JP3389885B2 - Electronic component bonding apparatus and electronic component bonding method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for soldering electronic components, for example.

[0002]

The soldering work of electronic parts is performed by using, for example, the apparatus shown in FIG.
It has been proposed to carry out under an inert gas atmosphere such as nitrogen gas. In FIG. 2, 11 is a stage on which the electronic component 12 is mounted, and 13 is a nitrogen gas supply port provided on a wall 14 standing on the stage 11.

Then, under the condition that the nitrogen gas is blown horizontally from the nitrogen gas supply port 13 into the chamber 15 surrounded by the wall 14 as shown by the arrow to fill the chamber 15 with the nitrogen gas, the electronic component 12 Soldering is performed from above. However, in the above method, the chamber 15 surrounded by the wall 14
Since the inside must be filled with nitrogen gas, a large amount of nitrogen gas is required. Therefore, the cost is higher.

Further, since a large amount of nitrogen gas is required to cover the electronic component 12 with nitrogen gas, it takes much time. In other words, it takes time to start the soldering work, and the efficiency is not good. Therefore, the problem to be solved by the present invention is to reduce the amount of inert gas required for the soldering work atmosphere to be an inert gas atmosphere, the running cost is low, and the soldering work is not necessary. It is an object of the present invention to provide an electronic component joining processing technique which can form an active gas atmosphere in a short time and is excellent in workability.

[0005]

[Means for Solving the Problems] The above-mentioned problem is an apparatus for joining and processing an electronic component, including a stage for mounting the electronic component and an inert gas for supplying an inert gas from below the stage. It has a gas supply means, a substantially inverted bowl-shaped body provided so as to cover the stage, and an opening formed in the substantially inverted bowl-shaped body at a position corresponding to above the substantially central portion of the stage. It is solved by the electronic parts joining processing device.

Further, a stage on which the child part is placed, an inert gas supply means for supplying an inert gas from below the stage, a substantially inverted bowl-shaped body provided so as to cover the stage, and the stage A method for joining electronic components using a device for joining electronic components having an opening formed in the substantially bowl-shaped body at a position corresponding to the upper part of the substantially central portion, the method comprising: A step of placing an electronic component on the stage, a step of supplying an inert gas by the inert gas supply means to form an inert gas atmosphere so as to cover the electronic component on the stage, and the substantially inverted bowl-shaped body And a step of performing a joining process on the electronic component on the stage through the formed opening.

That is, with the above construction, when an inert gas such as nitrogen gas is supplied by the inert gas supply means, the flow of this inert gas is exactly the stage by the substantially inverted bowl-shaped body. Turned over to cover the electronic components above and the electronic components are covered with an inert gas. Since the formation of the inert gas atmosphere is exactly on the stage on which the electronic component is placed, the required amount of the inert gas such as nitrogen gas is small. Therefore, the running cost is low.

Further, the time required to form the inert gas atmosphere on the stage on which the electronic parts are mounted is short, and the soldering work can be performed efficiently. Further, since the supplied inert gas is diffused upward through the opening formed in the substantially inverted bowl shape, dust or dust is blown up even when trying to fall onto the electronic component through the opening. As a result, it is difficult for dust and dirt to drop onto the electronic components being soldered, and it is difficult for dust and dirt to adhere to the electronic components. Therefore, the yield in soldering is good.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION An electronic component joining / processing apparatus according to the present invention is an apparatus for joining and processing electronic components, and includes a stage for mounting electronic components and an inert gas from below the stage. An inert gas supply means for supplying, a substantially inverted bowl-shaped body provided so as to cover the stage, and an opening formed in the substantially inverted bowl-shaped body at a position corresponding to above the substantially central portion of the stage. Have.

The electronic component joining method according to the present invention includes a stage on which electronic components are placed, an inert gas supply means for supplying an inert gas from below the stage, and a step for covering the stage. Joining of electronic components using an apparatus for joining processing of electronic components having an inverted bowl-shaped body and an opening formed in the substantially inverted bowl-shaped body at a position corresponding to above the substantially central portion of the stage A method of processing, which comprises placing an electronic component on the stage, and supplying an inert gas by the inert gas supply means to form an inert gas atmosphere so as to cover the electronic component on the stage. And a step of joining the electronic component on the stage through the opening formed in the substantially inverted bowl shape.

A more specific description will be given below. FIG. 1 is a schematic cross-sectional view of an embodiment of an electronic component joining processing apparatus according to the present invention. In FIG. 1, reference numeral 1 is a stage on which an electronic component such as an LSI is mounted. Reference numeral 2 is a substantially inverted bowl-shaped body, and the substantially inverted bowl-shaped body 2 is provided so as to cover the stage 1.

The top of the substantially inverted bowl-shaped body 2 is formed in an opening shape and serves as a window 3. The end 3a of the window 3 projects slightly inward from the end 1a of the stage 1. or,
The shoulder portion 2a of the substantially inverted bowl-shaped body 2 is inclined, and when a fluid collides from below, the direction is changed here. That is, the gas is turned from the vertical direction to the horizontal direction, and the atmosphere of the gas is exactly formed on the stage 1. Further, the gas forming a predetermined atmosphere on the stage 1 is pushed by the gas flowing one after another, pushed upward, and then released from the window 3 to the outside.

Reference numeral 4 is a base on which the substantially inverted bowl-shaped body 2 is arranged. A hole 5 is formed in the base 4, and an inert gas supply means (not shown) is connected to the hole 5. Therefore, when dry nitrogen gas (inert gas) is supplied from the inert gas supply means, the nitrogen gas is discharged from the hole 5 toward the upper stage 1 into the chamber formed by the substantially inverted bowl-shaped body 2. , And the nitrogen gas flowing upward is horizontally converted by the shoulder portion 2a, and the stage 1
An atmosphere of nitrogen gas is formed on the top.

Reference numeral 6 is an electronic component such as an LSI. next,
The soldering work using the above device will be briefly described. First, the electronic component 6 to be soldered is placed on the stage 1 through the window 3 of the substantially bowl-shaped body 2. Next, dry nitrogen gas is supplied from the hole 5 to the inside from the inert gas supply means. The supplied nitrogen gas flows upward toward the stage 1 and is horizontally converted by the shoulder portion 2 a to form an atmosphere of nitrogen gas on the stage 1. As a result, the entire electronic component 6 is covered with the dry nitrogen gas.

After a certain period of time has passed since the nitrogen gas was supplied by the inert gas supply means, the entire electronic component 6 will be covered with the nitrogen gas. Thereafter, the soldering work is performed through the window 3. When the soldering is performed as described above, the nitrogen gas supplied from below is diverted by the substantially inverted bowl-shaped body 2 so as to exactly cover the electronic component 6 on the stage 1, and the electronic component 6 Are covered with nitrogen gas.

In forming the gas atmosphere for covering the electronic component 6 with this nitrogen gas, the amount of nitrogen gas required is significantly smaller than that in the case of using the apparatus of FIG. 2, and the running cost is accordingly low. Further, the time required to form the nitrogen gas atmosphere for covering the electronic component 6 is short, and the soldering work can be performed efficiently.

Further, since the nitrogen gas is diffused upward from the window 3, dust or dirt can be blown up even if it tries to fall onto the electronic component 6 from the window 3, and soldering is performed. It is difficult for dust and dirt to fall onto the existing electronic component 6,
It is difficult for dust and dirt to adhere to the electronic component 6. Therefore, the yield in soldering is good.

[0018]

EFFECT OF THE INVENTION The inert gas supplied from below is
By the substantially inverted bowl-shaped body, the direction is changed to cover the electronic component on the stage, and the electronic component is covered with the inert gas. When forming an inert gas atmosphere for covering electronic components with this inert gas, the required amount of the inert gas is much smaller than in the case of using the conventional apparatus of FIG. 2, and the running cost is accordingly low. . The time required to form an inert gas atmosphere for covering electronic components is short, and soldering work (joining work) can be performed efficiently. Since the inert gas is diffused upward from the opening formed in the substantially inverted bowl shape, even if dust or dirt falls from the opening onto the electronic component, it will be blown up and the solder will be blown up. Dust and dust are less likely to drop on the electronic component being attached (joined), and dust and dust are less likely to adhere to the electronic component. Therefore, the yield in soldering (joining) is good.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of an embodiment of an electronic component joining processing apparatus according to the present invention.

FIG. 2 is a schematic plan view of a conventional electronic component joining processing apparatus.

[Explanation of symbols]

1 stage 2 Substantially inverted bowl shape 2a shoulder 3 windows (opening) 4 base 5 holes 6 electronic components

Claims (2)

(57) [Claims] 1. An apparatus for joining electronic components, comprising: a stage on which electronic components are mounted; an inert gas supply means for supplying an inert gas from below the stage; and a cover for the stage. An electronic component bonding apparatus, comprising: a substantially inverted bowl-shaped body provided as described above; and an opening formed in the substantially inverted bowl-shaped body at a position corresponding to above the substantially central portion of the stage. 2. A stage on which an electronic component is placed, an inert gas supply means for supplying an inert gas from below the stage, a substantially inverted bowl-shaped body provided so as to cover the stage, and the stage A method of joining electronic components using a device for joining processing of electronic components having an opening formed in the substantially bowl-shaped body at a position corresponding to an upper portion of a substantially central portion, comprising: A step of placing an electronic component on, a step of supplying an inert gas by the inert gas supply means, to form an inert gas atmosphere to cover the electronic component on the stage, in the substantially inverted bowl-shaped body And a step of joining the electronic component on the stage through the formed opening.