JP3392532B2 - Manufacturing method of sintered products - Google Patents
Manufacturing method of sintered productsInfo
- Publication number
- JP3392532B2 JP3392532B2 JP20245094A JP20245094A JP3392532B2 JP 3392532 B2 JP3392532 B2 JP 3392532B2 JP 20245094 A JP20245094 A JP 20245094A JP 20245094 A JP20245094 A JP 20245094A JP 3392532 B2 JP3392532 B2 JP 3392532B2
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- holder
- sintering
- binder
- sintered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Powder Metallurgy (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、焼結製品の製造方法、
特に焼結用粉末を含む成形品を焼結させて焼結製品を製
造する方法に関する。FIELD OF THE INVENTION The present invention relates to a method for producing a sintered product,
In particular, the present invention relates to a method for producing a sintered product by sintering a molded product containing sintering powder.
【０００２】[0002]
【従来の技術】金属やセラミックなどの粉末を所定の形
状に成形したあと焼結させて各種の焼結製品を製造する
ことが行われている。通常の焼結用粉末は、そのままで
は成形し難いので焼結用粉末にワックスやポリマーなど
の有機物質からなる結合剤いわゆるバインダーを混合し
て成形し易い状態にし、この成形材料を射出成形などの
成形方法で目的の製品形状に対応する形状の成形品に成
形している。この成形品は、そのまま焼結工程に供し
て、結合剤の除去および焼結用粉末の焼結を行う場合も
あるが、結合剤の除去工程すなわち脱脂工程を行った後
で、結合剤が除去された成形品を焼結工程に供する場合
もある。このように、結合剤の除去工程を焼結工程とは
別に行う方法は、成形品に含まれる結合剤の割合が多い
場合に好ましい方法である。2. Description of the Related Art Various kinds of sintered products are manufactured by forming powder of metal or ceramic into a predetermined shape and then sintering the powder. Ordinary sintering powder is difficult to mold as it is, so a binder, or binder, made of an organic substance such as wax or polymer is mixed with the sintering powder to make it easy to mold. The molding method is used to mold the product into a shape that corresponds to the desired product shape. This molded product may be directly subjected to the sintering step to remove the binder and sinter the sintering powder, but after the binder removing step, that is, the degreasing step, the binder is removed. The formed product may be subjected to a sintering process. As described above, the method of performing the binder removal step separately from the sintering step is a preferable method when the proportion of the binder contained in the molded product is large.
【０００３】成形品の成形を射出成形で行う場合には、
成形を行い易くするなどの目的で結合剤の割合が多くな
る。成形材料に占める結合剤の割合が多くなると、焼結
工程だけでは結合剤を十分に除去することが困難になる
ため、焼結工程とは別に結合剤の除去工程が必要にな
る。従来、結合剤の除去方法としては、例えば、結合剤
がワックス成分とポリマー成分との混合物である場合、
成形品を徐々に加熱しながらワックス成分およびポリマ
ー成分を順に除去する加熱脱脂法が提案されている。ま
た、成形品を溶剤中もしくは溶剤雰囲気中にさらして、
溶剤に溶解するワックス成分を除去した後、成形品を加
熱してポリマー成分を溶融除去する方法も提案されてい
る（英国特許第１５１６０７９号参照）。When a molded product is molded by injection molding,
The proportion of the binder is increased for the purpose of facilitating molding. When the proportion of the binder in the molding material is large, it is difficult to sufficiently remove the binder only by the sintering step, so that a binder removing step is required in addition to the sintering step. Conventionally, as a method of removing the binder, for example, when the binder is a mixture of a wax component and a polymer component,
A heating degreasing method has been proposed in which a wax component and a polymer component are sequentially removed while gradually heating a molded product. Also, expose the molded product to a solvent or solvent atmosphere,
A method has also been proposed in which a wax component dissolved in a solvent is removed and then a molded article is heated to melt and remove a polymer component (see British Patent No. 1516079).
【０００４】[0004]
【発明が解決しようとする課題】結合剤がワックス成分
とポリマー成分とからなる場合、結合剤の除去工程で成
形品の変形が生じ易いという問題がある。これは、結合
剤の除去工程では、ワックス成分が軟化し流動化または
液状化して成形品の外部に排出されるので、このワック
ス成分の流動化のために、成形品の形状保持性が低下し
てしまうのである。成形品に凹凸形状がある場合、成形
品の支持面で直接に支持されていない凹部あるいは凸部
が自重で変形してしまうことになる。When the binder is composed of a wax component and a polymer component, there is a problem that the molded article is likely to be deformed in the step of removing the binder. This is because in the binder removing step, the wax component is softened and fluidized or liquefied to be discharged to the outside of the molded article, so that the fluidization of the wax component lowers the shape retention of the molded article. It will end up. When the molded product has an uneven shape, the concave portion or the convex portion which is not directly supported by the supporting surface of the molded product is deformed by its own weight.
【０００５】具体的には、図１６に示すような断面Ｈ形
の成形品Ｍでは、成形時点では点線で示す水平片ｈが、
結合剤の除去工程で前記のようなワックス成分の流動化
が起こって成形品Ｍの形状保持性が低下すると、図に実
線で示すように、水平片ｈの中央部分が自重で下向きに
垂れるように変形してしまうのである。このように変形
した成形品Ｍを焼結すれば、得られた焼結製品にも水平
片ｈの垂れ変形が生じてしまう。Specifically, in a molded product M having an H-shaped cross section as shown in FIG. 16, a horizontal piece h indicated by a dotted line at the time of molding is
When the wax component is fluidized as described above in the binder removal step and the shape retention of the molded article M is deteriorated, the central portion of the horizontal piece h hangs downward by its own weight as shown by the solid line in the figure. It will be transformed into. When the deformed molded product M is sintered, the horizontal piece h also sags and deforms in the obtained sintered product.
【０００６】さらに、焼結用粉末に対する結合剤の割合
が多い成形材料を用いた場合には、焼結工程において
も、上記結合剤の除去工程の場合と同じような成形品の
変形が生じ易くなる。そこで、結合剤の除去工程および
焼結工程において、成形品のうち変形する可能性のある
部分を変形しないように保持しておく保持具いわゆるセ
ッターを用いることが考えられた。Further, when a molding material having a large ratio of the binder to the sintering powder is used, deformation of the molded product is likely to occur in the sintering step as in the case of the binder removing step. Become. Therefore, in the binder removing step and the sintering step, it was considered to use a so-called setter that holds a portion of the molded product that may be deformed so as not to be deformed.
【０００７】保持具は、成形品の凹凸形状に合致する凹
凸形状を有し、結合剤の除去工程や焼結工程における加
熱あるいは溶剤との接触で変形したり溶融しない材料で
作製される。ところが、焼結工程における成形品の収縮
率が大きいと、成形品の凹凸形状に合わせて作製された
保持具の凹凸形状は、焼結工程で収縮変形した成形品の
凹凸形状には合わなくなる。焼結工程での成形品の収縮
形状に合わせて保持具の凹凸形状を作製しておくと、結
合剤の除去工程では、保持具の凹凸形状と成形品の凹凸
形状との間に大きな隙間があいてしまい、成形品の形状
保持を果たすことができない。The holder has an uneven shape that matches the uneven shape of the molded product, and is made of a material that is not deformed or melted by heating in the binder removing step or sintering step or contact with a solvent. However, if the shrinkage rate of the molded product in the sintering step is large, the uneven shape of the holder manufactured according to the uneven shape of the molded product does not match the uneven shape of the molded product that is contracted and deformed in the sintering process. If the uneven shape of the holder is prepared according to the contracted shape of the molded product in the sintering step, a large gap will be created between the uneven shape of the holder and the uneven shape of the molded product in the binder removal step. The shape of the molded product cannot be maintained because it is opened.
【０００８】例えば、焼結用粉末と結合剤との配合比が
体積比で５０：５０である場合、焼結工程で約２０％も
の収縮を起こす。このような場合には、同じ形状の保持
具を結合剤の除去工程と焼結工程とで兼用することは不
可能である。そこで、結合剤の除去工程と焼結工程と
で、凹凸形状の寸法が異なるそれぞれに専用の保持具を
用いることが考えられた。しかし、この場合、結合剤の
除去工程が終了した後で、結合剤の除去工程で用いた保
持具から焼結工程に用いる保持具へと成形品を移し替え
る作業を行う必要がある。ところが、この移し替え作業
の際に、結合剤が除去された成形品が破損し易いという
問題がある。For example, when the mixing ratio of the sintering powder and the binder is 50:50 by volume, shrinkage of about 20% occurs in the sintering process. In such a case, it is impossible to use the holder having the same shape in both the binder removing step and the sintering step. Therefore, it has been considered to use a dedicated holder for each of the concave and convex shapes having different dimensions in the binder removing step and the sintering step. However, in this case, after the binder removal step is completed, it is necessary to transfer the molded product from the holder used in the binder removal step to the holder used in the sintering step. However, there is a problem that the molded product from which the binder has been removed is easily damaged during the transfer operation.
【０００９】これは、焼結用粉末を結合させていた結合
剤が無くなった状態の成形品は非常に脆く壊れやすいた
め、保持具から保持具への移し替えを行うだけでも破損
してしまうのである。本発明の目的は、上記のような焼
結製品の製造方法における問題点を解消し、凹凸形状を
有する成形品を変形や破損を起こすことなく結合剤の除
去および焼結を行って、仕上がり品質の良好な焼結製品
を得ることにある。[0009] This is because a molded product in a state where the binder used to bond the sintering powder has been lost is very brittle and easily broken, and therefore, it is damaged even if the holder is transferred from one holder to another. is there. The object of the present invention is to solve the problems in the method for producing a sintered product as described above, to remove a binder and sinter a molded product having an uneven shape without causing deformation or damage, and to obtain a finished quality. To obtain a good sintered product.
【００１０】[0010]
【課題を解決するための手段】本発明の焼結製品の製造
方法のうち、第１の方法は、焼結用粉末を含む成形品を
焼結させて焼結製品を製造する方法であり、成形工程、
ワックス成分除去工程、ポリマー成分除去工程および焼
結工程を備えている。成形工程は、ワックス成分とポリ
マー成分とを含む結合剤と焼結用粉末との混合物を成形
して凹凸形状を有する成形品を得る。ワックス成分除去
工程は、前記工程で得られた成形品を、前記凹凸形状に
合致する凹凸形状を有する第１の保持具に保持した状態
でワックス成分を除去する。ポリマー成分除去工程は、
前記工程でワックス成分が除去された成形品を、焼結に
伴う収縮量に見合う隙間を前記凹凸形状との間に有する
第２の保持具に保持した状態でポリマー成分を除去す
る。焼結工程は、前記工程でポリマー成分が除去された
成形品を、前記第２の保持具に保持した状態で焼結させ
る。Of the methods for producing a sintered product of the present invention, the first method is a method for producing a sintered product by sintering a molded article containing sintering powder, Molding process,
A wax component removing step, a polymer component removing step, and a sintering step are provided. In the molding step, a mixture of a binder containing a wax component and a polymer component and sintering powder is molded to obtain a molded product having an uneven shape. In the wax component removing step, the wax component is removed while the molded product obtained in the above step is held by the first holder having an uneven shape that matches the uneven shape. The polymer component removal process is
The polymer component is removed while the molded product from which the wax component has been removed in the above step is held by the second holding tool having a gap between the uneven shape and the shrinkage amount due to sintering. In the sintering step, the molded product from which the polymer component has been removed in the above step is sintered while being held by the second holder.
【００１１】なお、前記混合物が、焼結用粉末にポリマ
ー成分を被覆処理した後ワックス成分を混合したもので
あることができる。次に、上記方法とは別の製造方法を
説明する。以下に説明する第２〜６の方法は、本発明の
技術範囲からは外れる参考技術である。第２の方法は、
成形工程、部分焼結工程および全体焼結工程を備えてい
る。成形工程は前記方法と同じである。部分焼結工程
は、前記工程で得られた成形品のうち形状保持に必要な
一部に対して結合剤の除去および焼結を行って部分焼結
成形品を得る。全体焼結工程は、前記工程で得られた部
分焼結成形品の全体に対して結合剤の除去および焼結を
行う。The mixture may be a powder obtained by coating a powder for sintering with a polymer component and then mixing the wax component. Next, a manufacturing method different from the above method
explain. The second to sixth methods described below are the methods of the present invention.
It is a reference technology outside the technical scope. The second method is
The molding process, the partial sintering process, and the whole sintering process are provided. The molding process is the same as the above method. In the partial sintering step, the binder is removed and the part of the molded product obtained in the above step necessary for maintaining the shape is removed and sintered to obtain a partially sintered molded product. In the whole sintering step, the binder is removed and the whole sintered part obtained in the above step is removed and sintered.
【００１２】なお、前記部分焼結工程で、前記成形品の
一部に対して結合剤の除去および焼結を行う手段とし
て、高温流体、プラズマ、レーザーあるいは高周波を作
用させる方法が採用できる。第３の方法は、成形工程、
多孔性ポリマー被覆工程、ワックス成分除去工程、ポリ
マー除去工程および焼結工程を備えている。成形工程は
前記方法と同じである。多孔性ポリマー被覆工程は、前
記成形品を得る工程の途中または後で前記成形品に多孔
性ポリマーを被覆する。ワックス成分除去工程は、前記
工程で多孔性ポリマーが被覆された成形品から前記ワッ
クス成分を除去する。ポリマー除去工程は、前記工程で
ワックス成分が除去された成形品から前記ポリマー成分
および多孔性ポリマーを除去する。焼結工程は、前記工
程でポリマー成分および多孔性ポリマーが除去された成
形品を焼結する。As a means for removing the binder and sintering the part of the molded product in the partial sintering step, a method of applying a high temperature fluid, plasma, laser or high frequency can be adopted. The third method is a molding step,
It comprises a porous polymer coating step, a wax component removing step, a polymer removing step and a sintering step. The molding process is the same as the above method. In the porous polymer coating step, the molded article is coated with the porous polymer during or after the step of obtaining the molded article. In the wax component removing step, the wax component is removed from the molded article coated with the porous polymer in the step. The polymer removing step removes the polymer component and the porous polymer from the molded product from which the wax component has been removed in the above step. In the sintering step, the molded product from which the polymer component and the porous polymer have been removed in the above step is sintered.
【００１３】第４の方法は、成形工程、ワックス成分除
去工程、ポリマー成分除去工程、保持具縮小工程および
焼結工程を備えている。成形工程は前記方法と同じであ
る。ワックス成分除去工程は、前記工程で得られた成形
品を、その凹凸形状に合致する凹凸形状を有する保持具
に保持した状態でワックス成分を除去する。ポリマー成
分除去工程は、前記工程でワックス成分が除去された成
形品からポリマー成分を除去する。保持具縮小工程は、
前記ポリマー成分の除去と同時または後で、成形品が配
置されたままで保持具を焼結に伴う成形品の収縮形状に
合わせて縮小させる。焼結工程は、前記工程でポリマー
成分が除去された成形品を縮小された保持具に保持した
状態で焼結させる。The fourth method comprises a molding step, a wax component removing step, a polymer component removing step, a holder reducing step and a sintering step. The molding process is the same as the above method. In the wax component removing step, the wax component is removed while the molded product obtained in the above step is held by a holder having an uneven shape that matches the uneven shape. The polymer component removing step removes the polymer component from the molded product from which the wax component has been removed in the above step. The retainer reduction process is
Simultaneously with or after the removal of the polymer component, the holder is reduced in conformity with the contracted shape of the molded product due to sintering while the molded product is arranged. In the sintering step, the molded product from which the polymer component has been removed in the above step is sintered while being held in a reduced holder.
【００１４】なお、保持具縮小工程は、保持具の一部を
加熱により溶融させて除去したり、保持具の一部を加熱
により収縮変形させたりする方法が採用できる。第５の
方法は、成形工程、ワックス成分除去工程、ポリマー成
分除去工程および焼結工程を備えている。成形工程は前
記方法と同じである。ワックス成分除去工程は、前記工
程で得られた成形品を、前記凹凸形状に合致する凹凸形
状を有するとともに加熱収縮特性が成形品と同じ保持具
に保持した状態でワックス成分を除去する。ポリマー成
分除去工程は、前記工程でワックス成分が除去された成
形品を、保持具に保持した状態でポリマー成分を除去す
る。焼結工程は、前記工程でポリマー成分が除去された
成形品を、前記保持具に保持した状態で焼結させる。In the holder contraction step, a method of melting and removing a part of the holder by heating or shrinking and deforming a part of the holder by heating can be adopted. The fifth method includes a molding step, a wax component removing step, a polymer component removing step, and a sintering step. The molding process is the same as the above method. In the wax component removing step, the wax component is removed while the molded product obtained in the above step is held in a holder having an uneven shape that matches the uneven shape and having the same heat shrinkage property as the molded product. In the polymer component removing step, the polymer component is removed while the molded product from which the wax component has been removed in the above step is held by a holder. In the sintering step, the molded product from which the polymer component has been removed in the above step is sintered while being held by the holder.
【００１５】第６の方法は、成形工程、結合剤除去工
程、焼結用保持工程および焼結工程を備えている。成形
工程は前記方法と同じである。結合剤除去工程は、前記
工程で得られた成形品を、非接触で保持する手段で保持
した状態で結合剤を除去する。焼結用保持工程は、前記
工程で結合剤が除去された成形品を、前記非接触保持手
段による保持を解除し焼結用保持具の上に落下させて成
形品を焼結用保持具に保持させる。焼結工程は、前記焼
結用保持具に保持された成形品を焼結させる。The sixth method comprises a forming step, a binder removing step, a sintering holding step and a sintering step. The molding process is the same as the above method. In the binder removal step, the binder obtained is removed while the molded product obtained in the above step is held by a non-contact holding means. In the sintering holding step, the molded product from which the binder has been removed in the above step is released from the holding by the non-contact holding means and dropped onto the sintering holder to make the molded product a sintering holder. Hold it. In the sintering step, the molded product held by the sintering holder is sintered.
【００１６】[0016]
【作用】本発明の焼結製品の製造方法のうち、第１の方
法は、焼結前の成形品の凹凸形状に合致する凹凸形状を
有する第１の保持具を用いてワックス成分除去工程を行
うので、この工程における成形品の形状保持は確実に行
える。ポリマー成分除去工程では、焼結に伴う収縮量に
見合う隙間を前記凹凸形状との間に有する第２の保持具
すなわち焼結用の保持具を用いる。結合剤からワックス
成分が除去されてしまいポリマー成分だけになった成形
品は変形し難いので、成形品と第２の保持具との間に隙
間があいていても成形品が変形することはない。結合剤
が除去された成形品は脆く壊れやすいが、第２の保持具
に保持されたままでポリマー成分除去工程から焼結工程
へと移行するので、成形品の破損を良好に防止できる。In the method for producing a sintered product according to the present invention, the first method is a wax component removing step using a first holder having an uneven shape that matches the uneven shape of a molded product before sintering. Since this is performed, the shape of the molded product can be reliably retained in this step. In the polymer component removing step, a second holder, that is, a holder for sintering, which has a gap between the uneven shape and a gap corresponding to the shrinkage amount due to sintering is used. Since the wax component is removed from the binder and the molded product containing only the polymer component is difficult to deform, the molded product does not deform even if there is a gap between the molded product and the second holder. . The molded product from which the binder has been removed is brittle and fragile, but since the process proceeds from the polymer component removal step to the sintering step while still being held by the second holder, damage to the molded product can be satisfactorily prevented.
【００１７】なお、前記混合物が、焼結用粉末にポリマ
ー成分を被覆処理した後ワックス成分を混合したもので
あれば、焼結用粉末を被覆したポリマー成分の外周にワ
ックス成分が存在するので、ワックス成分除去工程でワ
ックス成分の除去が容易に行える。ワックス成分が除去
されたあとも焼結用粉末がポリマー成分で被覆されてい
るので成形品の形状保持性が高く、ワックス成分除去工
程からポリマー成分除去工程に移行する間およびポリマ
ー成分除去工程においても、成形品の変形が良好に防止
できる。If the mixture is a mixture of the powder for sintering and the wax component after coating with the polymer component, the wax component is present around the polymer component coated with the powder for sintering. The wax component can be easily removed in the wax component removing step. Since the powder for sintering is covered with the polymer component even after the wax component is removed, the shape retention of the molded article is high, and even during the transition from the wax component removal process to the polymer component removal process and also in the polymer component removal process. The deformation of the molded product can be prevented well.
【００１８】第２の方法は、部分焼結工程では成形品の
一部のみで結合剤の除去および焼結を行うので、残りの
大部分の成形品が有する形状保持力で成形品全体の変形
を防止することができる。部分焼結工程を終えた部分焼
結成形品は、焼結部分が有する高い剛性により、成形品
全体の形状保持性が高められており、このような部分焼
結成形品を用いて全体焼結工程を行うので、この全体焼
結工程のうちの結合剤の除去工程では、成形品をその凹
凸形状に合致する保持具で保持しておかなくても、成形
品が変形を起こすことはない。In the second method, since the binder is removed and sintered only in a part of the molded product in the partial sintering step, the entire molded product is deformed by the shape-retaining force of most of the remaining molded products. Can be prevented. The partially-sintered molded products that have undergone the partial-sintering process have high rigidity due to the high rigidity of the sintered parts, and the overall shape retention of the molded products is enhanced. Since the steps are performed, in the binder removing step of the overall sintering step, the molded article does not deform even if it is not held by a holder that conforms to the uneven shape.
【００１９】なお、前記部分焼結工程で、前記成形品の
一部に対して結合剤の除去および焼結を行う手段とし
て、高温流体、プラズマ、レーザーあるいは高周波を作
用させる方法を採用すれば、成形品の必要な部分だけを
効率的に加熱して結合剤の除去および焼結を行うことが
できる。第３の方法は、ワックス成分除去工程でワック
ス成分が除去されても、成形品の外周が多孔性ポリマー
で被覆されて補強されているので変形が生じ難い。しか
も、多孔性ポリマーはワックス成分を通過させるので、
多孔性ポリマーが存在していてもワックス成分の除去は
容易に行われる。ポリマー除去工程で、結合剤のポリマ
ー成分とともに多孔性ポリマーも除去されるので、焼結
工程に供される成形品には多孔性ポリマーが残留する心
配はない。In the partial sintering step, if a method of applying a high temperature fluid, plasma, laser or high frequency is adopted as means for removing the binder and sintering the part of the molded article, Only the required parts of the molded part can be efficiently heated to remove the binder and sinter. In the third method, even if the wax component is removed in the wax component removing step, deformation does not easily occur because the outer periphery of the molded product is covered with the porous polymer and reinforced. Moreover, since the porous polymer allows the wax component to pass,
The wax component can be easily removed even if the porous polymer is present. Since the porous polymer is removed together with the polymer component of the binder in the polymer removing step, there is no concern that the porous polymer remains in the molded article subjected to the sintering step.
【００２０】第４の方法は、ワックス成分除去工程に適
した形状の保持具を用いるとともに、焼結工程の前に、
成形品を保持したままの上記保持具を縮小させて、焼結
工程に適した形状の保持具にする。したがって、ワック
ス成分除去工程、ポリマー成分除去工程および焼結工程
を、同じ保持具に成形品を保持させたままで行えるの
で、保持具を移し変える際の成形品の変形や破損が防止
できる。寸法の異なる複数の保持具を用いる必要がない
ので、保持具の製造および準備の手間とコストが削減で
きる。The fourth method uses a holder having a shape suitable for the wax component removing step, and before the sintering step,
The holder holding the molded product is reduced to a holder having a shape suitable for the sintering process. Therefore, the wax component removing step, the polymer component removing step, and the sintering step can be performed while holding the molded product in the same holder, so that the molded product can be prevented from being deformed or damaged when the holder is transferred. Since it is not necessary to use a plurality of holders having different sizes, the labor and cost for manufacturing and preparing the holder can be reduced.
【００２１】なお、保持具縮小工程を、保持具の一部を
加熱により溶融させて除去したり、保持具の一部を加熱
により収縮変形させたりする方法で行えば、保持具の縮
小が容易に行える。特に、結合剤の除去と保持具の縮小
を同じ加熱処理によって行うことができるので、作業工
程および処理装置を削減することができる。第５の方法
は、ワックス成分除去工程では、成形品の凹凸形状に合
致した保持具を用いるので成形品が変形することは確実
に防止できる。保持具として、成形品と同じ加熱収縮特
性を有するものを用いるので、ワックス成分除去工程に
用いた保持具のままで焼結工程を行うと、成形品の加熱
収縮に合わせて保持具も加熱収縮することになる。した
がって、焼結工程でも、成形品の凹凸形状と保持具の凹
凸形状は合致したままであり、成形品の変形が良好に防
止できる。If the holder shrinking step is carried out by a method of melting and removing a part of the holder by heating or shrinking and deforming a part of the holder by heating, the holder can be easily reduced. You can do it. In particular, since the removal of the binder and the reduction of the holder can be performed by the same heat treatment, it is possible to reduce the work process and the processing device. In the fifth method, in the wax component removing step, since a holder that conforms to the uneven shape of the molded product is used, it is possible to reliably prevent the molded product from being deformed. Since a holder that has the same heat shrinkage characteristics as the molded product is used, if the sintering process is performed with the holder used in the wax component removal process, the holder will also shrink due to the heat shrinkage of the molded product. Will be done. Therefore, even in the sintering step, the uneven shape of the molded product and the uneven shape of the holding tool remain the same, and the deformation of the molded product can be favorably prevented.
【００２２】第６の方法は、結合剤の除去工程を、成形
品を非接触保持手段で保持した状態で行うので、成形品
の凹凸形状に合致する凹凸形状の保持具を用いなくて
も、成形品の変形が生じることがない。磁力やガス圧な
どの非接触保持手段が使用し難い焼結工程では、焼結工
程での成形品の収縮変形に対応できる焼結用保持具を用
いるので、焼結工程での成形品の変形も確実に防止でき
る。非接触保持手段から焼結用保持具への成形品の受け
渡しは、非接触保持手段による保持を解除することで成
形品を焼結用保持具の上に落下させて保持させるので、
結合剤が除去されて脆くなった成形品でも、変形したり
破損したりすることが防げる。In the sixth method, since the step of removing the binder is carried out while the molded product is held by the non-contact holding means, it is possible to use a holder having an uneven shape which matches the uneven shape of the molded product. No deformation of the molded product occurs. In a sintering process where it is difficult to use non-contact holding means such as magnetic force or gas pressure, a sintering holder that can handle shrinkage deformation of the molded product in the sintering process is used, so deformation of the molded product in the sintering process Can be reliably prevented. When passing the molded product from the non-contact holding means to the sintering holder, the molded product is dropped and held on the sintering holder by releasing the holding by the non-contact holding means.
Even if the molded product becomes brittle by removing the binder, it can be prevented from being deformed or damaged.
【００２３】[0023]
〔２つの保持具を用いる実施例〕図１に示すように、成
形品２０を第１の保持具１０および第２の保持具３０に
移し替えて焼結製品２０ｘを製造する。保持具１０、３
０はセラミック材料で形成されている。[Example Using Two Holders] As shown in FIG. 1, the molded product 20 is transferred to the first holder 10 and the second holder 30 to manufacture a sintered product 20x. Holders 10, 3
0 is formed of a ceramic material.
【００２４】成形品２０の成形材料は、焼結用粉末とし
て高速度鋼系微粉末を用い、結合剤としてワックス成分
およびポリマー成分を含む通常の焼結製品用の結合剤を
用いる。これらの成形材料を用いて射出成形により断面
Ｈ形のブロック状をなす成形品２０が形成されている。
射出成形には、以下に示す装置および成形条件が適用さ
れる。As a molding material for the molded product 20, a high-speed steel-based fine powder is used as a sintering powder, and a binder for an ordinary sintered product containing a wax component and a polymer component is used as a binder. A block-shaped molded product 20 having an H-shaped cross section is formed by injection molding using these molding materials.
The following apparatus and molding conditions are applied to the injection molding.
【００２５】
成形機：ＦＡＮＵＣ社製 電動サーボ式射出成形機
成形条件：射出速度 ４０mm/sec
射出時間 ０．２sec
シリンダ温度 １６０℃
金型内圧力 ４００kgf/cm2
金型温度 ２６℃
冷却時間 ３０sec
図１(a) に示すように、第１の保持具１０は、成形状態
での成形品２０の外形のうちＨ形断面の凹部に合致する
凸部１２（幅Ｗ1 ×高さＨ1 ）を備えている。成形品２
０の水平片２１が保持具１０の上面で支持された状態に
なっている。Molding machine: Electric servo injection molding machine manufactured by FANUC Molding condition: Injection speed 40 mm / sec Injection time 0.2 sec Cylinder temperature 160 ° C Mold pressure 400 kgf / cm 2 Mold temperature 26 ° C Cooling time 30 sec Figure 1 As shown in (a), the first holder 10 is provided with a convex portion 12 (width W 1 × height H 1 ) that matches the concave portion of the H-shaped cross section of the outer shape of the molded product 20 in the molded state. ing. Molded product 2
The horizontal piece 21 of 0 is supported on the upper surface of the holder 10.
【００２６】成形品２０から結合剤を除去する。結合剤
の除去工程は、最初にワックス成分の除去工程を行い、
つぎにポリマー成分の除去工程を行う。図１(a) に示す
ように、ワックス成分の除去工程では、成形品２０を第
１の保持具１０に保持させて、加熱炉などに入れて加熱
する。図２に示すような昇温過程で加熱する。最大加熱
温度が３００℃である。この最大加熱温度は結合剤に含
まれるワックス成分の溶融温度に合わせて設定される。
ワックス成分は加熱により軟化および流動化し、成形品
２０から抜け出して除去される。ワックス成分の除去過
程で成形品２０の水平片２１が垂れるように変形しよう
とするが、第１の保持具１０で保持されているので変形
は阻止される。The binder is removed from the molded product 20. In the binder removal step, the wax component removal step is performed first,
Next, a polymer component removing step is performed. As shown in FIG. 1A, in the wax component removing step, the molded product 20 is held by the first holder 10 and placed in a heating furnace or the like for heating. It heats in the temperature rising process as shown in FIG. The maximum heating temperature is 300 ° C. This maximum heating temperature is set according to the melting temperature of the wax component contained in the binder.
The wax component is softened and fluidized by heating, and is released from the molded product 20 and removed. In the process of removing the wax component, the horizontal piece 21 of the molded product 20 tries to deform so as to sag, but since it is held by the first holder 10, the deformation is prevented.
【００２７】ワックス成分が除去された成形品２０は、
液状あるいは流動性の成分が除去されるので変形し難く
なる。この状態で、成形品２０を第１の保持具１０から
第２の保持具３０に移す。第２の保持具３０は、後の工
程で成形品２０を焼結したときに、この焼結に伴って成
形品２０が収縮する量に見合うだけの隙間を、成形品２
０の凹凸形状との間に有するように設計されている。言
い換えると、第２の保持具３０は焼結工程に適した形状
を備えている。第２の保持具３０の凸部３２は、幅Ｗ2
×高さＨ2となっている。ここで、Ｗ2 ＜Ｗ1 、Ｈ2 ＜
Ｈ1 である。The molded product 20 from which the wax component has been removed is
Since the liquid or fluid component is removed, it becomes difficult to deform. In this state, the molded product 20 is transferred from the first holder 10 to the second holder 30. When the molded product 20 is sintered in a later step, the second holder 30 has a gap corresponding to the amount of shrinkage of the molded product 20 due to this sintering.
It is designed to have between 0 and the uneven shape. In other words, the second holder 30 has a shape suitable for the sintering process. The protrusion 32 of the second holder 30 has a width W 2
× The height is H 2 . Here, W 2 <W 1 , H 2 <
H 1 .
【００２８】図１(b) に示すように、ワックス成分除去
工程を終えた成形品２０を第２の保持具１２に保持させ
た状態では、成形品２０と第２の保持具１２との間には
隙間があいている。この状態で、ポリマー成分除去工程
を行う。ポリマー成分除去工程は、図３に示す昇温過程
を経て加熱する。加熱温度は３００℃から最高５００℃
になる。この加熱により、ポリマー成分は主に気化する
ことで成形品２０から外部に放出される。ポリマー成分
が除去される過程では、成形品２０の変形はあまり問題
にならない。As shown in FIG. 1 (b), when the molded product 20 which has undergone the wax component removing step is held by the second holder 12, the molded product 20 and the second holder 12 are separated from each other. There is a gap in. In this state, the polymer component removing step is performed. In the polymer component removing step, heating is performed through the temperature raising process shown in FIG. The heating temperature is from 300 ℃ to a maximum of 500 ℃
become. Due to this heating, the polymer component is mainly vaporized and released from the molded article 20 to the outside. In the process of removing the polymer component, the deformation of the molded product 20 does not matter so much.
【００２９】ポリマー成分が除去された成形品２０は、
第２の保持具３０に保持させたままで、焼結工程を行
う。焼結工程は、通常の焼結製品の製造の場合と同様の
処理条件で行う。図１(c) に示すように、成形品２０は
焼結過程で収縮変形を起こして焼結製品２０ｘとなる。
成形品２０が収縮変形を起こすと、成形品２０の凹凸形
状と第２の保持具３０の凹凸形状とが合致するので、焼
結過程での成形品２０の垂れ変形などは、第２の保持具
３０で確実に防止することができる。The molded article 20 from which the polymer component has been removed is
The sintering process is performed while being held by the second holding tool 30. The sintering process is performed under the same processing conditions as in the case of manufacturing a normal sintered product. As shown in FIG. 1 (c), the molded product 20 undergoes shrinkage deformation during the sintering process to become a sintered product 20x.
When the molded product 20 contracts and deforms, the uneven shape of the molded product 20 and the uneven shape of the second holder 30 match, so that sagging deformation of the molded product 20 during the sintering process can be prevented by the second holding. It can be surely prevented by the tool 30.
【００３０】焼結工程を終えれば、成形品２０は焼結さ
れて焼結製品２０ｘが得られる。
＜具体的実施例＞上記実施例の方法にしたがって焼結製
品を製造した具体例について説明する。
（使用材料）
焼結用粉末Ａ：金属粉末、材質ＳＫＨ５７、平均粒径１
μｍ
焼結用粉末Ｂ：セラミック粉末：材質ジルコニア、平均
粒径１μｍ
結合剤：ポリマー成分…メタクリル酸ブチルエステル、
エチレン−酢ビ共重合体
ワックス成分…パラフィンワックス、ステアリン酸
（配合比／重量部）
成形材料１…焼結用粉末Ａ：結合剤＝１００：１１
成形材料２…焼結用粉末Ｂ：結合剤＝１００：１３．３
（保持具）
第１の保持具１０の寸法：Ｗ1 ＝２０mm、Ｈ1 ＝４mm
（成形品２０の凹部と同じ寸法）
第２の保持具３０の寸法：Ｗ2 ＝１６mm、Ｈ1 ＝３．２
mm
上記のような条件で、成形材料１、２を用いて焼結製品
を製造したところ、何れの成形材料１、２から得られた
焼結製品も、その寸法精度は良好であった。なお、成形
品に対する焼結製品の収縮率を測定したところ、成形材
料１の場合は２０％、成形材料１の場合は１８％であっ
た。なお、成形品の収縮は何れの場合も結合剤の除去工
程では進行せず焼結工程のみで進行していた。When the sintering process is completed, the molded product 20 is sintered to obtain a sintered product 20x. <Specific Example> A specific example in which a sintered product is manufactured according to the method of the above example will be described. (Material used) Sintering powder A: Metal powder, material SKH57, average particle size 1
μm Sintering powder B: Ceramic powder: Material zirconia, average particle size 1 μm Binder: Polymer component ... Methacrylic acid butyl ester,
Ethylene-vinyl acetate copolymer wax component ... Paraffin wax, stearic acid (mixing ratio / parts by weight) Molding material 1 ... Sintering powder A: binder = 100: 11 Molding material 2 ... Sintering powder B: binder = 100: 13.3 (Holder) Dimensions of the first holder 10: W 1 = 20 mm, H 1 = 4 mm
(The same dimension as the concave portion of the molded product 20) The dimension of the second holding tool 30: W 2 = 16 mm, H 1 = 3.2
mm Sintered products were produced using the molding materials 1 and 2 under the above conditions, and the dimensional accuracy of the sintered products obtained from any of the molding materials 1 and 2 was good. When the shrinkage rate of the sintered product with respect to the molded product was measured, it was 20% for the molding material 1 and 18% for the molding material 1. In any case, the shrinkage of the molded product did not proceed in the binder removing step, but proceeded only in the sintering step.
【００３１】＜変更実施例＞
(a) 前記実施例では、ワックス成分除去工程を加熱によ
って行っていたが、ワックス成分を溶解可能な溶剤に成
形品２０を浸漬したりして、溶剤によるワックス成分の
除去を行うこともできる。
(b) 保持具１０、３０は、予め凸部１２、３２の形状を
一体加工しておくほか、平板状の保持具の上に、凸部と
なる部品を着脱自在に取り付けたりしてもよい。また、
平板状の保持具の上に粉末材料を盛り上げて凸部の形状
を作ることもできる。この粉末材料は、成形品を構成す
る材料と反応を起こさない材料が用いられる。
〔ポリマーによる被覆処理を行う実施例〕基本的な工程
は前記実施例と同じであるが、成形材料の構成が異な
る。<Modified Example> (a) In the above example, the wax component removing step was carried out by heating. However, the molded product 20 is immersed in a solvent capable of dissolving the wax component, and the wax component is removed by the solvent. Can also be removed. (b) In the holders 10 and 30, the shapes of the protrusions 12 and 32 may be integrally machined in advance, or the components to be the protrusions may be detachably attached to the flat holder. . Also,
It is also possible to raise the powder material on a plate-shaped holder to form the shape of the convex portion. As the powder material, a material that does not react with the material forming the molded article is used. [Example of performing coating treatment with polymer] The basic process is the same as that of the above-mentioned example, but the constitution of the molding material is different.
【００３２】成形材料は、焼結用粉末として鉄系微粉末
を用いる。結合剤は、ポリマー成分とワックス成分を含
むものである。図４(a) に示すように、焼結用粉末２４
の周囲にポリマー成分２６を被覆処理する。被覆処理
は、蒸着あるいはスプレーなどの方法が適用される。つ
ぎに、図４(b) に示すように、ポリマー成分２６が被覆
された焼結用粉末２４とワックス成分２８を混練する。As the molding material, iron-based fine powder is used as the sintering powder. The binder contains a polymer component and a wax component. As shown in FIG. 4 (a), the powder for sintering 24
The polymer component 26 is coated on the periphery of the. For the coating treatment, a method such as vapor deposition or spraying is applied. Next, as shown in FIG. 4 (b), the sintering powder 24 coated with the polymer component 26 and the wax component 28 are kneaded.
【００３３】このようにして得られた成形材料を用い
て、前記実施例と同じ工程で焼結製品を製造する。この
実施例では、ワックス成分２８が成形粒子の外周に存在
するので、ワックス成分除去工程でワックス成分２８の
除去が効率的に行われる。ワックス成分２８が除去され
たあとも、焼結用粉末２４の周囲をポリマー成分２６が
良好に覆っているので、成形品２０の変形が生じ難い。
〔部分焼結を行う実施例〕図５に示すように、成形品２
０は前記図１の実施例と同様のものを用いる。但し、結
合剤は、ワックス成分とポリマー成分とを組み合わせた
ものである必要はなく、通常の焼結製品の製造に利用さ
れる各種結合剤を用いることができる。保持具１０、３
０も前記図１の実施例と同様のものである。但し、第１
の保持具１０の内部には冷却用配管１４が埋め込まれて
おり、冷却用配管１４には冷却水が流される。。Using the molding material thus obtained, a sintered product is manufactured in the same process as in the above-mentioned embodiment. In this embodiment, the wax component 28 exists on the outer periphery of the molded particles, so that the wax component 28 is efficiently removed in the wax component removing step. Even after the wax component 28 is removed, the periphery of the sintering powder 24 is well covered with the polymer component 26, so that the molded product 20 is unlikely to be deformed. [Example of Partial Sintering] As shown in FIG.
0 is the same as that of the embodiment of FIG. However, the binder does not have to be a combination of the wax component and the polymer component, and various binders that are used in the production of ordinary sintered products can be used. Holders 10, 3
0 is also the same as that of the embodiment shown in FIG. However, the first
A cooling pipe 14 is embedded in the holder 10, and cooling water is flown through the cooling pipe 14. .
【００３４】図５(a) に示すように、第１の保持具１０
に保持された成形品２０の表面のみで結合剤の除去およ
び焼結を行って部分焼結部２０ａを形成する。この部分
焼結工程のうち、結合剤の除去工程では、成形品２０の
表面に高熱ガスなどの高温流体を吹き付け表面のみを加
熱して結合剤の除去を行う。結合剤の除去は、ワックス
成分とポリマー成分とからなる結合剤の場合は、ワック
ス成分除去工程とポリマー成分除去工程に分けて行って
もよいし両工程を連続的に同時に行ってもよい。結合剤
の除去工程で、成形品２０の内部側の結合剤までが除去
されないように、冷却用配管１４で成形品２０の内部側
を冷却しておくことが好ましい。As shown in FIG. 5A, the first holder 10
The binder is removed and sintered only on the surface of the molded product 20 held by to form the partially sintered portion 20a. In the binder removing step of the partial sintering step, a binder is removed by spraying a high temperature fluid such as a high-temperature gas onto the surface of the molded article 20 to heat only the surface. In the case of a binder composed of a wax component and a polymer component, the removal of the binder may be performed separately in the wax component removing step and the polymer component removing step, or both steps may be continuously performed simultaneously. In the binder removing step, it is preferable that the inside of the molded product 20 is cooled by the cooling pipe 14 so that the binder on the inside of the molded product 20 is not removed.
【００３５】焼結工程は、成形品２０を第１の保持具１
０に保持させたままで行う。焼結温度を約１００℃程度
に設定することで、成形品２０の表面２０ａのみを焼結
させる。この焼結の際の加熱にも、前記した高温流体が
用いられる。成形品２０の内部側は焼結しないので、成
形品２０全体の収縮変形は生じない。したがって、成形
品２０を第１の保持具１０に保持させたままで焼結を行
うことができる。In the sintering process, the molded product 20 is attached to the first holder 1
Perform with the value kept at 0. By setting the sintering temperature to about 100 ° C., only the surface 20a of the molded product 20 is sintered. The high temperature fluid described above is also used for heating during the sintering. Since the inner side of the molded product 20 is not sintered, shrinkage deformation of the entire molded product 20 does not occur. Therefore, sintering can be performed while the molded product 20 is held by the first holding tool 10.
【００３６】成形品２０のうち部分焼結部２０ａを形成
しておく場所や範囲は、後に行う全体の結合剤除去工程
で成形品２０の変形を防止するのに有効な場所および範
囲に設定しておく。図５(a) に示すように、成形品２０
の外側表面の全体に部分焼結部２０ａを形成しておけ
ば、成形品２０の変形防止が良好に行えるが、成形品２
０の変形し易い水平片２１とその周辺だけに部分焼結部
２０ａを形成しておくだけでもよい。The place and range where the partially sintered portion 20a is formed in the molded product 20 is set to a place and range effective in preventing the deformation of the molded product 20 in the entire binder removing step to be performed later. Keep it. As shown in FIG. 5 (a), the molded product 20
If the partial sintered portion 20a is formed on the entire outer surface of the molded article 20, deformation of the molded article 20 can be favorably prevented.
The partially sintered portion 20a may be formed only on the horizontal piece 21 which is easily deformed and its periphery.
【００３７】つぎに、図５(b) に示すように、部分焼結
された成形品２０を第２の保持具３０に移して、成形品
２０の全体に対する結合剤の除去および焼結を行う。こ
の段階での結合剤の除去工程および焼結工程は、通常の
焼結製品の製造と同様に行える。焼結温度は約１２５０
℃で行う。結合剤の除去工程で、ワックス成分が軟化あ
るいは流動化しても、部分焼結部２０ａが成形品２０全
体の形状保持を果たすので、成形品２０が垂れ変形を起
こすことはない。また、成形品２０を第１の保持具１０
から第２の保持具３０に移す際には、比較的脆い部分焼
結部２０ａが成形品２０の内部側の結合剤を含む部分で
補強されるので、成形品２０が取扱い中に破損する心配
もない。Next, as shown in FIG. 5 (b), the partially sintered molded product 20 is transferred to the second holder 30 to remove the binder and sinter the entire molded product 20. . The binder removing step and the sintering step at this stage can be performed in the same manner as in the production of a normal sintered product. Sintering temperature is about 1250
Perform at ℃. Even if the wax component is softened or fluidized in the step of removing the binder, the partially sintered portion 20a maintains the shape of the entire molded product 20, so that the molded product 20 does not sag and deform. In addition, the molded product 20 is attached to the first holder 10
Since the comparatively brittle partial sintered part 20a is reinforced by the part containing the binder on the inner side of the molded product 20 when the molded product 20 is transferred from the second holding device 30 to the second holding device 30, the molded product 20 may be damaged during handling. Nor.
【００３８】＜部分焼結手段の変更例＞前記した図５
(a) の部分焼結工程において、成形品２０の表面のみを
加熱して結合剤の除去および焼結を行う手段としては、
前記した高温流体のほか、つぎの手段が適用できる。図
６(a) に示すように、成形品２０をプラズマＰで加熱し
て部分焼結部２０ａを形成する。プラズマＰとしては、
減圧プラズマまたは常圧プラズマが用いられる。このと
き、成形品２０は前記第２の保持具３０に保持させてお
く。したがって、保持具３０と成形品２０との凹凸形状
には隙間があいている。この状態でプラズマＰによる加
熱を行うと、成形品２０の上部側の表面だけでなく、保
持具３０との隙間部分の表面も加熱されるので、成形品
２０の全表面に部分焼結部２０ａが形成される。加熱温
度は、前記した実施例の部分焼結工程と同じ程度でよ
い。<Modification Example of Partial Sintering Means> FIG.
In the partial sintering step (a), as a means for heating only the surface of the molded product 20 to remove the binder and sinter,
In addition to the above-mentioned high temperature fluid, the following means can be applied. As shown in FIG. 6A, the molded product 20 is heated by the plasma P to form the partially sintered portion 20a. As plasma P,
Reduced pressure plasma or normal pressure plasma is used. At this time, the molded product 20 is held by the second holder 30. Therefore, there is a gap in the uneven shape between the holder 30 and the molded product 20. If heating is performed by the plasma P in this state, not only the upper surface of the molded product 20 but also the surface of the gap between the molded product 20 and the holder 30 is heated. Is formed. The heating temperature may be the same as that in the partial sintering step of the above-mentioned embodiment.
【００３９】図６(b) に示すように、成形品２０の全体
に対する結合剤の除去および焼結工程は前記した実施例
と同様である。上記図６の実施例では、前記第１の保持
具１０は用いず、第２の保持具３０だけを用いるので、
作業工程が簡略化できる。図７(a) に示すように、成形
品２０の表面にレーザＲの照射で加熱して部分焼結部２
０ａを形成することができる。レーザＲは、成形品２０
の凹凸形状にしたがって走査するように照射する。その
他の工程は、前記した実施例と同様に行える。As shown in FIG. 6 (b), the steps of removing the binder and sintering the whole molded product 20 are the same as those in the above-mentioned embodiment. In the embodiment of FIG. 6 described above, since the first holder 10 is not used and only the second holder 30 is used,
The work process can be simplified. As shown in FIG. 7 (a), the surface of the molded product 20 is heated by irradiation of the laser R to heat the partially sintered portion 2
0a can be formed. Laser R is a molded product 20
Irradiation is performed so as to scan in accordance with the uneven shape of. Other steps can be performed in the same manner as in the above-mentioned embodiment.
【００４０】図８(a) に示すように、成形品２０の表面
に高周波コイルＣによる高周波加熱で部分焼結部２０ａ
を形成することができる。高周波コイルＣは成形品２０
の外形に合わせて全周に配置しておいてもよいし、高周
波コイルＣを成形品２０の外形に沿って移動させながら
加熱を行ってもよい。その他の工程は、前記した実施例
と同様に行える。
〔多孔性ポリマーで被覆する実施例〕成形品２０を、前
記したような通常の成形材料からなる本体部２０ｃと、
本体部ｃの外面を被覆する多孔性ポリマー層２０ｂとで
構成しておく。本体部２０ｃは、前記同様に、結合剤と
してワックス成分とポリマー成分とからなるものを用い
る。本体部２０ｃの製造工程は、前記実施例と同様であ
る。As shown in FIG. 8 (a), the surface of the molded article 20 is subjected to high-frequency heating by the high-frequency coil C to form a partially sintered portion 20a.
Can be formed. The high frequency coil C is a molded product 20
It may be arranged around the entire circumference according to the outer shape of the above, or heating may be performed while moving the high frequency coil C along the outer shape of the molded product 20. Other steps can be performed in the same manner as in the above-mentioned embodiment. [Example of coating with a porous polymer] A molded article 20 is composed of a main body portion 20c made of a normal molding material as described above,
It is composed of a porous polymer layer 20b that covers the outer surface of the main body c. For the main body portion 20c, as described above, a binder composed of a wax component and a polymer component is used. The manufacturing process of the main body portion 20c is the same as that of the above embodiment.
【００４１】多孔性ポリマーには、本体部２０ｃのワッ
クス成分よりも軟化点の高い材料が用いられる。多孔性
ポリマーを本体部２０ｃに被覆して多孔性ポリマー層２
０ｂを形成する手段としては、浸漬やスプレー塗布など
の手段が採用される。図９(a) に示すように、多孔性ポ
リマー層２０ｂが被覆された成形品２０を、第２の保持
具３０に保持させた状態で結合剤の除去工程を行う。保
持具３０と成形品２０の間には隙間があいている。As the porous polymer, a material having a softening point higher than that of the wax component of the main body portion 20c is used. The main body 20c is coated with a porous polymer to form a porous polymer layer 2
As a means for forming 0b, a means such as dipping or spray coating is adopted. As shown in FIG. 9 (a), the step of removing the binder is performed while the molded article 20 covered with the porous polymer layer 20 b is held by the second holder 30. There is a gap between the holder 30 and the molded product 20.
【００４２】この結合剤の除去工程でワックス成分が軟
化、流動化しても、外周を多孔性ポリマー層２０ｂで被
覆しているので、成形品２０が垂れ変形を起こすことは
ない。したがって、保持具３０と成形品２０の間に隙間
があいていてもよいのである。成形品２０から除去され
るワックス成分は、多孔性ポリマー層２０ｂの多孔性の
隙間を通じて外部に排出される。Even if the wax component is softened or fluidized in the binder removing step, the molded article 20 does not sag and deform because the outer periphery is covered with the porous polymer layer 20b. Therefore, there may be a gap between the holder 30 and the molded product 20. The wax component removed from the molded product 20 is discharged to the outside through the porous gaps of the porous polymer layer 20b.
【００４３】結合剤の除去工程でポリマー成分が除去さ
れる際に多孔性ポリマーも除去されるので、結合剤の除
去工程を終えた成形品２０には多孔性ポリマー層２０ｂ
は存在しない。焼結工程は、結合剤が除去された成形品
２０に対する通常の処理条件が適用できる。
〔保持具を縮小させる実施例〕図１０(a) に示すよう
に、前記第２の保持具３０の凸部３２の上に、断面コ字
形の補助保持具１６を被せた状態で、補助保持具１６の
上に成形品２０を保持させる。保持具３０に補助保持具
１６を被せた状態の外形は、前記した第１の保持具１０
の外形と同じである。補助保持具１６は、結合剤のポリ
マー成分が除去される工程で同時に除去される材料で作
製されている。具体的には、結合剤のポリマー成分と同
様のポリマーからなるものを用いることができる。Since the porous polymer is also removed when the polymer component is removed in the binder removing step, the porous polymer layer 20b is formed in the molded article 20 after the binder removing step.
Does not exist. In the sintering process, usual processing conditions for the molded product 20 from which the binder has been removed can be applied. [Embodiment for reducing the size of the holder] As shown in FIG. 10 (a), the auxiliary holder 16 having a U-shaped cross-section is covered on the convex portion 32 of the second holder 30 so that the auxiliary holder is held. The molded product 20 is held on the tool 16. The outer shape of the holder 30 covered with the auxiliary holder 16 is the same as the first holder 10 described above.
It is the same as the outer shape of. The auxiliary holder 16 is made of a material that is simultaneously removed in the process of removing the polymer component of the binder. Specifically, those composed of the same polymer as the polymer component of the binder can be used.
【００４４】図１０(a) の状態で結合剤の除去工程を行
う。成形品２０からワックス成分が除去される際には、
補助保持具１６で成形品２０を保持しているので、成形
品２０が変形を起こすことはない。ワックス成分の除去
処理温度では補助保持具１６は軟化溶融しない。成形品
２０からポリマー成分が除去される際には、ポリマー成
分の除去と同時に補助保持具１６も除去される。保持具
全体の外形に着目すれば、補助保持具１６の外形が第２
の保持具３０の外形まで縮小することになる。補助保持
具１６が除去されて保持具全体の外形が縮小されれば、
成形品２０と保持具３０の間に隙間が生じるが、この段
階の成形品２０にはワックス成分は含まれていないの
で、成形品２０が変形する心配はない。In the state shown in FIG. 10A, the binder removing step is performed. When the wax component is removed from the molded product 20,
Since the molded product 20 is held by the auxiliary holder 16, the molded product 20 is not deformed. The auxiliary holder 16 does not soften and melt at the wax component removal processing temperature. When the polymer component is removed from the molded product 20, the auxiliary holder 16 is removed at the same time as the removal of the polymer component. Focusing on the outer shape of the entire holder, the outer shape of the auxiliary holder 16 is
The outer shape of the holder 30 of FIG. If the auxiliary holder 16 is removed and the outer shape of the entire holder is reduced,
A gap is formed between the molded product 20 and the holder 30, but since the molded product 20 at this stage does not contain a wax component, there is no concern that the molded product 20 will be deformed.
【００４５】図１０(b) に示すように、結合剤が除去さ
れた成形品２０を保持具３０に保持させたままで焼結さ
せる。焼結製品２０ｘは縮小して保持具３０の凹凸形状
に合致する。したがって、焼結過程での変形は保持具３
０で防止できる。
＜縮小手段の異なる実施例＞図１１に示すように、第２
の保持具３０を、平板状の下部材３４と下部材３４より
も面積が小さな台状の上部材３６とで構成する。As shown in FIG. 10B, the molded product 20 from which the binder has been removed is sintered while being held by the holder 30. The sintered product 20x is reduced to match the uneven shape of the holder 30. Therefore, the deformation in the sintering process is caused by the holder 3.
It can be prevented by 0. <Embodiment with Different Reduction Means> As shown in FIG.
The holder 30 is composed of a plate-shaped lower member 34 and a trapezoidal upper member 36 having an area smaller than that of the lower member 34.
【００４６】図１１(a) に示すように、結合剤の除去工
程で成形品２０を保持する際には、下部材３４の上に、
上向きに開いたコ状形をなす補助保持具１８を載せ、こ
の補助保持具１８の上部の凹みに保持具３０の上部材３
６を嵌入して配置しておく。補助保持具１８の材料は、
前記実施例で用いた補助保持具１６と同様のものであ
る。このように配置された保持具の全体形状は、前記し
た第１の保持具１０の外形と同じである。As shown in FIG. 11A, when the molded product 20 is held in the binder removing step, the
The auxiliary holder 18 having a U-shape that is opened upward is placed, and the upper member 3 of the holder 30 is placed in the recess of the upper portion of the auxiliary holder 18.
6 is inserted and arranged. The material of the auxiliary holder 18 is
This is the same as the auxiliary holder 16 used in the above embodiment. The overall shape of the holder thus arranged is the same as the outer shape of the first holder 10 described above.
【００４７】保持具３４、１８、３６に保持された成形
品２０を結合剤の除去工程に供する。結合剤のワックス
成分が除去される段階では、各保持具３４、１８、３６
で成形品２０の変形を確実に防止する。結合剤のポリマ
ー成分が除去される段階では、補助保持具１８がポリマ
ー成分とともに溶融あるいは気化して除去される。補助
保持具１８が除去されると、上部材３６が下部材３４の
上に落下して重なった状態になる。保持具全体の外形に
着目すると、補助保持具１８が無くなった分だけ、外形
が縮小したことになる。この状態では、下部材３４と上
部材３６からなる保持具３０と成形品２０との間には隙
間があくことになる。The molded product 20 held by the holders 34, 18, 36 is subjected to a binder removing step. At the stage where the wax component of the binder is removed, each holder 34, 18, 36 is
The deformation of the molded product 20 is surely prevented by. When the polymer component of the binder is removed, the auxiliary holder 18 is removed by melting or vaporizing together with the polymer component. When the auxiliary holder 18 is removed, the upper member 36 falls on the lower member 34 and becomes in an overlapping state. Focusing on the outer shape of the entire holder, the outer shape is reduced by the amount of the auxiliary holder 18 that is lost. In this state, there is a gap between the holder 30 including the lower member 34 and the upper member 36 and the molded product 20.
【００４８】図１１(b) に示すように、結合剤が除去さ
れた成形品２０を焼結させて、焼結製品２０ｘを得る。
焼結製品２０ｘは、下部剤３４と上部剤３６とからなる
保持具３０で保持されているので、焼結に伴う変形が防
止できる。
＜縮小手段の異なる別の実施例＞図１２に示すように、
前記実施例と同様の下部材３４および上部材３６と、形
状記憶合金からなる縮小部材３８とからなる保持具３０
を用いる。縮小部材３８は、下部材３４と上部材３６の
間に重ねられている。As shown in FIG. 11 (b), the molded product 20 from which the binder has been removed is sintered to obtain a sintered product 20x.
Since the sintered product 20x is held by the holder 30 composed of the lower agent 34 and the upper agent 36, deformation due to sintering can be prevented. <Another embodiment with different reducing means> As shown in FIG.
A holder 30 including a lower member 34 and an upper member 36 similar to those in the above-described embodiment, and a reduction member 38 made of a shape memory alloy.
To use. The reduction member 38 is superposed between the lower member 34 and the upper member 36.
【００４９】図１２(a) に示すように、成形品２０の水
平片２１を縮小部材３８と上部材３６とで支えた状態で
結合剤の除去工程を行う。結合剤の除去工程のうちポリ
マー成分を除去するために加熱温度を高くしたり、その
後の焼結工程で高温に加熱すると、形状記憶合金からな
る縮小部材３８が縮小変形を起こす。As shown in FIG. 12 (a), the step of removing the binder is performed while the horizontal piece 21 of the molded product 20 is supported by the reduction member 38 and the upper member 36. When the heating temperature is increased in order to remove the polymer component in the binder removal step or the heating step is heated to a high temperature in the subsequent sintering step, the reduction member 38 made of the shape memory alloy undergoes reduction deformation.
【００５０】図１２(b) に示すように、焼結工程では、
成形品２０の収縮に合わせて前記縮小部材３８が低くな
るので、成形品２０あるいは焼結製品２０ｘは上部材３
６の上面で確実に支持された状態になる。縮小部材３８
の縮小機構としては、前記形状記憶合金を用いるほかバ
イメタルによる縮小機構を組み込んでおくこともでき
る。
〔保持具と成形品の加熱収縮特性を合わせておく実施
例〕図１３に示すように、保持具４０として、加熱収縮
特性が成形品２０と同じ材料を用いる。保持具４０を成
形品２０と同じ材料で作製しておけば、加熱収縮特性も
同じになる。加熱収縮特性が同じであれば、成形品２０
と異なる材料で保持具４０を作製しておいてもよい。保
持具４０の外形は、前記した第１の保持具１０の外形と
同じである。As shown in FIG. 12 (b), in the sintering step,
Since the reduction member 38 becomes lower in accordance with the shrinkage of the molded product 20, the molded product 20 or the sintered product 20x becomes the upper member 3
The upper surface of 6 is securely supported. Reduction member 38
As the reduction mechanism, the shape memory alloy may be used and a reduction mechanism using bimetal may be incorporated. [Example in which the heat shrinkage characteristics of the holder and the molded product are matched with each other] As shown in FIG. 13, a material having the same heat shrinkage property as that of the molded product 20 is used as the holder 40. If the holder 40 is made of the same material as the molded product 20, the heat shrinkage characteristics are also the same. If the heat shrinkage characteristics are the same, the molded product 20
The holder 40 may be made of a different material. The outer shape of the holder 40 is the same as the outer shape of the first holder 10 described above.
【００５１】図１３(a) に示すように、保持具４０に成
形品２０を保持させた状態で結合剤の除去工程を行う。
成形品２０の変形は保持具４０で確実に防止できる。図
１３(b) に示すように、結合剤が除去された成形品２０
を保持具４０に保持させたまま焼結工程を行う。焼結に
伴って成形品２０あるいは焼結製品２０ｘが収縮する
が、保持具４０のほうも同じ割合で収縮するので、保持
具４０で成形品２０が保持された状態は変わらない。
〔非接触保持手段を用いる実施例〕成形品２０を構成す
る焼結用粉末に高速度鋼のような磁着性のある材料を用
いる。As shown in FIG. 13 (a), the binder removal step is performed with the molded article 20 held by the holder 40.
The holder 40 can surely prevent the deformation of the molded product 20. As shown in FIG. 13 (b), the molded product 20 with the binder removed.
The sintering step is carried out while the above is held by the holder 40. Although the molded product 20 or the sintered product 20x shrinks along with the sintering, the holder 40 also contracts at the same rate, so the state in which the molded product 20 is held by the holder 40 does not change. [Example Using Non-Contact Holding Means] A material having magnetic sticking property such as high speed steel is used for the sintering powder forming the molded product 20.
【００５２】図１４に示すように、成形品２０を電磁石
５０の磁力で空中に保持する。成形品２０の下方には前
記した焼結工程に適した第２の保持具３０を配置してお
く。この状態で、結合剤の除去工程を行う。成形品２０
を構成するワックス成分が軟化流動しても、成形品２０
の全体が電磁石５０により非接触状態で保持されている
ので、成形品２０の一部が垂れ変形を起こすことはな
い。As shown in FIG. 14, the molded product 20 is held in the air by the magnetic force of the electromagnet 50. The second holder 30 suitable for the above-mentioned sintering process is arranged below the molded product 20. In this state, the binder removing step is performed. Molded product 20
Even if the wax component that constitutes the
Since the whole is held by the electromagnet 50 in a non-contact state, a part of the molded product 20 does not sag and deform.
【００５３】ワックス成分が除去された後あるいは結合
剤の除去工程が終わった後で、電磁石５０を遠ざけるか
磁力を無くす。成形品２０は保持具３０の上に落下して
保持具３０で保持される。結合剤が除去された成形品２
０が脆くなっていても、成形品２０を電磁石５０から保
持具３０に落下させるだけであれは、成形品２０が損傷
したり変形したりすることはない。保持具３０で成形品
２０を保持した状態では、保持具３０と成形品２０は凹
凸形状の間に隙間があいている。After the wax component is removed or after the binder removing step is completed, the electromagnet 50 is moved away or the magnetic force is removed. The molded product 20 falls on the holder 30 and is held by the holder 30. Molded product 2 with binder removed
Even if 0 is fragile, if the molded product 20 is simply dropped from the electromagnet 50 onto the holder 30, the molded product 20 will not be damaged or deformed. When the molded product 20 is held by the holder 30, a gap is formed between the holder 30 and the molded product 20 between the concave and convex shapes.
【００５４】その後、成形品２０を保持具３０に保持し
たままで焼結工程を行う。焼結過程で成形品２０が収縮
しても、成形品２０あるいは焼結製品２０ｘは保持具３
０で良好に保持され、焼結製品２０ｘの変形が防止でき
る。
＜非接触保持手段の別の実施例＞図１５に示すように、
保持具３０に多数のガス噴出口３１を設けておく。ガス
噴出口３１から噴出するガスで成形品２０を浮上させて
非接触で保持する。Thereafter, the sintering step is performed while the molded product 20 is held by the holder 30. Even if the molded product 20 shrinks during the sintering process, the molded product 20 or the sintered product 20x is held by the holder 3.
When the sintered product 20x is 0, the sintered product 20x can be prevented from being deformed. <Another Embodiment of Non-Contact Holding Means> As shown in FIG.
The holder 30 is provided with a large number of gas ejection ports 31. The molded product 20 is floated by the gas ejected from the gas ejection port 31 and held in a non-contact manner.
【００５５】ガスを吹き付けた状態で、結合剤の除去工
程を行う。その後、ガスの吹き付けを終了すれば、成形
品２０は保持具３０の上に落下して保持具３０で保持さ
れることになる。その後の焼結工程は、前記した実施例
と同じである。
〔その他の実施例〕
(a) 焼結製品２０ｘすなわち成形品２０の材料は、通常
の焼結製品と同様の材料が使用できる。焼結用粉末は、
前記した高速度鋼などの金属、ジルコニアなどのセラミ
ック、その他の無機材料など、通常の焼結製品用の粉末
材料が用いられる。結合剤のワックス成分やポリマー成
分も、通常の焼結製品用の結合剤と同様の材料を適宜に
組み合わせて使用することができる。In the state where the gas is blown, the binder removing step is performed. After that, when the blowing of the gas is completed, the molded product 20 falls on the holder 30 and is held by the holder 30. The subsequent sintering process is the same as that of the above-mentioned embodiment. [Other Embodiments] (a) As the material of the sintered product 20x, that is, the molded product 20, the same material as a normal sintered product can be used. The sintering powder is
Powdered materials for ordinary sintered products such as the above-mentioned metals such as high-speed steel, ceramics such as zirconia, and other inorganic materials are used. As the wax component and the polymer component of the binder, the same materials as those for the binder for a normal sintered product can be appropriately combined and used.
【００５６】(b) 成形品２０の形状は、図示した断面Ｈ
形のほか、焼結製品の利用分野や用途に合わせて、任意
の凹凸形状を有するものに適用できる。成形品２０の形
状が変われば、前記した保持具１０、３０や補助保持具
１６、１８、上部材３６、下部材３４、縮小部材３８、
電磁石５０などの形状も変わる。(B) The shape of the molded product 20 is the cross section H shown in the figure.
In addition to the shape, it can be applied to those having any irregular shape according to the usage field and application of the sintered product. If the shape of the molded product 20 changes, the above-mentioned holders 10, 30 and auxiliary holders 16, 18, the upper member 36, the lower member 34, the reduction member 38,
The shape of the electromagnet 50 and the like also changes.
【００５７】[0057]
【発明の効果】本発明にかかる焼結製品の製造方法のう
ち、第１の方法では、前記のような第１および第２の保
持具を用いることで、ワックス成分除去工程での成形品
の変形および焼結工程での成形品の変形の何れをも良好
に防ぐことができる。しかも、第１の保持具から第２の
保持具への移し替えを、ポリマー成分除去工程の前に行
っておくので、移し替え作業の際に成形品を損傷するこ
とがない。The first method of the method for producing a sintered product according to the present invention uses the first and second holders as described above, so that the molded product in the wax component removing step can be manufactured. Both the deformation and the deformation of the molded product in the sintering process can be favorably prevented. Moreover, since the transfer from the first holding tool to the second holding tool is performed before the polymer component removing step, the molded product is not damaged during the transfer operation.
【００５８】なお、焼結用粉末にポリマー成分を被覆し
ワックス成分を混合した成形材料を用いれば、結合剤の
除去が効率的に行え、成形品の形状保持性が高く、成形
品の変形が良好に防止できる。第２の方法では、結合剤
の除去および焼結を、部分焼結工程と全体の焼結工程と
の２段階に分けることにより、成形品の形状保持性を高
め、成形品の変形を良好に防止することができる。By using a molding material in which the powder for sintering is coated with the polymer component and mixed with the wax component, the binder can be removed efficiently, the shape retention of the molded article is high, and the deformation of the molded article is high. It can be prevented satisfactorily. In the second method, the removal of the binder and the sintering are divided into two steps, that is, a partial sintering step and an entire sintering step, so that the shape retention of the molded product is improved and the deformation of the molded product is improved. Can be prevented.
【００５９】なお、部分焼結を行う手段として、高温流
体、プラズマ、レーザーあるいは高周波を作用させる方
法を採用すれば、上記方法を効率的に行える。第３の方
法では、成形品を多孔性ポリマーで被覆しておくので、
成形品に変形を生じさせずにワックス成分が除去でき、
多孔性ポリマーはポリマー成分とともに除去されるの
で、成形品の変形を防止しながら能率的な結合剤の除去
が行える。If a method of applying a high temperature fluid, plasma, laser or high frequency is adopted as a means for performing partial sintering, the above method can be efficiently performed. In the third method, since the molded article is coated with the porous polymer,
The wax component can be removed without causing deformation in the molded product,
Since the porous polymer is removed together with the polymer component, the binder can be efficiently removed while preventing the deformation of the molded article.
【００６０】第４の方法では、保持具を縮小させること
で、結合剤の除去工程および焼結工程の両方を、保持具
に成形品を保持したままで行うことができる。その結
果、保持具間での成形品の移し替えの手間が省け、移し
替えに伴う成形品の変形や破損の問題も解消される。な
お、保持具の縮小を、保持具の一部を加熱により溶融さ
せて除去したり、保持具の一部を加熱により収縮変形さ
せたりする方法で行えば、作業が容易に行える。In the fourth method, by reducing the size of the holder, both the binder removing step and the sintering step can be performed while holding the molded product in the holder. As a result, it is possible to save the trouble of transferring the molded product between the holders and solve the problem of the deformation or damage of the molded product due to the transfer. The work can be easily performed by reducing the holder by a method of melting and removing a part of the holder by heating or by shrinking and deforming a part of the holder by heating.
【００６１】第５の方法では、保持具の加熱収縮特性を
成形品と同じにしておくことで、結合剤の除去工程と焼
結工程で別の保持具を用いる必要がなく、成形品の収縮
に合わせて保持具で確実に変形を防止することができ
る。第６の方法では、結合剤の除去工程で非接触保持手
段を用いることにより、成形品の外形に関わりなく、成
形品が変形しないように確実に保持しておくことができ
る。非接触保持手段から焼結用保持具への成形品の受け
渡しは、非接触保持手段の保持を解除するだけでよいの
で、作業が簡単で成形品の変形や損傷を確実に防ぐこと
ができる。In the fifth method, the heat shrinkage characteristics of the holder are the same as those of the molded product, so that it is not necessary to use separate holders in the binder removal step and the sintering step, and the molded product shrinks. In accordance with the above, the holder can surely prevent the deformation. In the sixth method, by using the non-contact holding means in the step of removing the binder, it is possible to reliably hold the molded product so as not to deform regardless of the outer shape of the molded product. To transfer the molded product from the non-contact holding means to the sintering holder, it suffices to release the holding of the non-contact holding means. Therefore, the work is simple and the deformation and damage of the molded product can be reliably prevented.
【図１】この発明の実施例となる焼結製品の製造方法を
段階的に表す概略工程図FIG. 1 is a schematic process diagram showing stepwise a method for manufacturing a sintered product according to an embodiment of the present invention.
【図２】ワックス成分除去工程における加熱温度変化図FIG. 2 is a diagram showing a heating temperature change in a wax component removing process.
【図３】ポリマー成分除去工程における加熱温度変化図FIG. 3 is a heating temperature change diagram in the polymer component removing step.
【図４】別の実施例における成形材料の製造工程を段階
的に表す概略工程図FIG. 4 is a schematic process diagram showing stepwise a manufacturing process of a molding material in another example.
【図５】別の実施例となる焼結製品の製造方法を段階的
に表す概略工程図FIG. 5 is a schematic process diagram showing stepwise a method for manufacturing a sintered product according to another embodiment.
【図６】別の実施例となる焼結製品の製造方法を段階的
に表す概略工程図FIG. 6 is a schematic process diagram showing stepwise a method for manufacturing a sintered product as another embodiment.
【図７】別の実施例となる焼結製品の製造方法を段階的
に表す概略工程図FIG. 7 is a schematic process diagram showing stepwise a method of manufacturing a sintered product according to another embodiment.
【図８】別の実施例となる焼結製品の製造方法を段階的
に表す概略工程図FIG. 8 is a schematic process diagram showing stepwise a method for manufacturing a sintered product as another example.
【図９】別の実施例となる焼結製品の製造方法を段階的
に表す概略工程図FIG. 9 is a schematic process diagram showing stepwise a method for manufacturing a sintered product as another example.
【図１０】別の実施例となる焼結製品の製造方法を段階
的に表す概略工程図FIG. 10 is a schematic process diagram showing stepwise a method for manufacturing a sintered product as another example.
【図１１】別の実施例となる焼結製品の製造方法を段階
的に表す概略工程図FIG. 11 is a schematic process diagram showing stepwise a method for manufacturing a sintered product as another example.
【図１２】別の実施例となる焼結製品の製造方法を段階
的に表す概略工程図FIG. 12 is a schematic process diagram showing stepwise a method for manufacturing a sintered product as another example.
【図１３】別の実施例となる焼結製品の製造方法を段階
的に表す概略工程図FIG. 13 is a schematic process diagram showing stepwise a method for manufacturing a sintered product as another example.
【図１４】別の実施例となる焼結製品の製造方法を表す
概略工程図FIG. 14 is a schematic process diagram showing a method for manufacturing a sintered product as another example.
【図１５】別の実施例となる焼結製品の製造方法を表す
概略工程図FIG. 15 is a schematic process diagram showing a method for manufacturing a sintered product as another example.
【図１６】焼結製品の変形状態を説明する概略斜視図FIG. 16 is a schematic perspective view illustrating a deformed state of a sintered product.
１０ 第１の保持具 １２ 凸部 １６、１８ 補助保持具 ２０ 成形品 ２０ａ 部分焼結部 ２０ｘ 焼結製品 ２１ 水平片 ２４ 焼結用粉末 ２６ ポリマー成分 ２８ ワックス成分 ３０ 第２の保持具 ３１ ガス噴出口 ３２ 凸部 ３４ 下部材 ３６ 上部材 ３８ 縮小部材 ５０ 電磁石 10 First holder 12 convex 16, 18 Auxiliary holder 20 molded products 20a Partial sintering part 20x sintered product 21 Horizontal piece 24 Sintering powder 26 Polymer component 28 Wax component 30 Second holder 31 gas outlet 32 convex 34 Lower member 36 Upper member 38 Reduction member 50 electromagnets
───────────────────────────────────────────────────── フロントページの続き (72)発明者 草野 昇 大阪府門真市大字門真1048番地松下電工 株式会社内 (56)参考文献 特開 平３−294402（ＪＰ，Ａ) 特開 平２−30701（ＪＰ，Ａ) 特開 平６−108115（ＪＰ，Ａ) 特開 平３−104802（ＪＰ，Ａ) 特開 平４−74769（ＪＰ，Ａ) 特開 平４−6201（ＪＰ，Ａ) 特開 平６−108106（ＪＰ，Ａ) 特開 平４−45202（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B22F 3/02,3/10 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Noboru Kusano 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works, Ltd. (56) Reference JP-A-3-294402 (JP, A) JP-A-2-30701 ( JP, A) JP 6-108115 (JP, A) JP 3-104802 (JP, A) JP 4-74769 (JP, A) JP 4-6201 (JP, A) JP HEI 6-108106 (JP, A) JP HEI 4-45202 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) B22F 3 / 02,3 / 10
Claims (2)
製品を製造する方法であって、 ワックス成分とポリマー成分とを含む結合剤と前記焼結
用粉末との混合物を成形して凹凸形状を有する成形品を
得る工程と、 前記工程で得られた成形品を、前記凹凸形状に合致する
凹凸形状を有する第１の保持具に保持した状態で前記ワ
ックス成分を除去する工程と、 前記工程でワックス成分が除去された成形品を、前記焼
結に伴う収縮量に見合う隙間を前記凹凸形状との間に有
する第２の保持具に保持した状態で前記ポリマー成分を
除去する工程と、 前記工程でポリマー成分が除去された成形品を、前記第
２の保持具に保持した状態で焼結させる工程とを備えた
焼結製品の製造方法。1. A method for producing a sintered product by sintering a molded product containing sintering powder, which comprises molding a mixture of a binder containing a wax component and a polymer component and the sintering powder. And a step of obtaining a molded product having a concavo-convex shape, and a step of removing the wax component while holding the molded product obtained in the step in a first holder having a concavo-convex shape matching the concavo-convex shape. And the polymer component is removed in a state where the molded product from which the wax component has been removed in the above step is held by the second holding tool having a gap between the uneven shape and the shrinkage amount due to the sintering. A method for producing a sintered product, comprising: a step; and a step of sintering the molded article from which the polymer component is removed in the step while being held in the second holder.
マー成分を被覆処理した後、前記ワックス成分を混合し
たものである請求項１に記載の焼結製品の製造方法。 2. The method for producing a sintered product according to claim 1, wherein the mixture is obtained by coating the sintering powder with the polymer component and then mixing the wax component .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20245094A JP3392532B2 (en) | 1994-08-26 | 1994-08-26 | Manufacturing method of sintered products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20245094A JP3392532B2 (en) | 1994-08-26 | 1994-08-26 | Manufacturing method of sintered products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0867904A JPH0867904A (en) | 1996-03-12 |
| JP3392532B2 true JP3392532B2 (en) | 2003-03-31 |
Family
ID=16457732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20245094A Expired - Fee Related JP3392532B2 (en) | 1994-08-26 | 1994-08-26 | Manufacturing method of sintered products |
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| Country | Link |
|---|---|
| JP (1) | JP3392532B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101288138B1 (en) * | 2011-10-26 | 2013-07-18 | 삼성전기주식회사 | A device for sintering a ceramic board and a method of sintering a ceramic board by using the same |
-
1994
- 1994-08-26 JP JP20245094A patent/JP3392532B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0867904A (en) | 1996-03-12 |
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