JP3417915B2 - Case integrated connector - Google Patents
Case integrated connectorInfo
- Publication number
- JP3417915B2 JP3417915B2 JP2000320182A JP2000320182A JP3417915B2 JP 3417915 B2 JP3417915 B2 JP 3417915B2 JP 2000320182 A JP2000320182 A JP 2000320182A JP 2000320182 A JP2000320182 A JP 2000320182A JP 3417915 B2 JP3417915 B2 JP 3417915B2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- case body
- terminal
- ventilation groove
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、自動車等の車両に
搭載されて、その各装置を電子制御するためのケース一
体コネクタに関し、更に詳しくは、ケース本体にコネク
タ部が一体に設けられて、前記ケース本体の部品実装面
側、及び開口側には、その内部の気密を保持すべく、そ
れぞれ裏蓋、及び表蓋が密封状態で覆蓋された構成のケ
ース一体コネクタに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a case-integrated connector which is mounted on a vehicle such as an automobile and electronically controls the respective devices, and more specifically, a case body is integrally provided with a connector portion, The present invention relates to a case-integrated connector in which a back cover and a front cover are covered in a hermetically sealed state on the component mounting surface side and the opening side of the case main body so as to maintain airtightness inside thereof.
【０００２】[0002]
【従来の技術】本発明に係るケース一体コネクタは、図
１、図７及び図８に示されるように、樹脂成形されたケ
ース本体Ｃの特定の側壁部１にコネクタ部２が一体成形
されて、前記側壁部１の内側には、端子配置部３が段差
状となって形成されている。また、ケース本体Ｃの成形
時において、平板ストリップ状をした多数本のコネクタ
端子Ｔは、その中央部のみが前記側壁部１に部分インサ
ートされて、その先端の端子接続部Ｔａは、前記コネク
タ部２の内部空間に突出して収容されていると共に、そ
の残りの前記ケース本体Ｃ内に収容されたワイヤー接続
部Ｔｂは、その上面が前記端子配置部３の上面と同一面
となって露出した状態で、該端子配置部３の表層部に、
その全体が埋設状態で配置されている。2. Description of the Related Art As shown in FIGS. 1, 7 and 8, a case-integrated connector according to the present invention has a connector portion 2 integrally formed on a specific side wall portion 1 of a resin-molded case body C. The terminal placement portion 3 is formed in a stepped shape inside the side wall portion 1. Further, when molding the case body C, a large number of flat-plate strip-shaped connector terminals T are partially inserted into the side wall portion 1 only at the central portion thereof, and the terminal connecting portion Ta at the tip thereof is the connector portion. A state in which the upper surface of the wire connecting portion Tb, which is housed so as to project into the inner space of 2 and is housed in the remaining case body C, is flush with the upper surface of the terminal placement portion 3, and is exposed. Then, on the surface layer portion of the terminal placement portion 3,
The whole is arranged in a buried state.
【０００３】また、上記のようにして、各コネクタ端子
Ｔをケース本体Ｃに一体成形する際には、各コネクタ端
子Ｔのうちケース本体Ｃ内に収容されるワイヤー接続部
Ｔｂは、その浮き上がりを防止するために、ケース本体
Ｃを形成する割型の一方に設けられた端子押えピン（い
ずれも図示せず）によって、前記割型の他方に押さえ付
けられた状態で成形される。このため、図７及び図８に
示されるように、前記端子配置部３には、コネクタ端子
Ｔと同数の貫通孔４が成形されて、そのまま残る。当然
のことながら、前記貫通孔４の一方（上方）の開口は、
コネクタ端子Ｔで閉塞された状態で成形される。When each connector terminal T is integrally molded with the case body C as described above, the wire connection portion Tb of the connector terminal T housed in the case body C is lifted up. In order to prevent this, it is molded in a state of being pressed to the other of the split molds by a terminal pressing pin (neither is shown) provided on one of the split molds forming the case body C. Therefore, as shown in FIGS. 7 and 8, the same number of through holes 4 as the connector terminals T are formed in the terminal placement portion 3 and remain as they are. As a matter of course, the opening on one side (above) of the through hole 4 is
It is molded in a state of being closed by the connector terminal T.
【０００４】そして、ケース本体Ｃの内部に必要部品を
実装した後に、図８ないし図１０に示されるように、ケ
ース本体Ｃの部品実装面側、及び開口面側に、それぞれ
裏蓋Ｌ1 及び表蓋Ｌ2 を接着剤Ａを用いて接着覆蓋する
ことにより、ケース本体Ｃと裏蓋Ｌ1 及び表蓋Ｌ2 との
密着部の気密を保持して、ケース本体Ｃの内部空間Ｖ2
と外部とを遮断している。裏蓋Ｌ1 は、アルミニウム製
であって、内部に収容された発熱部品からの発熱を放熱
させる機能を有しており、その外側には、多数のフィン
１１が形成されている。一方、表蓋Ｌ2 は、樹脂で成形
されている。また、前記裏蓋Ｌ1 及び表蓋Ｌ2 の接着に
用いた接着剤Ａの硬化は、これを促進させて、作業能率
を高めるために、１３０°Ｃ前後の加熱雰囲気で１時間
程度放置して行っている。After mounting the necessary components inside the case body C, as shown in FIGS. 8 to 10, the back cover L 1 and the back cover L 1 are provided on the component mounting surface side and the opening surface side of the case body C, respectively. By adhesively covering the front cover L 2 with the adhesive A, the airtightness of the close contact portion between the case main body C and the back cover L 1 and the front cover L 2 is maintained, and the internal space V 2 of the case main body C is maintained.
And the outside are cut off. The back lid L 1 is made of aluminum and has a function of radiating the heat generated from the heat generating components housed inside, and a large number of fins 11 are formed on the outer side thereof. On the other hand, the front lid L 2 is made of resin. Further, in order to accelerate the curing of the adhesive A used for bonding the back cover L 1 and the front cover L 2 and to enhance the work efficiency, the adhesive A is left in a heating atmosphere at about 130 ° C. for about 1 hour. I am going.
【０００５】ここで、前記接着剤Ａの硬化時において、
前記各貫通孔４、及びケース本体Ｃの各内部空間Ｖ1,Ｖ
2 が加熱される結果、内部空気が膨張しようとして、各
内部空間Ｖ1,Ｖ2 内の圧力は、温度の上昇に比例して高
まる。そして、ケース本体Ｃの内部空間Ｖ2 は、比較的
薄肉の表蓋Ｌ2 で覆われているために、内部温度の上昇
により前記表蓋Ｌ2 が外方に変形されて、内部空間Ｖ2
の容積が大きくなり得るが、貫通孔４の内部空間Ｖ
1 は、その全周が厚い樹脂壁で囲まれていて殆ど変形し
ないために、内部空間Ｖ1 の容積は、殆ど変化しない。
この結果、貫通孔４の内部空間Ｖ1 の圧力Ｐ1 は、ケー
ス本体Ｃの内部空間Ｖ2 の圧力Ｐ2 よりも高くなると共
に、外部の大気圧力Ｐ0 は、いずれの圧力Ｐ1,Ｐ2 より
も小さい。このため、（Ｐ1 −Ｐ0 ）＞（Ｐ2 −Ｐ0 ）
となって、図９で矢印Ｑで示されるように、貫通孔４内
の空気が接着剤Ａの外側部Ａ1 において、前記端子配置
部３の裏面（接着面）３ａとの間に生じた隙間を通っ
て、貫通孔４内の空気がケース本体Ｃの外に流出する現
象が生ずる。Here, when the adhesive A is cured,
The through holes 4 and the internal spaces V 1 and V of the case body C
As a result of the heating of 2 , the internal air tends to expand, and the pressure in each of the internal spaces V 1 and V 2 increases in proportion to the increase in temperature. Since the internal space V 2 of the case body C is covered with the relatively thin front cover L 2 , the front cover L 2 is deformed outward due to a rise in the internal temperature, and the internal space V 2
, But the internal space V of the through hole 4 can be increased.
Since the entire circumference of 1 is surrounded by a thick resin wall and hardly deforms, the volume of the internal space V 1 hardly changes.
As a result, the pressure P 1 in the internal space V 1 of the through hole 4 becomes higher than the pressure P 2 in the internal space V 2 of the case body C, and the external atmospheric pressure P 0 becomes any of the pressures P 1 , P. Less than two . For this reason, (P 1 -P 0)> (P 2 -P 0)
As shown by the arrow Q in FIG. 9, the air in the through hole 4 is generated between the outer surface A 1 of the adhesive A and the rear surface (adhesive surface) 3 a of the terminal placement portion 3. A phenomenon occurs in which the air in the through hole 4 flows out of the case body C through the gap.
【０００６】この結果、ケース本体Ｃの内部空間（貫通
孔４の内部空間Ｖ1 或いはケース本体Ｃの内部空間Ｖ2)
と外部とが通気可能となって、外部の湿気が内部に吸い
込まれて、実装部品、或いは機器が腐食される。As a result, the internal space of the case body C (the internal space V 1 of the through hole 4 or the internal space V 2 of the case body C)
The outside can be ventilated, the outside moisture is sucked into the inside, and the mounted components or devices are corroded.
【０００７】[0007]
【発明が解決しようとする課題】本発明は、上記したケ
ース一体コネクタにおいて、簡単な構成によって、ケー
ス本体の内部と外部とが通気可能となるのを防止するこ
とを課題としている。SUMMARY OF THE INVENTION It is an object of the present invention to prevent the inside and outside of the case body from being ventilated with a simple structure in the case-integrated connector described above.
【０００８】[0008]
【課題を解決するための手段】上記課題を解決するため
の請求項１の発明は、ケース本体の特定の側壁部の外側
には、コネクタ部が一体成形されていると共に、前記側
壁部の内側には、中央部が前記側壁部に部分インサート
されたコネクタ端子を配置する端子配置部が段差状にな
って形成されて、該端子配置部には、多数の貫通孔が形
成され、前記ケース本体の部品実装面側には、裏蓋が密
封状態で覆蓋されていると共に、その開口側には、表蓋
が同様の状態で覆蓋されて、内部の気密が保持されたケ
ース一体コネクタであって、前記端子配置部の裏面に、
前記貫通孔と前記ケース本体の各内部空間を連通する通
気溝を設けたことを、その特徴としている。According to a first aspect of the invention for solving the above-mentioned problems, a connector portion is integrally formed on the outside of a specific side wall portion of a case body, and the inside of the side wall portion is formed. A terminal placement portion for arranging a connector terminal, the central portion of which is partially inserted into the side wall portion, is formed in a stepped shape, and a large number of through holes are formed in the terminal placement portion. A case-integrated connector in which a back cover is covered in a hermetically sealed state on the component mounting surface side and a front cover is covered in the same state on the opening side to maintain airtightness inside. , On the back surface of the terminal placement portion,
The feature is that a ventilation groove is provided to connect the through hole and each internal space of the case body.
【０００９】請求項１の発明によれば、前記貫通孔とケ
ース本体との各内部空間が、前記端子配置部の裏面に形
成された通気溝を介して連通しているために、裏蓋及び
表蓋をケース本体に密封状態で覆蓋して、その接着剤を
高温雰囲気で硬化させる際において、貫通孔とケース本
体との各内部空間の圧力が同一となって、該貫通孔の内
部空間の圧力のみが、ケース本体の内部空間の圧力より
も高くなることが防止されて、ケース本体内の空気が外
部に流出しなくなる。この結果、ケース本体の内部の密
封が確保されて、外部と通気状態となって、その湿気の
流入により、実装部品、機器等が腐食されるのが防止さ
れる。また、前記通気溝は、ケース本体を型成形する際
の成形面となる端子配置部の裏面に開口して形成される
ので、型側に通気溝を成形する凸部を設けておくことに
より、ケース本体の成形時に同時成形される。このた
め、本発明は、成形工数を全く増大させることなく、実
施可能である。According to the invention of claim 1, since the internal spaces of the through hole and the case body communicate with each other through the ventilation groove formed on the back surface of the terminal arrangement portion, the back cover and the When the front lid is covered in a hermetically sealed state on the case body and the adhesive is cured in a high temperature atmosphere, the pressures in the inner spaces of the through hole and the case body are the same, and the internal space of the through hole becomes Only the pressure is prevented from becoming higher than the pressure in the inner space of the case body, and the air in the case body does not flow out. As a result, the inside of the case body is sealed tightly, the case body is ventilated, and the inflow of moisture prevents the mounted components, devices, etc. from being corroded. Further, since the ventilation groove is formed by opening on the back surface of the terminal placement portion that is the molding surface when molding the case body, by providing a convex portion for molding the ventilation groove on the mold side, Simultaneously molded when molding the case body. Therefore, the present invention can be carried out without increasing the number of molding steps.
【００１０】また、請求項２の発明は、請求項１の発明
を前提として、各貫通孔を接続するように縦方向に形成
された第１通気溝と、該第１通気溝と連通させて、隣接
する各貫通孔の間に横方向に形成された第２通気溝とに
よって、前記通気溝を構成したものであって、コネクタ
端子の直下に通気溝を形成しない構成によって、各貫通
孔とケース本体の内部空間との通気が可能となる。端子
配置部の裏面におけるコネクタ端子の直下の部分に通気
溝を形成すると、端子配置部におけるコネクタ端子の配
置部の部分の肉厚が他の部分よりも薄くなるため、超音
波を利用したワイヤボンディング方法（熱圧着法）によ
って、前記コネクタ端子と他の実装部品の端子とを極細
のボンディングワイヤーで接続する際に、超音波熱圧着
に支障を来すが、請求項２の発明によれば、これを防止
できる。Further, the invention of claim 2 is based on the invention of claim 1, in which a first ventilation groove formed in the longitudinal direction so as to connect each through hole is made to communicate with the first ventilation groove. , The second ventilation groove formed in the lateral direction between adjacent through holes constitutes the ventilation groove, and the ventilation groove is not formed immediately below the connector terminal. Ventilation with the internal space of the case body is possible. If a ventilation groove is formed in the portion of the back surface of the terminal placement portion directly below the connector terminal, the thickness of the portion of the terminal placement portion where the connector terminal is placed becomes thinner than the other portions, so wire bonding using ultrasonic waves is performed. According to the invention of claim 2, ultrasonic thermocompression bonding is hindered when the connector terminal and the terminal of another mounting component are connected by an ultrafine bonding wire by a method (thermocompression bonding method). This can be prevented.
【００１１】[0011]
【発明の実施の形態】以下、実施例を挙げて、本発明を
更に詳細に説明する。図１は、本発明に係るケース一体
コネクタの分解斜視図であり、図２は、ケース本体Ｃの
コネクタ部２及び端子配置部３を破断した状態を下方か
ら見た部分拡大斜視図であり、図３は、組付状態のケー
ス一体コネクタのコネクタ部２及び端子配置部３を主体
に示す拡大縦断面図であり、図４は、端子配置部３の接
着面３ａに対する裏蓋Ｌ1 の接着状態を主体に示す図３
の部分拡大図であり、図５は、図４のＸ−Ｘ線断面図で
あり、図６は、図２のＹ矢視図である。なお、上記した
「従来の技術」の項目で説明した部分と同一部分には、
同一符号を付し、重複説明を避けて、本発明の特徴を構
成する部分についてのみ説明する。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail with reference to Examples. FIG. 1 is an exploded perspective view of a case-integrated connector according to the present invention, and FIG. 2 is a partially enlarged perspective view of a state in which a connector portion 2 and a terminal arrangement portion 3 of a case main body C are broken, viewed from below, FIG. 3 is an enlarged vertical cross-sectional view mainly showing the connector portion 2 and the terminal arrangement portion 3 of the case-integrated connector in the assembled state, and FIG. 4 is a view showing the adhesion of the back cover L 1 to the adhesion surface 3 a of the terminal arrangement portion 3. FIG. 3 mainly showing the state
5 is a partially enlarged view of FIG. 5, FIG. 5 is a sectional view taken along line XX of FIG. 4, and FIG. In addition, the same parts as those described in the above-mentioned "Prior Art",
The same reference numerals will be given, duplicated explanations will be avoided, and only the portions constituting the features of the present invention will be explained.
【００１２】本発明においては、端子配置部３の裏面
（接着面）３ａに、前記貫通孔４の内部空間Ｖ1 とケー
ス本体Ｃの内部空間Ｖ2 とを連通する通気溝が形成され
ている。即ち、図２及び図３に示されるように、端子配
置部３の接着面３ａには、多数の貫通孔４を連通する第
１通気溝５が、その縦方向Ｒに形成され、隣接する各貫
通孔４の間には、前記第１通気溝５と連通する第２通気
溝６が、その横方向Ｓに形成されている。よって、貫通
孔４の内部空間Ｖ1 とケース本体Ｃの内部空間Ｖ2 と
は、第１及び第２の各通気溝５，６を介して通気可能と
なっている。また、第１及び第２の各通気溝５，６は、
成形面となる端子配置部３の裏面（接着面）３ａに開口
しているので、ケース本体Ｃの樹脂成形時に同時成形で
きる。In the present invention, the rear surface of the terminal arrangement portion 3 (adhesive surface) 3a, the inner space V 1 and the inner space V 2 and the ventilation groove communicating the case body C of the through-hole 4 is formed . That is, as shown in FIG. 2 and FIG. 3, the bonding surface 3a of the terminal placement portion 3 is formed with the first ventilation groove 5 communicating with the plurality of through holes 4 in the vertical direction R, and the first ventilation groove 5 is formed adjacent to each other. A second ventilation groove 6 communicating with the first ventilation groove 5 is formed between the through holes 4 in the lateral direction S thereof. Therefore, the internal space V 2 of the inner space V 1 and the case body C of the through-hole 4 has a ventable through the first and second of each ventilation groove 5,6. Further, the first and second ventilation grooves 5, 6 are
Since the opening is formed in the back surface (adhesive surface) 3a of the terminal placement portion 3 that serves as a molding surface, simultaneous molding can be performed during resin molding of the case body C.
【００１３】このため、図３ないし図５に示されるよう
に、端子配置部３の裏面の接着面３ａに接着剤Ａを塗布
して、裏蓋Ｌ1 を接着覆蓋して、高温雰囲気において前
記接着剤Ａを硬化させると、該接着剤Ａは、第１及び第
２の各通気溝５，６に流れ込むが、裏蓋Ｌ1 の接着に必
要な接着剤Ａの量と、第１及び第２の各通気溝５，６の
深さとの関係からして、各通気溝５，６が接着剤Ａで塞
がれないようにすることが可能である。このため、各通
気溝５，６には、それぞれ残溝５ａ，６ａが形成され、
貫通孔４の内部空間Ｖ1 とケース本体Ｃの内部空間Ｖ2
とは、前記各残溝５ａ，６ａを介して通気可能となった
ままである。Therefore, as shown in FIGS. 3 to 5, the adhesive A is applied to the adhesive surface 3a on the back surface of the terminal placement portion 3 and the back lid L 1 is adhesively covered, and the above is performed in a high temperature atmosphere. When the adhesive A is cured, the adhesive A flows into the first and second ventilation grooves 5 and 6, but the amount of the adhesive A required to bond the back cover L 1 and the first and second It is possible to prevent the ventilation grooves 5 and 6 from being blocked by the adhesive agent A in view of the relationship with the depth of the ventilation grooves 5 and 6 of 2. Therefore, residual grooves 5a and 6a are formed in the ventilation grooves 5 and 6, respectively.
Internal space V 2 of the inner space V 1 and the case body C of the through-hole 4
Means that ventilation is still possible through the residual grooves 5a and 6a.
【００１４】このため、ケース本体Ｃと、その部品実装
面側、及び開口側とをそれぞれ閉塞する裏蓋Ｌ1 及び表
蓋Ｌ2 とを接着している接着剤Ａを高温雰囲気で硬化さ
せる際において、各貫通孔４とケース本体Ｃの各内部空
間Ｖ1,Ｖ2 の圧力が同一となって、従来構造のケース一
体コネクタのように、貫通孔４の内部空間Ｖ1 の圧力Ｐ
1 のみが、ケース本体Ｃの内部空間Ｖ2 の圧力Ｐ2 より
も高くなることが防止されて、ケース本体Ｃ内の空気が
外部に流出しなくなる。この結果、ケース本体Ｃの内部
の密閉が確保されて、外部と通気状態となって、その湿
気の流入により、実装部品、機器等が腐食されるのが防
止される。Therefore, when the adhesive A that adheres the case body C and the back lid L 1 and the front lid L 2 that close the component mounting surface side and the opening side, respectively, is cured in a high temperature atmosphere. , The pressures of the through holes 4 and the internal spaces V 1 and V 2 of the case body C become the same, and the pressure P of the internal space V 1 of the through hole 4 becomes the same as in the case integrated connector of the conventional structure.
Only 1 is prevented from becoming higher than the pressure P 2 in the internal space V 2 of the case body C, and the air in the case body C does not flow out. As a result, the inside of the case main body C is sealed, and the case main body C is ventilated from the outside, so that the inflow of moisture prevents the mounted components, devices, etc. from being corroded.
【００１５】また、端子配置部３の裏面におけるコネク
タ端子Ｔの直下の部分に通気溝を形成すると、端子配置
部３におけるコネクタ端子Ｔの配置部の部分の肉厚が他
の部分よりも薄くなるため、超音波を利用したワイヤー
ボンディング方法によって、前記コネクタ端子Ｔと他の
実装部品の端子とを極細の接続ワイヤーＷ（図１及び図
３参照）で接続する際に、超音波熱圧着に支障を来す。
しかし、上記実施例では、貫通孔４の内部空間Ｖ1 とケ
ース本体Ｃの内部空間Ｖ2 とを連通させる通気溝を、上
記した２種類の通気溝５，６で構成することにより、図
６に示されるように、端子配置部３におけるコネクタ端
子Ｔの直下に通気溝が形成されること、換言すれば、前
記貫通孔４からコネクタ端子Ｔと平行に通気溝を形成す
ることを回避しているので、ボンディングワイヤーによ
る上記接続を支障なく行える。Further, when the ventilation groove is formed on the back surface of the terminal placement portion 3 immediately below the connector terminal T, the thickness of the placement portion of the connector placement terminal 3 of the terminal placement portion 3 becomes thinner than the other portions. Therefore, when the connector terminal T and the terminal of another mounting component are connected by the fine connection wire W (see FIGS. 1 and 3) by the wire bonding method using ultrasonic waves, ultrasonic thermocompression bonding is hindered. Come on.
However, in the above embodiment, the vent groove communicating the inner space V 2 of the inner space V 1 and the case body C of the through-hole 4, by configuring two types of ventilation grooves 5, 6 as described above, FIG. 6 As shown in FIG. 3, avoiding that the ventilation groove is formed immediately below the connector terminal T in the terminal arrangement portion 3, in other words, forming the ventilation groove from the through hole 4 in parallel with the connector terminal T is avoided. Therefore, the above-mentioned connection by the bonding wire can be performed without any trouble.
【００１６】また、図１及び図３において、ケース本体
Ｃには、導体２１がエッチングされた基板２２が実装さ
れ、各コネクタ端子Ｔは、前記基板２２の各導体２１と
接続ワイヤーＷを介して接続されており、更に、ケース
本体Ｃには、前記側壁部１と対向する側壁部７に近接し
てブロック状の部品２３が複数個実装されている。In FIGS. 1 and 3, a board 22 having conductors 21 etched is mounted on the case main body C, and each connector terminal T is connected to each conductor 21 of the board 22 via a connecting wire W. Further, a plurality of block-shaped components 23 are mounted on the case main body C in the vicinity of the side wall 7 facing the side wall 1.
【００１７】また、端子配置部３の裏面（接着面）３ａ
に接着剤を塗布する際に、該裏面（接着面）３ａにおけ
る第１通気溝５を境界にして、これよりも外側の第２通
気溝６が形成されていない部分３a1（図２参照）のみに
接着剤を塗布することにより、第１及び第２の各通気溝
５，６内に接着剤が流入するのを防止できて、前記各通
気溝５，６の機能が支障なく発揮される。The back surface (bonding surface) 3a of the terminal placement portion 3
To the time of applying the adhesive, the first ventilation grooves 5 in said back surface (adhesive surface) 3a and the boundary, than this is not formed second ventilation groove 6 of the outer side part 3a 1 (see FIG. 2) By applying the adhesive only to the first and second ventilation grooves 5 and 6, it is possible to prevent the adhesive from flowing into the ventilation grooves 5 and 6, and the functions of the ventilation grooves 5 and 6 can be exhibited without any trouble. .
【００１８】[0018]
【発明の効果】本発明は、ケース一体コネクタにおい
て、ケース本体に一体成形された端子配置部の裏面に、
該端子配置部に設けられた貫通孔とケース本体の内部空
間とを連通する通気溝を設けるという簡単な構成によっ
て、ケース本体の内部と外部とが通気可能となるのを防
止でき、この結果、外気の流入により、実装部品、機器
等が腐食されるのを防止できる。As described above, according to the present invention, in a case-integrated connector, the back surface of the terminal placement portion integrally formed with the case body is
With a simple structure of providing a ventilation groove that communicates the through hole provided in the terminal placement portion with the internal space of the case body, it is possible to prevent the inside and outside of the case body from being ventilated, and as a result, It is possible to prevent mounting components, devices, etc. from being corroded by the inflow of outside air.
【図１】本発明に係るケース一体コネクタの分解斜視図
である。FIG. 1 is an exploded perspective view of a case-integrated connector according to the present invention.
【図２】ケース本体Ｃのコネクタ部２及び端子配置部３
を破断した状態を下方から見た部分拡大斜視図である。FIG. 2 is a connector portion 2 and a terminal arrangement portion 3 of a case body C.
FIG. 3 is a partially enlarged perspective view of a state in which the is broken, as viewed from below.
【図３】本発明に係るケース一体コネクタのコネクタ部
２及び端子配置部３を主体に示す拡大縦断面図である。FIG. 3 is an enlarged vertical sectional view mainly showing a connector portion 2 and a terminal arrangement portion 3 of the case-integrated connector according to the present invention.
【図４】端子配置部３の接着面３ａに対する裏蓋Ｌ1 の
接着状態を主体に示す図３の部分拡大図である。4 is a partially enlarged view of FIG. 3 mainly showing a bonding state of a back cover L 1 to a bonding surface 3a of a terminal placement portion 3.
【図５】図４のＸ−Ｘ線断面図である。5 is a sectional view taken along line XX of FIG.
【図６】図２のＹ矢視図である。FIG. 6 is a view on arrow Y of FIG.
【図７】従来のケース一体コネクタのコネクタ部２及び
端子配置部３を破断した部分拡大斜視図である。FIG. 7 is a partially enlarged perspective view in which a connector portion 2 and a terminal arrangement portion 3 of a conventional case-integrated connector are cut away.
【図８】同じく拡大縦断面図である。FIG. 8 is an enlarged vertical sectional view of the same.
【図９】端子配置部３の裏面に対する裏蓋Ｌ1 の接着状
態を主体に示す図８の部分拡大図である。9 is a partially enlarged view of FIG. 8 mainly showing a bonded state of a back cover L 1 to the back surface of the terminal placement portion 3.
【図１０】ケース本体Ｃの開口部に対する表蓋Ｌ2 の接
着状態を主体に示す図８の部分拡大図である。10 is a partially enlarged view of FIG. 8 mainly showing a bonded state of a front cover L 2 with respect to an opening of a case body C. FIG.
Ｃ：ケース本体 Ｌ1 ：裏蓋 Ｌ2 ：表蓋 Ｔ：コネクタ端子 Ｖ1 ：貫通孔の内部空間 Ｖ2 ：ケース本体の内部空間 ２：コネクタ部 ３：端子配置部 ３ａ：端子配置部の裏面（接着面） ４：貫通孔 ５：第１通気溝 ６：第２通気溝C: Case main body L 1 : Back cover L 2 : Front cover T: Connector terminal V 1 : Internal space of the through hole V 2 : Internal space of the case main body 2: Connector part 3: Terminal arrangement part 3a: Rear surface of terminal arrangement part (Adhesive surface) 4: Through hole 5: First ventilation groove 6: Second ventilation groove
───────────────────────────────────────────────────── フロントページの続き (72)発明者 福西 篤志 愛知県豊田市トヨタ町１番地 トヨタ自 動車株式会社内 (72)発明者 岡田 秀樹 愛知県豊田市トヨタ町１番地 トヨタ自 動車株式会社内 (56)参考文献 特開2000−3753（ＪＰ，Ａ) 特開 昭61−219911（ＪＰ，Ａ) 特開 平10−199608（ＪＰ，Ａ) 特開 平８−64325（ＪＰ，Ａ) 実開 昭62−180952（ＪＰ，Ｕ) 実開 昭64−30625（ＪＰ，Ｕ) 実開 昭60−168172（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01R 13/52 H05K 5/02 H05K 5/06 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Atsushi Fukunishi 1 Toyota Town, Toyota City, Aichi Prefecture Toyota Motor Co., Ltd. (72) Inventor Hideki Okada 1 Toyota Town, Aichi Prefecture Toyota Motor Co., Ltd. ( 56) References JP 2000-3753 (JP, A) JP 61-219911 (JP, A) JP 10-199608 (JP, A) JP 8-64325 (JP, A) 62-180952 (JP, U) Actually opened 64-30625 (JP, U) Actually opened 60-168172 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H01R 13/52 H05K 5/02 H05K 5/06
Claims (2)
コネクタ部が一体成形されていると共に、前記側壁部の
内側には、中央部が前記側壁部に部分インサートされた
コネクタ端子を配置する端子配置部が段差状になって形
成されて、該端子配置部には、多数の貫通孔が形成さ
れ、 前記ケース本体の部品実装面側には、裏蓋が密封状態で
覆蓋されていると共に、その開口側には、表蓋が同様の
状態で覆蓋されて、内部の気密が保持されたケース一体
コネクタであって、 前記端子配置部の裏面に、前記貫通孔と前記ケース本体
の各内部空間を連通する通気溝を設けたことを特徴とす
るケース一体コネクタ。1. The outer side of a specific side wall portion of the case body,
The connector portion is integrally molded, and a terminal arranging portion for arranging a connector terminal, the central portion of which is partially inserted into the side wall portion, is formed in a step shape inside the side wall portion. A large number of through holes are formed in the portion, and a back lid is covered in a sealed state on the component mounting surface side of the case body, and a front lid is covered in the same state on the opening side. A case-integrated connector in which the airtightness of the inside is maintained, wherein a ventilation groove that connects the through hole and each internal space of the case body is provided on the back surface of the terminal placement portion. connector.
に縦方向に形成された第１通気溝と、該第１通気溝と連
通させて、隣接する各貫通孔の間に横方向に形成された
第２通気溝とで構成されることを特徴とする請求項１に
記載のケース一体コネクタ。2. The ventilation groove includes a first ventilation groove formed in a vertical direction so as to connect the respective through holes, and the first ventilation groove is communicated with the first ventilation groove so that a lateral direction is provided between adjacent through holes. to claim 1, characterized in that it is composed of a second ventilation groove formed on
The case integrated connector described .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000320182A JP3417915B2 (en) | 2000-10-20 | 2000-10-20 | Case integrated connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000320182A JP3417915B2 (en) | 2000-10-20 | 2000-10-20 | Case integrated connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002134215A JP2002134215A (en) | 2002-05-10 |
| JP3417915B2 true JP3417915B2 (en) | 2003-06-16 |
Family
ID=18798502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000320182A Expired - Fee Related JP3417915B2 (en) | 2000-10-20 | 2000-10-20 | Case integrated connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3417915B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4156990B2 (en) | 2003-07-29 | 2008-09-24 | 日本圧着端子製造株式会社 | Connector, sealing case with connector and module with connector |
-
2000
- 2000-10-20 JP JP2000320182A patent/JP3417915B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002134215A (en) | 2002-05-10 |
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