JP3310686B2 - Polishing tape manufacturing method - Google Patents

Polishing tape manufacturing method

Info

Publication number
JP3310686B2
JP3310686B2 JP04232292A JP4232292A JP3310686B2 JP 3310686 B2 JP3310686 B2 JP 3310686B2 JP 04232292 A JP04232292 A JP 04232292A JP 4232292 A JP4232292 A JP 4232292A JP 3310686 B2 JP3310686 B2 JP 3310686B2
Authority
JP
Japan
Prior art keywords
polishing
polishing layer
tape
binder
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP04232292A
Other languages
Japanese (ja)
Other versions
JPH05208376A (en
Inventor
正俊 寺沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Maxell Energy Ltd
Original Assignee
Hitachi Maxell Energy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Energy Ltd filed Critical Hitachi Maxell Energy Ltd
Priority to JP04232292A priority Critical patent/JP3310686B2/en
Publication of JPH05208376A publication Critical patent/JPH05208376A/en
Application granted granted Critical
Publication of JP3310686B2 publication Critical patent/JP3310686B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】この発明は、磁気ヘツド、磁気デ
イスク、その他精密部品などに用いられる研磨テ―プの
製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a polishing tape used for a magnetic head, a magnetic disk, and other precision parts.

【0002】[0002]

【従来の技術】一般に、この種の研磨テ―プは、テ―プ
基材上に、研磨剤粉末およびバインダを含む塗料を塗
布,乾燥して、研磨層を形成したものであるが、この研
磨層における研磨剤粉末およびバインダの充てん率によ
つて研磨力が大きく左右される。このため、従来より、
研磨剤粉末とバインダを含む塗料を調製する際に、分散
剤を添加して、塗料中での研磨剤粉末の分散性を向上さ
せ、もつて上記充てん率を高める手法が汎用されてい
る。
2. Description of the Related Art Generally, a polishing tape of this kind is obtained by applying a coating material containing an abrasive powder and a binder on a tape base material and drying the coating material to form a polishing layer. The polishing power greatly depends on the filling ratio of the abrasive powder and the binder in the polishing layer. For this reason,
When preparing a paint containing an abrasive powder and a binder, a method of adding a dispersant to improve the dispersibility of the abrasive powder in the paint and thereby increase the above-mentioned filling rate is widely used.

【0003】[0003]

【発明が解決しようとする課題】しかし、分散剤を使用
すると、研磨層の強度が低下して、研磨剤粒子の脱落を
生じ易く、研磨テ―プとしての耐久性が劣化する。その
うえ、通常、研磨層形成用の塗料には、溶媒として有機
溶剤が用いられているが、塗布後の乾燥で研磨層中に有
機溶剤の蒸発による気孔の生成が起こり、上記分散剤の
使用によつても、この気孔により充てん率はさほど向上
しない。
However, when a dispersant is used, the strength of the polishing layer is reduced, the abrasive particles are liable to fall off, and the durability as a polishing tape is deteriorated. In addition, usually, an organic solvent is used as a solvent in the coating for forming the polishing layer. However, drying after application causes generation of pores due to evaporation of the organic solvent in the polishing layer. Even so, the pores do not significantly improve the filling rate.

【0004】この発明は、このような事情に鑑み、研磨
層における研磨剤粉末およびバインダの充てん率が高く
て、研磨力にすぐれ、しかも耐久性の良好な研磨テ―プ
の製造方法を提供することを目的としている。
The present invention has been made in view of the above circumstances, and provides a method for producing a polishing tape having a high filling ratio of an abrasive powder and a binder in a polishing layer, excellent polishing power, and excellent durability. It is intended to be.

【0005】[0005]

【課題を解決するための手段】この発明者は、上記の目
的を達成するために、鋭意検討した結果、テ―プ基材上
に研磨層を形成したのち、特定の高密度化処理を施した
場合に、研磨層における研磨剤粉末およびバインダの充
てん率が著しく上昇し、研磨力および耐久性にすぐれた
研磨テ―プが得られることを見出し、この発明をなすに
至つた。
Means for Solving the Problems The present inventor has conducted intensive studies to achieve the above object, and as a result, after forming a polishing layer on a tape base material, a specific high-density treatment was performed. In this case, the filling ratio of the abrasive powder and the binder in the polishing layer was remarkably increased, and it was found that a polishing tape having excellent polishing power and durability was obtained, which led to the present invention.

【0006】すなわち、この発明は、テ―プ基材上に、
研磨剤粉末およびバインダを含む塗料を塗布,乾燥し
て、研磨層を形成したのち、カレンダ―による研磨層の
高密度化処理を施すとともに、この高密度化処理を施す
にあたり、研磨層の表面に接するロ―ルをコツトンロ―
ルとしたことを特徴とする研磨テ―プの製造方法に係る
ものである。
That is, the present invention provides a tape base material comprising:
After applying a coating material containing an abrasive powder and a binder and drying to form a polishing layer, the polishing layer is densified by a calendar , and the densification is performed.
The roll in contact with the surface of the polishing layer
The present invention relates to a method for producing a polishing tape, characterized in that the polishing tape is formed.

【0007】[0007]

【発明の構成・作用】この発明において、テ―プ基材上
に研磨層を形成したのち、カレンダ―による高密度化処
理を行うと、研磨層内に有機溶剤の蒸発に起因して生じ
ていた気孔がこの研磨層の圧縮によつて縮小ないし消滅
し、もつて研磨層は研磨剤粉末およびバインダの充てん
率が著しく高くなるとともに、研磨剤粒子がバインダに
強固に結着されて強靱性に富むものとなる。
In the present invention, when a polishing layer is formed on a tape base material and a high-density treatment is performed by a calendar, the polishing layer is formed in the polishing layer due to evaporation of an organic solvent. The pores shrink or disappear due to the compression of the polishing layer, and in the polishing layer, the filling ratio of the abrasive powder and the binder becomes remarkably high, and the abrasive particles are firmly bound to the binder, thereby increasing the toughness. Be rich.

【0008】したがつて、この高密度化処理を経て得ら
れる研磨テ―プでは、研磨時に研磨層が変形しにくく、
かつ研磨剤粒子の脱落を生じにくいことから、非常にす
ぐれた耐久性を示し、また研磨に要するエネルギ―が研
磨層の変形に費やされる割合は極めて小さいため、それ
だけ研磨力が大きくなるとともに研磨効率が向上し、研
磨面もシヤ―プになる。
Therefore, in the polishing tape obtained through this high-density treatment, the polishing layer is hardly deformed during polishing, and
In addition, the abrasive particles are less likely to fall off, exhibiting excellent durability. Since the energy required for polishing is spent on the deformation of the polishing layer is extremely small, the polishing power increases and the polishing efficiency increases. And the polished surface is sharpened.

【0009】このような研磨層の高密度化処理に用いる
カレンダ―としては、種々のロ―ル配置構成を採用でき
るが、特に研磨層の表面に接するロ―ルをコツトンロ―
ルとすることが好ましい。すなわち、高密度化処理によ
つて研磨剤粉末およびバインダの充てん率が向上して
も、研磨層の表面が平滑化されると研磨効率の低下を招
くことになるが、上記コツトンロ―ルの使用により、研
磨層表面を粗面状態に維持した形で研磨層の充てん率を
高くすることが容易になる。
Various roll arrangements can be used as a calendar used for such a high density treatment of the polishing layer. In particular, the roll in contact with the surface of the polishing layer is a cotton roll.
Preferably. That is, even if the filling ratio of the abrasive powder and the binder is improved by the high-density treatment, the polishing efficiency is lowered if the surface of the polishing layer is smoothed. Thereby, it is easy to increase the filling rate of the polishing layer while maintaining the surface of the polishing layer in a roughened state.

【0010】なお、研磨層における研磨剤粉末およびバ
インダの充てん率は、90%以上とすることが望まし
く、低すぎては十分な研磨力および耐久性が得られな
い。また、研磨層の表面粗さは、高密度化処理前の表面
粗さの80%以上となるように設定するのがよい。この
ような充てん率および表面粗さとするうえで、上記コツ
トンロ―ルの使用によるカレンダ―のロ―ル温度は30
〜80℃、加圧力(線圧)は50〜200Kg/cm2 程度
が好適である。
[0010] The filling ratio of the abrasive powder and the binder in the polishing layer is desirably 90% or more, and if it is too low, sufficient polishing power and durability cannot be obtained. The surface roughness of the polishing layer is preferably set to be 80% or more of the surface roughness before the high-density treatment. In order to achieve such a filling ratio and surface roughness, the roll temperature of the calendar by using the cotton roll is 30.
It is preferable that the pressure (linear pressure) is about 50 to 200 kg / cm 2 .

【0011】研磨剤粉末としては、たとえばAl
2 3 、SiC、Cr2 3 、Fe2 3、SiO2
どの高硬度の無機化合物粒子が挙げられ、特に平均粒子
径が0.1〜10μm程度のものが好適である。
As the abrasive powder, for example, Al
Examples include inorganic compound particles of high hardness such as 2 O 3 , SiC, Cr 2 O 3 , Fe 2 O 3 , and SiO 2 , and those having an average particle diameter of about 0.1 to 10 μm are particularly preferable.

【0012】研磨層のバインダとしては、ポリウレタン
系樹脂、ポリエステル系樹脂、塩化ビニル−酢酸ビニル
系共重合体、エポキシ系樹脂など、従来より研磨層用と
して知られるものを単独でまたは2種以上を併用でき
る。このようなバインダの使用量は、研磨剤粉末100
重量部に対して、10〜50重量部程度とするのがよ
い。少なすぎては結着力が不足して研磨剤粒子の脱落を
生じ易くなり、耐久性の低下を招き、逆に多すぎては研
磨力および研磨効率が不十分となる。
As the binder for the polishing layer, polyurethane resins, polyester resins, vinyl chloride-vinyl acetate copolymers, epoxy resins and the like, which are conventionally known for polishing layers, can be used alone or in combination of two or more. Can be used together. The amount of such a binder used is 100
The amount is preferably about 10 to 50 parts by weight with respect to parts by weight. If the amount is too small, the binding force is insufficient, and the abrasive particles tend to fall off, resulting in a decrease in durability. Conversely, if the amount is too large, the polishing power and the polishing efficiency become insufficient.

【0013】研磨層を形成するには、上記の研磨剤粉末
およびバインダと有機溶剤とからなる塗料を調製し、こ
の塗料を、ポリエステルなどからなるテ―プ基材上に、
乾燥後の厚さが3〜50μm程度となるように塗布し、
乾燥させればよい。この研磨層の形成後、前記のカレン
ダ―による高密度化処理を施すことにより、この発明の
研磨テ―プが得られる。
In order to form a polishing layer, a coating material comprising the above-mentioned abrasive powder, a binder and an organic solvent is prepared, and this coating material is coated on a tape base made of polyester or the like.
Apply so that the thickness after drying is about 3 to 50 μm,
It may be dried. After the formation of this polishing layer, the polishing tape of the present invention is obtained by performing the densification treatment using the above-mentioned calendar.

【0014】[0014]

【発明の効果】以上のように、この発明の製造方法によ
れば、研磨層における研磨剤粉末およびバインダの充て
ん率が高く、研磨力、研磨効率、仕上げ性がいずれも良
好であつて、しかも耐久性の良い研磨テ―プを提供でき
る。特に、カレンダ―による高密度化処理において、研
磨層表面に接するロ―ルをコツトンロ―ルとする構成に
よれば、研磨層の表面の平滑化による研磨力の低下を回
避できる。
As described above, according to the manufacturing method of the present invention, the filling rate of the abrasive powder and the binder in the polishing layer is high, the polishing power, the polishing efficiency, and the finish are all good. A highly durable polishing tape can be provided. In particular, in the high-density treatment using the calendar, according to the configuration in which the roll in contact with the surface of the polishing layer is a cotton roll, it is possible to avoid a decrease in polishing power due to the smoothing of the surface of the polishing layer.

【0015】[0015]

【実施例】つぎに、この発明の実施例を記載して、より
具体的に説明する。なお、以下において、部とあるのは
重量部を意味する。
Next, an embodiment of the present invention will be described in more detail. In the following, “parts” means “parts by weight”.

【0016】実施例1 Al2 3 粉末(平均粒子径0.3μm) 70部 ポリウレタン系樹脂 30部 (日本ポリウレタン社製の商品名N2301) メチルエチルケトン 100部 上記の組成物を混合して塗料とし、これを厚さが25μ
mのテ―プ基材上に乾燥後の厚さが35μmとなるよう
に塗布し、乾燥して、研磨層を形成した。
Example 1 Al 2 O 3 powder (average particle size: 0.3 μm) 70 parts Polyurethane resin 30 parts (trade name N2301 manufactured by Nippon Polyurethane Co.) 100 parts methyl ethyl ketone The above composition was mixed to form a paint, This has a thickness of 25μ
It was applied on a tape base material having a thickness of 35 μm after drying, and dried to form a polishing layer.

【0017】つぎに、直径30cmのコツトンロ―ル4本
を積み重ね状態に配置したカレンダ―を用い、ロ―ル温
度50℃、加圧力(線圧)80Kg/cm2 の条件で、上記
の研磨層を形成したテ―プを、その研磨層の表面がコツ
トンロ―ルに接する状態で、50m/分の速度で通し
て、高密度化処理を行い、研磨テ―プを作製した。この
テ―プの研磨層の充てん率は90%であつた。
Next, using a calender in which four cotton rolls each having a diameter of 30 cm are arranged in a stacked state, under the conditions of a roll temperature of 50 ° C. and a pressing force (linear pressure) of 80 kg / cm 2 , the above-mentioned polishing layer is formed. The tape on which was formed was passed through at a speed of 50 m / min in a state where the surface of the polishing layer was in contact with the cotton roll, and a high-density treatment was performed to produce a polishing tape. The filling ratio of the polishing layer of this tape was 90%.

【0018】実施例2 カレンダ―のロ―ル温度を70℃に変更した以外は、実
施例1と同様にして、研磨テ―プを作製した。このテ―
プの研磨層の充てん率は95%であつた。
Example 2 A polished tape was produced in the same manner as in Example 1 except that the roll temperature of the calendar was changed to 70 ° C. This table
The filling rate of the polishing layer of the tape was 95%.

【0019】実施例3 カレンダ―の加圧力(線圧)を100Kg/cm2 に変更し
た以外は、実施例1と同様にして、研磨テ―プを作製し
た。このテ―プの研磨層の充てん率は95%であつた。
Example 3 A polishing tape was produced in the same manner as in Example 1 except that the pressure (linear pressure) of the calendar was changed to 100 kg / cm 2 . The filling ratio of the polishing layer of this tape was 95%.

【0020】比較例1 カレンダ―による高密度化処理を施さなかつた以外は、
実施例1と同様にして、研磨テ―プを作製した。
Comparative Example 1 Except that the high-density treatment by the calendar was not performed,
A polishing tape was produced in the same manner as in Example 1.

【0021】以上の実施例1〜3および比較例1で得ら
れた各研磨テ―プについて、鋼球摺動摩耗試験機を用い
て、研磨量、仕上げ性、耐久性を、それぞれ測定した。
その結果を、研磨層の表面粗さとともに、下記の表1に
示す。
With respect to each of the polishing tapes obtained in Examples 1 to 3 and Comparative Example 1, the polishing amount, finishability, and durability were measured using a steel ball sliding wear tester.
The results are shown in Table 1 below together with the surface roughness of the polishing layer.

【0022】なお、仕上げ性および耐久性は、優秀であ
るものを○、普通であるものを△、劣るものを×、とす
る3段階で評価した。また、研磨層の表面粗さは、針接
触式表面粗さ計によつて測定し、比較例1の研磨テ―プ
の値を100%とする相対値により表した。さらに、研
磨量は、上述のように鋼球摺動摩耗試験機により測定し
て、比較例1の研磨テ―プの値を100%とする相対値
により表した。
The finishability and durability were evaluated on a three-point scale, with 優秀 being excellent, △ being normal, and × being poor. The surface roughness of the polishing layer was measured by a needle contact type surface roughness meter, and expressed as a relative value with the value of the polishing tape of Comparative Example 1 taken as 100%. Further, the polishing amount was measured with a steel ball sliding wear tester as described above, and expressed as a relative value with the value of the polishing tape of Comparative Example 1 taken as 100%.

【0023】[0023]

【表1】 [Table 1]

【0024】上記の表1から、この発明方法によつて得
られる研磨テ―プ(実施例1〜3)は、研磨層の形成後
にカレンダ―による研磨層の高密度化処理を施している
ため、この処理を施さなかつた研磨テ―プ(比較例1)
に比べて、仕上げ性および耐久性にすぐれ、かつ十分な
研磨力を有することが明らかである。
From Table 1 above, the polishing tapes (Examples 1 to 3) obtained by the method of the present invention are because the polishing layer has been subjected to a treatment for increasing the density of the polishing layer using a calendar after the formation of the polishing layer. Polished tape not subjected to this treatment (Comparative Example 1)
It is clear that, as compared with, the finish and the durability are excellent, and the abrasive has a sufficient polishing force.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平1−135481(JP,A) 特開 昭53−137493(JP,A) 特開 昭58−194192(JP,A) 特開 昭57−143737(JP,A) (58)調査した分野(Int.Cl.7,DB名) B24D 3/00 - 18/00 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-1-135481 (JP, A) JP-A-53-137493 (JP, A) JP-A-58-194192 (JP, A) JP-A-57-194 143737 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B24D 3/00-18/00

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 テ―プ基材上に、研磨剤粉末およびバイ
ンダを含む塗料を、塗布,乾燥して、研磨層を形成した
のち、カレンダ―による研磨層の高密度化処理を施す
ともに、この高密度化処理を施すにあたり、研磨層の表
面に接するロ―ルをコツトンロ―ルとしたことを特徴と
する研磨テ―プの製造方法。
1. A tape - the flop substrate on a paint containing an abrasive powder and a binder, coating and drying, after forming the polishing layer, a calendar - the densification of the abrasive layer applied by the
In both cases, the surface of the polishing layer
A method for producing a polishing tape, characterized in that a roll in contact with a surface is a cotton roll .
JP04232292A 1992-01-30 1992-01-30 Polishing tape manufacturing method Expired - Fee Related JP3310686B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04232292A JP3310686B2 (en) 1992-01-30 1992-01-30 Polishing tape manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04232292A JP3310686B2 (en) 1992-01-30 1992-01-30 Polishing tape manufacturing method

Publications (2)

Publication Number Publication Date
JPH05208376A JPH05208376A (en) 1993-08-20
JP3310686B2 true JP3310686B2 (en) 2002-08-05

Family

ID=12632780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04232292A Expired - Fee Related JP3310686B2 (en) 1992-01-30 1992-01-30 Polishing tape manufacturing method

Country Status (1)

Country Link
JP (1) JP3310686B2 (en)

Also Published As

Publication number Publication date
JPH05208376A (en) 1993-08-20

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