JP3404390B2 - One-part moisture-curable epoxy resin composition - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a one-part moisture-curable epoxy resin composition which has both excellent curing characteristics and good storage stability, and more particularly to a one-part room temperature curable hard epoxy adhesive.

[0002]

2. Description of the Related Art Epoxy resin compositions have been widely used as adhesives, putty materials, paints and coating materials because of their excellent physical strength and adhesiveness. Since the conventional epoxy resin composition uses a highly reactive amine compound as a curing agent, it is a two-pack type in which the epoxy resin and the curing agent component are mixed immediately before they are used. However, the two-pack type epoxy resin composition requires work such as weighing and mixing, and thus is inferior in workability, and due to its complexity, there are various problems such as measurement error and poor mixing. The two-pack type has a drawback that the usable time is limited because a chemical reaction starts when it is mixed.

For this reason, various studies have been made on a one-pack type epoxy resin composition, and many techniques are known for a one-pack type epoxy resin composition using a moisture-decomposition type latent curing agent mainly containing a ketimine compound. Has been. Above all, from an industrial standpoint, various techniques have been disclosed for a one-pack type epoxy resin composition using a ketimine compound obtained from methyl isobutyl ketone as a carbonyl compound.

Ketimine compounds are well known as latent curing agents for epoxy resins and isocyanate-terminated urethane prepolymers. The reaction mechanism of the composition containing the ketimine compound and the epoxy resin will be described. The ketimine compound reacts with moisture in the air and decomposes to form an amine compound having active hydrogen. The generated amine compound having active hydrogen reacts with the epoxy resin,
This mechanism cures the epoxy resin composition. That is, in a composition containing a ketimine compound and an epoxy resin, the most important thing is that the faster the hydrolysis rate of the ketimine compound is, the faster the curability is obtained.
Furthermore, the higher the reactivity of the amine compound generated by hydrolysis, the easier the rapid curing and the higher physical properties. Here, a ketimine compound having a high hydrolysis rate has a contradictory difficulty of poor storage stability. The one-pack type epoxy resin composition containing a well-known ketimine compound obtained from methyl isobutyl ketone has good storage stability, but has a drawback that curing properties such as initial adhesive strength and rise in mechanical strength are slow. is there. Therefore, since the storage stability is taken into consideration, the limit of the conventional technique is that the method using a ketimine compound obtained from an amine compound having high reactivity with an epoxy resin must be used. In this way, if there is a dilemma that the storage stability is impaired if the rapid curing property is improved, the composition containing the ketimine compound and the epoxy resin imparts the rapid curing property to achieve both the storage stability. At present, no technology has been found.

Recently, international publication WO98 / 31722
The official gazette discloses a technique of improving storage stability by using a specific ketimine compound obtained from a carbonyl compound having steric hindrance. The ketimine compound here is
Due to its three-dimensional structure, it became difficult for water to contact the hydrolyzable site, and the hydrolyzability was slow. Therefore, although it has good storage stability, it has a conventional drawback that it has poor curing characteristics such as fast curing property. That is, when the ketimine compound is used here, the curing of the epoxy resin composition is difficult to proceed, and there is a problem that the initial adhesive strength and the mechanical strength are slow to rise. It takes a long time to cure before it can be used for physical properties
It was not practically sufficient. Therefore, even in this technique, it is not possible to achieve a technique in which practical curing characteristics and storage stability are compatible with each other. That is, it was a technical means that is an extension of the conventional technology.

Thus, if a composition containing a ketimine compound and an epoxy resin, which gives a quick-curing property and achieves both storage stability, is found, an adhesive agent, a putty material, a paint or a coating material using these is found. Since it is a basic technology such as potting material, its industrial utility is much improved.

[0007]

SUMMARY OF THE INVENTION The object of the present invention is to provide excellent storage stability and rapid curing property. Another object is to provide a one-part moisture-curable epoxy resin composition that can be cured at room temperature.

[0008]

Means for Solving the Problems As a result of intensive studies for achieving the above-mentioned object, the present inventors have found that ketimine obtained by reacting a specific carbonyl compound with an amine compound having a primary amino group. It has been found that the compounds show significantly faster hydrolysability. Then, focusing on an unprecedented hydrolyzable speed and confirming storage stability, it was confirmed to have sufficiently practical performance. That is, the invention of this application is completely inactive in the condition of moisture barrier such as in a container when compounded with an epoxy resin as long as the structure of a carbonyl compound as a raw material of a ketimine compound is in a very limited range. This is because it is hydrolyzed easily by moisture in the air once it is taken out from the container, so that it is based on the function of exhibiting markedly high adhesiveness and rising of mechanical strength. This function is the technology that achieves both the desired curing characteristics and practical storage stability. Based on this knowledge, the present inventors have extensively studied the range of compounds having such characteristics, the compounding amount with an epoxy resin, and the synthesis technique. As a result, the initial adhesive strength, the adhesive strength, the rise of mechanical strength is remarkably fast, and it has succeeded in developing a one-part moisture-curable epoxy resin composition that can be used without problems even after long-term storage, and the present invention is achieved. It came to completion.

The means of the present invention for solving the above problems will be described below. The invention of claim 1 contains a ketimine compound represented by the following chemical formula (2) obtained by reacting a carbonyl compound represented by the following chemical formula (1) with an amine compound having a primary amino group, and an epoxy resin. It is a one-part moisture-curable epoxy resin composition.

[0010]

[Chemical 3] However, R ₁ and R ₂ are any one alkyl group selected from the group consisting of alkyl groups having 2 to 6 carbon atoms,
R ₁ and R ₂ are the same or different alkyl groups.

[0011]

[Chemical 4] However, R ₃ is a residue excluding a primary amino group of an amine compound, and R ₄ and R ₅ are any one alkyl group selected from the group consisting of alkyl groups having 2 to 6 carbon atoms,
R ₄ and R ₅ are the same or different alkyl groups. n
Is an integer of 1 or more.

In a second aspect of the invention, the carbonyl compound is the one-pack moisture-curable epoxy resin composition according to the first aspect, wherein the carbon atom at the α-position has a methylene structure.

According to a third aspect of the present invention, in the one-part moisture-curable epoxy resin composition according to the first or second aspect, the carbonyl compound has the same or different alkyl groups selected from ethyl groups or propyl groups. is there.

In the invention of claim 4, the carbonyl compound is the one-pack moisture-curable epoxy resin composition according to claim 1, wherein the carbonyl compound has two ethyl groups.

The operation of the above means of the present invention will be described below. The specific ketimine compound used in the present invention refers to a compound having a double bond between a hydrolyzable C atom and an N atom represented by the following chemical formula (2). This site has 2 to 6 carbon atoms in the C atom having a double bond with the N atom
Having an identical or different alkyl group selected from the group consisting of
It is hydrolyzed into an amine compound having a primary amino group and a carbonyl compound having an alkyl group.

[0016]

[Chemical 5] However, R ₃ is a residue excluding a primary amino group of an amine compound, and R ₄ and R ₅ are any one alkyl group selected from the group consisting of alkyl groups having 2 to 6 carbon atoms,
R ₄ and R ₅ are the same or different alkyl groups. n
Is an integer of 1 or more.

In the one-pack type epoxy resin composition, after the amine compound is formed, it reacts with the epoxy resin and cures. That is, the hydrolysis rate of the ketimine compound is
It affects the curability of the epoxy resin composition. The one-pack type epoxy resin composition containing the ketimine compound was remarkably fast curable due to its rapid hydrolyzability. The curability here means that the adhesive strength, mechanical strength, and the like rise, and that long-term curing is not required to obtain practical physical properties that can withstand use.

The ketimine compound used in the present invention has the same or different alkyl group selected from the group consisting of alkyl groups having 2 to 6 carbon atoms at the C atom of the carbonyl group represented by the following chemical formula (1). Any compound can be used as long as it can be obtained by reacting a carbonyl compound having a with an amine compound having a primary amino group.

[0019]

[Chemical 6] However, R ₁ and R ₂ are any one alkyl group selected from the group consisting of alkyl groups having 2 to 6 carbon atoms,
R ₁ and R ₂ are the same or different alkyl groups.

In the case of a double bond between a C atom and an N atom, which has a steric hindrance in the vicinity which prevents contact with a water molecule, the hydrolyzability is lowered. The α-position carbon atom of the carbonyl compound is preferably a methylene structure because it does not have a structure that causes steric hindrance in the vicinity of the double bond between the C atom and the N atom, and thus hydrolyzability is not hindered. Carbonyl compounds having the same or different alkyl groups having 2 or 3 carbon atoms are more preferable because they have high hydrolyzability among these carbonyl compounds. Among these,
Diethyl ketone having the same alkyl group having 2 carbon atoms has the highest hydrolyzability, and therefore, when blended in the epoxy resin, it gives the fastest curing property, and is therefore particularly preferable.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention is described in detail below.
The specific ketimine compound used in the present invention refers to a hydrolyzable compound having a double bond between a C atom and an N atom represented by the following chemical formula (2). This ketimine compound is obtained by reacting a C atom of a carbonyl group with a carbonyl compound having the same or different alkyl group selected from the group consisting of an alkyl group having 2 to 6 carbon atoms and an amine compound having a primary amino group. The resulting compound.
Any structure may be used as long as it has the structure of the chemical formula (2). For example, N represented by the chemical formula (3) below,
N'-di (1-ethylpropylidene) -1,3-bisaminomethylcyclohexane, N, N'-di (1-ethylpropylidene) -metaxylylenediamine represented by the following chemical formula (4), etc. Is mentioned. They are a dehydration condensation product of 1,3-bisaminomethylcyclohexane and diethyl ketone, and a dehydration condensation product of metaxylylenediamine and diethyl ketone, respectively.

[0022]

[Chemical 7] However, R ₃ is a residue excluding a primary amino group of an amine compound, and R ₄ and R ₅ are any one alkyl group selected from the group consisting of alkyl groups having 2 to 6 carbon atoms,
R ₄ and R ₅ are the same or different alkyl groups. n is an integer of 1 or more.

[0023]

[Chemical 8]

[0024]

[Chemical 9]

The carbonyl compound used as a raw material of the ketimine compound used in the present invention is selected from the group consisting of an alkyl group having 2 to 6 carbon atoms in the C atom of the carbonyl group represented by the following chemical formula (1): Any carbonyl compound having the same or different alkyl group may be used. Specific examples of the carbonyl compound include diethyl ketone, dipropyl ketone, dibutyl ketone, ethylpropyl ketone and ethylbutyl ketone.

[0026]

[Chemical 10] However, R ₁ and R ₂ are any one alkyl group selected from the group consisting of alkyl groups having 2 to 6 carbon atoms,
R ₁ and R ₂ are the same or different alkyl groups.

In the case of a double bond between a C atom and an N atom, which has a steric hindrance in the vicinity that prevents contact with a water molecule, the hydrolyzability is lowered. The α-position carbon atom of the carbonyl compound is preferably a methylene structure because it does not have a structure that causes steric hindrance in the vicinity of the double bond between the C atom and the N atom, and thus hydrolyzability is not hindered. Carbonyl compounds having the same or different alkyl groups having 2 or 3 carbon atoms are more preferable because they have high hydrolyzability among these carbonyl compounds. Among these,
Diethyl ketone having the same alkyl group having 2 carbon atoms has the highest hydrolyzability, and therefore, when blended in the epoxy resin, it gives the fastest curing property, and is therefore particularly preferable.

The amine compound which is a raw material of the ketimine compound used in the present invention may be any compound having a primary amino group, and specific examples thereof include:
Ethylenediamine, diethylenetriamine, 1,3-bisaminomethylcyclohexane, norbornanediamine, metaxylylenediamine, isophoronediamine,
Bis (4-aminocyclohexyl) methane, polyamine having polyoxylene skeleton, N-β (aminoethyl)
Examples thereof include, but are not limited to, γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltrimethoxysilane, and γ-aminopropyltriethoxysilane. Those having two or more primary amino groups in one molecule are preferable because excellent mechanical strength can be obtained.

From the above, a ketimine compound obtained from diethyl ketone having the same alkyl group having 2 carbon atoms and an amine compound having two or more primary amino groups in one molecule,
When compounded with an epoxy resin, it is the most preferable composition because it gives the fastest curing property and excellent mechanical strength.

The ketimine compound may be produced by any method, for example, the carbonyl compound and the amine compound may be used without a solvent or in the presence of a nonpolar solvent (hexane, cyclohexane, toluene, benzene, etc.). It can be obtained by mixing below, heating under reflux, and azeotropically removing water formed. As the carbonyl compound and / or amine compound used, two or more kinds of compounds may be used as raw materials. Further, the one-pack type epoxy resin composition,
Needless to say, two or more kinds of the ketimine compounds may be used, and a ketimine compound or an aldimine compound synthesized from an ordinary carbonyl compound or an aldehyde compound may be used as long as the curability and the storage stability are not impaired. Other latent curing agents may be used in combination.

The epoxy resin may be any one as long as it has an epoxy group capable of reacting with an amine compound obtained by hydrolysis of a ketimine compound at the time of use. For example, biphenyl type epoxy resin obtained by reacting biphenyl, bisphenol A, bisphenol F, bisphenol AD, bisphenol S, etc. with epichlorohydrin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol S type Epoxy resin and the like, hydrogenated or brominated epoxy resin, glycidyl ester type epoxy resin, novolac type epoxy resin, urethane modified epoxy resin having a urethane bond, and nitrogen-containing epoxy resin obtained by epoxidizing metaxylene diamine or hydantoin. , A rubber-modified epoxy resin containing polybutadiene or NBR, and the like. It is not limited to these, and two or more kinds of epoxy resins may be used in combination.

The blending ratio of the ketimine compound of the present invention and the epoxy resin may be determined by the equivalent of active hydrogen of the amine compound generated by hydrolysis of the ketimine compound and the equivalent of epoxy groups of the epoxy resin. That is, the equivalent of active hydrogen of the amine compound generated by hydrolysis of the ketimine compound is 0.5 to 2.0 as compared with the equivalent of the epoxy group.
It is preferably double. If the blending ratio is lower than this range, the epoxy resin becomes excessive, and the cured product does not undergo satisfactory crosslinking, and practical mechanical strength cannot be obtained. When it is high, the amount of amine compound generated by hydrolysis becomes excessive, and in this case also, practical mechanical strength cannot be obtained for the same reason. If the blending ratio is within this range, a cross-linking structure capable of obtaining practical mechanical strength is obtained, and therefore, it is preferable that the blending ratio is 0.8 to 1.2 times as an ideal cross-linking structure. It is more preferable because the composition has further excellent mechanical strength.

In the present invention, it is preferable to use a dehydrating agent in addition to the above components of the ketimine compound and the epoxy resin. The dehydrating agent is mainly used to prevent ketimine from being decomposed by water and reacting with the epoxy resin, and those having such a dehydrating effect are widely and effectively used. Vinylsilane such as trimethoxysilane and vinyltriethoxysilane, acrylic silane such as γ-methacryloxypropyltrimethoxysilane, methyl silicate such as tetramethoxysilane and trimethoxymethylsilane, and dimethoxydimethylsilane, tetraethoxysilane and triethoxymethyl. Silane, ethyl silicate such as diethoxydimethylsilane, acetylacetone, orthoformate and the like are preferably used, and the amount thereof is about 1 to 10 parts by mass with respect to 100 parts by mass of the epoxy resin.

The composition of the present invention comprises, in addition to the above-mentioned compounds, fillers such as calcium carbonate and titanium oxide, coupling agents such as epoxysilane and vinylsilane, plasticizers and thixotropy as long as the effects of the present invention are not impaired. Granting agent,
Pigments, dyes, antioxidants, antioxidants, antistatic agents, flame retardants, adhesion promoters, dispersants, solvents and the like may be added. In this case, removing the influence of the water content of the above-mentioned components as much as possible gives good results on the storage stability.

The method for producing the composition of the present invention is not particularly limited, but it is preferable to thoroughly knead the composition under a nitrogen atmosphere or under reduced pressure using a stirrer such as a mixing mixer to obtain a composition. An example is as follows. Using a closed processing pot equipped with a stirrer, a condenser, a heating device, a vacuum dewatering device, and a nitrogen stream device, the epoxy resin is charged into the pot. Using a nitrogen gas stream, under nitrogen reflux, if necessary, a modifier or an additive is blended and homogeneously mixed. After this, finally mix the ketimine compound, mix homogeneously,
A one-pack moisture-curable adhesive composition is obtained. The final product is obtained by housing the one-component moisture-curable adhesive composition in a closed container that has been subjected to nitrogen substitution. If the modifier or additive contains water, it will be easily cured during storage and the storage stability will decrease. Therefore, it is recommended to remove the water content of the modifier or additive by dehydration. preferable. Dehydration of water may be performed before blending the modifier or additive, or after blending these with the epoxy resin, it may be dehydrated by means such as heating or reduced pressure.

[0036]

EXAMPLES The present invention will be described below based on examples, but the present invention is not limited to the examples.

[Synthesis of Ketimine Compound] (Synthesis Example 1) 142 g of 1,3-bisaminomethylcyclohexane (trade name: 1,3-BAC manufactured by Mitsubishi Gas Chemical Co., Inc.)
Then, 258 g of 3-fold molar equivalents of diethyl ketone and 200 g of toluene were placed in a flask and the produced water was removed by azeotropic distillation, and the reaction was continued for 20 hours at a temperature (120 to 150 ° C.) at which toluene and diethyl ketone refluxed. It was
Then, excess diethyl ketone and toluene were distilled off to obtain ketimine compound A.

Synthesis Example 2 Metaxylylenediamine (trade name MXDA, manufactured by Mitsubishi Gas Chemical Co., Inc.) 136 as an amine compound
A ketimine compound B was obtained in the same manner as in Synthesis Example 1 except that g was used.

(Synthesis Example 3) Ketimine compound C was prepared in the same manner as in Synthesis Example 1 except that 154 g of norbornanediamine (trade name NBDA manufactured by Mitsui Chemicals, Inc.) was used as the amine compound.
Got

(Synthesis Example 4) A ketimine compound D was obtained in the same manner as in Synthesis Example 2 except that 340 g of ethyl butyl ketone was used as the carbonyl compound.

(Synthesis Example 5) A ketimine compound E was obtained in the same manner as in Synthesis Example 2 except that 342 g of dipropyl ketone was used as the carbonyl compound.

(Synthesis Example 6) A ketimine compound F was obtained in the same manner as in Synthesis Example 1 except that 300 g of methyl isobutyl ketone was used as the carbonyl compound.

(Synthesis Example 7) A ketimine compound G was obtained in the same manner as in Synthesis Example 1 except that 258 g of methyl isopropyl ketone was used as the carbonyl compound.

Example 1 100 parts by mass of epoxy resin (Okaka Shell Epoxy, trade name Epicoat 828), heavy calcium carbonate (Nitto Koka, trade name NS100) 4
0 parts by mass, 80 parts by mass of surface-treated calcium carbonate (manufactured by Maruo Calcium, trade name MS700) at 100 ° C.
Reduce pressure and heat under the conditions of torr and 2 hours, and mix with stirring until uniform. When it becomes uniform, it is cooled to room temperature, and 40 parts by mass of ketimine compound A as a curing agent for epoxy resin, vinylsilane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd.,
5 parts by mass of trade name KBM1003) and 2 parts by mass of an epoxy silane coupling agent (KBM403 manufactured by Shin-Etsu Chemical Co., Ltd.) were added, and the mixture was stirred under reduced pressure to obtain a one-component moisture-curable adhesive composition.

Example 2 A one-part moisture-curable adhesive composition was obtained in the same manner as in Example 1 except that the ketimine compound B was used as the curing agent for epoxy resin.

Example 3 A one-pack moisture-curable adhesive composition was obtained in the same manner as in Example 1 except that the ketimine compound C was used as the curing agent for epoxy resin.

Example 4 A one-part moisture-curable adhesive composition was obtained in the same manner as in Example 1 except that the ketimine compound D was used as the curing agent for the epoxy resin.

Example 5 A one-pack moisture-curable adhesive composition was obtained in the same manner as in Example 1 except that the ketimine compound E was used as the curing agent for epoxy resin.

Example 6 A one-pack moisture-curable adhesive composition was obtained in the same manner as in Example 1 except that the epoxysilane coupling agent as the adhesion-imparting agent was omitted.

Example 7 The procedure of Example 6 was repeated except that 5 parts by mass of ethyl silicate (GE Toshiba Silicone, trade name TSL8124) was used in place of the vinyl silane coupling agent as a dehydrating agent. A liquid moisture-curable adhesive composition was obtained.

Example 8 The procedure of Example 1 was repeated except that the vinyl silane coupling agent as a dehydrating agent was removed and the epoxy silane coupling agent was increased to 7 parts by mass.
A one-pack moisture-curable adhesive composition was obtained.

Comparative Example 1 A one-part moisture-curable adhesive composition was obtained in the same manner as in Example 1 except that the ketimine compound F was used as the curing agent for epoxy resin.

Comparative Example 2 A one-part moisture-curable adhesive composition was obtained in the same manner as in Example 1 except that the ketimine compound G was used as the curing agent for epoxy resin.

[Adhesiveness] The following tests were conducted using the adhesive compositions according to Examples 1 to 5, Comparative Example 1 and Comparative Example 2. The results are shown in Tables 1 and 2.

[0055]

[Table 1]

[0056]

[Table 2]

The test was carried out in accordance with the standard conditions (adhesive epoxy resin for building repair) of JIS A6024 (curing for 7 days at 23 ° C.). In order to evaluate the quick-curing property of the adhesive composition, the adhesive strength is particularly measured by setting the adhesive strength under the conditions of curing at 23 ° C. for 1 day, at 23 ° C. for 2 days, and at 23 ° C. for 3 days. The test was conducted. Unit is N / m
It was m ² , and the fracture state at that time was shown.

[Stability] The one-component moisture-curable adhesive composition was filled in a cartridge, sealed, and allowed to stand at 23 ° C. for 2 months, and then the viscosity was measured. Then, the stability was compared with the viscosity immediately after compounding, and evaluated in the following three stages. The viscosity was measured at 23 ° C. with a BH viscometer at 10 r / min. I went there. ◯ ... (viscosity after standing for 2 months at 23 ° C.) / (Viscosity immediately after compounding) <2 Δ ... 2 ≦ (viscosity after standing for 2 months at 23 ° C.) / (Viscosity immediately after compounding) <3 × ... 3 ≦ (viscosity after standing for 2 months at 23 ° C.) / (Viscosity immediately after compounding)

As is clear from comparison between Examples 1 to 5, Comparative Example 1 and Comparative Example 2, the one-component moisture-curable adhesive composition according to the example is the one-component moisture-curable adhesive composition according to the comparative example. Compared with the composition, the value of the adhesive strength under each curing condition is large and the fracture state is excellent. In particular, the adhesiveness after curing for 1 day at 23 ° C shows a marked difference in the results,
It can be seen that the one-component moisture-curable adhesive composition according to the example exhibits excellent curability as compared with the one-component moisture-curable adhesive composition according to the comparative example.

[0060]

As described above, the one-part moisture-curable epoxy resin composition according to the present invention significantly accelerates the rise of initial adhesive strength and mechanical strength without impairing storage stability. It is a one-part moisture-curable epoxy resin composition used as an adhesive composition that can be cured at room temperature and has both conflicting performances. Therefore, the one-part moisture-curable epoxy resin composition according to the present invention can be effectively used for adhesives, putty materials, paints, coating materials, potting materials and the like using these.

─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Hisaichi Horii 4-7-9 Tsurumi, Tsurumi-ku, Osaka Koshi Co., Ltd. Osaka Research Institute (72) Inventor Nobuteru Matsuura 4-7-9, Tsurumi, Tsurumi-ku, Osaka No. Konishi Co., Ltd. Osaka Research Institute (56) Reference JP-A-8-217859 (JP, A) JP-A-10-60095 (JP, A) JP-A-11-21532 (JP, A) (58) Survey Areas (Int.Cl. ⁷ , DB name) C08G 59/40 C08G 59/50 C09J 163/00-163/10

Claims (4)

(57) [Claims] 1. A solution containing a ketimine compound represented by the following chemical formula (2) obtained by reacting a carbonyl compound represented by the following chemical formula (1) with an amine compound having a primary amino group, and an epoxy resin. Moisture curable epoxy resin composition. [Chemical 1] However, R ₁ and R ₂ are any one alkyl group selected from the group consisting of alkyl groups having 2 to 6 carbon atoms,
R ₁ and R ₂ are the same or different alkyl groups. [Chemical 2] However, R ₃ is a residue excluding a primary amino group of an amine compound, and R ₄ and R ₅ are any one alkyl group selected from the group consisting of alkyl groups having 2 to 6 carbon atoms,
R ₄ and R ₅ are the same or different alkyl groups. n
Is an integer of 1 or more. 2. The one-pack moisture-curable epoxy resin composition according to claim 1, wherein the carbon atom in the α-position of the carbonyl compound has a methylene structure. 3. The one-part moisture-curable epoxy resin composition according to claim 1, wherein the carbonyl compound has the same or different alkyl groups selected from ethyl groups or propyl groups. 4. The one-part moisture-curable epoxy resin composition according to claim 1, wherein the carbonyl compound has two ethyl groups.