JP3352898B2 - Unit frame for mounting electronic circuit packages - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a unit frame for mounting an electronic circuit package in a communication device.

[0002]

2. Description of the Related Art A plurality of electronic circuit packages formed by mounting electronic components on a predetermined printed wiring board are arranged side by side on a unit frame, and a communication unit is formed by combining a plurality of units as one unit. There is a device, and in this communication device, the above unit is a unit for realizing the device function.

[0003] As a unit frame in such a communication device, a printed wiring board for external connection is fixed so as to divide the inside into front and rear portions, and electronic circuit packages are inserted from both the front and rear surfaces. There is a mid-plane mounting type in which a connector is connected to the printed wiring board. FIG. 4 is an exploded perspective view showing a conventional unit frame of this type, and FIG. 5 is a side view of a portion A in FIG.

In the figures, reference numerals 21a and 21b denote front and rear upper guide plates, 22a and 22b denote front and rear lower guide plates, 23 denotes a printed wiring board for external connection, and 24 denotes fixing screws. , 25a and 25b are left and right side plates,
Reference numeral 26 denotes a connecting member, and the opposing ends of the upper guide plates 21a and 21b and the lower guide plates 22a and 22b are formed in a substantially L shape.

[0005] To assemble these, the upper guide plate 2
The upper end and the lower end of the printed wiring board 23 are sandwiched between the vertical portions 1a and 21b and the opposing ends of the lower guide plates 22a and 22b, and provided at the vertical portions of the front upper guide plate 21a and the lower guide plate 2 respectively. The fixing screws 24 are passed through the holes provided at the upper and lower ends of the printed wiring board 23 from the holes formed, and the fixing screws 24 are provided at the respective vertical portions of the upper guide plate 21b and the lower guide plate 22b on the rear side. The side plates 25a and 25b are arranged so as to close the both side surfaces by tightening and fixing the screw holes, and the connecting material 26 is passed between the side plates 25a and 25b, and the holes provided in the side plates 25a and 25b are provided. Is fixed by tightening it into a screw hole of the connecting member 26 through a fixing screw (not shown).

The connection member 26 is fixed to the printed wiring board 2.
3 is fixed on the printed wiring board 2
The connector 3 is set so as not to hinder the fitting of the connector by using a vertical gap of a connector (not shown) provided in the connector 3. In the unit frame assembled in this manner, the guide rails provided on the upper guide plates 21a and 21b and the lower guide plates 22a and 22b are provided on the front and rear mounting portions with the printed wiring board 23 as a boundary. The electronic circuit packages are respectively inserted along the portions, and the connectors provided in each of the electronic circuit packages are connected to the printed wiring board 23.
The connector is mounted by fitting it to a connector (not shown) provided in the connector.

[0007]

However, such a conventional technique has the following problems. That is, in this type of communication device, a plurality of types of electronic circuit packages having different depth dimensions are used according to the function of each unit. The size of each of the front and rear mounting portions varies depending on the depth dimension of the electronic circuit package mounted on each of the mounting portions on the front side and the rear side. The upper guide plate and the lower guide plate have to be prepared in a plurality of types having different depth dimensions in accordance with the depth dimension of the device, and there is a problem of lack of versatility.

Accordingly, an object of the present invention is to vary the depth dimensions of the front and rear mounting parts according to the depth dimensions of the electronic circuit packages mounted on the front and rear mounting parts of the unit. This is to realize a versatile unit frame.

[0009]

SUMMARY OF THE INVENTION Therefore, the present invention has a front mounting portion and a rear mounting portion bordered by a printed wiring board, and the electronic circuit package is mounted on both front and rear surfaces. An electronic circuit package mounting unit frame to be inserted and mounted in the mounting portion on the front side and the mounting portion on the rear side, wherein an upper guide plate on the front side forming the upper surface of the mounting portion on the front side; A rear upper guide plate forming the upper surface of the mounting portion,
A front lower guide plate forming the lower surface of the front mounting portion; a rear lower guide plate forming the lower surface of the rear mounting portion; and a cross-sectional shape provided corresponding to each of the guide plates. Comprises a substantially L-shaped guide bracket for front and rear and up and down, and left and right side plates forming side surfaces of the front and rear mounting portions, and a vertical surface of each of the guide brackets is a portion for fixing the printed wiring board therebetween. In addition, the horizontal portion is a portion that is overlapped with and fixed to each guide plate, so that the overlapping amount can be changed while being shifted in the insertion direction of the electronic circuit package.

[0010]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing an embodiment of a unit frame for mounting an electronic circuit package according to the present invention. FIG. 2 is a side view showing the same embodiment, and shows an example in which a front mounting portion is large and a rear mounting portion is small.

In the figures, 1a and 1b are front guide plates on the front and rear sides, 2a and 2b are lower guide plates on the front and rear sides, 3a and 3b are brackets for the upper guide plate, and 4a and 4b are lower guide plates. Guide plate brackets, 5a to 5c are screw insertion holes (screw fixing holes), 6 is a printed wiring board for external connection, 7 and 8 are fixing screws, 9a and 9b are left and right side plates, 10 is a screw An insertion hole, 11 is a connecting member, and 12 is a fixing screw.

Here, the upper guide plate 1a and the lower guide plate 2
a denotes the upper surface and the lower surface of a front mounting portion on which an electronic circuit package (not shown) is inserted and mounted. The upper guide plate 1b and the lower guide plate 2b are rear portions on which an electronic circuit package (not shown) is inserted and mounted. The upper and lower guide plates 1a and 1b and the lower guide plates 2a and 2b are all formed in the same size in the present embodiment.

The upper guide plate brackets 3a, 3
b and the lower guide plate brackets 4a, 4b are formed in a substantially L-shape.
b, and a plurality of rows of screw insertion holes 5a to 5c are provided at predetermined intervals in the front-rear direction in a horizontal portion overlapping with the lower guide plates 2a and 2b, and the upper guide plates 1a and 1b and the lower guide plates 2a and 2b are provided. A screw insertion hole 5 is provided at the end of the printed wiring board 6 side.
Screw holes (not shown) are provided so as to correspond to any of a to 5c.

On the other hand, the side plates 9a and 9b form side surfaces of the front and rear mounting portions.
9b, the screw insertion holes 5a to 5
The screw insertion holes 10 are provided at the same interval as c. still,
Upper guide plates 1a and 1b of upper guide plate brackets 3a and 3b and lower guide plate brackets 4a and 4b;
In addition, three screw insertion holes 5a to 5c are illustrated in the horizontal portion overlapping the lower guide plates 2a and 2b, and the number of screw insertion holes is not limited, and may be two or more.

The same applies to the number of screw insertion holes 10 in the side plates 9a and 9b. 3 (A) to 3 (C) are side views of a main part showing the operation of the embodiment. Next, as an operation of the above-described configuration, the assembly will be described with reference to FIG. First, the upper guide plate brackets 3a, 3b,
And the upper and lower ends of the printed wiring board 6 are sandwiched between the vertical end faces of the opposed ends of the lower guide plate brackets 4a and 4b,
The fixing screws 7 are passed through the holes provided at the vertical end faces of the upper guide plate bracket 3a and the lower guide plate bracket 4a on the front side and into the holes provided at the upper and lower ends of the printed wiring board 6, respectively. The fixing screws 7 are tightened and fixed to screw holes provided on respective vertical end surfaces of the upper guide plate bracket 3b and the lower guide plate bracket 4b on the rear side.

Next, the upper guide plate brackets 3a, 3
b, and upper guide plates 1a, 1b and lower guide plates 2a, 2 respectively on the lower guide plate brackets 4a, 4b.
b is fixed, but at this time, the fixing position is made different depending on the depth dimension of the electronic circuit package mounted on the front and rear mounting portions of the unit frame. For example, if an electronic circuit package with a small depth dimension is mounted on the mounting part on the front side of the unit frame and an electronic circuit package with a large depth dimension is mounted on the mounting part on the rear side, the bracket for the upper guide plate on the front side The fixing screw 8 is passed through the screw insertion hole 5a at the innermost part in the electronic circuit package insertion direction of 3a and tightened into the screw hole of the upper guide plate 1a. The fixing screw 8 is passed through the front screw insertion hole 5c and fastened to the screw hole of the upper guide plate 1b.

FIG. 3A shows the state at this time.
Similarly, the lower guide plates 2a, 2b are also fixed to the lower guide plate brackets 4a, 4b with fixing screws 8. In the case where electronic circuit packages having the same depth dimension are mounted on the front mounting portion and the rear mounting portion of the unit frame, the center of the front upper guide plate bracket 3a in the electronic circuit package insertion direction is set. Fixing screw 8 in screw insertion hole 5b
And the upper guide plate bracket 3b on the rear side is also screwed into the screw insertion hole 5b at the center in the electronic circuit package insertion direction.
Through the upper guide plate 1b.

FIG. 3B shows the state at this time.
Similarly, the lower guide plates 2a, 2b are also fixed to the lower guide plate brackets 4a, 4b with fixing screws 8. Furthermore, when an electronic circuit package with a large depth is mounted on the mounting portion on the front side of the unit frame, and an electronic circuit package with a small depth is mounted on the mounting portion on the rear side, the bracket for the upper guide plate on the front side. A fixing screw 8 is inserted into the screw insertion hole 5c at the front in the electronic circuit package insertion direction 3a.
Through the upper guide plate 1a, and the rear upper guide plate bracket 3b is screwed into the screw hole of the upper guide plate 1b through the fixing screw 8 into the screw insertion hole 5a at the innermost side in the electronic circuit package insertion direction. .

FIG. 3C shows the state at this time.
Similarly, the lower guide plates 2a, 2b are also fixed to the lower guide plate brackets 4a, 4b with fixing screws 8. By combining in this way, the amount of overlap between the upper guide plate 1a and the lower guide plate 2a on the front side, the bracket 3a for the upper guide plate and the bracket 4a for the lower guide plate, and the upper guide plate 1b and the lower guide on the rear side The amount of overlap between the plate 2b, the upper guide plate bracket 3b and the lower guide plate bracket 4b is selected, and the size of the front mounting portion and the size of the rear mounting portion are changed without changing the overall size. Adjust to the package depth dimension.

In this way, the side plates 9a and 9b are arranged so as to cover both sides of the fixed body, and the side plates 9a and 9b are provided on the front and rear sides of the printed wiring board 6.
9b, the connecting members 11 are passed between the side plates 9a, 9b.
Is fixed by screwing the fixing screw 12 into the screw insertion hole 10 provided in the connector member 11 and tightening it into the screw hole of the connecting member 11. still,
Also in the present embodiment, the fixing position of the connecting member 11 is set so as not to hinder the connector fitting by utilizing the vertical gap of a connector (not shown) provided on the printed wiring board 9.

In the unit frame assembled in this manner, the upper and lower guide plates 1a and 1b and the lower guide plates 2a and 2b are mounted on the mounting portions on the front and rear sides with the printed wiring board 6 as a boundary.
Each of the electronic circuit packages is inserted along a guide rail portion (not shown) provided on 2b, and a connector provided on each electronic circuit package is fitted to a connector (not shown) provided on the printed wiring board 6. Implement.

Of course, the electronic circuit packages can be individually extracted as needed. In the above-described embodiment, the upper guide plate brackets 3a and 3b and the lower guide plate brackets 4a and 4b are provided with a plurality of screw insertion holes 5a to 5c, respectively, but the upper guide plate brackets 3a and 3b are provided. , And bracket 4 for lower guide plate
Similar assembly is possible even if only the screw insertion holes 5c are provided in a and 4b, and a plurality of screw holes (screw fixing holes) are provided in the upper guide plates 1a and 1b and the lower guide plates 2a and 2b. .

In the above-described embodiment, the upper guide plates 1a and 1b and the lower guide plates 2a and 2b have been described as having the same size. However, the upper guide plate 1a and the lower guide plate on the front side are described. The size of the plate 2a may be different from that of the rear upper guide plate 1b and the lower guide plate 2b.

[0024]

As described above, the present invention has a front-side mounting portion and a rear-side mounting portion bordered by a printed wiring board, and the electronic circuit package is mounted on both front and rear surfaces. An electronic circuit package mounting unit frame to be inserted and mounted in the mounting portion on the front side and the mounting portion on the rear side, wherein an upper guide plate on the front side forming the upper surface of the mounting portion on the front side; A rear upper guide plate that forms the upper surface of the mounting portion, a front lower guide plate that forms the lower surface of the front mounting portion, and a rear lower guide plate that forms the lower surface of the rear mounting portion And a front and rear guide bracket having a substantially L-shaped cross section and corresponding left and right side plates forming side surfaces of the front and rear mounting portions. Part that fixes the part with the printed wiring board in between At the same time, the horizontal part is overlapped with each guide plate and fixed, so that the amount of overlap can be shifted in the insertion direction of the electronic circuit package, so that it can be mounted on the front and rear mounting parts of the unit. The depth dimensions of the front and rear mounting portions can be changed according to the depth size of the electronic circuit package to be mounted, and an effect that a versatile unit frame can be realized is obtained.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a side view showing the embodiment of FIG.

FIG. 3 is a side view of a main part showing the operation of the embodiment.

FIG. 4 is an exploded perspective view of a conventional technique.

FIG. 5 is a side view of a portion A in FIG. 4;

[Explanation of symbols]

 1a, 1b Upper guide plate, 2a, 2b Lower guide plate, 3a, 3b Bracket for upper guide plate 4a, 4b Bracket for lower guide plate 5a-5c Screw insertion hole 6 Printed wiring board, 7, 8 Fixing screw, 9a, 9b Side plate 10 Screw insertion hole 11 Connecting material 12 Fixing screw

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Nobuaki Sugiura 3-19-2 Nishi-Shinjuku, Shinjuku-ku, Tokyo Within Nippon Telegraph and Telephone Corporation (72) Katsumi Kaizu 3--19, Nishishinjuku, Shinjuku-ku, Tokyo No. 2 Within Nippon Telegraph and Telephone Corporation (56) References JP-A-1-216597 (JP, A) JP-A-64-67996 (JP, A) JP-A-60-49685 (JP, U) JP-A 2-52488 (JP, U) Japanese Utility Model Showa 50-124807 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 7/14 H05K 7/18

Claims (5)

(57) [Claims] An electronic circuit package having a front mounting portion and a rear mounting portion with a printed wiring board as a boundary, and mounting the electronic circuit package on both the front and rear surfaces. An electronic circuit package mounting unit frame to be inserted and mounted in the mounting portion, wherein: a front upper guide plate forming the upper surface of the front mounting portion; and a rear upper portion forming the upper surface of the rear mounting portion. A guide plate, a front lower guide plate that forms the lower surface of the front mounting portion, a rear lower guide plate that forms the lower surface of the rear mounting portion, The cross-sectional shape provided is approximately L
A front and rear top and bottom guide bracket, and left and right side plates forming side surfaces of the front and rear mounting portions, and a vertical portion of each of the guide brackets as a portion for fixing the printed wiring board therebetween, and a horizontal portion. The unit frame for mounting an electronic circuit package, wherein the portion is overlapped and fixed with each guide plate so that the amount of overlap can be shifted in the insertion direction of the electronic circuit package. 2. The unit frame for mounting an electronic circuit package according to claim 1, wherein a plurality of screws are fixed to one of a horizontal portion of each of the guide brackets and each of the guide plates at regular intervals in an insertion direction of the electronic circuit package. A mounting hole for an electronic circuit package, wherein one of the screw fixing holes is selected and the horizontal portion of the guide bracket and each guide plate are fixed with fixing screws. 3. The unit frame for mounting an electronic circuit package according to claim 1, wherein when an overlapping amount between the horizontal portion of the front guide bracket and the guide plate on the front side is increased, the guide bracket on the rear side is provided. When the amount of overlap between the horizontal and rear guide plates is reduced, and the amount of overlap between the front guide bracket horizontal and front guide plates is reduced, the rear guide bracket horizontal and rear A unit frame for mounting an electronic circuit package, wherein the amount of overlap of the side guide plates is increased so that the overall size is fixed. 4. The unit frame for mounting an electronic circuit package according to claim 1, wherein the size of each guide plate is the same. 5. The unit frame for mounting an electronic circuit package according to claim 1, wherein the size of the upper guide plate and the lower guide plate on the front side is different from the size of the upper guide plate and the lower guide plate on the rear side. A unit frame for mounting an electronic circuit package.