JP3408928B2 - Method of manufacturing piezoelectric element - Google Patents
Method of manufacturing piezoelectric elementInfo
- Publication number
- JP3408928B2 JP3408928B2 JP18406696A JP18406696A JP3408928B2 JP 3408928 B2 JP3408928 B2 JP 3408928B2 JP 18406696 A JP18406696 A JP 18406696A JP 18406696 A JP18406696 A JP 18406696A JP 3408928 B2 JP3408928 B2 JP 3408928B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- plate
- piezoelectric
- metal film
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】
【０００１】
【産業上の利用分野】 本発明は、圧電振動子や圧電発
振器等に使用される圧電素板の製造方法に関する。
【０００２】
【従来の技術】 厚みすべり振動モードで圧電素板を使
用する場合、その圧電素板の振動部分は使用周波数にあ
わせて厚みを調整しなければならない。例えば、厚みす
べり基本波振動モードの二十数ＭＨｚ以下の比較的低い
周波数で使用する圧電振動子の素板の場合は、素板全体
をエッチングにより板厚を数百μｍ〜１００μｍ位に加
工しているが、厚みすべり基本波振動モードで数十ＭＨ
ｚ以上の比較的高い周波数で使用しようする圧電素板の
場合は、素板の振動部分の板厚は数十μｍ以下と極めて
薄くする必要がある。しかし板厚が薄くなることで圧電
素板自体の物理的強度は著しく低下してしまう。この使
用周波数の比較的高い（板厚の薄い）圧電素板の物理的
強度を、使用周波数の比較的低い（板厚の厚い）圧電素
板と同等並にするため、板厚が極めて薄くなった振動部
分の周囲に、振動部分よりも板厚を厚くした部分（補強
部分）を有する形状の圧電素板が使用されている。
【０００３】 前述したような振動部分の周囲に補強部
分を有する使用周波数が比較的高い圧電素板を製造する
場合、フォトリソグラフィ法を用いて形状加工するのが
一般的である。フォトリソグラフィ法を用いた、振動部
分の周囲に振動部分よりも板厚の厚い補強部分を有する
使用周波数が比較的高い圧電素板の製造工程を図２に示
す。なお図２の工程図は圧電素板を側面方向から図示し
ている。まず圧電素板１表裏面全体に金属膜２を蒸着
し、その圧電素板１の金属膜２上の面全体にレジスト膜
１１を形成し、このレジスト膜１１を圧電素板１の補強
部分４のレジスト膜等が残るパターンで露光現像してレ
ジストマスクを形成し、エッチング処理により板厚の薄
い振動部分３を形成する。最後に圧電素板上に残った金
属膜＋レジスト膜を剥離除去する方法がある。
【０００４】
【発明が解決しようとする課題】 しかし振動部分と補
強部分とを有するような、使用周波数が比較的高い圧電
素板の製造方法にフォトリソグラフィ法を用いるに伴
い、従来の使用周波数が比較的低い圧電素板の製造機器
及び製造工程とは別に、新たに露光器，現像器等のフォ
トリソグラフィ法に使用する機器及びその製造工程数の
増加を生じてしまう。
【０００５】 本発明は上記した従来の課題を鑑みなさ
れたもので、その目的は、フォトリソグラフィ法を用い
ないで、板厚の薄い振動部分の周囲に振動部分の板厚よ
り厚い補強部分を有する、使用周波数が比較的高い圧電
素板の製造方法を提供することにある。
【０００６】
【課題を解決するための手段】 本発明の製造方法は、
上記目的を達するため、まず洗浄された複数の圧電素板
をスペーサに整列させて、そのスペーサの表裏に各圧電
素板のそれぞれの振動域にあたる部分を覆うようなマス
クを装着する。次にマスク及びスペーサにて固定被覆さ
れた複数の圧電素板に金属膜を蒸着する。次に振動域を
除いた部分に金属膜を蒸着された複数の圧電素板を表裏
両面から同時にエッチング処理し、金属膜が覆っていな
い振動域部分を板表裏両方面から所望の板厚まで薄くす
る。次に圧電振動板の補強部分に残っている金属膜を剥
離除去することを特徴とする。
【０００７】
【実施例】 図１は本発明の製造方法を表した工程図で
ある。本実施例では圧電素板１として、切り出しモード
がＡＴカットの円形水晶素板を使用している。また図１
の工程図においては圧電素板を側面方向から図示してい
る。まず、素板外形を円形に、また素板全体の板厚を補
強部分が所望する板厚まで加工した圧電素板１を洗浄液
および純水等で洗浄する。なお圧電素板１は結晶軸方向
を明確にするため、外形の一部分が切除してある。
【０００８】 なお、本実施例では円形水晶素板を使用
しているが、素板材はタンタル酸リチウム等の他の単結
晶圧電材でもよく、また素板外形は角形や矩形でもよ
い。
【０００９】 次に、洗浄した複数個の圧電素板１を、
圧電素板１の外形寸法より僅かに大きい孔部９を複数個
有するスペーサ５の、その孔部９に填める。圧電素板１
およびスペーサ５の孔部９は円外形の一部分が切除され
完全な円形ではないため、孔部９内で圧電素板が動いた
り回転することはない。
【００１０】 次に、複数個の圧電素板を収納したスペ
ーサ５の表裏両面に、圧電素板１の振動部分３を被覆す
るようなパターンを有するマスク６を装着する。マスク
６の圧電素板１に該当する部分のパターンは、圧電素板
１より僅かに大きい円孔部１０と、圧電素板の振動域に
あたる部分を被覆する被覆部７と、円孔部１０外縁と被
覆部７とを結ぶ橋部８とで構成されている。被覆部７は
スペーサ５表裏面に装着するマスク間で同形及び対向す
るよう形成され、橋部８はスペーサ５表裏面に装着する
マスク間において必ず対向しないよう形成される。この
スペーサ５及びマスク６の一部分を拡大した斜視図を図
５に示す。
【００１１】 なお、本実施例ではマスク６の被覆部７
の形状を円形、橋部８をその円形の被覆部７の接線方向
に円孔部１０外縁まで直線で形成しているが、マスクの
被覆部の形状は角形や矩形でもよく、また橋部の形状は
圧電素板表裏面で対向箇所がなく、また振動に影響を与
えないかぎり自由である。
【００１２】 次に、上記マスク６を装着した複数個の
圧電素板１表裏両面に、マスク６上から金属膜２を蒸着
する。金属膜２はマスク６の被覆部７及び橋部８で覆わ
れた部分以外の圧電素板１両面上に蒸着される。なお、
本実施例では、圧電素板上にまずＣｒ膜を蒸着し、その
Ｃｒ膜上にＡｕ膜を蒸着した２層構造の金属膜を形成し
ている。
【００１３】 次に、マスク６及びスペーサ５から金属
膜２が蒸着された複数個の圧電素板１を取り出し、取り
出した圧電素板１を整列ジグに配列し、水晶のエッチャ
ント液により圧電素板１表裏両方面からエッチングを行
う。エッチングにより圧電素板１両面の金属膜２で被覆
されていない部分（被覆部７及び橋部８で被覆された部
分）の板厚を化学的に腐食溶解することで、振動部分３
の板厚を所望の周波数に合う板厚にする。橋部８は圧電
素板表裏面で対向していないため、橋部８にあたる部分
の素板板厚は、エッチング後もエッチングされていない
補強部分４の板厚の半分以上の板厚を有しており、物理
的強度は十分に得られている。
【００１４】 次に、補強部分４にＡｕ＋Ｃｒ２層の金
属膜２を有し、また振動部分３を表裏両方面からのエッ
チングにより得た圧電素板１の、補強部分４表裏面に残
った２層の金属膜２をそれぞれのエッチャント液により
溶融剥離する。次に残った圧電素板１を純水及び洗浄液
等で洗浄することで、振動部分の周囲に補強部分を有す
る圧電素板が得られる。
【００１５】
【発明の効果】 振動部分の周囲に補強部分を有する使
用周波数の比較的高い圧電素板の製造に、フォトリソグ
ラフィ法を用いず、本発明による圧電素板の製造方法を
用いることで、設備及び工程数の増加を抑えることがで
き、安価で簡易に振動部分の周囲に補強部分を有する使
用周波数の比較的高い圧電素板を得ることができる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a piezoelectric element used for a piezoelectric vibrator or a piezoelectric oscillator. 2. Description of the Related Art When a piezoelectric element is used in a thickness shear vibration mode, the thickness of the vibrating portion of the piezoelectric element must be adjusted in accordance with the frequency used. For example, in the case of a base plate of a piezoelectric vibrator to be used at a relatively low frequency of less than 20 MHz of the thickness-shear fundamental wave vibration mode, the entire base plate is processed to a thickness of about several hundred μm to 100 μm by etching. Tens of MH in the thickness-shear fundamental wave vibration mode
In the case of a piezoelectric element to be used at a relatively high frequency of z or more, the thickness of the vibrating portion of the element needs to be extremely thin, not more than several tens of μm. However, the physical strength of the piezoelectric element itself is remarkably reduced as the sheet thickness is reduced. Since the physical strength of the piezoelectric element having a relatively high operating frequency (thin plate thickness) is equivalent to that of the piezoelectric element having a relatively low operating frequency (thick plate), the sheet thickness becomes extremely thin. A piezoelectric element plate having a portion (reinforcement portion) having a greater thickness than the vibrating portion is used around the vibrating portion. [0003] In the case of manufacturing a piezoelectric element having a relatively high working frequency and having a reinforcing portion around the vibrating portion as described above, it is general to shape it using a photolithography method. FIG. 2 shows a manufacturing process of a piezoelectric element plate using a photolithography method and having a reinforcing portion having a thicker plate than the vibrating portion around the vibrating portion and having a relatively high use frequency. Note that the process diagram of FIG. 2 illustrates the piezoelectric element plate from the side. First, a metal film 2 is deposited on the entire front and back surfaces of the piezoelectric element 1, and a resist film 11 is formed on the entire surface of the piezoelectric element 1 on the metal film 2. A resist mask is formed by exposing and developing with a pattern in which the resist film or the like remains, and a vibration portion 3 having a small thickness is formed by etching. Finally, there is a method of removing and removing the metal film + resist film remaining on the piezoelectric element plate. However, with the use of photolithography in a method of manufacturing a piezoelectric element having a relatively high operating frequency having a vibrating portion and a reinforcing portion, the conventional operating frequency is Apart from the relatively low piezoelectric element manufacturing equipment and manufacturing process, new equipment such as an exposure device and a developing device used for the photolithography method and the number of manufacturing processes are increased. The present invention has been made in view of the above-described conventional problems, and has as its object to provide a reinforcing portion thicker than a vibrating portion around a vibrating portion having a small thickness without using a photolithography method. Another object of the present invention is to provide a method for manufacturing a piezoelectric element plate having a relatively high use frequency. Means for Solving the Problems The production method of the present invention comprises:
In order to achieve the above object, a plurality of cleaned piezoelectric plates are first aligned with a spacer, and a mask is attached to the front and back of the spacer so as to cover a portion corresponding to a vibration region of each piezoelectric plate. Next, a metal film is deposited on the plurality of piezoelectric plates fixedly covered with the mask and the spacer. Next, a plurality of piezoelectric plates on which a metal film is deposited on the portion excluding the vibration region are simultaneously etched from both front and back surfaces, and the vibration region portion not covered by the metal film is thinned from both the front and back surfaces to a desired plate thickness. I do. Next, the metal film remaining on the reinforcing portion of the piezoelectric vibration plate is peeled and removed. FIG. 1 is a process chart showing a manufacturing method of the present invention. In this embodiment, a circular crystal element plate whose cutting mode is AT cut is used as the piezoelectric element plate 1. FIG.
In the process drawing of (1), the piezoelectric element plate is shown from the side. First, the piezoelectric element plate 1 in which the outer shape of the element plate is made circular and the thickness of the entire element plate is processed to the desired thickness of the reinforcing portion is washed with a cleaning liquid, pure water or the like. Note that the piezoelectric element plate 1 is partially cut off in order to clarify the crystal axis direction. In this embodiment, a circular quartz plate is used. However, the plate member may be another single crystal piezoelectric material such as lithium tantalate, and the outer shape of the plate may be square or rectangular. Next, the plurality of cleaned piezoelectric element plates 1 are
The spacer 5 having a plurality of holes 9 slightly larger than the outer dimensions of the piezoelectric element plate 1 is fitted into the holes 9. Piezoelectric plate 1
Since the hole 9 of the spacer 5 is not completely circular because a part of the circular outer shape is cut off, the piezoelectric element plate does not move or rotate in the hole 9. Next, a mask 6 having a pattern that covers the vibrating portion 3 of the piezoelectric element 1 is mounted on both front and back surfaces of the spacer 5 containing a plurality of piezoelectric elements. The pattern of the portion of the mask 6 corresponding to the piezoelectric element 1 includes a circular hole 10 slightly larger than the piezoelectric element 1, a covering part 7 covering a portion corresponding to a vibration region of the piezoelectric element 1, and an outer edge of the circular part 10. And a bridge portion 8 that connects the cover portion 7. The covering portion 7 is formed so as to have the same shape and oppose each other between the masks mounted on the front and back surfaces of the spacer 5, and the bridge portion 8 is formed so as not to necessarily oppose between the masks mounted on the front and back surfaces of the spacer 5. FIG. 5 is an enlarged perspective view showing a part of the spacer 5 and the mask 6. In this embodiment, the covering portion 7 of the mask 6 is used.
Is formed in a circular shape, and the bridge portion 8 is formed in a straight line up to the outer edge of the circular hole portion 10 in the tangential direction of the circular cover portion 7. However, the shape of the mask cover portion may be square or rectangular. The shape is free as long as there are no opposing portions on the front and back surfaces of the piezoelectric element and the vibration is not affected. Next, a metal film 2 is deposited on the front and back surfaces of the plurality of piezoelectric plates 1 on which the mask 6 is mounted, from above the mask 6. The metal film 2 is vapor-deposited on both surfaces of the piezoelectric element 1 except for the portion covered by the covering portion 7 and the bridge portion 8 of the mask 6. In addition,
In this embodiment, a two-layer metal film is formed by first depositing a Cr film on a piezoelectric element plate and depositing an Au film on the Cr film. Next, a plurality of piezoelectric elements 1 on which the metal film 2 has been deposited are taken out from the mask 6 and the spacer 5, the taken out piezoelectric elements 1 are arranged in an alignment jig, and the piezoelectric elements 1 are formed using a quartz etchant. 1 Etching is performed from both front and back surfaces. The vibrating portion 3 is formed by chemically corroding and dissolving the thickness of the portion of the piezoelectric element 1 that is not covered with the metal film 2 (the portion covered with the covering portion 7 and the bridge portion 8) by etching.
Is set to a thickness suitable for a desired frequency. Since the bridge portions 8 are not opposed to each other on the front and back surfaces of the piezoelectric element plate, the plate thickness of the portion corresponding to the bridge portion 8 is more than half the plate thickness of the reinforcing portion 4 which is not etched even after etching. And the physical strength is sufficiently obtained. Next, two layers remaining on the front and back surfaces of the reinforcing portion 4 of the piezoelectric element plate 1 having the Au + Cr two-layer metal film 2 on the reinforcing portion 4 and the vibrating portion 3 obtained by etching from both front and back surfaces The metal film 2 is melt-peeled with each etchant liquid. Next, the remaining piezoelectric element 1 is washed with pure water, a cleaning liquid, or the like, whereby a piezoelectric element having a reinforcing portion around the vibrating portion is obtained. According to the present invention, a method for manufacturing a piezoelectric element according to the present invention is used, without using a photolithography method, for manufacturing a piezoelectric element having a relatively high working frequency having a reinforcing portion around a vibrating portion. In addition, it is possible to suppress an increase in the number of facilities and steps, and to obtain a piezoelectric element plate having a relatively high working frequency having a reinforcing portion around the vibrating portion at low cost and easily.
【図面の簡単な説明】
【図１】図１には本願実施例における圧電素板製造工程
図を示す。
【図２】図２には従来技術における圧電素板製造工程図
を示す。
【図３】図３には本願発明による圧電素板の一例の斜視
図を示す。
【図４】図４（ａ）及び図４（ｂ）には本願発明による
圧電素板の一例の平面図を示す。
【図５】図５には本願発明におけるスペーサ及びマスク
の一部分を拡大した斜視図を示す。
【符号の説明】
１ 圧電素板
２ 金属膜
５ スペーサ
６ マスクBRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a manufacturing process of a piezoelectric element plate according to an embodiment of the present invention. FIG. 2 is a view showing a process of manufacturing a piezoelectric element in the prior art. FIG. 3 is a perspective view of an example of a piezoelectric element plate according to the present invention. 4 (a) and 4 (b) are plan views of an example of the piezoelectric element plate according to the present invention. FIG. 5 is an enlarged perspective view of a part of a spacer and a mask according to the present invention. [Description of Signs] 1 piezoelectric element plate 2 metal film 5 spacer 6 mask
フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 41/22 Continuation of front page (58) Field surveyed (Int.Cl. 7 , DB name) H01L 41/22
Claims (1)
分より厚みの厚い補強部分を有する圧電素板の製造方法
において、 複数の圧電素板をスペーサに整列させ、該スペーサの表
裏面にマスクを装着する工程と、該マスク上から金属膜
を該圧電素板の表裏両面に蒸着する工程と、該圧電素板
の該金属膜の付着部分以外の箇所を該圧電素板の表裏両
方面からエッチングで所望の板厚まで薄くする工程と、
該圧電素板から該金属膜を剥離する工程を備えたことを
特徴とする圧電素板の製造方法。(57) [Claim 1] In a method of manufacturing a piezoelectric element having a vibrating part and a reinforcing part surrounding the vibrating part and having a thickness greater than the vibrating part, a plurality of piezoelectric elements are used as spacers. Aligning and mounting a mask on the front and back surfaces of the spacer; depositing a metal film on the front and back surfaces of the piezoelectric element from above the mask; and a portion of the piezoelectric element plate other than where the metal film is attached. A step of etching to a desired plate thickness from both the front and back surfaces of the piezoelectric element plate,
A method for manufacturing a piezoelectric element, comprising a step of removing the metal film from the piezoelectric element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18406696A JP3408928B2 (en) | 1996-06-25 | 1996-06-25 | Method of manufacturing piezoelectric element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18406696A JP3408928B2 (en) | 1996-06-25 | 1996-06-25 | Method of manufacturing piezoelectric element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1012944A JPH1012944A (en) | 1998-01-16 |
| JP3408928B2 true JP3408928B2 (en) | 2003-05-19 |
Family
ID=16146791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18406696A Expired - Fee Related JP3408928B2 (en) | 1996-06-25 | 1996-06-25 | Method of manufacturing piezoelectric element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3408928B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100633281B1 (en) | 2004-05-27 | 2006-10-12 | 전자부품연구원 | Method of manufacturing crystal blank |
| JP4803299B2 (en) * | 2009-12-03 | 2011-10-26 | セイコーエプソン株式会社 | Piezoelectric vibrating piece, piezoelectric vibrator and piezoelectric oscillator |
-
1996
- 1996-06-25 JP JP18406696A patent/JP3408928B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1012944A (en) | 1998-01-16 |
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