JP3295211B2 - Case having thermal recording section and method of manufacturing electronic component package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hard case having a heat-sensitive recording portion on its surface, and more particularly, to an electronic component package containing electronic components and a method of manufacturing the same. Electronic device package containing an IC device or other electronic component having a thermosensitive recording section provided by attaching a thermosensitive sheet capable of repeatedly recording to the surface, and molded into a flat tag shape, and a method of manufacturing the same About.

[0002]

2. Description of the Related Art An IC device in which a semiconductor circuit (hereinafter, referred to as an IC) containing a microprocessor and a memory is housed in a small package is rapidly spreading. In particular, IC cards housed in card-shaped packages are being used in various fields as alternatives to conventional magnetic cards. This IC card has features such as a large storage capacity, an arithmetic function, erasing and rewriting of data, and an excellent security maintaining function. Further, as one type of the IC device, there is a non-contact IC device which does not have a connection terminal and inputs and outputs data to and from an external device using non-contact means such as light, magnetism, and electromagnetic waves. This non-contact IC device can be used to improve the reliability and durability of the contact portion,
It is used when it is desired to save the trouble of passing the IC device through an external device. In particular, it is effective to use it for a gate opening / closing system such as an automatic ticket gate. In addition, non-IC type devices that contain electronic components such as resonance circuits and capacitor circuits are also non-contact type small devices, which can be reduced in cost, so that they can be used as tags to prevent shoplifting or as simple access control systems. It's being used.

As a practical example of such a non-contact type IC device, there is an example of application to a ticket gate system of a ski lift. In most cases, ticket gates at ski resorts are performed by a method in which skiers post lift tickets on which ticket types, dates, and the like are printed to attendants. For this ticket gate, several people are required for each lift.
In addition, in the method of using a lift ticket as a magnetic card and performing a ticket gate using an automatic ticket gate, it is necessary for a skier to remove gloves, take out a magnetic card from a pocket, a holder, etc., and insert the card into the automatic ticket gate. ,
It takes troublesome work. On the other hand, in a ticket gate system using a non-contact type IC device, an IC device in which a ticket type, a date, and the like are recorded is placed in a holder, and is mounted on, for example, an arm, and the IC device is mounted at a lift gate. The ticket gate can be performed by bringing the arm part close to a predetermined area of the ticket gate device. Therefore, the skier can check the lift ticket only by passing through the gate, and the number of attendants can be reduced. Therefore, ski resorts using such a non-contact type IC device as a lift ticket are gradually increasing. The non-contact type I actually used in such a ski resort
The shape of the C device is the above-mentioned card shape, a square flat plate tag shape, or the like.

By the way, such an IC device is not suitable for use as a disposable card because the cost of the card is high. It is often reused, taking advantage of the fact that data can be easily rewritten. That is, the used card is collected, the data is erased, and data such as a new ticket type, an issue date, and a valid date are recorded at the time of ticket issuance, and the card is reused. In such an apparatus that sequentially rewrites and uses recorded data, a means for confirming recorded contents is indispensable. However, it is impossible to directly check the recorded data by visually observing the contents, and it is necessary to provide some display means on the external surface of the IC device.
Until now, when a ticket was issued, a piece of paper with the recorded contents was printed on an IC
The main method has been to display the recorded contents of the IC device by attaching it to the outer surface of the device. However, in this method, when the IC device is collected, the attached paper piece must be peeled off, which is troublesome.

Therefore, recently, a repetitive recording medium capable of erasing or reprinting the printed contents has been used as the display means. Examples of such a medium that can be repeatedly recorded include a heat-sensitive recording medium due to heat and a magnetic rewritable medium that encloses magnetic powder in microcapsules and changes the orientation of the magnetic powder by a magnetic field to give contrast and print. However, thermosensitive recording media are mainly used in terms of cost and visibility of the printing apparatus.

FIG. 8 shows an example of a non-contact type IC device which has a heat-sensitive recording section as the heat-sensitive recording medium on its outer surface and accommodates an IC circuit. FIG. 8 is a schematic cross-sectional view for explaining the structure of a non-contact type IC device having a square and flat tag shape (hereinafter, also referred to as an IC tag). The IC tag 800
An upper cover 801 and a lower cover 802 are joined. A heat-sensitive sheet 820 as a heat-sensitive recording unit is provided on the outer surface of the upper lid 801.
A concave portion 803 is formed for adhering the. Also,
A boss 804 for protecting the contents is formed on the lower lid 802. An IC circuit 810 including a processor, a memory, a loop antenna, and peripheral circuits is housed in a disc-shaped hollow portion 805 formed when the upper lid 801 and the lower lid 802 are joined. The upper lid 801 and the lower lid 802 are ultrasonically welded at a welding rib 806 on the outer periphery of the hollow portion 805.

[0007]

However, when a thermal recording section provided on the outer surface of the IC tag is printed using a thermal head, there is a problem that it is difficult to perform clear printing. The thermal head prints by directly contacting the thermal recording section. Further, the heat-sensitive sheet adhered to the hard package is directly affected by the shape of the surface of the package, and therefore, a convex portion or a concave portion is easily generated on the surface. Therefore, when irregularities are generated in the heat-sensitive recording section as described above,
The thermal head could not uniformly contact the entire surface of the heat-sensitive recording section in a planar manner. For example, as shown in FIG. 9, the printing result was blurred or printing could not be performed at all. Further, since there is a limit in the precision of a mold at the time of injection molding, which is one of the methods of manufacturing a package, and the precision of a surface having a heat-sensitive recording portion due to the influence of ultrasonic welding, the clear printing can be performed. It is difficult to manufacture a package with high flatness. In addition, even with a package having a heat-sensitive recording section with the same flatness, such as a package that can obtain a clear printing result,
In some cases, printing quality varied.

Therefore, conventionally, when printing is performed directly on a hard surface with a thermal head, the thickness of the adhesive layer to which the heat-sensitive sheet is adhered is increased to give the printing surface elasticity, and the thermal head is printed. The heat-sensitive sheet was made to come in contact with the plane. However, in the case of a heat-sensitive sheet that performs such repetitive recording, if the pressure-sensitive adhesive layer is thickened, the adhesive material will protrude from the edge of the heat-sensitive sheet during printing many times, and thermal There is a problem that the head and the heat-sensitive sheet are soiled. Therefore, it has not been possible to increase the thickness of the adhesive layer by providing elasticity to such an extent that the heat-sensitive sheet is brought into planar contact with the thermal head.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a case having a heat-sensitive recording portion capable of performing clear printing without unevenness by a thermal head. Another object of the present invention is to provide a package for housing an electronic component as the case. Still another object of the present invention is to provide a method for manufacturing an electronic component package, which can stably provide the package.

[0010]

Means for Solving the Problems In order to solve the above problems, the inventors of the present application have analyzed in detail the relationship between the shape of the surface having the heat-sensitive recording portion of the hard case for housing the IC circuit and the printing quality. Then, they found that when printing was not possible or when the printing quality was poor, the sticking surface was not in contact with the thermal head due to the following reasons. (1) The unevenness of the surface having the heat-sensitive recording portion is less than a predetermined standard, and the flatness has reached a certain level. However, if a concave portion exists entirely or partially, the portion is hardly contacted by the head and printing cannot be performed. (2) The portion of the welding rib for welding the upper lid and the lower lid is easily protruded or depressed, and the printing quality of that portion often deteriorates. (3) There is a case where the boss for protecting the contents, specifically, the IC circuit, is welded due to the vibration at the time of ultrasonic sealing, and in that case, as in the case of the above (2), the portion is easily protruded or depressed, Printing quality deteriorates.

Therefore, based on the above analysis, the inventor of the present application gives priority to forming a convex surface over the absolute value of the flatness on the surface having the heat-sensitive recording portion, and preferably the surface portion having the heat-sensitive recording portion has a higher priority. Do not weld the upper and lower lids,
More preferably, the boss has a structure so as not to be welded during ultrasonic sealing.Therefore, the case having the heat-sensitive recording portion of the present invention has a heat-sensitive recording portion formed slightly convex from the center toward the edge. Having a surface. The slightly convex surface is a convex surface to such an extent that a non-contact portion does not occur between the heat-sensitive recording portion and the heat-sensitive head due to minute deformation caused by pressing of the heat-sensitive head. Preferably, in the case having the heat-sensitive recording portion of the present invention, the surface portion having the heat-sensitive recording portion is configured as a free surface having no welded portion.

[0012] More preferably, the case having the thermal recording section of the present invention is provided on at least one of the upper lid and the lower lid to protect the housed electronic components,
It has a boss having a minute gap between the opposing upper lid or lower lid or the opposing boss provided thereon. The minute gap has a gap when the surface having the heat-sensitive recording section is maintained in a slightly convex state, and in order to protect the container when pressure is applied by a heat-sensitive head or the like, The gap is such that it contacts and supports the opposing portion. Further, the case having the heat-sensitive recording portion of the present invention, a support is provided on a receiving jig of the ultrasonic welding device, and the surface having the heat-sensitive recording portion is installed on the support with the surface facing downward,
Further, the package is manufactured by applying ultrasonic pressure to a predetermined welded portion while applying air pressure to the extent that the package slightly warps.

[0013]

In order to perform clear printing on the thermal recording section provided on the hard case, the thermal recording section must contact the thermal recording section in a flat manner without unevenness. However, the case formed by injection molding and ultrasonic welding usually has irregularities of, for example, about several tens μm to 100 μm. In this case, the convex surface is deformed into a shape following the shape of the thermal head by pressing the thermal head at the time of printing, but the concave surface remains out of contact with the thermal head. The case of the present invention is formed such that the surface having the heat-sensitive recording portion is a slightly convex surface. Therefore, the thermal head presses the thermal head in planar contact with the thermal head, so that clear printing can be performed. Further, in the method of manufacturing an electronic component package accommodating the electronic component package according to the present invention, at the time of ultrasonic welding, the edge of the surface having the thermal recording portion of the electronic component package is supported by a support, and the package is further subjected to thermal recording. Ultrasonic welding is performed in a state in which pressure is applied from the surface opposite to the surface having the portion. Therefore, since the ultrasonic welding is performed in a state where the surface having the heat-sensitive recording portion is slightly warped to a convex shape, the convex state is preserved, and an electronic component package in which the surface having the heat-sensitive recording portion is slightly convex can be manufactured. .

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As an embodiment of a case having a heat-sensitive recording portion of the present invention, an electronic component package containing a semiconductor circuit is provided.
An example of a non-contact type IC tag to which a heat-sensitive sheet that can be repeatedly recorded is attached will be described with reference to FIGS. This IC tag is used as a lift ticket at a ski resort. The container is not limited to a semiconductor circuit, but may include a resonance circuit and a capacitor circuit. FIG. 1 is a top view and a front view of an IC tag 100 according to the present embodiment. This IC
The tag 100 has a side of about 50 mm and a thickness of 4 mm, which is preferable for being stored in a pocket or a holder.
This is a square and flat tag. This IC tag 100
Has a structure in which an IC circuit is housed in a hard case composed of an upper lid 101 and a lower lid 102, and a heat-sensitive sheet 120 is attached to the surface of the hard case. Power is supplied and data is input / output to / from the IC device in the case by an electromagnetic wave via a built-in loop antenna. Further, a part of data recorded in the IC circuit, for example, a ticket type, an effective date, an amount of money, and the like are printed and recorded on the heat-sensitive sheet 120 so as to be visible.

FIG. 2 is a diagram for explaining the configuration of the IC tag 100 shown in FIG. FIG. 2 is a cross-sectional view taken along line XX ′ of FIG.
FIG. 3 is a diagram showing the IC tag 100 in a cross section of FIG. IC tag 1
00 has an upper lid 101, a lower lid 102, an IC circuit 110, and a heat-sensitive sheet 120. First, the respective units will be described with reference to FIG. The upper lid 101 has a heat-sensitive sheet sticking surface 103 on the upper outer surface for sticking a heat-sensitive sheet 120 as a heat-sensitive recording unit. This heat-sensitive sheet sticking surface 1
03 is suitable for fixing the heat-sensitive sheet, for example, 2
It has a slight recess of about 00 μm. The upper lid 101 has a welding portion 108 for welding to the lower lid 102. The welded portion 108 is provided on the heat-sensitive sheet
Provided on the edge rather than 3.

The lower lid 102 has two bosses 104 for supporting a hollow portion formed between the upper lid 101 and the lower lid 102 and protecting the IC circuit 110 accommodated in the hollow portion. When the IC tag is not pressed, the boss 104 may be higher than the height of the hollow portion by, for example, 100 to 100.
Mold slightly short, about 0μ. The lower lid 102 has a welding portion 107 for welding to the upper lid 101.
The welded portion 107 has an energy director structure formed in a chevron. This energy director structure is an effective structure for performing ultrasonic welding. Ultrasonic vibrations are concentrated and transmitted to the chevron, generating local frictional heat and melting and welding the material. Therefore, uniform and strong welding can be obtained without causing deterioration of the resin in a short time.
The upper lid 101 and the lower lid 102 are manufactured by injection molding or the like. The IC circuit 110 has a processor, a memory, a loop antenna, and peripheral circuits. The IC circuit 110 supplies power and inputs / outputs data to / from an external device using an electromagnetic wave via the loop antenna. The IC circuit 110 is attached to a central portion of the lower cover 102.

The heat-sensitive sheet 120 is a heat-sensitive recording sheet that can be repeatedly erased and recorded. This is, for example, a sheet in which a thermoreversible recording layer is laminated using a transparent film as a support. When the thermoreversible recording layer itself has a film-forming property, the support may be omitted. When printing is performed on this sheet with a thermal head or the like at a temperature equal to or higher than a predetermined recording temperature, the printed portion becomes cloudy and characters can be recorded. Further, when the recording medium is heated to a temperature lower than the predetermined recording temperature and higher than the normal temperature and then cooled, the whole becomes a transparent state and the characters are erased.
The thermoreversible recording layer can be formed of a polymer composition which reversibly changes between a transparent state and a cloudy state by heat and can be maintained in a transparent state and a cloudy state at normal temperature. Examples of the polymer composition include thermoplastic resins such as polyvinyl chloride, vinyl chloride-based copolymer, vinylidene chloride-based copolymer, and polyester as a matrix material. In this matrix material, saturated or unsaturated fatty acids having 10 to 30 carbon atoms, their esters, amides,
Alternatively, a material in which an organic low-molecular substance such as an ammonium salt is dispersed may be used. The use ratio of the matrix material to the organic low molecular weight material is preferably 6: 1 to 1 by weight.
The range is 2: 1.

As the thermosensitive reversible recording layer, a leuco dye-based thermosensitive recording layer, specifically, a layer described in JP-A-4-247895 can be used. That is, it is composed of an electron-donating color-forming compound, an electron-accepting compound, and a binder component. As the electron-accepting compound, R ¹ -PO (OH) ₃ (wherein R ¹ represents a higher alkyl group or an alkenyl group) And / or an organic phosphoric acid compound represented by the general formula R ² —CH (OH) COOH
(Wherein R ² represents a higher alkyl group or an alkenyl group), and a leuco dye-based thermal recording utilizing an organic acid having a hydroxyl group at the α-position carbon represented by the following formula: Further, the heat-sensitive recording portion may be formed by directly applying or printing on the base material instead of sticking the sheet.

Next, the structure of the IC tag 100 of the present invention obtained by assembling the above components will be described with reference to FIG. FIG. 3 is a sectional view of the IC tag 100 shown in FIG. 3 also shows the IC tag 100 in a cross section taken along line XX ′ of FIG. 1, similarly to FIG. IC circuit 110 is lower lid 1
02 is housed in a hollow portion 105 formed between the upper lid 101 and the lower lid 102. This top lid 1
01 and the lower lid 102 are the welded portions 1 of the upper lid 101 in FIG.
08 and a welding portion 107 of the lower lid 102 is ultrasonically welded. Welding portion 106 is the ultrasonic welding portion,
The welding portion 106 is provided on the edge of the heat-sensitive sheet attaching surface 103 provided on the upper lid 101.

The upper surface of the IC tag 100 is formed to have a slightly convex surface slightly higher at the center and slightly lower at the edges.
The heat-sensitive sheet 120 is attached to the slightly convex upper surface, that is, the heat-sensitive sheet attaching surface 103 of the upper lid 101. A method of welding the upper cover 101 and the lower cover 102 and a method of forming the upper surface of the IC tag 100 into a slightly convex surface will be described later. A boss 104 is provided on the lower lid 102 to support a hollow portion 105 formed between the upper lid 101 and the lower lid 102. This boss 104 is the upper lid 101
And a gap of, for example, about 100 to 1000 μ.

Next, a method of welding the upper cover 101 and the lower cover 102 and a method of forming the upper surface of the IC tag 100 into a slightly convex surface will be described with reference to FIGS. FIG. 4 is a diagram illustrating an ultrasonic welding device. The ultrasonic welding device 300 includes an ultrasonic phone 310 and a receiving jig 32.
0, and a support 330. And receiving jig 3
The support tool 330 is set on the top 20, and the top cover 101 is placed thereon.
The IC tag 100 is placed with the side facing down. Then, by applying ultrasonic waves from the ultrasonic phone 310 while applying appropriate pressure from above, the upper lid 101 and the lower lid 102 are welded to form the IC tag 100.

IC tag 10 by ultrasonic welding device 300
The method of forming 0 will be described in more detail with reference to FIG. FIG. 5 is a diagram illustrating a method of forming the IC tag 100 by ultrasonic welding. The support 330 is set on the receiving jig 320, and the lower cover 102 to which the upper cover 101 and the IC circuit 110 are attached is placed on the support 330. These are placed on the support 330 with the heat-sensitive sheet sticking surface 103 of the upper lid 101 down, that is, with the upper lid 101 down and the lower lid 102 up. Ultrasonic waves are applied to the upper lid 101 and the lower lid 102 by the ultrasonic phone 300 while applying air pressure. In this embodiment, ultrasonic welding of about 20 kHz is applied for about 0.5 seconds while applying an air pressure of about 5 kg / cm ² to perform ultrasonic welding.

By applying ultrasonic waves under the above conditions, the welding portion 108 of the upper lid 101 and the welding portion 107 of the lower lid 107 are melted and welded. Also, by performing ultrasonic welding while applying a considerable air pressure as described above, the upper lid 101 is formed.
Is slightly warped downward. This allows
An IC tag 100 having a slightly convex upper surface is formed. That is, the heat-sensitive sheet sticking surface 103 of the upper lid 101 is formed into a convex surface slightly inclined from the center toward the edge. The degree of the convex surface is determined by the applied air pressure at the time of the ultrasonic welding.
A convex surface of about 00 μm or less is formed.

Printing on the heat-sensitive sheet 120 of the IC tag 100 formed as described above will be described.
FIG. 6 is a diagram illustrating a state in which the thermal head 200 prints on the heat-sensitive sheet 120 of the IC tag 100.
As shown in FIG. 6, the heat-sensitive sheet 120 of the IC tag 100
Then, the hard thermal head 200 comes in direct contact with it and prints a predetermined item. The upper surface of the IC tag 100 to which the heat-sensitive sheet 120 is stuck is usually slightly convex as shown in FIG.
As a result, the thermal head 200 is deformed along the shape of the thermal head 200 and comes into contact with the thermal head 200 without unevenness in a plane as shown in FIG. Therefore, clear printing without blurring is possible.

Table 1 shows the measurement results of the relationship between the flatness and the printing quality. FIG. 7 is a diagram showing the positions of the measurement lines A, B, and C. In Table 1, tag 1 and tag 2 are conventional IC tags, and tag 3 and tag 4 are the aforementioned IC tags of the present invention. As shown in Table 1,
The unevenness, which is the flatness of the heat-sensitive sheet attachment surface, is at most 60 to 80 μm, but the IC tag of the present invention is in a convex state at any measurement line, and the printing quality is good. . Conversely, in the conventional IC tag, there is a concave portion on the heat-sensitive sheet sticking surface, and the portion is not clearly printed, resulting in poor printing. in this way,
Even if the flatness is the same, a tag having a heat-sensitive sheet adhesive surface having a convex surface can perform clear printing.

[0026]

[Table 1]

Table 2 shows the results of the measurement of the flatness of the IC tag manufactured by the manufacturing method of the present invention as described above. Note that the measurement positions are the same as the measurement shown in Table 1 above, and the measurement lines A, B, and C shown in FIG.
It is. As shown in Table 2, according to the method for manufacturing an electronic component package of the present invention, the surface of the electronic component package to which the heat-sensitive sheet is attached can be stably manufactured as a convex surface having a height difference of about 100 μm or less.

[0028]

[Table 2]

[0029]

As described above, according to the present invention, by forming a slight convex surface on the hard case, specifically on the surface of the electronic component package having the heat-sensitive recording section, the thermal head can be planarized. It is possible to make contact with this heat-sensitive recording portion, and clear printing can be performed. In addition, by making the welded portion of the upper lid and the lower lid more rim than the surface having the heat-sensitive recording portion, it is possible to prevent unevenness from being generated on the surface having the heat-sensitive recording portion due to the effect of welding, and to provide a high flatness thermal recording. A surface having a portion can be formed. Furthermore, since the boss for protecting the hollow portion for accommodating the IC circuit, which is the container, has a structure having a gap between the boss in the normal state, the boss portion is ultrasonically welded, No irregularities are formed on the surface having the heat-sensitive recording portion, and therefore, the surface having the heat-sensitive recording portion with high flatness can be formed. Further, according to the method for manufacturing an electronic component package of the present invention, it is possible to easily and stably manufacture an electronic component package having a surface having a thermosensitive recording portion formed in the slightly convex state.

[Brief description of the drawings]

FIG. 1 is a top view and a front view of an IC tag according to an embodiment.

FIG. 2 is a diagram illustrating the configuration of the IC tag shown in FIG.

FIG. 3 is a sectional view of the IC tag shown in FIG. 1;

FIG. 4 is a diagram illustrating an ultrasonic welding device.

FIG. 5 is a diagram illustrating a method of forming the IC tag shown in FIG. 1 by ultrasonic welding.

FIG. 6 is a diagram illustrating a state in which printing is performed by a thermal head on a heat-sensitive sheet of the IC tag illustrated in FIG. 1;

FIG. 7 is a diagram showing a measurement unit of the flatness of the heat-sensitive sheet attachment surface of the IC tag of the present invention.

FIG. 8 is a schematic sectional view for explaining the structure of a conventional non-contact IC device having a square and flat tag shape.

FIG. 9 is a view showing a heat-sensitive sheet on which unclear printing is performed.

[Explanation of symbols]

REFERENCE SIGNS LIST 100 Non-contact type IC tag 101 Upper lid 102 Lower lid 103 Thermal sheet attaching surface 104 Boss 105 Hollow part 106 Welding part 107 Lower lid welding part 108 Upper lid welding part 110 IC circuit 120 Thermal sheet 200 Thermal head 300 Ultrasonic welding device 310 Ultra Sound wave phone 320 Receiving jig 330 Supporter 800 Conventional non-contact type IC tag 801 Upper lid 802 Lower lid 803 Heat-sensitive sheet attaching surface 804 Boss 805 Hollow part 806 Welding part 810 IC circuit 820 Heat-sensitive sheet

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-7-164761 (JP, A) JP-A-7-61182 (JP, A) JP-A-6-239070 (JP, A) JP-A-4- 368894 (JP, A) JP-A-2-79373 (JP, A) JP-A-63-280694 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 5/02 B42D 15 / 10 501 G06K 19/07 G06K 19/077 B65D 25/20

Claims (5)

(57) [Claims] 1. A flat hard case having a thermosensitive recording portion capable of repetitive recording on at least one surface of the case, and the surface of the case having the thermosensitive recording portion has a central portion to an edge portion. A case having a heat-sensitive recording section, wherein the heat-sensitive recording section is formed to have a slightly convex surface to such an extent that a non-contact portion does not occur in the heat-sensitive recording section due to pressing of the print head. 2. The case comprises a first lid having the thermosensitive recording section, and a second lid joined to the first lid,
The said 1st lid and the 2nd lid are welded by the edge part rather than the surface which has the said heat-sensitive recording part, The surface which has this heat-sensitive recording part is a free surface which can be deformed slightly. Case having a thermosensitive recording section. 3. The case comprises a first lid having the thermal recording section and a second lid joined to the first lid.
A boss is provided on one or both of the inner surface of the first lid and the inner surface of the second lid of the surface having the heat-sensitive recording portion, and the boss is provided on the inner surface of the opposing lid or the inner surface of the opposing lid. 2. A small gap between the boss and the boss.
Or a case having the thermosensitive recording section according to 2. 4. The case according to claim 1, wherein said case is an electronic component package for housing electronic components. 5. A method according to claim 1, wherein one side of the flat hard case for housing the electronic component is welded to the other side while pressing the surface having the repetitively recordable thermosensitive recording portion from the back side to the front side. A method for manufacturing an electronic component package having a heat-sensitive recording portion, wherein the surface having the heat-sensitive recording portion is formed so as to be slightly convex so that a non-contact portion does not occur in the heat-sensitive recording portion by pressing the print head from the center to the edge. .