JP3407514B2 - Liquid ejection device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microdevice capable of accurately ejecting minute droplets. Moreover,
The present invention relates to an inkjet printer head that ejects ink as minute droplets to form a desired image on an object to be printed.

[0002]

2. Description of the Related Art Conventionally, a microdevice as described in, for example, Japanese Patent Application Laid-Open No. 7-176770 has been known (conventional example 1).

FIG. 7 (a) is a plan view showing the structure of the micropump disclosed in Conventional Example 1, and FIG. 7 (b) is shown in FIG.
It is an AA 'sectional view of (a). In the figure, 201 is a first substrate, 202 is a second substrate made of silicon, 203 is a membrane portion (hereinafter referred to as a diaphragm), 204 is a third substrate, 20
Reference numerals 5 and 206 are electrodes, 207 is a lead electrode, 208 is a lead electrode lead portion, 209 is a fluid inlet, and 210 is a fluid outlet.

Fluid is injected through the fluid inlet 209,
It is filled between the second substrate 202 and the third substrate 204.
Electrode 2 facing electrode 205 formed on diaphragm 203
By controlling the voltage with respect to 06, and vibrating the vibrating plate 203 up and down, the fluid can be ejected from the fluid ejection port 210.

[0005]

However, recently, there has been a demand for a smaller and cheaper liquid ejecting apparatus in terms of cost and function. Specifically, for example, in an inkjet print head in which a liquid ejection device is applied to an inkjet printer, there is a very high demand for increasing the array density of ejection ports in order to print a higher-definition image. Further, regarding the discharge amount of the liquid, it is required to easily control the supply amount of the liquid by discharging finer liquid droplets with high accuracy. Specifically, the requirement that the amount of droplets is 10 to 30 ng per droplet is required especially when the liquid ejection device is applied to an inkjet head. The diameter and shape of the discharge port are very important for accurately discharging fine droplets.

Under such a background, for example, the conventional example 1
In the case of, it is not only necessary to make the liquid pressurizing chamber very large, but also the liquid ejection port has a problem that it is difficult to reduce the diameter to a sufficient size for ejecting fine droplets. There is. Further, there is no description about the liquid pressurizing chamber near the liquid discharge port.

Further, in order to miniaturize the ink jet head, it is necessary to narrow the width of the liquid pressurizing chamber and to thin the partition wall between the liquid pressurizing chambers. This is to increase the array density of the liquid ejection ports and realize miniaturization.

However, narrowing the width of the liquid pressurizing chamber and thinning the partition between the liquid pressurizing chambers have two major problems.

First, by thinning the partition walls between the liquid pressurizing chambers, when the liquid in the adjacent liquid pressurizing chambers is pressurized, the pressure applied to the liquid acts on the partition walls to cause the partition walls to bend. come. When the partition wall bends, the pressure in the liquid pressurizing chamber, which is not originally pressurized, rises and the liquid is ejected. This is generally called crosstalk, and is a phenomenon that appears remarkably depending on the height and thickness of partition walls. In order to suppress crosstalk, the partition wall must have a certain height and thickness.

Second, by narrowing the width of the liquid pressurizing chamber, it becomes difficult to use a nozzle having an ejection port (hereinafter referred to as a nozzle) shape capable of ejecting ink accurately in an ink jet head or the like. That is the point. Hereinafter, such a problem will be described.

As to the shape of the discharge port, for example, as disclosed in German International Patent No. 1511397 and known,
It is effective that the cross section has a shape that widens toward the back surface of the nozzle plate. Further, regarding the thickness of the nozzle plate, as disclosed in detail in the ink jet recording head of Japanese Patent Laid-Open No. 5-177834, a certain thickness is required to ensure mechanical strength. Specifically, 8
It is described that a thickness of about 0 μm or more is necessary.

Therefore, the diameter of the discharge port is, for example, 30 μm.
m, and the thickness of the nozzle plate is set to 80 μm, the liquid pressurizing surface has a diameter of at least 70 μm.
m, preferably about 90 μm is required.

For example, in the ink jet head described in JP-A-6-55733, as shown in FIG. 8, the ink cavity 104, the reservoir 105 and the ink supply port 10 are provided.
Silicon substrate 103 on which 6 is formed, and silicon substrate 1
Nozzle plate 101 having a nozzle 102 and a diaphragm 10 joined to a silicon substrate 103.
7 and a piezoelectric element 108 bonded to the vibrating plate 107 and bonded to the ink cavity 104 as described above.

As described above, since the width of the liquid pressurizing chamber (hereinafter, the liquid pressurizing chamber of the ink jet head is referred to as an ink cavity) becomes narrower, the ink jet of FIG. 9 (BB 'sectional view of the ink jet head of FIG. 8). As shown in the schematic cross-sectional view of the head, the ink cavity 10 of the nozzle 102 is
The width of the ink cavity 104 may be narrower than that of the opening on the fourth side. The formation of the acute-angled concave portion 102a at the joining portion between the nozzle 102 and the ink cavity 104 in this way makes it easier for bubbles generated or flowing in the ink cavity 104 to accumulate in the acute-angled concave portion 102a, which hinders the ink flow. In addition, precise ink ejection becomes difficult. Further, there is a problem in that the ink flow is disturbed by the acute-angled concave portion 102a, and the ink ejection amount and ejection speed are not stable.

Therefore, in the liquid ejecting apparatus of the present invention, the width of the liquid pressurizing chamber is made narrower so that the liquid pressurizing chamber can be made higher in density, and an acute-angled concave portion is formed at the joint between the liquid pressurizing chamber and the liquid ejecting port. However, the purpose is to obtain a high-density and stable liquid ejection device. It is another object of the present invention to provide a liquid ejecting apparatus having no crosstalk, since the partition wall between the liquid pressurizing chambers is formed thin only in the vicinity of the connecting portion with the nozzle.

[0016]

According to another aspect of the present invention, there is provided a liquid ejecting apparatus comprising a liquid pressurizing chamber having a plurality of liquid pressurizing chambers formed in single crystal silicon, a discharge port communicating with the liquid pressurizing chamber, and the liquid. Supply port for supplying liquid to the pressurizing chamber and pressurizing the plurality of liquids
A liquid ejecting apparatus, which is provided for each chamber and has a pressurizing unit including a piezoelectric element that generates a pressure in each of the liquid pressurizing chambers.
Therefore , the liquid pressurizing chamber is provided in
Portion composed of other parts on the inlet side and communicating with the outlet
Width is wider than that of other parts and liquid pressure is applied to the discharge port
It is formed wider than the diameter of the chamber side and the other parts
The piezoelectric element corresponding to the liquid pressurizing chamber
It is characterized by Further, the liquid ejection device of the present invention,
A liquid pressurizing chamber; a discharge port communicating with the liquid pressurizing chamber;
A supply port for supplying a liquid to the liquid pressurizing chamber, and the plurality of liquids
It is provided for each pressurizing chamber and generates pressure in each liquid pressurizing chamber.
Ejecting device having pressurizing means composed of a piezoelectric element
And a portion facing the discharge port of the liquid pressurizing chamber
The width of the position is on the side of the discharge port facing the liquid pressurizing chamber.
Is formed larger than the hole diameter, and
The width of the region facing the pressurizing means is equal to that of the liquid at the discharge port.
It is formed smaller than the hole diameter on the side facing the pressure chamber.
It is characterized by

Further, the discharge port is communicated with a plurality of liquid pressurizing chambers.

[0018]

Further, the piezoelectric element is composed of at least a lower electrode layer, a piezoelectric material formed on the lower electrode layer, and an upper electrode layer formed on the piezoelectric material. .

Further, a vibrating plate is formed below the piezoelectric element formed for the liquid pressurizing chamber.

Further, the discharge port is in a range of a slope portion formed at an end of the liquid pressurizing chamber.

[0022]

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to the drawings by way of embodiments.

(Embodiment 1) First, an embodiment of an ink jet head using a silicon substrate in which an ink cavity is formed, to which the liquid ejection apparatus of the present invention can be suitably applied, will be described.

FIG. 1 (a) is a plan view of an example in which the liquid ejection apparatus of the present invention is applied to an ink jet head, and FIG. 1 (b) is a sectional view taken along the line CC 'of FIG. 1 (a). is there. In the figure, 101 is a nozzle plate, 102 is a nozzle, and 103.
Is a silicon substrate, 104 is an ink cavity, 105
Is a reservoir, 106 is an ink supply port, 107 is a vibrating plate, and 108 is a piezoelectric element. Further, 109 is the nozzle 1
It is a wide portion formed near 02.

The ink filled in the reservoir 105 is introduced into the ink cavity 104 through the supply port 106. On the other hand, the piezoelectric element 10 formed on the vibrating plate 107
8 is bent toward the ink cavity 104 side by an electric field applied between electrodes (not shown), and generates pressure in the ink cavity 104. Although part of the pressurized ink flows back to the ink supply port 106, the nozzle 102
Is ejected as an ink droplet.

Now, the structure of the nozzle 102 for accurately ejecting a minute ink droplet will be described. In the inkjet head, a nozzle plate 101 having a thickness of about 90 μm is generally used because of its mechanical strength. The diameter of the ejection surface of the nozzle 102 is 35.
A diameter of about μm is suitable. In addition, the nozzle 102
A suitable diameter of the ink cavity 104 side is about 80 μm. That is, it is desirable that the cross-sectional shape of the nozzle 102 be a smooth conical shape from the ink cavity 104 side to the ejection surface. This is because the amount of ink droplets to be ejected can be stabilized with high accuracy by smoothing the flow of ink in the nozzles.

FIG. 2 is an enlarged sectional view of the ink cavity portion in the DD ′ direction of FIG. 1 (a). FIG. 2 shows a sectional view of three cavities. A silicon substrate 103 having an ink cavity 104 bonded on the nozzle 102 is bonded. In particular, the ink cavity 10 at the joint between the silicon substrate 103 and the nozzle plate 101.
4 is a part of the partition wall of the nozzle 10 on the joint surface of the nozzle 102.
A wide portion 109 wider than the diameter of 2 is formed.

A mechanism for generating pressure in the ink cavity 104 will be described with reference to FIG.

First, by applying an electric field to the piezoelectric element 108 in the vertical direction in the figure, the piezoelectric element 108 tends to deform in the direction of the arrow A in the figure. At this time, the stress acting between the vibrating plate 107 and the vibrating plate 107 causes the vibrating plate 107 and the piezoelectric element 108 to deform in the direction of B in the figure. Generally, the amount of deformation of the vibrating plate 107 and the piezoelectric element 108 in the direction of B in the figure is referred to as the amount of displacement.

The amount of displacement depends on the piezoelectric constant of the piezoelectric element 108, the stress due to the electric field strength applied to the piezoelectric element 108, and the vibration plate 10.
Bending rigidity of 7, Young's modulus and ink cavity 10
It is almost determined by the size of 4. Assuming that the piezoelectric constant of the piezoelectric element 108 is substantially constant, it is necessary to obtain a higher electric field strength when driving the piezoelectric element with a lower applied voltage as described above. In this case, the piezoelectric element 1
It is desirable that the film thickness of 08 be thinner. However,
When the film thickness of the piezoelectric element 108 is thin, the generated stress is reduced. Therefore, in order to obtain a constant displacement amount, it is necessary that the bending rigidity of the vibration plate 107 is small. Therefore,
It is desirable that the diaphragm 107 also has a smaller thickness. However, a pressure above a certain level is generated in the ink filled in the ink cavity 104, and the nozzle 102
In order to eject the necessary ink from the diaphragm 107,
Requires a certain degree of rigidity.

So, we create the necessary pressure in the ink cavity 104 filled with ink, and
The structure required for driving the piezoelectric element 108 with a drive voltage of a certain level or less was examined in detail. As a result, it has been found that the best result is obtained when the width of the ink cavity 104 is about 40 to 50 μm.

However, since the diameter of the nozzle 102 on the side of the ink cavity 104 is preferably about 80 μm as described above, when the nozzle 102 and the silicon substrate 103 are bonded, the ink cavity 10 of the nozzle 102 is joined.
Since the nozzle openings on the fourth side are blocked, it becomes difficult to eject fine ink with high accuracy.

Therefore, in the first embodiment, as shown in FIGS. 1 and 2, the ink cavity wide portion 109 is formed only in the vicinity of the nozzle 102, and the fine ink can be formed without expanding the width of the entire ink cavity 104. It is designed so that the ink can be discharged accurately.

Further, in FIG. 1B, 110 is a sloped portion formed at the end of the ink cavity 104. For example, when the inclined surface portion 110 uses a substrate having a (110) plane orientation as the silicon substrate 103 and is anisotropically etched with an alkaline solution such as KOH, (11)
It is a (111) plane that appears at an angle of about 35 degrees with respect to the (0) plane. As is apparent from the figure, the inclined surface portion 110 contacts the nozzle plate 101 at an angle of about 35 degrees. The presence of the portion surrounded by the narrow angle in the ink cavity 104 as described above facilitates the accumulation of bubbles in the ink or generated bubbles in the narrow angle portion. This makes it difficult to eject ink accurately because the pressure generated by the piezoelectric element 108 decreases. Bubbles are usually discharged from the ink cavity 104 by a method such as suction from the nozzle 102. However, it is difficult to discharge bubbles particularly in such a narrow angle portion because the ink is retained therein. Therefore, as in the present invention, the nozzle 102 is provided with the slope 1 of the (111) plane.
Arranging at a position corresponding to 10 is important for preventing ink retention and efficiently discharging bubbles.

Since the formation of the ink cavity wide portion 109 in the ink jet head as in the first embodiment has a further remarkable effect, it will be described with reference to FIG.

The three piezoelectric elements 108 shown in FIG.
Of these, when the piezoelectric elements 108 at both ends are driven, the ink pressure in the ink cavities 104 at both ends rises,
The partition wall made of the silicon substrate 103, which constitutes the central ink cavity 104, bends in the direction of C in the figure.
As a result, the pressure in the central ink cavity 104 rises, and ink is ejected from the central nozzle 102. Such a phenomenon is generally called crosstalk and is an abnormal ejection operation.

For such crosstalk, it is effective to reduce the height of the partition wall and increase the thickness of the partition wall. However, when the silicon substrate 103 is used as in this embodiment, the silicon substrate 103
Due to manufacturing restrictions, the maximum thickness is about 200 μm. Therefore, increasing the thickness of the partition wall is important for preventing crosstalk. Generally, the arrangement pitch of the nozzles 102 is fixed at a pitch of 180 DPI (dots per inch) or the like. Therefore, in order to increase the thickness of the partition wall, it is necessary to narrow the width of the ink cavity 104. For example, when the ink cavities 104 are arranged at 180 DPI, the pitch is 141 μm pitch. However, as described above, narrowing the width of the ink cavity 104 becomes larger than the diameter of the nozzle 102 on the ink cavity 104 side. Even in such a case, by expanding the width of the cavity 104 only in the vicinity of the nozzle 102, a sufficient partition wall thickness that does not cause crosstalk is ensured, and a nozzle plate 101 having a nozzle shape with good ejection characteristics is used. Is what you can do.

Here, a manufacturing method for forming such a liquid ejecting apparatus as an ink jet head will be described with reference to FIGS. First, FIG.
A silicon substrate 10 having a plane orientation (110) as shown in (a)
A silicon oxide layer 112 is formed on 3 by a method such as thermal oxidation. Next, as a piezoelectric element, a Pt lower electrode layer 108-1,
The PZT piezoelectric layer 108-2 and the Pt upper electrode layer 108-3 are formed by a method such as sputtering and appropriately patterned by a method such as general photolithography. This Pt
The structure of the PZT piezoelectric layer 108-2 sandwiched between the electrode layers of the lower electrode layer 108-1 and the Pt upper electrode layer 108-3 functions as a piezoelectric element due to the voltage applied between the upper and lower electrodes. After that, the surface on which the piezoelectric element is formed is the active surface,
The opposite surface is referred to as the back surface.

Next, as shown in FIG. 3B, the silicon oxide layer 112 on the back surface is patterned (first silicon oxide etching step).

Next, as shown in FIG. 3 (c), the silicon oxide layer 112 at the portion where the ink cavity wide portion 109 where the ink cavity is partially wide and the portion where the ink supply port 106 is formed is changed to another portion. Half etching is performed as the thickness becomes smaller than that of the silicon oxide layer 112 (second
Silicon oxide etching step).

Next, as shown in FIG. 3D, the silicon substrate 103 in the portion where the silicon oxide layer 112 is removed in the first silicon oxide etching step is anisotropically etched using an etchant such as a KOH solution. By doing so, the ink cavity 104 and the reservoir 105 are formed. At this time, the slope portion 110 having the plane orientation (111) appears (first silicon etching step).

Next, as shown in FIG. 3E, thin silicon oxide is half-etched in the second silicon oxide etching step to form the ink cavity wide portion 109 and the ink supply port 106. The layer 112 is removed, and the silicon oxide layer 112 is etched so that the silicon oxide layer 112 at the other portions is left (third silicon oxide etching step).

Next, as shown in FIG. 3F, the silicon substrate 10 in the portion removed in the third silicon oxide etching step.
By half-etching 3, the ink cavity wide portion 109 and the ink supply port 106 in which the ink cavity is partially wide are formed.

Example 2 In Example 1, a lower electrode layer and
An example in which the piezoelectric layer and the upper electrode layer are formed on a silicon substrate having a silicon oxide layer by a method such as sputtering has been described. In the second embodiment, a case will be described where silicon having a silicon oxide layer is etched from both sides to form a liquid ejection device as an ink cavity of an inkjet head.

FIG. 4 (a) is a cross-sectional view in which the liquid ejection apparatus of the present invention is applied to an ink jet head, and silicon having an oxide silicon layer is etched from both sides to form an ink cavity of the ink jet head. is there. 4B is a plan view of the ink cavity of FIG. 4A.

As described above, the silicon substrate 103 having the (110) plane orientation is etched with an etchant such as KOH to form the ink cavity 104 and the ink supply port 10.
6. Form the reservoir 105. At this time, the silicon oxide layer (not shown) on the side of the nozzle plate 101 and the silicon oxide layer on the side of the vibrating plate 107 are used as etching masks to match the pattern shapes of the silicon oxide layers on both sides, so that the (110) plane is formed. The ink cavity 104 surrounded by the vertical (111) plane can be formed.
Then, as described in the first embodiment, the ink cavity wide portion 109 is formed as shown in FIG. 4B using the silicon oxide half etching technique. Next in FIG.
As shown in (a), the nozzle plate 101 having the nozzle 102, the vibrating plate 107, and the piezoelectric element 108 are joined by a method such as bonding to obtain an inkjet head.

(Embodiment 3) An ink jet head having a plurality of ink cavities communicating with one nozzle will be described.

FIG. 5 is a plan view of an ink jet head in which a plurality of ink cavities of the present invention are connected to one nozzle.

As in the first embodiment, the piezoelectric element 108 is formed on the vibrating plate 107. In the present embodiment, one nozzle 102 has a first ink cavity 104-
In this structure, the first ink cavity 104-2 and the second ink cavity 104-2 are connected to each other.

The special effect of the ink jet head in which a plurality of ink cavities are connected to one nozzle in this way will be described with reference to FIG. As described in the first embodiment, the structure required for generating the necessary pressure in the ink cavity 104 filled with ink and driving the piezoelectric element 108 with a driving voltage of a certain level or less is the ink cavity. A suitable width of the tee 104 is about 40 to 50 μm. The volume of ink ejected from the nozzles 102 (ink amount) is determined by the volume reduction of the ink cavity 104 (hereinafter referred to as the excluded volume) due to the vibration plate 107 bending in the direction of B in the figure. Therefore, when it is attempted to increase the amount of ink ejected from the nozzles 102 by a certain amount or more, it is necessary to increase the length of the ink cavity 104. However, increasing the length of the ink cavity 104 leads to an increase in the size of the inkjet head and an increase in cost. Therefore, as in this embodiment, by forming two or more plural ink cavities in parallel and ejecting ink from one nozzle 102, the length of the ink cavity 104 is lengthened. It is possible to obtain a larger excluded volume without having to do so.

(Embodiment 4) An example in which the liquid ejecting apparatus of the present invention is applied to a micro pump for accurately conveying a small amount of liquid will be described.

FIG. 6 shows an example in which the liquid discharge device of the present invention is applied to a micro pump for conveying a small amount of liquid.
5 is a reservoir, 106a is a liquid supply port, 104a is a liquid cavity, and 102 is a nozzle. Reservoir 1
The supply of the liquid to the nozzle 05 and the removal of the liquid from the nozzle 102 can be appropriately selected depending on the application. As a method of pressurizing the liquid in the liquid cavity 104a, a piezoelectric element, an electrostatic actuator, a method utilizing foaming by heating, or the like can be used.

A plurality of liquid cavities 10 as shown in FIG.
4a is connected to one nozzle 102 to control the number of liquid cavities 104a to be driven,
The dynamic range of the amount of ejected liquid can be widened. Further, by precisely controlling the pressure in each liquid cavity 104a, it is possible to carry out liquid transfer with extremely high accuracy.

[0055]

As described above, according to the present invention, it is possible to reduce driving energy and use a discharge port having a smooth shape, and further, to prevent crosstalk between adjacent liquid pressurizing chambers. It is possible to obtain a liquid ejecting apparatus that can eject finer droplets with high accuracy while reducing the number of droplets.

Further, by connecting a plurality of liquid pressurizing chambers to one discharge port, it is possible to obtain a liquid discharge device having a smaller size and higher controllability.

Furthermore, the liquid ejecting apparatus of the present invention can be applied to an apparatus for ejecting a very small amount of liquid such as an ink jet head or a micro pump, and it is possible to improve the ejection accuracy.

[Brief description of drawings]

1A and 1B are diagrams of an inkjet head, which is an embodiment of a liquid ejection device of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a sectional view taken along line CC ′ of FIG.

FIG. 2 is an enlarged cross-sectional view of an inkjet head that is an embodiment of the liquid ejection device of the present invention.

FIG. 3 is a cross-sectional view showing a method of manufacturing an inkjet head, which is an embodiment of the liquid ejection device of the present invention.

FIG. 4 is a diagram showing a case where a silicon ink cavity of an ink jet head, which is an embodiment of a liquid ejection device of the present invention, is formed from both sides, (a) is a cross-sectional view,
(B) is a plan view of the ink cavity and the nozzle plate.

FIG. 5 is a plan view of an ink jet head in which a plurality of ink cavities communicate with one nozzle, which is an embodiment of the liquid ejection apparatus of the present invention.

FIG. 6 is a plan view of a micropump, which is an embodiment of the liquid ejection device of the present invention.

FIG. 7 is a diagram showing a conventional micropump, (a)
Is a plan view and (b) is a sectional view taken along the line AA ′ of (a).

FIG. 8 is a schematic view of a conventional inkjet head.

9 is a cross-sectional view of the inkjet head of FIG.

[Explanation of symbols]

101: Nozzle plate 102: nozzle 102a: a concave part with an acute angle 103: Silicon substrate 104: Ink cavity 104a: Liquid cavity 105: Reservoir 106: Ink supply port 106a: Liquid supply port 107: diaphragm 108: Piezoelectric element 108-1: Lower electrode layer 108-2: Piezoelectric layer 108-3: Upper electrode layer 109: Wide part of ink cavity 110: Slope of ink cavity 112: Silicon oxide layer 201: First substrate 202: Second substrate 203: Membrane part 204: Third substrate 205, 206: electrodes 207: Lead electrode 208: Lead electrode lead portion 209: Fluid inlet 210: Fluid outlet

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-6-55733 (JP, A) JP-A-5-309835 (JP, A) JP-A-3-297653 (JP, A) JP-A-6- 191028 (JP, A) JP 7-89074 (JP, A) JP 7-195682 (JP, A) JP 55-3916 (JP, A) JP 7-137266 (JP, A) JP-A-5-62964 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) B41J 2/045 B41J 2/055 B41J 2/16 B41J 2/175

Claims (6)

(57) [Claims] 1. A liquid pressurizing chamber, a discharge port communicating with the liquid pressurizing chamber, a supply port for supplying a liquid to the liquid pressurizing chamber,
A liquid ejecting apparatus comprising: a pressurizing unit provided for each of the plurality of liquid pressurizing chambers, the pressurizing unit including a piezoelectric element for generating a pressure in each of the liquid pressurizing chambers , wherein the liquid pressurizing chamber has an ejection port. Of communicating part and supply port side
The width of the part that is composed of other parts and communicates with the discharge port
Port that is wider than the width of other parts and on the liquid pressurizing chamber side of the discharge port
Formed wider than the diameter, and liquid in other parts
A liquid ejecting apparatus, wherein the piezoelectric element is provided so as to correspond to a pressurizing chamber . 2. The liquid ejection device according to claim 1, wherein the ejection port is communicated with a plurality of liquid pressurizing chambers. 3. The piezoelectric element comprises at least a lower electrode layer,
The liquid ejecting apparatus according to claim 1, comprising a piezoelectric material formed on the lower electrode layer and an upper electrode layer formed on the piezoelectric material. 4. The liquid ejecting apparatus according to claim 3, wherein a vibrating plate is formed below the piezoelectric element formed for the liquid pressurizing chamber. 5. The discharge port is within a range of a slope formed at an end of the liquid pressurizing chamber.
The liquid ejection device described. 6. A liquid pressurizing chamber communicated with the liquid pressurizing chamber.
A discharge port and a supply port for supplying a liquid to the liquid pressurizing chamber,
The liquid pressurizing chamber is provided for each of the plurality of liquid pressurizing chambers.
A pressurizing means including a piezoelectric element for generating pressure in the chamber
A liquid ejecting apparatus, the width of a portion facing the discharge port of the liquid pressurizing chamber is pre
Larger than the hole diameter on the side of the discharge port facing the liquid pressurizing chamber.
And is formed in a pair with the pressurizing means of the liquid pressurizing chamber.
The width of the facing area faces the liquid pressurizing chamber of the discharge port.
It is characterized by being formed smaller than the hole diameter on the side
Liquid ejecting device.