JP3326401B2 - Optical connection parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device, an optical circuit package, and an optical connection device for interconnecting optical devices, components, and devices used for optical communication and optical information processing such as optical circuit devices. Optical wiring board).

[0002]

2. Description of the Related Art Generally, in connection of a plurality of optical elements in an optical circuit package, between a plurality of optical circuit packages, or in optical connection of an optical circuit device on which the optical circuit package is mounted, an optical element or an optical circuit package is generally used. An optical connector is arranged at an end of an optical circuit device or the like and is connected to each other by an optical fiber. In this case, since the optical fibers need to be arranged with an extra length, for example, on the optical circuit package or inside and / or the back of the optical circuit device, complicated wiring by the optical fibers is formed in a bird's nest, Or at present, they are congested and occupy a large space. For an optical connection method that requires a great deal of space and connection labor for such complicated wiring, an optical fiber is arbitrarily wired on a two-dimensional plane to solve these problems easily. A method has been proposed. For example, as disclosed in Japanese Patent No. 2574611, there has been proposed an optical connecting part that uses a sheet or substrate coated with an adhesive and fixes an optical fiber thereby.

[0003] By the way, the optical connection component described in Japanese Patent No. 2574611 is manufactured by laying an optical fiber with an adhesive on a base material (base layer) or a fiber jacket to form a wiring pattern. Above,
An optical connection component is obtained by forming a protective layer by coating using a material similar to the material used for the base material. However, according to this method, as the number of laid optical fibers increases and the overlapping portion (crossover wiring) of the optical fibers in the formed wiring pattern increases, the thickness of the optical fiber wiring layer increases, and In the overlapping part of the optical fiber,
There is a problem that the protective layer cannot be provided uniformly because the number of adhesive surfaces in contact with the optical fiber is reduced. Further, there is a problem that the fixing force of the adhesive is weakened in the overlapping portion of the optical fibers in the wiring pattern, the optical fiber moves, and the optical fiber in the wiring pattern is displaced (the wiring pattern is broken). Furthermore, a typical optical fiber has a diameter of 125 to 25.
0 μm, for example, 375 to 7 at three overlapping portions.
When the thickness becomes 50 μm and the overlapping portion of the optical fiber in the wiring pattern increases, a floating portion (air layer) of the protective layer is generated around the optical fiber below the protective layer, and there is a problem in reliability with respect to temperature and humidity. In addition to this, the optical wiring board is significantly weakened against breakage due to deformation such as bending.

In order to solve these problems, it has been considered to fix a congested and wired optical fiber by forming a resin protective layer on an optical fiber wired on an adhesive layer. In this case, an acrylic adhesive (pressure-sensitive adhesive), which is most commonly used as an adhesive layer, is used, and a silicone-based material, which is generally used as a sealing material in the semiconductor industry, is used as a resin. Combinations used for the protective layer are excellent in reliability, stress relaxation, heat resistance, cold resistance, moisture resistance, chemical resistance, dust resistance, and electrical insulation due to the characteristics of those materials. Because of its releasability, there is a problem in the adhesiveness with the acrylic pressure-sensitive adhesive material, which is a plastic material. A problem occurred, the optical fiber in the wiring pattern problem of causing positional displacement (deformation of the wiring pattern) occurs.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems in the prior art. That is, an object of the present invention is to provide an external force (pulling, bending, scratching, etc.) for a wired optical fiber to an optical fiber wiring congested as described above without breaking the wiring pattern of the wired optical fiber. It is an object of the present invention to provide a novel optical connecting component that can be fixed, protected, and easily optically connected.

[0006]

According to a first aspect of the present invention, there is provided an optical connecting part comprising a plurality of optical fibers which are wired two-dimensionally and have an end portion for optically connecting to an end, and the optical fiber. An optical fiber has at least one resin protective layer, and the resin protective layer is formed of a silicone-based material that is cured by crosslinking by a hydrosilylation reaction and an adhesion-imparting agent. And is bonded to a base material or another resin protective layer via an adhesive layer, and the adhesive layer is made of an acrylic pressure-sensitive adhesive.

In the optical connecting part of the present invention, the resin protective layer for fixing the optical fiber may be bonded to both sides of the base material via an adhesive layer. Further, another resin protective layer may be provided on the back surface of the base material. Also, when a resin protective layer is provided on the back surface of the substrate in order to make the optical connection component flexible without fixing the optical fiber, the resin protective layer is directly applied to the substrate without an adhesive layer. It can also be provided on top. Further, a plurality of resin protective layers fixing the optical fiber may be joined via an adhesive layer.

[0008] A second optical connection component of the present invention is characterized in that the plurality of optical connection components are joined to each other via an adhesive layer made of a silicone-based adhesive to form a laminate. .

A first optical connection component according to the present invention is that an acrylic adhesive is applied to one surface of a base material having a two-dimensional plane to form an adhesive layer, and an optical fiber end is formed thereon. A plurality of optical fibers are wired so as to have an end portion for optical connection to the portion, and an adhesive agent is applied to a silicone-based material that is crosslinked and cured by a hydrosilylation reaction so that the wired optical fibers are fixed. Can be produced by applying and curing a resin protective layer. On the other surface of the base material, a resin-based protective layer is formed by applying a silicone-based material that is cured by crosslinking by a hydrosilylation reaction to which an adhesion-imparting agent has been added, or a material that forms a flexible film. It may be formed. Further, the above-mentioned adhesive layer may be formed on both surfaces of the base material, and the wiring of the optical fiber and the resin protective layer may be formed.

[0010] An optical connecting part having no base material can be produced by using a peelable film.
That is, on one surface of the peelable film, an adhesive layer made of an acrylic pressure-sensitive adhesive was formed as described above, an optical fiber was wired, and after forming a resin protective layer, the peelable film was removed and exposed. An optical fiber may be wired on the adhesive layer as needed to form a resin protective layer as described above. If necessary, an optical fiber may be wired on the exposed adhesive layer to form a resin protective layer. Further, an adhesive layer may be similarly formed on the formed resin protective layer, an optical fiber may be wired, and a resin protective layer may be formed. By repeating this operation, it is possible to produce an optical connection component in which a large number of resin protective layers to which the optical fibers are fixed are joined via an adhesive layer.

In the optical connecting part having a plurality of base materials, the optical connecting part having one base material prepared as described above is bonded to the resin protective layers thereof using a silicone adhesive. It can also be manufactured by attaching and forming a laminate.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a partially broken plan view of an example of the optical connection component of the present invention, and FIG. 2 is a cross-sectional view thereof. FIGS. 3 to 5 and 10 are cross-sectional views of other examples when a base material is used, respectively, and FIGS. 6 to 8 are cross-sectional views of an example of an optical connection component having no base material. FIG. 9 is a cross-sectional view of an example of an optical connection component in which base materials are present on both surfaces of a protective layer. 1 and 2, a plurality of optical fibers 4 are two-dimensionally wired on one surface of a substrate 1 having a two-dimensional plane via an adhesive layer 3, and these optical fibers 4 have flexibility. It is fixed by a resin protective layer 2 having the same. An end of the optical fiber 4 is a terminal portion 5 for optical connection, and an optical component 6, for example, an optical connector is connected. In addition,
The terminal portion 5 and the optical component 6 may be integrated.
Reference numeral 7 denotes a weir-like material provided for forming a resin protective layer.

The optical connecting part shown in FIG. 3 is provided with a flexible resin protective layer 2a made of the same material or a different material as the resin material of the resin protective layer on the other surface of the substrate 1 of FIG. This shows a case where it is formed. In FIG. 4, a plurality of optical fibers 4 'are two-dimensionally wired on the other surface of the base material 1 of FIG. 2 via another adhesive layer 3' as in the case of FIG. The optical fibers 4 'are fixed by a flexible resin protective layer 2'. FIG.
The optical connection parts of the optical connection parts 8 and 8 of FIG.
It has a structure joined by the adhesive layer 3a,
A laminated structure having one resin protective layer and two substrates is formed.

The optical connecting part shown in FIG. 6 has a structure in which a resin protective layer 2 for fixing an optical fiber is joined to another resin protective layer 2a via an adhesive layer 3. Also,
FIG. 7 shows a structure in which the resin protective layer 2 fixing the optical fiber 4 and the resin protective layer 2 ′ fixing the optical fiber 4 ′ are joined via the adhesive layer 3. , FIG.
In the case of (1), the resin protective layer 2 ″ fixing the optical fiber 4 ″ is further joined to the optical connecting component 8 of FIG. 7 via the adhesive layer 3 a, and the three resin protective layers To form a laminate. The optical connection part of FIG.
Base material 1 on which optical fiber is wired on resin protective layer 2 in FIG.
Are provided and formed. Further FIG.
0 indicates a case where the resin protective layer 2a is provided on the other surface of the base material 1 in FIG.

In the optical connecting part of the present invention, a flexible film-like base material having a two-dimensional plane is generally used as a base material for supporting the wired optical fiber. It is not something to be done. Examples of the substrate include a glass-epoxy resin composite substrate, a polyester film, a polyimide film, a gel material of an organic material such as silicone or urethane rubber or foam, a rubber material, and a foam material. Any substrate can be used as long as it is used for electronic components and electric components. Further, the optical connection component of the present invention does not need to be flexible depending on the purpose of use,
It may be rigid. For example, a substrate made of a rigid polymer material, a ceramic substrate, or the like can be used, and its shape may be any.

The optical fiber to be wired in the present invention is appropriately selected and used according to the application purpose of the optical connecting part. For example, a single mode optical fiber or a multi-mode optical fiber made of quartz or plastic is preferably used. You. Preferably, the optical fiber is a carbon-coated optical fiber. In general, the major factors that determine the life of an optical fiber are the intrusion of water and hydrogen in the atmosphere.However, the carbon-coated optical fiber suppresses the intrusion of water and hydrogen, resulting in high reliability and long life. is there. Further, in the optical connecting component of the present invention, since a cable sheath that provides environmental resistance performance such as a normal optical cable is not provided, it is more effective to use a highly reliable carbon-coated optical fiber.

As the method of two-dimensionally wiring an optical fiber in the present invention, the method of providing an adhesive layer on a base material and wiring is the simplest method, but an optical connection component free of a base material is manufactured. In this case, a release film may be used temporarily as a substrate.

An acrylic adhesive is used as an adhesive constituting the adhesive layer for wiring the optical fiber, and the shape of the optical fiber is changed according to the tension generated by bending the optical fiber to be wired. Any acrylic pressure-sensitive adhesive may be used as long as it has an adhesive strength to maintain. Generally, the acrylic pressure-sensitive adhesive is composed of an acrylic resin, and the constituent components are a copolymer composed of an acrylic monomer main component, another comonomer component, and a small amount of a functional group-containing monomer component. , For example, toluene,
Radical polymerization in an organic solvent such as aromatic hydrocarbons such as xylene, esters such as ethyl acetate and butyl acetate, and ketones such as methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone, or emulsified water dispersion in the presence of an emulsifier It can be synthesized by subjecting the body to emulsion polymerization. Although the synthesized acrylic pressure-sensitive adhesive can be used alone, a curing agent may be used in combination as needed. Also, depending on the intended use, and tackifiers such as rosin esters and C ₉ petroleum resin may be added a pigment such as titanium oxide as a filler.

The main monomer component constituting the acrylic pressure-sensitive adhesive includes, for example, alkyl having 2 or more carbon atoms of acrylic acid such as ethyl acrylate, n-butyl acrylate, isobutyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate and benzyl acrylate. Examples include esters, alkyl esters of methacrylic acid having 4 or more carbon atoms such as n-butyl methacrylate, isobutyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate, and benzyl methacrylate.

Examples of comonomers copolymerizable with these alkyl acrylates and alkyl methacrylates include methyl acrylate, alkyl methacrylates such as methyl methacrylate, ethyl methacrylate and propyl methacrylate having 3 or less carbon atoms, and acetic acid. Examples include vinyl, acrylonitrile, methacrylonitrile, acrylamide, styrene and the like.

Examples of the functional group-containing monomer include monocarboxylic acids such as acrylic acid and methacrylic acid, polycarboxylic acids such as maleic acid, fumaric acid, citraconic acid, glutaconic acid and itaconic acid, and acid anhydrides of these. Carboxyl group-containing monomer, 2-hydroxyethyl (meth)
Acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth)
Examples thereof include hydroxyl group-containing monomers such as acrylate, diethylene glycol mono (meth) acrylate, N-methylol acrylamide and N-methylol methacrylamide, and amino group-containing monomers such as dimethylaminoethyl methacrylate, t-butylaminoethyl methacrylate and acrylamide.

Examples of the curing agent include isocyanate compounds such as tolylene diisocyanate, hydrogenated tolylene diisocyanate, tolylene diisocyanate adduct of trimethylolpropane, and xylylene diisocyanate adduct of trimethylolpropane, bisphenol A, epichlorohydrin epoxy resin. Epoxy compounds such as ethylene glycol diglycidyl ether and polyethylene glycol diglycidyl ether, aldehyde compounds such as glyoxal, malondialdehyde, succindialdehyde, maleic dialdehyde and formaldehyde, hexamethylene diamine, triethylene diamine, polyethylene imine, hexa Amine compounds such as methylenetetramine, aluminum, iron, copper, zinc, tin, titanium, nickel Metal salts such as acetylacetone or acetoacetate coordination compounds of polyvalent metals such as aluminum, iron, copper, zinc, tin, titanium and nickel. Can be

In the optical connecting part of the present invention, the resin protective layer for fixing the optical fiber is formed by a silicone-based material which is crosslinked and cured by a hydrosilylation reaction (hereinafter referred to as "addition type silicone material"). ) To which an adhesion promoter is added. The addition-type silicone-based material is not particularly limited as long as it is crosslinked and cured by a hydrosilylation reaction. Specific examples include silicone-based materials that are cured with a platinum catalyst using a functional group-containing silicone oil as a main component and a hydrogen organopolysiloxane as a crosslinking agent. The functional group may have an aliphatic unsaturated bond, but a vinyl group is the most common in terms of synthesis or economy. As a substituent of the Si group other than the vinyl group, a methyl group is generally used, but a phenyl group is used to provide heat resistance or low temperature resistance, and trifluoropropyl is used when solvent resistance is important. A fluorine-substituted alkyl group such as a group is used. Hydrogen organopolysiloxane is a relatively low molecular weight polymer having SiH groups in the molecule. Usually, one having three or more SiH groups in one molecule is used.

The addition type silicone material has a uniform surface and internal curing (has a deep curing property) as compared with other silicone materials, and requires the selection of the type and amount of a curing catalyst or the use of a reaction inhibitor. Thus, there is an advantage that desired pot life and storage hardening conditions can be set. Weighing,
Since the steps of mixing, coating liquid injection, and coating can be automated and can be cured in a short time by heating, it is an energy-saving specification. Further, since there is no by-product as in the case of the condensation type, post-curing is unnecessary and drying for a long time is not required. Furthermore, it is characterized in that it does not cause cleavage of the polysiloxane in a high temperature state under sealing and has excellent weather resistance.

As mentioned above, the addition-type silicone material is
Although it has very good properties for application as an optical connecting part, it has essentially excellent peelability and poor adhesion to other materials. In the present invention, in order to improve this point, an adhesion-imparting agent is added to the addition-type silicone material, whereby the adhesion to the acrylic pressure-sensitive adhesive can be improved.

As the adhesion-imparting agent used in the present invention, a group —SiH (R ₁ ) (R ₂ ) (where R ₁ and R ₂ ) are attached to one end of a hydrocarbon chain which may have a substituent.
₂ is the same or different and represents a hydrogen atom or an alkyl group which may have a substituent. ) Is present and at the other end a group —Si (R ₃ ) (R ₄ ) (R ₅ )
(However, R ₃ , R ₄ and R ₅ may be the same or different and represent one selected from an alkyl group, an alkoxy group, an alkoxy group having an alkyl ether structure and a chlorine atom, provided that any one of them is selected. One is an alkoxy group or an alkoxy group having an alkyl ether structure.) It is preferable to use a silane coupling agent. In addition, the hydrocarbon chain which is a main chain connecting both terminal groups has 1 to 18 carbon atoms, more preferably 1 to 1 carbon atoms.
0, more preferably 1 to 5 alkylene groups,
These may be substituted with an alkyl group such as a methyl group and an ethyl group. Particularly preferred alkylene groups are ethylene and propylene.

In the present invention, it is preferable to add a hydrogen polysiloxane to the adhesion-imparting agent to the silane coupling agent in order to adjust the surface tension or the solubility parameter. Thereby, the compatibility with the addition type silicone material and the adhesiveness with the acrylic pressure-sensitive adhesive can be further improved. Hydrogen polysiloxane may be appropriately selected depending on the purpose of use,
Although not particularly limited, for example, those represented by the following general formula (I) can be mentioned.

[0028]

Embedded image (Wherein, a plurality of R ₆ may be the same or different,
A hydrogen atom, a phenyl group, an alkyl-substituted phenyl group, an alkoxyl group, a carboxyl group, an epoxy group,
Represents a hydroxyl group, a vinyl group or an acrylic group;
₇ represents an alkyl group, a phenyl group, an alkyl-substituted phenyl group, an alkoxyl group, a carboxyl group, an epoxy group, a hydroxy group, a vinyl group or an acryl group;
An integer from 1 to 80, l is an integer from 1 to 60, and k + 1 =
8 to 98. Among the hydrogenpolysiloxanes represented by the general formula (I), more preferred ones are represented by the following formula (II).

Embedded image (Wherein, a plurality of R ₈ may be the same or different,
Each represents a hydrogen atom, a methyl group or a carboxyl group, a plurality of R ₉ represents an alkyl group having 4 or less carbon atoms,
k is an integer of 3 to 80, l is an integer of 1 to 60, and k
+ L = 8 to 98. )

The addition ratio of the above-mentioned adhesion-imparting agent may be appropriately selected according to the purpose, but is generally 0.01 to 50% by weight, preferably 0.01 to 50% by weight, based on the addition-type silicone material. 30% by weight, more preferably 0.1 to 10
% By weight.

When hydrogen polysiloxane is added to the silane coupling agent in the adhesion-imparting agent, the mixing ratio thereof may be appropriately selected according to the purpose. For
0.05 to 1000% by weight, preferably 0.1 to 500
% By weight, more preferably 0.1 to 200% by weight.

In the present invention, a resin protective layer may be provided directly on the back surface of the substrate without wiring an optical fiber. In this case, the resin constituting the resin protective layer has flexibility. If it is a thing, it will not be specifically limited.
For example, a curable resin such as a gel or rubber organic material, an ultraviolet curable resin, an electron beam curable resin, and a thermosetting resin having flexibility, a thermoplastic resin having flexibility, or the like is used. Is done. More specifically, examples of the gel organic material include a silicone gel, an acrylic resin gel, a fluororesin gel, and the like. As the rubber organic material,
Silicone rubber, urethane rubber, fluorine rubber, acrylic rubber, ethylene-acrylic rubber, SBR, B
R, NBR, chloroprene rubber and the like. Examples of the flexible curable resin include an epoxy resin, an ultraviolet curable adhesive, and a silicone resin. Examples of the flexible thermoplastic resin include resins constituting a hot melt adhesive such as acrylic resins such as polyvinyl acetate and polyethyl methacrylate, vinylidene chloride resins, polyvinyl butyral resins, and polyamide resins.

Incidentally, if necessary, a protective layer may be provided on the resin protective layer to be the surface of the optical connection component. When flexibility is not required much, the same substrate as the above-mentioned substrate on which the optical fiber is wired may be used, and a sheet or a plate made of an organic polymer material, ceramic or the like may be used. Further, when the optical connection component is required to be flexible, a silicone hard coat material or the like may be used as a protective layer that does not impair the flexibility.

In the optical connecting part of the present invention, usually,
For connection with the optical connector, an optical fiber extends from a desired position (port) on the end face of the optical connection component to form a termination portion, to which the optical connector is connected or connected to the optical connector. Fusion spliced with the optical fiber.
The optical connector connected to the optical connection component of the present invention is not particularly limited, but a single-core or multi-core small optical connector is preferably selected. For example, MPO optical connector, MT optical connector, MU optical connector, FPC optical connector (NTT
R & D, Vol. 45 No. 6,589) or V-groove parts used for optical connection. In addition,
The method of connecting the optical connector is not limited at all, and the terminal portion and the optical connector may be integrated.

In the present invention, the optical connecting part having one base material is manufactured as follows. For example, first, an adhesive layer made of the acrylic pressure-sensitive adhesive is provided on one surface of a base material having a two-dimensional plane, and an optical fiber is wired thereon in a desired pattern. At this time, the end portion of the optical fiber is pulled out so as to be a terminal portion for optical connection with an optical connector or the like. In addition, as a method of providing an adhesive layer, an acrylic pressure-sensitive adhesive is directly coated on the above-mentioned base material, or in a state of being dissolved in a solvent to form a coating solution, roll coating, bar coating, blade coating, casting, dispenser coating. ,
Spray coating, a method of applying an adhesive layer by screen printing or the like, and a method of providing an adhesive layer, and a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed on a peelable film in advance is adhered to the above-described base material, and then the release property is determined. A method of transferring the film by removing the film is employed. In addition, a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed on a release film can be used as it is as a substrate. The thickness of the adhesive layer is
It may be appropriately selected and used depending on the diameter of the optical fiber to be wired, but is usually 1 μm to 1 mm, preferably 5 μm to 500 μm.
m, more preferably in the range of 10 to 300 μm.

On the optical fiber wired as described above, an additional type silicone material to which the above-mentioned adhesive agent is added is used to protect the resin so that the wired optical fiber is fixed in a buried state. By forming the layer, the optical connecting component of the present invention can be manufactured.

Here, the thickness of the resin protective layer in the case where the optical fiber is wired is appropriately selected depending on the diameter of the optical fiber to be wired and the number of overlapping layers, so that the optical fiber is protected.
What is necessary is just to make it fixed. Usually, a thickness of (optical fiber diameter) × (number of overlapping fibers) or more is required. Also,
When the optical fiber is not wired, the thickness of the resin protective layer is
Depending on the purpose of using the optical connection component, it may be appropriately selected and used with a film thickness that reduces the rigidity of the base material, but is usually about 1 μm to several cm, preferably 10 μm to
It is set to a range of 10 mm, more preferably 30 μm to 1 mm.

The simplest method of providing a resin protective layer on the substrate on which the optical fiber is wired or on the back surface of the substrate is as follows.
What is necessary is just to provide a weir-like material at or near the periphery of the base material, fill the inside of the formed weir-like material with a resin material, and solidify it. For example, a method of dissolving an addition-type silicone material to which an adhesion-imparting agent is added in an appropriate solvent to form a coating solution, and then dropping and drying the liquid, or a liquid-state addition-type silicone to which an adhesion-imparting agent is added A resin protective layer can be formed by dropping a system material and curing by heating.

The weir-like material may be usually provided at or near the periphery of the substrate over the entire periphery. However,
When mounting optical components such as an optical connector, an optical module, and an optical device in the vicinity of the periphery of the base material, the optical components may serve as a weir-like object. It is not necessary to provide a weir-like object at the portion where the sheet is placed.

The material constituting the weir-like material is not particularly limited, and may be suitably selected according to the application purpose of the optical connection part. In particular, polyethylene, polypropylene, nylon, etc. A nonwoven fabric made of an organic fiber, a nonwoven fabric made of a glass fiber, and a sealing agent (filler) made of a silicone, epoxy, urethane or acrylic resin are preferably used. Weirs are
The size and shape are not limited as long as the resin material filled inside does not flow out.

In the case where a resin protective layer is provided on the back surface of the base material of the optical connection component, if an adhesive layer made of an acrylic pressure-sensitive adhesive is not provided on the back surface of the base material, a resin protective layer is formed. As the material, those described above can be used,
For example, gel-like or rubber-like organic materials, UV curing,
A curable resin such as an electron beam-curable or thermosetting resin having flexibility, a thermoplastic resin having flexibility, or the like can be used. May be filled and produced. An adhesive layer made of an acrylic pressure-sensitive adhesive is provided on the back surface of the base material, and when an optical fiber is wired in a desired pattern, as described above, using an additional silicone material to which a tackifier is added, What is necessary is just to produce a resin protective layer.

In the case of an optical connection component having no base material and fixing an optical fiber in a resin protective layer in a buried state, for example, an adhesive layer made of an acrylic adhesive is provided on a peelable film. After wiring a plurality of optical fibers thereon, as described above, a resin protective layer was formed using an addition-type silicone-based material to which an adhesion-imparting agent had been added, and the film was exposed after removing the peelable film. A resin protective layer may be formed on the adhesive layer by using an additional silicone material to which an adhesive agent has been added in the same manner as described above. In this case, a plurality of optical fibers may be wired on the exposed adhesive layer, and a resin protective layer may be formed on the exposed adhesive layer using an additional silicone-based material to which an adhesive is added.

Further, a plurality of optical connecting parts are prepared in advance by the above-mentioned method, and an adhesive layer made of a silicone-based adhesive is directly provided on the surface of the resin protective layer, or an adhesive layer made of a silicone-based adhesive is prepared in advance. An adhesive layer is provided by transferring the adhesive layer from the adhesive sheet provided with to the surface of the resin protective layer, and the plurality of optical connection components are attached to produce an optical connection component having a multilayer structure. It is also possible. The silicone-based pressure-sensitive adhesive used in that case is not particularly limited as long as it is a material exhibiting adhesiveness to the silicone-based material that is the material for the resin protective layer.

In the optical connecting part of the present invention manufactured as described above, an optical connecting part such as an optical connector or an optical module is joined to the end of the drawn optical fiber. For example, the end of an optical fiber that has been subjected to an end face treatment to be connected to the optical connector is connected to the optical connector, or the end face of the optical fiber fixed to the optical connector, and each of the optical fibers pulled out from the optical fiber wiring member. The end face is fusion-spliced.

[0044]

The present invention will be described below with reference to examples.
The present invention is not limited to this. Test Example 100 parts of a 30% ethyl acetate solution of an acrylic resin composed of n-butyl acrylate / methyl acrylate / acrylic acid / 2-hydroxyethyl methacrylate copolymer (= 82/15 / 2.7 / 0.3) Coronate L
1.0 part (Tolylene diisocyanate adduct of trimethylolpropane, manufactured by Nippon Polyurethane Industry Co., Ltd.) was mixed and mixed. The obtained acrylic pressure-sensitive adhesive coating solution was applied on one surface of a 25-μm-thick polyimide film so that the film thickness after drying was 50 μm, thereby forming an acrylic pressure-sensitive adhesive layer to prepare a sheet. .

On this sheet, a coating solution obtained by mixing an addition-type silicone material composed of the materials shown in Table 1 below and an adhesion-imparting agent was applied to a thickness of 5 by a roll coating method.
It was applied to a thickness of 00 μm and solidified under the conditions shown in Table 1. Thereafter, the formed coating film was cut in a cross shape with a cutter knife, and the resulting coating film was bent crosswise to evaluate the degree of peeling from the polyimide film. As a result, peeling did not occur between the coating film and the acrylic pressure-sensitive adhesive, and it was confirmed that good adhesion was exhibited.

Further, a sample similar to the above was prepared, and 7
After performing a high-temperature and high-humidity test left for 5000 hours at 5 ° C. and 90% RH and a temperature cycle test of -40 ° C. to 75 ° C. for 500 times, a coating formed in the same manner as above was performed.
A cross cut was made in the film with a cutter knife, and the film was bent crosswise at that portion, and the degree of peeling from the polyimide film was evaluated. As a result, no peeling was observed between the coating film and the acrylic pressure-sensitive adhesive, and it was confirmed that good adhesion was exhibited.

[0047]

[Table 1]

[0048]

Embedded image

Example 1 30% ethyl acetate solution of acrylic resin composed of n-butyl acrylate / methyl acrylate / acrylic acid / 2-hydroxyethyl methacrylate copolymer (= 82/15 / 2.7 / 0.3) 100 parts, Coronate L
1.0 part (Tolylene diisocyanate adduct of trimethylolpropane, manufactured by Nippon Polyurethane Industry Co., Ltd.) was mixed and mixed. The obtained acrylic pressure-sensitive adhesive coating solution was applied on one surface of a polyimide film having a thickness of 125 μm so that the film thickness after drying was 100 μm to form an acrylic pressure-sensitive adhesive layer. × 297m
m) was prepared. An optical fiber core wire (carbon fiber optical fiber, 250 μm diameter, manufactured by Furukawa Electric Co., Ltd.) per port (portion where the optical fiber was taken out from the optical connection member) was wired as follows. That is, 16 optical fibers are connected to 3
Eight ports (each port is composed of 16 optical fibers) were formed at a pitch of 25 mm on both sides of the short side of the polyimide film in parallel at a pitch of 00 μm. Each optical fiber is wired from one short side of the polyimide film to the other short side,
Wiring to each port on both sides is designed as desired free access wiring (128) for each optical fiber, and the wiring of the optical fiber is adjusted so that the maximum number of overlaps is three.

Thereafter, a silicone-based filler (manufactured by Konishi Co., Ltd., Bath Bond) was applied to the periphery of the polyimide film on which the optical fiber was wired, and the width was 1.5 mm and the thickness was 1 m.
m were formed. Next, the inside of Table 1
o. An application liquid composed of an addition type silicone material to which an adhesion promoter of Formulation 2 was added was dropped, and the silicone material was cured at 100 ° C. for 1 hour to form a resin protective layer. An optical wiring board having a thickness of 1.2 mm was manufactured by fixing with a resin protective layer. Thereafter, an MU connector was connected to the end of the drawn optical fiber to obtain an optical wiring board as a final product.

The produced optical wiring board has good adhesiveness between the acrylic pressure-sensitive adhesive and the resin protective layer, sufficiently fixes the optical fiber, does not displace the optical fiber in the wiring pattern (collapse of the wiring pattern), and There was no problem with destruction due to deformation such as bending of the wiring board.

When the loss of all the connected optical fibers was measured, the loss including the connection loss of the optical connector was reduced to 0.
It was 7 dB or less. In addition, the fabricated optical wiring board was subjected to a high-temperature and high-humidity test of leaving at 5,000C for 90 hours at 75 ° C and a temperature cycle test of -40 ° C to 75 ° C for 500 times. It was 0.2 dB or less, which proved that it could be sufficiently used as an optical connection part.

Second Embodiment In the first embodiment, each port is composed of eight optical fibers, an MT connector (eight-fiber optical connector) is used instead of the MU connector, and only one end of the MT fiber is connected before the optical fiber is wired. Using the connector connected, the wiring conditions of the optical fibers were such that the total number of all the optical fibers was 64 and the maximum overlap of the optical fibers was two. The weir-like material was 1.5 mm in width and 500 μm in thickness. Example 5 was prepared in the same manner as in Example 1 except that a coating liquid composed of an addition-type silicone material to which an adhesion-imparting agent having a prescription of 5 was added was used. Thereafter, a silicone-based filler (manufactured by Konishi Corporation, Bath Bond) was applied to the periphery of the back surface of the polyimide film to form a weir-like material having a width of 1.5 mm and a thickness of 500 μm. N
o. The addition-type silicone-based material to which the adhesion-imparting agent of the prescription of No. 5 was added was dropped and cured at 100 ° C. for 1 hour to produce an optical wiring board having a thickness of 1.2 mm. Thereafter, an MT connector was connected to the end of the drawn optical fiber, and an optical wiring board as a final product was manufactured.

The produced optical wiring board has good adhesiveness between the acrylic pressure-sensitive adhesive and the resin protective layer, sufficiently fixes the optical fiber, does not displace the optical fiber in the wiring pattern (collapse of the wiring pattern), and There was no problem with destruction due to deformation such as bending of the wiring board.

When the loss of all the connected optical fibers was measured, the loss including the connection loss of the optical connector was reduced to 0.1.
It was 6 dB or less. In addition, the fabricated optical wiring board was subjected to a high-temperature and high-humidity test of leaving at 5,000C for 90 hours at 75 ° C and a temperature cycle test of -40 ° C to 75 ° C for 500 times. It was 0.3 dB or less, which proved that it could be sufficiently used as an optical connection part.

Example 3 In Example 1, the acrylic adhesive used in Example 1 was applied to both sides of a polyimide film having a thickness of 125 μm so that the thickness of the adhesive layer became 100 μm. A peelable film was adhered to the film to prepare a film-shaped substrate (size 210 mm × 297 mm). On one side of this polyimide film, an optical fiber was wired in the same manner as in Example 1, and then, instead of a silicone-based filler, a silicone rubber coating solution (KE45-T, manufactured by Shin-Etsu Chemical Co., Ltd.) was used. A 1.5 mm wide, 1 mm high weir-like material was produced around the periphery of the sample No. 1 in Table 1. 7
The addition type silicone-based material to which the adhesion-imparting agent of the formula was added was dropped, and the silicone-based material was cured at 150 ° C. for 30 minutes to form a first resin protective layer, and the optical fiber was buried. Fixed.

Thereafter, the peelable film on the back surface of the polyimide film was removed, and 64 fibers were placed on the adhesive layer so that the total number of optical fibers was 64 and the maximum overlap of the optical fibers was 2. For free access wiring. Then, a silicone rubber coating solution (KE, manufactured by Shin-Etsu Chemical Co., Ltd.) is applied to the periphery of the polyimide film on which the optical fiber is wired.
45-T) to form a weir-like material having a width of 1.5 mm and a height of 500 μm. Next, No. 1 in Table 1
A coating liquid composed of an addition-type silicone-based material to which the adhesion-imparting agent of the prescription 7 was added was dropped, and the silicone-based material was cured at 150 ° C. for 30 minutes to form a second resin protective layer. The fiber is fixed in a buried state and has a thickness of 1.
An optical wiring board of 8 mm was produced. Thereafter, an MU connector was connected to the end of the drawn optical fiber to produce an optical wiring board as a final product.

The produced optical wiring board has good adhesion between the acrylic pressure-sensitive adhesive and the resin protective layer, sufficiently fixes the optical fiber, does not displace the optical fiber in the wiring pattern (collapse of the wiring pattern), and There was no problem with destruction due to deformation such as bending of the wiring board.

The loss of all the connected optical fibers was measured.
It was 8 dB or less. In addition, the fabricated optical wiring board was subjected to a high-temperature and high-humidity test of leaving at 5,000C for 90 hours at 75 ° C and a temperature cycle test of -40 ° C to 75 ° C for 500 times. It was 0.4 dB or less, which proved that it could be sufficiently used as an optical connection part.

Example 4 In place of the silicone-based material in Example 3, Two optical connection parts were produced in the same manner as in Example 3 except that the coating liquid was cured using an application liquid made of an addition-type silicone material to which an adhesion-imparting agent having a formulation of No. 12 was added at 100 ° C. for 1 hour. Next, a silicone-based pressure-sensitive adhesive coating solution (SD4590 / BY24-741 / S, manufactured by Dow Corning Toray Co., Ltd.) was applied to the second resin protective layer of one optical connection component.
RX212 / toluene = 100 / 1.0 / 0.9 / 50
(Parts by weight)), and dried at 100 ° C. for 3 minutes.
A 00 μm adhesive layer was formed. On top of that, the other optical connection component was overlaid and adhered to produce an optical wiring board composed of a laminated body having a thickness of 3.7 mm.

The produced optical wiring board has good adhesion between the acrylic pressure-sensitive adhesive and the resin protective layer, sufficiently fixes the optical fiber, does not displace the optical fiber in the wiring pattern (collapse of the wiring pattern), and There was no problem with destruction due to deformation such as bending of the wiring board.

The loss of all the connected optical fibers was measured.
It was 8 dB or less. In addition, the fabricated optical wiring board was subjected to a high-temperature and high-humidity test of leaving at 5,000C for 90 hours at 75 ° C and a temperature cycle test of -40 ° C to 75 ° C for 500 times. It was 0.5 dB or less, which proved that it could be sufficiently used as an optical connection part.

Example 5 The acrylic pressure-sensitive adhesive coating solution used in Example 1 was coated to a thickness of 75
An acrylic pressure-sensitive adhesive layer was formed on one side of a silicone-based release film having a thickness of 100 μm by drying so as to have a thickness of 100 μm.
m) was prepared. An optical fiber was wired in the same manner as in Example 1. Thereafter, a weir-like material of silicone-based filler (manufactured by Konishi Co., Ltd., bus bond) was formed on the periphery of the peelable film on which the optical fiber was wired in the same manner as in Example 1. . A coating liquid composed of an addition-type silicone material to which an adhesion-imparting agent of the 16 formulation was added was dropped, and the silicone material was cured at 100 ° C. for 1 hour to form a first resin protective layer.

Next, the silicone-based release film was peeled off, and a second resin protective layer was formed on the exposed back surface of the pressure-sensitive adhesive layer. That is, a silicone-based filler (manufactured by Konishi Corp., Bath Bond) was applied to the periphery of the pressure-sensitive adhesive layer on the back surface to form a weir-like material having a width of 1.5 mm and a height of 500 μm. No. An addition-type silicone-based material to which an adhesion-imparting agent of formula 16 was added was dropped, and the silicone-based material was cured at 100 ° C. for 1 hour to form a second resin protective layer, having a thickness of 1.6 mm. Was produced. Thereafter, an MU connector was connected to the end of the drawn optical fiber to obtain an optical wiring board as a final product.

The produced optical wiring board has good adhesion between the acrylic pressure-sensitive adhesive and the resin protective layer, sufficiently fixes the optical fiber, does not displace the optical fiber in the wiring pattern (collapse of the wiring pattern), and There was no problem with destruction due to deformation such as bending of the wiring board.

The loss of all the connected optical fibers was measured.
It was 5 dB or less. In addition, the fabricated optical wiring board was subjected to a high-temperature and high-humidity test of leaving at 5,000C for 90 hours at 75 ° C and a temperature cycle test of -40 ° C to 75 ° C for 500 times. It was 0.3 dB or less, which proved that it could be sufficiently used as an optical connection part.

Example 6 In place of the silicone-based material in Example 5, A first resin protective layer was formed in the same manner as in Example 5, except that the coating liquid was formed using an addition type silicone material to which an adhesion-imparting agent having a formulation of No. 9 was added and cured at 100 ° C. for 1 hour. . Next, the silicone-based release film was peeled off, and each port was composed of eight optical fibers on the exposed adhesive layer on the back surface, the total number of optical fibers was 64, and the largest of the optical fibers The optical fibers were wired so that the overlap was two.

Thereafter, a second resin protective layer was formed on the adhesive layer on which the optical fibers were wired. That is, a silicone-based filler (manufactured by Konishi Co., Ltd., Bath Bond) is applied to the periphery of the pressure-sensitive adhesive layer on the back surface, and is 1.5 mm wide and 50 mm high.
A 0 μm weir-like material was formed, and the inside of the same was formed in the same manner as described above. 1 at 100 ° C. using a coating liquid of an addition type silicone material to which an adhesion-imparting agent of the formula 9 was added.
Curing under the condition of time to form a second resin protective layer,
An optical wiring board having a thickness of 1.6 mm was produced. Thereafter, an MU connector was connected to the end of the drawn optical fiber to obtain an optical wiring board as a final product.

The produced optical wiring board has good adhesiveness between the acrylic adhesive and the resin protective layer, sufficiently fixes the optical fiber, does not displace the optical fiber in the wiring pattern (collapse of the wiring pattern), and There was no problem with destruction due to deformation such as bending of the wiring board.

The loss of all the connected optical fibers was measured.
It was 7 dB or less. In addition, the fabricated optical wiring board was subjected to a high-temperature and high-humidity test of leaving at 5,000C for 90 hours at 75 ° C and a temperature cycle test of -40 ° C to 75 ° C for 500 times. It was 0.4 dB or less, which proved that it could be sufficiently used as an optical connection part.

Example 7 In the same manner as in Example 1, two 125 μm-thick polyimide films in which optical fibers were wired to the adhesive layer were produced. Thereafter, a silicone rubber coating solution (KE45-T, manufactured by Shin-Etsu Chemical Co., Ltd.) was applied to the periphery of one polyimide film to form a weir having a width of 2.5 mm and a thickness of 2 mm.
Next, No. 1 in Table 1 A coating liquid composed of an addition-type silicone material to which an adhesion-imparting agent is added is dropped, and a polyimide film on which the other optical fiber is wired is covered from above, and the silicone material is applied at 100 ° C. for 1 hour. Is cured to form a resin protective layer, and the optical fiber is fixed by the resin protective layer to a thickness of 2.45.
mm optical wiring board was produced. Thereafter, an MU connector was connected to the end of the drawn optical fiber to obtain an optical wiring board as a final product.

The produced optical wiring board has good adhesion between the acrylic pressure-sensitive adhesive and the resin protective layer, sufficiently fixes the optical fiber, does not displace the optical fiber in the wiring pattern (collapse of the wiring pattern), and There was no problem with destruction due to deformation such as bending of the wiring board.

The loss of all the connected optical fibers was measured.
It was 8 dB or less. In addition, the fabricated optical wiring board was subjected to a high-temperature and high-humidity test of leaving at 5,000C for 90 hours at 75 ° C and a temperature cycle test of -40 ° C to 75 ° C for 500 times. It was 0.6 dB or less, which proved that it could be sufficiently used as an optical connection part.

Example 8 An optical connecting part was produced in the same manner as in Example 7. Thereafter, a silicone rubber coating solution (KE45-T, manufactured by Shin-Etsu Chemical Co., Ltd.) is applied to the periphery of the back surface of each polyimide film,
A weir having a width of 1.5 mm and a height of 500 μm was formed. An addition-type silicone-based material to which the adhesion-imparting agent of Formulation 15 was added was added dropwise and cured at 100 ° C. for 1 hour to form second and third resin protective layers, and a thickness of 3.45 mm. Was produced. afterwards,
An MU connector was connected to the end of the drawn optical fiber to obtain an optical wiring board as a final product.

The produced optical wiring board has good adhesiveness between the acrylic pressure-sensitive adhesive and the resin protective layer, sufficiently fixes the optical fiber, does not displace the optical fiber in the wiring pattern (collapse of the wiring pattern), and There was no problem with destruction due to deformation such as bending of the wiring board.

When the loss of all the connected optical fibers was measured, the loss including the connection loss of the optical connector was measured.
It was 6 dB or less. In addition, the fabricated optical wiring board was subjected to a high-temperature and high-humidity test of leaving at 5,000C for 90 hours at 75 ° C and a temperature cycle test of -40 ° C to 75 ° C for 500 times. It was 0.4 dB or less, which proved that it could be sufficiently used as an optical connection part.

[0077]

As described above, the optical connecting part of the present invention uses the acrylic adhesive (pressure-sensitive adhesive) most commonly used as an adhesive to provide versatility and stress relaxation. By using a proven silicone material for the resin protective layer as a semiconductor encapsulating material, reliability, stress relaxation, heat resistance,
It has the characteristics of being excellent in cold resistance, moisture resistance, chemical resistance, dust resistance, and electrical insulation. In addition, since the resin protective layer was obtained by adding an adhesion-imparting agent to an addition-type silicone material having excellent weather resistance such as the above-described heat resistance and moisture resistance,
Poor adhesion of the addition type silicone material is eliminated, and the formed resin protective layer has excellent weather resistance. In addition, the adhesiveness between the resin protective layer and the adhesive layer made of an acrylic adhesive is improved, there is no displacement of the optical fiber in the wiring pattern (collapse of the wiring pattern), and the optical wiring board is broken due to deformation such as bending. Is also tough.

[Brief description of the drawings]

FIG. 1 is a partially broken plan view of an example of an optical connection component of the present invention.

FIG. 2 is a cross-sectional view of the optical connection component of FIG.

FIG. 3 is a sectional view of another example of the optical connection component of the present invention.

FIG. 4 is a sectional view of another example of the optical connection component of the present invention.

FIG. 5 is a sectional view of another example of the optical connection component of the present invention.

FIG. 6 is a sectional view of another example of the optical connection component of the present invention.

FIG. 7 is a sectional view of another example of the optical connecting component of the present invention.

FIG. 8 is a sectional view of another example of the optical connection component of the present invention.

FIG. 9 is a cross-sectional view of another example of the optical connection component of the present invention.

FIG. 10 is a cross-sectional view of another example of the optical connection component of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Base material, 2, 2 ', 2 ", 2a ... Resin protective layer, 3
3 ', 3a ... adhesive layer, 4, 4', 4 "... optical fiber,
5: Terminating part, 6: Optical components such as optical connectors and optical modules, 7: Weirs, 8: Optical connecting parts.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-11-119033 (JP, A) JP-A-6-265763 (JP, A) JP-A-62-18011 (JP, A) 39058 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G02B 6/00 G02B 6/08 G02B 6/44

Claims (6)

(57) [Claims] 1. An optical connection comprising a plurality of optical fibers wired in a two-dimensional plane and having an end portion for optical connection to an end portion, and at least one resin protective layer fixing the optical fiber. In the component, the resin protective layer is formed from a silicone-based material and an adhesion-imparting agent that are cured by crosslinking by a hydrosilylation reaction, and the resin protective layer and the base material or another resin protective layer via the adhesive layer. An optical connecting part which is joined, wherein the adhesive layer is made of an acrylic pressure-sensitive adhesive. 2. As an adhesion-imparting agent, a group —SiH (R ₁ ) is attached to one terminal of a hydrocarbon chain which may have a substituent.
(R ₂ ) (provided that R ₁ and R ₂ may be the same or different and each represent a hydrogen atom or an alkyl group optionally having a substituent).
Si (R ₃ ) (R ₄ ) (R ₅ ) (where R ₃ , R ₄ and R ₅ may be the same or different and include an alkyl group, an alkoxy group, an alkoxy group having an alkyl ether structure, and a chlorine atom 2. A silane coupling agent having at least one selected from the group consisting of an alkoxy group and an alkoxy group having an alkyl ether structure is used. Optical connection parts. 3. An adhesion-imparting agent comprising a hydrogen polysiloxane and a group -SiH at one end of a hydrocarbon chain.
(R ₁ ) and (R ₂ ) (provided that R ₁ and R ₂ may be the same or different and each represent a hydrogen atom or an alkyl group which may have a substituent). At the terminal, a group —Si (R ₃ ) (R ₄ ) (R ₅ ) (provided that
R ₃ , R ₄ and R ₅ may be the same or different, and are selected from an alkyl group, an alkoxy group, an alkoxy group having an alkyl ether structure and a chlorine atom.
Species, provided that any one of them is an alkoxy group or an alkoxy group having an alkyl ether structure. 2. The optical connection component according to claim 1, wherein a silane coupling agent containing (1) is used. 4. The optical connection component according to claim 1, wherein the resin protective layer for fixing the optical fiber is bonded to both surfaces of the base material via an adhesive layer. 5. The optical connection component according to claim 1, wherein a plurality of resin protective layers fixing the optical fiber are joined via an adhesive layer. 6. A laminated body formed by bonding a plurality of optical connection parts according to claim 1 through an adhesive layer made of a silicone-based pressure-sensitive adhesive. Optical connection parts.