JP3429179B2 - Optical module and manufacturing method thereof - Google Patents
Optical module and manufacturing method thereofInfo
- Publication number
- JP3429179B2 JP3429179B2 JP01576398A JP1576398A JP3429179B2 JP 3429179 B2 JP3429179 B2 JP 3429179B2 JP 01576398 A JP01576398 A JP 01576398A JP 1576398 A JP1576398 A JP 1576398A JP 3429179 B2 JP3429179 B2 JP 3429179B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resin
- stop member
- flow stop
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
【０００１】[0001]
【発明の属する技術分野】本発明は光モジュール及びそ
の製造方法に関し、更に詳しくは光導波層又は光ファイ
バ等の光伝送路と光素子とを光結合し搭載した第１の基
板を、箱様体の第２の基板に簡易収容して光素子側を樹
脂封止した光モジュール及びその製造方法に関する。近
年の情報網の拡大化、高速化に伴い、局と一般家庭とを
光ファイバで結ぶ光加入者系ファイバ通信網の必要性が
高まっている。これを実現するには大量需要が見込まれ
る光モジュールを小型、高信頼性、低価格で実現するこ
とが必要である。TECHNICAL FIELD The present invention relates to an optical module and its optical module.
In more detail, the first substrate on which an optical transmission line such as an optical waveguide layer or an optical fiber and an optical element are optically coupled and mounted is simply accommodated in a second substrate of a box-like body. The present invention relates to an optical module whose side is sealed with a resin and a method for manufacturing the same . Along with the expansion and speeding up of information networks in recent years, there is an increasing need for an optical subscriber fiber communication network that connects an office and an ordinary home by an optical fiber. In order to realize this, it is necessary to realize an optical module, which is expected to be in large demand, with a small size, high reliability, and low price.
【０００２】[0002]
【従来の技術】光モジュールを小型、低価格で実現する
には光モジュールを簡易な方法で樹脂封止することが好
ましい。本件出願人等はこの考えに基づく光モジュール
を既に提案している。図１３〜図１７は既提案の光モジ
ュールを説明する図（１）〜（５）である。2. Description of the Related Art In order to realize an optical module in a small size and at a low price, it is preferable to encapsulate the optical module in a simple method. The applicants have already proposed an optical module based on this idea. 13 to 17 are diagrams (1) to (5) for explaining the already proposed optical module.
【０００３】図１３は既提案の光モジュールにおける第
１の基板１０を説明する図で、図（Ａ）はその平面図、
図（Ｂ）は正面図、図（Ｃ）は側面図、図（Ｄ）は外観
斜視図である。図において、第１の基板１０は、シリコ
ン等による支持基板１１上にガラス出発原料を反応させ
ながらガラス化材料を積層堆積させると共に、ガラス化
させ、かつ屈折率制御を行うことで、２条の埋め込み型
光導波路１２1 ，１２ 2 を公知技術により積層形成し、
更に基板１１の一端に発光素子（ＬＤチップ）１３と受
光素子（ＰＤチップ）１４とを夫々光導波路１２1 ，１
２2 と光結合するように配置したものである。更に、光
素子１３，１４の近傍の基板１１上に複数の中継用ボン
ディングパッド１５を形成し、また基板１１の後端部に
は外部回路と接続するための複数の接続用ボンディング
パッド１６を形成し、かつこれら中継用ボンディングパ
ッド１５と接続用ボンディングパッド１６との間は不図
示の導体パターン１７により接続されている。FIG. 13 is a schematic diagram of a first proposed optical module.
1A is a plan view of the substrate 10 of FIG.
Figure (B) is a front view, Figure (C) is a side view, and Figure (D) is an external view.
It is a perspective view. In the figure, the first substrate 10 is a silicon substrate.
By reacting the glass starting material on the supporting substrate 11 by
While vitrifying material is stacked and deposited,
By controlling the refractive index
Optical waveguide 121, 12 2Is formed by a known technique,
Further, a light emitting element (LD chip) 13 is received at one end of the substrate 11.
An optical element (PD chip) 14 and an optical waveguide 12 respectively1, 1
Two2It is arranged so as to be optically coupled with. Moreover, the light
On the substrate 11 in the vicinity of the elements 13 and 14, a plurality of relay bons are provided.
To form a pad 15 on the rear end of the substrate 11.
Is a multi-connection bond for connecting to external circuits
The pad 16 is formed, and these relay bonding pads are formed.
No connection between the pad 15 and the bonding pad 16 for connection
They are connected by the conductor pattern 17 shown.
【０００４】図１４は既提案の光モジュールにおける第
１の基板１０の他の構成を説明する図で、上記埋め込み
型の光導波路１２1 ，１２2 に代えて、光ファイバ１８
1 ，１８2 を備える場合を示している。図（Ａ）はその
平面図、図（Ｂ）は正面図、図（Ｃ）は側面図、図
（Ｄ）は外観斜視図である。図において、第１の基板１
０は、２本の光ファイバ１８1 ，１８2 を上下の支持基
板１９2 ，１９1 の各Ｖ溝で固定し、更に上部基板１９
1 の一端に発光素子１３と受光素子１４とを夫々光ファ
イバ１８1 ，１８2 と光結合するように配置したもので
ある。他の構成は上記図１３と同様で良い。FIG. 14 is a view for explaining another structure of the first substrate 10 in the already proposed optical module. Instead of the embedded optical waveguides 12 1 and 12 2 , an optical fiber 18 is provided.
The case where 1 and 18 2 are provided is shown. FIG. 1A is a plan view thereof, FIG. 2B is a front view, FIG. 2C is a side view, and FIG. 1D is an external perspective view. In the figure, the first substrate 1
0 fixes the two optical fibers 18 1 and 18 2 in the respective V-grooves of the upper and lower support substrates 19 2 and 19 1 , and further fixes the upper substrate 19
The light emitting element 13 and the light receiving element 14 are arranged at one end of the optical fiber 1 so as to be optically coupled to the optical fibers 18 1 and 18 2 , respectively. Other configurations may be similar to those in FIG.
【０００５】なお、第１の基板１０としては、上記図１
３，図１４の何れの基板１０を使用しても良いが、以下
は図１３の第１の基板１０を使用した場合の光モジュー
ルについて説明を進める。図１４の第１の基板１０を使
用した場合も同様である。図１５は既提案の光モジュー
ルにおける第２の基板２０を説明する図で、図（Ａ）は
その平面図、図（Ｂ）は正面図、図（Ｃ）は側断面図
｛図（Ａ）のｃ−ｃ断面図｝である。図において、第２
の基板２０の本体は、合成樹脂による箱形のモールド成
型品２１よりなり、その正面側の壁面に上記第１の基板
１０を突き出すための開口部２２と、この開口部２２に
連続して底面に第１の基板１０を載置するための凹部２
３とが形成されている。基板２０には、後述の図１６の
被覆材４２の線膨張率と同一乃至近似となるように、合
成樹脂材中にガラスやカーボン等の短繊維（フィラ）が
混和されており、線膨張率が制御されている。更に、基
板２０の手前側側面には２つのリード端子２６と、凹部
２３上に露出する基板載置板（基板冷却板）２４に連結
する２つのリード端子２７とが導出され、また反対側側
面には５つの独立したリード端子２８が夫々導出されて
いる。リード端子２６，２８の反対側は基板２０の内側
底面に露出されている。The first substrate 10 is the same as that shown in FIG.
3, any substrate 10 shown in FIG. 14 may be used, but the optical module using the first substrate 10 shown in FIG. 13 will be described below. The same applies when the first substrate 10 of FIG. 14 is used. 15A and 15B are views for explaining the second substrate 20 in the already proposed optical module. FIG. 15A is a plan view thereof, FIG. 15B is a front view, and FIG. 15C is a side sectional view {FIG. C c sectional view of FIG. In the figure, the second
The main body of the substrate 20 is made of a box-shaped molded product 21 made of synthetic resin, and has an opening 22 for protruding the first substrate 10 on the wall surface on the front side thereof, and a bottom surface continuous with the opening 22. The recess 2 for mounting the first substrate 10 on the
And 3 are formed. On the substrate 20, short fibers (fillers) such as glass and carbon are mixed in the synthetic resin material so as to have the same or similar linear expansion coefficient as that of the covering material 42 of FIG. Is controlled. Further, two lead terminals 26 and two lead terminals 27 connected to the substrate mounting plate (substrate cooling plate) 24 exposed on the recess 23 are led out to the front side surface of the substrate 20, and the opposite side surface is also formed. Five independent lead terminals 28 are led out respectively. The opposite sides of the lead terminals 26 and 28 are exposed on the inner bottom surface of the substrate 20.
【０００６】図１６は既提案の光モジュールの組み立て
状態を説明する図で、図（Ａ）はその平面図、図（Ｂ）
は正面図、図（Ｃ）は側断面図｛図（Ａ）のｃ−ｃ断面
図｝、図（Ｄ）は樹脂の流れ止め部材３０の外観斜視図
である。なお、流れ止め部材３０の構造を明確にするた
めに見えない部分の構造を点線で表す。基板１０を基板
２０の凹部２３に位置合わせし、載置すると、基板１０
の光導波路１２1 ，１２2 の先端部が基板２０の開口部
２２から突き出される。その際には、予め凹部２３にエ
ポキシ系樹脂接着剤を薄く密に供給しておき、基板１０
を基板２０の凹部２３に確実に接着固定させる。そし
て、基板１０の接続用ボンディングパッド１６と基板２
０のリード端子２６，２８との間をワイヤボンディング
する。FIG. 16 is a diagram for explaining the assembled state of the already proposed optical module. FIG. 16A is a plan view thereof and FIG.
Is a front view, FIG. (C) is a side sectional view {cc sectional view of FIG. (A)}, and FIG. (D) is an external perspective view of the resin flow stop member 30. In addition, in order to clarify the structure of the flow stop member 30, the structure of the invisible portion is shown by a dotted line. When the substrate 10 is aligned with the concave portion 23 of the substrate 20 and placed, the substrate 10
The tip portions of the optical waveguides 12 1 and 12 2 are projected from the opening 22 of the substrate 20. At that time, the epoxy resin adhesive is thinly and densely supplied to the recess 23 in advance, and the substrate 10
Is securely bonded and fixed to the recess 23 of the substrate 20. Then, the bonding pad 16 for connection of the substrate 10 and the substrate 2
Wire bonding is performed between the lead terminals 26 and 28 of No. 0.
【０００７】次に、基板２０の開口部２２の内側に接し
て合成樹脂板からなる壁体（流れ止め部材）３０を配置
する。流れ止め部材３０の高さは基板２０の底面から上
面までの高さに等しく、その下側中央部には、図１６
（Ｄ）に示す如く、基板１０を丁度またぐようなサイズ
の切り欠き３１が形成されている。次に、光素子１３，
１４と中継用ボンディングパッド１５の付近及び光導波
路１２1 ，１２2 との光結合部付近を含んで、光学的に
透明な合成樹脂４１（シリコーン樹脂，エポキシ系樹脂
等）を供給する。Next, a wall body (flow stop member) 30 made of a synthetic resin plate is arranged in contact with the inside of the opening 22 of the substrate 20. The height of the flow stop member 30 is equal to the height from the bottom surface to the top surface of the substrate 20, and the lower middle portion thereof is shown in FIG.
As shown in (D), a notch 31 having a size just straddling the substrate 10 is formed. Next, the optical element 13,
An optically transparent synthetic resin 41 (silicone resin, epoxy resin, etc.) is supplied including 14 and the vicinity of the relay bonding pad 15 and the vicinity of the optical coupling portion with the optical waveguides 12 1 and 12 2 .
【０００８】そして、合成樹脂４１の硬化後、基板２０
の内部に、基板１０の部分を覆うようにして不透明な被
覆材４２（ＣＯＢ材系エポキシ系樹脂等）を注入し、加
熱キュアして被覆層を形成する。その際には、被覆材４
２に多少の膨張／収縮があっても、流れ止め部材３０が
基板１０上を移動することで、基板１０上の収縮応力が
緩和され、よって樹脂４２と基板１０との接着部分に剥
離や亀裂が発生しない、と言うものである。After the synthetic resin 41 is cured, the substrate 20
An opaque coating material 42 (COB material-based epoxy resin or the like) is injected into the inside of the substrate so as to cover the portion of the substrate 10 and cured by heating to form a coating layer. In that case, the covering material 4
Even if 2 is slightly expanded / contracted, the flow stop member 30 moves on the substrate 10 to relieve the contraction stress on the substrate 10, and thus peeling off or cracking the adhesive portion between the resin 42 and the substrate 10. It does not occur.
【０００９】[0009]
【発明が解決しようとする課題】図１７は既提案の光モ
ジュールの問題点を説明する図である。しかし、一般に
ＣＯＢ材系エポキシ樹脂４２の線膨張係数（〜１０-5／
℃）と石英系光導波路（Ｓｉ０2 ）の線膨張係数（〜６
×１０-7／℃）との間には大きな差がある。このため、
基板２０内に樹脂４２を充填して加熱（１５０℃付近）
硬化させた後、通常の使用温度（−４０℃〜８０℃）に
戻ると、樹脂４２の収縮により流れ止め部材３０は力Ｆ
の方向に引きつけられる。この時、基板２１の底面近傍
の樹脂４２は相対的に密度も高く、かつ基板２１との接
着応力も働くことから、収縮の程度は相対的に小さい
が、一方、表面近傍の樹脂４２は相対的に密度も低く、
かつ空気との間では接着応力も働かないことから、流れ
止め部材３０は最終的にｃ点を支点として樹脂４２の側
に傾けられる。しかも、この時既に流れ止め部材３０は
樹脂４２と接着しているため、もはや流れ止め部材３０
は基板１０の上方に移動する（逃げる）ことは出来ず、
このため流れ止め部材３０の架橋部Ａの右下片が基板１
０の上面を押すことになり、光導波路１２1 ，１２2 の
複屈折率が大きくなる問題があった。FIG. 17 is a diagram for explaining the problems of the already proposed optical module. However, in general, the linear expansion coefficient of the COB-based epoxy resin 42 (~ 10 -5 /
Linear expansion coefficient ° C.) and silica-based optical waveguide (Si0 2) (~6
(× 10 −7 / ° C.). For this reason,
Resin 42 is filled in the substrate 20 and heated (around 150 ° C.)
After curing, when the temperature returns to a normal use temperature (-40 ° C to 80 ° C), the resin 42 shrinks, so that the flow stop member 30 receives a force F.
Attracted in the direction of. At this time, since the resin 42 near the bottom surface of the substrate 21 has a relatively high density and the adhesive stress with the substrate 21 also acts, the degree of shrinkage is relatively small, while the resin 42 near the surface is relatively Has a low density,
Moreover, since the adhesive stress does not work with the air, the flow stop member 30 is finally tilted toward the resin 42 with the point c as the fulcrum. Moreover, at this time, since the flow stop member 30 is already bonded to the resin 42, the flow stop member 30 is no longer present.
Cannot move (escape) above the substrate 10,
Therefore, the lower right piece of the bridge portion A of the flow stop member 30 is the substrate 1
Since the upper surface of 0 is pushed, there is a problem that the birefringence of the optical waveguides 12 1 and 12 2 becomes large.
【００１０】本発明は上記既提案技術の問題点に鑑み成
されたもので、その目的とする所は、小型、高信頼性、
低価格の光モジュールを安定に供給することにある。The present invention has been made in view of the problems of the above-mentioned proposed techniques, and its purpose is to achieve small size, high reliability,
It is to stably supply low-priced optical modules.
【００１１】[0011]
【課題を解決するための手段】上記の課題は例えば図１
の構成により解決される。即ち、本発明（１）の光モジ
ュールは、光伝送路と該光伝送路の一端に光結合された
光素子とを有する第１の基板１０と、前記光伝送路の他
端が外部に突き出るように前記光素子側を光伝送路と共
に支持する箱様体の第２の基板２０と、前記第２の基板
の箱様体の内壁に接し前記光伝送路をまたぐ態様で載置
される樹脂の流れ止め部材５１とを備え、前記第２の基
板上を前記第１の基板の光伝送路と光素子とを含んで樹
脂４２により密に覆い、前記流れ止め部材が該樹脂の硬
化と同時に固定され一体化してなる光モジュールにおい
て、前記流れ止め部材５１の架橋部Ａにおける断面は、
その厚みが前記第１の基板の表面に向かって徐々に薄く
なるテーパ形状を有し、且つ、前記樹脂と接触する界面
部５１ｂが傾斜して該テーパ形状を形成しているもので
ある。The above-mentioned problem is solved, for example, by referring to FIG.
It is solved by the configuration of. That is, in the optical module of the present invention (1), the first substrate 10 having an optical transmission line and an optical element optically coupled to one end of the optical transmission line, and the other end of the optical transmission line protrudes to the outside . resin is placed in the optical element side and the second substrate 20 of the box-like body for supporting with the optical transmission line, the second aspect straddling the optical transmission line in contact inner walls of the box-like body of the substrate so as of a flow stop member 51, the densely covered with the resin 42 and the second upper substrate and a light transmission path and the optical element of the first substrate, wherein the flow stop member is the resin hardness
In the optical module which is fixed and integrated at the same time as the formation, the cross section of the flow stop member 51 at the bridge portion A is
The thickness gradually decreases toward the surface of the first substrate.
The interface portion 51b that comes into contact with the resin is inclined to form the tapered shape .
【００１２】図２（Ａ）に基づき作用を説明する。本発
明（１）によれば、流れ止め部材５１の架橋部Ａにおけ
る断面は、その厚みが第１の基板１０の表面に向かって
徐々に薄くなるテーパ形状を有し、且つ、樹脂４２と接
触する界面部５１ｂが傾斜して該テーパ形状を形成して
いるので、流れ止め部材５１が樹脂４２の収縮応力を受
けたことによりｃ点を支点として樹脂４２の側にθ1 だ
け傾いても、界面部５１ｂの下辺は常に基板１０の表面
から離れる方向に付勢されるため、下側の光導波路１２
1 ，１２2 には何らの影響も生じない。またこの時、樹
脂４２は既に硬化しているので、樹脂封止領域から漏れ
出ない。またこの時、架橋部Ａの下側の樹脂４２は流れ
止め部材５１の界面部５１ｂにより保護されると共に、
傾いた界面部５１ｂにより僅かに下側に付勢されるの
で、樹脂４２と基板１０との接着部分に剥離や亀裂は生
じない。The operation will be described with reference to FIG. According to the present invention (1), the cross section of the flow stop member 51 at the cross-linking portion A has a thickness toward the surface of the first substrate 10.
It has a taper shape that gradually becomes thinner, and the interface portion 51b that contacts the resin 42 is inclined to form the taper shape.
Because there is also inclined flow stop member 51 only theta 1 to the side of the resin 42 as a fulcrum point c by receiving the shrinkage stress of the resin 42, the lower side of the interface unit 51b is always in a direction away from the surface of the substrate 10 Since it is biased, the lower optical waveguide 12
1 and 12 2 have no effect. Further, at this time, the resin 42 has already hardened, so that it does not leak from the resin sealing region. At this time, the resin 42 on the lower side of the bridge portion A is protected by the interface portion 51b of the flow stop member 51, and
Since the inclined interface portion 51b is biased slightly downward, peeling or cracking does not occur in the bonding portion between the resin 42 and the substrate 10.
【００１３】なお、流れ止め部材５１の架橋部Ａにおけ
る断面は、少なくともその厚みが第１の基板１０の表面
に向かって徐々に薄くなるテーパ形状を有し、且つ、樹
脂４２と接触する界面部５１ｂが傾斜して該テーパ形状
を形成していれば良く、その断面形状は問わない。例え
ば架橋部Ａの断面形状は逆台形であっても良い。上記説
明により、同様の作用、効果が得られることは明らかで
ある。好ましくは本発明（２）においては、上記本発明
（１）において、例えば図１（Ｄ）に示す如く、架橋部
Ａの断面形状は三角形である。At the bridge portion A of the flow stop member 51,
The cross-section is at least the surface of the first substrate 10
Has a taper shape that gradually becomes thinner toward
The interface portion 51b in contact with the oil 42 is inclined to have the tapered shape.
It suffices to form the cross section, and the cross-sectional shape does not matter. For example, the cross-sectional shape of the bridge portion A may be an inverted trapezoid. From the above description, it is clear that the same action and effect can be obtained. Preferably, in the present invention (2), in the above-mentioned present invention (1), for example, as shown in FIG. 1 (D), the cross-sectional shape of the bridge portion A is a triangle.
【００１４】架橋部Ａの断面形状が三角形であれば、架
橋部Ａと基板１０とは一辺（陵）で接触し、本来の樹脂
４２の流れ止めの機能を果たすと共に、基板１０との接
触面積を最小にできる。従って、基板１０の表面に不測
の応力を加えてしまう様な機会が少ない。なお、図は架
橋部Ａの断面形状が直角三角形の場合を示しているが、
他の二等辺三角形、正三角形など様々な三角形が含まれ
ることは言うまでも無い。If the cross-sectional shape of the bridge portion A is triangular, the bridge portion A and the substrate 10 are in contact with each other on one side (ridge) to fulfill the original function of stopping the flow of the resin 42 and the contact area with the substrate 10. Can be minimized. Therefore, there are few chances that unexpected stress is applied to the surface of the substrate 10. Although the figure shows a case where the cross-sectional shape of the bridge portion A is a right triangle,
It goes without saying that various triangles such as other isosceles triangles and equilateral triangles are included.
【００１５】また好ましくは本発明（３）においては、
上記本発明（１）において、例えば図３に示す如く、架
橋部Ａの下部の断面形状は三角形である。従って、上記
本発明（２）と同様の作用、効果を奏する。更には、架
橋部Ａの下側に充填される樹脂４２の量や厚み等を任意
に調整できる。また好ましくは本発明（４）において
は、上記本発明（１）において、例えば図４に示す如
く、架橋部Ａの界面部５３ｂに対応する断面形状は曲線
である。Preferably, in the present invention (3),
In the present invention (1), for example, as shown in FIG. 3, the cross-sectional shape of the lower portion of the bridge portion A is triangular. Therefore, the same action and effect as those of the present invention (2) can be obtained. Furthermore, the amount, thickness, etc. of the resin 42 filled below the bridge portion A can be adjusted arbitrarily. Further, preferably, in the present invention (4), in the above-mentioned present invention (1), for example, as shown in FIG. 4, the cross-sectional shape corresponding to the interface portion 53b of the bridge portion A is a curve.
【００１６】従って、上記本発明（１）と同様の作用、
効果を奏する。更には、架橋部Ａの下側に充填される樹
脂４２の量や形状等を任意に調整できる。なお、図は架
橋部Ａの断面形状が半楕円形の場合を示しているが、他
の様々な曲線形状が含まれることは言うまでも無い。ま
た、全てが曲線形状である必要はなく、曲線と直線とが
混ざった形状でも良い。Therefore, the same operation as the above-mentioned present invention (1),
Produce an effect. Furthermore, the amount, shape, etc. of the resin 42 filled below the bridge portion A can be arbitrarily adjusted. Although the drawing shows the case where the cross-sectional shape of the bridge portion A is semi-elliptical, it goes without saying that other various curved shapes are included. Further, it is not necessary that all of them have a curved shape, and a shape in which a curved line and a straight line are mixed may be used.
【００１７】また好ましくは本発明（５）においては、
上記本発明（１）〜（４）において、例えば図１（Ｅ）
に示す如く、流れ止め部材５１´の樹脂４２と接触する
残りの界面部５１ｃの断面は、その厚みが第２の基板の
底面に向かって徐々に薄くなるテーパ形状を有し、且
つ、樹脂と接触する界面部が（図の左側）に傾斜して該
テーパ形状を形成している。図２（Ｂ）に基づき作用を
説明する。Preferably, in the present invention (5),
In the above inventions (1) to (4), for example, FIG.
As shown in FIG. 6 , the cross section of the remaining interface portion 51c of the flow stop member 51 'that contacts the resin 42 has a thickness of the second substrate.
Has a taper shape that gradually becomes thinner toward the bottom surface, and
, The interface part that contacts the resin is inclined to the left side of the figure
It has a tapered shape . The operation will be described with reference to FIG.
【００１８】本発明（５）によれば、流れ止め部材５１
´の界面部５１ｃ´も傾斜しているため、樹脂４２の収
縮応力Ｆは流れ止め部材５１´を後方に引き寄せる力ｆ
1 と垂直下方に引き寄せる力ｆ2 とに分離される。この
うちの力ｆ2 は基板２０の上面により支えられ、他方の
力ｆ1 はｆ1 ＜Ｆの関係となる。従って、流れ止め部材
５１´の回転角θ2 は上記図２（Ａ）の場合のθ1 より
も小さくなり、よって架橋部Ａの下端が基板１０の表面
に加える力も十分に小さい。According to the present invention (5), the flow stop member 51.
Since the interface portion 51c ′ of ′ is also inclined, the contraction stress F of the resin 42 is the force f that pulls the flow stop member 51 ′ backward.
It is separated into 1 and the force f 2 that pulls vertically downward. Of these forces, the force f 2 is supported by the upper surface of the substrate 20, and the other force f 1 has a relationship of f 1 <F. Therefore, the rotation angle θ 2 of the flow stop member 51 ′ becomes smaller than θ 1 in the case of FIG. 2A, and thus the force applied by the lower end of the bridge portion A to the surface of the substrate 10 is sufficiently small.
【００１９】なお、流れ止め部材５１´の界面部５１c
´は少なくともその一部が第２の基板２０の主面に垂直
な面より光伝送路の他端側（図の左側）に傾斜していれ
ば良く、その断面形状は問わない。また上記の課題は例
えば図５の構成により解決される。即ち、本発明（６）
の光モジュールの製造方法は、光伝送路と該光伝送路の
一端に光結合された光素子とを有する第１の基板１０
と、前記光伝送路の他端が外部に突き出るように前記光
素子側を光伝送路と共に支持する箱様体の第２の基板２
０とを備え、前記第２の基板上を前記第１の基板の光伝
送路と光素子とを含んで樹脂４２により密に覆い一体化
してなる光モジュールの製造方法であって、樹脂４２と
は接着しない材料で構成された流れ止め部材５４が予め
第２の基板２０の箱様体の内壁に接し、かつ前記光伝送
路をまたぐ態様で載置され、かつ充填された樹脂の硬化
後に前記流れ止め部材５４が取り外されるものである。The interface portion 51 c of the flow stop member 51 '
It suffices that at least a part thereof is inclined to the other end side (the left side in the drawing) of the optical transmission line with respect to the surface perpendicular to the main surface of the second substrate 20, and its cross-sectional shape does not matter. Further, the above problem can be solved by, for example, the configuration of FIG. That is, the present invention (6)
The method of manufacturing an optical module of
First substrate 10 having an optical element optically coupled at one end
And so that the other end of the optical transmission line projects to the outside.
Box-shaped second substrate 2 supporting the element side together with the optical transmission path
0, and the optical transmission of the first substrate on the second substrate.
Incorporating the transmission path and the optical element in a tightly covered resin 42
In the method of manufacturing the optical module, the flow stop member 54 made of a material that does not adhere to the resin 42 is previously formed.
The second substrate 20 is in contact with the inner wall of the box-like body, and the optical transmission is performed.
The flow stop member 54 is removed after the resin placed on the road is cured and the filled resin is cured.
【００２０】流れ止め部材５４は、本来の樹脂４２の流
れ止めの機能を果たすと共に、樹脂４２とは接着しない
材料で構成されているため、樹脂４２の収縮応力は流れ
止め部材５４には伝わらない。従って、基板１０の表面
には何らの影響を与えることも無く、基板２０を所要の
特性で安定に樹脂封止できる。また流れ止め部材５４を
取り外すことで流れ止め部材５４を再利用できる。Since the flow stop member 54 has a function of originally preventing flow of the resin 42 and is made of a material that does not adhere to the resin 42, the contraction stress of the resin 42 is not transmitted to the flow stop member 54. . Therefore, the surface of the substrate 10 is not affected at all, and the substrate 20 can be stably resin-sealed with the required characteristics. Further, the flow stop member 54 can be reused by removing the flow stop member 54.
【００２１】なお、上記流れ止め部材５４には、流れ止
め部材５４そのものが樹脂４２とは接着しない材料で構
成さている場合と、流れ止め部材５４そのものは樹脂４
２と接着するが、流れ止め部材５４の表面（特に樹脂４
２と接触する界面部）に樹脂４２とは接着しない層がコ
ーティング又は塗布されている場合とが含まれる。また
上記の課題は例えば図６の構成により解決される。即
ち、本発明（７）の光モジュールは、光伝送路と該光伝
送路の一端に光結合された光素子とを有する第１の基板
と、前記光伝送路の他端が外部に突き出るように前記光
素子側を光伝送路と共に支持する箱様体の第２の基板
と、前記第２の基板の箱様体の内壁に接し前記光伝送路
をまたぐ態様で載置される樹脂の流れ止め部材とを備
え、前記第２の基板上を前記第１の基板の光伝送路と光
素子とを含んで樹脂により密に覆い、前記流れ止め部材
が該樹脂の硬化と同時に固定され一体化してなる光モジ
ュールにおいて、流れ止め部材５５Ａの架橋部Ａの下面
に柔軟性の緩衝層５５ｂを備えるものである。The anti-flow member 54 is made of a material that does not adhere to the resin 42, and the anti-flow member 54 itself is made of resin 4.
2 is adhered, but the surface of the flow stop member 54 (especially resin 4
The case where a layer that does not adhere to the resin 42 is coated or applied to the interface portion (contacting with 2) is included. The above problem can be solved by, for example, the configuration of FIG. That is, the optical module of the present invention (7) is provided with an optical transmission line and the optical transmission line.
A first substrate having an optical element optically coupled to one end of a transmission path
And so that the other end of the optical transmission line projects to the outside.
Box-shaped second substrate supporting the device side together with the optical transmission path
And the optical transmission line in contact with the inner wall of the box-like body of the second substrate.
And a resin flow stop member placed in a manner to straddle
The optical transmission line of the first substrate and the optical path on the second substrate.
The flow-stopping member, which includes elements and is closely covered with resin,
In the optical module in which the resin is fixed and integrated simultaneously with curing of the resin , a flexible buffer layer 55b is provided on the lower surface of the bridge portion A of the flow stop member 55A.
【００２２】流れ止め部材５５Ａは、本来の樹脂４２の
流れ止めの機能を果たすと共に、その架橋部Ａの下面に
は柔軟性の緩衝層５５ｂを備えるため、流れ止め部材５
５Ａが樹脂４２の収縮応力を受けて傾いても、これに伴
う架橋部下部による基板１０の表面を下に押し下げよう
とする力は緩衝層５５ｂの変形により十分に吸収され、
基板１０の表面には伝わらない。従って、基板１０の表
面には何らの影響も与えること無く、基板２０を所要の
特性で安定に樹脂封止できる。The flow stop member 55A has an original function of stopping the flow of the resin 42, and since the flexible buffer layer 55b is provided on the lower surface of the bridge portion A, the flow stop member 5A.
Even if 5A inclines due to the contraction stress of the resin 42, the force that pushes down the surface of the substrate 10 due to the lower portion of the bridge portion due to this is sufficiently absorbed by the deformation of the buffer layer 55b,
It does not reach the surface of the substrate 10. Therefore, the surface of the substrate 10 can be stably resin-sealed with the required characteristics without any influence on the surface of the substrate 10.
【００２３】また上記の課題は例えば図７の構成により
解決される。即ち、本発明（８）の光モジュールは、上
記前提となる光モジュールにおいて、流れ止め部材５５
Ｂの樹脂４２と接触する界面部に柔軟性の緩衝層５５ｃ
を備えるものである。流れ止め部材５５Ｂは、本来の樹
脂４２の流れ止めの機能を果たすと共に、流れ止め部材
５５Ｂの樹脂４２と接触する界面部には柔軟性の緩衝層
５５ｃを備えるため、流れ止め部材５５Ｂが樹脂４２の
収縮応力を受けて傾いても、これに伴う架橋部下部によ
る基板１０の表面を下に押し下げようとする力は緩衝層
５５ｃの変形により十分に吸収され、基板１０の表面に
は伝わらない。従って、基板１０の表面には何らの影響
も与えること無く、基板２０を所要の特性で安定に樹脂
封止できる。The above problem can be solved by, for example, the configuration of FIG. That is, the optical module of the present invention (8) is the same as the above-described optical module, which is based on the above premise.
A flexible buffer layer 55c is provided at the interface contacting the B resin 42.
It is equipped with. The flow stop member 55B has an original function of stopping the flow of the resin 42, and a flexible buffer layer 55c is provided at the interface portion of the flow stop member 55B in contact with the resin 42. Even when it is tilted by receiving the contraction stress of, the force of pushing down the surface of the substrate 10 due to the lower portion of the bridge portion is sufficiently absorbed by the deformation of the buffer layer 55c and is not transmitted to the surface of the substrate 10. Therefore, the surface of the substrate 10 can be stably resin-sealed with the required characteristics without any influence on the surface of the substrate 10.
【００２４】また上記の課題は例えば図８の構成により
解決される。即ち、本発明（９）の光モジュールは、上
記前提となる光モジュールにおいて、流れ止め部材５５
Ｃを柔軟性の材料で構成したものである。流れ止め部材
５５Ｃは、本来の樹脂４２の流れ止めの機能を果たすと
共に、流れ止め部材５５Ｃそのものを柔軟性の材料で構
成したため、流れ止め部材５５Ｃが樹脂４２の収縮応力
を受けて傾いても、これに伴う架橋部下部による基板１
０の表面を下に押し下げようとする力は流れ止め部材５
５Ｃ（特に架橋部下部）の変形により吸収され、基板１
０の表面には伝わらない。従って、基板１０の表面には
何らの影響も与えること無く、基板２０を所要の特性で
安定に樹脂封止できる。なお、流れ止め部材５５Ｃの架
橋部Ａの断面形状は、樹脂４２の流れ止めの機能を果た
すものであれば、どの様な形状でもよい。The above problem can be solved by the structure shown in FIG. That is, the optical module of the present invention (9) is the same as the above-described optical module, which is based on the premise of the flow stop member 55.
C is made of a flexible material. The flow stop member 55C has an original function of stopping the flow of the resin 42, and since the flow stop member 55C itself is made of a flexible material, even if the flow stop member 55C receives the contraction stress of the resin 42 and tilts, Substrate 1 due to the lower part of the bridge
The force to push down the surface of 0 is the flow stop member 5
It is absorbed by the deformation of 5C (especially the lower part of the bridge), and the substrate 1
It does not reach the 0 surface. Therefore, the surface of the substrate 10 can be stably resin-sealed with the required characteristics without any influence on the surface of the substrate 10. The cross-sectional shape of the bridge portion A of the flow stop member 55C may be any shape as long as it functions to stop the flow of the resin 42.
【００２５】また上記の課題は例えば図９の構成により
解決される。即ち、本発明（１０）の光モジュールは、
上記前提となる光モジュールにおいて、流れ止め部材５
６は該流れ止め部材の側面の一部又は複数の部分から前
記光伝送路と平行な方向に突出かつ展開して前記流れ止
め部材を前記第２の基板面により複数の面で平面的（多
点的）に支持するための支持部５６1 〜５６3 を備える
ものである。The above problem can be solved by, for example, the configuration of FIG. That is, the optical module of the present invention (10) is
In the above-described optical module as a premise, the flow stop member 5
Reference numeral 6 projects and develops in a direction parallel to the optical transmission path from a part or a plurality of side surfaces of the flow stop member to make the flow stop member planar by a plurality of surfaces by the second substrate surface. in which a support portion 56 1-56 3 for supporting the point manner).
【００２６】なお、図において、流れ止め部材を５６1
と考えればその支持部は５６3 ，５６2 であり、また流
れ止め部材を５６2 と考えればその支持部は５６3 ，５
６1である。好ましくは、流れ止め部材５６は樹脂成形
法等により一体成形されるため、流れ止め部と支持部と
の区別はない。流れ止め部材５６は、本来の樹脂４２の
流れ止めの機能を果たすと共に、流れ止め部材５６その
ものを第２の基板面により平面的に堅固に支持する構造
としたため、流れ止め部材５６が樹脂４２の収縮応力を
受けても、流れ止め部材５６は傾かない。従って、基板
１０の表面には何らの影響も与えること無く、基板２０
を所要の特性で安定に樹脂封止できる。In the figure, 56 1
Considering that, the supporting portions are 56 3 and 56 2 , and considering the flow stop member 56 2 , the supporting portions are 56 3 and 5 2.
6 1 . Preferably, the flow stop member 56 is integrally molded by a resin molding method or the like, and therefore there is no distinction between the flow stop portion and the support portion. The flow stop member 56 has an original function of stopping the flow of the resin 42 and has a structure in which the flow stop member 56 itself is firmly supported in a planar manner by the second substrate surface. The flow stop member 56 does not tilt even if it receives contracting stress. Therefore, the surface of the substrate 10 is not affected and the substrate 20
The resin can be stably sealed with the required characteristics.
【００２７】なお、流れ止め部材５６は、樹脂４２の流
れ止めの機能を果たすと共に該流れ止め部材の側面の一
部又は複数の部分から光伝送路と平行な方向に突出かつ
展開して第２の基板面により平面的に支持される構造で
あれば、その形状は問わない。好ましくは本発明（１
１）においては、上記本発明（１０）において、例えば
図９に示す如く、流れ止め部材と支持部とからなる構造
の平面視形状はＨの字型である。The flow stop member 56 has a function of stopping the flow of the resin 42, and a side surface of the flow stop member.
Part or multiple parts in a direction parallel to the optical transmission line and
If the structure is planar supported by the second substrate surface by expanding, its shape is not limited. Preferably, the present invention (1
In 1), in the present invention (10), as shown in FIG. 9, for example, the plan view shape of the structure including the flow stop member and the supporting portion is an H shape.
【００２８】また好ましくは本発明（１２）において
は、上記本発明（１０）において、例えば図１０に示す
如く、流れ止め部材と支持部とからなる構造の平面視形
状は口の字型である。また好ましくは本発明（１３）に
おいては、上記本発明（１０）において、例えば図１１
に示す如く、流れ止め部材と支持部とからなる構造の平
面視形状は逆コの字型である。Further, preferably, in the present invention (12), in the above-mentioned present invention (10), for example, as shown in FIG. 10, the plan view shape of the structure including the anti-flow member and the supporting portion is a square-shaped shape. . Further, preferably, in the present invention (13), in the above-mentioned present invention (10), for example, FIG.
As shown in, the plan view of the structure including the flow stop member and the support portion is an inverted U-shape.
【００２９】上記いずれの場合も、流れ止め部材５６〜
５８は第２の基板２０による平面的（多点的）な支持に
より該第２の基板２０と平行に接着固定される。従っ
て、基板１０の表面には何らの影響も与えること無く、
基板２０を所要の特性で安定に樹脂封止できる。また上
記の課題は例えば図１２の構成により解決される。即
ち、本発明（１４）の光モジュールの製造方法は、光伝
送路と該光伝送路の一端に光結合された光素子とを有す
る第１の基板１０と、前記光伝送路の他端が外部に突き
出るように前記光素子側を光伝送路と共に支持する半箱
様体の第２の基板２０であて、前記光伝送路が突き出る
前面側を開放端とすると共に、該前面部両側面に凹部を
有するものと、前記第２の基板の前記光伝送路が突き出
る位置で前記光伝送路をまたぐ態様で載置される樹脂の
流れ止め部材５９であって、その両側に前記凹部と嵌合
するための凸部を有するものとを備え、前記流れ止め部
材５９の凸部５９ｂを前記第２の基板の凹部２９に嵌合
させた状態で、前記第２の基板上を前記第１の基板の光
伝送路と光素子とを含んで樹脂により密に覆い、前記流
れ止め部材が該樹脂の硬化と同時に固定され一体化され
るものである。In any of the above cases, the flow stop members 56-
58 is adhered and fixed in parallel with the second substrate 20 by planar (multipoint) support by the second substrate 20. Therefore, the surface of the substrate 10 is not affected at all,
The substrate 20 can be stably resin-sealed with the required characteristics. Further, the above problem is solved by, for example, the configuration of FIG. That is, in the optical module manufacturing method of the present invention (14), the first substrate 10 having an optical transmission line and an optical element optically coupled to one end of the optical transmission line, and the other end of the optical transmission line are Poke outside
A second half-box- shaped second substrate 20 supporting the optical element side together with the optical transmission line so that the optical transmission line protrudes.
The front side is an open end, and concave parts are formed on both side surfaces of the front side.
And a resin flow stop member 59 mounted on the second substrate so as to straddle the optical transmission path at a position where the optical transmission path of the second substrate protrudes, and is fitted to the recesses on both sides thereof.
And a convex portion 59b of the flow stop member 59 is fitted into the concave portion 29 of the second substrate.
In this state, the light of the first substrate is passed over the second substrate.
Cover the transmission line and the optical element with resin,
The anti-friction member is fixed and integrated at the same time when the resin is cured.
It is those that.
【００３０】流れ止め部材５９の両側に設けた凸部５９
ｂと、第２の基板２０の両側に設けた凹部２９との嵌合
により第２の基板２０の両端面で流れ止め部材５９を堅
固に支持し、かつ同時に箱様体となす構成により、流れ
止め部材５９は、本来の樹脂４２の流れ止めの機能を果
たすと共に、流れ止め部材５９が樹脂４２の収縮応力を
受けても、該流れ止め部材５９は傾かない。従って、基
板１０の表面には何らの影響も与えること無く、基板２
０を所要の特性で安定に樹脂封止できる。Convex portions 59 provided on both sides of the flow stop member 59
b and the recesses 29 provided on both sides of the second substrate 20 are fitted to firmly support the anti-flow member 59 on both end faces of the second substrate 20 and at the same time form a box-like body. The stop member 59 has an original function of stopping the flow of the resin 42, and even when the flow stop member 59 receives the contraction stress of the resin 42, the flow stop member 59 does not tilt. Therefore, the surface of the substrate 10 is not affected and the substrate 2
0 can be stably resin-sealed with the required characteristics.
【００３１】[0031]
【発明の実施の形態】以下、添付図面に従って本発明に
好適なる複数の実施の形態を詳細に説明する。なお、全
図を通して同一符号は同一又は相当部分を示すものとす
る。図１は第１の実施の形態による光モジュールを説明
する図で、図（Ａ）はその平面図、図（Ｂ）は正面図、
図（Ｃ）は側断面図｛図（Ａ）のｃ−ｃ断面図｝、図
（Ｄ）は第１の実施の形態による流れ止め部材５１の外
観斜視図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A plurality of preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The same reference numerals denote the same or corresponding parts throughout the drawings. 1A and 1B are views for explaining an optical module according to a first embodiment, FIG. 1A is a plan view thereof, and FIG. 1B is a front view thereof.
FIG. 6C is a side sectional view {cc sectional view of FIG. 7A}, and FIG. 9D is an external perspective view of the flow stop member 51 according to the first embodiment.
【００３２】第１の基板１０の基本的構造は図１３（又
は図１４）で述べたものと同様でよく、また第２の基板
２０の基本的構造は図１５で述べたものと同様でよい。
なお、支持基板１１としてはシリコン基板、石英基板又
はセラミック基板等を用い得る。また箱様体の基板２１
は後述の外装（封止）用のエポキシ系樹脂４２とほぼ等
しい線膨張係数を有する材料｛例えば合成樹脂材中にガ
ラスやカーボン等の短繊維（フィラ）が混和されたも
の｝により成形される。The basic structure of the first substrate 10 may be similar to that described in FIG. 13 (or FIG. 14), and the basic structure of the second substrate 20 may be similar to that described in FIG. .
The support substrate 11 may be a silicon substrate, a quartz substrate, a ceramic substrate, or the like. In addition, the box-shaped substrate 21
Is molded with a material having a linear expansion coefficient substantially equal to that of the epoxy resin 42 for exterior (sealing) described later (for example, a synthetic resin material mixed with short fibers (fillers) such as glass and carbon). .
【００３３】係る構成で、まず第２の基板２０の凹部２
３に第１の基板１０を位置合わせして接着固定し、必要
なワイヤボンディング作業を行う。次に第２の基板２０
の開口部２２に合成樹脂からなる流れ止め部材５１を載
置する。好ましくは、流れ止め部材５１を箱様体の基板
２１と同じ材料又は線膨張係数がほぼ等しい材料で制作
する。流れ止め部材５１の高さは基板２１の凹部２３か
ら上面までの高さに等しく、その下側中央部には、図１
（Ｄ）に示す如く、第１の基板１０を丁度またぐような
サイズの切り欠き５１ａが形成されている。また流れ止
め部材５１の架橋部Ａにおける樹脂４２と接する界面部
５１ｂは第２の基板２０の主面に垂直な面より前方（図
の左側）に傾斜している。因みに、図１（Ｄ）は架橋部
Ａの断面形状が直角三角形の場合を示している。With this structure, first, the recess 2 of the second substrate 20 is formed.
The first substrate 10 is aligned and adhesively fixed to 3, and necessary wire bonding work is performed. Next, the second substrate 20
The flow stop member 51 made of synthetic resin is placed in the opening 22 of the. Preferably, the flow stop member 51 is made of the same material as that of the box-shaped substrate 21 or a material having substantially the same linear expansion coefficient. The height of the anti-flow member 51 is equal to the height from the concave portion 23 of the substrate 21 to the upper surface, and the lower central portion of the flow stopper member 51 shown in FIG.
As shown in (D), a notch 51a having a size just straddling the first substrate 10 is formed. Further, the interface portion 51b in the bridging portion A of the flow stop member 51, which is in contact with the resin 42, is inclined forward (on the left side in the drawing) from the plane perpendicular to the main surface of the second substrate 20. Incidentally, FIG. 1D shows a case where the cross-sectional shape of the bridge portion A is a right triangle.
【００３４】次に光素子１３，１４、光導波路１２1 ，
１２2 との光結合部付近及び中継用ボンディングパッド
１５を含んで、光学的に透明な合成樹脂（シリコーン樹
脂，エポキシ系樹脂等）４１を供給し、加熱硬化する。
合成樹脂４１は透明であるため、光結合部の光結合状態
を安定に封止できる。また予め光結合部を樹脂４１で封
止したため、その後の樹脂４２を加熱硬化させる際の光
結合部の熱歪みを緩和できる。Next, the optical elements 13 and 14, the optical waveguides 12 1 and
Includes an optical coupling portion and near the relay bonding pads 15 and 12 2, and supplies an optically transparent synthetic resin (silicone resin, epoxy resin, etc.) 41, heat cured.
Since the synthetic resin 41 is transparent, the optical coupling state of the optical coupling section can be stably sealed. Further, since the optical coupling portion is sealed with the resin 41 in advance, it is possible to reduce the thermal strain of the optical coupling portion when the resin 42 is subsequently heat-cured.
【００３５】樹脂４１の硬化後、更に耐湿性に優れた不
透明な外装用の樹脂（ＣＯＢ材系のエポキシ樹脂等）４
２を第２の基板２０の高さまで充填して加熱（１５０°
Ｃ程度）硬化し、被覆層４２を形成する。樹脂４２を不
透明とすることで、外光の侵入を防止できる。樹脂４２
を加熱硬化させる際には、加熱時の樹脂４２に熱膨張が
あっても、流れ止め部材５１は基板２１の内壁により堅
固に支持されるため、下側の光導波路１２1 ，１２2 に
は何らの影響も生じない。また冷却後の被覆層４２に収
縮があっても、上記図２（Ａ）に基づき述べた流れ止め
部材５１の作用により、下側の光導波路１２1 ，１２2
には何らの影響も生じない。従って、この様な流れ止め
部材５１を備える構成により、小型の気密封止型光モジ
ュールを低価格かつ高信頼性で大量に提供できる。After curing the resin 41, an opaque exterior resin (COB-based epoxy resin or the like) 4 which is further excellent in moisture resistance
2 is filled up to the height of the second substrate 20 and heated (150 °
About C) is cured to form the coating layer 42. By making the resin 42 opaque, entry of external light can be prevented. Resin 42
When the resin is heat-cured, the flow stop member 51 is firmly supported by the inner wall of the substrate 21 even if the resin 42 is thermally expanded during heating, so that the lower optical waveguides 12 1 and 12 2 are It has no effect. Further, even if the coating layer 42 contracts after cooling, the action of the flow stop member 51 described with reference to FIG. 2 (A) causes the lower optical waveguides 12 1 and 12 2 to function.
Has no effect on. Therefore, with the configuration including such a flow stop member 51, a large number of small hermetically sealed optical modules can be provided at low cost and with high reliability.
【００３６】図１（Ｅ）は第１の実施の形態による他の
流れ止め部材５１´の外観斜視図である。この流れ止め
部材５１´は架橋部Ａの界面部５１ｂ´のみならず、樹
脂４２と接する残りの界面部５１ｃ´も第２の基板２０
の主面に垂直な面より前方（図の左側）に傾斜してい
る。このため、冷却後の被覆層４２に収縮があっても、
上記図２（Ｂ）に基づき述べた流れ止め部材５１´の作
用により、流れ止め部材５１´が傾く角度は相対的に小
さく、よって下側の光導波路１２1 ，１２2 には何らの
影響も生じない。従って、この様な流れ止め部材５１´
を備える構成により、小型の気密封止型光モジュールを
低価格かつ高信頼性で大量に提供できる。FIG. 1E is an external perspective view of another flow stop member 51 'according to the first embodiment. The flow stop member 51 ′ includes not only the interface portion 51 b ′ of the bridge portion A but also the remaining interface portion 51 c ′ that contacts the resin 42.
Is inclined forward (on the left side in the figure) from a plane perpendicular to the main surface of the. Therefore, even if the coating layer 42 after cooling contracts,
Due to the action of the flow stop member 51 'described with reference to FIG. 2 (B), the angle at which the flow stop member 51' is inclined is relatively small, so that there is no effect on the lower optical waveguides 12 1 and 12 2. Does not happen. Therefore, such a flow stop member 51 '
With such a configuration, it is possible to provide a large number of small hermetically sealed optical modules at low cost and with high reliability.
【００３７】図３は第２の実施の形態による光モジュー
ルを説明する図で、流れ止め部材５２の架橋部Ａの少な
くとも下部の断面形状が三角形の場合を示している。従
って、上記流れ止め部材５１と同様の作用、効果を奏す
る。更には、架橋部Ａの下側に充填される樹脂４２の量
や厚み等を所望（剥離や亀裂が生じない様）に調整でき
る。FIG. 3 is a view for explaining the optical module according to the second embodiment, and shows a case where the cross-sectional shape of at least the lower portion of the bridge portion A of the flow stop member 52 is triangular. Therefore, the same action and effect as the flow stop member 51 are obtained. Furthermore, the amount and thickness of the resin 42 filled below the cross-linking portion A can be adjusted to a desired value (so that peeling or cracking does not occur).
【００３８】図４は第３の実施の形態による光モジュー
ルを説明する図で、流れ止め部材５３の架橋部Ａの界面
部５３ｂに対応する断面形状が曲線の場合を示してい
る。従って、上記流れ止め部材５１と同様の作用、効果
を奏する。更には、架橋部Ａの下側に充填される樹脂４
２の量や形状等を所望（剥離や亀裂が生じない様）に調
整できる。FIG. 4 is a view for explaining the optical module according to the third embodiment, and shows a case where the cross-sectional shape corresponding to the interface portion 53b of the bridge portion A of the flow stop member 53 is a curve. Therefore, the same action and effect as the flow stop member 51 are obtained. Further, the resin 4 filled under the bridge portion A
The amount and shape of 2 can be adjusted as desired (so that peeling or cracking does not occur).
【００３９】図５は第４の実施の形態による光モジュー
ルを説明する図で、流れ止め部材５４が樹脂４２とは接
着しない材料で構成され、かつ充填された樹脂４２の硬
化後に流れ止め部材５４が取り外されてなる場合を示し
ている。流れ止め部材５４は、本来の樹脂４２の流れ止
めの機能を果たすと共に、樹脂４２とは接着しない材料
（ゴム等）で構成されているため、樹脂４２の収縮応力
は流れ止め部材５４には伝わらない。従って、基板１０
の表面には何らの影響を与えることも無く、基板２０を
所要の特性で安定に樹脂封止できる。FIG. 5 is a view for explaining the optical module according to the fourth embodiment, in which the flow stop member 54 is made of a material which does not adhere to the resin 42, and the flow stop member 54 is cured after the filled resin 42 is cured. Shows the case where is removed. The flow stop member 54 has an original function of stopping the flow of the resin 42 and is made of a material (rubber or the like) that does not adhere to the resin 42. Therefore, the contraction stress of the resin 42 is transmitted to the flow stop member 54. Absent. Therefore, the substrate 10
The surface of the substrate 20 is not affected at all, and the substrate 20 can be stably resin-sealed with the required characteristics.
【００４０】なお、図の流れ止め部材５４は図１（Ｄ）
の流れ止め部材５１と同じ形をしているが、他の流れ止
め部材５１´，５２，５３、更には図１６（Ｄ）の流れ
止め部材３０と同じ形をしていても良い。好ましくは、
流れ止め部材５４の形状は、流れ止め部材５４を取り外
した時の樹脂４２と基板１１との間の接着形状が剥離や
亀裂を起こしにくい形状（適当な厚みと丸みを帯びた端
面形状）となるように選ばれる。The flow stop member 54 shown in FIG.
Although it has the same shape as the flow stop member 51 of FIG. 16, it may have the same shape as the other flow stop members 51 ′, 52, 53 and further the flow stop member 30 of FIG. Preferably,
The shape of the flow stop member 54 is such that the adhesive shape between the resin 42 and the substrate 11 when the flow stop member 54 is removed does not easily cause peeling or cracks (a proper thickness and a rounded end surface shape). To be chosen.
【００４１】図６は第５の実施の形態による光モジュー
ルを説明する図で、流れ止め部材５５Ａの架橋部Ａの下
面に柔軟性の緩衝層５５ｂを備える場合を示している。
流れ止め部材５５Ａの本体は剛性でも良い。架橋部Ａの
下面にはゴム等からなる柔軟性（弾力性，変形性）の緩
衝層５５ｂが所定の厚みで設けられる。この流れ止め部
材５５Ａを基板１０をまたいで載置すると、緩衝層５５
ｂの下面が基板１０の上面に丁度当接し、樹脂４２の流
れ止めの機能を果たす。また流れ止め部材５５Ａが樹脂
４２の収縮応力を受けて傾いても、これに伴う架橋部下
部による基板１０の表面を下に押し下げようとする力は
緩衝層５５ｂの変形により十分に吸収されるため、基板
１０の表面には伝わらない。従って、基板１０の表面に
は何らの影響も与えること無く、基板２０を所要の特性
で安定に樹脂封止できる。FIG. 6 is a view for explaining an optical module according to the fifth embodiment, and shows a case where a flexible buffer layer 55b is provided on the lower surface of the bridge portion A of the flow stop member 55A.
The main body of the flow stop member 55A may be rigid. A flexible (elastic, deformable) buffer layer 55b made of rubber or the like is provided on the lower surface of the bridge portion A with a predetermined thickness. When this flow stop member 55A is placed over the substrate 10, the buffer layer 55
The lower surface of b just comes into contact with the upper surface of the substrate 10 and functions to prevent the resin 42 from flowing. Further, even if the flow stop member 55A inclines due to the contraction stress of the resin 42, the force that pushes down the surface of the substrate 10 due to the lower part of the bridge portion due to this is sufficiently absorbed by the deformation of the buffer layer 55b. , Does not reach the surface of the substrate 10. Therefore, the surface of the substrate 10 can be stably resin-sealed with the required characteristics without any influence on the surface of the substrate 10.
【００４２】図７は第６の実施の形態による光モジュー
ルを説明する図で、流れ止め部材５５Ｂの樹脂４２と接
触する界面部に柔軟性の緩衝層５５ｃを備える場合を示
している。流れ止め部材５５Ｂの本体は剛性でも良い。
流れ止め部材５５Ｂの樹脂４２と接触する界面部にはゴ
ム等からなる柔軟性（弾力性，変形性）の緩衝層５５ｃ
が所定の厚みで設けられている。この流れ止め部材５５
Ｂを基板１０をまたいで載置すると、架橋部Ａの下面が
基板１０の上面に丁度当接し、樹脂４２の流れ止めの機
能を果たす。また流れ止め部材５５Ｂが樹脂４２の収縮
応力を受けて傾いても、樹脂４２による界面部５５ｃを
下に押し下げようとする力は、緩衝層５５ｃの変形によ
り流れ止め部材５５Ｂの本体には伝わらない。従って、
基板１０の表面には何らの影響も与えること無く、基板
２０を所要の特性で安定に樹脂封止できる。FIG. 7 is a view for explaining an optical module according to the sixth embodiment, and shows a case where a flexible buffer layer 55c is provided at an interface portion of the flow stop member 55B which comes into contact with the resin 42. The main body of the flow stop member 55B may be rigid.
A flexible (elastic, deformable) buffer layer 55c made of rubber or the like is provided at an interface portion of the flow stop member 55B which is in contact with the resin 42.
Are provided with a predetermined thickness. This flow stop member 55
When B is placed over the substrate 10, the lower surface of the bridge portion A just comes into contact with the upper surface of the substrate 10 and functions to prevent the resin 42 from flowing. Further, even if the anti-flow member 55B is inclined due to the contraction stress of the resin 42, the force of the resin 42 for pushing down the interface 55c is not transmitted to the main body of the anti-flow member 55B due to the deformation of the buffer layer 55c. . Therefore,
The substrate 20 can be stably resin-sealed with the required characteristics without any influence on the surface of the substrate 10.
【００４３】図８は第７の実施の形態による光モジュー
ルを説明する図で、流れ止め部材５５Ｃそのものを柔軟
性の材料で構成した場合を示している。流れ止め部材５
５Ｃはゴム等の柔軟性（弾力性，変形性）の材料で構成
されている。この流れ止め部材５５Ｃを基板１０をまた
いで載置すると、架橋部Ａの下部が基板１０の上面に丁
度当接し、樹脂４２の流れ止めの機能を果たす。また流
れ止め部材５５Ｃが樹脂４２の収縮応力を受けて傾いて
も、これに伴う架橋部下部による基板１０の表面を下に
押し下げようとする力は流れ止め部材５５Ｃ（特に架橋
部下部）の変形により十分に吸収されるため、基板１０
の表面には伝わらない。従って、基板１０の表面には何
らの影響も与えること無く、基板２０を所要の特性で安
定に樹脂封止できる。FIG. 8 is a view for explaining an optical module according to the seventh embodiment, and shows a case where the flow stop member 55C itself is made of a flexible material. Flow stop member 5
5C is made of a flexible (elastic, deformable) material such as rubber. When this flow stop member 55C is placed across the substrate 10, the lower part of the bridge portion A just abuts on the upper surface of the substrate 10 and functions to stop the flow of the resin 42. Further, even if the flow stop member 55C is tilted by the contraction stress of the resin 42, the force which pushes the surface of the substrate 10 downward by the lower portion of the bridge portion due to this is the deformation of the flow stop member 55C (particularly the lower portion of the bridge portion). Is sufficiently absorbed by the substrate 10
Is not transmitted to the surface of. Therefore, the surface of the substrate 10 can be stably resin-sealed with the required characteristics without any influence on the surface of the substrate 10.
【００４４】図９は第８の実施の形態による光モジュー
ルを説明する図で、流れ止め部材５６が第２の基板２０
の平面により平面的（多点的）に支持される場合を示し
ている。流れ止め部材５６は、基本的には図１６（Ｄ）
の流れ止め部材３０と同様の流れ止め部材５６1 ，５６
2 を平行に並べ、これらの中間を架橋部５６3 で結合し
た構造を備える。各部を機能的にみると、もし流れ止め
部を５６1 と考える時は残りの５６3 ，５６2 は流れ止
め部５６1 を支持する支持部であり、また流れ止め部を
５６2 と考える時は残りの５６3 ，５６1 は流れ止め部
５６2 を支持する支持部となる。流れ止め部材５６の平
面視形状はＨの字型であり、好ましくは、樹脂成形法に
より一体成形される。FIG. 9 is a view for explaining the optical module according to the eighth embodiment, in which the flow stop member 56 is the second substrate 20.
It shows a case of being supported in a plane (multipoint) by the plane of. The flow stop member 56 is basically shown in FIG.
Flow stop members 56 1 and 56 similar to the flow stop member 30 of FIG.
2 is arranged in parallel, and a structure in which the middle of these are connected by a bridge portion 56 3 is provided. From a functional viewpoint, if the flow stop portion is considered to be 56 1 , the remaining 56 3 and 56 2 are support portions that support the flow stop portion 56 1 , and if the flow stop portion is considered to be 56 2. The remaining 56 3 and 56 1 serve as support portions for supporting the flow stop portion 56 2 . The plan view shape of the flow stop member 56 is an H shape, and is preferably integrally molded by a resin molding method.
【００４５】基板２０に載置された流れ止め部材５６は
基板２０上の４つの矩形状平面ａにより安定に支持され
ると共に、架橋部Ａの下部が基板１０の上面に丁度当接
し、樹脂４２の流れ止めの機能を果たす。この状態で、
好ましくは、樹脂４２を流れ止め部材５６2 の右側のみ
ならず、流れ止め部材５６1 ，５６2 の中間にも十分に
充填し、加熱硬化する。The flow stop member 56 mounted on the substrate 20 is stably supported by the four rectangular planes a on the substrate 20, and the lower portion of the bridge portion A just abuts on the upper surface of the substrate 10 so that the resin 42 Fulfills the function of a flow stop. In this state,
Preferably, the resin 42 is sufficiently filled not only on the right side of the flow stop member 56 2 but also in the middle of the flow stop members 56 1 and 56 2 and heat-cured.
【００４６】その後に光モジュールが冷却されると、流
れ止め部材５６1 ，５６2 の中間の樹脂４２が収縮する
がが、その収縮応力は流れ止め部材５６1 ，５６2 の内
壁間で互いに反対方向に作用して相殺され、流れ止め部
材５６を傾ける力は生じない。また流れ止め部材５６2
の右側の樹脂４２が収縮しても、流れ止め部材５６は上
記４つの矩形状平面ａに対応する各内壁等で基板２０に
しっかり接着固定されているため、流れ止め部材５６は
傾かない。従って、基板１０の表面には何らの影響も与
えること無く、基板２０を所要の特性で安定に樹脂封止
できる。[0046] When thereafter the optical module is cooled, but the flow stop member 56 1, 56 2 of the intermediate resin 42 shrinks but the shrinkage stress opposite each other between the inner wall of the flow stop member 56 1, 56 2 The forces acting in the directions cancel each other out, and the force for tilting the flow stop member 56 does not occur. In addition, the flow stop member 56 2
Even if the resin 42 on the right side of the flow prevention member 56 contracts, the flow prevention member 56 does not tilt because the flow prevention member 56 is firmly adhered and fixed to the substrate 20 by the inner walls corresponding to the four rectangular planes a. Therefore, the surface of the substrate 10 can be stably resin-sealed with the required characteristics without any influence on the surface of the substrate 10.
【００４７】図１０は第９の実施の形態による光モジュ
ールを説明する図で、流れ止め部材５７が第２の基板面
により平面的に（多点で）支持される他の場合を示して
いる。流れ止め部材５７の平面視形状は口の字型であ
り、好ましくは、樹脂成形法により一体成形される。基
板２０に載置された流れ止め部材５７は基板２０上の２
つのコの字状平面ａで安定に支持されると共に、架橋部
Ａの下部が基板１０の上面に丁度当接し、樹脂４２の流
れ止めの機能を果たす。この状態で、好ましくは、樹脂
４２を流れ止め部材５７の右側のみならず、流れ止め部
材７の内側にも十分に充填し、加熱硬化する。FIG. 10 is a view for explaining an optical module according to the ninth embodiment, and shows another case in which the flow stop member 57 is supported planarly (at multiple points) by the second substrate surface. . The shape of the flow stop member 57 in a plan view is a V shape, and it is preferably integrally molded by a resin molding method. The flow stop member 57 mounted on the substrate 20 is provided on the substrate 20.
It is stably supported by two U-shaped planes a, and the lower part of the bridge portion A just abuts on the upper surface of the substrate 10 to fulfill the function of stopping the flow of the resin 42. In this state, preferably, not only the right side of the flow stop member 57 but also the inside of the flow stop member 7 is sufficiently filled with the resin 42, and the resin 42 is cured by heating.
【００４８】その後に光モジュールが冷却されると、流
れ止め部材５７の内側の樹脂４２が収縮するが、その収
縮応力は流れ止め部材５７の内壁間に作用して相殺さ
れ、流れ止め部材５７を傾ける力は生じない。また流れ
止め部材５７の右側の樹脂４２が収縮しても、流れ止め
部材５７は上記２つのコの字状平面ａに対応する各内壁
でしっかり基板２０に接着固定されているため、流れ止
め部材５７は傾かない。従って、基板１０の表面には何
らの影響も与えること無く、基板２０を所要の特性で樹
脂封止できる。When the optical module is subsequently cooled, the resin 42 inside the flow stop member 57 contracts, but the contraction stress acts between the inner walls of the flow stop member 57 and is offset, so that the flow stop member 57 is prevented. There is no tilting force. Even if the resin 42 on the right side of the flow stop member 57 contracts, the flow stop member 57 is firmly adhered and fixed to the substrate 20 by the inner walls corresponding to the two U-shaped planes a. 57 does not lean. Therefore, the substrate 20 can be resin-sealed with desired characteristics without any influence on the surface of the substrate 10.
【００４９】図１１は第１０の実施の形態による光モジ
ュールを説明する図で、流れ止め部材５８が第２の基板
面により平面的に（多点で）支持される更に他の場合を
示している。流れ止め部材５８の平面視形状は逆コの字
型であり、好ましくは、樹脂成形法により一体成形され
る。基板２０に載置された流れ止め部材５８は、基板２
０上の２つのＬの字状平面ａで安定に支持されると共
に、架橋部Ａの下部が基板１０の上面に丁度当接し、樹
脂４２の流れ止めの機能を果たす。この状態で、基板２
０の内側に樹脂４２を十分に充填し、加熱硬化する。FIG. 11 is a view for explaining the optical module according to the tenth embodiment, showing still another case where the flow stop member 58 is supported planarly (at multiple points) by the second substrate surface. There is. The plan view shape of the flow stop member 58 is an inverted U-shape, and is preferably integrally molded by a resin molding method. The flow stop member 58 mounted on the substrate 20 is
It is stably supported by the two L-shaped planes a above 0, and the lower portion of the bridge portion A just abuts the upper surface of the substrate 10 to fulfill the function of stopping the flow of the resin 42. In this state, the substrate 2
The inside of 0 is sufficiently filled with the resin 42 and cured by heating.
【００５０】その後に光モジュールが冷却されると、樹
脂４２が収縮して流れ止め部材５８は収縮応力を受ける
が、流れ止め部材５８は上記２つのＬの字状平面ａに対
応する内壁で基板２０にしっかり接着固定されているた
め、流れ止め部材５８は傾かない。従って、基板１０の
表面には何らの影響も与えること無く、基板２０を所要
の特性で樹脂封止できる。After that, when the optical module is cooled, the resin 42 contracts and the flow stop member 58 receives a contraction stress, but the flow stop member 58 is an inner wall corresponding to the two L-shaped planes a. Since it is firmly adhered and fixed to 20, the flow stop member 58 does not tilt. Therefore, the substrate 20 can be resin-sealed with desired characteristics without any influence on the surface of the substrate 10.
【００５１】図１２は第１１の実施の形態による光モジ
ュールを説明する図で、流れ止め部材５９の両側に設け
た凸部５９ｂと、基板２０の両側に設けた凹部２９との
嵌合により第２の基板２０で流れ止め部材５９を支持
し、同時に箱様体となした場合を示している。流れ止め
部材５９の両凸部５９ｂを、基板１０をまたいで、半箱
様体の基板２０の両凹部２９に差し込むと、箱様体が形
成されると共に、架橋部Ａの下部が基板１０の上面に丁
度当接し、樹脂４２の流れ止めの機能を果たす。この状
態で、基板２０の内側に樹脂４２を十分に充填し、加熱
硬化する。FIG. 12 is a view for explaining the optical module according to the eleventh embodiment, in which the convex portions 59b provided on both sides of the flow stop member 59 and the concave portions 29 provided on both sides of the substrate 20 are fitted to each other. The case where the second substrate 20 supports the flow stop member 59 and simultaneously forms a box-like body is shown. When both convex portions 59b of the flow stop member 59 are inserted into the both concave portions 29 of the half-box-like substrate 20 while straddling the substrate 10, a box-like body is formed and the lower part of the bridge portion A is the substrate 10. It just comes into contact with the upper surface and functions to stop the flow of the resin 42. In this state, the inside of the substrate 20 is sufficiently filled with the resin 42 and is cured by heating.
【００５２】その後に光モジュールが冷却されると、樹
脂４２が収縮して流れ止め部材５９は収縮応力を受ける
が、流れ止め部材５９は基板２０の両側端面でしっかり
支持されているため、流れ止め部材５９は傾かない。従
って、基板１０の表面には何らの影響も与えること無
く、基板２０を所要の特性で安定に樹脂封止できる。な
お、上記本発明に好適なる複数の実施の形態を述べた
が、本発明思想を逸脱しない範囲内で各部の構成（特に
基板や流れ止め部材の形状，構造，材質）及びこれらの
組合せの様々な変更が行えることは言うまでも無い。When the optical module is cooled thereafter, the resin 42 contracts and the flow stop member 59 receives contraction stress. However, since the flow stop member 59 is firmly supported by both end faces of the substrate 20, the flow stop member 59 is prevented from flowing. The member 59 does not tilt. Therefore, the surface of the substrate 10 can be stably resin-sealed with the required characteristics without any influence on the surface of the substrate 10. Although a plurality of preferred embodiments of the present invention have been described above, various configurations (particularly the shapes, structures, and materials of the substrate and the flow stop member) and combinations thereof can be used without departing from the spirit of the present invention. Needless to say, it can be changed.
【００５３】[0053]
【発明の効果】以上述べた如く本発明によれば、簡易な
樹脂封止型の光モジュールにおいて、外装用樹脂の流れ
止めの形状，構造，材質を改良したことにより、その後
の温度環境等により支持基板や外装用樹脂等に膨張収縮
が生じても光モジュールの特性劣化を有効に防止でき
る。As described above, according to the present invention, in a simple resin-sealed type optical module, the shape, structure, and material of the exterior resin flow stop are improved so that the temperature environment and the like after that can be improved. Even if expansion or contraction occurs in the supporting substrate, the exterior resin, or the like, the characteristic deterioration of the optical module can be effectively prevented.
【図１】第１の実施の形態による光モジュールを説明す
る図である。FIG. 1 is a diagram illustrating an optical module according to a first embodiment.
【図２】第１の実施の形態による流れ止め部材の作用を
説明する図である。FIG. 2 is a view for explaining the operation of the flow stop member according to the first embodiment.
【図３】第２の実施の形態による光モジュールを説明す
る図である。FIG. 3 is a diagram illustrating an optical module according to a second embodiment.
【図４】第３の実施の形態による光モジュールを説明す
る図である。FIG. 4 is a diagram illustrating an optical module according to a third embodiment.
【図５】第４の実施の形態による光モジュールを説明す
る図である。FIG. 5 is a diagram illustrating an optical module according to a fourth embodiment.
【図６】第５の実施の形態による光モジュールを説明す
る図である。FIG. 6 is a diagram illustrating an optical module according to a fifth embodiment.
【図７】第６の実施の形態による光モジュールを説明す
る図である。FIG. 7 is a diagram illustrating an optical module according to a sixth embodiment.
【図８】第７の実施の形態による光モジュールを説明す
る図である。FIG. 8 is a diagram illustrating an optical module according to a seventh embodiment.
【図９】第８の実施の形態による光モジュールを説明す
る図である。FIG. 9 is a diagram illustrating an optical module according to an eighth embodiment.
【図１０】第９の実施の形態による光モジュールを説明
する図である。FIG. 10 is a diagram illustrating an optical module according to a ninth embodiment.
【図１１】第１０の実施の形態による光モジュールを説
明する図である。FIG. 11 is a diagram illustrating an optical module according to a tenth embodiment.
【図１２】第１１の実施の形態による光モジュールを説
明する図である。FIG. 12 is a diagram illustrating an optical module according to an eleventh embodiment.
【図１３】既提案の光モジュールを説明する図（１）で
ある。FIG. 13 is a diagram (1) illustrating an already proposed optical module.
【図１４】既提案の光モジュールを説明する図（２）で
ある。FIG. 14 is a diagram (2) illustrating an already proposed optical module.
【図１５】既提案の光モジュールを説明する図（３）で
ある。FIG. 15 is a diagram (3) illustrating an already proposed optical module.
【図１６】既提案の光モジュールを説明する図（４）で
ある。FIG. 16 is a diagram (4) illustrating an already proposed optical module.
【図１７】既提案の光モジュールを説明する図（５）で
ある。FIG. 17 is a diagram (5) illustrating an already proposed optical module.
１０ 第１の基板 １１ 支持基板 １２1 ，１２2 光導波路 １３ 発光素子（ＬＤチップ） １４ 受光素子（ＰＤチップ） １５ 中継用ボンディングパッド １６ 接続用ボンディングパッド １７ 導体パターン １８1 ，１８2 光ファイバ １９1 ，１９2 支持基板 ２０ 第２の基板 ２１ モールド成型品 ２９ 凹部 ５１〜５９ 流れ止め部材 ５５ｂ，５５ｃ 緩衝層 ５９ｂ 凸部10 First Substrate 11 Support Substrates 12 1 and 12 2 Optical Waveguide 13 Light-Emitting Element (LD Chip) 14 Light-Receiving Element (PD Chip) 15 Relay Bonding Pad 16 Connection Bonding Pad 17 Conductor Patterns 18 1 and 18 2 Optical Fiber 19 1 , 19 2 Support substrate 20 Second substrate 21 Molded product 29 Recesses 51-59 Flow stop members 55b, 55c Buffer layer 59b Convex part
───────────────────────────────────────────────────── フロントページの続き (72)発明者 三浦 和則 神奈川県川崎市中原区上小田中４丁目１ 番１号 富士通株式会社内 (72)発明者 澤江 信也 北海道札幌市中央区北一条西２丁目１番 地 富士通北海道ディジタル・テクノロ ジ株式会社内 (72)発明者 菊池 英治 神奈川県川崎市中原区上小田中４丁目１ 番１号 富士通株式会社内 (72)発明者 中川 剛二 神奈川県川崎市中原区上小田中４丁目１ 番１号 富士通株式会社内 (72)発明者 佐々木 誠美 神奈川県川崎市中原区上小田中４丁目１ 番１号 富士通株式会社内 (72)発明者 田淵 晴彦 神奈川県川崎市中原区上小田中４丁目１ 番１号 富士通株式会社内 (72)発明者 福田 光男 東京都新宿区西新宿三丁目19番２号 日 本電信電話株式会社内 (72)発明者 市川 二三夫 東京都新宿区西新宿三丁目19番２号 日 本電信電話株式会社内 (72)発明者 塙 文明 東京都新宿区西新宿三丁目19番２号 日 本電信電話株式会社内 (72)発明者 石橋 重喜 東京都新宿区西新宿三丁目19番２号 日 本電信電話株式会社内 (56)参考文献 特開 昭56−15083（ＪＰ，Ａ) 特開 平４−330788（ＪＰ，Ａ) 特開 平11−202145（ＪＰ，Ａ) 特開 平10−123371（ＪＰ，Ａ) 特開 平10−123372（ＪＰ，Ａ) 吉田幸司 ｅｔ．ａｌ，1997年電子情 報通信学会総合大会講演論文集，1993年 ３月 ６日，エレクトロニクス１, ｐ．253 寺田浩二 ｅｔ．ａｌ．，1997年電子 情報通信学会エレクトロニクスソサイエ ティ大会講演論文集１，1997年 ８月13 日，ｐ．217 (58)調査した分野(Int.Cl.7，ＤＢ名) G02B 6/12 - 6/14 G02B 6/30 G02B 6/42 - 6/43 H01L 21/56 H01L 23/02 - 23/28 H01L 33/00 H01S 5/00 - 5/022 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazunori Miura 4-1-1 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Fujitsu Limited (72) Inventor Shinya Sawae 2-chome, Kitaichijo Nishi, Chuo-ku, Sapporo, Hokkaido Address: Hokkaido Hokkaido Digital Technology Co., Ltd. (72) Inventor Eiji Kikuchi Eiji Kikuchi 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited (72) Goji Nakagawa Nakahara-ku, Kawasaki-shi, Kanagawa 4-1-11 Kamiodanaka FUJITSU LIMITED (72) Inventor Satomi Sasaki 4-1-1 1-1 UMEDATA Nakagawa, Nakahara-ku, Kawasaki, Kanagawa Prefecture (72) Haruhiko Tabuchi Nakahara, Kawasaki, Kanagawa 4-1-1 Kamiodanaka, Ward Fujitsu Limited (72) Inventor Mitsuo Fukuda 3-19 Nishi-Shinjuku, Shinjuku-ku, Tokyo No. 2 Nihon Telegraph and Telephone Corp. (72) Inventor Fumio Ichikawa 3-19-3 Nishishinjuku, Shinjuku-ku, Tokyo No. 2 Nihon Telegraph and Telephone Corp. (72) Inventor Fumimei Hanawa 3-Nishishinjuku, Shinjuku-ku, Tokyo 19-2 Nihon Telegraph and Telephone Corporation (72) Inventor Shigeki Ishibashi 3-19-3 Nishishinjuku, Shinjuku-ku, Tokyo Nihon Telegraph and Telephone Corporation (56) References JP-A-56-15083 (JP , A) JP 4-330788 (JP, A) JP 11-202145 (JP, A) JP 10-123371 (JP, A) JP 10-123372 (JP, A) Koji Yoshida et al. ． al, Proc. of IEICE General Conference 1997, March 6, 1993, Electronics 1, p. 253 Koji Terada et. al. , 1997 IEICE Electronics Society Conference Proceedings 1, August 13, 1997, p. 217 (58) Fields surveyed (Int.Cl. 7 , DB name) G02B 6/12-6/14 G02B 6/30 G02B 6/42-6/43 H01L 21/56 H01L 23/02-23/28 H01L 33/00 H01S 5/00-5/022
Claims (14)
れた光素子とを有する第１の基板と、前記光伝送路の他
端が外部に突き出るように前記光素子側を光伝送路と共
に支持する箱様体の第２の基板と、前記第２の基板の箱
様体の内壁に接し前記光伝送路をまたぐ態様で載置され
る樹脂の流れ止め部材とを備え、前記第２の基板上を前
記第１の基板の光伝送路と光素子とを含んで樹脂により
密に覆い、前記流れ止め部材が該樹脂の硬化と同時に固
定され一体化してなる光モジュールにおいて、 前記流れ止め部材の架橋部における断面は、その厚みが
前記第１の基板の表面に向かって徐々に薄くなるテーパ
形状を有し、且つ、前記樹脂と接触する界面部が傾斜し
て該テーパ形状を形成していることを特徴とする光モジ
ュール。1. A first substrate and a light element that is optically coupled to one end of the optical transmission line and optical transmission path, the optical element side and the other end of the optical transmission path so as to project to the outside light A second substrate of a box-like body that supports together with the transmission path, and a resin flow stop member that is placed in contact with the inner wall of the box-like body of the second substrate and that is placed across the optical transmission path, The second substrate is closely covered with a resin including the optical transmission line and the optical element of the first substrate, and the flow stop member is fixed at the same time when the resin is cured.
In a fixed and integrated optical module, the cross section of the bridging portion of the flow stop member has a thickness
A taper that gradually becomes thinner toward the surface of the first substrate
It has a shape, and the interface that contacts the resin is inclined.
The optical module is characterized in that the taper shape is formed .
とを特徴とする請求項１に記載の光モジュール。2. The optical module according to claim 1, wherein the cross-sectional shape of the bridge portion is triangular.
あることを特徴とする請求項１に記載の光モジュール。3. The optical module according to claim 1, wherein the cross-sectional shape of the lower portion of the bridge portion is triangular.
は曲線であることを特徴とする請求項１に記載の光モジ
ュール。4. The optical module according to claim 1, wherein the cross-sectional shape corresponding to the interface portion of the bridge portion is a curve.
残りの界面部の断面は、その厚みが前記第２の基板の底
面に向かって徐々に薄くなるテーパ形状を有し、且つ、
前記樹脂と接触する界面部が傾斜して該テーパ形状を形
成していることを特徴とする請求項１乃至４の何れか１
に記載の光モジュール。5. The cross section of the remaining interface portion of the flow stop member that comes into contact with the resin has a thickness of the bottom of the second substrate.
Has a taper shape that gradually becomes thinner toward the surface, and
The interface that contacts the resin is inclined to form the tapered shape.
5. The method according to claim 1, wherein
Optical module described in.
れた光素子とを有する第１の基板と、前記光伝送路の他
端が外部に突き出るように前記光素子側を光伝送路と共
に支持する箱様体の第２の基板とを備え、前記第２の基
板上を前記第１の基板の光伝送路と光素子とを含んで樹
脂により密に覆い一体化してなる光モジュールの製造方
法であって、 前記樹脂とは接着しない材料で構成された流れ止め部材
が予め前記第２の基板の箱様体の内壁に接し、かつ前記
光伝送路をまたぐ態様で載置され、かつ充填された前記
樹脂の硬化後に前記流れ止め部材が取り外されることを
特徴とする光モジュールの製造方法。6. Light a first substrate having a light element that is optically coupled to one end of the optical transmission line and optical transmission path, the optical element side and the other end of the optical transmission path so as to protrude to the outside and a second substrate of the box-like body for supporting with the transmission line, formed by tightly covered integrated by the resin the second upper substrate and a light transmission path and the optical element of the first substrate light How to make a module
A law, the flow stop member, wherein the resin formed of a material which does not adhere
Previously contacts the inner wall of the box-like body of the second substrate, and
A method of manufacturing an optical module , characterized in that the flow stop member is removed after the resin that has been placed in a manner straddling an optical transmission path and has been filled is cured.
れた光素子とを有する第１の基板と、前記光伝送路の他
端が外部に突き出るように前記光素子側を光伝送路と共
に支持する箱様体の第２の基板と、前記第２の基板の箱
様体の内壁に接し前記光伝送路をまたぐ態様で載置され
る樹脂の流れ止め部材とを備え、前記第２の基板上を前
記第１の基板の光伝送路と光素子とを含んで樹脂により
密に覆い、前記流れ止め部材が該樹脂の硬化と同時に固
定され一体化してなる光モジュールにおいて、 前記流れ止め部材の架橋部の下面に柔軟性の緩衝層を備
えることを特徴とする光モジュール。7. Light a first substrate having a light element that is optically coupled to one end of the optical transmission line and optical transmission path, the optical element side and the other end of the optical transmission path so as to protrude to the outside a second substrate of the box-like body for supporting with the transmission path, the box of the second substrate
A resin flow stop member that is placed in contact with the inner wall of the body so as to straddle the optical transmission line, and includes the optical transmission line of the first substrate and the optical element on the second substrate. Cover it tightly with resin so that the flow stop member will not harden when the resin hardens.
A fixed and integrated optical module, comprising a flexible buffer layer on the lower surface of the bridging portion of the flow stop member.
れた光素子とを有する第１の基板と、前記光伝送路の他
端が外部に突き出るように前記光素子側を光伝送路と共
に支持する箱様体の第２の基板と、前記第２の基板の箱
様体の内壁に接し前記光伝送路をまたぐ態様で載置され
る樹脂の流れ止め部材とを備え、前記第２の基板上を前
記第１の基板の光伝送路と光素子とを含んで樹脂により
密に覆い、前記流れ止め部材が該樹脂の硬化と同時に固
定され一体化してなる光モジュールにおいて、 前記流れ止め部材の前記樹脂と接触する界面部に柔軟性
の緩衝層を備えることを特徴とする光モジュール。8. Light a first substrate having a light element that is optically coupled to one end of the optical transmission line and optical transmission path, the optical element side and the other end of the optical transmission path so as to protrude to the outside a second substrate of the box-like body for supporting with the transmission path, the box of the second substrate
A resin flow stop member that is placed in contact with the inner wall of the body so as to straddle the optical transmission line, and includes the optical transmission line of the first substrate and the optical element on the second substrate. Cover it tightly with resin so that the flow stop member will not harden when the resin hardens.
An optical module which is fixed and integrated, wherein a flexible buffer layer is provided at an interface portion of the flow stop member that comes into contact with the resin.
れた光素子とを有する第１の基板と、前記光伝送路の他
端が外部に突き出るように前記光素子側を光伝送路と共
に支持する箱様体の第２の基板と、前記第２の基板の箱
様体の内壁に接し前記光伝送路をまたぐ態様で載置され
る樹脂の流れ止め部材とを備え、前記第２の基板上を前
記第１の基板の光伝送路と光素子とを含んで樹脂により
密に覆い、前記流れ止め部材が該樹脂の硬化と同時に固
定され一体化してなる光モジュールにおいて、 前記流れ止め部材を柔軟性の材料で構成したことを特徴
とする光モジュール。9. A first substrate having a light element that is optically coupled to one end of the optical transmission line and optical transmission path, the optical element side and the other end of the optical transmission path so as to project to the outside light a second substrate of the box-like body for supporting with the transmission path, the box of the second substrate
A resin flow stop member that is placed in contact with the inner wall of the body so as to straddle the optical transmission line, and includes the optical transmission line of the first substrate and the optical element on the second substrate. Cover it tightly with resin so that the flow stop member will not harden when the resin hardens.
A fixed and integrated optical module, wherein the flow stop member is made of a flexible material.
された光素子とを有する第１の基板と、前記光伝送路の
他端が外部に突き出るように前記光素子側を光伝送路と
共に支持する箱様体の第２の基板と、前記第２の基板の
箱様体の内壁に接し前記光伝送路をまたぐ態様で載置さ
れる樹脂の流れ止め部材とを備え、前記第２の基板上を
前記第１の基板の光伝送路と光素子とを含んで樹脂によ
り密に覆い、前記流れ止め部材が該樹脂の硬化と同時に
固定され一体化してなる光モジュールにおいて、 前記流れ止め部材は該流れ止め部材の側面の一部又は複
数の部分から前記光伝送路と平行な方向に突出かつ展開
して前記流れ止め部材を前記第２の基板面により複数の
面で支持するための支持部を備えることを特徴とする光
モジュール。10. A first substrate having a light element that is optically coupled to one end of the optical transmission line and optical transmission path, the optical element side and the other end of the optical transmission path so as to project to the outside light A second substrate having a box-like body that is supported together with the transmission path;
A resin flow stop member that is placed in contact with the inner wall of the box-like body so as to straddle the optical transmission line, and includes the optical transmission line of the first substrate and the optical element on the second substrate. The resin is tightly covered with a
In the fixed and integrated optical module, the flow stop member is a part or a side surface of the flow stop member.
From the portion of the number plurality of the second substrate surface the flow stop member protrudes and developed in the light transmission path parallel to the direction
An optical module comprising a supporting portion for supporting the surface .
構造の平面視形状がＨの字型であることを特徴とする請
求項１０に記載の光モジュール。11. The optical module according to claim 10, wherein the structure including the flow stop member and the support portion has an H shape in a plan view.
構造の平面視形状が口の字型であることを特徴とする請
求項１０に記載の光モジュール。12. The optical module according to claim 10, wherein the plan view of the structure including the flow stop member and the support portion is a V-shape.
構造の平面視形状が逆コの字型であることを特徴とする
請求項１０に記載の光モジュール。13. The optical module according to claim 10, wherein the structure including the flow stop member and the support portion has an inverted U-shape in plan view.
された光素子とを有する第１の基板と、前記光伝送路の
他端が外部に突き出るように前記光素子側を光伝送路と
共に支持する半箱様体の第２の基板であて、前記光伝送
路が突き出る前面側を開放端とすると共に、該前面部両
側面に凹部を有するものと、前記第２の基板の前記光伝
送路が突き出る位置で前記光伝送路をまたぐ態様で載置
される樹脂の流れ止め部材であって、その両側に前記凹
部と嵌合するための凸部を有するものとを備え、 前記流れ止め部材の凸部を前記第２の基板の凹部に嵌合
させた状態で、前記第２の基板上を前記第１の基板の光
伝送路と光素子とを含んで樹脂により密に覆い、前記流
れ止め部材が該樹脂の硬化と同時に固定され一体化され
ることを特徴とする光モジュールの製造方法。14. A first substrate having a light element that is optically coupled to one end of the optical transmission line and optical transmission path, the optical element side and the other end of the optical transmission path so as to project to the outside light A second half-box-like substrate for supporting together with a transmission path , the optical transmission
The front side from which the road projects is defined as an open end, and the front side
And having a recess on a side surface, a flow stop member of resin which is mounted in a manner straddling the optical transmission line at a position where the light transmission path of the second substrate protrudes, said concave on both sides
And a having a protrusion for parts and fitting, the fitting convex portion of the flow stop member in the recess of the second substrate
In this state, the light of the first substrate is passed over the second substrate.
Cover the transmission line and the optical element with resin,
The anti-friction member is fixed and integrated at the same time when the resin is cured.
Method of manufacturing an optical module, characterized in that that.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01576398A JP3429179B2 (en) | 1998-01-28 | 1998-01-28 | Optical module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01576398A JP3429179B2 (en) | 1998-01-28 | 1998-01-28 | Optical module and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11211941A JPH11211941A (en) | 1999-08-06 |
| JP3429179B2 true JP3429179B2 (en) | 2003-07-22 |
Family
ID=11897844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01576398A Expired - Lifetime JP3429179B2 (en) | 1998-01-28 | 1998-01-28 | Optical module and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3429179B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003133626A (en) * | 2001-10-19 | 2003-05-09 | Matsushita Electric Ind Co Ltd | Light-emitting device package and sealing method of light-emitting device |
| JP4156442B2 (en) * | 2003-05-30 | 2008-09-24 | 日本電信電話株式会社 | Planar optical circuit component and manufacturing method thereof |
| JP5268082B2 (en) * | 2006-02-22 | 2013-08-21 | シチズン電子株式会社 | Optical semiconductor device |
| PL2703180T3 (en) * | 2012-08-27 | 2016-06-30 | Agfa Nv | Free radical radiation curable liquids for de-inking substrates |
-
1998
- 1998-01-28 JP JP01576398A patent/JP3429179B2/en not_active Expired - Lifetime
Non-Patent Citations (2)
| Title |
|---|
| 吉田幸司 ｅｔ．ａｌ，１９９７年電子情報通信学会総合大会講演論文集，１９９３年 ３月 ６日，エレクトロニクス１，ｐ．２５３ |
| 寺田浩二 ｅｔ．ａｌ．，１９９７年電子情報通信学会エレクトロニクスソサイエティ大会講演論文集１，１９９７年 ８月１３日，ｐ．２１７ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11211941A (en) | 1999-08-06 |
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