JP3307488B2 - Resin composition - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition having excellent heat resistance, flame retardancy, melt moldability and mechanical strength.

[0002]

2. Description of the Related Art Polyphenylene sulfide resin has attracted attention as a resin having excellent heat resistance, flame retardancy, chemical resistance, and electrical properties, but has a drawback that its impact resistance is very weak. are doing. On the other hand, polycarbonate resins are generally well known as resins having excellent impact resistance. However, polycarbonate resins have low chemical resistance and the like, and do not have high flame retardancy. Therefore, as a technique for improving the disadvantages of polyphenylene sulfide and polycarbonate resin, a resin composition comprising polyphenylene sulfide and polycarbonate resin has already been proposed (Japanese Patent Publication No. 53-13468). However, the resin composition obtained by this technique has poor compatibility between the two resins,
As a result, delamination was observed, and the high heat resistance of polyphenylene sulfide was hardly reflected.

On the other hand, aromatic polyamide-imide resin is a plastic material having excellent heat resistance, mechanical strength, electrical properties, and chemical resistance, and has been conventionally used as a varnish, a film, and the like. At present, most of them are difficult to be injection-molded, and are currently molded by a compression molding method. The aromatic polyamideimide resin is prepared by reacting (a) an aromatic tricarboxylic anhydride with a diisocyanate in a solvent (isocyanate method) or (b) reacting an aromatic tricarboxylic anhydride with a diamine in a solvent. It is generally prepared, and the isocyanate method is disclosed in JP-B-44-19274. According to this method, a polyamideimide having high heat resistance and toughness can be obtained without performing the high-temperature and long-time post-treatment required in (b), and no halogen residue remains in the polyamideimide. Therefore, it is also a suitable method for recent electronic and electrical applications. However, polyamideimides produced by these methods are suitable for uses such as varnishes and cast films, but are inferior in melt moldability and therefore unsuitable for melt molding.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to provide a resin composition comprising a polyphenylene sulfide resin and a polycarbonate resin having poor compatibility, delamination is observed, and furthermore, an excellent heat resistance of the polyphenylene sulfide resin. That is, a material which does not reflect the properties and has an excellent balance of heat resistance, flame retardancy, and moldability has not yet been obtained.

[0005]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems. (A) An aromatic tricarboxylic anhydride and diisocyanate are dissolved in a solvent at 50 to 100 ° C.
Preferably 60 to 100 ° C, more preferably 80 to 10
The reaction is carried out in a temperature range of 0 ° C., and after the amidation reaction is completed by 70% or more, preferably 80% or more, more preferably 90% or more, and most preferably 95% or more.
An aromatic polyamide-imide resin having a repeating unit represented by the general formula 1, which is obtained by performing an imide group generation reaction at a temperature of 200 ° C, preferably 105 to 180 ° C, more preferably 110 to 130 ° C; (B) Polycarbonate
The present invention relates to a resin composition comprising a carbonate resin and (C) a polyphenylene sulfide resin.

[0006] The method of the present invention specifically comprises a polymerization temperature,
The reaction can be carried out by controlling the amidation reaction and the formation reaction of the imide group by keeping the reaction time and the method of adding the catalyst optimal. It does not matter if the amidation is carried out under conditions that do not cause a group formation reaction, and then the imidation is carried out. In order not to start the imidation reaction until the generation of the amide group is substantially completed,
Although it is necessary to track the components of the amide group and the component of the imide group during the polymerization reaction, this method can be performed by a known infrared spectroscopy, gas chromatogram, or the like.

In the present invention, the reaction temperature is an important condition, and by controlling this, the aromatic polyamideimide resin used in the resin composition of the present invention can be produced. The temperature in each stage may be set as long as it is within the temperature range. For example, the temperature may be raised, maintained at a constant temperature, or a combination thereof, but preferably maintained at a constant temperature. When the reaction temperature in each stage is lower than this, the amide group and imide group generation reaction is not completed, and as a result, the degree of polymerization of the polyamide imide does not increase and becomes brittle. And the imide group formation reaction proceed simultaneously. Even if the resin composition of the present invention is produced using this, only those having poor fluidity and retention stability during melting can be obtained. The reaction time is 30 minutes to 5 hours, preferably 30 minutes to 2 hours in the first stage, and 30 minutes to 10 hours, preferably 1 hour to 8 hours in the second stage. If the reaction time is too short, the degree of polymerization will not increase, and if it is too long, the fluidity and retention stability of the resin composition during melting will be impaired.

The aromatic tricarboxylic anhydride used as a raw material for producing the aromatic polyamideimide resin used in the resin composition of the present invention is a compound represented by the following general formula 3.

[0009]

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(In the formula, Ar represents a trivalent aromatic group containing at least one carbon 6-membered ring.) Specific examples of Ar in the general formulas 1 and 2 are shown in the following chemical formula 4. Is used.

[0011]

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Among these, preferred are those shown in the following Chemical Formula 5.

[0013]

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The diisocyanate compound used for producing the aromatic polyamideimide resin used in the resin composition of the present invention is a compound represented by the following general formula (3). O = C = NRN = C = O (3) (where R is a divalent aromatic and / or aliphatic group)

Specific examples thereof include those shown in the following chemical formulas (6) and (7).

[0016]

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[0017]

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Among these, the following are preferred.

[0019]

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Particularly preferred are the following.

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The most preferred are:

[0022]

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In producing the aromatic polyamideimide resin used in the resin composition of the present invention, 0 to 50 mol% of the aromatic tricarboxylic anhydride used as a raw material is used.
It is also possible to replace less than with an aromatic tetracarboxylic anhydride represented by the general formula 2.

Specific examples of Ar ₁ in Chemical Formula 2 include those shown in Chemical Formula 11 below.

[0025]

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Each of the structural units derived from the compounds represented by the general formulas (3), (2) and (3) may have one or more types corresponding to different Ar, R and Ar ₁ in the polyamideimide resin. That is, the polyamideimide resin of the present invention,
It can take the form of various copolymers.

In order to produce an aromatic polyamideimide resin suitable for the resin composition of the present invention, an aromatic tricarboxylic anhydride component (which can contain the above-mentioned dicarboxylic acid and tetracarboxylic anhydride) can be used. And diisocyanes
It is desirable that the molar ratio of the two components be maintained at 0.9 <A / B <1.1, where A and B represent the number of moles. More preferably, 0.99 <A / B <1.01
Should be kept.

The solvent used in the production of the aromatic polyamideimide resin suitably used in the resin composition of the present invention includes:
It is compatible with N-methylpyrrolidone, dimethylformamide, dimethylacetamide, dimethylsulfoxide, dimethylsulfolane, tetramethylenesulfone, diphenylsulfone, γ-butyrolactone, etc., which are compatible with the resulting polyamideimide. Non-polar solvents, for example, nitrobenzene, nitrotoluene, acetonitrile, benzonitrile, acetophenone, nitromethane, dichlorobenzene, anisole, etc., can be used alone or in combination. Preferred are solvents that are compatible with the polyamideimide. In addition, these solvents are used in a ratio of 0.1 to the solvent of the monomer raw material.
It is common to use 1 to 4 mol / l.

In the production of the aromatic polyamideimide resin suitably used in the resin composition of the present invention, various catalysts described in the prior art can be used, but they do not impair the melt-molding processability. The amount used should be limited to the minimum necessary, and is preferably not used as long as the polymerization rate is at a sufficiently practical level. Specific examples of the catalyst include pyridine, quinoline, isoquinoline, trimethylamine, triethylamine, tributylamine, N, N-diethylamine, γ-picoline, N-
Tertiary amines such as methylmorpholine, N-ethylmorpholine, triethylenediamine, 1,8-diazabicyclo [5,4,0] undecene-7, metal salts of weak acids such as cobalt acetate, cobalt naphthenate, and sodium oleate, and heavy metal salts And alkali metal salts.

In producing an aromatic polyamide-imide resin suitable for the resin composition of the present invention, the water content of a polymerization system composed of a solvent, a monomer and the like is 500 PP.
M or less, more preferably 100
PPM, most preferably kept below 50 PPM.
If the amount of water contained in the system is higher than these, the melt formability is impaired.

The use of a small amount of the molecular weight modifier is not limited at all. Representative molecular weight regulators include monocarboxylic acids such as benzoic acid, dicarboxylic anhydrides such as phthalic anhydride, succinic anhydride, and naphthalenedicarboxylic anhydride; monoisocyanates such as phenyl isocyanate; and phenols. Functional compounds. The degree of polymerization of the aromatic polyamideimide resin suitable for the resin composition of the present invention is 3 in dimethylformamide.
If the reduced viscosity measured at 0 ° C. at a concentration of 1 g / dl is used, 0.15 dl / g to 1.0 dl / g is suitably used, and more preferably 0.2 dl / g to 0.6 dl / g. But most preferably from 0.2 dl / g to 0.5 dl / g.

The aromatic polyamideimide resin used in the present invention may be an alcohol such as methanol or isopropanol.
It is recovered as a powder by precipitation and washing with ketones such as toluene, acetone and methyl ethyl ketone, and aliphatic and aromatic hydrocarbons such as heptane and toluene. Alternatively, the polymerization solvent may be directly concentrated. Further, a method of concentrating to a certain extent, removing the solvent under reduced pressure with an extruder or the like, and pelletizing is also effective.

As the polycarbonate resin which is the component (B) used in the resin composition of the present invention, various ones are used, and 4,4'-dioxyallylalkane, especially 4,4'-dioxyallylalkane Polycarbonate resins derived from 4'-dioxydiphenylpropane are preferably used.

The polyphenylene sulfide resin as the component (C) used in the resin composition of the present invention includes:
It is a polymer containing 70 mol% or more, more preferably 90 mol% or more, and most preferably substantially 100 mol% of the repeating unit represented by the following chemical formula 15.

[0035]

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When the content of the repeating unit is less than 70 mol%, it is difficult to obtain a resin composition of the present invention having specific properties. As a polymerization method for obtaining this polymer, various known methods can be adopted, and sodium sulfide and p-dichlorobenzene are reacted with N 2
-A method in which the reaction is carried out in an amide solvent such as methylpyrrolidone or dimethylacetamide or a sulfone solvent such as sulfolane is preferred. At this time, it is preferable to add an alkali metal carboxylate such as sodium acetate or lithium acetate in order to adjust the degree of polymerization.
Polyphenylene sulfide resins include those having relatively low molecular weight (JP-B No. 45-3368) and those having linear high molecular weight (JP-B No. 52-12240) depending on the production method. It is also possible to increase the molecular weight by heating in an oxygen atmosphere or in the presence of a crosslinking agent such as a peroxide. Any polyphenylene sulfide may be used in the resin composition of the present invention.

The polyphenylene sulfide resin according to the present invention is used as a copolymer component in an amount of less than 30 mol%, so long as it does not significantly affect the crystallinity of the polymer.
Ether bond, sulfone bond, biphenyl bond, amino group substituted phenyl sulfide bond, carboxyl group substituted phenyl sulfide bond, other alkyl, nitro, phenyl, alkoxy group substituted phenyl sulfide bond, 3
It may contain a functional phenyl sulfide bond or the like, but preferably the copolymer component is less than 10 mol%.

Further, the polyphenylene sulfide resin S
Those adjusted for the H terminal group concentration are also included in the present invention. Depending on the composition of the composition, kneading conditions, etc., a polyphenylene sulfide resin having a SH terminal group concentration of 10 mg equivalent or more per 1 kg of resin gives a preferable result, and more preferably 20 mg equivalent or more gives a more preferable result. Various methods are conceivable as a method for introducing the SH group, for example, treatment with hydrochloric acid, acetic acid, or the like in the final stage of polyphenylene sulfide resin production, or purification of a purified polyphenylene sulfide resin using hydrochloric acid, acetic acid, or the like. By treating in a solvent such as acetone, the SH group can be easily introduced into the terminal.

Next, the component (A) of the resin composition of the present invention,
(B) and (C) are 1 to 75% by weight, preferably 2 to 65% by weight, and most preferably 2 to 5% by weight of the aromatic polyamideimide resin of the component (A) based on 100% by weight of the total of the three.
0% by weight, and the polycarbonate resin as the component (B) is 5 to 95% by weight, preferably 5 to 80% by weight, and most preferably 10 to 60% by weight. Is from 5 to 95% by weight, preferably from 10 to 90% by weight, and most preferably from 25 to 90% by weight. If the amount of the component (A) is larger than this amount, the fluidity at the time of melting decreases, and if the amount is small, the heat resistance decreases.

The resin composition of the present invention is produced by melt-kneading the components, and the temperature of the melt-kneading is from 250 to 400 ° C.
Preferably at 280 to 400 ° C., the kneading method can be performed by an extruder, kneader, Banbury mixer, roll or the like. A preferred method is a method using a twin screw extruder.

The resin composition of the present invention may contain, if desired,
Fillers, pigments, lubricants, plasticizers, stabilizers, UV absorbers,
Other components such as a flame retardant, various additives of a flame retardant auxiliary, other resins, and elastomers can be appropriately compounded. Examples of fillers include glass beads, wollastonite, mica, talc, kaolin, silicon dioxide, clay, asbestos, charcoal, magnesium hydroxide, silica, diatomaceous earth, graphite, carborundum, and molybdenum disulfide. Mineral filler; glass fiber, milled fiber, potassium titanate fiber, boron fiber, silicon carbide fiber, inorganic fiber such as metal fiber such as brass, aluminum and zinc; organic fiber represented by carbon fiber and aramid fiber;
Examples include aluminum and zinc flakes.
The filler is preferably used in an amount of 1 to 70% by weight of the whole composition. Preferred fillers are milled fiber, glass fiber, and carbon fiber, and those obtained by treating them with an epoxy-based, amino-based, or other silane coupling agent are also suitably used.

Examples of the pigment include titanium oxide, zinc sulfide, zinc oxide and the like.

Examples of the lubricant include mineral oil, silicone oil, ethylene wax, polypropylene wax, metal salts such as sodium and lithium stearate, metal salts such as sodium, lithium and zinc montanic acid, and amides and esters of montanic acid. Are exemplified as typical ones.

As examples of various additives, examples of flame retardants include phosphoric esters such as triphenyl phosphate and tricresyl phosphate; decabromobiphenyl, pentabromotoluene, decabromobiphenyl. Brominated compounds represented by ether, hexabromobenzene, brominated polystyrene, brominated epoxy resin, brominated phenoxy resin, etc .; nitrogen-containing compounds such as melamine derivatives; nitrogen-containing phosphorus compounds such as cyclic phosphazene compounds and phosphazene polymers. Can be mentioned. Flame retardant aids may be used, examples of which include compounds of antimony, boron, zinc or iron. Still other additives include stabilizers such as sterically hindered phenols and phosphite compounds; ultraviolet absorbers exemplified by oxalic acid diamide compounds and sterically hindered amine compounds.

Examples of other resins mentioned above include epoxy resins and phenoxy resins produced from epichlorohydrin and dihydric phenols such as 2,2-bis (4-hydroxyphenyl) propane; polyethylene terephthalate, polybutylene terephthalate, polyethylene Phthalate,
Polyesters such as polybutylene naphthalate; aliphatic and aromatic crystals such as nylon-6, nylon-10, nylon-12, nylon-66, nylon-MXD6, nylon-46, nylon-6T, nylon-6I Polyamides; Aliphatic and aromatic amorphous polyamides;
Polyphenylene ether obtained by oxidative coupling polymerization of 2,6-dimethylphenol; aromatic resins such as polysulfone, polyethersulfone, polyetherimide, polythioetherketone, polyetherketone, and polyetheretherketone; No.

Examples of the elastomer include a high melting point hard segment mainly composed of an alkylene terephthalate unit composed of the above-mentioned dihydric alcohol and terephthalic acid, and a poly (ethylene oxide) glycol, poly (propylene oxide) glycol or the like. Polyester elastomers represented by ether glycol or a block copolymer of a soft segment consisting of an aliphatic polyester produced from an aliphatic dicarboxylic acid and a dihydric alcohol (typical products are Toyobo's Perprene and DuPont's) Hytrel); polyamide elastomers represented by block copolymers of hard segments such as nylon 11 and nylon 12 and polyether or soft segment of polyester (typical products Can be mentioned EMS CHEMIE Co. Grilamid); low density, high density, ultra high molecular weight,
Various polyethylenes such as linear low density; polypropylene; EP elastomer which is a copolymer of ethylene and propylene; EPDM which is a non-conjugated copolymer such as ethylene, propylene and norbornenes, cyclopentadiene, and 1,4-hexadiene Elastomer; Copolymer elastomer of α-olefin such as ethylene, propylene, butene-1 and glycidyl ester of α, β-unsaturated acid such as glycidyl acrylate and glycidyl methacrylate; α-olefin such as ethylene, propylene, butene-1 Olefin and vinyl acetate, vinyl propionate, methyl acrylate,
Copolymer elastomers with unsaturated esters such as methyl methacrylate; polyethylene, polypropylene, E
Α, β-unsaturated dicarboxylic anhydride typified by maleic anhydride of P, EPDM, α-olefin copolymer elastomer, or graft-modified glycidyl ester of α, β-unsaturated acid such as glycidyl methacrylate AB consisting of component A of a vinyl aromatic compound such as styrene and component B of a diene component such as butadiene and isoprene;
-A ', AB type elastomeric block copolymer; B
The component is a hydrogenated ABA ′, an AB type elastomeric block copolymer, furthermore, α, β-unsaturated dicarboxylic anhydride represented by maleic anhydride, or
AB- graft-modified with glycidyl esters of α, β-unsaturated acids such as glycidyl methacrylate
A ′, AB type elastomeric block copolymer, and AB similarly graft-modified and hydrogenated with the B component
-A ', AB type elastomeric block copolymers; polysulfide rubbers, silicone rubbers and the like.

[0047]

The aromatic polyamide-imide resin of the present invention,
The resin composition comprising a polycarbonate resin and a polyphenylene sulfide resin improves the compatibility without impairing the flame retardancy and the like of the resin composition comprising the polycarbonate resin and the polyphenylene sulfide resin, and is further improved. Realized heat resistance, mechanical strength, and flame retardancy. Therefore, this resin composition is suitably used for molding materials requiring high heat resistance, high mechanical strength, flame retardancy, and the like. This excellent characteristic is that the resin composition mainly comprising the aromatic polyamideimide resin, the polycarbonate resin and the polyphenylene sulfide resin of the present invention is different from the resin composition comprising the conventional polycarbonate resin and the polyphenylene sulfide resin. It is considered that the poor compatibility of the product was improved. In particular, the improvement in heat resistance is specific to the resin composition of the present invention.

Hereinafter, the resin composition of the present invention will be described in more detail with reference to Reference Examples, Examples and Comparative Examples. Also,
In the reference example, the produced aromatic polyamideimide resin is shown, and the results of the examples and comparative examples are shown in Table 1.

[0049]

【Example】

Reference Example 1 N-methylpyrrolidone having a water content of 15 ppm, 3 liters were charged into a reactor equipped with a 5 liter stirrer, a thermometer, and a reflux condenser equipped with a drying tube filled with calcium chloride at the tip. 555 g of trimellitic anhydride here
(50 mol%) and then 503.3 g (50 mol%) of 2,4-tolylene diisocyanate were added. The in-system water content of trimellitic anhydride was 30 ppm. Initially, the temperature of the contents was set to 90 ° C. over 20 minutes from room temperature, and polymerization was carried out at this temperature for 50 minutes. While conducting polymerization, 2,4-
The amount of isocyanate groups reduced and the amount of imide groups formed in tolylene diisocyanate were measured. The measurement was carried out by sampling a small amount of the reaction solution with a syringe and quantifying the absorption at 2276 cm ^-1 of the isocyanate group by an infrared method. When polymerization was performed for 50 minutes, the amount of isocyanate groups was reduced to 50 mol%. At this time, no imide group absorption was observed. This confirmed that the amidation reaction was completed before the imidation reaction occurred. Thereafter, it took 15 minutes to raise the temperature to 115 ° C., and the polymerization was continued for 8 hours while maintaining the temperature. After the completion of the polymerization, the polymer solution was dropped into methanol twice the volume of N-methylpyrrolidone with vigorous stirring. The precipitated polymer was separated by suction filtration, further redispersed in methanol, washed well, and filtered.
Vacuum drying was performed at 00 ° C. for 10 hours to obtain a polyamideimide powder. Dimethylformamide solution (concentration 1.0 g /
It was 0.25 dl / g when the reduced viscosity at 30 ° C. was measured in dl).

Reference Example 2 3 L of N-methylpyrrolidone having a water content of 15 ppm was charged into a reactor equipped with a 5 L stirrer, a thermometer, and a reflux condenser equipped with a drying tube filled with calcium chloride at the tip. . 555 g of trimellitic anhydride here
(50 mol%) and then 503.3 g (50 mol%) of 2,4-tolylene diisocyanate. Initially, the content was brought to 115 ° C. in 30 minutes from room temperature, and polymerization was continued at this temperature for 8 hours. After the polymerization was completed, the polymer solution was diluted twice by adding N-methylpyrrolidone.
The mixture was dropped into methanol twice the volume of 1-methylpyrrolidone under vigorous stirring. The precipitated polymer was separated by suction filtration, further redispersed in methanol, washed well, and separated.
Drying under reduced pressure at 0 ° C. gave a polyamideimide powder.
The reduced viscosity at 30 ° C. of the dimethylformamide solution (concentration: 1.0 g / dl) was measured.
It was 24 dl / g.

Example 1 5% by weight of the aromatic polyamideimide resin produced in Reference Example 1 and a polycarbonate resin (PC, manufactured by Mitsubishi Gas Chemical Company, Inc.)
Pyrone E-2000) 30% by weight, polyphenylene sulfide (PPS, melt viscosity at 300 ° C. is 2000)
35% by weight of Poise's Toprene T-4) and 30% by weight of glass fiber (03FT540 manufactured by Asahi Fiberglass) were melt-kneaded at 320 ° C. using a twin-screw extruder and pelletized. A 1/4 inch thick test piece was injection molded from the obtained pellet. For the purpose of heat resistance evaluation, the heat deformation temperature of 18.6 kg / cm ² stress was measured from this test piece, and the bending strength was measured for mechanical strength. Furthermore, the melt moldability is 30
The melt flow value at 0 ° C. under a stress of 60 kg / cm ² was measured by a Koka flow tester. The flammability is UL-
94. The results are shown in Table 1.

Examples 2 to 3 Example 1 was repeated except that the composition shown in Table 1 was changed. Result is,
The results are shown in Table 1.

Comparative Example 1 35% by weight of PC, 35% by weight of PPS, and 30% by weight of glass fiber were melt-kneaded under the same conditions as in Example 1 to form pellets. From the obtained pellets, a test piece having a thickness of 1/4 inch was injection-molded, and the heat deformation temperature and the bending strength were measured in the same manner as in Example 1. Further, in the same manner as in Example 1, the melt flow value was measured by a Koka type flow tester. Flammability is U
Measured by L-94.

Comparative Example 2 Comparative Example 1 was repeated with the composition shown in Table 1 changed. The results are shown in Table 1.

Comparative Example 3 Example 1 was repeated using the aromatic polyamideimide prepared in Reference Example 2. The results are shown in Table 1.

[0056]

[Table 1] Example Amit Imit PC PPS GF Thermal deformation Bending Melting Combustion Comparative example Type Temperature Strength Flowability (W%) (W%) (W%) (W%) (℃) (MPa) (cc / sec) X10 ^-1 ─────────────────────────────────── Example 1 Reference Example 1 5 30 35 30 210.3 172 1.2 V-0 Example 2 Reference Example 1 17.5 17.5 35 30 265.8 166 1.0 V-0 Example 3 Reference Example 1 15 15 30 40 266.4 172 1.0 V-0 Comparative Example 1 0 35 35 30 150.7 137 1.0 V-1 Comparison Example 2 0 30 30 40 150.1 142 0.8 V-1 Comparative Example 3 Reference Example 2 5 30 35 30 180.1 145 0.3 V-0

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-202552 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) C08L 69/00 C08L 79/08 C08L 81 / 04

Claims (2)

(57) [Claims] 1. A reaction of (A) an aromatic tricarboxylic anhydride and diisocyanate in a solvent at a temperature in the range of 50 to 100 ° C.
An aromatic polyamide-imide resin having a repeating unit represented by the general formula 1, which is obtained by performing an imide group generation reaction in a temperature range of 0 to 200 ° C., (B) polycarbonate-
And a resin composition comprising (C) a polyphenylene sulfide resin. Embedded image (In the general formula 1, Ar represents a trivalent aromatic group containing at least one carbon 6-membered ring, and R represents a divalent aromatic and / or aliphatic group.) (A) reacting an aromatic tricarboxylic anhydride, an aromatic tetracarboxylic acid represented by the general formula (2) and diisocyanate in a solvent at a temperature of 50 to 100 ° C. % To 100% after completion
An aromatic polyamide-imide resin having a repeating unit represented by the general formula 1, obtained by performing an imide group formation reaction in a temperature range of 00 ° C., (B) a polycarbonate resin, and (C) polyphenylene A resin composition comprising a sulfide resin. Embedded image (Ar ₁ is a tetravalent aromatic group containing at least one carbon 6-membered ring.)