JP3380008B2 - Polyamide resin composition - Google Patents

Polyamide resin composition

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Publication number
JP3380008B2
JP3380008B2 JP24975393A JP24975393A JP3380008B2 JP 3380008 B2 JP3380008 B2 JP 3380008B2 JP 24975393 A JP24975393 A JP 24975393A JP 24975393 A JP24975393 A JP 24975393A JP 3380008 B2 JP3380008 B2 JP 3380008B2
Authority
JP
Japan
Prior art keywords
polyamide resin
resin composition
weight
molding
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP24975393A
Other languages
Japanese (ja)
Other versions
JPH0782474A (en
Inventor
真也 松元
順一郎 牧田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by Asahi Kasei Corp filed Critical Asahi Kasei Corp
Priority to JP24975393A priority Critical patent/JP3380008B2/en
Publication of JPH0782474A publication Critical patent/JPH0782474A/en
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Anticipated expiration legal-status Critical
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Description

【発明の詳細な説明】 【0001】 【産業上の利用分野】本発明は、成形加工性に優れたポ
リアミド樹脂組成物に関する。更に詳しくは射出成形時
に於いて、優れた生産性を与えると同時に、優れた成形
品特性を得ることが可能なポリアミド樹脂組成物に関す
るものである。 【0002】 【従来の技術】ポリアミド樹脂は優れた機械的特性、耐
熱性、耐油性等を有することで、エンジニアリング樹脂
として広く使用されている。このポリアミド樹脂は、通
常は容易に射出成形等で成形加工されるが、生産性及び
経済性の観点から、成形サイクルを短縮することがで
き、高生産の達成が可能なポリアミド樹脂が求められて
いる。これに応えて、これまで数々の技術的な改良が試
みられて来た。例えば、ステアリン酸バリウム、ラウリ
ン酸バリウム、ステアリン酸アルミニウム等よりなる群
より選ばれた1種以上の化合物を添加してなるポリアミ
ド樹脂組成物(特公昭41−8954号公報)、ポリシ
ロキサンと周期律表I族、II族、およびIII族の金
属から選ばれた金属の高級脂肪酸塩を添加してなるポリ
アミド樹脂組成物(特開昭51−34257号公報)、
炭素数10〜20の脂肪族カルボン酸の塩および炭素数
22以上の脂肪族カルボン酸またはその誘導体を含有し
てなるポリアミド樹脂組成物(特開昭52−42549
号)、等が知られている。 【0003】しかしながら、これらの方法で得られたポ
リアミド樹脂組成物は、可塑化時間が短縮されること
と、離型性が改善されることで、見かけ上は成形サイク
ルタイムが短縮されるが、成形サイクルタイムを短縮し
て成形した場合は、得られる成形品の反り変形量が大き
くなり、寸法精度が厳しい用途向けの成形品を得る為に
は、成形サイクルタイムを延ばして成形する必要があっ
た。また、ポリアミド樹脂成形品が吸水する事で靭性が
増す特徴を利用して、ヒンジ部が付いた成形品を一体成
形するケースが増えてきている。しかしながら、ポリア
ミド樹脂成形品の厚みが薄いヒンジ部は、吸水してない
絶乾状態に於いて、曲げ折れが生じ易い為に、調湿して
強制的に吸水させているのが現状であった。 【0004】 【発明が解決しようとする課題】かかる事情に鑑み、本
発明の課題は、ポリアミド樹脂の可塑化時間の短縮と離
型性を改善し、成形サイクルタイムの短縮を可能とし、
更に成形サイクルタイムを短縮して成形した場合に於い
ても反り変形が少ないポリアミド樹脂組成物を提供する
ものであり、同時に、絶乾状態に於いても成形品ヒンジ
部の曲げ折れ性が改善されたポリアミド樹脂組成物を提
供することにある。 【0005】 【課題を解決するための手段】本発明者らは、上記課題
を解決するため鋭意検討を重ねた結果、窒化ホウ素粉末
と脂肪族カルボン酸の誘導体を含有してなるポリアミド
樹脂組成物が、上記課題をすべて解決できることを見出
し、本発明を完成するに到った。すなわち、本発明は、
(A)ポリアミド樹脂100重量部に、(B)粉末粒径
が10μ以下である窒化ホウ素の粉末を0.0001〜
1重量部と、(C)炭素数15以上の脂肪族カルボン酸
の誘導体を0.005〜0.5重量部とを含有させてな
るポリアミド樹脂組成物。を要旨とするものである。 【0006】以下、本発明の内容を詳細に説明すると、
本発明に用いられるポリアミド樹脂とは、公知のポリア
ミド樹脂であれば特に制限はなく、5000以上の分子
量を有するナイロンと称せられているものを包含してい
る。具体的には、ラクタムの重縮合物、ジアミン化合物
とジカルボン酸化合物との重縮合物、ω−アミノカルボ
ン酸の重縮合物等の各種タイプのポリアミド樹脂、又は
それ等の共重合ポリアミド樹脂やブレンド物等であり、
例えば、ナイロン6、66、610、612、11、1
2、46等のホモポリマー、ナイロン66/6、66/
610、66/612、66/6T、66/6I、66
/6T/6I等のコポリマー及びこれ等の相互ブレンド
物が挙げられる。ここで6Tとは、ヘキサメチレンジア
ミンとテレフタル酸、6Iとはヘキサメチレンジアミン
とイソフタル酸を原料とする縮合物であり、他は公知の
原料を用いたポリアミド樹脂である。 【0007】本発明で用いられる窒化ホウ素とは、化学
式:BNで表わされるものであり、ホウ素を窒素気流中
で高温加熱するか、またはアンモニアと酸化ホウ素ある
いは、塩化アンモニウムとホウ砂を加熱して得られる粉
末であり、粉末の粒径が大きいと構造欠陥を生じてヒン
ジ特性の改善効果が得られない為に粒径が10μ以下の
粉末を用いるのが好ましい。窒化ホウ素の添加量は、そ
の作用効果に関連して限定されたものであり、ポリアミ
ド樹脂100重量部に対して0.0001重量部よりも
少ないとそれが目的とする効果が小さく、1重量部を越
えても目的とする効果が得られないので0.0001〜
1重量部の範囲で含有させることが必要であり、好まし
くは0.0005〜0.5重量部の範囲である。 窒化
ホウ素はポリマーの重合時に添加してもよく、また押出
機内でポリアミドに配合する、ペレット表面にブレンド
添加する、高濃度のマスターバッチとして添加する等の
公知の方法で配合する事ができる。 【0008】本発明に用いられる炭素数15以上の脂肪
族カルボン酸の誘導体としては、パルミチン酸、ステア
リン酸、ベヘニン酸、セロチン酸、モンタン酸、メリシ
ン酸、セロプラスチン酸、オレイン酸、エルカ酸、等の
金属塩及びエステル等が包含される。炭素数15以上の
脂肪族カルボン酸の誘導体の添加量はその作用効果に関
連して限定される、即ち、ポリアミド樹脂100重量部
に対して0.005重量部よりも少ないとそれが目的と
する効果が小さく、0.5重量部を越えても更なる効果
は望めないので0.005〜0.5重量部の範囲で含有
させることが必要である。炭素数15以上の脂肪族カル
ボン酸の誘導体は押出機内でポリアミドに配合する、ペ
レット表面にブレンド添加する、高濃度のマスターバッ
チとして添加する等の公知の方法で配合することができ
る。なお、本発明のポリアミド樹脂組成物には、本発明
の効果を著しく損なわない程度の範囲内において他の添
加剤、即ち展着剤、帯電防止剤、着色剤、充填剤、補強
剤、安定剤等を任意の段階で添加することができる。 【0009】 【実施例】次に、実施例及び比較例によって本発明を更
に詳細に説明するが、本発明はこの実施例に限定される
ものではない。実施例及び比較例に於いて、可塑化時
間、離型可能な成形サイクルタイム、反り変形量、ヒン
ジ特性は以下の方法で測定した。 (1)可塑化時間 (成形条件) 射出成形機 :日精樹脂工業(株)製 PS4
0E 金 型 :1ケ取りボックス(図1参照) シリンダー温度 :ノズル部280℃、前部280
℃、中部280℃、後部280℃ 型 温 度 :80℃ 可塑化ストローク :12mm スクリュー回転数 :250rpm 背 圧 :10% 射出速度 :40% 射出圧力 :30% 成形サイクルタイム :射出2sec、冷却13se
c、休止0.3sec(トータル18.3sec) (測定方法)成形開始より31ショットから40ショッ
トまでの可塑化時間の平均値を求めた。 【0010】(2)離型可能な成形サイクルタイム (測定方法)可塑化時間の測定と同一条件で成形し、冷
却時間のみを短縮しながら50ショット連続成形した時
に離型不良がない限界のトータル成形サイクルタイムを
求めた。 (3)反り変形量 (測定方法)可塑化時間の測定と同一条件で、冷却時間
のみを変化させて、トータル成形サイクルタイムが1
2.3secと20.3secの成形品の反りを測定し
た。尚、測定部位は図1に記した部位である。 【0011】(4)ヒンジ特性 (成形条件) 射出成形機 :日精樹脂工業(株)製 PS4
0E 金 型 :ヒンジ付き成形品(図2参照) シリンダー温度 :ノズル部280℃、前部280
℃、中部280℃、後部280℃ 型 温 度 :80℃ 可塑化ストローク :15mm スクリュー回転数 :200rpm 背 圧 :10% 射出速度 :40% 射出圧力 :23% 成形サイクルタイム :射出7sec、冷却7sec、
休止1sec (測定方法)上記成形条件で成形した図2のヒンジ付き
成形品を絶乾状態で180°折り曲げて、破壊した時の
折り曲げ回数を測定した。実施例及び比較例のポリアミ
ド樹脂組成物は以下の様にして得た。分子量16,00
0のナイロン66を100重量部に対して、表1に記し
た配合物の配合量をヘンシェルミキサーで3分間混合し
て得た。これらのポリアミド樹脂組成物を前記した条件
で成形及び測定し、表1に示す物性を得た。 【0012】 【表1】【0013】 【発明の効果】本発明により、従来技術が抱えていた課
題、即ち、ポリアミド樹脂の可塑化時間の短縮と離型性
を改善し、成形サイクルタイムの短縮を可能とした、更
に成形サイクルタイムを短縮した場合に於いても反り変
形が少ないことで、生産性を向上する為に成形サイクル
タイムを短縮した場合に於いても、寸法精度が厳しい用
途向けの成形品を得る事が可能となった。更に、成形品
の厚みが薄いヒンジ部の絶乾状態における曲げ折れに関
しても、本発明で改善されたことで、調湿工程が不要と
なり、生産性向上に寄与できた。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyamide resin composition having excellent moldability. More specifically, the present invention relates to a polyamide resin composition capable of giving excellent productivity and at the same time obtaining excellent molded article properties at the time of injection molding. [0002] Polyamide resins are widely used as engineering resins because of their excellent mechanical properties, heat resistance, oil resistance and the like. This polyamide resin is usually easily molded by injection molding or the like, but from the viewpoint of productivity and economy, a polyamide resin capable of shortening the molding cycle and achieving high production is required. I have. In response, a number of technical improvements have been attempted. For example, a polyamide resin composition containing at least one compound selected from the group consisting of barium stearate, barium laurate, aluminum stearate and the like (Japanese Patent Publication No. 41-8954), polysiloxane and periodic Polyamide resin composition obtained by adding a higher fatty acid salt of a metal selected from Tables I, II and III (JP-A-51-34257);
Polyamide resin composition containing a salt of an aliphatic carboxylic acid having 10 to 20 carbon atoms and an aliphatic carboxylic acid having 22 or more carbon atoms or a derivative thereof (JP-A-52-42549).
No.) are known. [0003] However, the polyamide resin composition obtained by these methods apparently shortens the molding cycle time by shortening the plasticization time and improving the releasability, If molding is performed with a reduced molding cycle time, the resulting molded product will have a large amount of warpage deformation, and in order to obtain a molded product for applications with strict dimensional accuracy, it is necessary to extend the molding cycle time to perform molding. Was. In addition, there is an increasing number of cases in which a molded article having a hinge portion is integrally molded by utilizing a feature that toughness is increased by absorbing water from a polyamide resin molded article. However, the thin hinge portion of the polyamide resin molded article is apt to bend and bend easily in a completely dry state where it does not absorb water. . [0004] In view of such circumstances, an object of the present invention is to shorten the plasticization time of a polyamide resin, improve the releasability, and shorten the molding cycle time.
Further, the present invention provides a polyamide resin composition having less warpage even when molding is performed with a shorter molding cycle time, and at the same time, the bending and foldability of a molded product hinge is improved even in a completely dry state. To provide a polyamide resin composition. The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, have found that a polyamide resin composition containing boron nitride powder and a derivative of an aliphatic carboxylic acid. However, they have found that all of the above problems can be solved, and have completed the present invention. That is, the present invention
(A) 100 parts by weight of a polyamide resin, (B) a powder of boron nitride having a powder particle size of 10 μ
A polyamide resin composition comprising 1 part by weight and (C) 0.005 to 0.5 part by weight of a derivative of an aliphatic carboxylic acid having 15 or more carbon atoms. It is the gist. Hereinafter, the contents of the present invention will be described in detail.
The polyamide resin used in the present invention is not particularly limited as long as it is a known polyamide resin, and includes those called nylon having a molecular weight of 5000 or more. Specifically, various types of polyamide resins such as polycondensates of lactams, polycondensates of diamine compounds and dicarboxylic acid compounds, polycondensates of ω-aminocarboxylic acids, and copolymerized polyamide resins and blends thereof. Things, etc.
For example, nylon 6, 66, 610, 612, 11, 1
Homopolymers such as 2, 46, nylon 66/6, 66 /
610, 66/612, 66 / 6T, 66 / 6I, 66
Copolymers such as / 6T / 6I and the like and blends thereof. Here, 6T is a condensate using hexamethylene diamine and terephthalic acid as raw materials, 6I is a condensate using hexamethylene diamine and isophthalic acid as raw materials, and the other is a polyamide resin using a known raw material. The boron nitride used in the present invention is represented by the chemical formula: BN. Boron is heated at a high temperature in a nitrogen stream, or is heated by heating ammonia and boron oxide, or ammonium chloride and borax. It is preferable to use a powder having a particle size of 10 μm or less, since if the particle size of the powder is large, structural defects occur and the effect of improving hinge characteristics cannot be obtained. The amount of boron nitride added is limited in relation to its function and effect. If the amount is less than 0.0001 part by weight with respect to 100 parts by weight of the polyamide resin, the intended effect is small and 1 part by weight. Exceeds 0.0001, the desired effect cannot be obtained.
It is necessary to contain it in the range of 1 part by weight, preferably in the range of 0.0005 to 0.5 part by weight. Boron nitride may be added at the time of polymerization of the polymer, or may be added by a known method such as being added to a polyamide in an extruder, being added to the pellet surface by blending, or added as a high-concentration masterbatch. The derivatives of aliphatic carboxylic acids having 15 or more carbon atoms used in the present invention include palmitic acid, stearic acid, behenic acid, cerotic acid, montanic acid, melicic acid, celloplastic acid, oleic acid, erucic acid and the like. Metal salts and esters. The amount of the aliphatic carboxylic acid derivative having 15 or more carbon atoms to be added is limited in relation to its function and effect. That is, if the amount is less than 0.005 parts by weight with respect to 100 parts by weight of the polyamide resin, it is intended. The effect is small, and even if it exceeds 0.5 part by weight, no further effect can be expected. Therefore, it is necessary to contain it in the range of 0.005 to 0.5 part by weight. The derivative of the aliphatic carboxylic acid having 15 or more carbon atoms can be compounded by a known method such as compounding with polyamide in an extruder, blending and adding to the pellet surface, or adding as a high-concentration masterbatch. In the polyamide resin composition of the present invention, other additives such as a spreading agent, an antistatic agent, a coloring agent, a filler, a reinforcing agent, and a stabilizer are used as long as the effects of the present invention are not significantly impaired. Can be added at any stage. Next, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples. In Examples and Comparative Examples, the plasticizing time, the molding cycle time at which the mold could be released, the amount of warpage, and the hinge characteristics were measured by the following methods. (1) Plasticization time (molding condition) Injection molding machine: PS4 manufactured by Nissei Plastic Industry Co., Ltd.
0E Mold: 1 box (see Fig. 1) Cylinder temperature: 280 ° C at nozzle, 280 at front
C, middle 280 ° C, rear 280 ° C Mold temperature: 80 ° C Plasticization stroke: 12 mm Screw rotation speed: 250 rpm Back pressure: 10% Injection speed: 40% Injection pressure: 30% Molding cycle time: Injection 2 sec, cooling 13 sec
c, rest 0.3 sec (total 18.3 sec) (Measurement method) The average value of the plasticization time from 31 shots to 40 shots from the start of molding was determined. (2) Molding cycle time capable of releasing (measuring method) Molding is performed under the same conditions as in the measurement of the plasticizing time, and the total amount of the mold release failure when 50 shots are continuously molded while shortening only the cooling time is reduced. The molding cycle time was determined. (3) Warpage Deformation (Measurement Method) Under the same conditions as in the measurement of the plasticization time, only the cooling time is changed, and the total molding cycle time is 1
The warpage of the molded product was measured at 2.3 sec and 20.3 sec. The measurement site is the site shown in FIG. (4) Hinge characteristics (molding conditions) Injection molding machine: PS4 manufactured by Nissei Plastic Industry Co., Ltd.
0E Mold: Molded product with hinge (see Fig. 2) Cylinder temperature: 280 ° C at nozzle, 280 at front
C., middle 280 ° C., rear 280 ° C. Mold temperature: 80 ° C. Plasticizing stroke: 15 mm Screw rotation speed: 200 rpm Back pressure: 10% Injection speed: 40% Injection pressure: 23% Molding cycle time: Injection 7 sec, cooling 7 sec,
Pause 1 sec (Measurement method) The hinged molded article of FIG. 2 molded under the above molding conditions was bent 180 ° in an absolutely dry state, and the number of times of folding when broken was measured. The polyamide resin compositions of Examples and Comparative Examples were obtained as follows. Molecular weight 16,00
The amount of the composition shown in Table 1 was mixed with 100 parts by weight of nylon 66 of No. 0 using a Henschel mixer for 3 minutes. These polyamide resin compositions were molded and measured under the conditions described above, and the physical properties shown in Table 1 were obtained. [Table 1] According to the present invention, the problems encountered in the prior art, namely, shortening of the plasticization time of the polyamide resin, improvement of the releasability, and shortening of the molding cycle time have been achieved. Even when the cycle time is shortened, the warpage is small, so even if the molding cycle time is shortened to improve productivity, it is possible to obtain molded products for applications where dimensional accuracy is severe. It became. Furthermore, with respect to the bending breakage of the thin hinge part in a dry state in a dry state, the improvement of the present invention eliminates the need for a humidity control step, thereby contributing to an improvement in productivity.

【図面の簡単な説明】 【図1】本発明で成形品の反り変形量を測定するため
の、1ケ取りボックス成形品の図であり、(A)は平面
図、(B)は断面図、(C)は反り変形を生じた側面図
である。 【図2】本発明でヒンジ部の曲げ折れ回数の測定に用い
た成形品の図であり、(A)は平面図、(B)は断面
図、(C)は180゜折り曲げ時の断面図である。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view of a one-piece box molded product for measuring the amount of warpage deformation of the molded product according to the present invention, (A) is a plan view, and (B) is a cross-sectional view. (C) is a side view in which warpage deformation has occurred. FIGS. 2A and 2B are diagrams of a molded product used for measuring the number of times the hinge portion is bent in the present invention, wherein FIG. 2A is a plan view, FIG. 2B is a cross-sectional view, and FIG. It is.

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Claims (1)

(57)【特許請求の範囲】 【請求項1】 (A)ポリアミド樹脂100重量部に、
(B)粉末粒径が10μ以下である窒化ホウ素の粉末を
0.0001〜1重量部と、(C)炭素数15以上の脂
肪族カルボン酸の誘導体を0.005〜0.5重量部と
を含有させてなるポリアミド樹脂組成物。
(57) [Claim 1] (A) 100 parts by weight of a polyamide resin,
(B) 0.0001 to 1 part by weight of a powder of boron nitride having a powder particle size of 10 μ or less, and (C) 0.005 to 0.5 part by weight of a derivative of an aliphatic carboxylic acid having 15 or more carbon atoms. And a polyamide resin composition.
JP24975393A 1993-09-13 1993-09-13 Polyamide resin composition Expired - Lifetime JP3380008B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24975393A JP3380008B2 (en) 1993-09-13 1993-09-13 Polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24975393A JP3380008B2 (en) 1993-09-13 1993-09-13 Polyamide resin composition

Publications (2)

Publication Number Publication Date
JPH0782474A JPH0782474A (en) 1995-03-28
JP3380008B2 true JP3380008B2 (en) 2003-02-24

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CN101712758A (en) 2004-05-21 2010-05-26 三菱化学株式会社 Polyamide resin and hinged molded articles
JP5080718B2 (en) * 2004-06-02 2012-11-21 ディーエスエム アイピー アセッツ ビー.ブイ. Polyamide resin composition
JP2007297463A (en) * 2006-04-28 2007-11-15 Teijin Ltd Reinforced resin composition and its manufacturing method
JP2008214398A (en) * 2007-02-28 2008-09-18 Nippon Polypenco Ltd Thermoconductive monomer-cast nylon-molded article
JP2010173739A (en) * 2010-03-19 2010-08-12 Mitsubishi Engineering Plastics Corp Binding band and molded object having hinge structure

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