JP3314647B2 - Method for producing phenolic resin composition - Google Patents

Method for producing phenolic resin composition

Info

Publication number
JP3314647B2
JP3314647B2 JP00644397A JP644397A JP3314647B2 JP 3314647 B2 JP3314647 B2 JP 3314647B2 JP 00644397 A JP00644397 A JP 00644397A JP 644397 A JP644397 A JP 644397A JP 3314647 B2 JP3314647 B2 JP 3314647B2
Authority
JP
Japan
Prior art keywords
reaction
parts
added
resin composition
phenolic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP00644397A
Other languages
Japanese (ja)
Other versions
JPH10204141A (en
Inventor
浩之 福住
一彦 根本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP00644397A priority Critical patent/JP3314647B2/en
Publication of JPH10204141A publication Critical patent/JPH10204141A/en
Application granted granted Critical
Publication of JP3314647B2 publication Critical patent/JP3314647B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

Landscapes

  • Phenolic Resins Or Amino Resins (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、フェノール樹脂組
成物の製造方法に関し、具体的には、例えば電子機器等
に用いられる紙基材フェノール樹脂積層板を製造するた
めに使用されるフェノール樹脂組成物の製造方法に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a phenolic resin composition, and more specifically, to a phenolic resin composition used for producing a paper-based phenolic resin laminate used for electronic equipment and the like. The present invention relates to a method for manufacturing a product.

【0002】[0002]

【従来の技術】従来、電子機器等に用いられる紙基材フ
ェノール樹脂積層板を製造するために使用されるフェノ
ール樹脂組成物は、桐油とフェノール類の反応物と、ア
ルデヒド類とをレゾール化反応して製造するのが一般的
であった。そして、紙基材フェノール樹脂積層板に難燃
性を付与するために、フェノール樹脂組成物にはBr化
合物等の難燃剤を添加していた。近年、環境問題等の点
からハロゲン系難燃剤の使用を削減することが求められ
るようになってきている。そこで、レゾール化反応を終
えたフェノール樹脂中にメチロール化メラミン化合物水
溶液を添加し、その後減圧下で加熱脱水して、難燃性を
有しているメラミン成分をフェノール樹脂組成物中に含
有させる方法が検討されている。しかし、難燃性向上の
ためメラミン成分の量を増やすと、紙基材フェノール樹
脂積層板を製造するためにワニス化したフェノール樹脂
組成物に濁りや、沈殿が生じ、均一な性能の紙基材フェ
ノール樹脂積層板を安定して製造することが困難になる
という問題があった。そのため、ワニス化したフェノー
ル樹脂組成物に濁りが生じない方法であって、フェノー
ル樹脂組成物中に含有させることのできるメラミン成分
量を増やせる製造方法の開発が求められている。
2. Description of the Related Art Conventionally, a phenolic resin composition used for producing a paper-based phenolic resin laminate used for electronic equipment and the like is a resolving reaction of tung oil and phenols with aldehydes. It was common to manufacture. And, in order to impart flame retardancy to the paper-based phenolic resin laminate, a flame retardant such as a Br compound was added to the phenolic resin composition. In recent years, it has been required to reduce the use of halogen-based flame retardants in view of environmental problems and the like. Thus, a method of adding an aqueous solution of a methylolated melamine compound to the phenol resin after the resolation reaction, and then heating and dehydrating under reduced pressure to include a melamine component having flame retardancy in the phenol resin composition. Is being considered. However, when the amount of the melamine component is increased to improve the flame retardancy, the varnished phenolic resin composition for producing the paper-based phenolic resin laminate becomes turbid or precipitates, and the paper base having uniform performance is produced. There has been a problem that it is difficult to stably manufacture a phenolic resin laminate. Therefore, there is a need for a method of producing a varnished phenol resin composition that does not cause turbidity and that can increase the amount of a melamine component that can be contained in the phenol resin composition.

【0003】[0003]

【発明が解決しようとする課題】本発明は上記の事情に
鑑みてなされたものであって、本発明の目的とするとこ
ろは、桐油とフェノール類の反応物と、アルデヒド類と
を反応させたフェノール樹脂中にメチロール化メラミン
化合物水溶液を添加し、その後減圧下で加熱脱水して、
メラミン成分をフェノール樹脂組成物中に含有させるフ
ェノール樹脂組成物の製造方法であって、積層板を製造
するためにワニス化したフェノール樹脂組成物に濁り
や、沈殿が生じることなしに、フェノール樹脂組成物中
に含有させるメラミン成分量を増やせる製造方法を提供
することにある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to react a tung oil and a phenol with a aldehyde with an aldehyde. A methylolated melamine compound aqueous solution is added to the phenolic resin, and then heated and dehydrated under reduced pressure,
A method for producing a phenolic resin composition containing a melamine component in a phenolic resin composition, wherein the phenolic resin composition varnished to produce a laminate does not become cloudy or precipitate, and the phenolic resin composition An object of the present invention is to provide a production method capable of increasing the amount of a melamine component contained in a product.

【0004】[0004]

【課題を解決するための手段】請求項1に係る発明のフ
ェノール樹脂組成物の製造方法は、桐油とフェノール類
の反応物と、アルデヒド類とを、一次反応として酸性触
媒の存在下でノボラック化反応した後、二次反応として
塩基性触媒として3級アミンを加えレゾール化反応して
製造するフェノール樹脂組成物の製造方法であって、レ
ゾール化反応の際に3級アミンと共に加えるアンモニア
量が、桐油とフェノール類の合計量100重量部に対
し、0〜0.35重量部であり、且つレゾール化反応を
終えた重量平均分子量が2000〜10000である樹
脂にメチロール化メラミン化合物水溶液を添加し、次い
で減圧下で加熱脱水することを特徴とする。
According to a first aspect of the present invention, there is provided a method for producing a phenolic resin composition, comprising reacting a tung oil and a phenol with a aldehyde in the presence of an acidic catalyst as a primary reaction. After the reaction, a secondary reaction is a method for producing a phenolic resin composition produced by adding a tertiary amine as a basic catalyst and performing a resolving reaction, wherein the amount of ammonia added together with the tertiary amine during the resolving reaction is as follows: For a total amount of 100 parts by weight of tung oil and phenols, 0 to 0.35 parts by weight, and a methylolated melamine compound aqueous solution is added to a resin having a weight average molecular weight of 2,000 to 10,000 after the resolving reaction, Then, it is characterized by heating and dehydrating under reduced pressure.

【0005】[0005]

【0006】請求項に係る発明のフェノール樹脂組成
物の製造方法は、請求項1記載の製造方法において、メ
チロール化メラミン化合物水溶液が、フェノール類で変
性されたメチロール化メラミン化合物の水溶液であるこ
とを特徴とする。
According to a second aspect of the present invention, there is provided a method for producing a phenolic resin composition according to the first aspect, wherein the aqueous solution of a methylolated melamine compound is an aqueous solution of a methylolated melamine compound modified with a phenol. It is characterized by.

【0007】請求項に係る発明のフェノール樹脂組成
物の製造方法は、請求項1又は請求項2記載の製造方法
において、3級アミンがトリエチルアミンあることを
特徴とする。
[0007] manufacturing process of the phenol resin composition of the invention according to claim 3 is the method according to claim 1 or claim 2 wherein, characterized in that tertiary amines are triethylamine.

【0008】本発明では、ノボラック化反応した後、ア
ンモニア量を制限した条件で、塩基性触媒として3級ア
ミンを加えレゾール化反応して得られた重量平均分子量
が2000〜10000である樹脂に、メチロール化メ
ラミン化合物水溶液を添加するようにしている。そのた
め、メチロール化メラミン化合物水溶液を添加したフェ
ノール樹脂を減圧下で加熱脱水しても、積層板を製造す
るためにワニス化したフェノール樹脂組成物に濁りや、
沈殿が生じ難くなる。これは、ノボラック化反応した後
レゾール化反応するようにし、さらにアンモニア量及び
重量平均分子量を制限するようにしたことの2つの要素
のため、減圧下での加熱脱水工程での高分子化反応が抑
制されるためと考えられる。さらに詳しく説明すると、
従来はノボラック化反応をすることなしに、レゾール化
反応してフェノール樹脂を製造していたが、このように
レゾール化反応のみの場合には、フェノール樹脂組成物
の反応速度を高めて紙基材フェノール樹脂積層板を生産
性よく製造できるようにするため、レゾール化反応の際
の塩基性触媒として、3級アミンと共に、桐油とフェノ
ール類の合計量100重量部に対し、0.5重量部程度
の量のアンモニアを添加せざるを得なかったが、このか
なり多量のアンモニアの存在ために、減圧下での加熱脱
水工程でメチロール化メラミン化合物を含むフェノール
樹脂組成物の高分子化反応がおきていた。しかも、アン
モニアの添加量を増やした場合でもまだ反応速度は不十
分なものであった。本発明では、ノボラック化反応した
後レゾール化反応してフェノール樹脂を製造するように
したため、アンモニアの添加量が少なくても、フェノー
ル樹脂組成物の反応速度を高くできるようになった。そ
のため、アンモニアの添加量を少なく制限することによ
り、減圧下での加熱脱水工程でメチロール化メラミン化
合物を含むフェノール樹脂組成物の高分子化反応を抑制
できるようになったのである。本発明における、塩基性
触媒として、3級アミンと共にアンモニアを添加する場
合のタイミングについては、同時に添加する必要はな
く、例えば3級アミンの存在下でレゾール化反応した
後、アンモニアを添加してさらなるレゾール化反応をす
るようにしてもよい。
In the present invention, a resin having a weight average molecular weight of 2,000 to 10,000 obtained by adding a tertiary amine as a basic catalyst and subjecting to a resolving reaction after the novolak reaction is performed under the condition that the amount of ammonia is limited, An aqueous solution of a methylolated melamine compound is added. Therefore, even when the phenol resin to which the methylolated melamine compound aqueous solution is added is heated and dehydrated under reduced pressure, the varnished phenol resin composition becomes turbid to produce a laminate,
Precipitation hardly occurs. This is because the novolak reaction is followed by the resolation reaction, and furthermore, the amount of ammonia and the weight-average molecular weight are restricted. It is considered that it is suppressed. To elaborate further,
Conventionally, a phenol resin was produced by a resolation reaction without a novolak reaction, but in the case of only a resolation reaction, the reaction rate of the phenol resin composition was increased to increase the paper base. In order to be able to produce a phenolic resin laminate with good productivity, about 0.5 parts by weight based on 100 parts by weight of tung oil and phenols together with a tertiary amine as a basic catalyst in the resolving reaction. Amount of ammonia had to be added, but due to the presence of this considerable amount of ammonia, the polymerization reaction of the phenolic resin composition containing the methylolated melamine compound occurred in the heat dehydration step under reduced pressure. Was. Moreover, even when the amount of added ammonia was increased, the reaction rate was still insufficient. In the present invention, since the phenol resin is produced by the resolation reaction after the novolak reaction, the reaction rate of the phenol resin composition can be increased even if the amount of added ammonia is small. Therefore, by limiting the amount of ammonia to be added to a small amount, the polymerization reaction of the phenol resin composition containing the methylolated melamine compound in the heating and dehydrating step under reduced pressure can be suppressed. In the present invention, the timing of adding ammonia together with a tertiary amine as a basic catalyst does not need to be added at the same time. For example, after performing a resolving reaction in the presence of a tertiary amine, ammonia is added and A resolving reaction may be performed.

【0009】[0009]

【発明の実施の形態】本発明では桐油とフェノール類の
反応物を使用する。本発明で使用する桐油は重量平均分
子量が約870程度であり、フェノール類と反応する性
質を有している。また、本発明で使用するフェノール類
としては、フェノール、クレゾール、レゾルシン、プロ
ピルフェノール等が例示できる。そして、桐油とフェノ
ール類の反応については、特に限定するものではない
が、メタノールの存在下で、桐油1モルに対しフェノー
ル類8〜25モルの割合で反応させるのが好ましい。こ
の桐油とフェノール類の反応の際のメタノール量は、得
られる桐油とフェノール類の反応物の分子量に影響を及
ぼす作用があり、メタノール量が多くなるほど反応物の
分子量が小さくなる傾向がある。また、桐油1モルに対
するフェノール類の割合については、8モル未満の場合
は得られる紙基材フェノール樹脂積層板の層間密着性が
劣るという問題が生じ、25モルを越える場合は得られ
る紙基材フェノール樹脂積層板のパンチング加工性が劣
るという問題が生じるため、8〜25モルであることが
好ましい。なお、この桐油1モルに対するフェノール類
の割合については、ノボラック化反応を終えた後でフェ
ノール類を追加して、前記の8〜25モルという範囲内
になるようにしてもよい。なお、桐油1モルの量につい
ては、GPC(ゲルパーミエイションクロマトグラフィ
ー)等の方法で重量平均分子量を求めて決定することが
できる。
DETAILED DESCRIPTION OF THE INVENTION In the present invention, a reaction product of tung oil and phenols is used. The tung oil used in the present invention has a weight average molecular weight of about 870 and has a property of reacting with phenols. Examples of the phenol used in the present invention include phenol, cresol, resorcinol, and propylphenol. The reaction between paulownia oil and phenols is not particularly limited, but is preferably performed in the presence of methanol at a ratio of 8 to 25 mol of phenols to 1 mol of tung oil. The amount of methanol in the reaction between the tung oil and the phenols has an effect on the molecular weight of the obtained reaction product of the tung oil and the phenols, and the molecular weight of the reactant tends to decrease as the amount of methanol increases. When the ratio of phenols to 1 mol of tung oil is less than 8 mol, the problem of poor interlayer adhesion of the obtained paper-based phenolic resin laminate occurs, and when it exceeds 25 mol, the obtained paper base is reduced. Since a problem that the punching workability of the phenolic resin laminate is inferior occurs, the amount is preferably 8 to 25 mol. The ratio of phenols to 1 mol of tung oil may be in the range of 8 to 25 mol by adding phenols after the novolak reaction is completed. In addition, about 1 mol of tung oil, the weight average molecular weight can be determined by a method such as GPC (gel permeation chromatography).

【0010】本発明では、桐油とフェノール類の反応物
と、アルデヒド類とを、一次反応として酸性触媒の存在
下でノボラック化反応させる。アルデヒド類としては、
パラホルムアルデヒド、ホルマリン水溶液等が例示でき
る。また、酸性触媒としては例えばシュウ酸、コハク
酸、マレイン酸、フマル酸、パラトルエンスルホン酸、
ギ酸、酢酸等の有機酸、あるいは塩酸、硫酸、硝酸等の
無機酸が挙げられる。なお、桐油とフェノール類の反応
の際に用いた酸性触媒をノボラック化反応の触媒として
用いるようにしてもよい。また、ノボラック化反応をす
る段階での、フリーのフェノール類とアルデヒド類のモ
ル比を1:0.3〜1.3とすることが望ましい。アル
デヒド類が0.3以下であるとノボラック化反応物が高
分子化する傾向があり、1.3を越えるとアルデヒド類
を添加しても未反応のアルデヒド類が過剰に残存するよ
うになり無駄である。フリーのフェノール類のモル数に
ついては、GPCによる測定や、フリーのフェノール類
を気化させて重量測定する方法等を行って決定する。
In the present invention, a reaction product of tung oil and a phenol and an aldehyde are subjected to a novolak reaction as a primary reaction in the presence of an acidic catalyst. As aldehydes,
Examples include paraformaldehyde and aqueous formalin. Examples of the acidic catalyst include oxalic acid, succinic acid, maleic acid, fumaric acid, p-toluenesulfonic acid,
Examples include organic acids such as formic acid and acetic acid, and inorganic acids such as hydrochloric acid, sulfuric acid, and nitric acid. The acidic catalyst used in the reaction between tung oil and phenols may be used as a catalyst for the novolak reaction. In addition, it is desirable that the molar ratio of free phenols and aldehydes at the stage of performing the novolak reaction is 1: 0.3 to 1.3. If the aldehyde content is 0.3 or less, the novolak reaction product tends to polymerize. If the aldehyde content exceeds 1.3, unreacted aldehydes will remain excessively even if the aldehyde is added, resulting in waste. It is. The number of moles of free phenols is determined by measurement by GPC, a method of vaporizing free phenols and measuring the weight, or the like.

【0011】本発明では、ノボラック化反応後に、二次
反応として塩基性触媒を加えレゾール化反応を行ってフ
ェノール樹脂組成物を得るが、ノボラック化反応後にト
リエタノールアミン等を用いて中和した後、二次反応の
レゾール化反応を行うようにすることが好ましい。そし
て、二次反応のレゾール化反応で使用する塩基性触媒は
トリメチルアミン、トリエチルアミン、トリエタノール
アミン、トリメタノールアミン等の3級アミンを必須成
分として使用する。そして、必要に応じてアンモニア、
ジメチルアミン、ジエチルアミン、ジ−n−プロピルア
ミン、i−プロピルアミン、n−プロピルアミン、ジベ
ンジルアミン、ベンジルアミン等の有機塩基、あるいは
水酸化ナトリウム、水酸化カリウム、水酸化カルシウ
ム、水酸化マグネシウム、水酸化リチウム等の無機塩基
を塩基性触媒として併用できる。但し、アンモニアを使
用する場合には、3級アミンと共に加えるアンモニア量
が、桐油とフェノール類の合計量100重量部に対し、
0〜0.35重量部であることが重要である。0.35
重量部を越えると、後工程の減圧下での加熱脱水工程で
メチロール化メラミン化合物を含むフェノール樹脂組成
物の高分子化反応が生じ、ワニス化したフェノール樹脂
組成物に濁りや、沈殿が生じてしまう。なお、本発明で
は、レゾール化反応を行う場合、アルデヒド類を追加し
て反応を行うこともできる。
In the present invention, a phenolic resin composition is obtained by adding a basic catalyst as a secondary reaction after the novolak reaction and performing a resolation reaction. After the novolak reaction, the phenol resin composition is neutralized with triethanolamine or the like. It is preferable to perform a resolving reaction of a secondary reaction. As a basic catalyst used in the resolving reaction of the secondary reaction, a tertiary amine such as trimethylamine, triethylamine, triethanolamine or trimethanolamine is used as an essential component. And, if necessary, ammonia,
Organic bases such as dimethylamine, diethylamine, di-n-propylamine, i-propylamine, n-propylamine, dibenzylamine, benzylamine, or sodium hydroxide, potassium hydroxide, calcium hydroxide, magnesium hydroxide, An inorganic base such as lithium hydroxide can be used in combination as a basic catalyst. However, when using ammonia, the amount of ammonia added together with the tertiary amine is 100 parts by weight of the total amount of tung oil and phenols.
It is important that the amount is 0 to 0.35 parts by weight. 0.35
If the amount exceeds the weight part, a polymerization reaction of the phenol resin composition containing the methylolated melamine compound occurs in the heat dehydration step under reduced pressure in the subsequent step, and the varnished phenol resin composition becomes cloudy or precipitates I will. In the present invention, when the resolving reaction is performed, the reaction can be performed by adding an aldehyde.

【0012】本発明では、レゾール化反応を終えた樹脂
にメチロール化メラミン化合物水溶液を添加し、次いで
減圧下で加熱脱水する。ここでいうメチロール化メラミ
ン化合物水溶液とは、メラミンとアルデヒド類とを反応
させた水を含む溶液であり、フェノール類で変性されて
いてもよい。また、メチロール化メラミン化合物水溶液
を添加しようとする、レゾール化反応を終えた樹脂の重
量平均分子量は2000〜10000であることが本発
明では重要である。2000未満であると、紙基材フェ
ノール樹脂積層板の耐溶剤性(例えば耐塩化メチレン
性)が劣るという問題が生じ、10000を越えるとワ
ニス化したフェノール樹脂組成物に濁りや、沈殿が生じ
るからである。
In the present invention, an aqueous solution of a methylolated melamine compound is added to the resin that has undergone the resolving reaction, and then heated and dehydrated under reduced pressure. Here, the aqueous solution of a methylolated melamine compound is a solution containing water obtained by reacting melamine and aldehydes, and may be modified with phenols . It is important in the present invention that the weight-average molecular weight of the resin after the resolving reaction to which the aqueous solution of a methylolated melamine compound is to be added is 2,000 to 10,000. If it is less than 2,000, the solvent resistance (for example, methylene chloride resistance) of the paper-based phenolic resin laminate becomes poor. If it exceeds 10,000, the varnished phenolic resin composition becomes cloudy or precipitates. It is.

【0013】本発明のフェノール樹脂組成物の製造方法
では、必要に応じて、各種の難燃剤、充填材あるいはエ
ポキシ樹脂等の変性用樹脂等を適宜配合することができ
る。
In the method for producing a phenolic resin composition of the present invention, various flame retardants, fillers, and denaturing resins such as epoxy resins can be appropriately compounded as required.

【0014】[0014]

【実施例】【Example】

(実施例1)メラミン130重量部(以下部と記す)に
37%(37重量%濃度)ホルムアルデヒドを240部
添加し、さらに、水酸化ナトリウム0.3部添加し、9
8℃70分反応させた後、水70部及びメタノール70
部で希釈しメチロール化メラミン化合物水溶液M−1を
得た。
Example 1 To 130 parts by weight of melamine (hereinafter referred to as "parts"), 240 parts of 37% (37% by weight) formaldehyde was added, and 0.3 part of sodium hydroxide was further added.
After reacting at 8 ° C. for 70 minutes, 70 parts of water and 70 parts of methanol
The resulting mixture was diluted with an aqueous solution to obtain a methylolated melamine compound aqueous solution M-1.

【0015】別途に、フェノール60部と桐油40部と
メタノール5部と酸性触媒パラトルエンスルホン酸0.
5部を80℃で90分反応させ桐油フェノール反応物T
−1を得た。
Separately, 60 parts of phenol, 40 parts of tung oil, 5 parts of methanol, and 0.5 parts of acidic catalyst p-toluenesulfonic acid were added.
5 parts were reacted at 80 ° C for 90 minutes, tung oil phenol reactant T
-1 was obtained.

【0016】この桐油フェノール反応物T−1に37%
ホルムアルデヒド23部を添加し90℃で30分間反応
させノボラック化反応物N−1を得た。更に、この反応
物N−1にトリエタノールアミンを0.4部添加して中
和した後に、37%ホルムアルデヒド23部添加し、更
に、塩基性触媒としてトリエチルアミンを2部添加し8
5℃で60分反応させた後、さらに25%アンモニア水
溶液を1部添加し、85℃で30分反応させ、レゾール
タイプのフェノール樹脂R−1を得た。これに、前記の
メチロール化メラミン化合物水溶液M−1を29.4部
添加し、150mmHgで70℃になるまで減圧脱水
し、常圧に戻した後、メタノールを60部添加して桐油
変性フェノール樹脂ワニスを得た。この樹脂ワニス60
部にクレジルジフェニルホスフェイト4部、テトラブロ
ムビスフェノールAジグリシジルエーテル6部と、テト
ラブロモビスフェノールA1部と、2,2-プロパン- ビス
[4-(3-ポリブロモフェニールオキシ-2- ヒドロキシプ
ロピル)オキシ-3,5- ジブロモフェノル]0.5部を添
加して2次含浸用フェノール樹脂ワニスS−1を得た。
そして、この2次含浸用フェノール樹脂ワニスS−1を
下記に記載する積層板の製造において使用するようにし
た。
Tung oil phenol reactant T-1 has 37%
23 parts of formaldehyde was added and reacted at 90 ° C. for 30 minutes to obtain a novolak reaction product N-1. The reaction product N-1 was neutralized by adding 0.4 parts of triethanolamine and then 23 parts of 37% formaldehyde was added, and 2 parts of triethylamine was added as a basic catalyst.
After the reaction at 5 ° C for 60 minutes, 1 part of a 25% aqueous ammonia solution was further added, and the mixture was reacted at 85 ° C for 30 minutes to obtain a resol type phenolic resin R-1. To this, 29.4 parts of the above-mentioned aqueous solution of methylolated melamine compound M-1 was added, dehydrated under reduced pressure at 150 mmHg to 70 ° C., returned to normal pressure, and then added with 60 parts of methanol to add tung oil-modified phenol resin. I got a varnish. This resin varnish 60
Parts are cresyl diphenyl phosphate (4 parts), tetrabromobisphenol A diglycidyl ether (6 parts), tetrabromobisphenol A (1 part), 2,2-propane-bis [4- (3-polybromophenyloxy-2-hydroxypropyl) ) Oxy-3,5-dibromophenol] 0.5 part was added to obtain a phenol resin varnish S-1 for secondary impregnation.
Then, the phenolic resin varnish for secondary impregnation S-1 was used in the production of a laminate described below.

【0017】以下、積層板の製造工程を説明する。ま
ず、前記のメチロール化メラミン化合物溶液M−1を2
20部、メタノールを50部、水を50部配合し、1次
含浸用樹脂ワニスF−1を得た。この1次含浸用樹脂ワ
ニスF−1を重量126g/m 2 のクラフト紙にコート
法で含浸した後に、135℃の乾燥機で30秒間処理
し、160g/m2 の1 次プリプレグAを得た。この1
次プリプレグAに上記2次含浸用フェノール樹脂ワニス
S−1をを含浸した後に、155℃の乾燥機で100秒
間処理し260g/m2 の2次プリプレグを得た。次
に,この2次プリプレグを8枚重ね、最上層に厚さ0.
035μmの銅箔を接着剤を介して配設し、これを圧力
100kg/cm2 、温度160℃で50分間成形し厚
さ1.6mmの片面銅張積層板を得た。
Hereinafter, the manufacturing process of the laminate will be described. Ma
The methylolated melamine compound solution M-1 was added to 2
20 parts, 50 parts of methanol and 50 parts of water
A resin varnish F-1 for impregnation was obtained. This resin for primary impregnation
Varnish F-1 was weighed 126 g / m TwoCoat on kraft paper
30 seconds after drying by impregnation at 135 ° C
And 160g / mTwoWas obtained as a primary prepreg A. This one
Phenolic resin varnish for secondary impregnation on the next prepreg A
After impregnation with S-1, 100 seconds in a dryer at 155 ° C.
260g / mTwoWas obtained. Next
Of the secondary prepregs, and the top layer has a thickness of 0.
A copper foil of 035 μm is disposed via an adhesive,
100kg / cmTwoMolded at 160 ° C for 50 minutes
A 1.6 mm single-sided copper-clad laminate was obtained.

【0018】(比較例1)実施例1と同様にしてノボラ
ック化反応物N−1を得た。次に、この反応物N−1に
トリエタノールアミンを0.4部添加して中和した後
に、37%ホルムアルデヒド23部を添加し、さらに、
塩基性触媒としてトリエチルアミンを2部添加し85℃
で60分反応させた後、さらに25%アンモニア水溶液
を2部添加し、85℃で30分反応させ、レゾールタイ
プのフェノール樹脂R−2を得た。これに、前記のメチ
ロール化メラミン化合物水溶液M−1を29.4部添加
し、150mmHgで70℃になるまで減圧脱水し、常
圧に戻した後、メタノールを60部添加して桐油変性フ
ェノール樹脂ワニスを得た。この樹脂ワニス60部に、
実施例1と同様に、クレジルジフェニルホスフェイト4
部、テトラブロムビスフェノールAジグリシジルエーテ
ル6部と、テトラブロモビスフェノールA1部と、2,2-
プロパン- ビス[4-(3-ポリブロモフェニールオキシ-2
- ヒドロキシプロピル)オキシ-3,5- ジブロモフェノ
ル]0.5部を添加して2次含浸用フェノール樹脂ワニ
スS−2を得た。そして、この2次含浸用フェノール樹
脂ワニスS−2を用いるようにした以外は、実施例1と
同様にして、厚さ1.6mmの片面銅張積層板を得た。
Comparative Example 1 A novolak reaction product N-1 was obtained in the same manner as in Example 1. Next, the reaction product N-1 was neutralized by adding 0.4 parts of triethanolamine, and then 23 parts of 37% formaldehyde was added.
85 parts of triethylamine as a basic catalyst
, And 2 parts of a 25% aqueous ammonia solution was further added, and the mixture was reacted at 85 ° C. for 30 minutes to obtain a resol type phenol resin R-2. To this, 29.4 parts of the above-mentioned aqueous solution of methylolated melamine compound M-1 was added, dehydrated under reduced pressure at 150 mmHg to 70 ° C., returned to normal pressure, and then added with 60 parts of methanol to add tung oil-modified phenol resin. I got a varnish. In 60 parts of this resin varnish,
As in Example 1, cresyl diphenyl phosphate 4
Parts, tetrabromobisphenol A diglycidyl ether 6 parts, tetrabromobisphenol A 1 part, 2,2-
Propane-bis [4- (3-polybromophenyloxy-2
-Hydroxypropyl) oxy-3,5-dibromophenol] was added to obtain a phenol resin varnish S-2 for secondary impregnation. Then, a single-sided copper-clad laminate having a thickness of 1.6 mm was obtained in the same manner as in Example 1 except that the phenol resin varnish for secondary impregnation S-2 was used.

【0019】(比較例2) 実施例1と同様にしてノボラック化反応物N−1を得
た。次に、この反応物N−1にトリエタノールアミンを
0.4部添加して中和した後に、37%ホルムアルデヒ
ド23部を添加し、さらに、塩基性触媒としてトリエチ
ルアミンを2部添加し85℃で60分反応させた後、さ
らに25%アンモニア水溶液を1部添加し、85℃で6
0分反応させ、レゾールタイプのフェノール樹脂R−3
を得た。このレゾールタイプのフェノール樹脂R−3を
R−1に代えて使用するようにした以外は、実施例1と
同様にして、2次含浸用フェノール樹脂ワニスS−3及
びS−3を使用して作製した厚さ1.6mmの片面銅張
積層板を得た。
(Comparative Example 2) A novolak reaction product N-1 was obtained in the same manner as in Example 1. Next, 0.4 part of triethanolamine was added to the reaction product N-1 to neutralize the mixture, 23 parts of 37% formaldehyde was added, and 2 parts of triethylamine was added as a basic catalyst. After reacting for 60 minutes, 1 part of 25% aqueous ammonia solution was further added,
After reacting for 0 minutes, resol type phenolic resin R-3
I got This resol type phenolic resin R-3
Single-sided copper having a thickness of 1.6 mm produced using phenolic resin varnishes for secondary impregnation S-3 and S-3 in the same manner as in Example 1 except that R-1 was used instead of R-1. A laminated laminate was obtained.

【0020】(実施例2)メラミン130重量部にフェ
ノール20部と37%ホルムアルデヒド300部を添加
し、さらに、水酸化ナトリウム0.3部を添加し、98
℃70分反応させた後、水70部及びメタノール70部
で希釈しメチロール化メラミン化合物水溶液M−2を得
た。
(Example 2) 20 parts of phenol and 300 parts of 37% formaldehyde were added to 130 parts by weight of melamine, and 0.3 part of sodium hydroxide was further added.
After reacting at 70 ° C. for 70 minutes, the mixture was diluted with 70 parts of water and 70 parts of methanol to obtain a methylolated melamine compound aqueous solution M-2.

【0021】実施例1と同様にして、レゾールタイプの
フェノール樹脂R−1を得た。これに、前記のメチロー
ル化メラミン化合物水溶液M−2を30部添加し、15
0mmHgで70℃になるまで減圧脱水し、常圧に戻し
た後、メタノールを60部添加して桐油変性フェノール
樹脂ワニスを得た。この樹脂ワニス60部にクレジルジ
フェニルホスフェイト4部、テトラブロムビスフェノー
ルAジグリシジルエーテル6部と、テトラブロモビスフ
ェノールA1部と、2,2-プロパン- ビス[4-(3-ポリブ
ロモフェニールオキシ-2- ヒドロキシプロピル)オキシ
-3,5- ジブロモフェノル]0.5部を添加して2次含浸
用フェノール樹脂ワニスS−4を得た。そして、この2
次含浸用フェノール樹脂ワニスS−4を用いるようにし
た以外は、実施例1と同様にして、厚さ1.6mmの片
面銅張積層板を得た。
In the same manner as in Example 1, a resol type phenolic resin R-1 was obtained. To this, 30 parts of the aqueous solution of methylolated melamine compound M-2 was added, and
After dehydration under reduced pressure at 0 mmHg to 70 ° C. and returning to normal pressure, 60 parts of methanol was added to obtain a tung oil-modified phenol resin varnish. To 60 parts of this resin varnish, 4 parts of cresyl diphenyl phosphate, 6 parts of tetrabromobisphenol A diglycidyl ether, 1 part of tetrabromobisphenol A, and 2,2-propane-bis [4- (3-polybromophenyloxy- 2-hydroxypropyl) oxy
[-3,5-dibromophenol] 0.5 part was added to obtain a phenol resin varnish S-4 for secondary impregnation. And this 2
A 1.6 mm thick single-sided copper-clad laminate was obtained in the same manner as in Example 1, except that the phenol resin varnish S-4 for the next impregnation was used.

【0022】(実施例3)実施例1で得られたノボラッ
ク化反応物N−1に37%ホルマリン23部を添加し、
次いで、トリエチルアミンを2部添加し、90℃で90
分間反応させレゾールタイプのフェノール樹脂R−4を
得た。これに、実施例2で記載したメチロール化メラミ
ン化合物水溶液M−2を78部添加し、150mmHg
で70℃になるまで減圧脱水し、常圧に戻した後、メタ
ノールを60部添加して桐油変性フェノール樹脂ワニス
を得た。この樹脂ワニス60部にクレジルジフェニルホ
スフェイト4部、テトラブロムビスフェノールAジグリ
シジルエーテル6部と、テトラブロモビスフェノールA
1部と、2,2-プロパン- ビス[4-(3-ポリブロモフェニ
ールオキシ-2- ヒドロキシプロピル)オキシ-3,5- ジブ
ロモフェノル]0.5部を添加して2次含浸用フェノー
ル樹脂ワニスS−5を得た。そして、この2次含浸用フ
ェノール樹脂ワニスS−5を用いるようにした以外は、
実施例1と同様にして、厚さ1.6mmの片面銅張積層
板を得た。
Example 3 To the novolak reaction product N-1 obtained in Example 1 was added 23 parts of 37% formalin,
Then, 2 parts of triethylamine were added,
After reacting for 1 minute, a resol type phenolic resin R-4 was obtained. To this, 78 parts of the aqueous solution of methylolated melamine compound M-2 described in Example 2 was added, and 150 mmHg was added.
After dehydrating under reduced pressure to 70 ° C. and returning to normal pressure, 60 parts of methanol was added to obtain a tung oil-modified phenol resin varnish. To 60 parts of this resin varnish, 4 parts of cresyl diphenyl phosphate, 6 parts of tetrabromobisphenol A diglycidyl ether, and tetrabromobisphenol A
1 part and 0.5 part of 2,2-propane-bis [4- (3-polybromophenyloxy-2-hydroxypropyl) oxy-3,5-dibromophenol] are added, and phenol for secondary impregnation is added. A resin varnish S-5 was obtained. And except that this secondary impregnation phenolic resin varnish S-5 was used,
In the same manner as in Example 1, a single-sided copper-clad laminate having a thickness of 1.6 mm was obtained.

【0023】(実施例4)フェノール60部と桐油40
部とメタノール10部と酸性触媒パラトルエンスルホン
酸0.5部を80℃で90分反応させ桐油フェノール反
応物T−2を得た。
(Example 4) 60 parts of phenol and tung oil 40
Part of methanol, 10 parts of methanol and 0.5 part of an acidic catalyst p-toluenesulfonic acid at 80 ° C. for 90 minutes to obtain a tung oil phenol reactant T-2.

【0024】この桐油フェノール反応物T−2に37%
ホルムアルデヒド23部を添加し、90℃で30分間反
応させノボラック化反応物N−2を得た。次いで、この
反応物N−2にトリエタノールアミンを0.4部添加し
て中和した後に、37%ホルムアルデヒド23部添加
し、さらに、塩基性触媒としてトリエチルアミンを2部
添加し85℃で60分反応させた後、さらに、25%ア
ンモニア水溶液を1部添加し、85℃で30分反応さ
せ、レゾールタイプのフェノール樹脂を得た。これに、
実施例1で記載したメチロール化メラミン化合物水溶液
M−1を78部添加し、150mmHgで70℃になる
まで減圧脱水し、常圧に戻した後、メタノールを60部
添加して桐油変性フェノール樹脂を得た。そして、この
桐油変性フェノール樹脂を用いるようにした以外は、実
施例1と同様にして、2次含浸用フェノール樹脂ワニス
S−6及びS−6を用いて作製した厚さ1.6mmの片
面銅張積層板を得た。
The tung oil phenol reactant T-2 contained 37%
23 parts of formaldehyde was added and reacted at 90 ° C. for 30 minutes to obtain a novolak reaction product N-2. Then, 0.4 parts of triethanolamine was added to the reaction product N-2 to neutralize the mixture, 23 parts of 37% formaldehyde was added, and 2 parts of triethylamine was further added as a basic catalyst. After the reaction, 1 part of a 25% aqueous ammonia solution was further added, and the mixture was reacted at 85 ° C. for 30 minutes to obtain a resol type phenol resin. to this,
78 parts of the aqueous methylolated melamine compound solution M-1 described in Example 1 was added, and the mixture was dehydrated under reduced pressure at 150 mmHg to 70 ° C., returned to normal pressure, and then 60 parts of methanol was added to remove the tung oil-modified phenol resin. Obtained. Then, in the same manner as in Example 1 except that the tung oil-modified phenol resin was used, a 1.6 mm thick single-sided copper produced using the secondary impregnation phenol resin varnishes S-6 and S-6. A laminated laminate was obtained.

【0025】(比較例3)実施例4と同様にして桐油フ
ェノール反応物T−2及びノボラック化反応物N−2を
得た。次いで、この反応物N−2にトリエタノールアミ
ンを0.4部添加して中和した後に、37%ホルムアル
デヒド23部添加し、さらに、塩基性触媒としてトリエ
チルアミンを2部添加し85℃で60分反応させた後、
さらに、25%アンモニア水溶液を2部添加し、85℃
で30分反応させ、レゾールタイプのフェノール樹脂を
得た。これに、実施例1で記載したメチロール化メラミ
ン化合物水溶液M−1を78部添加し、150mmHg
で70℃になるまで減圧脱水し、常圧に戻した後、メタ
ノールを60部添加して桐油変性フェノール樹脂を得
た。そして、この桐油変性フェノール樹脂を用いるよう
にした以外は、実施例1と同様にして、2次含浸用フェ
ノール樹脂ワニスS−7及びS−7を用いて作製した厚
さ1.6mmの片面銅張積層板を得た。
Comparative Example 3 A tung oil phenol reactant T-2 and a novolak reactant N-2 were obtained in the same manner as in Example 4. Then, 0.4 parts of triethanolamine was added to the reaction product N-2 to neutralize the mixture, 23 parts of 37% formaldehyde was added, and 2 parts of triethylamine was further added as a basic catalyst. After reacting
Further, 2 parts of a 25% aqueous ammonia solution was added, and 85 ° C.
For 30 minutes to obtain a resol type phenol resin. To this, 78 parts of the aqueous solution of methylolated melamine compound M-1 described in Example 1 was added, and 150 mmHg was added.
After dehydrating under reduced pressure to 70 ° C. and returning to normal pressure, 60 parts of methanol was added to obtain a tung oil-modified phenol resin. Then, in the same manner as in Example 1 except that the tung oil-modified phenol resin was used, a 1.6 mm-thick single-sided copper prepared using the phenol resin varnish for secondary impregnation S-7 and S-7. A laminated laminate was obtained.

【0026】(実施例5)実施例4と同様にして桐油フ
ェノール反応物T−2及びノボラック化反応物N−2を
得た。次いで、この反応物N−2にトリエタノールアミ
ンを0.4部添加して中和した後に、37%ホルムアル
デヒド23部添加し、さらに、塩基性触媒としてトリエ
チルアミンを2部添加し85℃で90分反応させ、レゾ
ールタイプのフェノール樹脂を得た。これに、実施例1
で記載したメチロール化メラミン化合物水溶液M−1を
94部添加し、150mmHgで70℃になるまで減圧
脱水し、常圧に戻した後、メタノールを60部添加して
桐油変性フェノール樹脂を得た。そして、この桐油変性
フェノール樹脂を用いるようにした以外は、実施例1と
同様にして、2次含浸用フェノール樹脂ワニスS−8及
びS−8を用いて作製した厚さ1.6mmの片面銅張積
層板を得た。
Example 5 In the same manner as in Example 4, a tung oil phenol reactant T-2 and a novolak reactant N-2 were obtained. Then, 0.4 parts of triethanolamine was added to the reaction product N-2 to neutralize it, 23 parts of 37% formaldehyde was added, and 2 parts of triethylamine was further added as a basic catalyst, and the mixture was heated at 85 ° C. for 90 minutes. The reaction was performed to obtain a resol type phenol resin. In addition, Example 1
94 parts of the aqueous solution of methylolated melamine compound M-1 described in (1) was added, and the mixture was dehydrated under reduced pressure at 150 mmHg to 70 ° C., returned to normal pressure, and then 60 parts of methanol was added to obtain a tung oil-modified phenol resin. Then, in the same manner as in Example 1 except that the tung oil-modified phenol resin was used, a 1.6 mm thick single-sided copper prepared using the phenol resin varnishes S-8 for secondary impregnation and S-8. A laminated laminate was obtained.

【0027】(比較例4)実施例1と同様にして桐油フ
ェノール反応物T−1を得た。次いで、この桐油フェノ
ール反応物T−1にトリエタノールアミンを0.4部添
加して中和した後に、37%ホルムアルデヒド46部添
加し、さらに、塩基性触媒としてトリエチルアミンを2
部と25%アンモニア水溶液を2部添加し、85℃で9
0分反応させレゾールタイプのフェノール樹脂を得た。
これに、実施例1で記載したメチロール化メラミン化合
物水溶液M−1を6部添加し、150mmHgで70℃
になるまで減圧脱水し、常圧に戻した後、メタノールを
60部添加して桐油変性フェノール樹脂を得た。そし
て、この桐油変性フェノール樹脂を用いるようにした以
外は、実施例1と同様にして、2次含浸用フェノール樹
脂ワニスS−9及びS−9を用いて作製した厚さ1.6
mmの片面銅張積層板を得た。この比較例は、ノボラッ
ク反応をすることなしに、レゾール化反応をした例であ
り、160℃、50分の成形条件では硬化が不十分であ
り、得られた銅張積層板のパンチング加工性が不十分で
あった。
Comparative Example 4 A tung oil phenol reactant T-1 was obtained in the same manner as in Example 1. Then, 0.4 parts of triethanolamine was added to the tung oil phenol reactant T-1 to neutralize the same, and then 46 parts of 37% formaldehyde was added, and triethylamine was added as a basic catalyst in 2 parts.
And 2 parts of a 25% aqueous ammonia solution.
The reaction was performed for 0 minutes to obtain a resol type phenol resin.
To this, 6 parts of the aqueous solution of methylolated melamine compound M-1 described in Example 1 was added, and 70 ° C. at 150 mmHg.
After dehydration under reduced pressure to return to normal pressure, 60 parts of methanol was added to obtain a tung oil-modified phenol resin. Then, in the same manner as in Example 1 except that this tung oil-modified phenol resin was used, a phenol resin varnish for secondary impregnation S-9 and a thickness 1.6 produced using S-9.
mm single-sided copper-clad laminate was obtained. This comparative example is an example in which a resolving reaction was performed without performing a novolak reaction, and curing was insufficient under molding conditions of 160 ° C. and 50 minutes, and punching workability of the obtained copper-clad laminate was poor. It was not enough.

【0028】(比較例5) 実施例1と同様にして桐油フェノール反応物T−1を得
た。次いで、この桐油フェノール反応物T−1にトリエ
タノールアミンを0.4部添加して中和した後に、37
%ホルムアルデヒド46部添加し、さらに、塩基性触媒
としてトリエチルアミンを2部と25%アンモニア水溶
液を1部添加し、85℃で90分反応させレゾールタイ
プのフェノール樹脂を得た。これに、実施例1で記載し
たメチロール化メラミン化合物水溶液M−1を29.4
部添加し、150mmHgで70℃になるまで減圧脱水
し、常圧に戻した後、メタノールを60部添加して桐油
変性フェノール樹脂を得た。そして、この桐油変性フェ
ノール樹脂を用いるようにした以外は、実施例1と同様
にして、2次含浸用フェノール樹脂ワニスS−10及び
S−10を用いて作製した厚さ1.6mmの片面銅張積
層板を得た。この比較例は、ノボラック反応をすること
なしに、レゾール化反応をした例であり、160℃、5
0分の成形条件では硬化が不十分であり、得られた銅張
積層板のパンチング加工性が不十分であった。
Comparative Example 5 A tung oil phenol reactant T-1 was obtained in the same manner as in Example 1. Next, 0.4 parts of triethanolamine was added to the tung oil phenol reactant T-1 to neutralize the same,
% Formaldehyde, 2 parts of triethylamine as a basic catalyst and 1 part of a 25% aqueous ammonia solution were added, and reacted at 85 ° C. for 90 minutes to obtain a resol type phenol resin. To this, the methylolated melamine compound aqueous solution M-1 described in Example 1 was mixed with 29.4.
The mixture was dehydrated under reduced pressure at 70 ° C. at 150 mmHg and returned to normal pressure. Then, 60 parts of methanol was added to obtain a tung oil-modified phenol resin. Then, except that this tung oil-modified phenol resin was used, in the same manner as in Example 1, the secondary impregnation phenol resin varnish S-10 and
A single-sided copper-clad laminate having a thickness of 1.6 mm manufactured using S-10 was obtained. This comparative example is an example in which a resolving reaction was performed without performing a novolak reaction.
Under the molding conditions of 0 minutes, the curing was insufficient, and the obtained copper-clad laminate was insufficient in punching workability.

【0029】上記の各実施例及び各比較例における、桐
油変性フェノール樹脂を得るための配合量等の製造条件
と、メチロール化メラミン化合物水溶液を添加する前
の、レゾール化反応を終えたフェノール樹脂の重量平均
分子量を表1にまとめて示すと共に、上記で得られた各
2次含浸用フェノール樹脂ワニス及び各片面銅張積層板
の品質を評価し、その結果を表2に示した。表2に示し
た。2次含浸用フェノール樹脂ワニスの品質はワニス中
の濁りの有無を目視で評価し、片面銅張積層板の品質は
難燃性とパンチング加工性を下記の条件で評価した。
In each of the above Examples and Comparative Examples, the production conditions such as the compounding amount for obtaining the tung oil-modified phenol resin and the phenol resin after the resolation reaction before adding the aqueous solution of the methylolated melamine compound were added. The weight-average molecular weights are summarized in Table 1, and the phenolic resin varnish for secondary impregnation obtained above and the quality of each single-sided copper-clad laminate were evaluated. The results are shown in Table 2. The results are shown in Table 2. The quality of the phenol resin varnish for secondary impregnation was visually evaluated for the presence or absence of turbidity in the varnish, and the quality of the single-sided copper-clad laminate was evaluated for flame retardancy and punching workability under the following conditions.

【0030】難燃性はUL試験法に基づき、5本の試験
片についての消炎時間を測定し、平均値と最大値を求
め、平均消炎時間が5秒以下であって、且つ最大消炎時
間が10秒以下の場合はUL94V−0のレベルに合格
として評価した。
The flame retardancy was determined based on the UL test method by measuring the quenching time of five test pieces, calculating the average value and the maximum value. The average quenching time was 5 seconds or less, and the maximum quenching time was 5 seconds. In the case of 10 seconds or less, it was evaluated as passing the UL94V-0 level.

【0031】パンチング加工性は、50℃でパンチング
加工して、クラックとバルジの発生状況を評価し、クラ
ックが150個以下であって、且つバルジの程度17ポ
イント以下であれば合格とした。なお、クラックは穴径
0.8mm、穴間0.8mmで20×8個の穴を打ち抜
き、穴間にクラックが発生している個数を評価し(個数
が少ないほど良好)、バルジは打ち抜いた穴径0.8m
mの穴の周囲のバルジの程度を白色化した色調の濃淡を
数値に置き換えて評価し(数値が小さいほど良好)、ク
ラックとバルジの両方が合格である場合を○、どちらか
一方でも不合格の場合を×として表2に示した。
The punching workability was evaluated by the occurrence of cracks and bulges by punching at 50 ° C. If the number of cracks was 150 or less and the degree of bulge was 17 points or less, it was judged as acceptable. For cracks, 20 × 8 holes were punched with a hole diameter of 0.8 mm and a hole gap of 0.8 mm, and the number of cracks generated between the holes was evaluated (the smaller the number, the better), and the bulge was punched. Hole diameter 0.8m
The degree of bulge around the hole of m is evaluated by replacing the shade of white tone with a numerical value (the smaller the numerical value, the better). If both the crack and the bulge pass, the evaluation is ○. Table 2 is shown in Table 2 as x.

【0032】[0032]

【表1】 [Table 1]

【0033】[0033]

【表2】 [Table 2]

【0034】表2の結果から明らかなように、本発明の
実施例の片面銅張紙基材フェノール樹脂積層板は、積層
板中のBr含有量が比較例4と同一レベル(3重量%)
であっても、メラミン成分の含有量が比較例4より多い
ので、良好な難燃性が得られている。また、本発明の実
施例の2次含浸用フェノール樹脂ワニスはすべて、ワニ
スの濁りがなく含浸性が良好であったが、比較例1〜比
較例3の二次含浸用フェノール樹脂ワニスはワニスの濁
りがあり、含浸性が不十分であることも確認された。ま
た、ノボラック反応をすることなしに、レゾール化反応
をした比較例4及び比較例5では、160℃、50分の
成形条件では硬化が不十分であり、得られた銅張積層板
のパンチング加工性が不十分であった。
As is evident from the results in Table 2, the phenolic resin-based laminate of single-sided copper-clad paper according to the example of the present invention has the same Br content in the laminate as Comparative Example 4 (3% by weight).
However, since the content of the melamine component is larger than that of Comparative Example 4, good flame retardancy is obtained. In addition, the phenolic resin varnishes for secondary impregnation of the examples of the present invention all had good turbidity and good impregnation properties of the varnishes, but the phenolic resin varnishes for secondary impregnation of Comparative Examples 1 to 3 were varnishes. It was also confirmed that there was turbidity and impregnation was insufficient. Further, in Comparative Examples 4 and 5 in which the resolving reaction was performed without performing the novolak reaction, curing was insufficient under the molding conditions of 160 ° C. and 50 minutes, and the obtained copper-clad laminate was punched. Sex was inadequate.

【0035】[0035]

【発明の効果】請求項1〜請求項3に係る発明のフェノ
ール樹脂組成物の製造方法では、ノボラック化反応した
後、アンモニア量を制限した条件で、塩基性触媒として
3級アミンを加えレゾール化反応して得られた重量平均
分子量が2000〜10000である樹脂に、メチロー
ル化メラミン化合物水溶液を添加するようにしている。
そのため、メチロール化メラミン化合物水溶液を添加し
たフェノール樹脂を減圧下で加熱脱水しても、積層板を
製造するためにワニス化したフェノール樹脂組成物に濁
りや、沈殿が生じ難くなる。
According to the method for producing a phenolic resin composition of the invention according to any one of claims 1 to 3 , after a novolak reaction, a tertiary amine is added as a basic catalyst under a condition in which the amount of ammonia is limited, to form a resol. An aqueous solution of a methylolated melamine compound is added to a resin having a weight average molecular weight of 2,000 to 10,000 obtained by the reaction.
Therefore, even if the phenol resin to which the aqueous solution of the methylolated melamine compound is added is heated and dehydrated under reduced pressure, the varnished phenol resin composition for producing a laminated board is less likely to become cloudy or precipitate.

【0036】従って、請求項1〜請求項3に係る発明の
フェノール樹脂組成物の製造方法によれば、桐油とフェ
ノール類の反応物と、アルデヒド類とを反応させたフェ
ノール樹脂中に多量のメチロール化メラミン化合物水溶
液を添加し、その後減圧下で加熱脱水して、メラミン成
分をフェノール樹脂組成物中に含有させるようにして
も、積層板を製造するためにワニス化したフェノール樹
脂組成物に濁りや、沈殿が生じることがない。すなわ
ち、請求項1〜請求項3に係る発明のフェノール樹脂組
成物の製造方法によれば、フェノール樹脂組成物中に含
有させるメラミン成分量を増やせるので、所望の難燃性
を付与するためのハロゲン系難燃剤の使用量を削減する
ことが可能になる。
Therefore, according to the method for producing a phenolic resin composition according to the first to third aspects of the present invention, a large amount of methylol is contained in the phenolic resin obtained by reacting a reaction product of tung oil and a phenol with an aldehyde. Melamine compound aqueous solution, and then heat dehydration under reduced pressure, even if the melamine component is contained in the phenolic resin composition, the varnished phenolic resin composition for producing a laminated board becomes cloudy. No precipitation occurs. That is, according to the method for producing a phenolic resin composition of the invention according to claims 1 to 3 , since the amount of the melamine component contained in the phenolic resin composition can be increased, a halogen for imparting a desired flame retardancy can be obtained. It is possible to reduce the amount of flame retardants used.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI C08L 61/28 C08L 61/28 (56)参考文献 特開 平2−73820(JP,A) 特開 平9−157414(JP,A) 特開 平9−31146(JP,A) 特開 昭58−15521(JP,A) 特開 昭58−13617(JP,A) 特開 昭59−58020(JP,A) 特開 平10−176024(JP,A) 特開 平10−204140(JP,A) 特開 昭61−183325(JP,A) (58)調査した分野(Int.Cl.7,DB名) C08L 61/00 - 61/34 C08G 8/00 - 8/38 WPI/L(QUESTEL)──────────────────────────────────────────────────続 き Continuation of the front page (51) Int.Cl. 7 Identification symbol FI C08L 61/28 C08L 61/28 (56) References JP-A-2-73820 (JP, A) JP-A 9-157414 (JP) JP-A-9-31146 (JP, A) JP-A-58-15521 (JP, A) JP-A-58-13617 (JP, A) JP-A-59-58020 (JP, A) 10-176024 (JP, A) JP-A-10-204140 (JP, A) JP-A-61-183325 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) C08L 61/00 -61/34 C08G 8/00-8/38 WPI / L (QUESTEL)

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 桐油とフェノール類の反応物と、アルデ
ヒド類とを、一次反応として酸性触媒の存在下でノボラ
ック化反応した後、二次反応として塩基性触媒として3
級アミンを加えレゾール化反応して製造するフェノール
樹脂組成物の製造方法であって、レゾール化反応の際に
3級アミンと共に加えるアンモニア量が、桐油とフェノ
ール類の合計量100重量部に対し、0〜0.35重量
部であり、且つレゾール化反応を終えた重量平均分子量
が2000〜10000である樹脂にメチロール化メラ
ミン化合物水溶液を添加し、次いで減圧下で加熱脱水す
ることを特徴とするフェノール樹脂組成物の製造方法。
1. A novolak reaction between a reaction product of tung oil and phenols and an aldehyde in the presence of an acidic catalyst as a primary reaction, followed by a basic reaction as a basic catalyst.
A method for producing a phenolic resin composition produced by adding a tertiary amine and performing a resolving reaction, wherein the amount of ammonia added together with the tertiary amine during the resolving reaction is 100 parts by weight based on the total amount of tung oil and phenols. A phenol which is prepared by adding an aqueous solution of a methylolated melamine compound to a resin having a weight-average molecular weight of 2,000 to 10,000 after resolving reaction and then dehydrating by heating under reduced pressure. A method for producing a resin composition.
【請求項2】 メチロール化メラミン化合物水溶液が、
フェノール類で変性されたメチロール化メラミン化合物
の水溶液であることを特徴とする請求項1記載のフェノ
ール樹脂組成物の製造方法。
2. An aqueous solution of a methylolated melamine compound,
The method for producing a phenolic resin composition according to claim 1, which is an aqueous solution of a methylolated melamine compound modified with a phenol.
【請求項3】 前記の3級アミンがトリエチルアミン
あることを特徴とする請求項1又は請求項2記載のフェ
ノール樹脂組成物の製造方法。
3. A process according to claim 1 or claim 2 Fe <br/> Nord resin composition according tertiary amine of the is characterized in that there <br/> with triethylamine.
JP00644397A 1997-01-17 1997-01-17 Method for producing phenolic resin composition Expired - Lifetime JP3314647B2 (en)

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JP3314647B2 true JP3314647B2 (en) 2002-08-12

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Publication number Priority date Publication date Assignee Title
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