JP3303690B2 - Non-reciprocal circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-reciprocal circuit device,
For example, the present invention relates to an isolator and a circulator, which are related to a structure capable of miniaturizing components, preventing displacement, and improving productivity.

[0002]

2. Description of the Related Art Generally, non-reciprocal circuit devices such as isolators and circulators have a function of hardly attenuating in a signal transmission direction and increasing in a reverse direction. , And UHF bands are used in transmission / reception circuits of mobile communication devices such as mobile phones and car phones.

FIGS. 11 and 12 are exploded perspective views showing a conventional non-reciprocal circuit device. In these figures, 21 and 31 are upper yokes, and 22 and 32 are cylindrical permanent magnets magnetized in the axial direction.
Reference numerals 3 and 34 denote a center conductor assembly, and reference numerals 26 and 37 denote lower yokes. The center conductor assemblies 23 and 34 are made of a ferrite made of a material such as a garnet having a columnar shape by folding the center conductor of a strip line projecting at the same interval in the outer direction from the disk-shaped center circular portion in an intersecting manner. And the central conductors are electrically insulated from each other. Normally, there are three center conductors, which are spaced apart by 120 °.

In the non-reciprocal circuit device shown in FIG. 11, reference numeral 24 denotes a dielectric substrate, and Ag-Pd or Ag-P
A conductor film of t is formed, thereby forming three capacitors, the resistors of which are printed on a portion thereof. Reference numeral 25 denotes a ground plate, and ground terminals 25 on both sides thereof.
a and 25b are made. The lower yoke 26, the ground plate 25, the dielectric substrate 24, and the center conductor assembly 23 are sequentially stacked on the printed board 27, and the conductor film on the lower side of the dielectric substrate 24 and the ground portion of the center circular portion of the center conductor are stacked. To the ground plate. The terminals 23a and 23b of the center conductor are connected to the upper electrodes of the respective capacitors of the dielectric substrate 24 and are bent to the back surface of the printed board 27 to form surface mounting terminals. The other terminal of the center conductor is connected to the upper terminal of another capacitor of the dielectric substrate 24 by soldering. When this non-reciprocal circuit device is used as an isolator, the other terminal of the center conductor is also connected to a resistor. The ground terminals 25a and 25b of the ground plate 25 are also bent to the back surface of the printed board 27 to become surface mount terminals. Center conductor assembly 23
The magnet 22 is mounted on the upper yoke, and the upper yoke 21
And the upper yoke 21, magnet 22, center conductor assembly 2
The ferrite No. 3 and the lower yoke 26 form a closed magnetic circuit, and the upper yoke 21 and the lower yoke 26 form an electromagnetic shield. As described above, in the capacitor in which the conductor film pattern is formed on the dielectric substrate 24, the shape of the dielectric substrate 24 is complicated, and since the resistor substrate and the conductor film are formed with high precision, the cost is high. There is a limit naturally. Also, as in this non-reciprocal circuit device, the terminals 23a, 23
B, 25a, and 25b are bent to the back surface of the printed board 27 to form the surface-mounting terminals, which requires assembling man-hours and makes assembly automation difficult. Terminals 23a, 23b
Since the printed circuit board 27 or an equivalent insulating plate is required to secure electrical insulation between the terminal and the lower yoke 26 when bending the printed circuit board to the back surface of the printed circuit board 27, it is difficult to reduce the thickness.

Therefore, as shown in FIG. 12, instead of the large dielectric substrate 24, dielectric substrate pieces 35a, 35b, 35c, which are provided with electrodes on the upper and lower surfaces and serve as capacitors, and a chip resistor 36, are used to assemble the center conductor. Product 34 and these dielectric substrate pieces and matching circuit elements such as chip resistors are connected to lower yoke 3.
7, the center circular part of the center conductor of the center conductor assembly 34 and the ground side electrode of the matching circuit element are connected to the lower yoke 3.
7 are connected to the electrodes in the resin case 38 by soldering, and assembled to connect the input / output terminals 34 c and 34 e of the center conductor of the center conductor assembly 34 to the dielectric substrate piece 3.
The other electrodes (upper electrodes) 5a and 35c are connected to the port electrodes 38a and 38b of the resin case 38. Also, the terminal 3 of the other center conductor of the center conductor assembly 34
4d is connected to the dielectric substrate piece 35b and the other electrode (upper electrode) of the chip resistor 36. Since the lower yoke 37 is connected to the electrode inserted on the inner surface of the resin case 38, the center circular portion of the center conductor and the ground-side electrode of the matching circuit element are connected to the ground terminal on the outer surface of the resin case. Become. The resin mold 33 is placed on this assembly, the permanent magnet 32 enters the central opening, and the upper yoke 31 is assembled from above. Resin mold 33
The center conductor assembly 34 can be inserted into the lower half of the center opening of the substrate, and three dielectric substrate pieces 35a, 35b, 35c and a chip resistor 36 are provided on the lower surface thereof.
And the resin mold 33 holds and positions the central conductor assembly 34 so as not to move. Further, the upper yoke 31 and the lower yoke 37 are combined so that a closed magnetic path is formed by these, the permanent magnet 32, and the ferrite of the center conductor assembly 34. The above-described chip resistor 36 is necessary when this non-reciprocal circuit device is used as an isolator, and when it is used as a circulator, the terminal 34d of the center conductor is an upper electrode and an input / output terminal (see FIG. (Not shown).

A dielectric substrate piece, a chip resistor, and a center conductor assembly, which are matching circuit elements, are mounted on a lower yoke, and each electrode on the lower yoke side is connected to the upper surface (inner surface) of the lower yoke. Is done.

At the time of this assembling, the matching circuit element piece and the center conductor assembly must be placed above (inside) the lower yoke and soldered. However, positioning is difficult, and many parts are not moved. , It is difficult to assemble and automatic assembling is difficult.

Therefore, in order to determine the positions of the chip capacitor and the chip resistor and the position of the center conductor assembly in the nonreciprocal circuit device, an electrode substrate on which the center conductor assembly rides over the center hole, and an electrode substrate thereon. Japanese Patent Application Laid-Open No. Hei 5-315814 discloses the use of a positioning member that can be placed on a vehicle. In this, there is a positioning member mounted on the electrode substrate so as to surround the center conductor assembly riding over the hole in the electrode substrate, and a concave portion for receiving chip capacitors and chip resistors is provided on the lower surface The central conductors, the terminals, and the respective elements are connected while the respective elements are covered with these concave portions.

[0009]

The non-reciprocal circuit device shown in FIG. 12 sometimes deviates from the place where the matching circuit device and the center conductor assembly are installed during the assembly. The non-reciprocal circuit element does not operate due to an accident such as the dielectric substrate piece contacting the ground side of the center conductor, the dielectric substrate pieces contacting each other, or the dielectric substrate piece riding on the input / output terminals. was there. In addition, the element piece may move, and the stray capacitance may fluctuate, leading to an increase in insertion loss.

In addition, such a movement of the element may occur when the non-reciprocal circuit element is mounted after the non-reciprocal circuit element is assembled, or when the non-reciprocal circuit element is overheated due to excessive power flow. Was lacking.

In the non-reciprocal circuit device described in the above publication,
It is believed that the position of each matching circuit element and center conductor assembly can be determined correctly. However, it is necessary to solder the electrodes and the center conductor of each matching circuit element between the electrode substrate and the positioning member to an electrode such as a port electrode of the electrode substrate, but this connection work is difficult. In addition, the positioning member has a concave part for receiving chip capacitors and chip resistors on the lower surface, so insert them from the bottom of the positioning member or insert the parts into the concave part with the lower surface of the positioning member facing up. Must be reversed after doing so. In addition, it is necessary to confirm whether each component is in contact with the electrode of the electrode substrate in the recess. As a result, the workability was not so much improved.

In particular, when the size of the nonreciprocal circuit element and the size of its components are reduced in order to reduce the size of the mobile communication device, the workability is degraded, and the problem of misalignment increases.

According to the present invention, it is possible to improve the reliability of the connection by preventing the displacement at the time of assembling and soldering while reducing the size of parts, and to improve the productivity and also suitable for the automation of assembling. And a non-reciprocal circuit device.

[0014]

The non-reciprocal circuit device of the present invention comprises an upper and lower yoke, a permanent magnet, a ferrite, and a center conductor.
And a matching circuit element connected to one end of a center conductor assembly in which a plurality of center conductors arranged in a crossed manner at predetermined intervals are arranged in an electrically insulated state with respect to the ferrite. The reversible circuit element has a resin case in which a base earth plate and a port electrode are cast-in with a resin and a partition made of the resin is provided on the base earth plate to form a cavity for receiving the center conductor assembly and the matching circuit element. the central conductor assembly and the matching circuit elements inserted respectively positioned in each cavity of the resin case, set one electrode of each matching circuit element to the bottom of the resin case
And connecting one end of each of the center conductors to the base earth plate or the lower yoke.
And the other end of the center conductor is an integral assembly connected to the other electrode of each matching circuit element and the port electrode.
It is characterized by having .

[0015] Of the port electrodes, a port for an input / output terminal
The electrode has a generally U-shaped cross section, with the upper surface inside and the side and lower surfaces
It is cast in and exposed to the outside of the resin case.
The other end of the center conductor is connected to the other electrode of the matching circuit element.
It is desirable to connect to the upper surface of the port electrode. Ma
In addition, the base earth plate and the port electrode for grounding are integrally formed.
It is desirable to form with a thin plate.

Preferably, each of the cavities is approximately the same size as the center conductor assembly and matching circuit element to be received. Preferably, one of the cavities to receive a matching circuit element is large enough to accommodate two matching circuit elements.

In the present invention, a permanent magnet is installed above, below, or above and below the center conductor assembly in order to apply a vertical magnetic field to the center conductor assembly, and has a high magnetic permeability such as soft iron. The upper yoke and lower yoke made of thin plates wrap the center conductor assembly and permanent magnets to provide electric and magnetic shielding, and increase the magnetic field strength applied to ferrites such as garnet in the center conductor assembly as a closed magnetic path At the same time, it stabilizes the magnetic field. The resin case can be mounted on the upper side of the lower yoke, and the lower yoke can be mounted on the inner side of the resin case.

In addition, a resin mold having an opening for inserting a permanent magnet in the center thereof is installed from the position where the center conductor assembly and the matching circuit element are inserted, positioned and connected in each cavity of the resin case, and these are stably placed. It is preferable to hold.

The resin of the resin case is preferably a resin which can be injection molded and has heat resistance. Thermoplastic resins such as polyimide, polyamide, polytetrafluoroethylene, polyester, PEEK, and PPS; thermosetting resins such as phenolic resins and epoxy resins; and glass fibers and asbestos in these resins to improve heat resistance. Can be used.
Particularly preferred are liquid crystal aromatic polyesters, Sumitomo Super ™ LCP E5000, E from Sumitomo Chemical.
Sold in the 4000, E6000, and E7000 series are solder baths with a temperature of 280 ° C or higher.
Withstand more than a second. It has heat resistance to withstand temperatures of 260 to 280 ° C or more for 2 minutes or more, and has excellent solvent resistance to withstand solder cleaning agents. In addition, resin enters into narrow parts during molding, and is excellent in molding accuracy. Things are desirable.

[0020]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view of a non-reciprocal circuit device according to one embodiment of the present invention. FIG. 2 is the non-reciprocal circuit device of FIG. 1 in which a matching circuit device and a center conductor assembly are inserted and assembled in a resin case. FIG. 3 is a perspective view, and FIG.
It is Z 'sectional drawing. 4A is a plan view, FIG. 4B is a right side view of a resin case used for the non-reciprocal circuit device of FIG.
(C) the positive plane view, a, (d) a bottom view, FIG. 5 4
It is XX 'sectional drawing of (a). 6 and 7 are plan views of modified examples of a resin case that can be used for the non-reciprocal circuit device of FIG. FIG. 8 is an exploded perspective view of a non-reciprocal circuit device according to another embodiment of the present invention. FIG. 9 is a plan view of a resin case used for the non-reciprocal circuit device of FIG. FIG, (c) a positive plane view, a, (d) a bottom view, FIG. 10
FIG. 10 is a sectional view taken along the line YY ′ of FIG.

First, referring to FIGS. 1 to 5, reference numeral 1 denotes an upper yoke made of a material having a high magnetic permeability such as soft iron, which also serves as a lid of a lower yoke 8 made of a material having a high magnetic permeability such as soft iron. . 2 is a cylindrical permanent magnet such as a hard ferrite magnet magnetized in the axial direction, 3 is a resin mold having an opening in the center for receiving the cylindrical permanent magnet, and 4 is a center conductor assembly. The center conductor assembly 4 includes a strip line center conductor protruding from the disc-shaped center circular portion made of an electric conductor material such as copper at the same outer diameter direction (usually at 120 ° intervals). It is folded in a cross shape and wraps around a ferrite made of a material such as a columnar garnet, and the central conductors are electrically insulated. The distal ends of the center conductors 4a and 4b are electrode terminals 4c, 4d and 4e. Dielectric substrate piece 5 having electrodes attached to upper and lower surfaces as matching circuit element
a, 5b, 5c and a chip resistor 6 having electrodes on the upper and lower surfaces and one side surface and functioning as a resistor between one of the electrodes on the upper surface and the electrode on the lower surface.

Reference numeral 7 denotes a resin case in which the port electrodes 7a and 7b for input / output terminals, the port electrodes 7c and 7d for grounding, and the base earth plate 7e forming the bottom of the case are cast with heat-resistant resin. It is molded. Port electrodes 7a, 7b,
Each of the base plates 7c and 7d and the base ground plate 7e is made of a thin sheet of a good electrical conductor such as copper or a copper alloy. After injection molding with heat-resistant resin and casting, the unnecessary portion of the thin plate is removed to form the resin case 7. In the case of an isolator, the base earth plate 7e
And the grounding port electrodes 7c and 7d are integrated.
When one of the port electrodes 7c and 7d is one of the input / output terminals as in a circulator, the port electrode serving as the input / output terminal is not connected to the base earth plate, and the center conductor assembly In order to connect the terminal 4 d of the center conductor of the product 4, it is connected to another terminal provided on the resin case 7.

The port electrodes 7a, which are input / output terminals,
As can be seen from the cross-sectional view of FIG. 5, 7b is continuously and integrally formed with the terminal provided in the resin case 7 for connecting the terminals 4e and 4c of the center conductor of the center conductor assembly 4.
The resin case 7 includes outer walls and inner partitions 7f, 7g, 7
h, which are preferably formed of a heat-resistant resin. Outer wall and partition 7f, 7g, 7
h forms a cavity for receiving the center conductor assembly 4 and the matching circuit element, with the base ground plate being the bottom of each cavity. As can be seen from the perspective view of the assembly of FIG. 2, each cavity has a central conductor assembly 4, a dielectric substrate piece 5a,
5b and 5c and the chip resistor 6 enter. In the plan view of FIG. 4A, a cavity above the partitions 7f and 7g contains a dielectric substrate piece 5b and a chip resistor 6. The size, especially the width, of these cavities is almost the same as the size of the center conductor assembly and matching circuit element to be put in each cavity, and these parts are easily inserted into the cavities and can be fully inserted, It is preferable not to move after assembling.

The center conductor assembly 4 and the matching circuit element thus inserted and assembled in the resin case 7 are connected with their lower electrodes by soldering which is previously attached to the base earth plate. The terminal 4e of the center conductor is connected by soldering to the upper electrode of the dielectric substrate piece 5c and the electrode in the case continuous from the port electrode 7a, and the terminal 4c of the center conductor is connected to the upper electrode of the dielectric substrate piece 5a and The port electrode 7b is connected by solder to an electrode in the case that is continuous, and the terminal 4d of the center conductor is connected by solder to the dielectric substrate piece 5b and the upper electrode of the chip resistor 6.

A resin case 7 in which a center conductor assembly 4 and a matching circuit element are assembled and connected is mounted on a lower yoke 8, and a resin mold 3, a permanent magnet 2, and an upper yoke 1 are assembled thereon to form a nonreciprocal circuit element.

As described above, a partition is provided in a resin case in which a base earth plate and a port electrode are cast, a cavity is formed between the partitions, and a center conductor assembly and a matching circuit element are incorporated and connected in the cavity. The workability of the assembly is good. Since all operations can be performed from the top of the case, it is suitable for machine assembly. In addition, since the movement of the components is stopped by the partition, displacement during assembly or mounting can be prevented, and the reliability of connection can be improved. In addition, since the electrode terminals and the base function are integrated, the thickness and size can be reduced.

The resin case shown in a plan view in FIG. 6 is a modified example which can be used for the non-reciprocal circuit device of the above-described embodiment. The port electrodes 7a1, 7b1, 7c1, and 7d1 are all located at the same positions as those above. Although the partition is cut in the middle in the above example, in FIG. 6, since the partition is continuous, it is more effective for positioning of components and ensuring insulation.

The resin case shown in the plan view of FIG. 7 is a modified example that can be used for the non-reciprocal circuit device of the above-described embodiment. The port electrodes 7a2, 7b2, 7c2, 7d2 are all located at the same position as above. Dielectric substrate piece 5
a, 5c are received by the port electrodes 7a2, 7b.
2 and between the electrode in the case and the cavity for receiving the center conductor assembly.
a and 5c can function as ideal capacitances, and can further reduce the loss.

The non-reciprocal circuit device shown in FIGS. 8 to 10 is another embodiment of the present invention. Here, 11 is the upper yoke, 12
Is a cylindrical permanent magnet, 13 is a resin mold, 14 is a center conductor assembly, 15a, 15b and 15c are dielectric substrate pieces, 1
6 is a chip resistor, 17 is a lower yoke, and 18 is a resin case. Terminals such as the center conductors 14a and 14b of the center conductor assembly 14 are 14e, 14c and 14d. Resin case 1
Reference numeral 8 denotes port electrodes 18a and 18b serving as input / output terminals, port electrodes 18c and 18d serving as ground terminals, and port electrodes 1
A base earth plate 18e connected to the base plates 8c and 18d and an electrode in the case connected to the port electrodes 18a and 18b are molded by casting with heat-resistant resin.
f, 18h, 18i, and 18j are formed therebetween, and a cavity for receiving the center conductor assembly 14, the dielectric substrate piece serving as a matching circuit element, and the chip resistor 16 is formed therebetween. Since the non-reciprocal circuit device of this embodiment is substantially the same as that shown in FIGS. 1 to 5 described above, detailed description will be omitted.

However, the lower yoke 17 enters the resin case 18 and the center conductor assembly 14 and the matching circuit element are placed thereon. For this reason, since the resin case 18 is located at the lowest position, the degree of freedom in designing the terminal shape on the back surface of the non-reciprocal circuit device is large.

[0031]

According to the non-reciprocal circuit device of the present invention, a resin case having a cavity for receiving the center conductor assembly and the matching circuit device is used, and this resin case is formed by casting a base earth plate and a port electrode integrally. Therefore, the thickness and size of the non-reciprocal circuit device can be reduced. Also, since the resin case has a partition on the base earth plate to separate the center conductor assembly and the cavity for receiving the matching circuit element, the workability (productivity) can be improved, and the mounting and assembly of parts can be improved. It is also suitable for automation. In particular, it is preferable that a cavity for receiving the component is provided on one side of the base earth plate, in which case the component can be inserted and heated on a resin case placed underneath, and the assembly and bonding can be performed. It will be suitable for. In addition, since the partition is provided between the components, it is possible to prevent the displacement of the components during the assembling and the mounting, so that the reliability of the connection can be improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a non-reciprocal circuit device according to one embodiment of the present invention.

FIG. 2 is a perspective view of the non-reciprocal circuit device of FIG. 1, in which a matching circuit device and a center conductor assembly are inserted and assembled in a resin case.

FIG. 3 is a sectional view taken along the line ZZ ′ of FIG. 2;

[4] (a) a plan view of that the resin case used in the non-reciprocal circuit device of FIG. 1, (b) a right side view, (c) positive elevational view,
(D) is a bottom view.

FIG. 5 is a sectional view taken along line XX ′ of FIG.

FIG. 6 is a plan view of a modified example of a resin case that can be used for the non-reciprocal circuit device of FIG. 1;

FIG. 7 is a plan view of another modification of the resin case that can be used for the non-reciprocal circuit device of FIG. 1;

FIG. 8 is an exploded perspective view of a non-reciprocal circuit device according to another embodiment of the present invention.

[9] (a) a plan view of that the resin case used in the non-reciprocal circuit device of FIG. 8, (b) a right side view, (c) positive elevational view,
(D) is a bottom view.

FIG. 10 is a sectional view taken along the line YY ′ of FIG.

FIG. 11 is an exploded perspective view of an example of a conventional non-reciprocal circuit device.

FIG. 12 is an exploded perspective view of another conventional non-reciprocal circuit device.

[Explanation of symbols]

2, 12, 22, 32: permanent magnets 4, 14, 23, 34: center conductor assembly 4a, 4b, 14a, 14b, 34a, 34b: center conductor 4c, 4d, 4e, 14c, 14d, 14e, 23a,
23b, 34c, 34d, 34e: Terminal 7, 18: Resin case 7a, 7b, 7c, 7d, 7a1, 7b1, 7c1, 7
d1, 7a2, 7b2, 7c2, 7d2, 18a, 18b, 18c, 18d: Port electrode 7e, 18e: Base earth plate 7f, 7g, 7h, 18f, 18h, 18i, 18j:
Partitions 5a, 5b, 5c, 15a, 15b, 15c: Dielectric substrate pieces 6, 16, 36: Chip resistors

────────────────────────────────────────────────── ─── Continued from the front page (72) Koji Ichikawa, Inventor 5200, Sankajiri, Kumagaya-shi, Saitama Hitachi Metals, Ltd. Magnetic Materials Research Laboratory (56) References JP-A-6-252611 (JP, A) JP-A-7- 231207 (JP, A) Japanese Utility Model Hei 5-93105 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01P 1/36 H01P 1/383 H01P 11/00

Claims (5)

(57) [Claims] 1. An upper and lower yoke, a permanent magnet, and a ferrite.
And a center conductor, wherein the matching circuit element is connected to one end of a center conductor assembly in which a plurality of center conductors arranged in a crossing manner at predetermined intervals are arranged in the ferrite in an electrically insulated state. When the base earth plate and the port electrode are cast with resin
Moni base grounding the on board a partition of a resin provided has a resin case forming a cavity for receiving a matching circuit element each and the central conductor assembly, the central conductor assembly and the matching circuit to each cavity of the resin case the element inserted position respectively, with connecting one of the electrodes of the respective matching circuit element to the base ground plate provided in the bottom of the resin case, the one of the center conductor
Connect the end to the base earth plate or lower yoke,
A non-reciprocal circuit device, characterized in that the other end of the center conductor has an integral assembly connected to the other electrode of each matching circuit device and the port electrode. 2. A port for an input / output terminal among said port electrodes.
The gate electrode has a generally U-shaped cross section, with the top inside and the side and bottom
Is cast so that it is exposed to the outside of the resin case,
Connect the other end of the center conductor to the other electrode of the matching circuit element.
2. The non-reciprocal circuit device according to claim 1, wherein the non-reciprocal circuit device is connected to the upper surface of the port electrode . 3. The base grounding plate and a port for grounding.
3. The non-reciprocal circuit device according to claim 1 , wherein the poles are formed of an integral thin plate . 4. The non-reciprocal circuit device according to claim 1, wherein each of the cavities is substantially the same size as a center conductor assembly to be received and a matching circuit device. 5. The method of claim 1, wherein one of said cavities to receive a matching circuit element is large enough to accommodate two matching circuit elements.
3. The non-reciprocal circuit device according to 3 or 4.