JP3430964B2 - LC filter - Google Patents

LC filter

Info

Publication number
JP3430964B2
JP3430964B2 JP08113399A JP8113399A JP3430964B2 JP 3430964 B2 JP3430964 B2 JP 3430964B2 JP 08113399 A JP08113399 A JP 08113399A JP 8113399 A JP8113399 A JP 8113399A JP 3430964 B2 JP3430964 B2 JP 3430964B2
Authority
JP
Japan
Prior art keywords
filter
substrate
terminal
processing circuit
circuit section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP08113399A
Other languages
Japanese (ja)
Other versions
JP2000278072A (en
Inventor
雅裕 芝
兼司 植野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP08113399A priority Critical patent/JP3430964B2/en
Publication of JP2000278072A publication Critical patent/JP2000278072A/en
Application granted granted Critical
Publication of JP3430964B2 publication Critical patent/JP3430964B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、各種民生機器に用
いるLCフィルタに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LC filter used in various consumer appliances.

【0002】[0002]

【従来の技術】以下、従来のLCフィルタについて図面
を参照しながら説明する。
2. Description of the Related Art A conventional LC filter will be described below with reference to the drawings.

【0003】図10は従来のLCフィルタの斜視図、図
11は同LCフィルタの等価回路図である。
FIG. 10 is a perspective view of a conventional LC filter, and FIG. 11 is an equivalent circuit diagram of the LC filter.

【0004】図10、図11において、従来のLCフィ
ルタは、インダクタンス素子とコンデンサ素子とを組み
合わせてLC回路を形成するとともに、入力信号をLC
回路により処理して、特定周波数域の出力信号を出力す
るフィルタ回路部1を備えている。
In FIGS. 10 and 11, a conventional LC filter forms an LC circuit by combining an inductance element and a capacitor element, and an input signal is LC
The filter circuit unit 1 is provided for processing by a circuit and outputting an output signal in a specific frequency range.

【0005】また、このフィルタ回路部1は、両端の鍔
2間に複数の鍔2を有し、この鍔2間に巻線3を巻回し
た多連同軸ボビン4と、多連同軸ボビン4の鍔2に植設
し、端部を鍔2の上方または下方に突出させるととも
に、巻線3と接続した端子5と、この端子5と接続した
チップコンデンサ6とを有している。そして、チップコ
ンデンサ6を、多連同軸ボビン4の鍔2の上面で、鍔2
の上方に突出させた端子5間に配置した構成である。
The filter circuit section 1 has a plurality of collars 2 between the collars 2 at both ends, and a multiple coaxial bobbin 4 in which a winding 3 is wound between the collars 2 and a multiple coaxial bobbin 4 are provided. It has a terminal 5 connected to the winding 3 and a chip capacitor 6 connected to the terminal 5 while having its end portion projected above or below the flange 2. Then, mount the chip capacitor 6 on the upper surface of the collar 2 of the multiple coaxial bobbin 4 by the collar 2
It is arranged between the terminals 5 protruding upward.

【0006】このようなLCフィルタを実装基板に実装
する際、実装基板には、LCフィルタのフィルタ回路部
から出力される出力信号を処理する処理回路部が設けら
れる。そして、この処理回路部は、複数の接続部を有す
る配線パターンと、この配線パターンの接続部により接
続する電子部品とから形成される。
When mounting such an LC filter on a mounting board, the mounting board is provided with a processing circuit section for processing an output signal output from the filter circuit section of the LC filter. The processing circuit unit is formed of a wiring pattern having a plurality of connecting portions and electronic components connected by the connecting portions of the wiring pattern.

【0007】[0007]

【発明が解決しようとする課題】上記従来の構成では、
入力信号をLC回路により処理して、特定周波数域の出
力信号を出力するフィルタ回路部1のみを有しているの
で、このフィルタ回路部1から出力される出力信号を処
理することができず、この処理のための処理回路部を実
装基板に形成しなければならなかった。
SUMMARY OF THE INVENTION In the above conventional configuration,
Since only the filter circuit unit 1 that processes the input signal by the LC circuit and outputs the output signal in the specific frequency range is included, the output signal output from the filter circuit unit 1 cannot be processed. The processing circuit unit for this processing has to be formed on the mounting substrate.

【0008】これにより、処理回路部の占有面積分、実
装基板が大きくなり、LCフィルタを実装する実装基板
の小型化を図ることができないとともに、フィルタ回路
部1と処理回路部とが分離されているので、実装基板に
おける周辺回路による影響等により、フィルタ回路部と
処理回路部との電気的接続の際の微調整が複雑になり、
信頼性を低下させるという問題点を有していた。
As a result, the mounting board becomes larger by the area occupied by the processing circuit section, the mounting board on which the LC filter is mounted cannot be downsized, and the filter circuit section 1 and the processing circuit section are separated. Therefore, due to the influence of the peripheral circuit on the mounting board, fine adjustment at the time of electrical connection between the filter circuit unit and the processing circuit unit becomes complicated,
It has a problem of reducing reliability.

【0009】本発明は上記問題点を解決するものであ
り、実装基板の小型化を図ることができるとともに、信
頼性を向上したLCフィルタを提供することを目的とし
ている。
The present invention solves the above problems, and an object of the present invention is to provide an LC filter which can reduce the size of a mounting substrate and improve reliability.

【0010】[0010]

【課題を解決するための手段】上記目的を達成するため
に本発明は、特に、前記多連同軸ボビンの上方に突出さ
せた前記端子の端部には、前記多連同軸ボビンの上方に
前記処理回路部の基板を配置して前記基板の接続部を電
気的接続するとともに、前記多連同軸ボビンの鍔の上
前記チップコンデンサを置して前記チップコンデンサ
を電気的接続し、かつ、前記巻線を電気的接続した構成
である。
Means for Solving the Problems The present invention to achieve the above object, in particular, the the end of the terminal which projects above the multiple-coaxial bobbins, the above said multiple-coaxial bobbins thereby electrically connecting the connection portion of the substrate by placing the substrate in the processing circuit section, wherein by location mounting a chip capacitor electrically connecting the chip capacitors on the flange of the multiple-coaxial bobbins, and The windings are electrically connected.

【0011】上記構成により、多連同軸ボビンの上方に
突出させた端子の端部には、多連同 軸ボビンの上方に処
理回路部の基板を配置して基板の接続部を電気的接続
ているので、実装基板に処理回路部を設ける必要がな
く、処理回路部の占有面積分、実装基板を小さくでき、
LCフィルタを実装する実装基板の小型化を図ることが
できる。
With the above-mentioned structure, the upper part of the multiple coaxial bobbin is provided.
The end of is protruded pin punished above the Tarendo shaft bobbin
Since the board of the processing circuit section is arranged and the connecting section of the board is electrically connected , it is not necessary to provide the processing circuit section on the mounting board, and the mounting board can be made smaller by the area occupied by the processing circuit section.
It is possible to reduce the size of the mounting board on which the LC filter is mounted.

【0012】また、ボビンの上方に基板を配置すること
により、フィルタ回路部と処理回路部とを分離させず、
結合させているので、実装基板における周辺回路による
影響等を受けることがなく、フィルタ回路部と処理回路
部との電気的接続の際の微調整を容易にし、信頼性を向
上させることができる。
Further, by disposing the substrate above the bobbin, the filter circuit section and the processing circuit section are not separated,
Since they are connected to each other, they are not affected by peripheral circuits on the mounting board, and it is possible to facilitate fine adjustment when electrically connecting the filter circuit unit and the processing circuit unit and improve reliability.

【0013】[0013]

【発明の実施の形態】本発明の請求項1に記載の発明
は、特に、前記多連同軸ボビンの上方に突出させた前記
端子の端部には、前記多連同軸ボビンの上方に前記処理
回路部の基板を配置して前記基板の接続部を電気的接続
するとともに、前記多連同軸ボビンの鍔の上に前記チッ
プコンデンサを置して前記チップコンデンサを電気的
接続し、かつ、前記巻線を電気的接続した構成である。
DETAILED DESCRIPTION OF THE INVENTION According to a first aspect of the present invention, particularly, the the end of the <br/> terminal which projects above the multiple-coaxial bobbins, of the multiple-coaxial bobbins thereby electrically connecting the connection portion of the substrate by placing the substrate of the processing circuit unit upward, the then location mounting a chip capacitor electrically connecting the chip capacitor on the flange of the multiple-coaxial bobbins In addition, the windings are electrically connected.

【0014】上記構成により、多連同軸ボビンの上方に
突出させた端子の端部には、多連同軸ボビンの上方に処
理回路部の基板を配置して基板の接続部を電気的接続
ているので、実装基板に処理回路部を設ける必要がな
く、処理回路部の占有面積分、実装基板を小さくでき、
LCフィルタを実装する実装基板の小型化を図ることが
できる。
With the above-mentioned structure, the upper part of the multiple coaxial bobbin is provided.
The end of the protruding terminal should be treated above the multiple coaxial bobbin.
Since the board of the processing circuit section is arranged and the connecting section of the board is electrically connected , it is not necessary to provide the processing circuit section on the mounting board, and the mounting board can be made smaller by the area occupied by the processing circuit section.
It is possible to reduce the size of the mounting board on which the LC filter is mounted.

【0015】また、ボビンの上方に基板を配置すること
により、フィルタ回路部と処理回路部とを分離せず、結
合させているので、実装基板における周辺回路による影
響等を受けることがなく、フィルタ回路部と処理回路部
との電気的接続の際の微調整を容易にし、信頼性を向上
させることができる。
Further, by disposing the substrate above the bobbin, the filter circuit portion and the processing circuit portion are not separated but joined, so that the filter circuit portion and the processing circuit portion are not affected by the peripheral circuits on the mounting substrate and the like. It is possible to facilitate fine adjustment when electrically connecting the circuit unit and the processing circuit unit and improve reliability.

【0016】本発明の請求項2記載の発明は、請求項1
記載の発明において、基板の接続部に貫通孔を設け、前
記貫通孔に鍔の上方に突出させた端子の端部を挿入した
構成である。
The invention according to claim 2 of the present invention is claim 1
In the invention described above, a through hole is provided in the connecting portion of the substrate, and an end portion of the terminal projecting above the flange is inserted into the through hole.

【0017】上記構成により、基板の接続部に設けた貫
通孔に、鍔の上方に突出させた端子の端部を挿入してい
るので、接続部と端子との電気的接続を容易にするとと
もに、基板の位置ずれを防止することができる。
With the above structure, since the end of the terminal projecting above the collar is inserted into the through hole provided in the connecting portion of the substrate, the electrical connection between the connecting portion and the terminal can be facilitated. It is possible to prevent the displacement of the substrate.

【0018】本発明の請求項3記載の発明は、請求項1
記載の発明において、基板の接続部に切欠部を設け、前
記切欠部に鍔の上方に突出させた端子の端部を挿入した
構成である。
The invention according to claim 3 of the present invention is claim 1
In the invention described above, a notch portion is provided in the connecting portion of the substrate, and an end portion of the terminal projecting above the flange is inserted into the notch portion.

【0019】上記構成により、基板の接続部に設けた貫
通孔に、鍔の上方に突出させた端子の端部を挿入してい
るので、接続部と端子との電気的接続を容易にするとと
もに、基板の位置ずれを防止することができる。
With the above structure, since the end of the terminal projecting above the collar is inserted into the through hole provided in the connecting portion of the substrate, the electrical connection between the connecting portion and the terminal can be facilitated. It is possible to prevent the displacement of the substrate.

【0020】本発明の請求項4記載の発明は、請求項2
または請求項3記載の発明において、鍔の上方に突出さ
せた端子の端部を、基板の上方まで突出させるととも
に、基板側に折曲した構成である。
The invention according to claim 4 of the present invention is the invention according to claim 2.
Alternatively, in the invention according to claim 3, the end portion of the terminal projecting above the collar is projected above the board and is bent toward the board.

【0021】上記の構成により、鍔の上方に突出させた
端子の端部を、基板の上方まで突出させるとともに、基
板側に折曲しているので、折曲した部分により基板を支
持することができ、基板の位置ずれを防止することがで
きる。
With the above structure, the end of the terminal projecting above the collar is projected above the board and is bent toward the board. Therefore, the board can be supported by the bent portion. It is possible to prevent the displacement of the substrate.

【0022】本発明の請求項5記載の発明は、請求項2
〜請求項4の内、いずれか一つに記載の発明において、
鍔の上方に突出させた端子の端部の先端部を、前記端子
の径よりも小さい細芯部にするとともに、前記細芯部の
根元に形成される段差部で、基板を支持した構成であ
る。
The invention according to claim 5 of the present invention is the invention according to claim 2.
~ In the invention described in any one of claims 4,
A structure in which the tip of the end of the terminal protruding above the collar is a thin core portion smaller than the diameter of the terminal, and the substrate is supported by a step portion formed at the base of the thin core portion. is there.

【0023】上記構成により、段差部によって、基板は
支持されるので、段差部の高さによって、基板とボビン
との間隔を制限し、基板の上下方向における規制ができ
る。
With the above structure, since the substrate is supported by the step portion, the height of the step portion can limit the distance between the substrate and the bobbin, and can regulate the substrate in the vertical direction.

【0024】本発明の請求項6記載の発明は、請求項5
記載の発明において、細芯部はチップコンデンサより上
方の端子の先端部に形成した構成である。
The invention according to claim 6 of the present invention is the invention according to claim 5.
In the invention described above, the thin core portion is above the chip capacitor.
This is a structure formed at the tip of one of the terminals .

【0025】上記構成により、基板がチップコンデンサ
と接触することがなく、チップコンデンサの位置ずれを
防止することができる。
With the above structure, the substrate does not come into contact with the chip capacitor, and the displacement of the chip capacitor can be prevented.

【0026】本発明の請求項7記載の発明は、請求項1
記載の発明において、フィルタ回路部と処理回路部とを
同調させる同調回路部を設け、前記同調回路部は、前記
処理回路部と電気的接続するとともに、前記フィルタ回
路部の多連同軸ボビンに巻線を巻回して形成した構成で
ある。
The invention according to claim 7 of the present invention is claim 1
In the invention described above, a tuning circuit unit for tuning the filter circuit unit and the processing circuit unit is provided, and the tuning circuit unit is electrically connected to the processing circuit unit and is wound around a multiple coaxial bobbin of the filter circuit unit. It is a structure formed by winding a wire.

【0027】上記構成により、同調回路部を設けるの
で、フィルタ回路部と処理回路部との同調を容易にする
ことができる。
With the above structure, since the tuning circuit section is provided, the tuning between the filter circuit section and the processing circuit section can be facilitated.

【0028】(実施の形態) 以下、本発明の一実施の形態におけるLCフィルタにつ
いて図面を参照しながら説明する。
(Embodiment) An LC filter according to an embodiment of the present invention will be described below with reference to the drawings.

【0029】図1は本発明の一実施の形態におけるLC
フィルタの斜視図、図2は同LCフィルタの上面図、図
3は同LCフィルタのA−A断面図、図4は同LCフィ
ルタのB−B断面図、図5は同LCフィルタの鍔の上方
に突出させた端子の端部の拡大斜視図、図6は同LCフ
ィルタのフィルタ回路部の上面図、図7は同LCフィル
タの処理回路部の上面図、図8は同LCフィルタの電子
部品実装前の処理回路部の上面図、図9は同LCフィル
タの等価回路図である。
FIG. 1 shows an LC according to an embodiment of the present invention.
FIG. 2 is a perspective view of the filter, FIG. 2 is a top view of the LC filter, FIG. 3 is a sectional view taken along the line AA of the LC filter, FIG. 4 is a sectional view taken along the line BB of the LC filter, and FIG. 5 is a flange of the LC filter. FIG. 6 is an enlarged perspective view of an end portion of the terminal protruding upward, FIG. 6 is a top view of a filter circuit portion of the LC filter, FIG. 7 is a top view of a processing circuit portion of the LC filter, and FIG. FIG. 9 is a top view of the processing circuit unit before component mounting, and FIG. 9 is an equivalent circuit diagram of the LC filter.

【0030】図1〜図8において、本発明の一実施の形
態におけるLCフィルタは、インダクタンス素子を形成
した巻線14とコンデンサ素子を形成したチップコンデ
ンサ17とを組み合わせてLC回路を形成するととも
に、入力信号をLC回路により処理して、特定周波数域
の出力信号を出力するフィルタ回路部11と、このフィ
ルタ回路部11から出力される出力信号を処理する処理
回路部12とを備えている。
1 to 8, the LC filter according to the embodiment of the present invention forms an inductance element .
Chip capacitor with the wound winding 14 and capacitor element
The filter circuit unit 11 that forms an LC circuit by combining the sensor 17 and the input signal is processed by the LC circuit to output an output signal in a specific frequency range, and an output signal output from the filter circuit unit 11. And a processing circuit section 12 for processing.

【0031】また、フィルタ回路部11は、両端の鍔1
3間に複数の鍔13を有し、この鍔13間に巻線14を
巻回した多連同軸ボビン15と、この多連同軸ボビン1
5の鍔13に植設し、端部を必要に応じて鍔13の上方
または下方に突出させるとともに、巻線14と接続した
端子16と、鍔13の上面で、この鍔13の上方に突出
した端子16の端部間に配置するとともに、この端子1
6と接続したチップコンデンサ17とを有している。
Further, the filter circuit section 11 has a collar 1 at both ends.
A multiple coaxial bobbin 15 having a plurality of collars 13 between three and windings 14 wound between the collars 13, and the multiple coaxial bobbin 1
5, the end portion of which is projected above or below the collar 13 as required, and the terminal 16 connected to the winding 14 and the upper surface of the collar 13 project above the collar 13. This terminal 1 is arranged between the ends of the terminal 16
6 and a chip capacitor 17 connected thereto.

【0032】さらに、処理回路部12は、複数の接続部
18を有する配線パターン19を形成した基板20と、
この配線パターン19の接続部18により接続するとと
もに、基板20に実装した電子部品21とを有してい
る。
Further, the processing circuit section 12 includes a substrate 20 on which a wiring pattern 19 having a plurality of connecting sections 18 is formed,
It has an electronic component 21 mounted on the substrate 20 while being connected by the connecting portion 18 of the wiring pattern 19.

【0033】そして、フィルタ回路部11と処理回路部
12とを電気的接続する接続手段を設け、この接続手段
は、多連同軸ボビン15の上方に基板20を配置すると
ともに、基板20の接続部18に貫通孔22を設け、こ
の貫通孔22に鍔13の上方に突出させた端子16の端
部を挿入して、鍔13の上方に突出させた端子16の端
部と基板20の接続部18とを電気的接続する手段とし
ている。
A connecting means for electrically connecting the filter circuit section 11 and the processing circuit section 12 is provided, and this connecting means arranges the substrate 20 above the multiple coaxial bobbin 15 and connects the substrate 20. 18 is provided with a through hole 22, and the end portion of the terminal 16 protruding above the collar 13 is inserted into the through hole 22 to connect the end portion of the terminal 16 protruding above the collar 13 and the connecting portion of the substrate 20. 18 is used as a means for electrically connecting.

【0034】このとき、鍔13の上方に突出させた端子
16の端子の先端部23は、端子16の径よりも小さい
細芯部24にするとともに、細芯部24の途中に形成し
た段差部25で、基板20を支持し、さらに、この細芯
部24を基板20の上方まで突出させている。このと
き、チップコンデンサ17の高さが低くなるように、段
差部25の高さを決めている。
At this time, the tip 23 of the terminal 16 of the terminal 16 protruding above the collar 13 is a thin core portion 24 smaller than the diameter of the terminal 16 and a step portion formed in the middle of the thin core portion 24. The substrate 20 is supported at 25, and the thin core portion 24 is projected above the substrate 20. At this time, the height of the step portion 25 is determined so that the height of the chip capacitor 17 becomes low.

【0035】そして、このLCフィルタの等価回路は、
図9に示すようになる。
The equivalent circuit of this LC filter is
As shown in FIG.

【0036】図9において、フィルタ回路部11の等価
回路(A)と処理回路部12の等価回路(B)との接続
は、A,B,Cで行い、それぞれ、フィルタ回路部11
では、多連同軸ボビン15の鍔13から上方に突出させ
た端子16の端部を、処理回路部12では、基板20の
配線パターン19の接続部18を、互いに適宜選択し
て、接続している。
In FIG. 9, the equivalent circuit (A) of the filter circuit section 11 and the equivalent circuit (B) of the processing circuit section 12 are connected by A, B, and C, respectively.
Then, the end portions of the terminals 16 protruding upward from the collar 13 of the multiple coaxial bobbin 15 and the connection portions 18 of the wiring pattern 19 of the substrate 20 in the processing circuit portion 12 are appropriately selected and connected to each other. There is.

【0037】さらに、このとき、フィルタ回路部11と
処理回路部12とを同調させる同調回路部10を設け、
同調回路部10は、処理回路部12と電気的接続すると
ともに、フィルタ回路部11の多連同軸ボビン15に巻
線を巻回して形成しており、この同調回路部10の等価
回路(C)と処理回路部12の等価回路(B)との接続
は、Bで行なっている。
Further, at this time, a tuning circuit unit 10 for tuning the filter circuit unit 11 and the processing circuit unit 12 is provided,
The tuning circuit unit 10 is electrically connected to the processing circuit unit 12 and is formed by winding a winding around the multiple coaxial bobbin 15 of the filter circuit unit 11. An equivalent circuit (C) of the tuning circuit unit 10 is formed. B is connected to the equivalent circuit (B) of the processing circuit unit 12.

【0038】上記構成のLCフィルタについて、以下そ
の動作を説明する。
The operation of the LC filter having the above structure will be described below.

【0039】上記構成により、フィルタ回路部11と処
理回路部12とを電気的接続する接続手段を設け、この
接続手段は、多連同軸ボビン15の上方に基板20を配
置するとともに、鍔13の上方に突出させた端子16の
端子と基板20の接続部18とを電気的接続する手段と
しているので、実装基板に処理回路部12を設ける必要
がなく、処理回路部12の占有面積分、実装基板を小さ
くできるとともに、多連同軸ボビン15の上方に基板2
0を配置することにより、フィルタ回路部11と処理回
路部12とを分離させず、結合させているので、実装基
板における周辺回路による影響等を受けることがない。
さらに、フィルタ回路部11と処理回路部12とを同調
させる同調回路部10を設けているので、周辺回路によ
る影響等を非常に受け難くすることができる。
With the above structure, a connecting means for electrically connecting the filter circuit section 11 and the processing circuit section 12 is provided, and this connecting means arranges the substrate 20 above the multiple coaxial bobbin 15 and also of the collar 13. Since the means for electrically connecting the terminal of the terminal 16 protruding upward and the connecting portion 18 of the substrate 20 is used, it is not necessary to provide the processing circuit portion 12 on the mounting substrate, and the mounting area corresponding to the area occupied by the processing circuit portion 12 is mounted. The board can be made small and the board 2 can be provided above the multiple coaxial bobbin 15.
By arranging 0, the filter circuit unit 11 and the processing circuit unit 12 are not separated but joined, so that they are not affected by peripheral circuits on the mounting substrate.
Furthermore, since the tuning circuit unit 10 that tunes the filter circuit unit 11 and the processing circuit unit 12 is provided, it is possible to make it extremely difficult to be affected by peripheral circuits.

【0040】また、基板20の接続部18に設けた貫通
孔22に、鍔13の上方に突出させた端子16の端子を
挿入しているので、接続部18と端子16との電気的接
続を容易にするとともに、基板20の位置ずれを防止す
ることができるとともに、細芯部24の途中に形成した
段差部25によって、基板20は支持されるので、段差
部25の高さによって、基板20と多連同軸ボビン15
との間隔を制限し、基板20の上下方向における規制が
できる。
Further, since the terminal of the terminal 16 projecting above the collar 13 is inserted into the through hole 22 provided in the connecting portion 18 of the substrate 20, the electrical connection between the connecting portion 18 and the terminal 16 is established. In addition to making it easy, it is possible to prevent the displacement of the substrate 20, and since the substrate 20 is supported by the step portion 25 formed in the middle of the thin core portion 24, the height of the step portion 25 allows the substrate 20 to be supported. And multiple coaxial bobbin 15
It is possible to limit the distance between the substrate 20 and the substrate 20 in the vertical direction of the substrate 20.

【0041】そして、チップコンデンサ17を鍔13の
上方に突出させた端子16の端部間に配置するととも
に、段差部25の高さよりもチップコンデンサ17の高
さが低くなるようにしているので、基板20がチップコ
ンデンサ17と接触することがなく、チップコンデンサ
17の位置ずれを防止することができる。
The chip capacitor 17 is arranged between the ends of the terminals 16 protruding above the collar 13, and the height of the chip capacitor 17 is lower than the height of the step 25. The substrate 20 does not come into contact with the chip capacitor 17, and the displacement of the chip capacitor 17 can be prevented.

【0042】このように本発明の一実施の形態によれ
ば、実装基板に処理回路部12を設ける必要がなく、処
理回路部12の占有面積分、実装基板を小さくでき、L
Cフィルタを実装する実装基板の小型化を図ることがで
きるとともに、実装基板における周辺回路による影響等
を受けることがなく、フィルタ回路部11と処理回路部
12との電気的接続の際の微調整を容易にし、信頼性を
向上させることができる。
As described above, according to the embodiment of the present invention, it is not necessary to provide the processing circuit section 12 on the mounting board, and the mounting board can be made smaller by the area occupied by the processing circuit section 12.
The mounting board on which the C filter is mounted can be miniaturized, and is not affected by peripheral circuits on the mounting board, etc., and finely adjusted when electrically connecting the filter circuit unit 11 and the processing circuit unit 12. Can be facilitated and reliability can be improved.

【0043】また、基板20の横方向への位置ずれを防
止することができるとともに、基板20と多連同軸ボビ
ン15との間隔を制限し、基板20の上下方向における
規制もできる。
Further, it is possible to prevent the positional displacement of the substrate 20 in the horizontal direction, limit the distance between the substrate 20 and the multiple coaxial bobbin 15, and regulate the substrate 20 in the vertical direction.

【0044】さらに、基板20がチップコンデンサ17
と接触することがなく、チップコンデンサ17の位置ず
れを防止することができる。
Further, the substrate 20 is the chip capacitor 17
It is possible to prevent the displacement of the chip capacitor 17 without making contact with.

【0045】なお、本発明の一実施の形態では、基板2
0に貫通孔22を設け、鍔13の上方に突出させた端子
16の端部を挿入することにより、接続部18と端子1
6との電気的接続を容易にしたが、基板20に切欠部を
設け、端子16の端部を挿入して、接続部18と端子1
6とを接続しても同様の効果を生じる。
In the embodiment of the present invention, the substrate 2
0 is provided with a through hole 22 and the end portion of the terminal 16 protruding above the collar 13 is inserted so that the connecting portion 18 and the terminal 1
Although the electrical connection with the terminal 6 is facilitated, the notch is provided in the substrate 20 and the end of the terminal 16 is inserted to connect the terminal 18 to the terminal 1.
Even if 6 and 6 are connected, the same effect is produced.

【0046】また、本発明の一実施の形態では、端子1
6の径よりも小さい細芯部24の途中に形成した段差部
25で、基板20を支持したが、途中に何も形成せず、
端子16の径と細芯部24の径との差により、必然的に
細芯部24の根元に形成される段差によって、基板20
を支持しても同様の効果を生じる。
In the embodiment of the present invention, the terminal 1
The step portion 25 formed in the middle of the thin core portion 24 having a diameter smaller than 6 supports the substrate 20, but nothing is formed in the middle,
Due to the difference between the diameter of the terminal 16 and the diameter of the thin core portion 24, a step formed at the base of the thin core portion 24 inevitably causes the substrate 20
Even if it supports, the same effect is produced.

【0047】さらに、基板20の上方に突出させた細芯
部24を、基板20側に折曲すれば、折曲した部分によ
り、基板20を支持することができ、基板20の位置ず
れを一層防止することができる。
Furthermore, if the thin core portion 24 protruding above the substrate 20 is bent toward the substrate 20 side, the substrate 20 can be supported by the bent portion, and the displacement of the substrate 20 is further reduced. Can be prevented.

【0048】[0048]

【発明の効果】以上のように本発明によれば、実装基板
に処理回路部を設ける必要がなく、処理回路部の占有面
積分、実装基板を小さくでき、LCフィルタを実装する
実装基板の小型化を図り、実装基板における周辺回路に
よる影響等を受けることがなく、フィルタ回路部と処理
回路部との電気的接続の際の微調整を容易にし、信頼性
を向上させたLCフィルタを提供することができる。
As described above, according to the present invention, it is not necessary to provide the processing circuit section on the mounting board, the mounting board can be made smaller by the area occupied by the processing circuit section, and the mounting board on which the LC filter is mounted can be made smaller. Provided is an LC filter which is improved in reliability and facilitates fine adjustment when electrically connecting the filter circuit unit and the processing circuit unit without being affected by peripheral circuits on the mounting substrate. be able to.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施の形態におけるLCフィルタの
斜視図
FIG. 1 is a perspective view of an LC filter according to an embodiment of the present invention.

【図2】同LCフィルタの上面図FIG. 2 is a top view of the LC filter.

【図3】図2のLCフィルタのA−A断面図3 is a cross-sectional view taken along the line AA of the LC filter shown in FIG.

【図4】図2のLCフィルタのB−B断面図4 is a cross-sectional view of the LC filter of FIG. 2 taken along the line BB.

【図5】同LCフィルタの鍔の上方に突出させた端子の
端部の拡大斜視図
FIG. 5 is an enlarged perspective view of an end portion of a terminal that is made to project above a collar of the LC filter.

【図6】同LCフィルタのフィルタ回路部の上面図FIG. 6 is a top view of a filter circuit section of the LC filter.

【図7】同LCフィルタの処理回路部の上面図FIG. 7 is a top view of a processing circuit section of the LC filter.

【図8】同LCフィルタの電子部品実装前の処理回路部
の上面図
FIG. 8 is a top view of a processing circuit section of the LC filter before mounting electronic components.

【図9】(A)(B)同LCフィルタの等価回路図9A and 9B are equivalent circuit diagrams of the LC filter.

【図10】従来のLCフィルタの斜視図FIG. 10 is a perspective view of a conventional LC filter.

【図11】同LCフィルタの等価回路図FIG. 11 is an equivalent circuit diagram of the LC filter.

【符号の説明】[Explanation of symbols]

10 同調回路部 11 フィルタ回路部 12 処理回路部 13 鍔 14 巻線 15 多連同軸ボビン 16 端子 17 チップコンデンサ 18 接続部 19 配線パターン 20 基板 21 電子部品 22 貫通孔 23 先端部 24 細芯部 25 段差部 10 Tuning circuit section 11 Filter circuit section 12 Processing circuit section 13 Tsuba 14 windings 15 Multiple coaxial bobbins 16 terminals 17 Chip Capacitor 18 Connection 19 wiring patterns 20 substrates 21 electronic components 22 Through hole 23 Tip 24 Thin core 25 Step

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平9−17643(JP,A) 特開 昭61−150315(JP,A) 特開 平8−306551(JP,A) 特開 昭61−136285(JP,A) 実開 平6−26215(JP,U) 実開 昭61−144617(JP,U) 実開 昭53−26487(JP,U) 実開 昭63−136421(JP,U) 実開 昭62−101209(JP,U) 実開 平4−2113(JP,U) 実公 昭49−46982(JP,Y1) (58)調査した分野(Int.Cl.7,DB名) H03H 5/00 - 7/12 H01F 27/00 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-9-17643 (JP, A) JP-A 61-150315 (JP, A) JP-A 8-306551 (JP, A) JP-A 61- 136285 (JP, A) Actual opening Flat 6-26215 (JP, U) Actual opening Sho 61-144617 (JP, U) Actual opening Sho 53-26487 (JP, U) Actual opening Sho 63-136421 (JP, U) 62-101209 (JP, U) 421-2113 (JP, U) 42-11382 (JP, Y1) 58-39 (58) Fields investigated (Int.Cl. 7 , DB name) H03H 5/00-7/12 H01F 27/00

Claims (7)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 インダクタンス素子を形成した巻線とコ
ンデンサ素子を形成したチップコンデンサとを組み合わ
せてLC回路を形成するとともに、入力信号を前記LC
回路により処理して、特定周波数域の出力信号を出力す
るフィルタ回路部と、前記フィルタ回路部から出力され
る前記出力信号を処理する処理回路部とを備え、前記フ
ィルタ回路部は、両端の鍔間に複数の鍔を有し、前記鍔
間に前記巻線を巻回した多連同軸ボビンと、前記多連同
軸ボビンの前記鍔に植設し、端部を前記鍔の上方あるい
は上方と下方に突出させるとともに、前記巻線とを接続
した端子と、前記端子と接続した前記チップコンデンサ
とを有しており、前記処理回路部は、複数の接続部を有
する配線パターンを形成した基板と、前記配線パターン
の前記接続部により接続するとともに、前記基板に実装
した電子部品とを有しており、前記多連同軸ボビンの上
方に突出させた前記端子の端部には、前記多連同軸ボビ
ンの上方に前記処理回路部の基板を配置して前記基板の
接続部を電気的接続するとともに、前記多連同軸ボビン
の鍔の上に前記チップコンデンサを置して前記チップ
コンデンサを電気的接続し、かつ、前記巻線を電気的接
続したLCフィルタ。
1. An LC circuit is formed by combining a winding formed with an inductance element and a chip capacitor formed with a capacitor element , and an input signal is applied to the LC circuit.
A filter circuit unit that processes the output signal in a specific frequency range by a circuit and a processing circuit unit that processes the output signal output from the filter circuit unit is provided, and the filter circuit unit has collars at both ends. a plurality of collars between, and multiple-coaxial bobbins wound the winding between the collar, the implanted in the flange of the multiple-coaxial bobbins, have the end portions is above the collar
With the protruded upward and downward, and a terminal connected with said winding has a said chip capacitor connected to the terminals, wherein the processing circuit section, forming a wiring pattern having a plurality of connecting portions and a substrate, as well as connected by the connection portion of the wiring pattern has an electronic component mounted on the substrate, wherein an end portion of the terminal which projects above the multiple-coaxial bobbins, the A substrate of the processing circuit unit is arranged above the multiple coaxial bobbin to electrically connect the connecting portion of the substrate, and the multiple coaxial bobbin is provided.
LC filter above with location mounting a chip capacitor electrically connecting the chip capacitors on the flange and electrically connecting the windings of the.
【請求項2】 基板の接続部に貫通孔を設け、前記貫通
孔に鍔の上方に突出させた端子の端部を挿入した請求項
1記載のLCフィルタ。
2. The LC filter according to claim 1, wherein a through hole is provided in the connecting portion of the substrate, and an end portion of the terminal projecting above the flange is inserted into the through hole.
【請求項3】 基板の接続部に切欠部を設け、前記切欠
部に鍔の上方に突出させた端子の端部を挿入した請求項
1記載のLCフィルタ。
3. The LC filter according to claim 1, wherein a cutout portion is provided in the connecting portion of the substrate, and an end portion of the terminal projecting above the flange is inserted into the cutout portion.
【請求項4】 鍔の上方に突出させた端子の端部を、基
板の上方まで突出させるとともに、基板側に折曲した請
求項2または請求項3記載のLCフィルタ。
4. The LC filter according to claim 2, wherein an end of the terminal projecting above the collar is projected above the substrate and bent toward the substrate.
【請求項5】 鍔の上方に突出させた端子の端部の先端
部を、前記端子の径よりも小さい細芯部にするととも
に、前記細芯部の根元に形成される段差部で、基板を支
持した請求項2〜請求項4の内、いずれか一つに記載の
LCフィルタ。
5. A substrate having a step portion formed at a base of the thin core portion, wherein a tip end portion of an end portion of the terminal projecting above the collar is a thin core portion smaller than a diameter of the terminal. The LC filter according to any one of claims 2 to 4, which supports the LC filter.
【請求項6】 細芯部はチップコンデンサより上方の端
子の先端部に形成した請求項5記載のLCフィルタ。
6. The thin core portion is an end above the chip capacitor.
The LC filter according to claim 5, wherein the LC filter is formed at the tip of the child .
【請求項7】 フィルタ回路部と処理回路部とを同調さ
せる同調回路部を設け、前記同調回路部は、前記処理回
路部と電気的接続するとともに、前記フィルタ回路部の
多連同軸ボビンに巻線を巻回して形成した請求項1記載
のLCフィルタ。
7. A tuning circuit section for tuning the filter circuit section and the processing circuit section is provided, and the tuning circuit section is electrically connected to the processing circuit section and wound around a multiple coaxial bobbin of the filter circuit section. The LC filter according to claim 1, which is formed by winding a wire.
JP08113399A 1999-03-25 1999-03-25 LC filter Expired - Fee Related JP3430964B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP08113399A JP3430964B2 (en) 1999-03-25 1999-03-25 LC filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08113399A JP3430964B2 (en) 1999-03-25 1999-03-25 LC filter

Publications (2)

Publication Number Publication Date
JP2000278072A JP2000278072A (en) 2000-10-06
JP3430964B2 true JP3430964B2 (en) 2003-07-28

Family

ID=13737912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP08113399A Expired - Fee Related JP3430964B2 (en) 1999-03-25 1999-03-25 LC filter

Country Status (1)

Country Link
JP (1) JP3430964B2 (en)

Also Published As

Publication number Publication date
JP2000278072A (en) 2000-10-06

Similar Documents

Publication Publication Date Title
KR100313590B1 (en) Structure of tuner and cable modem tuner using it
US4506238A (en) Hybrid circuit device
EP0593020A1 (en) Electronic component and its manufacturing method
JP3430964B2 (en) LC filter
US7106085B2 (en) Electronic circuit unit having small size and good productivity
US6864776B2 (en) Coupling adjusting structure for double-tuned circuit
JP3068724B2 (en) Surface mounting mount for toroidal winding components
KR960000914B1 (en) Print coil for modulation-demodulation circuit
JP3115597U (en) Transformer for surface mounting
JPH0513236A (en) Coil-mounted electronic component board and its manufacture
JP2006135027A (en) Electronic component
JP2004241678A (en) Surface-mounting coil and its manufacturing method
JPH08236356A (en) Composite element
JPH046259Y2 (en)
JP2008135808A (en) Antenna, antenna unit using same antenna, and manufacturing method of same antenna unit
JPH0897036A (en) Electronic circuit board
JPH09190923A (en) Printed inductor
JPH04281608A (en) Noise filter
JPH0720897Y2 (en) LC composite parts
JP2924231B2 (en) High frequency components
JP3466105B2 (en) Quartz crystal unit, crystal unit mounting substrate, and crystal unit mounting structure
JP2003086427A (en) Air-core coil for high-frequency circuit
JPH1041165A (en) Noise filter
JP3009165B2 (en) Interface module manufacturing method
JP2558324Y2 (en) Electric signal device

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080523

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090523

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees