JP3452380B2 - Organic EL display device and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat display device, and more particularly to a display device integrating a self-luminous EL element used in personal computers, portable televisions and the like.

[0002]

2. Description of the Related Art Self-luminous display devices such as liquid crystal display devices (other light emitting devices), EL (electroluminescence) display devices, and plasma displays have been put into practical use as flat display devices. Since the liquid crystal display element has a low voltage and low power consumption, it can be driven by a general-purpose integrated circuit, and since it can be made into a color only by applying a color filter, it is widely used as a color display. However, because it is necessary to display by changing the transmittance of the backlight light with the liquid crystal, the dynamic range of the display becomes narrow due to the constraints of the brightness of the backlight, the aperture ratio of the element, the transmittance of the color filter, etc. There is. In addition, since the liquid crystal display element has a slow response speed, it is necessary to display a moving image by an active matrix method in which a thin film transistor is incorporated in each pixel, which causes a problem of high manufacturing cost.

On the other hand, EL, plasma displays and the like are self-luminous, so that a clear and vivid screen having a relatively wide display dynamic range can be obtained.
However, it is difficult to emit light in the three primary colors, and because the driving voltage is as high as about 100 V, it cannot be driven by a general-purpose IC, and it is difficult to drive the battery due to the large power consumption, so it is generally considered to be inferior to the liquid crystal display element. I was told.

[0004]

However, in addition to the problem that the driving voltage is high, the conventional organic thin film EL display has no specific structure and manufacturing method established, and further, the brightness is insufficient. There was a problem. In addition, since a driver circuit or the like is mounted around the screen, the entire panel cannot be used for display, and there is a problem that the screens cannot be joined to form a large screen. An object of the present invention is to provide an organic thin film EL display device and a manufacturing method thereof that can solve the above problems.

[0005]

In order to solve the above problems, a linear transparent electrode pattern is formed by sandwiching a plurality of core wires made of a metal conductor covered with a light emitting layer of an organic EL film with an insulating spacer. It is arranged on the formed transparent film, and light is emitted by the voltage between the core wire and the transparent electrode. Also,
The core side of the transparent film in which the core wire and the spacer are alternately arranged is adhered to a printed circuit board, the ends of the core wire and the transparent film are bent at the edge of the printed circuit board, and connected to the circuit pattern on the other surface side of the printed circuit board. .

Further, a transparent electrode pattern is provided on the transparent film, a light emitting layer pattern of an organic EL film is further provided on the transparent electrode pattern, and a printed circuit board on the light emitting layer pattern is provided. The scanning line pattern provided on one surface is adhered, and the scanning line pattern and the circuit pattern on the other surface side of the printed circuit board are connected by a through hole. Further, the above
The positions of the holes are slanted with respect to the arrangement direction of the scanning line patterns so that the through-hole intervals are widened. Further, a driver circuit, a central processing circuit, a memory device, a reception / detection circuit, an input / output terminal for image information, etc. are mounted on the other side of the printed board.

Further, the transparent electrode pattern is provided on the convex-concave portion provided on the transparent film, and the concave portion is filled with an opaque material or a good electric conductor, and one side thereof is adjacent to the transparent electrode pattern. Connect to. Further, the resistivity of the light emitting layer is 0.3 to 3 × 10 ⁶ Ω · cm, and the film thickness is 30.
Thicken to 0 to 3000 nm.

Further, the light emitting layer is arranged over the entire surface of the printed circuit board so that the entire surface of the printed circuit board serves as a display surface.
Further, the scanning range of the screen is divided into a plurality of sections, and the respective scanning ranges are scanned independently of each other so that the duty time per pixel is lengthened. In addition, the above-mentioned organic EL display device is arranged adjacent to the substrate to enlarge the screen. Further, after the step of coating the core wire with the light emitting layer, anodization,
Alternatively, an insulating film is formed by electrodeposition, and cracks and defective portions of the light emitting layer are covered with this insulating film to reduce short circuit defects.

[0009]

The organic EL film coated on the core wire emits light by the voltage between the core wire and the transparent electrode, and the spacer acts as a light shield for the black matrix while insulating between the core wires. Further, the good electric conductor provided in the concave and convex portions of the transparent film serves as a light shield for the black matrix and simultaneously shunts the pattern resistance of the transparent electrode.

Further, the core wire side of the transparent film in which the core wire and the spacer are alternately arranged is adhered to a printed board, and the ends of the core wire and the transparent film are bent at the edge of the printed board,
By connecting to the circuit pattern on the other surface side of the printed circuit board, the organic EL element allows the driver circuit, the central processing circuit, the memory device, the reception, the detection circuit of the other surface side of the printed circuit board,
It is connected to an input / output terminal for image information, etc., so that the entire surface of the printed circuit board can be used as a display surface.

Similarly, it is provided on the transparent electrode pattern on the transparent film, a light emitting layer pattern of an organic EL film is further provided on the transparent electrode pattern, and further on the light emitting layer pattern. In an organic EL device in which a scanning line pattern provided on one surface of a printed circuit board is adhered to the printed circuit board, a space between the scanning line pattern and the circuit pattern on the other surface side is provided via a through hole of the printed circuit board. Since it is connected, the organic EL element is connected to the other side driver circuit, central processing circuit, memory device, reception, detection circuit, image information input / output terminal, etc., so that the entire surface of the printed circuit board can be used as the display surface. Becomes To do.

Further, by making the position of the through hole oblique with respect to the arrangement direction of the scanning line pattern, the interval between the through holes can be widened and the connection can be facilitated. The resistivity of the light emitting layer is 0.3 to 3 × 10 ⁶ Ω · cm.
As a result, by increasing the film thickness to 300 to 3000 nm, the distance between the electrode edge surfaces of the light emitting layer increases.

Further, by dividing the scanning range of the screen and independently scanning each scanning range, the duty time per pixel is lengthened by the number of divisions described above, and the brightness is increased. In addition, the screen is enlarged by the adjacent arrangement of the organic EL elements. In addition, an insulating film is formed on the cracks or defective portions of the light emitting layer by anodizing or electrodeposition after the core wire coating step of the light emitting layer.

[0015]

[Embodiment 1] FIG. 1 is a perspective view of a simple matrix type EL display according to the present invention. The core wire 11 covering the EL light emitting layer 12 is arranged so as to be orthogonal to the transparent electrode 15 via the spacer 13 to form a matrix, and the intersection point of the matrix is caused to emit light by the voltage between the core wire 11 and the transparent electrode 15.

As the core wire 11, M is formed on the copper alloy wire.
When a metal having a relatively small work function such as g, In, MgAg, or Al is coated, electron injection into the light emitting layer 12 can be promoted. From the viewpoint of reducing the wiring resistance of the core wire 11, Al or Cu is preferable, and Al can be used as it is, but the driving voltage is higher than that of Mg.

The light emitting layer 12 can be formed by a vapor deposition method, a spin coating method or the like, but from the viewpoint of production cost, the core wire 11 is a solution containing any one of three kinds of fluorescent dyes of base polymer, electron transfer material and red, blue and green. The most inexpensive method is to coat each of the light emitting layers 12 of red, blue and green by immersing in the substrate and then drying. The wirings 11 covering the light emitting layer are arranged on the adhesive film in the order of colors with the electrically insulating spacers 13 interposed therebetween and temporarily fixed. If a light absorbing resin such as black or similar glass fiber is used for the spacer 13, the effect of the black matrix is obtained and the effect of tightening the screen is obtained.

[0018]

[Table 1] Table 1 shows examples of chemical structures of fluorescent dyes and pigments used for the above-mentioned fluorescent dyes, and substances having an electron transporting ability or a hole transporting ability can be generally used.

[0019]

[Table 2] Table 2 shows examples of chemical structures of the compounds and base polymers used as the electron transfer agent and hole transfer agent. The wiring 11 is immersed in a solution prepared by mixing the fluorescent material, the base polymer, the electron transfer material or the hole transfer material in a solvent at a ratio of 1: 5: 1 to 2: 4: 2.

Next, the adhesive sheet is cut into a length corresponding to the wiring length and adhered to the printed board 16, the adhesive sheet is peeled off, and the core wire 11 having the light emitting layer 12 is transferred onto the printed board 16. Next, the core wire 11 is connected to the printed circuit board 1
Turn to the back side at the end of 6 and solder to the wiring 17 on the back side,
Anodization is carried out by putting it in a chemical conversion solution. As a result, it is possible to repair insufficient coverage or short-circuit defects of the light emitting layer 12 caused by the oxide film on the cracked portion.
Further, the film loss of the light emitting layer 12 can be repaired by a method of electrodeposition of a polymer using electrophoresis. These processes can improve the product yield.

Next, ITO (oxide of indium and tin) is sputter-deposited on the transparent film 14 and patterned to form a transparent electrode 15. This ITO has a problem in that it has poor workability, and when ITO is formed on the light emitting layer 12 which is an organic substance, the light emitting characteristics are deteriorated due to plasma damage. Therefore, in the present invention, ITO is formed on the glass substrate or the heat-resistant transparent film 14 and is attached thereto.

Generally, the ITO pattern is formed by a photolithography method. However, in the case of a simple matrix, the pattern is simple, so that it can be formed by a laser scribing method. Alternatively, the transparent electrode 15 can be obtained by polishing the glass substrate or the transparent film 14 having the ITO film formed thereon in a striped pattern by polishing. Further, at this time, the concave portion formed in the transparent film 14 is filled with a light-absorbing resin such as black to make the screen a black matrix to improve the visibility.

Further, when the concave portion is filled with a metal material having a low resistivity, the metal material can be used as a part of the black matrix, and when one end of the metal material is connected to the adjacent ITO, the conductivity of the ITO is insufficient. Can be supplemented. In particular, in a large display, the transparent electrode 15 becomes long, so that the voltage drop due to its resistance can be reduced.

Further, when the transparent film 14 is attached, it is necessary to make the film thickness of the light emitting device 12 constant.
Therefore, by spraying spacers such as glass fibers or beads on the light emitting layer 12 and then hot pressing, the spacers can be embedded in the light emitting layer and the thickness of the light emitting layer can be made equal to the size of the spacer. As a result, when the light emitting layer 12 is formed by the printing method, the light emitting layer 12
At the same time, the problem that the resin composition is rounded due to surface tension and the like and the film thickness becomes nonuniform will be solved.

The light emitting layer 12 of the organic thin film EL needs to be passivated since the fluorescent agent and the charge transport agent are sometimes oxidized when they are in an excited state. Therefore, the entire panel is covered with a polymer film and packaged in an inert gas such as nitrogen. Also, it is soaked in molten paraffin so that the whole is covered with paraffin. In addition, it is more effective to mix a deoxidizer in paraffin.

The thickness of the light emitting layer 12 formed as described above is usually about 100 nm. Therefore, discharge (dielectric breakdown) along the surface of the spacer is likely to occur even with a voltage of about 10V. This discharge can be prevented by increasing the film thickness, but at the same time, there arises a problem that the resistance value of the light emitting layer 12 increases and the light emission intensity rapidly decreases. This problem is the light emitting layer 1
The problem can be solved by lowering the electric resistance of No. 2 and increasing the film thickness at the same time so that a sufficient light emitting current can be obtained. For example, the base polymer of the light emitting layer 12 has a resistivity of 0.3 to 3
When a conductive polymer of about 10 ⁶ Ω · cm is used and the film thickness is about 300 to 3000 nm, the applied voltage is 10 V.
In contrast, a current density of 100 mA / cm ² which allows sufficient emission intensity to be obtained without sufficiently causing the creeping discharge can be applied.

If the film thickness is increased as described above, the light emitting layer 12 can be formed by a printing method, an electrodeposition method, an immersion method or the like. In the printing method and the electrodeposition method, the pattern formation is completed from the beginning, so the process is simplified. Each core wire 1
The portion where 1 and the transparent electrode face each other is one pixel. In the case of monochrome, the size should be 0.3 mm x 0.3 mm or less, and in the case of color, it should be 0.3 mm x 1/3.
Three 0.1 mm are combined to form one pixel.

[Embodiment 2] In FIG. 1, the core wire 11 is omitted and only the light emitting layer 12 is provided between the spacers 13, and the light emitting layer 12 is provided on the back side of the transparent electrode 15 and the printed circuit board 16. It is also possible to emit light by a voltage between the terminals.

For the electrodes provided on the back side of the printed board 16, materials such as Mg, In, MgAg, and Al having a relatively low work function are used in order to improve electron injection into the light emitting layer 12. However, in order to reduce the wiring resistance of the above electrodes, Al or C
u is good, and the electrodes such as Al and Cu are formed by patterning a vacuum deposition film by photolithography. In the case of Al, the driving voltage is slightly higher than that of Mg. Also, C
When the u electrode is used, its surface is coated with Mg or the like.

[Embodiment 3] FIG. 2 is a perspective view of an embodiment of the present invention in which a plurality of display units 1 of the present invention are connected to each other to form a large screen. Each display unit 1
The transparent electrode 15 and the portion of the core wire 11 protruding from the printed board 16 are turned to the back of the printed board 16 and connected to the wiring on the back side. Since the EL element does not require a back light in the liquid crystal element, the EL element can be mounted up to the end of the printed circuit board 16 by drawing and wiring the data line on the back side of the screen. It is possible to connect them with high precision to obtain a large screen.

A data line driver 6, a scanning line driver 4 and the like are mounted on the back side of the printed circuit board 16, and a power source and a connector 8 for inputting / outputting image information are provided at the center of the back side. Furthermore, a computer can be made by mounting a memory and a CPU on the back side. In addition, each driver I
Since C can be soldered, it can be connected with high reliability and at low cost.

A large screen can be obtained by arranging and adhering the display units 1 to a transparent plate such as a glass plate or an acrylic plate side by side with no space therebetween. In FIG. 2, each display unit 1 is scanned in the vertical direction by the scanning line extracted from the vertical edge and in the horizontal direction by the scanning line extracted from the horizontal edge. Further, since the scanning line from the edge in the horizontal direction is driven by the respective data line drivers 6 which are divided into upper and lower parts, the screen of each display unit 1 is divided into the upper and lower parts for horizontal scanning. It can be driven independently. As a result, the luminance can be doubled as compared with the case where the entire screen of the display unit 1 is line-sequentially scanned.

On the other hand, the brightness of the above screen is 10 in a personal computer.
Since 0 (Cd / m ² ) or more and 250 (Cd / m ² ) or more are required for TV, the maximum light emission intensity L (Cd /
m ² ) and the number of scanning lines n in line-sequential scanning must be set within the range of 100 <L / n <500. From this, the above L is relatively large and is 1000 to 10000 Cd / m ² , so the value of n is 10 to 100. Therefore, if the pixel size is 0.3 mm, the scanning range is 3 to 30 mm. Since one display unit 1 is composed of two scanning ranges in FIG. 2, the scanning range is 6 to 60 m.
m.

The aspect ratio of the display unit 1 is 1:
When set to √2, two, four, and eight display units 1
The aspect ratio is always 1: √ when increasing the area without cutting.
Can be kept at 2. Therefore, if the size of the display unit 1 is set to 7.5 cm and 5.25 cm, the scanning range is divided into two, and the width of one scanning range is 2.62 cm. Can be provided. In case of color, the data line is 3
225 pixels are arranged in the horizontal direction as one pixel for the primary color.

By arranging two display units 1 vertically and horizontally, a 7-inch display suitable for a portable device having a total of 320 pixels in the vertical direction and 450 pixels in the horizontal direction can be obtained. In addition, if you lay out four pieces vertically and horizontally, you will get six rows vertically.
A 14-inch high-definition display consisting of 40 and 900 horizontal pixels can be obtained, and more units can be arranged to increase the size.

[Embodiment 4] FIG. 3 shows that an EL display on a substrate is connected to a drive circuit and other circuits mounted on the other surface of the substrate through a through hole 30 provided on a printed circuit board 16. FIG. 3 is a perspective view of the device according to the embodiment of the present invention. In FIG. 3, the light emitting layer 12 described in the second embodiment is used, and only three pixels of red, blue and green in color display are shown.

First, the through hole 3 of the printed circuit board 16
Fill 0 with metal conductor. When the metal conductor is an electric wire, it is inserted into the through hole 30, cut, and then both surfaces are polished. Then, both surfaces of the printed board 16 are subjected to chemical copper plating, and then an alloy of magnesium and aluminum is vapor-deposited on the surface of the EL element side. Next, photoresist is applied to both surfaces and exposed to form the data line pattern 22 on the surface of the EL element side and the wiring 31 on the back surface thereof.

Next, after mounting the driver IC 32, the connector and the like on the back surface, the substrate is dipped in an electrophoresis tank containing a solution containing the same base polymer, electron / hole transfer agent, charge control agent and fluorescent dye as in Example 1. In the tank containing the red fluorescent dye, a voltage is applied to the red data line to form the red light emitting layer 26 by the electrodeposition method. Blue emitting layer 25 and green emitting layer 24
Is similarly formed.

Then, the transparent electrode 15 is formed on the transparent film 14 in the same manner as in Example 1, and the transparent electrode 15 is formed on the transparent substrate 14.
The transparent electrode 15 is attached so as to be orthogonal to the light emitting layer 12 on the printed circuit board 6, and the transparent electrode 15 which is omitted in FIG. 3 but protrudes from the printed circuit board 16 is turned to the back side of the printed circuit board 16 and connected to the wiring of the printed circuit board. Next, the data line pattern 22 is connected to the conductor of the through hole 30 and connected to the driver IC.

The scanning line pitch on the display screen is about 3
00μm, data line pitch is about 100μ in case of color
m, the through hole 30 having a diameter of 100 μm, for example
If these are arranged at this pitch, the substrate strength will be weakened. Therefore, as shown in FIG.
The through hole pitch is set to, for example, 1 mm with respect to the data line pitch of 0 μm. A multi-pin driver IC can be soldered to the 1 mm pitch with sufficient reliability.

[Embodiment 5] Next, a driving method of an EL display according to the present invention will be described. The organic thin film EL element has a rectifying characteristic and does not emit light in the reverse direction because it does not conduct electricity. Therefore, in the present invention, a forward voltage is applied to the scanning lines to emit light, and a reverse voltage is applied to the scanning lines that do not emit light to scan the scanning lines to emit light.

[Embodiment 6] When the display screen is line-sequentially scanned, only one scanning line emits light in the screen, so that the luminance becomes low. However, if the screen is divided into n sections and the respective divided sections are simultaneously scanned, the brightness will increase by n times. For example, when 300 to 600 scanning lines are divided into 10 lines by 30 to 60 and each divided range is simultaneously scanned, the brightness also increases by about 30 to 60 times.
0 to 20000 Cd / m ² or more required brightness of 300
It can be done with ~ 600 Cd / m ² .

However, it is necessary to create data corresponding to every 10 scanning lines and take out the data lines for every 10 lines outside the screen. Further, in the case of the active matrix, a power line for transmitting electric power is required in addition to the scanning line and the data line for transmitting the image data. Actually, since a common electrode is further required, two lines are added to each pixel as compared with the case of the simple matrix. Since the defective rate increases and the cost increases when the number of wirings increases, the power line and the scanning line are used together in the present invention. That is, the rectification characteristics of the organic thin film EL element are used to stop light emission and energization at the same time when a reverse voltage is applied to the power line. In the case of active matrix, the gate of the control transistor is opened by the above voltage.

[Embodiment 7] FIG. 4 is a diagram showing a configuration example of one pixel portion in an active matrix type EL display according to the present invention. The core wire 11 covering the blue-red-green light emitting layer 12 similar to that in Example 1 is sequentially attached to a printed circuit board, and the wiring is turned to the back surface at the end of the printed circuit board and soldered to the wiring on the printed circuit board to form a common electrode. To do.

Since a composite material is generally used for the printed circuit board 16, it is difficult to directly form the thin film transistor on the printed circuit board due to gas generation during heating, softening and deformation. Therefore, a thin film transistor is formed on a heat-resistant transparent film 14 such as polyethylene terephthalate or polyimide, or a substrate such as low soda glass or borosilicate glass.

First, the gate line patterns 43 and 47 are formed on the transparent film 14 by photolithography, then a gate insulating film and amorphous silicon are formed thereon by plasma CVD, and amorphous silicon islands are formed by photolithography. Then, the source and drain electrode patterns 44 and 45 and the source and drain electrode patterns 48 and 49 are formed by photolithography, and further the transparent electrode pattern 50 is formed.

The transparent film 14 on which each pixel is formed as described above is aligned with and bonded to the light emitting layer on the printed circuit board, and the transparent electrode portion protruding from the printed circuit board is turned to the back of the printed circuit board 16 to print the printed circuit board. Connect to the upper wiring. FIG. 5 is a wiring diagram of each pixel. The thin film transistor has two elements for current limiting and data writing for each pixel.
One is required, and data can be stored by utilizing the gate capacitance of the current limiting TFT.

In the active matrix, it can be visually recognized even when the light emission intensity of the light emitting layer 12 is as weak as 100 to 300 Cd / m ² . Also in the active matrix type display, if the aspect ratio is 1: √2 as in the case of the third embodiment, it is possible to increase the screen size by combining the display units. However, if the display unit is made larger, it becomes difficult to align the light emitting layer due to the expansion and contraction of the transparent film 14, so the size is 10 cm square or less,
It is preferably at least 20 cm square.

[0049]

According to the present invention, organic E is formed on a printed circuit board.
Since the L element can be mounted, the price of the EL display can be reduced. At the same time, it can be used as a screen up to the edge of the printed circuit board, and E on the back side of the printed circuit board.
An L element can be mounted. Further, the display brightness can be improved by driving the display area on the printed circuit board separately. Further, it is possible to provide a large-screen flat display device by arranging printed boards on which the EL elements are mounted side by side.

[Brief description of drawings]

FIG. 1 is a perspective view of an EL device according to the present invention.

FIG. 2 is a perspective view showing a state of a large screen by the wiring connection method of the EL element of FIG. 1 and a plurality of arrangements of EL elements.

FIG. 3 is a perspective view of a color pixel of another EL element according to the present invention.

FIG. 4 is a layout diagram of an EL element pixel including an active matrix thin film transistor according to the present invention.

FIG. 5 is a circuit diagram of an active matrix display.

[Explanation of symbols]

1 ... Display unit, 3 ... Scan line, 4 ... Scan line driver, 5 ... Data line, 6 ... Data line driver, 7 ... Signal line, 8 ... Connector, 11 ... Core wire, 12 ... Light emitting layer, 13
... spacers, 14 ... transparent film, 15 ... transparent electrodes, 1
6 ... Printed circuit board, 17 ... Wiring, 22 ... Data line pattern
24, 25, 26 ... Color emitting layer, 28 ... Insulator, 30
… Through holes, 31… Wiring, 32… Driver IC, 4
1 ... Scan line, 42 ... Data line, 43, 47 ... Gate line pattern, 44 ... Source electrode pattern, 45 ... Drain electrode pattern, 46 ... Through hole, 50 ... Transparent electrode pattern , 51 ... Light emitting element, 53, 54 ... Thin film transistor.

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Yutaka Saito, 292 Yoshida-cho, Totsuka-ku, Yokohama City, Kanagawa Prefecture, Hitachi, Ltd., Institute of Industrial Science (56) Reference JP-A-62-229181 (JP, A) JP 61-231584 (JP, A) JP-A-1-319092 (JP, A) JP-A-5-109484 (JP, A) Actual development Sho-55-114992 (JP, U) (58) Fields investigated (Int .Cl. ⁷ , DB name) H05B 33/00-33/28

Claims (6)

(57) [Claims] 1. A plurality of core wires made of a metal conductor coated with a light emitting layer of an organic EL film, spacers for insulating between the core wires, and a transparent film having a plurality of linear transparent electrode patterns formed thereon. Equipped with a transparent electrode pattern on the transparent film
- by intersecting the emissions are alternately arranged and the core and the spacer, an organic thin film EL configured to emit the light emitting layer by voltage applied between the core wire and the transparent electrode Display
A Lee apparatus, the printed circuit board to adhere the transparent film are alternately arranged with the core and the spacer is provided, adhered to the core side of the transparent film on one side of the printed circuit board, said each of the above core and transparent film Bend at the edge of the printed circuit board, and the circuit pattern on the other side of the printed circuit board.
The organic EL display device is characterized in that it is electrically connected to the monitor. 2. A driver circuit and / or a central processing circuit and / or a memory device and / or a reception / detection circuit and / or an input / output terminal for image information are mounted on the other side of the printed board. Claim 1
On-board organic EL display device. Wherein a concavo-convex shape provided on the transparent film, before
The recess is filled with an opaque material or a good electrical conductor, and
It is characterized in that the transparent electrode pattern is provided on the convex portion.
The organic EL display device according to claim 1 . 4. The resistivity of the light emitting layer is 0.3 to 3 × 10 6.
The organic EL display device according to claim 1 , wherein the film thickness is set to Ω · cm and the film thickness is set to 300 to 3000 nm. 5. A core wire made of a metal conductor is used to emit light from an organic EL film.
Layer coating process and formation of multiple linear transparent electrode patterns on transparent film
And the transparent electrode pattern on the transparent film
A core wire covering the light emitting layer of the organic EL film and an insulating spacer
And the core side of the transparent film is bonded to one side of the printed circuit board.
And the core wire and the transparent film, respectively.
Bend at the edge of the circuit pattern on the other side of the printed circuit board
And an organic thin film EL device
Spray device manufacturing method. 6. After the step of coating the core wire with the light emitting layer ,
Insulate the core wire is provided a step of forming an insulating film by anodic oxidation treatment, the exposed core surface without being covered with the light-emitting layer
6. The organic EL device according to claim 5 , wherein a film is formed to reduce short circuit defects at defective portions of the light emitting layer.
Display device manufacturing method.