JP3413389B2 - Multilayer film capacitor, method of manufacturing the same, and protective film forming apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated film capacitor in which a protective film is formed on a cut surface of a laminated film capacitor element, a manufacturing method thereof, and a film forming apparatus for forming the protective film.

[0002]

2. Description of the Related Art In recent years, with the miniaturization of electronic equipment and high-density mounting, electronic components have been miniaturized and made into chips. Film capacitors, which are one of the electronic components, are being miniaturized and made into chips, and multilayer film capacitors (hereinafter,
It is called a "multilayer film capacitor". ) Has been developed and is becoming widely used.

A laminated film capacitor is manufactured from a laminated film capacitor element obtained by cutting a long capacitor base material having external electrodes formed on both end faces of a metallized film laminate. If the cut surface caused by cutting the capacitor base material is left exposed, moisture may enter from the cut surface and the capacitance may change, or the capacitor may be damaged due to moisture absorbed during reflow processing after mounting. There is. For this reason, conventionally, the laminated film capacitor element is entirely covered with powder resin, or the cut surface is protected by directly applying the resin to the cut surface (for example, Japanese Patent Publication No. 5-6309).
No. 6, JP-A-3-64012).

[0004]

However, the conventional technique has the following problems. That is, when powder resin is used for the exterior, the exterior is formed not only on the cut surface of the laminated film capacitor element but also on the entire laminated film capacitor element, so that the external dimension of the laminated film capacitor becomes large. was there.

Further, as shown in FIG. 8, when the resin 140 is directly applied to the cut surface 120 of the laminated film capacitor element 110 by using the roller 150, the roller 150 causes physical damage to the cut surface 120. In some cases, the insulating structure of the capacitor section 112 of the laminated film capacitor element 110 may be damaged. Furthermore, when the resin 140 is applied by the roller 150, the resin 14
Since the thickness of 0 is about several tens of μm to 100 μm, it is difficult to further reduce the size by reducing the thickness of the resin 140.

Further, in this method, since application is performed by using a roller, application is made to a more compact laminated film capacitor element (for example, laminated film capacitor element having a cut surface 120 area of 10 mm ² or less) 110. In this case, it is often technically difficult to uniformly apply the resin 140 to the cut surface of each element. Further, since the thickness of the resin 140 becomes relatively large with respect to the size of the element, problems such as mounting failure on the substrate and peeling off of the resin 140 have also occurred.

The present invention has been made in view of the above points, and its main object is to provide a laminated film capacitor in which a cut surface of the laminated film capacitor element is protected by a thinner film, and a manufacturing method thereof. It is in. Another object of the present invention is to provide a film forming apparatus for forming a film for protecting a cut surface of a laminated film capacitor element.

[0008]

In a laminated film capacitor according to the present invention, a protective film is formed on a cut surface of a laminated film capacitor element formed by laminating dielectric films having a metal layer formed on at least one surface. A multilayer film capacitor, wherein the protective film comprises a plurality of resin layers each having a thickness of 0.1 μm or more and 1 μm or less, and each of the plurality of resin layers is an electron beam curable resin or an ultraviolet curable resin. It is made of resin and achieves the above object by this configuration.

The electron beam curable resin or the ultraviolet curable resin is preferably an acrylic resin curable by a radical polymerization reaction.

The protective film preferably comprises 10 or more resin layers.

In a preferred embodiment, each of the plurality of resin layers is formed by a vacuum vapor deposition method.

The protective film is preferably made of the same material as the dielectric film.

A method of manufacturing a laminated film capacitor according to the present invention includes a step of forming a protective film on a cut surface of a laminated film capacitor element formed by laminating a dielectric film having a metal layer formed on at least one surface. A method of manufacturing a shaped film capacitor, wherein the step of forming the protective film includes a step of disposing a plurality of laminated film capacitor elements on the outer periphery of a rotatable roll so that the cut surfaces are exposed, While rotating the roll, a step of vacuum-depositing an electron beam curable resin on each cut surface of the plurality of laminated film capacitor elements, and irradiating the electron beam curable resin thus vacuum-deposited with an electron beam to cure the resin. Thereby forming a resin layer having a thickness of 0.1 μm or more and 1 μm or less on the cut surface, and vacuum depositing the electron beam curable resin. And the step of forming the resin layer are repeated to stack the resin layer on the cut surface.

As the electron beam curable resin, it is preferable to use an acrylic resin curable by a radical polymerization reaction.

It is preferable to stack 10 or more resin layers by repeating the step of vacuum-depositing the electron beam curing resin and the step of forming the resin layer.

Another method of manufacturing a laminated film capacitor according to the present invention comprises a step of forming a protective film on a cut surface of a laminated film capacitor element formed by laminating a dielectric film having a metal layer formed on at least one surface. A method of manufacturing a laminated film capacitor including: the step of forming the protective film, the step of disposing a plurality of laminated film capacitor elements on the outer periphery of a rotatable roll so that the cut surface is exposed. A step of vacuum-depositing an ultraviolet curable resin on each cut surface of the plurality of laminated film capacitor elements while rotating the roll, and irradiating the vacuum-deposited ultraviolet curable resin with ultraviolet rays to cure the resin. To form a resin layer having a thickness of 0.1 μm or more and 1 μm or less on the cut surface by vacuum evaporation of the ultraviolet curable resin. The step of laminating the resin layer on the cut surface is repeated by repeating the step and the step of forming the resin layer.

As the ultraviolet curable resin, it is preferable to use an acrylic resin curable by a radical polymerization reaction.

It is preferable to stack 10 or more resin layers by repeating the step of vacuum-depositing the ultraviolet curable resin and the step of forming the resin layer.

In the step of arranging the plurality of laminated film capacitor elements, each cut surface of the plurality of laminated film capacitor elements is made an upper surface, and then a lower surface with respect to the upper surface is provided on an outer periphery of the roll via an adhesive sheet. Preference is given to carrying out by fixing.

The step of arranging the plurality of laminated film capacitor elements is preferably performed by arranging the plurality of laminated film capacitor elements two-dimensionally on the outer circumference of the roll.

In the laminated film capacitor cut surface protection film forming apparatus according to the present invention, a rotary structure is provided in which a plurality of laminated film capacitor elements each having a dielectric film having a metal layer formed on at least one surface are laminated on the outer periphery. A roll that can be used, a vacuum chamber that surrounds the roll, a resin evaporator that is provided in the vacuum chamber, and that heats and evaporates the electron beam curing resin that is vacuum-deposited on the plurality of laminated film capacitor elements; An electron beam irradiator for irradiating the outer circumference of the roll with an electron beam.

In another laminated film capacitor cut surface protection film forming apparatus according to the present invention, a plurality of laminated film capacitor elements formed by laminating dielectric films having a metal layer formed on at least one surface are arranged on the outer periphery. A rotatable roll, a vacuum chamber that surrounds the roll, a resin evaporator that is provided in the vacuum chamber, and heats and evaporates an ultraviolet curable resin that is vacuum-deposited on the plurality of laminated film capacitor elements, And an ultraviolet lamp for irradiating the outer circumference of the roll with ultraviolet rays.

It is preferable that the resin evaporator comprises a heater for heating and evaporating the resin and a hood for guiding the resin heated and evaporated by the heater to the outer circumference of the roll.

A resin supplier connected to the resin evaporator and supplying resin to the resin evaporator may be further provided.

The operation of the present invention will be described below.

In the laminated film capacitor of the present invention,
Since the protective film for protecting the cut surface of the laminated film capacitor element is composed of a plurality of resin layers each having a thickness of 0.1 μm or more and 1 μm or less, the protective film has an arbitrary thickness as compared with the prior art. It becomes possible to For this reason,
The thickness of the protective film can be made thinner than that in the conventional technique, and as a result, the multilayer film capacitor can be further downsized.

As the electron beam curable resin or the ultraviolet curable resin forming each of the plurality of resin layers, an acrylic resin curable by a radical polymerization reaction can be used. Since the thickness of the resin layer per layer is relatively thin, from 0.1 μm to 1 μm, even if 10 or more resin layers are formed,
The protective film can be configured so that it is difficult for the protective film to wrap around the cut surface. Note that each of the plurality of resin layers may be formed by a vacuum evaporation method. When the protective film is formed of the same material as the film included in the capacitor part of the laminated film capacitor, it is possible to provide the laminated film capacitor having the protective film with good adhesion to the capacitor part.

In the method for manufacturing a laminated film capacitor according to the present invention, a step of vacuum-depositing an electron beam curing resin on each cut surface of a plurality of laminated film capacitor elements arranged on the outer periphery of a roll, and a vacuum-deposited electron By repeating the step of curing the radiation curable resin by electron beam irradiation, the resin layer is laminated on the cut surface, so that it is possible to form a protective film having an arbitrary thickness as compared with the conventional technique. Further, since the electron beam curable resin having a high resin curing speed is used, the resin layer can be formed in a short time. As the electron beam curable resin, an acrylic resin curable by a radical polymerization reaction can be used.

Even when 10 or more resin layers are laminated, the thickness of the resin layer per layer is 0.1 μm or more and 1 μm or more.
Since it is relatively thin as follows, the protective film can be formed so that the protective film does not wrap around the cut surface. An ultraviolet curable resin can be used instead of the electron beam curable resin, and an acrylic resin curable by a radical polymerization reaction can be used as the ultraviolet curable resin. If the laminated film capacitor element is fixed to the outer circumference of the roll via the adhesive sheet, work can be performed efficiently. Further, when a plurality of laminated film capacitor elements are two-dimensionally arranged on the outer circumference of the roll, a large amount of laminated film capacitor elements can be processed and throughput can be improved.

The film forming apparatus of the present invention comprises a resin evaporator for heating and evaporating an ultraviolet curable resin to be vacuum-deposited on a plurality of laminated film capacitor elements, and an electron beam for irradiating the outer circumference of a roll with an electron beam. Since the irradiator is provided, the protective film can be formed without physically damaging the cut surface. As a result, it is possible to prevent damage to the insulating structure of the capacitor portion of the laminated film capacitor element, and improve the yield of the laminated film capacitor. Further, the protective film can be formed on the laminated film capacitor element having a small cut surface area without any technical difficulty. An ultraviolet lamp may be used instead of the electron beam irradiator.

As the resin evaporator, one provided with a heater for heating and evaporating the resin and a hood for guiding the resin heated and evaporated by the heater to the outer circumference of the roll can be used. As the resin, a resin supply device for supplying a resin can be used.

[0032]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, for simplification of description, components having substantially the same function are designated by the same reference numeral. (Embodiment 1) A laminated film capacitor according to the present invention will be described with reference to FIGS. 1 and 2. Figure 1
The entire laminated film capacitor 100 according to the present invention is schematically shown, and FIG. 2 schematically shows a cross section of the laminated film capacitor 100.

Multilayer film capacitor 1 according to the present invention
00 is the cut surface 1 of the laminated film capacitor element 10.
6 has a protective film 20 formed on it. The laminated film capacitor element 10 includes a capacitor portion 12 having a structure in which dielectric thin films (films) and metal layers are alternately laminated, and external electrodes (metallikon) 14 formed on both side surfaces of the capacitor portion 12. In addition, the cut surface 16 of the laminated film capacitor element 10 is located on the front surface and the back surface with respect to the upper surface 12a of the capacitor portion. The cut surface 16 is generated when the long-sized capacitor base material is cut to obtain the laminated film capacitor element 10 (see, for example, FIG. 2 of JP-A-4-332111).

In the present invention, from the viewpoint of increasing the capacity of the capacitor, the dielectric thin film of the capacitor section 12
Is preferably formed of an acrylic resin. In addition, aluminum is used as a metal layer sandwiching the dielectric thin film, and the external electrode 14 is made of zinc. The dielectric thin film is not limited to acrylic resin, and may be formed of polyester film (for example, PET film), PPS film, or the like. Further, for example, Ni may be used as the material forming the metal layer instead of aluminum.

The laminated film capacitor element 10
Is not particularly limited, the distance between the external electrodes 14 is, for example, about 0.5 to 5 mm, the distance between the cut surfaces 16 is, for example, about 1.0 to 5.0 mm, and the area of the cut surfaces is, for example. It is about 1.0 to 10 mm ² . In this embodiment, the laminated film capacitor element 10 having the distance between the external electrodes 14 of 1.6 mm, the distance between the cut surfaces 16 of 3.2 mm, and the area of the cut surfaces of 5.12 mm ² was used.

As shown in FIG. 2, the protective film 20 formed on the cut surface 16 of the laminated film capacitor element 10 is
It has a plurality of resin layers 22, and the thickness of each resin layer 22 is about 0.1 μm to about 1 μm. Resin layer 2
Each of the two is made of an electron beam curable resin or an ultraviolet curable resin. The reason for using the electron beam curable resin or the ultraviolet curable resin is that the curing time of the resin is fast. In this embodiment, an acrylic resin curable by a radical polymerization reaction is used as the electron beam curable resin or the ultraviolet curable resin. In addition, "acrylic resin" here means
Not only resins made of acrylic acid but also resins made of acrylate are included.

Since the protective film 20 is formed by laminating an arbitrary total number of resin layers 22 each of which can be made extremely thin, the thickness L of the protective layer 20 can be controlled with high accuracy. For this reason, it becomes possible to make the thickness of the protective film thinner than in the prior art. The thickness L of the protective layer 20 may be appropriately determined according to the required conditions and is not particularly limited, but is preferably about 1 to 10 μm, and about 5 μm from the viewpoint of protecting the cut surface.

The protective film 20 is formed of, for example, 10 or more resin layers 2
Even in the case of the two-layer structure, since the plurality of resin layers 22 each having a small thickness per layer are laminated, there is an advantage that the protective film 20 is hard to wrap around the cut surface 16. Therefore, the protective film 20 can prevent the laminated film capacitors adjacent to each other from being firmly adhered to each other. The number of layers of the resin layer 22 may be appropriately determined according to required conditions and is not particularly limited, but is, for example, about 2 to 100 layers, and from the viewpoint of the strength of the protective layer, about 30 to 80 layers. It is preferable. The resin layer 22 can be formed by, for example, a vacuum vapor deposition method.

In the present invention, it is preferable to form the protective film 20 from the same material (acrylic resin) as the film (dielectric thin film) of the capacitor section 12. By doing so, the adhesiveness between the capacitor portion 12 and the protective film 20 can be improved. Further, use of the capacitor portion 12 including a film made of acrylic resin is preferable from the viewpoint of increasing the capacity, but often causes a problem from the viewpoint of moisture resistance. According to the present invention, even in such a case, the cut surface 1
It is possible to effectively prevent moisture absorption from 6 to the condenser unit 12. The protective film 20 may be formed using a material (acrylic resin) different from the film (for example, polyester) of the capacitor section 12.

In this embodiment, a laminated film capacitor 100 having a protective film 20 in which about 20 resin layers 22 each having a thickness of 0.3 μm are laminated is manufactured. Multilayer film capacitor 100 having such protective film 20
As a result, it was found that it has excellent moisture resistance and has sufficient mechanical strength.

Multilayer film capacitor 1 according to the present invention
00, the protective film 20 having the plurality of resin layers 22 is formed on the cut surface 16 of the laminated film capacitor element 10. For this reason, the thickness of the protective film can be made thinner than in the prior art, and as a result, it is possible to provide a further downsized laminated film capacitor.
It should be noted that the laminated film capacitor 100 has the external electrode 1
4 may have a discrete type (lead type) configuration in which external leads are further attached, or may have a chip type configuration in which further external electrodes are formed on the external electrodes 14 so as to be surface-mounted. Further, for the purpose of increasing the mechanical strength or the like, the obtained laminated film capacitor may be provided with an exterior.

Next, with reference to FIGS. 3 to 5, a method of manufacturing the laminated film capacitor 100 according to the present invention and a cut surface protective film forming apparatus used therefor will be described.

First, before describing the method for manufacturing the laminated film capacitor 100, the film forming apparatus 500 for forming the protective film 20 of the laminated film capacitor 100 will be described. FIG. 3 shows a film forming apparatus 500 according to this embodiment.
The internal structure of is shown schematically.

The film forming apparatus 500 shown in FIG.
0, a vacuum chamber 60 surrounding the roll 50, a resin evaporator 70 provided in the vacuum chamber 60, and an electron beam irradiator 80 for irradiating the outer periphery 52 of the roll 50 with an electron beam. There is.

The roll 50 can have a plurality of laminated film capacitor elements 10 arranged on the outer periphery 52 and can continuously rotate in the direction of arrow 54 (of course, it can also rotate in the opposite direction of arrow 54). May be done). The roll 50 can rotate at a predetermined speed, for example, 1
It can be rotated at about 0 to 100 m / min. Note that only the outer circumference 52 may be configured to be rotatable, or the entire roll 50 may be configured to be rotatable. Further, the roll 50 may be cooled by a cooler (not shown) in order to prevent a thermal influence at the time of resin vapor deposition and shorten the resin curing time.

Referring again to FIG. Outer 5 of roll 50
2, a plurality of laminated film capacitor elements 10 can be arranged, for example, as shown in FIG. That is, the cut surface 16 of each of the plurality of laminated film capacitor elements 10 becomes the upper surface, and the lower surface with respect to the upper surface is provided with the adhesive sheet 56 and the outer circumference 52 of the roll 50.
Stick to. By doing this, each cut surface 1 on the upper surface side
6 can be efficiently exposed in the vacuum chamber 60. Further, a plurality of laminated film capacitor elements 10 are arranged in a matrix form (two-dimensionally) on the outer periphery 52 of the roll 50 without gaps, and the periphery thereof is covered with the masking tape 58. The shaped film capacitor element 10 can be processed, and it is possible to prevent only the cut surface 16 from being exposed.

The vacuum chamber 60 surrounding the roll 50 is reduced
It is connected to a pressure device (not shown) and
The interior 62 can be depressurized. For example, 1x
10 ^-1~ 1 x 10^-3It can be about Pa.
The resin evaporator 70 provided in the vacuum chamber 60 is
A heater 72 for heating and evaporating the supplied resin,
The resin heated and evaporated by the heater 72 is rolled 50
And a hood 74 that guides it to the outer periphery 52.

A resin supplier 90 for supplying resin may be connected to the resin evaporator 70. The resin supplier 90 used in the present embodiment has an external tank 92 having a container in which a resin (for example, acrylic resin) 98 supplied to the resin evaporator 70 is placed, and the external tank 92 and the resin evaporator 70 are connected to each other. And a valve 96 provided in a part of the pipe 94 for adjusting the supply amount of the resin 98. Since one end of the pipe 94 is arranged in the resin 98, it is possible to supply the resin 98 from the external tank 92 to the resin evaporator 70 via the pipe 95 by increasing the internal pressure of the external tank 92.

An electron beam irradiator 80 for irradiating the outer periphery 52 of the roll 50 with an electron beam is provided to cure the resin vacuum-deposited by the resin supplier 70.
In this embodiment, the degree of vacuum and contamination,
That is, from the viewpoint of making it difficult to mix impurities into the vacuum chamber 60, the heater 72 with the roll 50 interposed therebetween.
An electron beam irradiator 80 is provided so as to face the.
The electron beam irradiator 80 includes a filament 82 and an anode 84.
And a high-voltage power supply 86 electrically connected to them, and can irradiate an electron beam accelerated between -1 kV and -10 kV, for example.

Next, a method of manufacturing the laminated film capacitor 100 will be described with reference to FIG. FIG. 5 shows a flowchart for explaining the manufacturing method of the present embodiment.

First, a laminated film capacitor element 10 is manufactured by cutting a long capacitor base material having external electrodes 14 formed on both end surfaces of a plurality of laminated metallized films using a known method. Create.

Next, for example, as shown in FIG. 4, a plurality of laminated film capacitor elements 10 are attached to the film forming apparatus 50.
It is arranged on the outer periphery 52 of the roll 50 of 0 (step S10
1).

Next, the degree of vacuum in the inside 62 of the vacuum chamber 60 is set to about 5 × 10 ^-2 Pa, and the roll 50 is rotated. The rotation speed of the roll 50 is set to about 80 m / min, and the temperature of the roll 50 is set to about 20 ° C. by a cooler (not shown). Then, while rotating the roll 50, the electron beam curable resin (for example, acrylic resin) heated and evaporated by the resin evaporator 70 is used to cut the cut surfaces 16 of each of the plurality of laminated film capacitor elements 10.
Is vacuum-deposited (step S102). In this embodiment,
An acrylic resin curable by radical polymerization reaction was used as the electron beam curable resin. The resin evaporation rate of the resin evaporator 70 is, for example, about 0.1 μm / layer.

Next, when the roll 50 rotates in the direction of arrow 54, the vacuum-deposited electron beam curing resin is irradiated with an electron beam (for example, about 5 kV) from the electron beam irradiator 80 to be cured. This is the case (step S103). In this way, the thickness is about 0.1 μm to 1 μm (for example,
A resin layer 22 of about 0.3 μm) is formed on the cut surface 16.

Next, when the roll 50 further rotates, the heated and evaporated electron beam curable resin is vacuum-deposited again on the resin layer 22 formed on the cut surface 16 (step S102). Then, as the roll 50 rotates, the vacuum-deposited electron beam curable resin is cured by the electron beam from the electron beam irradiator 80, and the second resin layer 22 is formed (step S103).

Thereafter, by repeating step S102 and step S103, a plurality of resin layers 22 are laminated and the protective film 20 is formed on the cut surface 26 (step S10).
4). By doing so, for example, 10 or more resin layers 2
The protective film 20 composed of 2 can be obtained. Then, after removing the plurality of laminated film capacitor elements 10 from the outer periphery 52 of the roll 50, the same process is performed on the other cut surface 26 (the cut surface on which the protective film 20 is not yet formed). Just go.

According to the present embodiment, even when 10 or more (for example, about 20) resin layers 22 are laminated, the protective layer 20 should firmly adhere to the protective film 20 of the adjacent laminated film capacitor. In addition, the protective film 20 did not peel off from the laminated film capacitor element 10 even when the laminated film capacitors were individually formed. On the other hand, in the conventional method of directly applying to the cut surface, when the resin having a thickness of several tens of μm or more is applied at one time, the resins on the cut surfaces of the adjacent laminated film capacitor elements come into contact with each other, As a result, the present inventor has confirmed by experiments that the protective film peels off when the individual laminated film capacitors are formed.

According to this embodiment, unlike the prior art in which the resin is directly applied to the cut surface, the protective film 20 is formed by the vacuum deposition method, so that physical damage to the cut surface 16 is avoided. be able to. As a result, it is possible to prevent the insulating structure of the capacitor portion 12 of the laminated film capacitor element 10 from being damaged, and it is possible to improve the manufacturing yield of the laminated film capacitor. Further, because of the vacuum deposition method, even for the laminated film capacitor element 10 having a small area of the cut surface 16,
The protective film 20 can be formed without technical difficulty.

Further, since the protective film is formed by laminating the resin layer 22 having a thickness of about 0.1 μm to 1 μm, it is easier to control the thickness of the protective film 20 as compared with the prior art, and It is possible to form the thin protective film 20. As a result, a smaller laminated film capacitor can be manufactured, and in addition, the material cost of the protective film 20 can be reduced. (Embodiment 2) Embodiment 2 of the present invention will be described with reference to FIGS.

This embodiment is different from the first embodiment in that a combination of an ultraviolet curable resin and an ultraviolet lamp is used instead of the combination of the electron beam curable resin and the electron beam irradiator used in the first embodiment. In order to simplify the description of the present embodiment, the points different from the first embodiment will be mainly described below, and the description of the same points as the first embodiment will be omitted.

FIG. 6 shows a film forming apparatus 6 according to this embodiment.
00 schematically shows the internal structure of 00. The film forming apparatus 600 of this embodiment is provided with an ultraviolet lamp 40 instead of the electron beam irradiator 80 of the film forming apparatus 500. The ultraviolet lamp 40 has a function of curing the ultraviolet curable resin (for example, acrylic resin) 99 which is heated and evaporated by the resin evaporator 70 and vacuum-deposited on the cut surface 16. The irradiation condition of the ultraviolet lamp 40 is, for example, about 400W.

Compared with the electron beam irradiation of the first embodiment, the curing speed of the resin is slower by the ultraviolet irradiation, so in this embodiment, the rotation speed of the roll 50 is slower than that of the first embodiment, and the resin evaporator 70 is used. The evaporation rate of the resin due to is also reduced.

FIG. 7 shows a flow chart for explaining the manufacturing method of this embodiment. First, the first embodiment
In the same manner as in step S101, the plurality of laminated film capacitor elements 10 are arranged on the outer periphery 52 of the roll 50 (step S201). Next, while rotating the roll 50 (rotational speed is about 40 m / min), the ultraviolet curable resin (for example, acrylic resin) heated and evaporated by the resin evaporator 70 is applied to each of the plurality of laminated film capacitor elements 10. Vacuum deposition is performed on the cut surface 16 (step S20).
2). In this embodiment, an acrylic resin curable by a radical polymerization reaction is used as the ultraviolet curable resin. The resin evaporation rate of the resin evaporator 70 is, for example, about 0.1 μm / layer.

Next, the vacuum-deposited electron beam curing resin is cured by the ultraviolet rays of the ultraviolet lamp 40 (step S20).
3). Thus, the resin layer 22 having a thickness of about 0.1 μm to 1 μm (for example, about 0.3 μm) is cut into the cut surface 16
Form on top. Hereinafter, by repeating step S202 and step S203, the protective film 20 composed of a plurality of resin layers 22 is formed on the cut surface 26 (step S20).
4). The laminated film capacitor 100 having the protective film 20 can also be manufactured by such a manufacturing method.

[0065]

According to the present invention, the cut surface of the laminated film capacitor element is protected by the protective film composed of a plurality of resin layers each having a thickness of 0.1 μm or more and 1 μm or less. The protective film can have an arbitrary thickness as compared with the conventional technique. Therefore, it is possible to provide a laminated film capacitor having a protective film thinner than that of the conventional technique, and as a result, it is possible to further miniaturize the laminated film capacitor. Further, according to the present invention, it is possible to provide a film forming apparatus for forming a protective film composed of a plurality of resin layers each having a thickness of 0.1 μm or more and 1 μm or less.

[Brief description of drawings]

FIG. 1 is a perspective view schematically showing a laminated film capacitor 100 according to a first embodiment.

FIG. 2 is a cross-sectional view schematically showing the laminated film capacitor 100 according to the first embodiment.

FIG. 3 is a cross-sectional view schematically showing the internal structure of the film forming apparatus 500 according to the first embodiment.

FIG. 4 is a perspective view showing an example of a state in which a plurality of laminated film capacitor elements 10 are arranged on an outer circumference 52 of a roll 50.

FIG. 5 is a flowchart for explaining a method of manufacturing the laminated film capacitor 100 according to the first embodiment.

FIG. 6 is a sectional view schematically showing an internal structure of a film forming apparatus 600 according to a second embodiment.

FIG. 7 is a flowchart for explaining a method of manufacturing the laminated film capacitor 100 according to the second embodiment.

FIG. 8 is a perspective view showing a conventional laminated film capacitor.

[Explanation of symbols] 100 Multilayer film capacitor 10 Multilayer film capacitor element 12 Capacitor section 14 External electrode (metallikon) 16 cut surface 20 Protective film 22 Resin layer 40 UV lamp 50 rolls 52 perimeter 54 rotation direction 56 Adhesive sheet 58 Masking tape 60 vacuum chamber 62 Inside of vacuum chamber 70 resin evaporator 72 Heater 74 Hood 80 electron beam irradiator 82 filament 84 Anode 90 resin feeder 92 External tank 94 pipe 96 valves 98 resin 110 Multilayer film capacitor element 112 Capacitor section 120 cutting plane 130 exterior 140 resin 150 rollers 500,600 Film forming equipment

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kiyoshi Naito 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Shoichi Ishikura 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. Company (72) Inventor Masashi Moriwaki 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Kenji Fukumitsu 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (56) Reference Reference Japanese Patent Laid-Open No. 64-77913 (JP, A) Actual Development 63-114019 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01G 4/00-4/40

Claims (17)

(57) [Claims] 1. A laminated film capacitor having a protective film formed on a cut surface of a laminated film capacitor element comprising a dielectric film having a metal layer formed on at least one surface thereof, wherein the protective film comprises: Thickness per layer is 0.1μm or more 1μ
A laminated film capacitor comprising a plurality of resin layers each having a thickness of m or less, each of the plurality of resin layers being formed of an electron beam curable resin or an ultraviolet curable resin. 2. The laminated film capacitor according to claim 1, wherein the electron beam curable resin or the ultraviolet curable resin is an acrylic resin curable by a radical polymerization reaction. 3. The laminated film capacitor according to claim 1, wherein the protective film is composed of 10 or more resin layers. 4. The laminated film capacitor according to claim 1, wherein each of the plurality of resin layers is formed by a vacuum deposition method. 5. The laminated film capacitor according to claim 1, wherein the protective film is made of the same material as the dielectric film. 6. A method of manufacturing a laminated film capacitor, which comprises a step of forming a protective film on a cut surface of a laminated film capacitor element in which a dielectric film having a metal layer formed on at least one surface is laminated, The step of forming the protective film includes the step of disposing a plurality of laminated film capacitor elements on the outer periphery of a rotatable roll so that the cut surfaces are exposed, and the plurality of laminated layers while rotating the roll. The electron beam curable resin is vacuum-deposited on each cut surface of the shaped film capacitor element, and the electron beam curable resin thus vacuum-deposited is irradiated with an electron beam to be cured to have a thickness of 0.1 μm or more. By repeating a step of forming a resin layer of 1 μm or less on the cut surface, a step of vacuum-depositing the electron beam curing resin, and a step of forming the resin layer. Thus, a method of manufacturing a laminated film capacitor, including the step of laminating the resin layer on the cut surface. 7. The method for producing a laminated film capacitor according to claim 6, wherein an acrylic resin curable by a radical polymerization reaction is used as the electron beam curable resin. 8. The laminated type according to claim 6, wherein 10 or more resin layers are laminated by repeating a step of vacuum-depositing the electron beam curing resin and a step of forming the resin layer. Film capacitor. 9. A method of manufacturing a laminated film capacitor, which comprises a step of forming a protective film on a cut surface of a laminated film capacitor element in which a dielectric film having a metal layer formed on at least one surface is laminated. The step of forming the protective film includes the step of disposing a plurality of laminated film capacitor elements on the outer periphery of a rotatable roll so that the cut surfaces are exposed, and the plurality of laminated layers while rotating the roll. A vacuum-deposited UV-curing resin is vacuum-deposited on each cut surface of the shaped film capacitor element, and the vacuum-deposited UV-curable resin is irradiated with ultraviolet rays to be cured to have a thickness of 0.1 μm or more and 1 μm or less Repeating the step of forming a resin layer on the cut surface, the step of vacuum-depositing the ultraviolet curable resin, and the step of forming the resin layer. I, comprising a step of laminating the resin layer on the cut surface, multilayered film manufacturing method of the capacitor. 10. The acrylic resin curable by a radical polymerization reaction is used as the ultraviolet curable resin.
A method of manufacturing the laminated film capacitor described in. 11. The resin layer of 10 or more layers is laminated by repeating the step of vacuum-depositing the ultraviolet curable resin and the step of forming the resin layer.
Or the laminated film capacitor as described in 10 above. 12. The step of arranging the plurality of laminated film capacitor elements comprises using the cut surface of each of the plurality of laminated film capacitor elements as an upper surface and then the lower surface with respect to the upper surface of the roll through an adhesive sheet. It is carried out by fixing to the outer circumference.
1. The method for manufacturing a laminated film capacitor according to any one of 1. 13. The method according to claim 6, wherein the step of disposing the plurality of laminated film capacitor elements is performed by arranging the plurality of laminated film capacitor elements two-dimensionally on the outer circumference of the roll. A method for manufacturing the laminated film capacitor according to any one of claims. 14. A rotatable roll on which a plurality of laminated film capacitor elements each having a dielectric film having a metal layer formed on at least one surface thereof are laminated, and a vacuum chamber surrounding the roll. A resin evaporator provided in the vacuum chamber for heating and evaporating an electron beam curable resin to be vacuum-deposited on the plurality of laminated film capacitor elements, and an electron beam for irradiating the outer circumference of the roll with an electron beam. An apparatus for forming a cut surface protective film for a laminated film capacitor, which comprises an irradiator. 15. A rotatable roll on which a plurality of laminated film capacitor elements each having a dielectric film having a metal layer formed on at least one surface thereof are laminated, and a rotatable vacuum chamber surrounding the roll. A resin evaporator provided in the vacuum chamber for heating and evaporating an ultraviolet curable resin to be vacuum-deposited on the plurality of laminated film capacitor elements; and an ultraviolet lamp for irradiating the outer circumference of the roll with ultraviolet rays. A laminated film capacitor cutting surface protective film forming device comprising. 16. The resin evaporator according to claim 14, further comprising a heater for heating and evaporating the resin, and a hood for guiding the resin heated and evaporated by the heater to the outer circumference of the roll. Of multi-layer film capacitor cut surface protection film forming device. 17. The multilayer film capacitor cut surface protection according to claim 14, further comprising a resin supplier connected to the resin evaporator and supplying resin to the resin evaporator. Film forming equipment.