JP3402455B2 - Substrate having thin-film element, method of manufacturing the same, and method of processing substrate having thin-film element - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate having a thin film element in which a coil layer is formed between core layers in a state before being subjected to height processing, and particularly stress generated during film formation of an upper core layer. The present invention relates to a substrate having a thin film element that can effectively prevent the occurrence of cracking or film peeling that occurs in the gap layer, a method of manufacturing the same, and a method of processing a substrate having the thin film element.

[0002]

2. Description of the Related Art FIG. 8 is a partial plan view showing a structure of a substrate having a conventional thin film element, and FIG. 9 is a sectional view taken along line 9-9 shown in FIG. The structure of the substrate shown in FIGS. 8 and 9 shows a state before the height processing is performed. The substrate after the height processing is a so-called inductive head for recording (thin film magnetic head). ) Is commercialized as.

[0003] reference numeral 10, alumina titanium carbide (Al ₂ O ₃ -Ti C) is a substrate made of such as, via a non-magnetic material layer such as an alumina film (not shown) on the substrate 10, For example, the lower core layer 1 made of a magnetic material such as NiFe alloy is formed. As shown in FIG. 9, the lower core layer 1 is formed so as to extend forward of the surface (A-A line) facing the recording medium.

On the lower core layer 1, for example, A
A gap layer 7 made of a non-magnetic material such as l ₂ O ₃ (alumina) or SiO ₂ is provided. Like the lower core layer 1, the gap layer 7 is also formed so as to extend forward of the surface (A-A line) facing the recording medium.

As shown in FIG. 9, the surface facing the recording medium (A
The insulating layer 3 made of a resist material or another organic material is formed in the gap layer 7 located behind the (A line). Further, a coil layer 4 is spirally formed on the insulating layer 3 by using a conductive material having a low electric resistance such as Cu. The coil layer 4 is formed so as to circulate around a base end portion 6b of the upper core layer 6 described later, but only a part of the coil layer 4 is shown in the drawing.

The coil layer 4 is covered with an insulating layer 5 such as an organic material, and on the insulating layer 5,
The upper core layer 6 is formed by plating with a magnetic material such as permalloy. As shown in FIG. 8, the tip portion B of the upper core layer 6 faces the recording medium (A-A).
It is formed so as to extend forward of the line), and the width dimension of the tip end portion B is formed to be the track width Tw. Further, the length dimension of the tip portion B is L1 in front of the surface facing the recording medium from the start end formed on the gap layer 7 in contact with the tip portion B of the upper core layer 6.

Further, as shown in FIG. 8, the upper core layer 6
A dummy portion C formed with a width dimension larger than the track width Tw is formed in front of the tip portion B of, and the base end portion 6b of the upper core layer 6 has a contact portion (formed in the gap layer 7). It is magnetically connected to the lower core layer 1 via the hole 2a.

[0008]

If the width dimension (= track width Tw) of the tip portion B of the upper core layer 6 becomes smaller with the recent increase in recording density, the following problems will occur. As shown in FIG. 8 , the length dimension L1 of the tip portion B of the upper core layer 6 is conventionally formed to be relatively long, about 10 μm, and when the width dimension of the tip portion B becomes small, When the tip portion B of the upper core layer 6 is formed on the gap layer 7, the stress exerted on the gap layer 7 becomes large, so that the gap layer 7 is cracked under the influence of the stress, or Film peeling is likely to occur. In the worst case, the upper core layer 6
The film itself may peel off.

When the gap layer 7 is cracked or the like as described above, magnetic leakage easily occurs from the gap layer 7 in the thin film magnetic head manufactured as a product, which causes deterioration of recording characteristics.

Further, as shown in FIG. 9, for example, a plurality of layers are formed on the gap layer 7. Even when the resist layer used for patterning each of these layers is peeled off, Stress is applied to the gap layer 7, and cracks easily occur in the gap layer 7.

Further, as described above, the width dimension of the tip portion B of the upper core layer 6 becomes small and the tip portion B is formed to be long with the length L1, so that such an elongated pattern is formed. Further, the gap layer 7 formed on both sides of the tip portion B (in the direction of the surface (A-A line) facing the recording medium shown in the drawing) shown in the drawing is etched to reduce the width of the gap layer 7. By adjusting the dimension to the same dimension as the width dimension of the tip portion B of the upper core layer 6, the write fringing (writing bleeding) of the signal recorded on the recording medium can be effectively prevented. If the width dimension is formed as thin as the tip portion B, the tip portion B of the upper core layer 6 and the gap layer 7 are likely to be cracked or broken in the worst case.

The present invention is to solve the above-mentioned conventional problems, and in particular, the contact length between the gap layer and the upper core layer is shortened to reduce the stress exerted from the upper core layer to the gap layer. It is an object of the present invention to provide a substrate having a thin film element capable of preventing cracks and the like in the gap layer, a method of manufacturing the same, and a method of processing a substrate having the thin film element.

[0013]

According to the present invention, a lower core layer made of a magnetic material and a non-magnetic gap layer are formed on the lower core layer on a substrate so as to face the recording medium. An upper core layer made of a magnetic material and facing each other, and a coil layer positioned between the lower core layer and the upper core layer on the rear side of the position facing the recording medium and having an upper surface covered with an insulating layer. In a substrate having a thin film element configured with
Tip of at least the lower core layer and the upper core layer formed of the track width, rather than the opposite surface and a position of the recording medium is formed is extended to the front, ahead of the upper core layer
In front of the end, it is integral with the upper core layer and
Dummy part formed with a width larger than the rack width
Is formed in front of the position that is the surface facing the recording medium.
Through the hole formed in the gap layer located in the front
The dummy part and the lower core layer do not interpose the gap layer.
Is in a state of being magnetically coupled in contact without, the length from the starting end of the upper core layer is formed in contact on the gap layer to the opposite surface and a position of the recording medium and Gd, upper upward The length of the gap layer formed in contact with the core layer is within the range of Gd or more and less than 4 times Gd in the direction of the surface facing the recording medium from the starting end in contact with the upper core layer. It is a feature.

[0014]

[0015] Further, in the present invention, the length from the starting end of the upper core layer is formed in contact on the gap layer to the opposite surface and a position of the recording medium and Gd, the tip of the upper core layer It is preferable that the length is formed in the range of 4 times or more and less than 6 times Gd in the direction of the surface facing the recording medium from the starting end in contact with the gap layer.

[0016]

[0017]

According to the present invention, the lower core layer made of a magnetic material is formed on the substrate so as to face the recording medium at a position facing the lower core layer through a non-magnetic gap layer. An upper core layer made of a material, and a coil layer located between the lower core layer and the upper core layer on the rear side of the position facing the recording medium and having an upper surface covered with an insulating layer. In the method for manufacturing a substrate having a thin film element, a lower core layer and a gap layer formed on the lower core layer are provided on the substrate in front of a position that is a surface facing a recording medium. A step of extending and forming, a step of forming a coil layer on the gap layer rearward of a position facing the recording medium, and a step of forming an insulating layer on the coil layer; In the gap layer located in front of the facing surface, A step of forming a hole communicating with the core layer, a step of forming a magnetic material underlayer on the gap layer and in the hole, and further on the insulating layer, and then forming a resist layer on the underlayer, and exposure By the development, from the resist layer formed on the insulating layer to the resist layer formed on the lower core layer through the hole of the gap layer, to the upper core layer , and in front of the tip of the upper core layer. truck
The upper core is formed with a width dimension larger than the width dimension.
A step of forming a frame pattern for forming a dummy part integrally formed with the layer, and after forming the frame pattern, a layer of magnetic material for forming the upper core layer and the dummy part is formed by plating. At this time, in the hole
Is the tip portion of the lower core layer or the dummy portion and the
In the state of contacting with the lower core layer without interposing the gap layer
Before the step of magnetically connecting and removing the remaining resist layer, and forming a resist layer of a size that covers the upper core layer and the dummy part, and not covering the resist layer
Removing the underlayer Ki磁 material, it is characterized in further comprising a step of removing the resist layer.

[0019]

Further, in the method of processing a substrate having a thin film element according to the present invention, the substrate having a thin film element as described above is used, and the substrate, the lower core layer, the gap, which is located in front of the position facing the recording medium, The layer and the upper core layer are removed, and the gap layer and the lower core layer and the upper core layer facing each other through the gap layer are exposed on the surface facing the recording medium.

The lower core layer, the gap layer, and the upper core layer forming the so-called inductive head (thin film magnetic head) for recording are formed longer than the surface facing the recording medium during the manufacturing process. An extra lower core layer located forward from the surface facing the recording medium,
The gap layer and the upper core layer are removed (height processing) and commercialized.

As a conventional problem, since the gap layer is formed to be as long as the upper core layer, this problem occurs when the upper core layer is formed, especially with the recent increase in recording density. The gap layer is easily affected by the stress, and cracks or the like are generated in the gap layer, resulting in deterioration of recording characteristics.

[0023] Therefore, in the present invention, by shortening the length of the gap layer formed is extended forward from the surface facing the recording medium than the conventional, generated in forming the upper core layer The effect of stress on the gap layer can be reduced, and cracks and the like can be effectively prevented from occurring in the gap layer.

Further, it is preferable that the length dimension of the upper core layer extending forward of the surface facing the recording medium is shorter than that of the conventional one. In particular, as the track becomes narrower today, it becomes easier to pattern the upper core layer by making it shorter.

In the method of manufacturing a substrate having the thin film element according to the present invention, the gap layer formed on the lower core layer on the substrate is located in front of the position facing the recording medium. Is characterized in that a hole communicating with the lower core layer is formed, and an upper core layer formed on the gap layer is extended into the hole.

As described above, by forming a hole in the gap layer located in front of the surface facing the recording medium and further extending the upper core layer from above the gap layer into the hole, the upper core layer can be formed. The length dimension of the gap layer formed in contact with the lower side can be substantially shortened, so that the stress from the upper core layer can be relieved and the occurrence of cracks or the like in the gap layer can be appropriately prevented. It is possible.

[0027]

1 is a partial plan view of a substrate having a thin film element according to the present invention as seen from above, and FIG. 2 is a sectional view taken along line 2-2 shown in FIG. The substrate having the thin film element shown in FIG. 1 has a structure before removing the substrate located in front of the surface (DD line) facing the recording medium, that is, before height processing. The surface facing the recording medium (D
When the substrate located on the front side of (-D line) is removed and the substrate is processed into a slider shape, it is commercialized as an inductive head (thin film magnetic head) for recording, and in the present invention, this inductive head A reproducing head (MR head) utilizing the magnetoresistive effect may be laminated on the lower side.

Reference numeral 27 shown in FIG. 2 is a substrate formed of alumina titanium carbide (Al ₂ O ₃ --Ti C ) or the like, and a non-magnetic material layer such as an alumina film (not shown) is formed on the substrate 27. A thin film element that functions as an inductive head for recording is formed via the. As shown in FIG. 2, a lower core layer 20 made of a magnetic material such as a NiFe alloy is formed on the substrate 27 via an alumina film (not shown). When the reproducing head is stacked below the lower core layer 20, the lower core layer 20 also functions as the upper shield layer of the reproducing head. As shown in FIG. 2, the lower core layer 20 is
It is formed so as to extend forward of the surface (DD line) facing the recording medium.

As shown in FIG. 2, a gap layer (nonmagnetic material layer) 21 made of alumina or the like is formed on the lower core layer 20. Further, on the gap layer 21 behind the surface (DD line) facing the recording medium,
A coil layer 23, which is patterned so as to have a planar spiral shape, is provided via an insulating layer 22 made of polyimide or a resist material. The coil layer 23 is made of Cu.
It is formed of a non-magnetic conductive material having a low electric resistance such as (copper).

Further, the coil layer 23 is covered with an insulating layer 24 formed of polyimide or a resist material,
An upper core layer 25 is formed on the insulating layer 24 by plating with a magnetic material such as permalloy.

As shown in FIGS. 1 and 2, the upper core layer 2
The base end portion 25b of No. 5 is formed in contact with the lower core layer 20 via the contact portions (hole portions) 26 formed in the insulating layers 22 and 24 and the gap layer 21.
It is in a state of being magnetically connected to 0.

As shown in FIG. 1, the width dimension of the upper core layer 6 gradually decreases from the base end portion 25b toward the front, and the tip end portion E formed with the track width dimension Tw serves as a recording medium. Is formed so as to extend further forward than the facing surface (line D-D).

Here, as shown in FIG. 1, the gap layer 2 located in front of the surface (DD line) facing the recording medium.
1 has a hole 21a formed in a predetermined shape. The hole 21a is formed so as to reach the lower core layer 20 (see FIG. 2), and the lower core layer 20 is exposed from the hole 21a. The tip E of the upper core layer 25 is formed to extend to the hole 21a, and the tip E is magnetically connected to the lower core layer 20 through the hole 21a. .

Since the hole 21a is formed in the gap layer 21, the surface facing the recording medium (DD) from the starting end (line FF) where the gap layer 21 and the upper core layer 25 are in contact with each other.
The length dimension L2 of the gap layer 21 in the portion where the upper core layer 25 is formed on the upper side extending in the (line) direction is
Of the upper core layer 2 extending from the starting end (line F-F) where the and the upper core layer 25 contact each other in the direction of the surface facing the recording medium (line D-D).
5 is shorter than the length dimension L3 of the tip end portion E of FIG.

As described above, according to the present invention, the length dimension L2 of the gap layer 21 at the portion in contact with the upper core layer 25 on the upper side is substantially shortened, so that the tip end E of the gap layer 21 and the upper core layer 25 is formed. It is possible to reduce the contact area with the upper core layer 25 and the stress exerted on the gap layer 21 from the upper core layer 25. Therefore, the gap layer 21 can be prevented from cracking due to stress, or film peeling can be prevented, and the recording characteristics of the thin film magnetic head manufactured as a product can be improved.

As described above, a plurality of layers are formed on the gap layer 21, and a resist layer is used when patterning each of these layers, and when the resist layer is peeled off, the gap layer 21 is formed. However, according to the present invention, the length dimension L2 of the portion of the gap layer 21 formed in contact with the upper core layer 25 on the upper surface is shortened, so that the gap layer is removed when the resist layer is peeled off. 21
It is possible to reduce the influence of stress on the.

Further, in the present invention, as shown in FIGS. 1 and 2, the gap layer 21 and the tip E of the upper core layer 25 are in contact with each other from the starting end (line FF) which is formed. When the length dimension up to the plane (DD) is Gd (magnetic gap depth), the length L2 of the gap layer 21 at the portion formed by the tip E of the upper core layer 25 in contact with the upper side is ,
It is preferable that it is formed within the range of Gd or more and less than 4 times the Gd in the direction of the surface facing the recording medium from the starting end (line F-F) in contact with the upper core layer 25. Specifically, the Gd is 1
Therefore, the length dimension L2 of the gap layer 21 is preferably 1 μm or more and less than 4 μm.

The length dimension L2 of the gap layer 21 is G
Less than 4 times d is because if it is formed too long,
This is because the stress from the upper core layer 25 to the gap layer 21 becomes large as in the conventional case, and problems such as cracking and film peeling occur in the gap layer 21.

Further, in the present invention, the length dimension L3 of the tip portion E of the upper core layer 25 is 4 times or more of Gd in the direction of the surface facing the recording medium from the starting end (line FF) contacting the gap layer 21. It is preferably formed in a range of less than 6 times. Specifically, since Gd is about 1 μm as described above, the length dimension L3 of the tip end portion E of the upper core layer 25 is preferably 4 μm or more and less than 6 μm.

The length dimension L3 of the tip end portion E of the upper core layer 25 is set to be four times or more of Gd because, for example, in order to prevent write fringing (writing bleeding), the surface (D- When the lower core layer 1 in the (D line) direction is processed to have the same width as Tw of the upper core layer 25 by ion milling or the like, if the length dimension L3 of the tip end E is too short,
The ion milling is not preferable because it makes it difficult to scrape the gap layer 21. Further, the length dimension L3 of the tip portion E of the upper core layer 25 is set to be less than 6 times Gd, because when the length dimension L3 is too long, the tip portion E having an elongated shape is patterned. This is because the tip portion E, which is difficult and has an elongated shape, is easily broken due to the influence of stress or the like, which is not preferable.

Further, as shown in FIG. 1, in the present invention, a dummy portion G having a width dimension larger than the track width Tw is formed integrally with the tip portion E in front of the tip portion E of the upper core layer 25. Preferably. This is because in the manufacturing process described later, the resist layer is removed using a developing solution, and the same pattern as the tip portion E of the upper core layer 25 having an elongated shape is formed on the resist layer.
By forming a pattern of a dummy part G having a large width dimension in front of the resist layer, it becomes easy for the developing solution to penetrate into the resist layer in the part where the tip part E pattern is formed, and the tip part E can be easily formed. This is because a pattern having the same shape as can be formed.

The dummy part G shown in FIG. 1 is directly formed on the lower core layer 20 through the hole 21a formed in the gap layer 21, and the dummy part G and the lower core layer 20 are magnetically formed. It is connected.

Further, as shown in FIG. 1, the width dimension of the hole portion 21a formed in the gap layer 21 in the portion facing the tip portion E of the upper core layer 25 is the width dimension of the tip portion E (=
The width dimension of the hole portion 21a formed in the gap layer 21 in the portion facing the dummy portion G is larger than the width dimension of the dummy portion G. Is preferred. This is to relax the stress exerted on the tip portion E and the dummy portion G of the upper core layer 25. However, the width of the hole 21a may be larger than the track width Tw. Therefore, the size of the hole 21a formed below the dummy part G is larger than that of the dummy part G. Can be small.

If the hole 21a is formed too large, the lower core layer 20 and the like will be easily removed in the photolithography process. Therefore, the hole 21a is formed to have an appropriate size. It is preferable.

In the present invention, as shown in FIG. 1, the gap layer 21 is provided with the hole 21a, so that the length dimension L of the gap layer 21 at the portion in contact with the upper core layer 25 on the upper side.
However, the length dimension L2 of the gap layer 21 may be shortened by other methods.

Next, a method of manufacturing a substrate having a thin film element according to the present invention will be described with reference to FIGS. 3 is a vertical sectional view of the substrate having the thin film element, and FIGS. 4 to 7 are plan views of the substrate having the thin film element. As shown in FIG. 3, first, the lower core layer 20 and the non-magnetic gap layer 21 formed on the lower core layer 20 are provided on the substrate 27 so as to face the recording medium (line D-D).
It is formed by extending it forward.

Further, as shown in FIG. 3, an insulating layer 22 made of an organic material or the like is formed on the gap layer 21 behind the surface (DD line) facing the recording medium, and the insulating layer 22 is further formed.
The coil layer 2 is made of a non-magnetic conductive material such as Cu.
3 is spirally patterned. Then, an insulating layer 24 such as an organic material is formed on the coil layer 23, and the insulating layer 24 covers the upper surface of the coil layer 23.

Next, as shown in FIG. 4, the gap layer 21 located in front of the surface (DD line) facing the recording medium is formed by using an existing etching method such as a plasma etching method or an ion milling method. A hole 21a is formed in the hole.
The size of the hole 21a will be larger than that of the hole 21a in a later step.
It is preferable that it is formed larger than the size of the upper core layer formed on a. As shown in FIG. 4, the hole 2
The lower core layer 20 is exposed from 1a.

Simultaneously with the formation of the hole portion 21a, as shown in FIG. 4, the contact portion (hole portion) 2 is formed on the insulating layer 24 positioned behind the surface (DD line) facing the recording medium.
6 is formed. This contact portion 26 is formed on the insulating layer 2
Insulating layer 22 and gap layer 21 formed under
The lower core layer 20 is exposed from the contact portion 26.

As described above, it is preferable to simultaneously form the hole portion 21a formed in the gap layer 21 and the contact portion 26 formed through the insulating layers 24 and 22 and the gap layer 21, but separate steps. There is nothing wrong with going there.

Next, the upper core layer 25 is formed from the insulating layer 24 to the gap layer 21 by frame plating. First, a base layer (not shown) of a magnetic material is formed on the insulating layer 24 and the gap layer 21. It should be noted that this underlayer has holes 21a formed in the gap layer 21.
It is also formed inside the contact portion 26. Then, a resist layer 28 is formed on the base layer.

As shown in FIG. 5, patterns 29, 30, and 31 of the upper core layer 25 are formed on the resist layer 28 by exposure and development. As shown in FIG.
No. 9 has a large width dimension on the contact portion 26, and the width dimension gradually decreases to the track width Tw in the direction of the surface (DD line) facing the recording medium. The pattern 30 having the track width Tw is formed so as to extend further to the front than the surface (DD line) facing the recording medium, and the portion of this pattern 30 is the tip end portion E (of the upper core layer 25. (See FIG. 1).
A hole 21a is formed near the front of the pattern 30 that is the tip E.
The pattern 30 is formed above, and the pattern 30 is formed smaller than the size of the hole 21a. Further, in front of the surface (DD line) facing the recording medium, the pattern 3
1 has a width dimension larger than the track width Tw, and the pattern 31 formed with a width dimension larger than the track width Tw is formed on the hole portion 21 a formed in the gap layer 21.

As shown in FIG. 5, the pattern 31 formed with a width dimension larger than the track width Tw has the holes 2
It is formed smaller than 1a. In the present invention, the pattern 31 may be formed larger than the hole 21a. The portion of the pattern 31 is the portion that becomes the dummy portion G.

In the present invention, wide patterns 29, 3 are formed in the front and rear of the pattern 30 formed with the track width Tw.
1 is formed, when the pattern 30 in the track width Tw portion is removed by the developing solution, the developing solution is caused to enter the portion of the pattern 30 having the track width Tw from the portions of the wide patterns 29 and 31. This facilitates removal of the resist layer 28.

Next, a magnetic material is formed by plating inside the patterns 29, 30, 31 and the remaining resist layer 28 is formed.
To remove. As shown in FIG. 6, the patterns 29, 3
The magnetic material layer formed in the layers 0 and 31 is the upper core layer 25.
Therefore, the base end portion 25b of the upper core layer 25 is in a state of being magnetically connected to the lower core layer 20 through the contact portion 26.

Further, a front end portion E having a track width Tw is formed in front of the base end portion 25b, and the front end portion E is farther than the surface (DD line) facing the recording medium. It is formed to extend to the front. Further, a dummy portion E having a width dimension larger than that of the tip portion E is formed in front of the tip portion E, and the dummy portion E has a hole portion 21a formed in the gap layer 21. It is in a state of being magnetically connected to the lower core layer 20 through the interposition.

As described above, the pattern 3 shown in FIG.
Since 1 is formed smaller than the hole 21a of the gap layer 21, the dummy part G is formed smaller than the hole 21a of the gap layer 21 as shown in FIG. A part of the hole 21a is exposed at the bottom, and the lower core layer 20 is exposed from this part. When the pattern 31 is formed larger than the hole 21a of the gap layer 21, the dummy part G is formed so as to completely cover the hole 21a.

Next, as shown in FIG. 7, the upper core layer 2
A resist layer 32 is formed on the layer 5. The resist layer 32
The reason for forming is that the upper core layer 25 is effectively protected by the resist layer 32, and an excess magnetic material layer in a portion not covered by the resist layer 32 or the underlayer described in the step of FIG. This is to remove it.

As shown in FIG. 7, the resist layer 32 is formed to be slightly larger than the upper core layer 25, and in particular, the hole portion 21a of the gap layer 21 not covered by the dummy portion G is formed.
Must be completely covered by the resist layer 32. This is because the lower core layer 20 is exposed from the hole 21a as described above,
Is not completely covered with the resist layer 32, the lower core layer 20 of the magnetic material is also removed.

As shown in FIG. 7, after the upper core layer 25 is covered with a resist layer 32 which is slightly larger than the upper core layer 25, the excess magnetic material layer is removed, and then the resist layer 32 is removed. A substrate having a thin film element as shown in FIG. 1 is completed.

In the present invention using the substrate thus formed, the surface (DD line) facing the recording medium shown in FIG.
Then, the substrate 27, the upper core layer 25, the gap layer 21, and the lower core layer 20 located in front of the above position are removed (height process).

As a result, the surface facing the recording medium (DD
In the line), the gap layer 21 and the tip portions E of the lower core layer 20 and the upper core layer 25 that face each other through the gap layer 21 are exposed, and are commercialized as an inductive head (thin film magnetic head). It

In the inductive head, when the recording current is applied to the coil layer 23 shown in FIG.
Also, a recording magnetic field is induced in the upper core layer 25, and a magnetic field is recorded on a recording medium such as a hard disk by a leakage magnetic field from a magnetic gap portion between the lower core layer 20 and the tip E of the upper core layer 25.

The shape of the substrate having the thin film element shown in FIGS. 1 and 2 may be a slider shape configured as a magnetic head, or may be processed into a block shape, for example. A plurality of thin film elements formed of a laminated body of the lower core layer 20 to the upper core layer 25 may be formed over a number of rows, or the thin film elements may be arranged in a line on an elongated substrate. A plurality of so-called slider bar shapes may be formed.

[0065]

According to the present invention described in detail above, the lower core layer and the upper core layer are provided in front of the surface facing the recording medium.
It is formed to extend longer than the gap layer, and the lower core layer and the upper core layer are magnetically connected in front of the gap layer.

That is, in the present invention, the length of the gap layer is made shorter than the length of the upper core layer extending forward of the surface facing the recording medium, whereby the gap layer and the upper core layer are formed. The contact area with the core layer can be reduced, and the stress applied from the upper core layer to the gap layer can be reduced. Therefore, problems such as cracking and film peeling due to stress do not occur in the gap layer, and it is possible to improve the recording characteristics of the manufactured thin film magnetic head.

[Brief description of drawings]

FIG. 1 is a partial plan view showing a structure of a substrate having a thin film element according to an embodiment of the present invention,

FIG. 2 is a vertical sectional view taken along line 2-2 shown in FIG.

FIG. 3 is a vertical cross-sectional view of a substrate having a thin film element, showing one step in forming a substrate having a thin film element in the present invention.

FIG. 4 is a partial plan view showing a manufacturing process of a substrate having a thin film element, which is performed after FIG.

5 is a partial plan view showing a manufacturing process of a substrate having a thin film element, which is performed after FIG.

6 is a partial plan view showing a manufacturing process of a substrate having a thin film element, which is performed after FIG.

7 is a partial plan view showing a manufacturing process of a substrate having a thin film element, which is performed after FIG.

FIG. 8 is a partial plan view showing a structure of a substrate having a conventional thin film element,

9 is a vertical cross-sectional view taken along line 9-9 shown in FIG.

[Explanation of symbols]

20 Lower core layer 21 Gap layer 21a hole 22, 24 Insulation layer 23 Coil layer 25 Upper core layer 26 Contact part 27 substrates 28, 32 resist layer 29, 30, 31 patterns E Tip (of upper core layer) G dummy part Tw track width

Claims (4)

(57) [Claims] 1. A lower core layer made of a magnetic material on a substrate,
An upper core layer made of a magnetic material that faces the recording medium at a position facing the recording medium, and a rear side of a position facing the recording medium and an upper core layer made of a magnetic material that faces the lower core layer via a nonmagnetic gap layer. A substrate having a thin film element that is located between the lower core layer and the upper core layer and has a coil layer whose upper surface is covered with an insulating layer, and is formed with at least the lower core layer and the track width dimension. The front end portion of the upper core layer is formed to extend forward of the position facing the recording medium, and the front end portion of the upper core layer is formed in front of the upper core layer.
Integral and with a width larger than the track width
Before the formed dummy part is formed and is located in front of the position facing the recording medium.
With the dummy portion through the hole formed in the gap layer,
The lower core layer and the lower core layer are in contact with each other without the gap layer and are magnetically connected to each other, and a recording medium is formed from a start end formed by contacting the upper core layer on the gap layer. The length up to the position of the facing surface is Gd, and the length of the gap layer formed in contact with the upper core layer on the upper side is Gd from the starting end in contact with the upper core layer toward the facing surface of the recording medium. A substrate having a thin film element, which is formed within the range of less than 4 times Gd. 2. A length from a starting end formed in contact with the upper core layer on the gap layer to a position facing the recording medium is Gd, and a length of a tip end portion of the upper core layer is
The substrate having a thin film element according to claim 1, wherein the substrate is formed in the range of 4 times or more and less than 6 times Gd in the direction of the surface facing the recording medium from the starting end in contact with the gap layer. 3. A lower core layer made of a magnetic material on a substrate,
An upper core layer made of a magnetic material that faces the recording medium at a position facing the recording medium, and a rear side of a position facing the recording medium and an upper core layer made of a magnetic material that faces the lower core layer via a nonmagnetic gap layer. In the method of manufacturing a substrate having a thin film element that is located between the lower core layer and the upper core layer and has a coil layer whose upper surface is covered with an insulating layer, a lower core layer and a lower core layer are provided on the substrate. A step of forming a gap layer formed on the lower core layer forward of a position facing the recording medium, and forming a gap layer behind the position facing the recording medium. Forming a coil layer on the gap layer and further forming an insulating layer on the coil layer; and forming a hole in the gap layer located in front of the surface facing the recording medium to reach the lower core layer. Forming process and on and before the gap layer A step of forming an underlayer of a magnetic material in the hole portion and further on the insulating layer, and then forming a resist layer on the underlayer, and a step of forming a gap layer from the resist layer formed on the insulating layer by exposure and development. The resist layer formed on the lower core layer through the hole, the upper core layer , and the upper core
Width dimension greater than the track width dimension in front of the ply tip
And the upper core layer are integrally formed with the upper core layer.
A step of forming a frame pattern for forming a mee portion, and after forming the frame pattern, the upper core layer and the
A layer of magnetic material for forming the dummy portion is formed by plating, and at this time, the hole portion is the tip portion of the lower core layer.
Or the dummy layer and the lower core layer, the gap layer
Magnetic contact in a state of contacting without contact with the resist layer, and removing the remaining resist layer; forming a resist layer of a size that covers the upper core layer and the dummy portion, and covering with the resist layer. the underlying layer before Ki磁 <br/> material not removed, method of producing a substrate having a thin film element, characterized by further having a step of removing the resist layer. 4. A substrate having the thin film element according to claim 1 or 2 , which is located in front of a position facing a recording medium, a lower core layer, a gap layer , A thin film element, characterized in that the upper core layer and the dummy portion are removed, and a gap layer and a lower core layer and an upper core layer facing each other through the gap layer are exposed on a surface facing the recording medium. A method of processing a substrate having.