JP3449455B2 - Wafer transfer device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer device for carrying a large number of wafers cut into a predetermined thickness by a wire saw device into a water tank and arranging the wafers at predetermined separation positions.

[0002]

2. Description of the Related Art For example, when a large number of wafers cut by a wire saw device are separated one by one in a water tank, a large number of wafers are stacked and accommodated in a bucket, and a predetermined separation in the water tank is performed. Had been placed in position. In this case, the operator manually loads the bucket containing the wafers into the water tank so that the stacking direction of the wafers is horizontal, and then rotates the buckets so that the stacking direction of the wafers is vertical. The attitude was changed to, and the bucket was moved in the lateral direction to arrange the wafer at a predetermined separation position.

[0003]

As described above, in the conventional wafer transfer apparatus, the operator manually carries in the bucket containing the stacked wafers into the water tank, and rotates and moves the bucket in the water tank. I was going there. For this reason, there is a problem that the wafer transfer operation is troublesome and time-consuming, and the wafer may fly out of the bucket when the bucket rotates in the water tank.

The present invention has been made by paying attention to the problems existing in such conventional techniques. The purpose is to carry in the bucket containing the stacked wafers into the water tank, rotate and move the bucket in the water tank,
It is an object of the present invention to provide a wafer transfer device that can be easily performed without manual work by an operator and that can prevent the wafer from jumping out of the bucket when the bucket rotates.

[0005]

In order to achieve the above object, according to the invention of claim 1, a state in which a large number of wafers cut into a predetermined thickness by a wire saw device are stacked and accommodated in a bucket. Then, the wafers are loaded into the water tank so that the stacking direction is horizontal, and then the bucket is rotated to change the posture of the wafers so that the stacking direction is vertical, and then the bucket is moved horizontally. A wafer transfer device in which a wafer is placed at a predetermined separation position in a water tank, wherein a support frame for supporting a bucket is rotatably and movably arranged in the water tank, and the support frame is supported. The frame is provided with a holding mechanism for holding the wafers in the accommodation state in the bucket, and the rotation of the support frame is inching, and the holding mechanism is a rod extending in the stacking direction of the wafers.
The rod includes a position for holding the wafer and a wafer.
It is said that it can be moved to and from the position for releasing .

According to a second aspect of the present invention, in the wafer transfer apparatus according to the first aspect, when the buckets in which the wafers are stacked and accommodated are carried into the water tank, they are held on a support frame in the water tank. The first release mechanism is provided for changing the mechanism to the release state.

According to a third aspect of the present invention, in the wafer transfer apparatus according to the first or second aspect, the bucket in which the wafers are stacked and accommodated is laterally rotated on the water tank after being rotated in the water tank. The second release mechanism is provided for changing the holding mechanism to the release state when the holding mechanism is moved to.

[0008]

According to the invention described in claim 4 , claims 1 to 3 are provided.
In the wafer transfer apparatus described in any one of the above 1, the support frame has a hooking means for hooking the bucket and preventing the bucket from falling during rotation.

[0010] is, in the transfer apparatus of wafers according to claim 1, in the case of separating a large number of wafers that are cut by the wire saw apparatus, one by one in the water tank, a large number of wafers bucket as follows It is arranged in a predetermined separation position in the water tank while being stacked and accommodated therein. That is,
A bucket containing a large number of wafers is loaded onto a support frame in a water tank such that the stacking direction of the wafers is horizontal. Then, in this state, the holding mechanism on the support frame holds the wafer so as not to jump out of the bucket.

After that, the bucket is rotated by the rotation of the support frame, and the attitude of the wafer is changed so that the stacking direction is set to the vertical direction. Further, the bucket is moved in the horizontal direction by the movement of the support frame, and the wafers are arranged at a predetermined separation position in the water tank while keeping the stacking direction of the wafer in the vertical direction. Therefore, it is possible to easily carry the wafer in the water tank without the manual work of the operator, and it is possible to prevent the wafer from jumping out of the bucket when the bucket rotates. Also,
When rotating the bucket, by making the rotation motion inching,
The lateral flow of the wafer in the bucket is prevented. In addition,
The stack will be held by the rod and will not fall out of the bucket.
To be prevented.

In the wafer transfer device according to the second aspect, when the buckets in which the wafers are stacked and loaded are loaded onto the support frame in the water tank, the holding mechanism is moved to the released state by the first release mechanism. Therefore, the bucket containing the wafer can be easily loaded onto the support frame without interfering with the holding mechanism on the support frame.

In the wafer transfer device according to the third aspect, when the buckets containing the stacked wafers are moved in the lateral direction after being rotated in the water tank, the holding mechanism is moved to the released state by the second releasing mechanism. To be done. Therefore, the wafer can be easily taken out from the bucket while the bucket is arranged at the separation position in the water tank.

[0014] In the conveying apparatus of a wafer according to claim 4, bucket during its rotation, is hooked by the hooking means, is prevented from falling off from the supporting frame.

[0015]

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings. As shown in FIGS. 1 and 2, the water tank 21 is formed in a rectangular box shape having an upper surface opened. Then, after a large number of wafers 22 cut into a predetermined thickness by a wire saw device (not shown) are stacked and accommodated in the bucket 23 and are loaded into the water tank 21, the stacking direction becomes vertical. While being rotated, it is laterally moved and placed at a predetermined separation position. Further, in this separation position, the wafer 22 is placed on the support bar 2
4 is transferred from the inside of the bucket 23 onto the support bar 24 thereof and is held at a predetermined position by the engagement with the holding rod 25. The holding rod 25 is moved between a position for holding the wafer 22 and a position for retracting it.

The lift table 26 is arranged in the water tank 21 so as to be lifted and lowered, and a cassette 27 for storing the wafers in a separated state is placed on the upper surface thereof. And this elevator 2
Water is jetted from the nozzle 30 to the uppermost wafer 22 of the wafers 22 on the support bar 24 while the motor 6 is moved to a predetermined height position by the motor 28 via the elevating mechanism 29. As a result, the wafers 22 are separated one by one, and are conveyed along the guide plate 31 and stored in the cassette 27.

As shown in FIGS. 3 and 4, the bucket 23 has a pair of side plates 34, and a pair of support rods 35 for supporting the wafer 22 are provided between the side plates 34. The screw rod 36 is rotatably supported between the both side plates 34, and the outer peripheral surface of the screw rod 36 has a screw portion 36 in the opposite direction from the center.
a is formed. The pair of clamp plates 37 are both side plates 3.
4 is movably arranged inside one of the clamp plates 37.
Is the threaded portion 3 of the threaded rod 36 through the threaded cylinder 38 below
It is screwed to 6a. Then, when the screw rod 36 is rotated by a motor (not shown), one clamp plate 37 is moved toward and away from the other clamp plate 37,
The wafer 22 is clamped or released between the clamp plates 37.

Each pair of engaging projections 39 is formed on the outer surface of the upper end of each side plate 34, and can be engaged with an arm of a work robot (not shown). The pair of engagement holes 40 are formed in the one side plate 34 and can be engaged with a hook 50 which will be described later. Then, the buckets 23 accommodating the stacked wafers 22 are loaded into the water tank 21 by the arm of the work robot in a state where the stacking direction of the wafers 22 is horizontal.

As shown in FIGS. 5 to 7, the moving frame 4
3 is movably arranged in the water tank 21 through a plurality of wheels 44 attached to the lower surface. Support frame 4
5 is rotatably supported on the moving frame 43 via a pair of horizontal support shafts 46, and a receiving stand 47 engageable with both side plates 34 of the bucket 23 is arranged on the upper surface thereof. Then, the bucket 23, in which the wafers 22 are stacked and accommodated, is
1 is loaded into the receiving frame 47 of the support frame 45.
Supported above.

As shown in FIGS. 6 and 8, the pair of hooks 50 are rotatably attached to one side edge of the support frame 45, and are engaged with the engagement holes 40 of the bucket 23 by the spring 51. Is biased to rotate in the direction. Then, when the bucket 23 is carried in and supported on the receiving table 47 of the support frame 45, these hooking claws 50 engage with the engaging holes 40,
The bucket 23 is hooked and held on the support frame 45. The latch claws 50 prevent the bucket 23 from falling off even if the bucket 23 rotates together with the support frame 55 around the support shaft 46. When the bucket 23 is removed from the support frame 45, the locking claw 50 is rotated in the releasing direction by the cylinder (not shown) via the connecting link 52, and the bucket 23 relative to the support frame 45 is rotated.
Is released.

As shown in FIGS. 5 to 7, a mechanism for rotating and moving the bucket 23 supported on the support frame 45 is provided on the water tank 21. That is, the fixed frame 55 is arranged above the water tank 21, and a pair of guide rails 56 is laid on the front surface thereof.
The moving plate 57 is movably supported by the guide rail 56,
Its lower end is connected to the moving frame 43. Then, the moving plate 58 is moved by the moving motor 58 via the ball screw 59, and the moving frame 43 is moved laterally in the water tank 21.

The drive lever 60 is rotatably supported on the upper end of the moving plate 57, and is rotated by a rotation motor 61 between an upper position and a lower position. The driven lever 62 is attached to the one support shaft 46 corresponding to the drive lever 60, and is connected to the drive lever 60 via the connecting rod 63.
When the drive motor 60 is rotated from the upper position to the lower position by the rotation motor 61 while the bucket 23 is supported on the support frame 45, the connecting rod 6
3, the support frame 45 is rotated from the horizontal state to the vertical state via the driven lever 62 and the support shaft 46.

As a result, the bucket 23 moves 90 degrees in the same direction.
The wafer 22 on the bucket 23 is rotated once, and the posture thereof is changed so that the stacking direction is set to the vertical direction. After that, the moving frame 43 is moved laterally by the moving motor 58, and the bucket 2 supported on the support frame 45 is moved.
3, the wafers 22 are moved in the same direction with the stacking direction of the wafers 22 kept in the vertical direction, and are arranged at the separation positions corresponding to the support bars 24 shown in FIG.

As shown in FIGS. 6 and 7, a holding mechanism 66 is provided.
Is disposed on the support frame 45, and the support frame 4
The wafer 22 is held in the bucket 23 prior to the rotation of the wafer 5 from the horizontal position in the vertical direction. That is, each pair of holding levers 67 has a support shaft 68.
The support levers 45 are rotatably supported on both sides of the support frame 45, and the holding levers 67 are integrally rotatably connected via a plurality of links 69. The holding rod 70 is provided between the corresponding holding levers 67, and is capable of coming into contact with and separating from the outer peripheral upper surface of the wafer 22 on the bucket 23.

The springs 71 are stretched between the holding levers 67 and the support frame 45, and urge the holding levers 67 to rotate inward. By this urging, each holding lever 67 is normally arranged at the inner position shown by the chain line in FIG. 6, and both holding rods 70 are placed on the wafer 22 on the bucket 23.
The wafer 22 is held in pressure contact with the upper surface of the outer periphery of the wafer 22 so that the wafer 22 does not jump out of the bucket 23.

The release roller 72 is attached to the one support shaft 68 via a lever 73. When the release roller 72 is pressed, each holding lever 67 is rotated from the inner position shown by the chain line in FIG. 6 to the outer position shown by the solid line, and both holding rods 70 are separated from the outer peripheral upper surface of the wafer 22. It is placed in the release position.

As shown in FIGS. 9 and 11, the first release mechanism 76 is disposed on the water tank 21, and the bucket 23 accommodating the wafers 22 is stacked and supported on the support frame 45 in the water tank 21.
When it is carried up, the release roller 72 is pressed to shift the holding mechanism 66 to the released state. That is, the release lever 77 is rotatably supported on the inner surface on one side of the water tank 21 at the intermediate portion, and the lower end thereof is provided with a pressing plate 78 that can be engaged with the release roller 72.

The first cylinder 79 is arranged above the outside of the water tank 21 via a bracket 80, and its piston rod is connected to the upper end of the release lever 77 via a connecting body 81. Then, when the first cylinder 79 is retracted, the release lever 77 is rotated clockwise in FIG. 9 to press the release roller 72, and both the holding rods 70 of the holding mechanism 66 are arranged at the release position. It As a result, the bucket 23 accommodating the wafer 22 can be loaded onto the support frame 45 without interfering with both the holding rods 70.

As shown in FIGS. 10 and 11, the second releasing mechanism 84 is disposed on the decomposition water tank 21 adjacent to the first releasing mechanism 76, and the bucket 23 accommodating the wafers 22 in a stacked manner is the water tank 21. When the stacking direction is rotated so that the stacking direction is the vertical direction and then is moved in the horizontal direction, the release roller 72 is pressed to shift the holding mechanism 66 to the release state. That is, the moving plate 85 is connected to the water tank 21 via the bracket 86 and the pair of guide rods 87.
Is arranged movably above and outside, and a release plate 88 is extended and arranged at the lower end in the moving direction of the bucket 23.

The second cylinder 89 is arranged on the bracket 86, and its piston rod is connected to the moving plate 85 via the connecting body 90. Then, when the second cylinder 89 is projected, the release plate 88 is moved from the inoperative position shown by the solid line in FIG. 11 to the operating position shown by the chain line. In this state, the release roller 72 is pressed by the engagement with the release plate 88 when the bucket 23 in which the wafers 22 are stacked and housed is rotated and then moved in the lateral direction due to the rotation and horizontal movement of the support frame 45. Then, both holding rods 70 of the holding mechanism 66 are arranged at the release position. This allows
The wafer 22 can be taken out of the bucket 23 without interfering with both holding rods 70.

Next, the operation of the wafer transfer device configured as described above will be described. In this wafer transfer device, a large number of wafers 22 cut into a predetermined thickness by a wire saw device (not shown) are stacked and housed in a bucket 23, and the buckets 23 are stored in a water tank 21 by a work robot (not shown). It is carried onto the support frame 45. At this time, as shown in FIGS. 5 and 6, the support frame 45 is rotatably arranged in a horizontal state, and the wafers 22 are loaded and supported so that the stacking direction thereof is horizontal.

At the time of carrying in, the holding mechanism 66 on the support frame 45 is arranged at the releasing position shown by the solid line in FIG. 6 by the first releasing mechanism 76. Therefore, the wafer 2
The bucket 23 accommodating 2 is carried in and supported on the support frame 45 without interfering with the holding mechanism 66. Then, when the loading of the bucket 23 is completed, the bucket 23 is hooked and held by the support frame 45 by the hooking claw 50, and the holding rod 70 of the holding mechanism 66 is arranged at the holding position shown by the chain line in FIG. Wafer 22 is bucket 23
It is held in the housed state.

In this state, by intermittently driving the rotation motor 61, the support frame 45 is slightly rotated by an angle of 90 degrees, the bucket 23 is rotated in the same direction, and the wafer 22 is vertically laminated. The posture is changed so that it faces. At this time, since the wafer 22 is held in the bucket 23 by the holding mechanism 66, there is no possibility that the wafer 22 jumps out of the bucket 23 during the rotation of the bucket 22.

Moreover, since the rotation of the bucket 23 is caused by the inching, the lateral flow of the wafer 22 in the bucket 23 due to the centrifugal force is prevented, and the attitude of the wafer 22 is changed in a stable accommodation state. Therefore, the wafer 22 is held against the holding mechanism 66.
As a result, an excessive force is not applied, so that the holding and releasing drive force of the holding mechanism 66 can be small.

Thereafter, the supporting frame 45 is moved laterally together with the moving frame 43 by the moving motor 58, and the wafers 22 housed in the buckets 23 are kept in the water tank 21 with the stacking direction thereof kept in the vertical direction. Are arranged at predetermined separation positions. At the end of this movement, the holding mechanism 66 on the support frame 45 is arranged at the releasing position by the second releasing mechanism 84, and the holding lever 6 is released.
7 is opened.

Then, in this state, the wafer 22 is moved to the bucket 23 by raising the support lever 24 shown in FIGS.
The wafer 22 is transferred from the inside onto the support lever 24, the holding rod 25 is rotated from the retracted position to the holding position, and the wafer 22 is held at a predetermined position by the engagement with the holding lever. After that, water is sprayed from the nozzle 30 onto the wafer 22 on the support bar 24 while the elevating table 26 is raised stepwise by the motor 28 at a pitch of the thickness of the wafer 22. As a result, the wafers 22 are separated one by one from the separation position and housed in the cassette 27.

On the other hand, the movable frame 43 on which the empty bucket 23 is placed is operated in the reverse order of the above, and the backward rotation is performed following the backward movement in the horizontal direction. As shown in FIG. Is opened and the work robot takes it out of the water tank 21.

The effects expected from the above embodiment will be described below. In the wafer transfer device of this embodiment, the support frame 4 for supporting the bucket 23 in the water tank 21.
5 is rotatably and movably arranged, and a supporting frame 45 thereof is provided with a holding mechanism 66 for holding the wafer 22 in the accommodation state in the bucket 23. Therefore, in the water tank 2 of the bucket 23 in which the wafers 22 are stacked and stored.
1 can be easily carried in, and the bucket 23 in the water tank 21 can be easily rotated and moved without manual work. In addition, since the wafer 22 is held in the bucket 23 by the holding mechanism 66 when the bucket 23 is rotated, it is possible to prevent the wafer 22 from jumping out of the bucket 23. Then, the holding mechanism 66 serves to hold the holding rod 2 extending in the stacking direction of the wafers 22.
Since the wafer 22 is held by means of 5, the wafer 22 can be held securely with a simple structure.

In the wafer transfer apparatus of this embodiment, when the bucket 23 containing the stacked wafers 22 is carried onto the support frame 45 in the water tank 21, the first mechanism for changing the holding mechanism 66 to the released state. 1 release mechanism 76
Are provided on the water tank 21. Therefore, the bucket 23 accommodating the wafer 22 can be easily loaded onto the support frame 45 without interfering with the holding mechanism 66 on the support frame 45.

In the wafer transfer apparatus of this embodiment, when the bucket 23 containing the stacked wafers 22 is moved in the lateral direction after being rotated in the water tank 21, the holding mechanism 66 is moved to the released state. The second release mechanism 84 is provided on the water tank 21. Therefore, the wafer 22 can be easily taken out from the bucket 23 in a state where the bucket 23 is arranged at the separation position in the water tank 21.

In the wafer transfer apparatus of this embodiment, when the support frame 45 is rotated, the hooks 50 prevent the bucket 23 from falling off the support frame 45, and the wafer 22 is transferred smoothly. be able to.

In the wafer transfer apparatus of this embodiment, the rotation of the bucket 23 is caused by inching, so that the lateral flow of the wafer 22 in the bucket 23 due to centrifugal force is prevented, and the attitude of the wafer 22 is changed in a stable accommodation state. To be done.
Therefore, the wafer 22 does not exert an excessive force on the holding mechanism 66, so that the holding and releasing driving force of the holding mechanism 66 can be reduced.

In the above embodiment, various actuators such as motors should be replaced with other actuators. For example, various changes are possible, such as changing the motor to a cylinder and the cylinder to a solenoid.

[0045]

Since the present invention is constructed as described above, it has the following effects. According to the invention as set forth in claim 1, the buckets containing the stacked wafers can be easily carried into the water tank, and the buckets can be rotated and moved in the water tank without any manual work.
It is possible to prevent the wafer from jumping out of the bucket when the bucket rotates. Further, an excessive force of the wafer is not applied to the holding mechanism, so that the holding and releasing driving force of the holding mechanism can be reduced. Retention
The mechanism uses a rod that extends in the wafer stacking direction
Since it is held, the wafer can be held securely with a simple structure.
It

According to the second aspect of the invention, the bucket containing the wafer can be easily loaded onto the support frame without interfering with the holding mechanism on the support frame.

According to the third aspect of the present invention, the wafer can be easily taken out from the bucket while the bucket is arranged at the separation position in the water tank .

According to the invention of claim 4 , it is possible to reliably prevent the bucket from falling off.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a wafer transfer device of the present invention.

FIG. 2 is a sectional view showing the entire wafer transfer device.

FIG. 3 is a partially cutaway front view showing a bucket for supporting a wafer.

FIG. 4 is a side view of the bucket.

FIG. 5 is a front view of a main part showing an enlarged wafer rotation and movement mechanism.

FIG. 6 is a side view of an essential part showing an enlarged wafer holding mechanism.

7 is a front view of a main part of the holding mechanism of FIG.

FIG. 8 is a front view of essential parts showing a hooking mechanism of a bucket with respect to a rotating frame.

FIG. 9 is a side view of essential parts showing a first release mechanism for a wafer holding mechanism.

FIG. 10 is a side view of essential parts showing a second release mechanism for the wafer holding mechanism.

FIG. 11 is a plan view of an essential part showing a first release mechanism and a second release mechanism.

[Explanation of Codes] 21 ... Water tank, 22 ... Wafer, 23 ... Bucket, 34 ... Side plate, 35 ... Support rod, 37 ... Clamp plate, 40 ... Engagement hole, 43 ... Moving frame, 45 ... Support frame, 46 ...
Support shaft, 50 ... Latching claw, 57 ... Moving plate, 58 ... Moving motor, 60 ... Driving lever, 61 ... Rotating motor, 62 ... Followed lever, 66 ... Holding mechanism, 67 ... Holding lever, 70 ...
Holding rod, 72 ... release roller, 76 ... first release mechanism,
77 ... Release lever, 79 ... First cylinder, 84 ... Second release mechanism, 88 ... Release plate, 89 ... Second cylinder.

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) B65G 49/07 B65G 49/04 H01L 21/68 H01L 21/304

Claims (4)

(57) [Claims] 1. A plurality of wafers cut to a predetermined thickness are stacked and accommodated in a bucket, and are loaded into a water tank so that the stacking direction of the wafer is horizontal, and then the bucket is rotated. A wafer transfer apparatus in which the attitude of the wafer is changed so that the stacking direction is vertical, and further, the bucket is moved in the horizontal direction to arrange the wafer at a predetermined separation position in the water tank. A support frame for supporting the bucket is rotatably and movably arranged in the water tank, and the support frame is provided with a holding mechanism for holding the wafer in the accommodation state in the bucket. was brought to inching, the
The holding mechanism includes a rod extending in the stacking direction of the wafers,
The rod holds the wafer and releases the wafer
A wafer transfer device that can be moved to and from the desired position . 2. When a bucket containing stacked wafers is loaded onto the support frame in the water tank,
The wafer transfer apparatus according to claim 1, further comprising a first release mechanism for changing the holding mechanism to a release state. 3. A second release mechanism is provided on the water tank for shifting the holding mechanism to a release state when the buckets in which the wafers are stacked and accommodated are horizontally moved after being rotated in the water tank. The wafer transfer apparatus according to claim 1 or 2. 4. The support frame hooks a bucket,
There is a hooking device to prevent the bucket from falling off during rotation.
The wafer transfer device according to claim 1.