JP3454013B2 - Terminal connection method for flexible printed circuit boards - Google Patents

Terminal connection method for flexible printed circuit boards

Info

Publication number
JP3454013B2
JP3454013B2 JP10505796A JP10505796A JP3454013B2 JP 3454013 B2 JP3454013 B2 JP 3454013B2 JP 10505796 A JP10505796 A JP 10505796A JP 10505796 A JP10505796 A JP 10505796A JP 3454013 B2 JP3454013 B2 JP 3454013B2
Authority
JP
Japan
Prior art keywords
terminal
conductive pattern
metal
metal terminal
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP10505796A
Other languages
Japanese (ja)
Other versions
JPH09293545A (en
Inventor
崇章 舩▲曳▼
哲太郎 那須
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP10505796A priority Critical patent/JP3454013B2/en
Publication of JPH09293545A publication Critical patent/JPH09293545A/en
Application granted granted Critical
Publication of JP3454013B2 publication Critical patent/JP3454013B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、樹脂フィルム上に
導電パターンを形成したフレキシブル配線基板の端子接
続方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting terminals to a flexible wiring board having a conductive pattern formed on a resin film.

【0002】[0002]

【従来の技術】近年、電子機器に使用される電子部品
は、小型化及び薄型化が進んでおり、これら電子部品の
小型化及び薄型化を進めるために、フレキシブル配線基
板が使用されることが多くなってきた。
2. Description of the Related Art In recent years, electronic parts used in electronic equipment have been made smaller and thinner, and flexible wiring boards are often used to make these electronic parts smaller and thinner. It's getting more and more.

【0003】このフレキシブル配線基板は各種樹脂フィ
ルムをベースに導電パターンを形成したものであるが、
導電パターンの形成法により以下の二種類に分類され
る。
This flexible wiring board has a conductive pattern formed on the basis of various resin films.
It is classified into the following two types depending on the method of forming the conductive pattern.

【0004】第一は樹脂フィルム上に銅箔を貼り付けた
基板に、エッチング処理等を施して導電パターンを形成
したものと、第二は樹脂フィルム上に銀ペースト等の導
電ペーストをスクリーン印刷して、導電パターンを形成
したものであり、一般的には、その安価な製造コストか
ら第二の銀ペースト等の導電ペーストをスクリーン印刷
して導電パターンを形成したものが多く使用されてい
る。
The first is a substrate in which a copper foil is adhered on a resin film to form a conductive pattern by etching, and the second is a screen printing of a conductive paste such as silver paste on the resin film. Then, a conductive pattern is formed, and generally, a conductive pattern is formed by screen-printing a conductive paste such as a second silver paste because of its low manufacturing cost.

【0005】しかしながら、この導電パターンは金属粉
の他に多量の樹脂成分を含むため直接半田付けすること
が困難であり、仮に半田付けできたとしても半田付け強
度が非常に低いという問題がある。
However, since this conductive pattern contains a large amount of resin component in addition to metal powder, it is difficult to directly solder it, and even if soldering is possible, there is a problem that the soldering strength is very low.

【0006】この問題を解決するため、フレキシブル配
線基板の接続部の導電パターンに金属端子を電気的・機
械的に固着し、この金属端子を半田付けする方法がとら
れている。このための接続部導電パターンと金属端子を
固定する方法として特開平5−21097号公報に開示
されているように、接続部に金属端子をカシメる方法が
考えられるが、機械的強度が弱く端子のガタツキが発生
しやすいばかりか、カシメる際にフィルムが変形して印
刷した導電パターンにクラックや断線が発生し、その結
果接続抵抗値が上昇して接触不安定になるという問題が
あるため、金属端子を接続部にカシメた後、導電接着剤
で電気的・機械的に補強していた。
In order to solve this problem, a method is employed in which a metal terminal is electrically and mechanically fixed to a conductive pattern of a connecting portion of a flexible wiring board and the metal terminal is soldered. As a method for fixing the conductive pattern of the connecting portion and the metal terminal for this purpose, as disclosed in Japanese Patent Laid-Open No. 5-21097, a method of crimping the metal terminal to the connecting portion can be considered, but the mechanical strength is weak and the terminal is weak. Not only is the rattling likely to occur, but when crimping the film is deformed and cracks or disconnections occur in the printed conductive pattern, resulting in an increase in connection resistance and contact instability. After crimping the metal terminal to the connection part, it was electrically and mechanically reinforced with a conductive adhesive.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、上記の
方法では導電接着剤で補強する必要があるため、その塗
布・乾燥・硬化のための設備が必要であるばかりか、プ
ロセスも複雑になることからコスト高になり、さらに端
子カシメ部を包み込む様に導電接着剤を塗布する必要が
あるため、薄型化にも限界があった。
However, in the above method, since it is necessary to reinforce with a conductive adhesive, not only equipment for coating / drying / curing is required, but also the process is complicated. Since the cost is increased and it is necessary to apply the conductive adhesive so as to wrap the crimped portion of the terminal, there is a limit to reduction in thickness.

【0008】本発明はこれらの課題を解決し、導電接着
剤で補強をしなくても端子ガタツキの発生が無く、機械
的強度・電気的接続安定性の優れた、安価で薄型のフレ
キシブル配線基板の端子接続方法を提供することを目的
とするものである。
The present invention solves these problems and is a cheap and thin flexible wiring board that does not cause rattling of terminals even if it is not reinforced with a conductive adhesive and has excellent mechanical strength and electrical connection stability. It is an object of the present invention to provide a method for connecting terminals.

【0009】[0009]

【課題を解決するための手段】上記課題を解決するため
に本発明は、フレキシブル配線基板に軟質のポリエステ
ル系樹脂を結合剤とした導電ペーストで導電パターンを
形成すると共に、この導電パターンの両側に対向して立
てた端子側が半田付け接続される金属端子のカシメ部を
内側に倒し込んで、上記導電パターンを抱き込む形でカ
シメて、上記カシメ部の内側を上記導電パターンに食い
込ませて接続するものである。
In order to solve the above problems, the present invention provides a flexible wiring board with a soft polyester.
To form a conductive pattern in Le resin binder and the conductive paste, crowded defeat caulking portion of the metal terminal both sides to face the upright terminal side connected soldered of the conductive pattern on the inside, the conductive pattern caulked at embracing form, the inside of the caulking portion is intended to be connected by bite into the conductive pattern.

【0010】これにより、安価に接続できると共に、導
電接着剤の補強がなくても端子ガタの発生がなく、機械
的強度も確保できるので薄型化でき、かつ安定した電気
的接続を確保できると共に、上記金属端子の端子側を半
田付けする際に上記金属端子に伝わる熱により、上記金
属端子と上記導電パターン間の電気的接続安定性が増す
ものにできる。
As a result, the connection can be made at a low cost, the terminal backlash does not occur even if the conductive adhesive is not reinforced, and the mechanical strength can be secured, so that the device can be made thin and stable electrical connection can be secured . Half the terminal side of the above metal terminals
Due to the heat transmitted to the metal terminals when attaching the rice,
Increased stability of electrical connection between metal terminal and conductive pattern
It can be something.

【0011】本発明の請求項1に記載の発明は、結合剤
としてガラス転移点温度が常温(23℃)以下のポリエ
ステル系樹脂と導電粉として銀粉とを用いた導電ペース
トによりフレキシブル配線基板上に形成された導電パタ
ーンに対し、端子側が半田付け接続される金属端子にお
ける上記導電パターンの両側に対向して立てた金属端子
カシメ部を、上記導電パターンを抱くように内側に倒し
込んで、上記金属端子カシメ部内側面を上記導電パター
ンに食い込ませてカシメる方法としたものであり、導電
接着剤で補強をしなくても端子ガタツキの発生が無く、
機械的強度が強く、安定した電気的接続を確保できると
共に、金属端子の端子部の半田付けにより電気的接続安
定性が増す薄型の端子接続方法を安価に提供できるとい
う作用を有する。
[0011] According to a first aspect of the present invention, polyether glass transition temperature of ordinary temperature (23 ° C.) or less as a binder
A conductive pattern formed on a flexible wiring board by a conductive paste using a stell resin and silver powder as a conductive powder.
The metal terminal to which the terminal side is soldered and connected.
The kick metal terminal crimping portion stood in opposition to either side of the conductive pattern, crowded tilted inward so as to embrace the conductive pattern, and the metal terminal crimping unit side and caulking method by bite into the conductive pattern Since there is no backlash of the terminals without reinforcement with conductive adhesive,
It has strong mechanical strength and can secure a stable electrical connection.
In both cases, the electrical connection is secured by soldering the terminals of the metal terminals.
It has an effect that a thin terminal connection method with increased qualitativeness can be provided at low cost.

【0012】請求項2に記載の発明は、請求項1記載の
発明において、端子接続部の導電パターンの厚みが10
μm以上であるようにしたものであり、端子接続抵抗値
をより低くできると同時に、端子へのハンダ付け後の接
続抵抗値の安定性を向上できるという作用を有する。
According to a second aspect of the invention, in the first aspect of the invention, the conductive pattern of the terminal connecting portion has a thickness of 10
The thickness of the terminal connection resistance value can be further reduced, and at the same time, the stability of the connection resistance value after soldering to the terminal can be improved.

【0013】[0013]

【0014】請求項3に記載の発明は、請求項1記載の
発明において、金属端子打ち抜き加工時のバリの方向を
カシメ部の内側面としたものであり、電気的接続安定性
を増すことができるという作用を有する。
According to a third aspect of the present invention, in the invention according to the first aspect, the direction of the burr at the time of punching the metal terminal is the inner side surface of the caulking portion, and the electrical connection stability is improved. Has the effect of being able to increase.

【0015】請求項4に記載の発明は、請求項1記載の
発明において、導電ペーストの結合剤を金属端子にヒー
トシール性を有するポリエステル系樹脂とし、上記金属
端子がカシメ固定された後での上記金属端子の端子側の
半田付け時に上記金属端子に伝わる熱により、上記金属
端子と上記導電パターンが接着するものであり、金属端
子へのハンダ付けの後に金属端子と導電パターンが密着
するので、接続部の気密性が高まり接続の信頼性が高ま
るという作用を有する。
[0015] The invention according to claim 4, in <br/> invention of claim 1, wherein the binder of the conductive paste and the polyester resin having a heater <br/> Toshiru of the metal terminal, the metal
After the terminals have been crimped,
The heat transferred to the metal terminals during soldering causes the metal
Since the terminal and the conductive pattern are adhered , and the metal terminal and the conductive pattern are adhered to each other after soldering to the metal terminal, the airtightness of the connection portion is increased and the reliability of the connection is improved.

【0016】以下、本発明の一実施の形態について、回
転型可変抵抗器用の抵抗体を例として、図1から図4お
よび(表1)を用いて説明する。
An embodiment of the present invention will be described below with reference to FIGS. 1 to 4 and (Table 1) by taking a resistor for a rotary variable resistor as an example.

【0017】図1は同実施の形態によるフレキシブル配
線基板の端子接続方法を適用した回転型可変抵抗器用の
抵抗体に金属端子を接続した状態の平面図、図2は抵抗
体の平面図、図3(a)は金属端子の平面図、同(b)
は同側面図である。
FIG. 1 is a plan view showing a state in which metal terminals are connected to a resistor for a rotary variable resistor to which the method for connecting terminals of a flexible wiring board according to the embodiment is applied. FIG. 2 is a plan view of the resistor. 3 (a) is a plan view of the metal terminal, FIG.
Is a side view of the same.

【0018】同図において、抵抗体1は厚み188μm
のポリエステル樹脂製のフィルム1a(東レ社製:ルミ
ラーH10)にスクリーン印刷で各種パターン1b,1
c,1dが形成されたフレキシブル配線基板であり、1
bはフェノール樹脂系結合剤に導電粉としてカーボンを
用いた導電ペーストで形成した抵抗パターン、1cはフ
ェノール樹脂系結合剤に導電粉として銀粉を用いた導電
ペーストで形成した導出パターン、三ヶ所ある1dはガ
ラス転移点温度が7℃のポリエステル樹脂(東洋紡績社
製:バイロン300)が結合剤であり導電粉として銀粉
(徳力化学社製:TCG−1)を用いた導電ペーストで
形成した導電パターンであり、その厚みは15μm〜2
0μmである。そして、この導電パターン1d各々の両
側の対向する位置に金属端子のカシメ部2aを挿入する
ための端子孔1eが設けられている。
In the figure, the resistor 1 has a thickness of 188 μm.
Various patterns 1b and 1 by screen printing on the polyester resin film 1a (made by Toray: Lumirror H10)
c, 1d is a flexible wiring board on which 1
b is a resistance pattern formed of a conductive paste using carbon as a conductive powder for the phenol resin binder, 1c is a derived pattern formed of a conductive paste using silver powder as a conductive powder for the phenol resin binder, and 3d are 1d Is a conductive pattern formed by a conductive paste using a polyester resin (Vylon 300 manufactured by Toyobo Co., Ltd.) having a glass transition temperature of 7 ° C. as a binder and silver powder (TCG-1 manufactured by Tokuriki Kagaku) as conductive powder. Yes, its thickness is 15 μm to 2
It is 0 μm. Then, terminal holes 1e for inserting the caulked portions 2a of the metal terminals are provided at opposing positions on both sides of each of the conductive patterns 1d.

【0019】一方、金属端子2は、その端部に対向して
設けられた二ヶ所のカシメ部2aのバリが対向するよう
な方向からプレス加工が行われると共に、この二ヶ所の
カシメ部2aの内側面には凹凸部2bが設けられてい
る。
On the other hand, the metal terminal 2 is pressed from a direction such that the burrs of the two caulking portions 2a provided so as to be opposed to the ends thereof are opposed to each other, and at the same time, the two caulking portions 2a are pressed. The inner surface is provided with the uneven portion 2b.

【0020】この金属端子2を抵抗体1に接続する方法
としては、端子孔1eに金属端子カシメ部2aを下方か
ら挿入し、導電パターン1dの両側に対向して立った金
属端子カシメ部2aをフィルム1aと導電パターン1d
とを抱くように内側に倒し込んで、図4の断面図に示す
ように金属端子カシメ部2a内側面を導電パターン1d
に食い込ませてカシメつけるものである。
As a method for connecting the metal terminal 2 to the resistor 1, the metal terminal caulking portions 2a are inserted into the terminal holes 1e from below, and the metal terminal caulking portions 2a standing opposite to both sides of the conductive pattern 1d are provided. Film 1a and conductive pattern 1d
Crowded tilted to the inside prejudiced bets in the conductive pattern 1d metal terminals crimped portion 2a inside surface as shown in the sectional view of FIG. 4
It is something that is caulked by being cut into.

【0021】このように、金属端子カシメ部2aで基板
フィルム1aを抱くようなカシメ方法とすることによ
り、端子のガタツキが無く十分な機械的強度が得られ
る。さらに、基板フィルム1aの逃げが無くなり、基板
フィルム1aの導電パターン1dの部分が端子カシメ部
2aに沿うように変形し導電パターン1dと端子カシメ
部2aとの接続面積が増加し、接続抵抗値が低くなる。
In this way, by adopting the crimping method in which the substrate film 1a is held by the metal terminal crimped portion 2a, there is no rattling of the terminal and sufficient mechanical strength can be obtained. Further, the escape of the substrate film 1a disappears, the portion of the conductive pattern 1d of the substrate film 1a is deformed along the terminal caulking portion 2a, the connection area between the conductive pattern 1d and the terminal caulking portion 2a increases, and the connection resistance value is increased. Get lower.

【0022】ここで、導電パターン1dの端部1fには
カシメによる機械的ストレスが加わり、クラックが発生
し接続抵抗値が増加することが懸念されるが、ガラス転
移点が室温以下(7℃)の軟質樹脂を結合剤とするフレ
キシブルな導電パターン1dを用いているため、クラッ
クの発生が抑えられ低い接続抵抗値が得られる。
Here, there is a concern that mechanical stress due to caulking may be applied to the end 1f of the conductive pattern 1d to cause cracks and increase the connection resistance value, but the glass transition point is below room temperature (7 ° C.). Since the flexible conductive pattern 1d using the soft resin as a binder is used, the occurrence of cracks is suppressed and a low connection resistance value is obtained.

【0023】さらに、この抵抗体1に接続された金属端
子2をハンダコテを用いてハンダ付けする際、ハンダコ
テの熱が金属端子2を伝わり金属端子カシメ部2a内側
のポリエステル系樹脂を結合剤とした導電パターン1d
が軟化する。その結果、導電パターン1dと金属端子2
との接触面積が増加し、一層接続抵抗値が低下する。さ
らに金属端子2に対してヒートシール性を有するポリエ
ステル系樹脂を用いているため、金属端子2と導電パタ
ーン1dとがハンダ付けの際に接着することによって接
続面の気密性が高まり、接続信頼性が増す。
Further, when the metal terminal 2 connected to the resistor 1 is soldered by using a soldering iron, the heat of the soldering iron is transmitted through the metal terminal 2 and the inside of the metal terminal caulking portion 2a.
Conductive pattern 1d using the above polyester resin as a binder
Softens. As a result, the conductive pattern 1d and the metal terminal 2
The contact area with and increases, and the connection resistance value further decreases. Furthermore, since the polyester resin having heat sealability is used for the metal terminal 2, the metal terminal 2 and the conductive pattern 1d are adhered to each other at the time of soldering, so that the airtightness of the connection surface is increased and the connection reliability is improved. Will increase.

【0024】ここで、導電ペーストの結合剤を数種類用
いて、各々抵抗体1のサンプルを製作し、特性評価した
結果を(表1)に示す。
Here, the results of evaluating the characteristics of each sample of the resistor 1 produced by using several kinds of binders of the conductive paste are shown in Table 1.

【0025】[0025]

【表1】 [Table 1]

【0026】同表において、接続抵抗値は1Ω未満であ
れば、実使用上では電気的に問題のない接続であるとい
えるが、(表1)に示すように、導電パターン1dの厚
みを10μ以上とすれば、接続抵抗値は0.1Ω未満と
なり、より安定した接続となる。
In the table, if the connection resistance value is less than 1 Ω, it can be said that the connection has no electrical problem in actual use. However, as shown in (Table 1), the conductive pattern 1d has a thickness of 10 μm. In the above case, the connection resistance value is less than 0.1Ω, and the connection is more stable.

【0027】なお、使用されるフィルムは、ポリエステ
ルフィルムに限定されるものではなくたとえば、ガラス
エポキシ基板・ポリエチレンナフタレート・ポリフェニ
レンサルファイド・ポリエーテルイミド・ポリイミド・
ポリエーテルエーテルケトン・ポリエーテルサルフォン
等の各種厚みの樹脂フィルムを使用することができる。
The film to be used is not limited to the polyester film, and examples thereof include glass epoxy substrate, polyethylene naphthalate, polyphenylene sulfide, polyether imide, polyimide, and the like.
Resin films having various thicknesses such as polyether ether ketone and polyether sulfone can be used.

【0028】[0028]

【発明の効果】以上のように本発明によれば、端子側が
半田付け接続される金属端子をフレキシブル配線基板の
導電パターンに対し、導電接着剤の補強がなくても機械
的強度や電気的接続安定性、信頼性に優れた、薄型でか
つ安価に接続したものが得られ、しかも上記フレキシブ
ル配線基板にカシメ固定された上記金属端子の端子部を
半田付けすることにより、上記金属端子と上記導電パタ
ーン間の電気的接続安定性が増すフレキシブル配線基板
の端子接続方法を提供することができる。
As described above, according to the present invention, the terminal side is
Connect the metal terminals to be soldered to the flexible wiring board
It is possible to obtain a thin and inexpensive connection to a conductive pattern, which has excellent mechanical strength, electrical connection stability, and reliability even without reinforcement of a conductive adhesive.
The terminal part of the metal terminal fixed by crimping on the wiring board.
By soldering, the metal terminals and the conductive patterns
It is possible to provide a method of connecting terminals to a flexible wiring board, which improves the electrical connection stability between terminals.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施の形態によるフレキシブル配線
基板の端子接続方法を適用した回転型可変抵抗器用の抵
抗体に金属端子を接続した状態の平面図
FIG. 1 is a plan view showing a state in which a metal terminal is connected to a resistor for a rotary variable resistor to which a flexible wiring board terminal connecting method according to an embodiment of the present invention is applied.

【図2】同抵抗体の平面図FIG. 2 is a plan view of the resistor.

【図3】(a)同金属端子の平面図 (b)同側面図FIG. 3 (a) is a plan view of the same metal terminal. (B) Side view

【図4】図1のX−X線における断面図FIG. 4 is a sectional view taken along line XX of FIG.

【符号の説明】 1 抵抗体 1a フィルム 1b 抵抗パターン 1c 導出パターン 1d 導電パターン 1e 端子孔 1f 導電パターン端部 2 金属端子 2a カシメ部 2b 凹凸部[Explanation of symbols] 1 resistor 1a film 1b resistance pattern 1c Derivation pattern 1d conductive pattern 1e Terminal hole 1f Conductive pattern end 2 metal terminals 2a Caulking part 2b uneven part

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平4−28108(JP,A) 特開 平6−333618(JP,A) 特開 平7−153522(JP,A) 特開 昭54−78491(JP,A) 実開 平6−9167(JP,U) (58)調査した分野(Int.Cl.7,DB名) H01R 9/09 H01C 17/28 H05K 1/18 H05K 3/32 ─────────────────────────────────────────────────── --- Continuation of front page (56) References JP-A-4-28108 (JP, A) JP-A-6-333618 (JP, A) JP-A-7-153522 (JP, A) JP-A-54- 78491 (JP, A) Actual Kaihei 6-9167 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H01R 9/09 H01C 17/28 H05K 1/18 H05K 3/32

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 結合剤としてガラス転移点温度が常温
(23℃)以下のポリエステル系樹脂と導電粉として銀
粉とを用いた導電ペーストによりフレキシブル配線基板
上に形成された導電パターンに対し、端子側が半田付け
接続される金属端子における上記導電パターンの両側に
対向して立てた金属端子カシメ部を、上記導電パターン
を抱くように内側に倒し込んで、上記金属端子カシメ部
の内側面を上記導電パターンに食い込ませてカシメるよ
うにしたフレキシブル配線基板の端子接続方法。
1. A polyester resin having a glass transition temperature of room temperature (23 ° C.) or lower as a binder and silver as a conductive powder.
Solder the terminal side to the conductive pattern formed on the flexible wiring board with the conductive paste using powder
In the metal terminal to be connected, the metal terminal caulking portions that are erected on both sides of the conductive pattern are placed on the conductive pattern.
Crowded tilted inward so as to entertain, terminal connecting method of the flexible printed circuit board in which the inner surface of the metal terminal crimping portion caulked so by bite into the conductive pattern.
【請求項2】 端子接続部の導電パターンの厚みが10
μm以上である請求項1記載のフレキシブル配線基板の
端子接続方法。
2. The thickness of the conductive pattern of the terminal connecting portion is 10
The terminal connection method for a flexible wiring board according to claim 1, wherein the terminal connection is not less than μm.
【請求項3】 金属端子打ち抜き加工時のバリの方向を
カシメ部の内側面とする請求項1記載のフレキシブル配
線基板の端子接続方法。
3. The terminal connecting method for a flexible wiring board according to claim 1, wherein the direction of the burr at the time of punching the metal terminal is the inner side surface of the caulking portion.
【請求項4】 導電パターンを形成する導電ペーストの
結合剤金属端子にヒートシール性を有するポリエステ
ル系樹脂とし、上記金属端子がカシメ固定された後での
上記金属端子の端子側の半田付け時に上記金属端子に伝
わる熱により、上記金属端子と上記導電パターンが接着
する請求項1記載のフレキシブル配線基板の端子接続方
法。
4. A binder of a conductive paste for forming a conductive pattern is a polyester resin having heat sealability on a metal terminal, and the metal terminal after the metal terminal is fixed by caulking.
When soldering the terminal side of the above metal terminals, transfer it to the above metal terminals.
The metal terminal and the conductive pattern are bonded by the heat
The method for connecting terminals of a flexible wiring board according to claim 1 .
JP10505796A 1996-04-25 1996-04-25 Terminal connection method for flexible printed circuit boards Expired - Fee Related JP3454013B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10505796A JP3454013B2 (en) 1996-04-25 1996-04-25 Terminal connection method for flexible printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10505796A JP3454013B2 (en) 1996-04-25 1996-04-25 Terminal connection method for flexible printed circuit boards

Publications (2)

Publication Number Publication Date
JPH09293545A JPH09293545A (en) 1997-11-11
JP3454013B2 true JP3454013B2 (en) 2003-10-06

Family

ID=14397359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10505796A Expired - Fee Related JP3454013B2 (en) 1996-04-25 1996-04-25 Terminal connection method for flexible printed circuit boards

Country Status (1)

Country Link
JP (1) JP3454013B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101435209B1 (en) * 2008-08-05 2014-08-28 현대자동차주식회사 Terminal fusing assembly
CN108882551A (en) * 2018-06-15 2018-11-23 西安微电子技术研究所 A kind of the dress coupling device and assembling method of conducting wire and printing part
CN109449147B (en) * 2018-11-13 2024-03-29 中山市木林森电子有限公司 LED support capable of being used as direct-insert filament, LED light source and processing technology thereof
JP2021044087A (en) * 2019-09-06 2021-03-18 帝国通信工業株式会社 Circuit board

Also Published As

Publication number Publication date
JPH09293545A (en) 1997-11-11

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