JP3462315B2 - Manufacturing method of sensor element - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a sensor element used for a pressure sensor, a load sensor, etc., and more particularly to a method for manufacturing a plurality of objects to be processed by feeding a plurality of objects to be processed at one time. The present invention relates to a method for manufacturing a sensor element, which enables simultaneous manufacture of the sensor element.

[0002]

2. Description of the Related Art Generally, sensor elements used for pressure sensors, load sensors, etc.
It is configured as shown in FIG.

That is, the sensor element 5 has a cylindrical shape with one end closed, and has a peripheral surface formed in two steps of a large diameter portion 5a and a small diameter portion 5b, and the upper surface side of the large diameter portion 5a ( A strain gauge (not shown) is formed in a predetermined pattern on the closed portion by a film forming method such as vapor deposition and sputtering.

As shown in FIG. 19, such a sensor element has a "process of cutting or forging", a "cleaning process",
There are seven processes: "surface polishing process", "cleaning process", "film formation (functional film formation by vapor deposition or sputtering)", "patterning (spin coating, exposure, etching, etc.) process", and "cleaning process". However, in the past, there was no effective means to send a plurality of products to each process at one time for processing, so the products must be sent to each process one by one. Therefore, it took a long time to manufacture the plurality of sensor elements 5, and the productivity was very poor.

For example, the "surface polishing step" will be explained. As shown in FIG. 20, a holder 60 having holes 61 into which the workpiece 6 can be inserted is provided at a plurality of positions, and a holder 64 is positioned on a polishing plate 65. The workpiece 6 is inserted into each hole 61 of the holder 60, and the weight 67 is positioned above the workpiece 6 via the elastic material 66 so that each workpiece 6 can be moved toward the polishing plate 65. Then, the polishing plate 65 is operated in this state, so that a plurality of workpieces 6 are polished at the same time.

In this case, since the variation in the dimension of the plurality of workpieces 6 in the height direction is absorbed by the elastic deformation of the elastic material 66, the higher ones are polished first and gradually polished. The height of the whole goes evenly, and at the end the height is made uniform.

However, since the workpieces 6 must be mounted in the holes 61 of the holder 60 one by one, the work is troublesome, and when the dimensional variation in the height direction is large, the elastic material is used. Even if the deformation of 66 does not occur, the variation cannot be completely absorbed, and although it is low, the handling becomes insufficient, and the sagging occurs on the polished surface. Even if the sensor element 5 has a cylindrical shape as shown in FIG. 6B, the same problem as described above occurs.

On the other hand, Japanese Unexamined Patent Publication (Kokai) No. 58-149168 discloses a method for polishing a wafer. In this polishing method, each hole of a holder provided with a plurality of holes for holding an object to be processed is covered. A work piece is held and positioned between the upper and lower polishing plates so that both surfaces of a plurality of work pieces are polished at the same time.

However, even in such a case, since the workpieces must be mounted in the holes of the holder one by one, the work is troublesome, and each workpiece is completely inserted in each hole. Since it is not fixed on the polishing surface, there is a possibility that the polishing surface may be drooped.

The present invention solves the above-mentioned problems of the conventional ones, and a plurality of products to be manufactured can be sent to each process at a time to be processed, thereby significantly improving the productivity. It is an object of the present invention to provide a method of manufacturing a sensor element that can be manufactured.

[0011]

In order to solve the above problems, the present invention is a method for manufacturing a substantially cylindrical sensor element having one end closed, which is flexible in the thickness direction.
Sheets of a plurality of the product in the holding plate, the holding its treated surface
Fixed so as to face the direction of flexing of the plate, the holding plate and a plurality of
And the product as one unit that is integrated, first Ken
It is sent to the polishing process, and the processed surfaces of multiple products are polished.
Is located on the polishing machine so that
Be pressed in the direction of the polishing plate directly or through the holding plate.
And polishing the processed surfaces of multiple workpieces simultaneously.
After the completion, send the above unit to the process such as film formation,
Manufacturing multiple sensor elements at the same time
It adopts the means. Further, a method for producing a substantially tubular sensor element having one end closed, a plurality of holes on one holding plate having flexibility in the thickness direction, of the hole
At least two cantilever beams protruding inward in the radial direction are provided on the surface, and the processed surface of each of the workpieces is located at the position of each hole.
It is positioned so as to face the bending direction of the
By fixing the cantilever to this holding plate and a plurality of products to be manufactured,
Send the body as a unit to the polishing process first
Therefore, the treated surfaces of multiple workpieces face the polishing machine.
Located on the polishing plate, directly
Multiple products can be manufactured by pressing in the direction of the polishing plate through the holding plate.
The treated surface of the structure is polished at the same time, and after the polishing is completed, the above
Sending the unit to the process such as film formation and going through each process
It employs a means for simultaneously manufacturing a plurality of sensor elements .

[0012]

By adopting the above-mentioned means, the present invention provides a flexible holding plate that can be displaced in the thickness direction.
This is the maximum with one unit consisting of several products to be fixed.
First, send it to the polishing process,
It is located on the polishing disc so that it faces the polishing disc and
Holding or pressing the product directly toward the polishing machine
Multiple products to be pressed while pressing in the direction of the polishing plate through the plate
The polishing of the treated surface is simultaneously performed. In this case,
Even if there are variations in the height of the product,
Rippling is caused by displacement of the holding plate in the thickness direction, or
It is absorbed by the displacement of the cantilever. So
Then, after polishing, send one unit to the process such as film formation,
Multiple sensor elements can be manufactured simultaneously by going through each process.
Will be built.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a method for manufacturing a sensor element according to the present invention shown in the drawings will be described below.
1 to 5 show a first embodiment of a method for manufacturing a sensor element according to the present invention, FIG. 1 is a plan view showing a holding plate for holding an object to be manufactured, and FIG. 3A is a partially enlarged view of FIG. 3A, FIG. 3A is a partially enlarged view of the state shown in FIG. 1 in which a product is held, and FIG. 4A is FIG.
FIG. 5A is a side view of what is shown in FIG. 5A, and FIG. 5 is an explanatory view showing a state in which the object to be manufactured is held and sent to the surface polishing step in what is shown in FIG.

That is, in the method of manufacturing the sensor element according to this embodiment, the sensor element 5 has a cylindrical shape with one end closed and the peripheral surface is formed in two stages of the large diameter portion 5a and the small diameter portion 5b. (See FIG. 6A)
A product 6 having a cylindrical shape whose one end is closed is processed into two stages of a large diameter portion 6a and a small diameter portion 6b (FIG. 3 (a),
A plurality of sensor elements 5 are simultaneously manufactured by holding a plurality of holding plates 1 (see FIGS. 4 (a) and 5) and sending them to each process as one unit for processing. is there.

The holding plate 1 is a flexible thin plate made of metal having a thickness of about 100 μm, for example, stainless steel having excellent corrosion resistance, and has a small diameter portion 6b of the object 6 to be manufactured.
Holes 2 that can be inserted into the holes 2 are formed by etching, punching, or the like, and a pair of triangular cuts 3 and 3 are provided at opposing portions of the inner peripheral surface of each hole 2, and adjacent cuts 3 and 3 are formed. A triangular beam 4 for supporting the product to be manufactured is formed.

In order to hold a plurality of workpieces 6 on the holding plate 1 as described above, the small diameter portion 6b of the workpiece 6 is inserted into each hole 2 and the beam 4 of each hole 2 and each workpiece. The large-diameter portion 6a of the object 6 is integrally fixed by series welding or the like. The welding strength in this case is such that it does not come off during the processing of each step and can be easily removed after the completion of each step.

Then, a plurality of workpieces 6 held on the holding plate 1 are used as one unit and sent to each process such as polishing, film formation, etc. to be processed, whereby a plurality of sensor elements 5 are simultaneously manufactured. It is a thing.

For example, the "surface polishing step" will be described. A plurality of workpieces 6 held by the holding plate 1 are located on the polishing plate 7 together with the holding plate 1, and a weight 8 is placed on the polishing plate 7. Each product 6 is pressed toward the polishing plate 7 (see FIG. 5).

In this case, the variation in the dimension of each of the workpieces 6 in the height direction is absorbed by the displacement of the flexible holding plate 1 in the height direction, and each of the workpieces 6 has a corresponding hole. It is completely fixed to the holding plate 1 by two beams 4.

Therefore, even if the polishing plate 7 is operated, the respective workpieces 6 do not move in the holes 2, and the pressing force in the direction of the polishing plate 7 is large because the variation in the height direction is large. Even if it is partially insufficient, there is no risk of sagging on the polishing surface, and the workpiece 6 is polished in order from the highest one, and the entire height gradually becomes uniform, and finally the entire height becomes uniform. Will be finished to the dimensions.

Further, a plurality of products 6 to be manufactured are held on the holding plate 1 to form one unit, and the products are sent to each process for processing, so that one product 6 is processed in each process. Compared with the conventional method of sending in, processing time in the polishing process, spin coating in the film forming process, processing time such as exposure, processing time in the cleaning process, etc. can be greatly shortened, and productivity is greatly improved. It can be increased. The product 6 is not limited to the one with a flange, and the cylindrical product shown in FIGS. 3 (b) and 4 (b) can be similarly fixed. The element 5 is as shown in FIG.

7 to 9 (a) show a second embodiment of the method for manufacturing a sensor element according to the present invention, and FIG. 7 is a plan view showing a holding plate for holding an object to be manufactured. 8 is a partially enlarged view showing a state in which the object to be manufactured is held on the one shown in FIG. 7, and FIG. 9A is a side view of the one shown in FIG.

That is, also in the method of manufacturing the sensor element shown in this embodiment, as in the case of the first embodiment, one end is closed to form a tubular shape and the peripheral surface is formed with the large diameter portion 5a. A method of manufacturing a sensor element 5 (see FIG. 6 (a)) formed in two stages of a small diameter portion 5b, in which a peripheral surface of a cylindrical body having one end closed is provided with a large diameter portion 6a and a small diameter portion 6b.
A plurality of workpieces 6 processed in two stages (see FIGS. 8 and 9 (a)) are held on a holding plate 11, and a plurality of the processed products are sent to each process as one unit to process the plurality of sensor elements. 5 is manufactured at the same time.

Here, the holding plate 11 is a flexible thin plate made of metal having a thickness of about 100 μm, for example, stainless steel having excellent corrosion resistance, and has a small diameter portion 6 of the workpiece 6.
The holes 12 into which b can be inserted are formed at a plurality of locations by etching, punching or the like.

In order to hold a plurality of workpieces 6 on the holding plate 11 as described above, the small diameter portions 6 of the workpieces 6 are placed in the holes 12.
While inserting b, the large diameter portion 6a of the workpiece 6 is integrally fixed to the peripheral edge portion of each hole 12 by series welding or the like.
The welding strength in this case is such that it does not come off during the processing of each step and can be easily removed after the completion of each step.

A plurality of sensor elements 5 are simultaneously manufactured by sending the plurality of workpieces 6 held by the holding plate 11 together with the holding plate 11 to a process such as polishing, film formation and the like for processing. become.

Therefore, a plurality of products 6 to be processed can be sent to each process at a time as compared with the conventional case where the products 6 are sent to each process one by one and processed. The time, the processing time such as spin coating and exposure in the film forming step, the processing time in the cleaning step, and the like can be significantly shortened, and the productivity can be significantly increased.

In addition, the variation in the dimension of each product 6 in the height direction during the polishing process is caused by the flexible holding plate 11.
Is absorbed by the displacement in the height direction of each of the workpieces 6 and each of the workpieces 6 is completely fixed in each of the holes 12.
Even if (see FIG. 5) is operated, each workpiece 6 does not move in each hole 12, and since the variation in the height direction is large, the pressing force in the direction of the polishing plate 7 is partially Even if it is insufficient, there is no risk of sagging on the polished surface, and the workpiece 6 is polished in order from the highest one, and the overall height gradually becomes uniform, and finally the overall height becomes a uniform dimension. It will be finished. The product 6 is not limited to the one with a flange, but as shown in FIG. 9 (a), the product 6 can be similarly fixed even if it has a cylindrical shape. It is as shown in FIG.

FIGS. 10 to 12 show a third embodiment of the method for manufacturing a sensor element according to the present invention.
FIG. 10 is a plan view showing a holding plate for holding a product, FIG.
FIG. 1 is a partially enlarged view showing a state in which the article to be manufactured is held by the one shown in FIG. 10, and FIG. 12 is a side view of the one shown in FIG.

That is, also in the method of manufacturing the sensor element shown in this embodiment, as in the case of the first embodiment, one end is closed and the peripheral surface is the large diameter portion 5a. A method of manufacturing a sensor element 5 (see FIG. 6 (a)) formed in two stages of a small diameter portion 5b, in which a peripheral surface of a cylindrical body having one end closed is provided with a large diameter portion 6a and a small diameter portion 6b.
A plurality of workpieces 6 processed in two stages (see FIGS. 11 and 12) are held on a holding plate 21, and the plurality of sensor elements 5 are simultaneously processed by feeding them to each process as a unit. It is designed to be manufactured.

Here, the holding plate 21 is a flexible metal thin plate (stainless steel or the like having excellent corrosion resistance) or a flexible resin thin plate coated with a metal on the surface thereof. The holes 6 into which the large diameter portion 6a or the small diameter portion 6b (the large diameter portion 6a in this embodiment) can be fitted are formed at a plurality of locations by etching, punching or the like.

In order to hold a plurality of workpieces 6 on the holding plate 21 as described above, the large-diameter portion 6 of the workpiece 6 is placed in each hole 22.
Fit a.

Then, the plurality of workpieces 6 held on the holding plate 21 are sent to each process together with the holding plate 21 for processing, so that a plurality of sensor elements 5 are manufactured at the same time.

Therefore, the processing time in the polishing step,
The processing time such as spin coating and exposure in the film forming step, the processing time in the cleaning step, etc. can be greatly reduced, and the productivity can be greatly increased.

In addition, the variation of the dimension of each of the products 6 in the height direction in the polishing step is caused by the flexible holding plate 21.
Is absorbed by the displacement in the height direction, and each workpiece 6 is completely fixed in each hole 22.
Even if (see FIG. 5) is operated, each workpiece 6 does not move in each hole 22, and since the variation in the height direction is large, the pressing force in the direction of the polishing plate 7 is partially. Even if it is insufficient, there is no risk of sagging on the polished surface, and the workpiece 6 is polished in order from the highest one, and the overall height gradually becomes uniform, and finally the overall height becomes a uniform dimension. It will be finished.

In the first, second and third embodiments, the product 6 is fixed to the holding plates 1, 11, 21 by welding or fitting, but it may be fixed by an adhesive. The same effect can be obtained.

13 to 15 (a) show a fourth embodiment of the method for manufacturing a sensor element according to the present invention, and FIG. 13 is a plan view showing a holding plate for holding an object to be manufactured. FIG. 14 is a partially enlarged plan view showing a state in which the object to be manufactured is held by the one shown in FIG. 13, and FIG. 15 (a) is a partial cross-sectional view taken along the line AA of the one shown in FIG. .

That is, also in the method of manufacturing the sensor element shown in this embodiment, as in the case of the first embodiment, one end is closed and the peripheral surface is the large diameter portion 5a. A method of manufacturing a sensor element 5 (see FIG. 6 (a)) formed in two stages of a small diameter portion 5b, in which a peripheral surface of a cylindrical body having one end closed is provided with a large diameter portion 6a and a small diameter portion 6b.
By holding a plurality of workpieces 6 (see FIG. 15 (a)) processed in two stages on the holding plate 31 and sending them to each process as one unit, a plurality of sensor elements 5 are simultaneously processed. It is designed to be manufactured.

Here, the holding plate 31 is a flexible thin plate made of metal having a thickness of about 100 μm, for example, stainless steel having excellent corrosion resistance, and has a diameter smaller than that of the large diameter portion 6a of the workpiece 6. The holes 32 are formed at a plurality of locations by etching, punching or the like, and a pair of beams 34, 34 are formed at the opposing portions of the inner peripheral surface of each hole 32.
It should be noted that the beams 34, 34 may be provided in a pair or more at opposite portions of the inner peripheral surface of each hole 32.

In order to hold a plurality of products 6 to be held on the holding plate 31 constructed as described above, a plurality of products to be manufactured are placed on the holding plate 31 so as to close each hole 32. 6, 6,
, And the beams 34 of each hole 32 and the end surface of the large diameter portion 6a of each workpiece 6 are integrally fixed by series welding or the like. The welding strength in this case is such that it does not come off during the processing of each step and can be easily removed after the completion of each step.

.. held by the holding plate 31 are sent together with the holding plate 31 to a process such as polishing, film formation and the like to process the plurality of sensor elements 5. 5, ... will be manufactured at the same time.

In this case, each workpiece 6 is formed by the beam 3 of each hole 32.
Since it is fixed to the holding plate 31 by 4, 34, it does not move in each hole 32 in the surface polishing process or the like. Therefore, in the surface polishing process, etc., even if the pressing force in the direction of the polishing plate is partially insufficient due to the large variation in the dimension in the height direction, no sagging occurs on the polishing surface. The workpiece 6 is polished in order from the tallest one, and the entire height gradually becomes uniform, and finally the entire height is finished to a uniform size.

Therefore, a plurality of products 6 to be processed can be sent to each process at a time as compared with the conventional case where the products 6 are sent to each process one by one and processed. The time, the processing time such as spin coating and exposure in the film forming step, the processing time in the cleaning step, and the like can be significantly shortened, and the productivity can be significantly increased.

A plurality of products 6 to be manufactured are placed on the holding plate 31, and beams 34 and 34 provided on the inner peripheral surface of each hole 32 are used to mount the products 6 to be manufactured. Since the end surface of the diameter portion 6a is fixed by welding, the product 6 can be held in a larger amount than that shown in the first embodiment.

That is, in general, the dimensional tolerance of the entire height of the workpiece 6 can be made strict in processing, but the dimensional tolerance in the height direction of the large diameter portion 6a cannot be made strict. The first
In the embodiment described above, the dimensional variation in the height direction of the large diameter portion 6a appears as it is as the dimensional variation in the total height of the workpiece 6. Therefore, the beams 4 and 4 of each hole 2 are lengthened to reduce the spring constant, and the holding plate 1 is used in the polishing process or the like.
Is easily displaced in the height direction, and variations in the dimension of the workpiece 6 in the height direction are absorbed by the displacement of the holding plate 1.

On the other hand, in the structure shown in this embodiment, since the end surface of the large diameter portion 6a of the workpiece 6 is fixed to the beams 34, 34, the dimension of the large diameter portion 6a in the height direction is high. Does not cause a variation in the total height of the workpiece 6, and even if the length of the beams 34, 34 of each hole 32 is shortened to increase the spring constant, a plurality of workpieces are not generated without sagging. The product 6 can be formed to have a predetermined height. Therefore, as compared with the first embodiment, the holes 3
The distance between the holes 2 and the holes 32 can be made narrower, the number of workpieces 6 that can be held can be made larger than that shown in the form of the first embodiment, and the productivity can be further improved. Is something that can be done. The workpiece 6 is not limited to the one with a flange, and as shown in FIG. 15 (b), the workpiece 6 can be similarly fixed even if it has a cylindrical shape. It is as shown in FIG.

FIGS. 16 and 17 show a fifth embodiment of the method for manufacturing a sensor element according to the present invention, and FIG. 16 is a plan view showing a holding plate for holding an object to be manufactured,
FIG. 17 is a partially enlarged view of what is shown in FIG.

That is, similarly to the method of manufacturing the sensor element according to the first embodiment, the method of manufacturing the sensor element according to this embodiment has a cylindrical shape with one end closed and the peripheral surface of the large diameter portion 5a. A method of manufacturing a sensor element 5 (see FIG. 6 (a)) formed in two stages of a small diameter portion 5b, in which a peripheral surface of a cylindrical body having one end closed is provided with a large diameter portion 6a and a small diameter portion 6b.
A plurality of workpieces 6 processed in two stages are held by a holding plate 41 to form one unit, and a plurality of sensor elements 5 are simultaneously manufactured by sending the processed units to each process and processing. is there.

Here, the holding plate 41 is made of metal having a thickness of about 100 μm, for example, a flexible thin plate made of stainless steel or the like having excellent corrosion resistance, or made of metal having a thickness of more than that, for example, corrosion resistance. Holes 42, which are excellent thick plates made of stainless steel or the like, into which the small-diameter portion 6b of the workpiece 6 can be inserted are formed at a plurality of locations by etching, punching, or the like, and a plurality of notches 43 are formed around each hole 42. And a spring structure is formed around each hole 42 by the plurality of notches 43.

The cuts 43 are provided on the same concentric circle so as to be opposed to each other so as to surround the hole 42, and such cuts are staggered from the inside to the outside on the plurality of concentric circles. And a spring structure is formed around the hole 42 by the plurality of notches 43.

In order to hold a plurality of workpieces 6 on the holding plate 41 as described above, the small-diameter portion 6b of the workpiece 6 is inserted into each hole 42, and a notch around each hole 42 is formed. The large-diameter portion 6a of each workpiece 6 is integrally fixed to a portion other than 43 by series welding or the like. The welding strength in this case is such that it does not come off during the processing of each step and can be easily removed after the completion of each step.

Then, a plurality of workpieces 6 held on the holding plate 41 are used as one unit and sent to each process such as polishing, film formation, etc. to be processed, whereby a plurality of sensor elements 5 are simultaneously manufactured. It is a thing.

In this case, since each workpiece 6 is fixed around each hole 42, it does not move in each hole 42 during the surface polishing process, and therefore,
Even if the pressing force in the direction of the polishing plate is partially insufficient due to the large variation in size in the height direction, no sagging occurs on the polishing surface, and the plurality of workpieces 6 are high. Then, the entire height is gradually polished until it becomes uniform, and finally the entire height is finished to a uniform size.

Therefore, a plurality of products 6 can be sent to each process at one time as compared with the conventional method in which the products 6 are sent to each process one by one. The time, the processing time such as spin coating and exposure in the film forming step, the processing time in the cleaning step, and the like can be significantly shortened, and the productivity can be significantly increased.

A plurality of cuts 43 are formed around each hole 42.
And the spring structure is formed around each hole 42 by the plurality of notches 43, even if the holding plate 41 is a thick plate having inferior flexibility, each workpiece 6 is formed in each hole 42. Since it can be fully displaced in the height direction,
It is possible to sufficiently absorb the variation in the dimension of the plurality of products 6 in the height direction.

In the above description, the holding plate 41
42 into which the small diameter portions 6b of the plurality of workpieces 6 can be inserted
Although a plurality of cuts 43 are provided around the hole 42, a plurality of workpieces 6 are placed on the holding plate 41 without forming the plurality of holes 42 in the holding plate 41, and A part of the product 6 is fixed to the holding plate 41 by series welding or the like, a plurality of cuts 43 are provided in the holding plate 41 around each product 6, and the plurality of cuts 43 allow the product 6 to be cut. A spring structure may be formed around it.

FIG. 18 shows a sixth embodiment of the method of manufacturing a sensor element according to the present invention, and the method of manufacturing the sensor element shown in this embodiment is also the same as that of the first embodiment. Similarly to the one described above, a method of manufacturing a sensor element 5 (see FIG. 6 (a)) having a cylindrical shape with one end closed and a peripheral surface formed in two stages of a large diameter portion 5a and a small diameter portion 5b is used. Then, a plurality of workpieces 6, each of which has a cylindrical shape with one end closed and whose peripheral surface is processed into two stages of a large diameter portion 6a and a small diameter portion 6b, are held on a holding plate 51 to form one unit. A plurality of sensor elements 5 can be processed by sending them to each process.
Are manufactured at the same time.

Here, the holding plate 51 is made of a metal having a thickness of about 100 μm, for example, a flexible thin plate made of stainless steel or the like having excellent corrosion resistance, or a metal having a thickness of more than that, for example, corrosion resistance. A thick plate made of an excellent material such as stainless steel, which has a hole 52 into which the small-diameter portion 6b of the workpiece 6 can be inserted by etching, punching, or the like in the center of the plate 51, and the hole 52 is centered outside the hole 52. As a result, two annular holes 53, 54 into which the small-diameter portions 6b of the plurality of workpieces 6 can be inserted are provided by etching, punching or the like, and the holes 52, 53, 54 are provided on the holding plate 51. It has a spring structure formed on it.

In order to hold a plurality of workpieces 6 on the holding plate 51 as described above, the small-diameter portion 6b of the workpiece 6 is inserted into each of the holes 52, 53, 54, and each hole 52 is , 53,
A part of the large-diameter portion 6a of each workpiece 6 is integrally fixed around 54 by series welding or the like. The welding strength in this case is such that it does not come off during the processing of each step and can be easily removed after the completion of each step.

Then, the plurality of workpieces 6 held by the holding plate 51 are sent as one unit to each process such as polishing, film formation and the like, and a plurality of sensor elements 5 are simultaneously manufactured. It is a thing.

In this case, the respective workpieces 6 have holes 52, 5
Since it is fixed around 3, 54, it does not move in each hole 52, 53, 54 in the surface polishing process, etc., and therefore, the polishing plate has a large variation in the dimension in the height direction. Even if the pressing force in the direction of is partially insufficient, no sagging occurs on the polishing surface, and the plurality of workpieces 6 are polished in order from the highest one, and the entire height gradually becomes uniform. Finally, the overall height will be finished to a uniform size.

Therefore, as compared with the conventional method in which the products 6 are sent to each process one by one, a plurality of products 6 can be sent to each process at a time and processed. The time, the processing time such as spin coating and exposure in the film forming step, the processing time in the cleaning step, and the like can be significantly shortened, and the productivity can be significantly increased.

Two annular holes 53 and 54 are provided around the hole 52 with the hole 52 as the center, and the holes 52 and
By forming the spring structure on the holding plate 51 by 53 and 54, even if the holding plate 51 is a thick plate having poor flexibility,
Since each of the workpieces 6 can be sufficiently displaced in the height direction in each of the holes 52, 53, 54, it is possible to sufficiently absorb the variation in the dimension of the plurality of workpieces 6 in the height direction. , Will be able to significantly increase productivity.

In the above description, the two annular holes 53 and 54 centering on the hole 52 are provided outside the hole 52, but one or three or more annular holes may be provided. Of course.

[0065]

The present invention is configured as described above.
The holding plate holds multiple products to be manufactured.
First, it is sent to the polishing process first,
Do not press in the direction of the polishing plate directly or through the holding plate.
That the processed surfaces of multiple workpieces are polished simultaneously.
Become. Therefore, there are variations in the height direction of multiple workpieces.
Even if there is sticking, the variation in the holding plate changes in the thickness direction.
Position, or the cantilever is displaced
Since it can be stored, it finishes multiple products with a certain polishing accuracy.
You will be able to take advantage of it. In addition, multiple products
Since polishing can be done at the same time, the efficiency of polishing work is
Can be turned on. And after the polishing process is completed,
This one unit is sent to processes such as film formation, and each process is sequentially processed.
This allows multiple sensor elements to be manufactured simultaneously.
it can. Therefore, it is possible to improve the production efficiency of the sensor element.
You can do it.

[0066]

[Brief description of drawings]

FIG. 1 is a plan view showing a holding plate according to a first embodiment of a method for manufacturing a sensor element according to the present invention.

FIG. 2 is a partially enlarged view of what is shown in FIG.

3A is a partially enlarged view showing a state in which a product to be manufactured is held on the one shown in FIG. 1, and FIG. 3B is a partially enlarged view showing a state in which a product to be manufactured in another example is held. is there.

4 (a) is a side view of what is shown in FIG. 3 (a),
FIG. 3B is a side view of what is shown in FIG.

FIG. 5 is an explanatory view showing a state in which a plurality of products to be manufactured are held on the holding plate shown in FIG. 1 and sent as a unit to the surface polishing step.

FIG. 6A is a plan view showing an example of a sensor element according to the present invention and a conventional sensor element, and FIG. 6B is a plan view showing a sensor element of another example.

FIG. 7 is a plan view showing a holding plate of a second embodiment of the method for manufacturing a sensor element according to the present invention.

FIG. 8 is a partially enlarged view showing a state in which the object to be manufactured is held by the one shown in FIG.

9 (a) is a side view of what is shown in FIG. 8, and FIG. 9 (b) is a side view in the case of holding another workpiece.

FIG. 10 is a third method of manufacturing a sensor element according to the present invention.
FIG. 4 is a plan view showing a holding plate of the embodiment.

FIG. 11 is a partially enlarged view showing a state in which the object to be manufactured is held by the one shown in FIG.

FIG. 12 is a side view of what is shown in FIG. 11.

FIG. 13 is a fourth method of manufacturing the sensor element according to the present invention.
FIG. 4 is a plan view showing a holding plate of the embodiment.

FIG. 14 is a partially enlarged plan view showing a state in which the article to be manufactured is held by the one shown in FIG.

15A is a partial cross-sectional view taken along line AA of FIG. 14, and FIG. 15B is a partial cross-sectional view showing a state in which another workpiece is held.

FIG. 16 is a fifth method of manufacturing a sensor element according to the present invention.
FIG. 4 is a plan view showing a holding plate of the embodiment.

FIG. 17 is a partially enlarged view of what is shown in FIG.

FIG. 18 is a sixth method of manufacturing a sensor element according to the present invention.
FIG. 4 is a plan view showing a holding plate of the embodiment.

FIG. 19 is an explanatory view showing the manufacturing process of the present invention and the conventional sensor element.

FIG. 20 is an explanatory diagram showing an example of a conventional method for manufacturing a sensor element.

[Explanation of symbols]

1, 11, 21, 31, 41, 51 ... Retaining plates 2, 12, 22, 32, 42, 52, 53, 54, 61
...... Hole 3,43 ...... Notch 4,34 ...... Beam 5 ...... Sensor elements 5a, 6a ...... Large-diameter parts 5b, 6b ...... Small-diameter part 6 ...... Products 7, 65 ...... Grinding plate 8, 67 ... Weight 60 ... Holder 64 ... Guide 66 ... Elastic material

─────────────────────────────────────────────────── ─── Continuation of front page (56) Reference JP-A-2-98927 (JP, A) JP-A-6-126604 (JP, A) JP-A-6-63862 (JP, A) JP-A-62- 176757 (JP, A) Actual development Sho 54-42473 (JP, U) Actual development 2-126754 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) B24B 37/04 B24B 41 / 06 B24B 7/16 G01L 1/22

Claims (2)

(57) [Claims] 1. A method of manufacturing a substantially cylindrical sensor element having one end closed , which comprises a single protective sheet having flexibility in a thickness direction.
A plurality of the product to the holding plates, fixed to face a direction deflected the treated surface of the holding plate, a plurality of the manufacturing and the retaining plate
The polishing process is performed first as a unit of the product and the product.
And the treated surfaces of multiple workpieces are in the direction of the polishing machine.
It is located on the polishing machine so that
Or pressing the holding plate in the direction of the polishing plate
After polishing the processed surface of several products at the same time,
Then, send the above unit to the process such as film formation,
A method of manufacturing a sensor element, which comprises simultaneously manufacturing a plurality of sensor elements by the above . 2. A method for manufacturing a sensor element having a substantially cylindrical shape with one end closed, wherein a single protective sheet having flexibility in a thickness direction is used.
A plurality of holes are provided in the holding plate, at least two cantilever beams that project inward in the radial direction are provided on the inner surface of the holes, and the holes are manufactured at the positions of the holes.
Make sure that each processed surface faces the bending direction of the holding plate.
Position, fix each workpiece and the cantilever of each hole,
The holding plate and the plurality of products to be manufactured are integrated into one unit and first sent to the polishing process to
Positioned on the polishing board so that the treated surface of the
And polish multiple workpieces directly or through the holding plate.
Polishing the processed surfaces of multiple workpieces while pressing in the direction of the board
And the step of film-forming one unit after the polishing is completed.
Multiple sensors by sending them to each process
A method for manufacturing a sensor element, which comprises simultaneously manufacturing the elements.