JP3401331B2 - Inspection method of alloy mold temperature fuse and alloy mold temperature fuse - Google Patents
Inspection method of alloy mold temperature fuse and alloy mold temperature fuseInfo
- Publication number
- JP3401331B2 JP3401331B2 JP18995694A JP18995694A JP3401331B2 JP 3401331 B2 JP3401331 B2 JP 3401331B2 JP 18995694 A JP18995694 A JP 18995694A JP 18995694 A JP18995694 A JP 18995694A JP 3401331 B2 JP3401331 B2 JP 3401331B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature fuse
- epoxy resin
- flux
- melting point
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
【0001】[0001]
【産業上の利用分野】本発明は、電子または電気機器の
保全に使用される、ケ−スタイプまたは基板タイプの合
金型温度ヒュ−ズの検査方法及び合金型温度ヒュ−ズに
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting a case type or substrate type alloy type temperature fuse and an alloy type temperature fuse used for the maintenance of electronic or electric equipment.
【0002】[0002]
【従来の技術】合金型温度ヒュ−ズにおいては、フラッ
クスを付着した低融点金属片をヒュ−ズエレメントとし
て使用している。この合金型温度ヒュ−ズにおいては、
保護しようとする電気機器に取付けて使用され、当該機
器が過電流により発熱すると、その発生熱により低融点
金属片が溶断され、通電遮断により機器の異常発熱、ひ
いては火災の発生を未然に防止している。2. Description of the Related Art In an alloy type temperature fuse, a low melting point metal piece to which a flux is attached is used as a fuse element. In this alloy type temperature fuse,
When used by being attached to an electrical device to be protected and when the device heats up due to overcurrent, the generated heat melts and cuts the low melting point metal piece, which prevents abnormal heat generation of the device and even the occurrence of a fire by cutting off the current. ing.
【0003】上記低融点金属片の溶断において、フラッ
クスの役目は極めて重要である。すなわち、既に溶融さ
れているフラックスが低融点金属片表面の酸化皮膜を除
去・洗浄し、更に、溶融金属のリ−ド線に対する濡れ性
を高めてリ−ド線先端を核とする溶融金属の表面張力に
基づく球状化変形を促進し、この球状化の進行により溶
融金属が分断され、この分断後の球状化の更なる進行に
より分断間距離がア−ク消滅距離に達し、ア−クの消滅
により通電遮断が確実に終結されるのであり、フラック
スは、溶融された低融点金属片の分断を迅速化させるか
ら、温度ヒュ−ズの迅速な作動の保証に不可欠な構成要
素である。The role of the flux is extremely important in the fusing of the low melting point metal pieces. That is, the already-melted flux removes and cleans the oxide film on the surface of the low melting point metal piece, and further enhances the wettability of the molten metal with respect to the lead wire, thereby making The spheroidizing deformation based on the surface tension is promoted, the molten metal is divided by the progress of the spheroidizing, and the distance between divisions reaches the arc extinction distance due to the further progress of the spheroidizing after the dividing, The disappearance of electric current is surely terminated by the disappearance, and the flux accelerates the cutting of the molten low melting point metal piece, and is therefore an essential component for ensuring the quick operation of the temperature fuse.
【0004】従来、合金型温度ヒュ−ズには、リ−ド線
間に低融点金属片が接続され、該低融点金属片にフラッ
クスが付着され、該フラックス付着低融点金属片がセラ
ミックスケ−スで覆われ、該セラミックスケ−スの開口
と上記のリ−ド線との間がエポキシ樹脂材により封止さ
れてなるケ−スタイプの合金型温度ヒュ−ズ、セラミッ
クス基板の片面に一対の膜電極が設けられ、これらの膜
電極間に低融点金属片が接続され、該低融点金属片にフ
ラックスが付着され、各膜電極にリ−ド線が接続され、
セラミックス基板片面にエポキシ樹脂材が被覆されてな
る基板タイプの合金型温度ヒュ−ズが公知である。Conventionally, a low melting point metal piece is connected between lead wires in an alloy type temperature fuse, a flux is adhered to the low melting point metal piece, and the flux adhering low melting point metal piece is a ceramic case. A case type alloy type temperature fuse, which is covered with a die and is sealed with an epoxy resin material between the opening of the ceramic casing and the lead wire, and a pair of ceramic type fuses on one side of the ceramic substrate. Membrane electrodes are provided, low melting point metal pieces are connected between these membrane electrodes, flux is attached to the low melting point metal pieces, and lead wires are connected to the respective membrane electrodes,
A substrate type alloy type temperature fuse in which an epoxy resin material is coated on one surface of a ceramic substrate is known.
【0005】[0005]
【発明が解決しようとする課題】従来、ケ−スタイプの
合金型温度ヒュ−ズにおいて、封止材に、フィラ−を配
合したエポキシ樹脂組成物を使用することが公知であ
る。Conventionally, it has been known to use an epoxy resin composition containing a filler as a sealing material in a case type alloy type temperature fuse.
【0006】ところで、上記フラックスにおいては、通
常、松脂等のロジンを主成分としており、色彩は、淡黄
色乃至は茶褐色である。他方、エポキシ樹脂は本来、無
色、淡黄色または琥珀色であるが、フィラ−等の添加剤
や硬化剤との混合や反応により光の屈折性が変化し、絶
縁物製品として使用されているものの硬化後の色彩は、
上記フラックスと色彩的に、識別し難いものが多い。By the way, the above-mentioned flux usually contains rosin such as pine resin as a main component, and its color is pale yellow or brown. On the other hand, the epoxy resin is originally colorless, light yellow or amber, but the refraction of light is changed by mixing and reaction with additives such as filler and curing agent, and it is used as an insulator product. The color after curing is
Many are difficult to distinguish from the above fluxes in terms of color.
【0007】而して、上記合金型温度ヒュ−ズにおい
て、エポキシ樹脂に無機質粒体を配合すると、フラック
スがエポキシ樹脂封止部またはエポキシ樹脂被覆層を貫
通して露出されていても(このような状態は、セラミッ
クスケ−スの開口にフラックスが付着された状態でエポ
キシ樹脂材により封止される場合等に生じる)、フラッ
クスとエポキシ樹脂材とが同一系統の色彩のために、外
観検査で摘出されずに、使用されてしまい、使用中の機
器ヒ−トサイクルによりフラックスが流出し、低融点金
属片が酸化し、当該合金型温度ヒュ−ズの正常な作動を
保証し得ず、機器の保全不良が余儀なくされる畏れがあ
る。Thus, in the alloy type temperature fuse, when the inorganic particles are mixed with the epoxy resin, even if the flux is exposed through the epoxy resin sealing portion or the epoxy resin coating layer (such as This condition occurs when the epoxy resin material is used to seal the flux when the flux is attached to the opening of the ceramic case.) If it is used without being extracted, the flux will flow out due to the equipment heat cycle in use, the low melting point metal piece will be oxidized, and the normal operation of the alloy type temperature fuse cannot be guaranteed. There is a fear that poor maintenance will be forced.
【0008】本発明の目的は、ケ−スタイプの合金型温
度ヒュ−ズのエポキシ樹脂封止部や基板タイプのエポキ
シ樹脂絶縁被覆層に、フラックスが露出した不良品を外
観検査により、容易・確実に摘出することにある。An object of the present invention is to easily and surely check a defective product having flux exposed in an epoxy resin sealing portion of a case type alloy type temperature fuse or a substrate type epoxy resin insulating coating layer by visual inspection. Is to be extracted.
【0009】[0009]
【課題を解決するための手段】請求項1は、図1または
図2の(イ)、(ロ)に示すように、リ−ド線間に低融
点金属片が接続され、該低融点金属片にフラックスが付
着され、該フラックス付着低融点金属片がセラミックス
ケ−スで覆われ、該セラミックスケ−スの開口と上記の
リ−ド線との間がエポキシ樹脂材により封止されてなる
温度ヒュ−ズにおいて、上記エポキシ樹脂材に、無機質
粒体が配合された硬化後の色彩が白乃至はグレ−のエポ
キシ樹脂組成物(アルミナを配合したものを除く)を用
い、フラックスが封止部を貫通して露出する不良温度ヒ
ュ−ズを外観検査により摘出・排除することを特徴とす
る構成である。According to a first aspect of the present invention, as shown in (a) and (b) of FIG. 1 or 2, a low melting point metal piece is connected between lead wires, and the low melting point metal is connected. Flux is attached to the piece, the low melting point metal piece to which the flux is attached is covered with a ceramic case, and an epoxy resin material seals between the opening of the ceramic case and the lead wire. In the temperature fuse, use an epoxy resin composition (excluding a mixture of alumina) in which inorganic particles are blended with the above epoxy resin material and the color after curing is white or gray .
The defective temperature which the flux penetrates through the seal and is exposed.
It is characterized in that the fuse is extracted and removed by visual inspection .
【0010】請求項2は、図3の(イ)、(ロ)に示す
ように、セラミックス基板の片面に一対の膜電極が設け
られ、これらの膜電極間に低融点金属片が接続され、該
低融点金属片にフラックスが付着され、各膜電極にリ−
ド線が接続され、セラミックス基板片面にエポキシ樹脂
材が被覆されてなる温度ヒュ−ズにおいて、上記エポキ
シ樹脂材に、無機質粒体が配合された硬化後の色彩が白
乃至はグレ−のエポキシ樹脂組成物(アルミナを配合し
たものを除く)を用い、フラックスが被覆層を貫通して
露出する不良温度ヒュ−ズを外観検査により摘出・排除
することを特徴とする構成である。請求項3は、図4に
示すように、アルミナセラミックス基板の片面に、所定
パタ−ンの膜電極が導電ペ−ストの印刷・焼付け等によ
り設けられ、該膜電極の抵抗取付部間にわたって膜抵抗
体が抵抗ぺ−ストの印刷・焼付け等により設けられ、同
上膜電極の温度ヒュ−ズ取付部間に低融点金属片が接続
され、該低融点金属片2上にフラックスが塗着され、同
上膜電極両端にリ−ド線が接続され、前記セラミックス
基板片面にエポキシ樹脂材が被覆されてなる基板型抵抗
・温度ヒュ−ズにおいて、上記エポキシ樹脂材に、硬化
後の色彩が白乃至はグレ−のエポキシ樹脂組成物(アル
ミナを配合したものを除く)を用い、フラックスが被覆
層を貫通して露出する不良基板型抵抗・温度ヒュ−ズを
外観検査により摘出・排除することを特徴とする。 According to a second aspect of the present invention, as shown in (a) and (b) of FIG. 3, a pair of membrane electrodes are provided on one surface of a ceramic substrate, and a low melting point metal piece is connected between these membrane electrodes. Flux is attached to the low melting point metal pieces and reattached to each membrane electrode.
In a temperature fuse in which a lead wire is connected and an epoxy resin material is coated on one surface of a ceramic substrate, an epoxy resin having a white or gray color after curing in which inorganic particles are mixed with the epoxy resin material Composition ( combined with alumina
(Excluding the ones), and the flux penetrates the coating layer.
Removal and elimination of exposed bad temperature fuses by visual inspection
The configuration is characterized in that Claim 3 is shown in FIG.
As shown, on one side of the alumina ceramic substrate,
The membrane electrode of the pattern is printed or printed with a conductive paste.
Is provided between the resistance attachment parts of the membrane electrode.
The body is provided by printing, baking, etc. of the resistance paste.
A low melting point metal piece is connected between the temperature fuse mounting parts of the upper membrane electrode.
Flux is applied to the low melting point metal piece 2 and
Lead wires are connected to both ends of the upper membrane electrode, and
Substrate type resistor with epoxy resin coated on one side of the substrate
・ Curing to the above epoxy resin material at temperature fuse
Epoxy resin composition whose color is white or gray
(Excluding those containing mina), and coated with flux
Defective substrate type resistance / temperature fuse exposed through the layer
The feature is that it is extracted and removed by visual inspection.
【0011】本発明において、エポキシ樹脂材には、炭
酸カルシウム、水酸化アルミニウム、タルク、シリカ、
酸化チタンの何れか、または二種以上が配合されたエポ
キシ樹脂組成物を使用することができる。In the present invention, the epoxy resin material includes calcium carbonate, aluminum hydroxide, talc, silica,
It is possible to use an epoxy resin composition containing any one of titanium oxides or two or more thereof.
【0012】[0012]
【作用】フラックスは松脂等のロジンを主成分とするか
ら、色彩は淡黄色乃至は茶褐色である。このフラックス
がケ−スタイプの合金型温度ヒュ−ズのエポキシ樹脂材
による封止部や基板型タイプの合金型温度ヒュ−ズのエ
ポキシ樹脂材による被覆層を貫通して露出しても、エポ
キシ樹脂材とフラックスとの色彩上の充分なコントラス
トのために(淡黄色乃至は茶褐色と白乃至はグレ−)、
外観検査によりそれを容易に認識してその不良合金型温
度ヒュ−ズを確実に摘出できる。[Function] Since the flux is mainly composed of rosin such as pine resin, the color is pale yellow or brown. Even if this flux penetrates and is exposed through the sealing part made of the case type alloy type temperature fuse epoxy resin material and the coating layer made of the board type alloy type temperature fuse epoxy resin material, the epoxy resin For a sufficient color contrast between wood and flux (pale yellow to brown and white to gray)
It can be easily recognized by visual inspection and the defective alloy type temperature fuse can be reliably extracted.
【0013】また、炭酸カルシウム、水酸化アルミニウ
ム、タルク、シリカ、酸化チタンはエポキシ樹脂絶縁物
のフィラ−若しくは白色顔料としての使用の実績が確立
されており、絶縁性は充分に保証できる。Calcium carbonate, aluminum hydroxide, talc, silica, and titanium oxide have a proven track record of use as fillers or white pigments in epoxy resin insulation, and the insulation can be sufficiently guaranteed.
【0014】[0014]
【実施例】以下、図面により本発明の実施例について説
明する。図1は、請求項1の対象とされるケ−スタイプ
の合金型温度ヒュ−ズの実施例を示す断面図である。図
1において、1,1は一直線状に配設されたリ−ド線、
2はリ−ド線1,1間に臘接または溶接により接続され
た低融点金属片である。3は低融点金属片2に塗着され
たフラックスであり、松脂等のロジンを主成分とし、活
性剤、例えば、アニリン塩酸塩等を少量添加したものを
使用でき、松脂中のアビエチン酸のために、色彩は淡黄
色乃至茶褐色である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of a case type alloy type temperature fuse to which the present invention is directed . In FIG. 1, 1 and 1 are lead wires arranged in a straight line,
Reference numeral 2 is a low melting point metal piece connected between the lead wires 1 and 1 by side contact or welding. 3 is a flux applied to the low-melting metal piece 2, which can be used as a main component of rosin such as pine resin and a small amount of an activator, such as aniline hydrochloride, for use with abietic acid in pine resin. In addition, the color is pale yellow to brown.
【0015】4はフラックス塗着低融点金属片上に被せ
られたセラミックス筒(通常、タルクセラミックスが使
用され、白色である)である。5,5はセラミックス筒
両端の各開口と各リ−ド線(通常、裸銅線または絶縁被
覆銅線が使用される)との間を封止したエポキシ樹脂材
であり、常温硬化性であり、炭酸カルシウム、水酸化ア
ルミニウム、タルク、シリカ、酸化チタン等の無機質粒
体が含有され、硬化物の色彩は白乃至はグレ−である。Reference numeral 4 denotes a ceramic cylinder (usually talc ceramics, which is white in color) covered on the flux-coated low melting point metal piece. Numerals 5 and 5 are epoxy resin materials that seal between each opening at both ends of the ceramic cylinder and each lead wire (usually a bare copper wire or an insulating coated copper wire is used) and are room temperature curable. Inorganic particles such as calcium carbonate, aluminum hydroxide, talc, silica and titanium oxide are contained, and the color of the cured product is white or gray.
【0016】図2の(イ)は、請求項1の対象とされる
ケ−スタイプの合金型温度ヒュ−ズの別実施例を示す断
面図、図2の(ロ)は図2の(イ)におけるロ−ロ断面
図である。図2の(イ)並びに図2の(ロ)において、
1,1は互いに並設されたリ−ド線、2はリ−ド線1,
1間に臘接または溶接により接続された低融点金属片で
ある。3は低融点金属片2に塗着されたフラックスであ
り、上記と同様、松脂等のロジンを主成分とし、活性
剤、例えば、アニリン塩酸塩等を少量添加したものを使
用でき、松脂中のアビエチン酸のために、色彩は淡黄色
乃至茶褐色である。FIG. 2A is a sectional view showing another embodiment of the case type alloy type temperature fuse , which is the subject of claim 1, and FIG. FIG. 2 is a sectional view taken along line (2) -2. In (a) of FIG. 2 and (b) of FIG.
1, 1 are lead wires arranged in parallel with each other, 2 are lead wires 1,
It is a low melting point metal piece connected between 1 by side contact or welding. 3 is a flux applied to the low melting point metal piece 2. As in the above, a flux containing rosin such as pine resin as a main component and a small amount of an activator such as aniline hydrochloride added can be used. The color is pale yellow to brown due to abietic acid.
【0017】4はフラックス塗着低融点金属片上に被せ
られた、一端にのみ開口を有する扁平なセラミックスケ
−ス(通常、アルミナセラミックスが使用され、白色で
ある)である。5はセラミックスケ−スの開口とリ−ド
線1,1(通常、裸銅線または絶縁被覆銅線が使用され
る)との間を封止したエポキシ樹脂材であり、上記と同
様、常温硬化性であり、炭酸カルシウム、水酸化アルミ
ニウム、タルク、シリカ、酸化チタン等の無機質粒体が
含有され、硬化物の色彩は白乃至はグレ−である。Reference numeral 4 is a flat ceramics case (usually made of alumina ceramics and white) which is covered with a flux-coated low melting point metal piece and has an opening only at one end. Reference numeral 5 denotes an epoxy resin material that seals between the opening of the ceramic case and the lead wires 1 and 1 (usually a bare copper wire or an insulating coated copper wire is used). It is curable and contains inorganic particles such as calcium carbonate, aluminum hydroxide, talc, silica and titanium oxide, and the color of the cured product is white or gray.
【0018】図3の(イ)は請求項2の対象とされる基
板タイプの合金型温度ヒュ−ズの実施例を示す説明図、
図3の(ロ)は図3の(イ)におけるロ−ロ断面図であ
る。図3の(イ)並びに図3の(ロ)において、40は
セラミックス基板(通常、アルミナセラミックスが使用
され、白色である)である。11,11はセラミックス
基板の片面に設けられた一対の膜電極であり、導電ペ−
ストの印刷・焼付けによる厚膜法や金属蒸着や電着法等
の薄膜法等により設けることができる。2は膜電極1
1,11間に臘接または溶接により接続された低融点金
属片である。FIG. 3A is an explanatory view showing an embodiment of a substrate type alloy type temperature fuse , which is the subject of claim 2 .
3B is a cross-sectional view taken along the line of FIG. 3A. In FIG. 3A and FIG. 3B, 40 is a ceramic substrate (usually made of alumina ceramic and white). Reference numerals 11 and 11 denote a pair of membrane electrodes provided on one surface of the ceramic substrate.
It can be provided by a thick film method by printing / baking a strike, or a thin film method such as metal deposition or electrodeposition. 2 is a membrane electrode 1
It is a low melting point metal piece connected between 1 and 11 by side contact or welding.
【0019】3は低融点金属片に塗着されたフラックス
であり、上記と同様、松脂等のロジンを主成分とし、活
性剤、例えば、アニリン塩酸塩等を少量添加したものを
使用できる。1,1は各膜電極11,11に臘接または
溶接により接続されたリ−ド線(通常、絶縁被覆銅線ま
たは裸銅線が使用される)である。50はセラミックス
基板40の片面上に被覆されたエポキシ樹脂材であり、
上記と同様、常温硬化性であり、炭酸カルシウム、水酸
化アルミニウム、タルク、シリカ、酸化チタン等の無機
質粒体が含有され、硬化物の色彩は白乃至はグレ−であ
る。Numeral 3 is a flux applied to a low melting point metal piece, and similarly to the above, a flux containing rosin such as pine resin as a main component and a small amount of an activator such as aniline hydrochloride can be used. Numerals 1 and 1 are lead wires (usually insulating coated copper wires or bare copper wires are used) connected to each of the membrane electrodes 11 and 11 by contact or welding. 50 is an epoxy resin material coated on one side of the ceramic substrate 40,
Similar to the above, it is room temperature curable, contains inorganic particles such as calcium carbonate, aluminum hydroxide, talc, silica and titanium oxide, and the color of the cured product is white or gray.
【0020】上記エポキシ樹脂材としては、アミン類の
常温硬化剤を配合したほぼ無色のエポキシ樹脂に炭酸カ
ルシウム、水酸化アルミニウム、タルク、シリカ、酸化
チタン等の何れか、または二種以上の無機質粒体を30
〜60重量%配合したものを使用できる。As the above-mentioned epoxy resin material, a substantially colorless epoxy resin containing a room temperature curing agent of amines is used, and any one of calcium carbonate, aluminum hydroxide, talc, silica, titanium oxide, etc., or two or more kinds of inorganic particles are used. Body 30
It is possible to use a mixture of -60% by weight.
【0021】本発明においては、基板タイプの合金型温
度ヒュ−ズの場合、セラミックス基板の裏面に抵抗取付
け用膜電極を設け、これらの電極間にまたがって膜抵抗
体を抵抗ペ−ストの印刷・焼付けにより設け、これらの
各電極にリ−ド線を接続し、上記エポキシ樹脂材をセラ
ミックス基板の両面を含めた全体に被覆して、基板型抵
抗・温度ヒュ−ズとして実施することもできる。In the present invention, in the case of a substrate type alloy type temperature fuse, a resistance mounting film electrode is provided on the back surface of the ceramic substrate, and a film resistor is printed on the resistance paste across these electrodes. It is also possible to implement it as a substrate type resistance / temperature fuse by providing it by baking, connecting lead wires to each of these electrodes, and covering the entire surface of the ceramic substrate including both sides of the epoxy resin material. .
【0022】また、図4に示す基板型抵抗・温度ヒュ−
ズのように、セラミックス基板(通常、アルミナセラミ
ックスが使用され、白色である)40の片面に、所定パ
タ−ンの膜電極12を導電ペ−ストの印刷・焼付け等に
より設け、該膜電極の抵抗取付部121,121間にわ
たって膜抵抗体6を抵抗ぺ−ストの印刷・焼付け等によ
り設け、同上膜電極12の温度ヒュ−ズ取付部122,
122間に低融点金属片2を接続し、該低融点金属片2
上にフラックス3(上記と同様、松脂等のロジンを主成
分とし、活性剤、例えば、アニリン塩酸塩等を少量添加
したもの)を塗着し、同上膜電極12の両端にリ−ド線
1,1を接続し、セラミックス基板片面に、上記と同
様、常温硬化性で、炭酸カルシウム、水酸化アルミニウ
ム、タルク、シリカ、酸化チタン等の何れか、または二
種以上の無機質粒体が含有され、硬化物の色彩が白乃至
はグレ−とされたエポキシ樹脂材50を被覆することに
より実施することもできる。The substrate type resistance / temperature fuse shown in FIG.
As shown in FIG. 5, a ceramic substrate (usually made of alumina ceramics, which is white) 40 is provided on one surface thereof with a membrane electrode 12 of a predetermined pattern by printing or baking a conductive paste. The film resistor 6 is provided between the resistance mounting portions 121, 121 by printing or baking a resistance paste, and the temperature fuse mounting portion 122, of the same as above.
The low melting point metal piece 2 is connected between 122 and the low melting point metal piece 2
Flux 3 (similar to the above, containing rosin such as pine resin as a main component and a small amount of an activator, for example, aniline hydrochloride, etc.) was applied, and the lead wire 1 was attached to both ends of the same membrane electrode 12. , 1 is connected, and one side of the ceramic substrate contains room temperature-curable one of calcium carbonate, aluminum hydroxide, talc, silica, titanium oxide, etc., or two or more kinds of inorganic particles, as described above. It can also be carried out by coating an epoxy resin material 50 in which the color of the cured product is white or gray.
【0024】なお、図3に示す基板型温度ヒュ−ズ並び
に図4に示す基板型抵抗・温度ヒュ−ズにおいては、基
板の片面のみならず、他面にも、即ち両面に、上記の常
温硬化性で、炭酸カルシウム、水酸化アルミニウム、タ
ルク、シリカ、酸化チタン等の何れか、または二種以上
の無機質粒体が含有され、硬化物の色彩が白乃至はグレ
−とされたエポキシ樹脂材を浸漬塗装法等により被覆す
ることもできる。In the substrate type temperature fuse shown in FIG. 3 and the substrate type resistance / temperature fuse shown in FIG. 4, not only one side of the substrate but also the other side, that is, both sides of the above room temperature An epoxy resin material that is curable and contains any of calcium carbonate, aluminum hydroxide, talc, silica, titanium oxide, etc., or two or more kinds of inorganic particles, and the color of the cured product is white or gray. Can also be coated by a dip coating method or the like.
【0024】[0024]
【発明の効果】本発明に係る合金型温度ヒュ−ズの検査
方法においては、ケ−スタイプの合金型温度ヒュ−ズの
エポキシ樹脂封止材または基板タイプの合金型温度ヒュ
−ズのエポキシ樹脂被覆材に無機質粒体を配合し、その
無機質粒体に炭酸カルシウム、水酸化アルミニウム、タ
ルク、シリカ、酸化チタン等を使用し、その封止部また
は被覆層の硬化後の色彩を白色乃至はグレ−にして、低
融点金属片に塗着するフラックス(淡黄色乃至は茶褐
色)との色彩的なコントラストを高めているから、フラ
ックスが封止部または被覆層を貫通して露出する不良品
を外観検査により確実に摘出・排除でき、かかる不良品
による電気機器の保全不良を回避できる。INDUSTRIAL APPLICABILITY Inspection of alloy type temperature fuse according to the present invention
In the method , inorganic particles are blended with a case type alloy type temperature fuse epoxy resin encapsulant or a substrate type alloy temperature fuse epoxy resin coating material, and calcium carbonate is added to the inorganic particles. , Aluminum hydroxide, talc, silica, titanium oxide, etc., the color after curing of the sealing portion or the coating layer is white or gray, and the flux (pale yellow to light yellow to Since it has a higher color contrast with dark brown, defective products with flux penetrating and exposing the sealing part or coating layer can be reliably extracted and eliminated by visual inspection, and the electrical equipment is protected by such defective products. You can avoid defects.
【0025】また、炭酸カルシウム、水酸化アルミニウ
ム、タルク、シリカ、酸化チタン等についてはエポキシ
樹脂絶縁材のフィラ−として使用実績が確立されてお
り、合金型温度ヒュ−ズの絶縁性も良く保証できる。Further, calcium carbonate, aluminum hydroxide, talc, silica, titanium oxide, etc. have been established as fillers for epoxy resin insulating materials, and the insulating properties of alloy type temperature fuses can be well guaranteed. .
【図1】請求項1を示すケースタイプ温度ヒューズの断
面図である。FIG. 1 is a cross-sectional view of a case type thermal fuse showing claim 1.
【図2】図2の(イ)は請求項1を示すケースタイプ温
度ヒューズの別例の断面図、図2の(ロ)は図2の
(イ)におけるロ−ロ断面図である。FIG. 2A is a sectional view of another example of the case type thermal fuse according to claim 1, and FIG. 2B is a sectional view taken along line A-B of FIG.
【図3】図3の(イ)は請求項2を示す基板型温度ヒュ
ーズの説明図、図3の(ロ)は図3の(イ)におけるロ
−ロ断面図である。3 (A) is an explanatory view of a substrate type thermal fuse showing claim 2, and FIG. 3 (B) is a cross-sectional view taken along the line of FIG. 3 (A).
【図4】請求項3を示す基板型抵抗温度ヒューズの説明
図である。FIG. 4 is an explanatory view of a substrate type resistance temperature fuse showing a third aspect.
1 リ−ド線 2 低融点金属片 3 フラックス 4 セラミックス筒 5 エポキシ樹脂材 11 膜電極 12 膜電極 40 セラミックス基板 50 エポキシ樹脂材 1 lead wire 2 Low melting point metal pieces 3 flux 4 Ceramics tube 5 Epoxy resin material 11 Membrane electrode 12 membrane electrodes 40 ceramics substrate 50 Epoxy resin material
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭50−111562(JP,A) 実開 平3−91642(JP,U) 実開 昭58−14643(JP,U) (58)調査した分野(Int.Cl.7,DB名) H01H 37/76 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-50-111562 (JP, A) Actual development Hei 3-91642 (JP, U) Actual development Sho-58-14643 (JP, U) (58) Survey Field (Int.Cl. 7 , DB name) H01H 37/76
Claims (4)
低融点金属片にフラックスが付着され、該フラックス付
着低融点金属片がセラミックスケ−スで覆われ、該セラ
ミックスケ−スの開口と上記のリ−ド線との間がエポキ
シ樹脂材により封止されてなる温度ヒュ−ズにおいて、
上記エポキシ樹脂材に、硬化後の色彩が白乃至はグレ−
のエポキシ樹脂組成物(アルミナを配合したものを除
く)を用い、フラックスが封止部を貫通して露出する不
良温度ヒュ−ズを外観検査により摘出・排除することを
特徴とする合金型温度ヒュ−ズの検査方法。 1. A low melting point metal piece is connected between lead wires, a flux is adhered to the low melting point metal piece, and the flux adhering low melting point metal piece is covered with a ceramic case. In the temperature fuse which is sealed with an epoxy resin material between the opening of the space and the lead wire,
The color of the epoxy resin material after curing is white or gray.
Epoxy resin composition (excluding those containing alumina)
() Is used to prevent the flux from penetrating the seal and being exposed.
To remove and remove good temperature fuses by visual inspection
Characteristic alloy type temperature fuse inspection method.
設けられ、これらの膜電極間に低融点金属片が接続さ
れ、該低融点金属片にフラックスが付着され、各膜電極
にリ−ド線が接続され、セラミックス基板片面にエポキ
シ樹脂材が被覆されてなる温度ヒュ−ズにおいて、上記
エポキシ樹脂材に、硬化後の色彩が白乃至はグレ−のエ
ポキシ樹脂組成物(アルミナを配合したものを除く)を
用い、フラックスが被覆層を貫通して露出する不良温度
ヒュ−ズを外観検査により摘出・排除することを特徴と
する合金型温度ヒュ−ズの検査方法。 2. A pair of membrane electrodes are provided on one surface of a ceramic substrate, a low melting point metal piece is connected between these membrane electrodes, flux is attached to the low melting point metal piece, and a lead is attached to each membrane electrode. In a temperature fuse in which wires are connected and one surface of a ceramic substrate is coated with an epoxy resin material, an epoxy resin composition (alumina compounded with a cured color of white or gray is added to the above epoxy resin material. Except)
Bad temperature at which flux is exposed through the coating layer
Characterized by removing and removing fuses by visual inspection
Alloy type temperature fuse inspection method.
パタ−ンの膜電極が導電ペ−ストの印刷・焼付け等によ
り設けられ、該膜電極の抵抗取付部間にわたって膜抵抗
体が抵抗ぺ−ストの印刷・焼付け等により設けられ、同
上膜電極の温度ヒュ−ズ取付部間に低融点金属片が接続
され、該低融点金属片2上にフラックスが塗着され、同
上膜電極両端にリ−ド線が接続され、前記セラミックス
基板片面にエポキシ樹脂材が被覆されてなる基板型抵抗
・温度ヒュ−ズにおいて、上記エポキシ樹脂材に、硬化
後の色彩が白乃至はグレ−のエポキシ樹脂組成物(アル
ミナを配合したものを除く)を用い、フラックスが被覆
層を貫通して露出する不良基板型抵抗・温度ヒュ−ズを
外観検査により摘出・排除することを特徴とする基板型
抵抗・温度ヒュ−ズの検査方法。 3. A predetermined surface is formed on one side of an alumina ceramic substrate.
The membrane electrode of the pattern is printed or printed with a conductive paste.
Is provided between the resistance attachment parts of the membrane electrode.
The body is provided by printing, baking, etc. of the resistance paste.
A low melting point metal piece is connected between the temperature fuse mounting parts of the upper membrane electrode.
Flux is applied to the low melting point metal piece 2 and
Lead wires are connected to both ends of the upper membrane electrode, and
Substrate type resistor with epoxy resin coated on one side of the substrate
・ Curing to the above epoxy resin material at temperature fuse
Epoxy resin composition whose color is white or gray
(Excluding those containing mina), and coated with flux
Defective substrate type resistance / temperature fuse exposed through the layer
Substrate type characterized by being removed and removed by visual inspection
Resistance / temperature fuse inspection method.
ズの検査方法で検査される合金型温度ヒュ−ズであり、
エポキシ樹脂組成物に、炭酸カルシウム、水酸化アルミ
ニウム、タルク、シリカ、酸化チタンの何れか、または
二種以上が配合されている合金型温度ヒュ−ズ。4. The alloy type temperature fuse according to claim 1 or 2.
It is an alloy type temperature fuse that is inspected by the inspection method of
An alloy type temperature fuse in which any of calcium carbonate, aluminum hydroxide, talc, silica, titanium oxide, or two or more kinds thereof are mixed in the epoxy resin composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18995694A JP3401331B2 (en) | 1994-07-20 | 1994-07-20 | Inspection method of alloy mold temperature fuse and alloy mold temperature fuse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18995694A JP3401331B2 (en) | 1994-07-20 | 1994-07-20 | Inspection method of alloy mold temperature fuse and alloy mold temperature fuse |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0831283A JPH0831283A (en) | 1996-02-02 |
JP3401331B2 true JP3401331B2 (en) | 2003-04-28 |
Family
ID=16250012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18995694A Expired - Fee Related JP3401331B2 (en) | 1994-07-20 | 1994-07-20 | Inspection method of alloy mold temperature fuse and alloy mold temperature fuse |
Country Status (1)
Country | Link |
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JP (1) | JP3401331B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3478785B2 (en) | 2000-07-21 | 2003-12-15 | 松下電器産業株式会社 | Thermal fuse and battery pack |
KR20020047722A (en) * | 2000-12-14 | 2002-06-22 | 홍정표 | Pico-Fuse And Method of Making Thereof |
US6838971B2 (en) | 2001-05-21 | 2005-01-04 | Matsushita Electric Industrial Co., Ltd. | Thermal fuse |
JP4207686B2 (en) | 2003-07-01 | 2009-01-14 | パナソニック株式会社 | Fuse, battery pack and fuse manufacturing method using the same |
US20090159354A1 (en) * | 2007-12-25 | 2009-06-25 | Wenfeng Jiang | Battery system having interconnected battery packs each having multiple electrochemical storage cells |
US8404379B2 (en) | 2007-12-25 | 2013-03-26 | Byd Co., Ltd. | Vehicle with a battery system |
-
1994
- 1994-07-20 JP JP18995694A patent/JP3401331B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JPH0831283A (en) | 1996-02-02 |
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