150 μm is cut and polished to form a suction surface .
Comprising a surface (e.g., inner electrode arrangement surface parallel to the upper surface) 15
That the difference in level of more than 0μm is prevented from being formed
Therefore , the vacuum suction nozzle can surely perform the vacuum suction, and the mounting reliability can be improved.
In addition, it is necessary to perform cutting and polishing of the surface that becomes the adsorption surface before firing.
Therefore, it becomes possible to perform cutting and polishing efficiently. Well
Of the mother laminated crimp body before dividing it into individual chips
Cutting more efficiently by cutting and polishing in stages
To be able to polish and improve productivity
You can

Further, in the case of an electronic component in which the thickness of the ceramic layer is 10 μm or less and the number of laminated ceramic layers is 100 or more, a large step is likely to occur due to the influence of the thickness of the internal electrodes. As in the manufacturing method of 1), by performing cutting and polishing on the surface that will be the suction surface so that steps not exceeding 150 μm are not formed, it is possible to reliably perform vacuum suction using the vacuum suction nozzle. It is possible to improve the sex.

Further, in the case of an electronic component in which the thickness of the ceramic layer is small and the number of laminated layers is large, a large step is likely to occur on a surface parallel to the internal electrode arrangement surface due to the influence of the thickness of the internal electrode.
As in the method for manufacturing a monolithic ceramic electronic component according to claim 3, by performing a cutting and polishing process on a surface serving as a suction surface so that a step having a size of more than 150 μm is not formed, the suction surface is surely secured by using a vacuum suction nozzle. It is possible to perform vacuum suction, and it is possible to significantly improve mounting reliability. In addition, since it is not necessary to limit the thickness of the internal electrode in order to prevent the step from becoming large due to the influence of the thickness of the internal electrode, it is possible to reduce the acquired capacitance due to the decrease in the continuity of the internal electrode. It is possible to prevent it and obtain a desired capacitance.

Further, as in the method for manufacturing a monolithic ceramic electronic component according to claim 4 , as a method for cutting and polishing the adsorption surface, there are a method of pressing against a lapping machine, a method of cutting with a cutting blade, and a method of spraying abrasive grains. By using
The adsorption surface can be efficiently cut and polished, and the present invention can be further effectively realized.

Further, since the multilayer ceramic electronic component of the present invention (claim 5 ) is subjected to cutting and polishing so as not to form a step difference of more than 150 μm on the suction surface, the vacuum suction nozzle ensures the vacuum suction. It becomes possible to improve the mounting reliability.

Further, as described above, even when the thickness of the ceramic layer is 10 μm or less and the number of laminated ceramic layers is 100 or more, the surface serving as the attracting surface as in the laminated ceramic electronic component according to claim 6. It is possible to prevent a step difference of more than 150 μm from being formed on the suction surface by subjecting the surface to cutting and polishing.

Further, in the case of an electronic component in which the thickness of the ceramic layer is small and the number of laminated layers is large, a large step is likely to occur on the surface parallel to the internal electrode arrangement surface due to the influence of the thickness of the internal electrode.
When the surface to be the suction surface is cut and polished so as not to form a step exceeding 150 μm like the multilayer ceramic electronic component of claim 7 , the vacuum suction nozzle causes
The vacuum suction can be surely performed from the suction surface side, and the present invention can be more effectively realized. In addition, since it is not necessary to limit the thickness of the internal electrode in order to prevent the step from becoming large due to the influence of the thickness of the internal electrode, it is possible to reduce the acquired capacitance due to the decrease in the continuity of the internal electrode. It is possible to prevent it and obtain a desired capacitance.

[Brief description of drawings]

FIG. 1 is a diagram showing a monolithic ceramic electronic component (multilayer ceramic capacitor) according to an embodiment of the present invention, in which (a) is a perspective view, (b) is a front sectional view, and (c) is a side sectional view. is there.

FIG. 2 is a cross-sectional view showing a multilayer pressure-bonded body (mother multilayer pressure-bonded body) formed in a manufacturing process of a multilayer ceramic capacitor according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a step of cutting and polishing a laminated pressure-bonded body (mother laminated pressure-bonded body) formed in the manufacturing process of the laminated ceramic capacitor according to the embodiment of the present invention.

FIG. 4 is a diagram showing the relationship between the size of the step and the occurrence rate (defective rate) of suction failure during mounting when the size of the step is changed by changing the cutting and polishing amount of the laminated pressure-bonded body. .

5A is a diagram showing a cutting and polishing amount of a monolithic ceramic capacitor, and FIG. 5B is a diagram showing a size of a step formed on a suction surface of a monolithic ceramic capacitor.

FIG. 6 is a cross-sectional view showing a state where a suction failure occurs when a multilayer ceramic capacitor is sucked by a vacuum suction nozzle.

7A and 7B are diagrams showing a conventional monolithic ceramic capacitor (multilayer ceramic electronic component), in which (a) is a perspective view, (b) is a front sectional view, and (c) is a side sectional view.

FIG. 8 is a cross-sectional view showing a state in which a step is formed on an adsorption surface of a conventional multilayer ceramic capacitor.

FIG. 9 is a diagram showing a state of occurrence of suction failure when a conventional multilayer ceramic capacitor is vacuum-sucked.

[Explanation of symbols]

1 internal electrode 2 ceramic layers 3a, 3b End face of ceramic capacitor element 4a, 4b external electrodes 11 Ceramic capacitor element (chip) 11a surface (adsorption surface) 13 Laminated crimp body (Mother laminated crimp body) 14 Vacuum suction nozzle U step X Step size Y Cutting amount of upper surface

Continuation of the front page (56) Reference JP-A-6-6109 (JP, A) JP-A-5-234808 (JP, A) JP-A-9-205040 (JP, A) JP-A-7-14745 (JP , A) JP 61-139018 (JP, A) JP 9-129482 (JP, A) JP 9-17688 (JP, A) JP 9-129487 (JP, A) JP 9-153429 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01G 4/00-4/42 H03H 3/02

Claims (7)

(57) [Claims] 1. A ceramic layer facing each other through a ceramic layer.
It has a laminated structure in which multiple internal electrodes are arranged in
Monolithic ceramic electronic components picked up by the attachment method
The manufacturing method ofIn the process of pressing the laminated body of the ceramic layer and the internal electrode,
With the adsorption surface when picked up by the empty adsorption method
Cutting and polishing steps over 150 μm formed on the surface
do it, Steps of more than 150 μm on the vacuum suction surface
To prevent the formation ofCutting and polishingWith processCage,
And, The cutting and polishing step is a laminate of a ceramic layer and an internal electrode.
Performed at the stage before firing Stacking characterized by
Manufacturing method of ceramic electronic components. 2. The method for manufacturing a laminated ceramic electronic component according to claim 1, wherein the thickness of the ceramic layer interposed between the internal electrodes is 10 μm or less, and the number of laminated ceramic layers is 100 or more. . 3. The monolithic ceramic electron according to claim 1, wherein the adsorption surface to be cut and polished is a surface of the laminated body of the internal electrode and the ceramic layer, which is parallel to the internal electrode arrangement surface. Manufacturing method of parts. 4. The method for cutting and polishing the adsorption surface is characterized by using at least one method selected from a method of pressing against a lapping machine, a method of cutting with a cutting blade, and a method of spraying abrasive grains. method of manufacturing a multilayer ceramic electronic component according to any of claims 1-3. 5. A laminated ceramic electronic component which has a structure in which a plurality of internal electrodes are arranged so as to face each other with a ceramic layer interposed therebetween, and is picked up by a vacuum adsorption method . In the process of crimping the laminated body,
With the adsorption surface when picked up by the empty adsorption method
The level difference of more than 150 μm formed on the
Of the cutting layer and internal electrodes before firing.
It is polished, multilayer ceramic electronic component, characterized in that the suction surface to be vacuum suction is not formed above the step 150 [mu] m. 6. The monolithic ceramic electronic component according to claim 5 , wherein the thickness of the ceramic layer interposed between the internal electrodes is 10 μm or less, and the number of laminated ceramic layers is 100 or more. The suction surface 7. are cutting and polishing is a stack of internal electrodes and the ceramic layers, the multilayer ceramic according to claim 5 or 6, characterized in that the plane parallel to the internal electrode disposition surface Electronic components.