JP3296348B2 - Projection exposure apparatus and method, and method for manufacturing semiconductor element - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an illumination optical apparatus for uniformly illuminating a surface to be irradiated, and more particularly to an illumination optical apparatus suitable for an exposure apparatus for manufacturing semiconductors.

[0002]

2. Description of the Related Art Conventionally, the manufacture of semiconductor devices such as LSIs and VLSIs has been performed by a projection exposure apparatus that reduces and projects a circuit pattern formed on a reticle onto a wafer via a projection lens. However, there is a strong desire to transfer a finer pattern onto a wafer, and great efforts have been made to meet this demand. For example, efforts have been made to improve the resolving power of the projection lens due to the shortening of the wavelength of the exposure light and the increase in the numerical aperture (hereinafter, referred to as NA) of the projection lens.
Projection lenses that exceed the standard are realized.

In addition, efforts are being made to improve the resolution and depth of focus of the projection lens by optimizing the illumination conditions based on the minimum line width of the pattern to be exposed. For example, in Japanese Patent Application Laid-Open No. 59-155843, an appropriate balance between the resolution and the contrast of a predetermined pattern is obtained by optimizing the ratio of the NA of the illumination optical system to the NA of the projection lens, that is, the σ value. What has been proposed.

In recent years, a fly-eye lens provided in an illumination optical system for exposure has been developed.
Attempts have been made to further improve the resolving power and depth of focus of the projection lens by changing the shape of the secondary light source, for example, proposed in Japanese Patent Application Laid-Open No. 61-91622. According to this publication, the central portion of the fly-eye lens forming the secondary light source on the emission side is shielded from light by an aperture, and an eccentric light source is formed. Significant improvements have been made.

[0005]

Generally, in this type of illumination optical apparatus for exposure, when a fine pattern is transferred onto a wafer, a mask (or reticle) as an irradiated surface is used to improve throughput. Requires uniform illumination under a higher illuminance. However, JP-A-61-9
In the lighting device proposed in Japanese Patent No. 1622, a ring-shaped 2
In order to obtain the next light source, a stop for shielding the central portion on the emission side of the fly-eye lens is arranged. For this reason, the total amount of irradiation light decreases, and the illuminance on a mask (hereinafter, referred to as a reticle) as a surface to be irradiated is significantly reduced.

As a result, there has been a problem that the exposure time is prolonged and a decrease in throughput is unavoidable. The present invention overcomes the above-mentioned problems and shields the annular secondary light source from any light.
With high illumination efficiency,
By making the size of the secondary light source and the ring zone ratio variable, the reticle R
Top pattern on wafer with optimal line width and depth of focus
It is intended to be transcribed .

[0007]

Means for Solving the Problems To achieve the above object,
For example, the projection exposure apparatus according to one aspect of the present invention includes a projection exposure apparatus.
Light source means for supplying light, and the exposure from the light source means
Optical forms multiple secondary light sources with light
An integrator and the plurality of optical integrators
Light from multiple secondary light sources formed by
Condenser light that focuses and illuminates the reticle surface in a superimposed manner
Science system and projecting the reticle pattern on the wafer
A projection optical system comprising: a projection optical system;
Between the means and the optical path of the optical integrator,
Orbicular light beam converting means for converting the exposure light into an orbicular light beam
The orbicular luminous flux converting means shields the exposure light.
First optical member for converting into a first annular light beam without the need
To form a second annular luminous flux without blocking the exposure light.
A second optical member for converting, the first and second optical members
The member is provided so as to be insertable into the optical path of the exposure light,
The ring-shaped luminous flux converting means exchanges the first and second optical members.
Depending on the ratio of inner diameter to outer diameter
The switching of the luminous flux is performed.

[0008] To achieve the above object, another aspect of the present invention is described.
The projection exposure method according to the aspect,
And exposing the exposure light from the light source means to optical
Lead to the integrator to form multiple secondary light sources,
The light beams from the plurality of secondary light sources are condensed to form a reticle surface.
Illuminating the reticle pattern on the wafer
Using a first optical member.
Without blocking the exposure light from the light source means.
The optical inte- grate is converted into a ring-shaped luminous flux.
A first step of leading to the first optical member and a first step different from the first optical member.
(2) The exposure light from the light source is blocked by using an optical member.
A second different from the first annular luminous flux without illuminating;
The optical integrator converts the light into an annular light flux
And a second step of guiding the light to the first annular light flux and the second annular light flux.
The ratio of the inner diameter to the outer diameter of the second annular light flux is mutually different.
Differently, the first and second optical members are exchanged to replace the annular zone.
The method further comprises a step of switching the shape light beam.

In order to achieve the above object, the present invention
Further, a projection exposure apparatus according to another aspect illuminates a reticle.
Light source means for supplying exposure light for performing
A projection optical system for projecting the pattern on the wafer.
What is claimed is: 1. A shadow exposure apparatus, comprising:
Optical integrator placed in the optical path of light
And the light source means and the optical integrator
And converts the exposure light into an annular light flux.
Ring-shaped luminous flux converting means for changing the optical
Means for guiding exposure light from a Greater to the reticle.
The annular luminous flux converting means shields the exposure light.
A first optical member for converting the light into a first annular light beam;
Converting the exposure light into a second annular luminous flux without blocking the exposure light
The first and second optical members.
Is provided so as to be insertable into the optical path of the exposure light, and
The belt-like light beam converting means is provided by replacing the first and second optical members.
Thus, annular light with different ratios of inner diameter to outer diameter
The bundle is switched.

[0010] In order to achieve the above object, the present invention has been described.
The projection exposure method according to still another aspect includes a light source
The reticle is illuminated by the exposure light from the
Exposure to project the reticle pattern onto the wafer
A method, comprising using a first optical member to generate light from the light source means.
Is converted into the first annular luminous flux without blocking the exposure light of
A first step of leading to an optical integrator by
The light source using a second optical member different from the first optical member
The first ring without blocking the exposure light from the means
The light is converted into a second annular luminous flux different from the zonal luminous flux, and
The second step leading to the optical integrator
The outer diameters of the first annular light flux and the second annular light flux are different from each other.
The ratio of the inner diameter to the inner diameter differs from each other, and the first and second light
The step of switching the annular light flux by replacing the
And so on.

In the apparatus according to the present invention, the exposure light from the light source can be converted into the annular light beam without any interruption by the operation of the annular light beam converting means. It can be formed. Therefore, the reticle as the surface to be irradiated can be illuminated under high illuminance, so that the throughput does not decrease.

The annular light beam converting means has a first optical member for converting the exposure light into a first annular light beam and a second optical member for converting the exposure light into a second annular light beam. By providing the plurality of optical members interchangeably, it is possible to change the ratio of the inner diameter to the outer diameter of the orbicular light beam, that is, the so-called orbicular zone ratio, with high illumination efficiency.

Therefore, since a secondary light source having an arbitrary ring zone ratio can be formed, a pattern on a reticle can be transferred onto a wafer with an optimum line width and depth of focus.

[0014]

1 shows a configuration according to a first embodiment of the present invention. In FIG. 1, (A) shows a first annular luminous flux conversion state, and (B) shows a second annular luminous flux. The conversion state is shown. Hereinafter, the first embodiment will be described in detail with reference to FIG. As shown in FIG. 1A, a substantially parallel light beam is supplied from the light source unit 1. The light source unit 1 has a mercury arc lamp, an elliptical mirror, and a collimator lens, and light from the mercury arc lamp (for example, light such as g-line (436 nm) and i-line (365 nm)).
Is condensed by an elliptical mirror and then converted into a parallel light beam by a collimator lens. In addition, the light source unit 1 includes a KrF
And a beam expander for shaping the beam diameter, and supplying a collimated light beam from the excimer laser light source via the beam expander.

The substantially parallel light beam supplied from the light source unit 1 is:
As shown by oblique lines, the light passes through the first prism member 20 and is converted into an annular parallel light beam. The first prism member 20 has a concave conical refracting surface on the incident side and a convex conical refracting surface on the exit side, and as shown in FIG. It is provided so as to be replaceable with the member 21. The second prism member 21 has a concave conical refracting surface on the incident side and a convex conical refracting surface on the exit side, and has a smaller axial thickness (distance between vertices) than the first prism member 20. It is configured as follows.

The annular parallel light flux of FIG. 1A converted by the first prism member 20 is compared with the annular parallel light flux of FIG. 1B converted by the first prism member 20. Although the width of the band is constant, the outer diameter of the annular parallel light beam is largely converted. For this reason, each prism member (2
Assuming that the inner and outer diameters of the annular parallel light beam formed by (0, 21) are r ₁ and r ₂ , respectively, the annular parallel light beam converted by the first prism member 20 shown in FIG. The ring ratio (r ₁ / r) is larger than the ring-shaped parallel light flux converted by the second prism member 21 shown in FIG.
r ₂ ) becomes smaller. Therefore, each prism member (20,
It can be seen that the ring zone ratio can be made variable by inserting 21) into the optical path. In the present embodiment, the first prism member 20 and the second prism member 21 constitute the orbicular luminous flux conversion unit 2.

Returning to FIG. 1A, the light beam converted into an orbicular parallel light beam having a predetermined orbicular ratio by the first prism member 20 is formed into an orbicular shape by a fly-eye lens 3 as an optical integrator. A plurality of secondary light sources are formed. The fly-eye lens 3 is constituted by an aggregate of a plurality of rod-shaped lens elements. A secondary light source image is formed, where a substantially annular surface light source is formed. Therefore, the diameter of the parallel luminous flux incident on the fly-eye lens 3 and the ring ratio change by replacing the prism members (20, 21), so that the size and the ring ratio of the secondary light source image in the ring shape are reduced. Be variable.

At a position on the exit side of the fly-eye lens 3 where the annular secondary light source image is formed, there is provided aperture stop means 4 for accurately defining an annular parallel light beam.
The aperture stop means 4 has aperture stops 41 and 42 having a predetermined ring-shaped aperture.
In conjunction with insertion into the prism member 21, the second exchange means 11 is provided so as to be exchangeable with the aperture stop 42 having another annular shape and an annular ratio by the second exchange means 11.

The luminous flux from the secondary light source in the form of an annular zone via the aperture stop 41 is condensed by the condenser lens 5 as shown by oblique lines, and overlaps the pattern area on the reticle R from an oblique direction. Illuminate uniformly. Then, a circuit pattern image on the reticle R is formed on the wafer W by the projection lens 6 (projection optical system). Accordingly, the resist applied on the wafer W is exposed, and the circuit pattern image of the reticle R is transferred here. An aperture stop 6a having a variable aperture is provided at a pupil (entrance pupil) position of the projection optical system 6, and the aperture stop 6a is set to a predetermined aperture by the aperture variable means 12. The aperture stop 6a is provided conjugate with the aperture stop 6 provided on the exit side of the fly-eye lens 3, as shown by the dotted line in FIG.

Next, the operation according to the present embodiment will be described. First, when information relating to various reticles R to be sequentially exposed is input via input means 14 such as a keyboard, the input information is transmitted to the control means 13. Is input to This control means 13 provides an optimum line width for various reticles,
Information such as depth of focus is stored in the internal memory,
First exchange means 10, second exchange means, and diameter varying means 12
Control.

The first exchange means 10, the second exchange means and the aperture varying means 12 include a drive system therein.
Based on the control signal from the control means 13, the optimum line width,
Prism members (20, 21) and aperture stops (40, 41) for annular illumination of reticle R with depth of focus
Is selectively set, and the aperture of the aperture stop 6 is set.

A mark such as a bar code including information such as an optimum line width and depth of focus is formed outside the pattern area of the reticle R, and a mark detecting means for detecting the mark is provided by a peripheral portion where the reticle R is set. And the detection information may be directly input to the control means 13. Thus, the prism members (20, 21) are appropriately replaced,
By changing the size of the annular secondary light source formed on the exit side of the fly-eye lens 3 and the annular ratio to change the annular illumination (or oblique illumination) state, the pattern on the reticle R is optimized. It can be transferred onto a wafer under an appropriate line width and depth of focus.

Here, in order to sufficiently bring out the effect of the annular illumination obtained by the above configuration, the fly-eye lens 3 is required.
D ₁ the inner diameter of the secondary light source of the annular shape formed on the exit side of,
When the outer diameter of the ring-shaped secondary light source formed on the exit side of the fly-eye lens 3 is d ₂ , the ring zone satisfies 1/3 ≦ d ₁ / d ₂ ≦ 2/3 (1) It is desirable to set the beam diameter. As a result, the depth of focus of the projection optical system is improved, and a practical improvement in resolution is achieved.

If the lower limit of the condition (1) is exceeded, the inner diameter of the annular light source becomes too small, the effect of the annular illumination according to the present invention is weakened, and it is difficult to improve the depth of focus and the resolution of the projection optical system. Becomes Conversely, when the value exceeds the upper limit of the condition (1), the line width transferred onto the wafer differs depending on the presence or absence of the periodicity even on the reticle even if the pattern has the same line width, and the reticle pattern can be faithfully transferred onto the wafer. Disappears. Further, since the amount of change in the line width with respect to the change in the exposure amount becomes large, it becomes difficult to form a pattern having a desired line width on the wafer.

Furthermore, in order to maximize the effect of the annular illumination of the present invention, the numerical aperture of the reticle R of the projection lens 3 is determined by NA ₁ and the outer diameter of the secondary annular light source. When the numerical aperture of the illumination optical system is NA ₂ , it is desirable that the following condition (2) is satisfied. 0.45 ≦ NA ₂ / NA ₁ ≦ 0.8 (2) When the lower limit of the condition (2) is exceeded, the angle of incidence of light for obliquely illuminating the reticle by the annular illumination is reduced, and the annular illumination according to the present invention is performed. Can hardly obtain the effect of. For this reason, it is meaningless to perform annular illumination.
Conversely, when the value exceeds the upper limit of the condition (2), the resolution as an aerial image is improved, but the depth of focus is reduced. Moreover,
This is not preferable because the contrast at the best focus is greatly reduced.

As described above, in the first embodiment shown in FIG. 1, in order to form an annular parallel light beam, the annular light beam converting member has a concave conical refracting surface on the incident side and a convex surface on the exit side. The prism members (20, 21) having a conical refracting surface and having different axial thicknesses are exchangeably provided.
As shown in FIG. 6, a prism member 20 having convex conical refraction surfaces on the entrance side and exit side (see FIG. 4A), and a conical refraction surface having a different axial thickness from the entrance side and exit side and convex on the entrance side and exit side. May be provided so as to be interchangeable with each other (see FIG. 4B). Furthermore, a prism member having a concave conical refraction surface on the entrance side and a convex conical refraction surface on the exit side, and a prism member having convex conical refraction surfaces on the entrance side and the exit side can be exchanged. May be provided.

In this embodiment shown in FIG. 1, two prism members are provided so as to be interchangeable with each other. However, two or more prism members may be provided so as to be interchangeable. Ordinary lighting may be performed without being inserted into the inside. Next, a second embodiment according to the present invention will be described with reference to FIG. In the present embodiment, the difference from the first embodiment is that the annular light beam conversion unit 2 is constituted by two prism members with variable intervals.
The point is that the annular ratio of the annular parallel light flux is continuously changed. In FIG. 2, members having the same functions as those in FIG. 1 are denoted by the same reference numerals.

As shown in FIG. 2, the orbicular luminous flux conversion unit 2
A first prism member 22 having a concave conical refracting surface on the incident side and having a flat surface on the exit side, and a second prism member 2 having a flat surface on the incident side and having a convex conical refracting surface on the exit side.
The two prisms are provided so as to be movable by an interval varying means 15. The variable interval means 15 includes a drive system, and is controlled by the control means 13 as in the first embodiment shown in FIG.

Here, both prism members (22, 2)
When the interval of 3) is increased, as shown in FIG. 2A, the parallel luminous flux from the light source unit 1 incident thereon becomes an orbicular parallel luminous flux having a small orbital ratio due to an increase in the outer diameter of the orbicular luminous flux. When the distance between the two prism members (22, 23) is reduced, the parallel light beam from the light source unit 1 incident on the prism member (22, 23) has a small outer diameter of the annular light beam, as shown in FIG. As a result, the light is converted into a ring-shaped parallel light beam having a large ring ratio.

Therefore, by appropriately changing the distance between the prism members (22, 23), the size and the annular ratio of the annular secondary light source formed on the exit side of the fly-eye lens 3 are continuously changed. Then, when the annular illumination (or oblique illumination) state is changed, the pattern on the reticle R can be transferred onto the wafer with an optimum line width and focal depth. Note that also in the present embodiment, the above-mentioned condition (1) is satisfied.
It is desirable that the light flux should be an annular luminous flux that satisfies the condition (2).

As shown in FIG. 5A, the first prism member 22 and the second prism member 23 as the orbicular luminous flux conversion section 2 of the present embodiment are arranged with their respective directions reversed. The distance between the two members may be changed. In this case, as shown in FIG. 5B, if the two prism members are brought close to each other until the interval between them completely disappears, normal illumination can be performed.

The shapes of the first and second prism members are not limited to those described above. As shown in FIG. 6, the second prism member has a convex conical refracting surface on the incident side and a flat surface on the exit side. The second prism member may be configured to have a flat surface on the incident side and a convex conical refracting surface on the exit side. Further, as shown in FIG. May be reversed.

Next, a third embodiment of the present invention will be described with reference to FIG. The present embodiment is different from the second embodiment in that an afocal variable power optical system 30 is disposed between two prism members as the orbicular luminous flux conversion unit 2 and the fly-eye lens 3 so as to provide an orbicular luminous flux. Is that the radius (outer diameter) of the orbicular zone light beam is made continuously variable in addition to continuously changing the orbicular zone ratio. In FIG. 3, members having the same functions as those in FIG. 1 are denoted by the same reference numerals.

As shown in FIG. 3, the afocal variable power optical system 30 includes, in order from the light source side, a first group 30a having a positive refractive power;
It is composed of a second group 30b having a negative refractive power and a third group 30b having a positive refractive power. The second group 30b and the third group 30b are
The second group 30b and the third group 30b are moved by the magnification changing means 31. Note that the scaling means 31 includes a drive system, and like the first embodiment shown in FIGS. 1 and 2,
It is controlled by the control means 13.

Here, when the distance between the second group 30b and the third group 30b is increased (maximum magnification state), as shown in FIG. 3A, the annular parallel light flux incident thereon becomes the annular light flux. The light beam is converted into a light beam having a large outer diameter, and
When the distance from the group 30b is reduced (in the minimum magnification state), FIG.
As shown in (B), the annular luminous flux incident thereon is
The annular light beam is converted into a light beam having a small outer diameter.

Accordingly, by appropriately changing the distance between the second group 30b and the third group 30b, that is, by changing the afocal variable power optical system 30, the secondary light source in the form of an annular zone formed on the exit side of the fly-eye lens 3 can be obtained. The outer diameter can be continuously changed, and the annular zone ratio of the annular secondary light source formed on the exit side of the fly-eye lens 3 can be changed by appropriately changing the interval between the prism members (22, 23). It can be changed continuously. Therefore, the annular ratio of the annular secondary light source and the size (outer diameter) of the annular secondary light source can be continuously and independently controlled, so that the optimal annular illumination (or inclined illumination) state can be freely set. The degree improves. As a result, the pattern on the reticle R can be transferred onto the wafer under a more optimal line width and depth of focus. At this time, also in the present embodiment, it is desirable to change the annular luminous flux so as to satisfy the above-described conditions (1) and (2).

It is needless to say that the afocal variable power optical system 30 of the present embodiment can be applied to the embodiments shown in FIGS. FIG. 8 shows an example of a specific switching mechanism of the aperture stop means 4 provided on the exit side of the fly-eye lens 3 of each embodiment shown in FIGS.
This will be described with reference to FIG.

As shown in FIG. 8, on a circular substrate 400, eight types of diaphragms having transmission areas indicated by oblique lines are provided along the circumferential direction.
Is rotatable about O so that one of the stops is located in the illumination light path. On this substrate 400, three kinds of ring-shaped diaphragms having different ring ratios are formed. The diaphragm 401 has a ring-shaped transmission region having a ring ratio of r ₁₁ / r _21. Has a ring-shaped transmission region having a ring ratio of r ₁₂ / r ₂₂ , and the aperture 405 is provided with r ₁₃ / r _21.
Has a ring-shaped transmission region having a ring-shaped ratio of.

A diaphragm for efficiently forming four eccentric light sources under three different ring zone ratios is formed on the substrate 400, and the diaphragm 402 has a ring of r ₁₁ / r ₂₁ . The aperture 404 has four apertures in the luminous flux with an orbital ratio of r ₁₂ / r ₂₂ ,
The diaphragm 406 has four apertures in the annular light flux having an annular ratio of r ₁₃ / r ₂₁ .

[0040] Further, the substrate 400 on the two diaphragm usually circular bore for performing the illumination is formed, the diaphragm 407 has a circular diameter of 2r _22, aperture 408 is 2r _{It has 21} circular apertures. Therefore, if one of the apertures 401, 403, and 405 is selected and positioned in the illumination optical path, annular luminous fluxes having three different annular zone ratios can be accurately defined (restricted), and the apertures 402, 404 can be defined. And 406 are selected and positioned in the illumination optical path, four eccentric light sources can be efficiently formed under three different ring zone ratios. This makes it possible to perform efficient inclined illumination. Also, the aperture 40
If one of 7 and 408 is selected and positioned in the illumination light path, normal illumination with different σ values can be performed.

FIG. 8 illustrates an example of a turret type switching mechanism in which a plurality of diaphragms are provided along the circumferential direction on the circular substrate and the diaphragm is arbitrarily selected. Aperture stop 41 provided in
May not be exchangeable with the aperture stop 42, but may be provided so that the aperture of the aperture stop 41 itself can be changed. Although the fly-eye lens is used as a means for forming the secondary light source in each of the embodiments shown in FIGS. 1 to 3, a rod-shaped optical member (rod-shaped optical integrator) may be used.

[0042]

As described above, according to the present invention, an annular secondary light source can be formed without any light shielding, and the illuminated surface can be uniformly illuminated with high illumination efficiency . In addition, since the size and annular ratio of the annular secondary light source can be varied under a high illumination efficiency, the pattern on the reticle R can be formed on the wafer under the optimal line width and focal depth. Can be transferred on top.

According to the device shown in the third embodiment,
Since the annular ratio and the size of the annular secondary light source can be independently varied, the degree of freedom in setting the optimal annular illumination (or oblique illumination) state is improved. As a result, the pattern on the reticle R can be transferred onto the wafer under a more optimal line width and depth of focus.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a first embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a second embodiment of the present invention.

FIG. 3 is a diagram showing a configuration of a third embodiment of the present invention.

FIG. 4 is a view showing a modification of the first and second prism members according to the first embodiment of the present invention.

FIG. 5 is a view showing a first modification of the first and second prism members according to the second embodiment of the present invention.

FIG. 6 is a view showing a second modification of the first and second prism members according to the second embodiment of the present invention.

FIG. 7 is a view showing a third modification of the first and second prism members according to the second embodiment of the present invention.

FIG. 8 is a diagram showing an example of an aperture stop switching mechanism provided on the exit side of the fly-eye lens 3;

[Explanation of Signs of Main Parts]

 DESCRIPTION OF SYMBOLS 1 ... Light source part 2 ... Ring light beam conversion part 3 ... Fly-eye lens 4, 6a ... Aperture stop 5 ... Condenser lens 6 ... Projection lens R ... Reticle W ...・ Wafer

Claims (22)

(57) [Claims] 1. A light source means for supplying exposure light, an optical integrator forming a plurality of secondary light sources by the exposure light from the light source means, and a plurality of secondary light sources formed by the plurality of optical integrators. A condenser optical system for condensing a light beam from a typical light source and illuminating a reticle surface in a superimposed manner, and a projection optical system for projecting the reticle pattern onto a wafer. the optical path between the optical integrator, the annular light beam converting means for converting the exposure light zonal light beam provided該輪band light beam converting means, possible to shield the exposure light
A first optical member that converts the exposure light into a second annular light beam without blocking the exposure light, and wherein the first and second optical members are , Provided in the optical path of the exposure light so as to be insertable, and wherein the orbicular luminous flux converting means is provided for intersecting the first and second optical members.
In this way, rings with different ratios of inner diameter to outer diameter
A projection exposure apparatus for switching a belt-like light beam . 2. The projection exposure apparatus according to claim 1, wherein said first and second optical members include first and second refraction members having conical refraction surfaces. 3. An apparatus according to claim 1, wherein said light source means comprises an excimer laser light source. 4. The projection exposure apparatus according to claim 1, wherein said optical integrator has a rod-shaped optical integrator. (5) The orbicular light beam converting means includes the orbicular light.
5. The bundle according to claim 1, wherein the diameter of the bundle is variable.
The projection exposure apparatus according to claim 1. 6. An exposure light is supplied by a light source means, and the exposure light from the light source means is guided to an optical integrator to form a plurality of secondary light sources, and a light flux from the plurality of secondary light sources is provided. To illuminate the reticle surface in a superimposed manner,
In a projection exposure method for projecting the pattern of the reticle onto a wafer, the exposure light from the light source means is irradiated using a first optical member.
A first step of converting the light into a first annular luminous flux without blocking light and guiding the light to the optical integrator; and blocking the exposure light from the light source means using a second optical member different from the first optical member. Bei a second step leading to the optical integrator is converted into a different second annular light beam from said first annular beam without
For example, the outer diameter of the first annular beam and the second annular beam
The ratio of the inner diameter to the inner diameter is different from each other, and the annular optical flux is changed by exchanging the first and second optical members.
A projection exposure method , further comprising a switching step. Wherein said first and second steps, claim, characterized in that it comprises a step of passing the exposure light conical refracting surface
7. The projection exposure method according to 6 . Wherein said exposure light, a projection exposure method according to claim 6 or 7, wherein the having the light from the excimer laser light source. 9. The projection exposure method according to claim 6, wherein said optical integrator has a rod-shaped optical integrator. 10. The method according to claim 10, wherein the outer diameter of the orbicular zone light beam is adjusted.
7. The method according to claim 6, further comprising the step of making the variable.
10. The projection exposure method according to claim 1. By 11. The projection exposure method according to any one of claims 6 to 10, the semiconductor device manufacturing method characterized by comprising the step of reduction projection a circuit pattern formed on the reticle onto the wafer . 12. An exposure light is supplied to illuminate a reticle.
Light source means for projecting the reticle pattern onto the wafer.
A projection optical system having a projection optical system for shadowing, wherein the projection optical system is disposed in an optical path of exposure light supplied from the light source means.
Optical integrator, the light source means and the
Placed in the optical path between the optical integrator and
Annular light beam converting means for converting the exposure light into an annular light beam
And exposure light from the optical integrator.
Means for guiding to the reticle, wherein the orbicular luminous flux conversion means does not block the exposure light.
A first optical member for converting the light into a first annular light beam;
A second method for converting light into a second annular luminous flux without blocking light
Two optical members, wherein the first and second optical members are inserted in the optical path of the exposure light.
And the orbicular luminous flux converting means is provided for intersecting the first and second optical members.
In this way, rings with different ratios of inner diameter to outer diameter
A projection exposure apparatus for switching a belt-like light beam . Claim 13 The first and second optical members have a conical bending.
Having first and second refraction members having bent surfaces.
13. The projection exposure apparatus according to claim 12, wherein: 14. The light source means has an excimer laser light source.
14. The projection according to claim 12, wherein the projection is performed.
Exposure equipment. 15. The optical integrator is locked
Features an optical integrator in the shape of
The projection exposure according to any one of claims 12 to 14,
apparatus. 16. The annular light beam converting means includes the annular light flux converting means.
13. The light beam diameter is variable.
16. The projection exposure apparatus according to claim 15, 17. A reticle is exposed by exposure light from a light source means.
Illuminate and pattern the reticle through the projection optics
In a projection exposure method for projecting onto a wafer, a first optical member is used to block exposure light from the light source means.
And convert it to the first annular light flux without optical
A first step of leading to an integrator, and using a second optical member different from the first optical member,
The first exposure light without blocking the exposure light from the light source means;
To a second annular luminous flux different from the annular luminous flux of
And a second step leading to the optical integrator.
For example, the outer diameter of the first annular beam and the second annular beam
The ratio of the inner diameter to the inner diameter is different from each other, and the annular optical flux is changed by exchanging the first and second optical members.
A projection exposure method , further comprising a switching step. 18. In the first and second steps, the exposure light is
Claims: A step of passing through a conical refractive surface
Item 18. The projection exposure method according to Item 17. (19) The exposure light is from an excimer laser light source.
19. The light according to claim 17 or 18, wherein
Projection exposure method. 20. The optical integrator is locked
Having an optical integrator
The projection exposure method according to any one of claims 17 to 19, wherein
Law. 21. In the second step, the outer diameter of the orbicular zone light beam is adjusted.
2. The method according to claim 1, further comprising the step of making the variable.
21. The projection exposure method according to any one of 7 to 20. 22. The method according to any one of claims 17 to 20,
Circuit formed on the reticle by the projection exposure method
Having a step of reducing and projecting the pattern onto the wafer.
A method for manufacturing a semiconductor device.