JP3290471B2 - Wafer processing tape and method of using the same - Google Patents
Wafer processing tape and method of using the sameInfo
- Publication number
- JP3290471B2 JP3290471B2 JP22862092A JP22862092A JP3290471B2 JP 3290471 B2 JP3290471 B2 JP 3290471B2 JP 22862092 A JP22862092 A JP 22862092A JP 22862092 A JP22862092 A JP 22862092A JP 3290471 B2 JP3290471 B2 JP 3290471B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- wafer
- wafer processing
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ウエハ加工用テープに
関するものである。ウエハ加工用テープは半導体集積回
路（以下、ＩＣという）製造工程において使用される。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape for processing a wafer. Wafer processing tapes are used in a semiconductor integrated circuit (hereinafter referred to as IC) manufacturing process.
【０００２】[0002]
【従来の技術】ＩＣは、通常高純度シリコン単結晶等を
スライスして半導体ウエハ（以下、単にウエハと略すこ
ともある）とした後、その表面に不純物熱拡散や超微細
加工等の手段で集積回路を組み込み、ダイシングしてチ
ップ化する方法で製造されている。2. Description of the Related Art In general, an IC is formed by slicing a high-purity silicon single crystal or the like into a semiconductor wafer (hereinafter sometimes abbreviated simply as a wafer) and then diffusing the surface of the semiconductor wafer by means such as impurity diffusion or ultra-fine processing. It is manufactured by a method of incorporating an integrated circuit, dicing and chipping.
【０００３】これらの各工程において、ウエハの表面パ
ターン損傷や破損等を防止するため、ウエハ表面にウエ
ハ加工用テープが用いられている。In each of these steps, a tape for processing a wafer is used on the wafer surface in order to prevent damage or breakage of the surface pattern of the wafer.
【０００４】一般に、粘着剤としては、水系エマルジョ
ン粘着剤と溶剤系粘着剤が用いられているが、安全面、
衛生面、コスト面から考えて水系エマルジョン粘着剤の
方が好ましい。Generally, an aqueous emulsion adhesive and a solvent-based adhesive are used as the adhesive.
From the viewpoint of hygiene and cost, an aqueous emulsion pressure-sensitive adhesive is preferred.
【０００５】また、ウエハ加工用フィルムをウエハ加工
の用途に供した後、ウエハ表面の付着物を除去するため
に洗浄する際、溶剤系粘着剤を用いたフィルムを使用し
た場合、水洗浄では汚染を除去しきれず、有機溶剤の使
用等で手間がかかり、安全、衛生面からも問題がある。
一方、水系エマルジョン粘着剤を用いたフィルムでは、
水洗浄でも十分に汚染を除去できる。In addition, when a film using a solvent-based adhesive is used when a film for wafer processing is used for wafer processing and then washed to remove deposits on the surface of the wafer, contamination with water cleaning may occur. Can not be completely removed, it takes time and labor to use an organic solvent, etc., and there is also a problem in terms of safety and hygiene.
On the other hand, in a film using an aqueous emulsion adhesive,
Even water washing can sufficiently remove contamination.
【０００６】しかして、水系エマルジョン粘着剤は溶剤
系粘着剤に比べて耐水性が劣るという欠点があった。こ
の欠点を解消するウエハ加工用テープとして、粘着剤原
料のモノマーにフッ素含有モノマーを加えて重合したア
クリル系樹脂エマルジョン粘着剤を用いたウエハ加工用
テープを開発した。[0006] However, the water-based emulsion pressure-sensitive adhesive has a disadvantage that its water resistance is inferior to that of the solvent-based pressure-sensitive adhesive. As a wafer processing tape which solves this drawback, a wafer processing tape using an acrylic resin emulsion pressure-sensitive adhesive obtained by adding a fluorine-containing monomer to a monomer of a pressure-sensitive adhesive material and polymerizing the same has been developed.
【０００７】しかして、フッ素含有モノマーは、撥水性
があると共に撥油性もあるため、他のモノマーと相溶性
が悪く、これらのモノマーを混合するためには、多量の
界面活性剤を必要とする。重合して得られた粘着剤は、
かえって耐水性が悪くなるとともに、界面活性剤が表面
にブリードし、ウエハに貼付けた後剥離するとウエハの
表面を汚染するという欠点があった。However, since the fluorine-containing monomer has water repellency and oil repellency, it has poor compatibility with other monomers, and requires a large amount of a surfactant to mix these monomers. . The adhesive obtained by polymerization is
On the contrary, the water resistance is deteriorated, and the surfactant bleeds on the surface, and if the surfactant is peeled off after being attached to the wafer, the surface of the wafer is contaminated.
【０００８】[0008]
【発明が解決しようとする課題】以上の点に鑑み、本発
明は、ウエハを汚染せず、かつ耐水性に優れたウエハ加
工用テープを提供することを目的とする。SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a wafer processing tape which does not contaminate a wafer and has excellent water resistance.
【０００９】[0009]
【課題を解決するための手段】本発明者らは、上記目的
を達成する為に、鋭意検討した結果、粘着剤原料のモノ
マーにフッ素含有モノマーを加えて重合する際、反応性
界面活性剤を用いると、エマルジョン粒子との結びつき
が物理的な結合であり、フッ素含有モノマーと他のモノ
マーの分離が起きず、添加量が非反応性界面活性剤より
も少ない量で重合出来、重合して得られたアクリル系樹
脂エマルジョン粘着剤配合液を、基材フィルムに塗布し
てなるウエハ加工用テープは、ウエハを汚染せず、かつ
耐水性に優れていることを見出し、本発明を完成した。Means for Solving the Problems The present inventors have conducted intensive studies in order to achieve the above object, and as a result, when a fluorine-containing monomer is added to a monomer of a pressure-sensitive adhesive material for polymerization, a reactive surfactant is used. When used, the bond with the emulsion particles is a physical bond, the separation of the fluorine-containing monomer and other monomers does not occur, and the added amount can be polymerized in a smaller amount than that of the non-reactive surfactant, and is obtained by polymerization. The present inventors have found that a wafer processing tape obtained by applying the obtained acrylic resin emulsion pressure-sensitive adhesive composition to a base film does not contaminate the wafer and has excellent water resistance, and thus completed the present invention.
【００１０】即ち、本発明は、フッ素含有モノマーが
３．０〜２０．０重量％であるモノマー混合物１００重
量部に反応性界面活性剤０．１〜５．０重量部を添加し
て重合し、アクリル系樹脂エマルジョン粘着剤とした
後、該アクリル系樹脂エマルジョン粘着剤を基材フィル
ムに塗布してなることを特徴とするウエハ加工用テープ
である。That is, according to the present invention, 0.1 to 5.0 parts by weight of a reactive surfactant is added to 100 parts by weight of a monomer mixture containing 3.0 to 20.0% by weight of a fluorine-containing monomer to carry out polymerization. An acrylic resin emulsion pressure-sensitive adhesive, and then applying the acrylic resin emulsion pressure-sensitive adhesive to a substrate film.
【００１１】又、本発明は同ウエハ加工用テープを使用
することを特徴とするウエハ裏面研削方法である。Further, the present invention is a method of grinding the back surface of a wafer, characterized by using the tape for processing a wafer.
【００１２】モノマー混合物とは、メタクリル酸メチ
ル、アクリル酸ブチル、アクリル酸−２−エチルヘキシ
ル、アクリル酸エチル等の（メタ）アクリル酸エステル
モノマーと、カルボン酸含有ビニル化合物であるアクリ
ル酸、メタクリル酸、クロトン酸、マレイン酸、フマル
酸、イタコン酸等のモノマーと、フッ素含有モノマーの
混合物である。The monomer mixture includes (meth) acrylate monomers such as methyl methacrylate, butyl acrylate, 2-ethylhexyl acrylate, and ethyl acrylate, and acrylic acid, methacrylic acid, which is a carboxylic acid-containing vinyl compound. It is a mixture of a monomer such as crotonic acid, maleic acid, fumaric acid, and itaconic acid, and a fluorine-containing monomer.
【００１３】フッ素含有モノマーとはフッ素を含有する
ビニル化合物であり、例示するならば、トリフルオロエ
チルアクリレート、トリフルオロエチルメタクリレー
ト、ヘプタデカフルオロデシルアクリレート、ヘプタデ
カフルオロデシルメタクリレート等が挙げられる。The fluorine-containing monomer is a fluorine-containing vinyl compound. Examples thereof include trifluoroethyl acrylate, trifluoroethyl methacrylate, heptadecafluorodecyl acrylate, and heptadecafluorodecyl methacrylate.
【００１４】モノマー混合物中のフッ素含有モノマー
は、３．０〜２０．０重量％である。さらに好ましく
は、５．０〜１０．０重量％である。３．０重量％未満
であると耐水性が向上せず、２０．０重量％を越える
と、他のモノマーとの相溶性が悪く、うまく共重合しな
い。The fluorine-containing monomer in the monomer mixture is 3.0 to 20.0% by weight. More preferably, it is 5.0 to 10.0% by weight. If it is less than 3.0% by weight, the water resistance will not be improved, and if it exceeds 20.0% by weight, the compatibility with other monomers will be poor and copolymerization will not be performed well.
【００１５】本発明に用いる重合時の反応性界面活性剤
としては、分子中にビニル基をもつものであれば、適宜
選択出来る、好ましくは、ノニオン系界面活性剤、又は
アンモニウム塩であるアニオン系界面活性剤である。The reactive surfactant at the time of polymerization used in the present invention can be appropriately selected as long as it has a vinyl group in the molecule, and is preferably a nonionic surfactant or an anionic surfactant which is an ammonium salt. It is a surfactant.
【００１６】例示するならば、ノニオン系界面活性剤と
しては、ポリオキシエチレンアルキルフェニルエーテル
のベンゼン環にアリル基を付加させた化合物、アニオン
系界面活性剤としては、ポリオキシエチレンアルキルフ
ェニルエーテル硫酸エステル化塩のベンゼン環にアリル
基を付加させた化合物、マレイン酸に高級アルコールと
アリル基を付加させた化合物に硫酸塩を付加させた化合
物等が挙げられる。For example, as the nonionic surfactant, a compound obtained by adding an allyl group to a benzene ring of polyoxyethylene alkyl phenyl ether, and as the anionic surfactant, polyoxyethylene alkyl phenyl ether sulfate is used. Compounds obtained by adding an allyl group to the benzene ring of a chloride, compounds obtained by adding a sulfate to a compound obtained by adding a higher alcohol and an allyl group to maleic acid, and the like.
【００１７】しかし、ソーダ塩、カリ塩のアニオン系界
面活性剤では粘着剤中に残留したナトリウムイオンやカ
リウムイオンがウエハの腐食をまねく可能性がある。However, in the case of anionic surfactants of soda salt and potassium salt, sodium ions and potassium ions remaining in the adhesive may cause corrosion of the wafer.
【００１８】反応性界面活性剤の添加量としては、モノ
マー混合物１００重量部に対して、０．１〜５．０重量
部であり、さらに好ましくは、０．２〜３．０重量部で
ある。０．１重量部未満であると重合時の安定性が悪
く、凝集物が多く発生し、収率が悪くなる。５．０重量
部を越えると、できた粘着剤の皮膜が吸水し、耐水性が
悪くなる。The addition amount of the reactive surfactant is 0.1 to 5.0 parts by weight, more preferably 0.2 to 3.0 parts by weight, based on 100 parts by weight of the monomer mixture. . If the amount is less than 0.1 part by weight, the stability during polymerization is poor, many aggregates are generated, and the yield is poor. 5 . If the amount exceeds 0 parts by weight, the resulting pressure-sensitive adhesive film absorbs water, resulting in poor water resistance.
【００１９】アクリル系樹脂エマルジョン粘着剤は、モ
ノマー混合物に、反応性界面活性剤、脱イオン水、重合
開始剤を添加し水中でエマルジョン重合した粘着剤であ
り、モノマー組成の選択は必要とする粘着力に応じて適
宜行う事が可能である。こうして重合されたアクリル系
樹脂エマルジョン粘着剤は水以外に通常３０〜６０ｗｔ
％の固形分（アクリル系樹脂）を含有するが、塗布時に
は粘度調整のため更に水で希釈することもできる。The acrylic resin emulsion adhesive is an adhesive obtained by adding a reactive surfactant, deionized water, and a polymerization initiator to a monomer mixture and emulsion-polymerizing the resulting mixture in water. It can be performed appropriately according to the force. The acrylic resin emulsion adhesive thus polymerized usually contains 30 to 60 wt.
% Solid content (acrylic resin), but can be further diluted with water for viscosity adjustment at the time of coating.
【００２０】又、必要に応じ上記アクリル系樹脂エマル
ジョン粘着剤へ、例えば、エポキシ系等の架橋剤を添加
することもできる。If necessary, a crosslinking agent such as an epoxy resin may be added to the acrylic resin emulsion pressure-sensitive adhesive.
【００２１】本発明で用いる基材フィルムとしては、合
成樹脂あるいは天然、合成ゴム等からなるフィルムを適
宜選択出来る。As the base film used in the present invention, a film made of synthetic resin or natural or synthetic rubber can be appropriately selected.
【００２２】基材フィルムの材質として例示するなら
ば、エチレン−酢酸ビニル共重合体、ポリブタジエン、
軟質塩化ビニル樹脂、ポリオレフィン、ポリエステル、
ポリアミド等熱可塑性エラストマー、及びジエン系、ニ
トリル系、シリコン系、アクリル系等の合成ゴム等であ
る。Examples of the material of the base film include ethylene-vinyl acetate copolymer, polybutadiene,
Soft vinyl chloride resin, polyolefin, polyester,
Thermoplastic elastomers such as polyamides, and synthetic rubbers such as diene, nitrile, silicone, and acrylic rubbers.
【００２３】基材フィルムにアクリル系樹脂エマルジョ
ン粘着剤配合液を塗布する方法としては、リバースロー
ルコーター、グラビヤコーター、バーコーター、ダイコ
ーター、コンマコーター等の公知のコーティング方法で
塗布し、通常８０〜１５０℃の熱風で乾燥する事により
可能である。乾燥後の塗布厚みは、通常１μｍ〜１００
μｍぐらいである。As a method for applying the acrylic resin emulsion pressure-sensitive adhesive compounding liquid to the base film, a known coating method such as a reverse roll coater, a gravure coater, a bar coater, a die coater, a comma coater, etc. is used. This is possible by drying with hot air at 150 ° C. The coating thickness after drying is usually 1 μm to 100
It is about μm.
【００２４】又、必要に応じて粘着剤層を保護するため
にセパレーターと称する合成樹脂フィルムを粘着剤層側
に貼付けておくのが好ましい。It is preferable to attach a synthetic resin film called a separator to the pressure-sensitive adhesive layer side in order to protect the pressure-sensitive adhesive layer if necessary.
【００２５】ウエハの裏面研削方法は、特に制限はな
く、グラインダー等による物理的研削でも、ケミカルエ
ッチング等による化学的研削でも、公知の方法が適宜用
いられる。The method of grinding the back surface of the wafer is not particularly limited, and a known method may be appropriately used for physical grinding using a grinder or the like or chemical grinding using chemical etching or the like.
【００２６】[0026]
【実施例】以下実施例にて本発明を更に具体的に説明す
る。 実施例１ 温度計、還流冷却器、滴下ロート、窒素導入口及び撹拌
機を付けたフラスコに、脱イオン水１５０．０重量部、
反応性界面活性剤としてポリオキシエチレンノニルフェ
ニルエーテル（エチレンオキサイド２０モル）のベンゼ
ン環にアリル基を付加させた化合物３．０重量部を入
れ、窒素雰囲気下で撹拌しながら７０℃まで昇温した
後、過硫酸アンモニウム（重合開始剤）０．５重量部を
添加し溶解させる。 次いで、メタクリル酸メチル２
２．５重量部、アクリル酸−２−エチルヘキシル６３．
５重量部、メタクリル酸グリシジル２．０重量部、メタ
クリル酸２．０重量部、トリフルオロエチルアクリレー
ト１０．０重量部からなるモノマー混合物を４時間で連
続滴下し、滴下終了後も３時間撹拌を続けて重合し、固
形分約４０重量％のアクリル系樹脂エマルジョン粘着剤
を得た。The present invention will be described more specifically with reference to the following examples. Example 1 150.0 parts by weight of deionized water was added to a flask equipped with a thermometer, a reflux condenser, a dropping funnel, a nitrogen inlet, and a stirrer.
As a reactive surfactant, 3.0 parts by weight of a compound obtained by adding an allyl group to a benzene ring of polyoxyethylene nonylphenyl ether (ethylene oxide 20 mol) was added, and the mixture was heated to 70 ° C. while stirring under a nitrogen atmosphere. Thereafter, 0.5 parts by weight of ammonium persulfate (polymerization initiator) is added and dissolved. Then, methyl methacrylate 2
2.5 parts by weight, 2-ethylhexyl acrylate
A monomer mixture consisting of 5 parts by weight, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid, and 10.0 parts by weight of trifluoroethyl acrylate was continuously added dropwise for 4 hours, and stirring was continued for 3 hours after completion of the addition. Polymerization was continued to obtain an acrylic resin emulsion pressure-sensitive adhesive having a solid content of about 40% by weight.
【００２７】この配合液を、Ｔダイ法にて製膜したＥＶ
ＡとＰＰの２層からなる厚さ１１０μｍのフィルムのコ
ロナ処理したＥＶＡ面にロールコーターにて塗布し、９
０℃で乾燥して塗布厚み３０μｍのアクリル系樹脂エマ
ルジョン粘着剤層を有するウエハ加工用テープを得た。[0027] EV obtained by forming a film of this compounded liquid by the T-die method.
A 110 μm thick film composed of two layers, A and PP, was applied to the corona-treated EVA surface with a roll coater,
After drying at 0 ° C., a wafer processing tape having an acrylic resin emulsion pressure-sensitive adhesive layer having a coating thickness of 30 μm was obtained.
【００２８】こうして得たウエハ加工用テープをＪＩＳ
Ｂ ０６０１に定められた基準長さ０．８ｍｍにおけ
る最大高さで３０μｍの凹凸をもつＳＵＳ板に貼付け、
水中に浸漬し、耐水性を評価した。この基準長さとは、
被測体表面の粗さを測定する際のサンプルの基準測定長
である。The wafer processing tape obtained in this way is JIS
Attached to a SUS plate having irregularities of 30 μm at the maximum height at a reference length of 0.8 mm defined in B0601,
It was immersed in water and evaluated for water resistance. This reference length is
This is the reference measurement length of the sample when measuring the roughness of the surface of the measured object.
【００２９】評価の方法は、水中にウエハ加工用テープ
を貼付けたＳＵＳ板を、１０分間浸漬した時点での、水
の浸入面積により評価し、その浸入面積のＳＵＳ板全面
積に対する割合を百分率で示した。尚、ＳＵＳ板の大き
さは巾５ｃｍ、長さ２０ｃｍ、面積１００ｃｍ 2であ
る。The evaluation method is as follows. The SUS plate to which the tape for wafer processing is adhered is immersed in water for 10 minutes, and the SUS plate is evaluated based on the infiltration area of water, and the ratio of the infiltration area to the total area of the SUS plate is expressed as a percentage. Indicated. The size of the SUS plate is 5 cm in width, 20 cm in length, and 100 cm 2 in area.
【００３０】さらに、該ウエハ加工用テープの粘着剤表
面に水滴を滴下し、その接触角を測定した。撥水性が大
きい程、接触角は大きくなる。Further, a water drop was dropped on the surface of the pressure-sensitive adhesive of the tape for wafer processing, and the contact angle was measured. The greater the water repellency, the greater the contact angle.
【００３１】また、さらに、該ウエハ加工用テープを４
インチ半導体ウエハに自動テープ貼付け機（（株）タカ
トリ製“ＡＴＭ−１０００Ｂ”）を用いて貼付け、１日
間室温で放置した後、自動テープ剥離機（（株）タカト
リ製“ＡＴＲＭ−２０００Ｂ”）を用いてウエハ加工用
テープを剥離し、得られた４インチ半導体ウエハを日立
電子エンジニアリング（株）製表面検査装置ＨＬＤ−３
００Ｂにより０．２μｍ以上の異物が何個存在するかに
より、ウエハの汚染度を測定した。結果は〔表１〕に示
す如く、耐水性は良く、ウエハの汚染もなく良好であっ
た。Further, the wafer processing tape is
An automatic tape peeling machine ("ATRM-2000B" manufactured by Takatori Co., Ltd.) is attached to an inch semiconductor wafer by using an automatic tape pasting machine ("ATM-1000B" manufactured by Takatori Co., Ltd.) and left at room temperature for one day. The wafer processing tape is peeled off by using the same, and the obtained 4-inch semiconductor wafer is subjected to a surface inspection apparatus HLD-3 manufactured by Hitachi Electronics Engineering Co., Ltd.
The degree of contamination of the wafer was measured based on the number of foreign particles having a size of 0.2 μm or more according to 00B. As shown in Table 1, the water resistance was good and the wafer was free from contamination.
【００３２】実施例２ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル７０．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルアクリレート３．０重量部からなるモ
ノマー混合物を添加し、反応性界面活性剤としてポリオ
キシエチレンノニルフェニルエーテル硫酸エステルのア
ンモニウム塩（エチレンオキサイド１０モル）のベンゼ
ン環にアリル基を付加させた化合物０．１重量部用いた
以外、実施例１と同様にした。この配合液を用い、実施
例１と同様にしてウエハ加工用テープを得た。こうして
得たウエハ加工用テープを実施例１と同様に評価した。
結果は〔表１〕に示す如く良好であった。Example 2 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
A monomer mixture consisting of 70.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid and 3.0 parts by weight of heptadecafluorodecyl acrylate was added. Example 1 was repeated except that 0.1 part by weight of a compound obtained by adding an allyl group to the benzene ring of an ammonium salt of ethylene nonylphenyl ether sulfate (ethylene oxide 10 mol) was used. Using this liquid mixture, a tape for processing a wafer was obtained in the same manner as in Example 1. The wafer processing tape thus obtained was evaluated in the same manner as in Example 1.
The results were good as shown in [Table 1].
【００３３】実施例３ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル５３．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルメタクリレート２０．０重量部からな
るモノマー混合物１００重量部を添加し、反応性界面活
性剤としてポリオキシエチレンノニルフェニルエーテル
硫酸エステルのアンモニウム塩（エチレンオキサイド１
０モル）のベンゼン環にアリル基を付加させた化合物
５．０重量部用いた以外、実施例１と同様にした。この
配合液を用い、実施例１と同様にしてウエハ加工用テー
プを得た。こうして得たウエハ加工用テープを実施例１
と同様に評価した。結果は〔表１〕に示す如く良好であ
った。Example 3 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
100 parts by weight of a monomer mixture consisting of 53.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid, and 20.0 parts by weight of heptadecafluorodecyl methacrylate are added, and a reactive surfactant is added. As ammonium salt of polyoxyethylene nonyl phenyl ether sulfate (ethylene oxide 1
0 mol) of a compound obtained by adding an allyl group to a benzene ring in an amount of 5.0 parts by weight. Using this liquid mixture, a tape for processing a wafer was obtained in the same manner as in Example 1. The tape for wafer processing thus obtained was used in Example 1.
Was evaluated in the same way as The results were good as shown in [Table 1].
【００３４】比較例１ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル７３．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部からなるモ
ノマー混合物１００重量部を用い、反応性界面活性剤と
してポリオキシエチレンノニルフェニルエーテル硫酸エ
ステルのアンモニウム塩（エチレンオキサイド１０モ
ル）のベンゼン環にアリル基を付加させた化合物３．０
重量部用いた以外、実施例１と同様にした。この配合液
を用い、実施例１と同様にしてウエハ加工用テープを得
た。こうして得たウエハ加工用テープを実施例１と同様
に評価した。結果は〔表１〕に示す如く耐水性が悪かっ
た。Comparative Example 1 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
Ammonium salt of polyoxyethylene nonyl phenyl ether sulfate as a reactive surfactant using 100 parts by weight of a monomer mixture consisting of 73.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, and 2.0 parts by weight of methacrylic acid (Ethylene oxide 10 mol) Compound 3.0 in which an allyl group is added to the benzene ring
Same as Example 1 except that parts by weight were used. Using this liquid mixture, a tape for processing a wafer was obtained in the same manner as in Example 1. The wafer processing tape thus obtained was evaluated in the same manner as in Example 1. The result was poor water resistance as shown in [Table 1].
【００３５】比較例２ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル６８．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、トリフル
オロデシルアクリレート５．０重量部からなるモノマー
混合物を添加し、界面活性剤としてポリオキシエチレン
ノニルフェニルエーテル（エチレンオキサイド１０モ
ル）５．０重量部用いた以外、実施例１と同様にして重
合したが、モノマーの相溶性が悪く、重合出来なかっ
た。 比較例３ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル６８．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルアクリレート５．０重量部からなるモ
ノマー混合物を添加し、界面活性剤としてポリオキシエ
チレンノニルフェニルエーテル硫酸エステルのアンモニ
ウム塩（エチレンオキサイド１０モル）１０．０重量部
用いた以外、実施例１と同様にした。この配合液を用
い、実施例１と同様にしてウエハ加工用テープを得た。
こうして得たウエハ加工用テープを実施例１と同様に評
価した。結果は〔表１〕に示す如く耐水性が悪かった。Comparative Example 2 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
A monomer mixture consisting of 68.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid and 5.0 parts by weight of trifluorodecyl acrylate was added, and polyoxyethylene nonylphenyl was used as a surfactant. Polymerization was carried out in the same manner as in Example 1 except that 5.0 parts by weight of ether (10 mol of ethylene oxide) was used, but polymerization was not possible due to poor compatibility of the monomers. Comparative Example 3 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
A monomer mixture consisting of 68.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid and 5.0 parts by weight of heptadecafluorodecyl acrylate was added, and polyoxyethylene nonyl was used as a surfactant. Same as Example 1 except that 10.0 parts by weight of ammonium salt of phenyl ether sulfate (10 mol of ethylene oxide) was used. Using this liquid mixture, a tape for processing a wafer was obtained in the same manner as in Example 1.
The wafer processing tape thus obtained was evaluated in the same manner as in Example 1. The result was poor water resistance as shown in [Table 1].
【００３６】比較例４ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル４３．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルメタクリレート３０．０重量部からな
るモノマー混合物を添加し、反応性界面活性剤としてポ
リオキシエチレンノニルフェニルエーテル（エチレンオ
キサイド２０モル）のベンゼン環にアリル基を付加させ
た化合物５．０重量部用いた以外、実施例１と同様にし
て重合したが、モノマーの相溶性が悪く、重合出来なか
った。Comparative Example 4 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
A monomer mixture consisting of 43.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid, and 30.0 parts by weight of heptadecafluorodecyl methacrylate was added. Polymerization was carried out in the same manner as in Example 1 except that 5.0 parts by weight of a compound having an allyl group added to the benzene ring of ethylene nonyl phenyl ether (20 mol of ethylene oxide) was used. Did not.
【００３７】比較例５ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル７０．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルメタクリレート３．０重量部からなる
モノマー混合物を添加し、反応性界面活性剤としてポリ
オキシエチレンノニルフェニルエーテル硫酸エステルの
アンモニウム塩（エチレンオキサイド１０モル）のベン
ゼン環にアリル基を付加させた化合物０．０５重量部用
いた以外、実施例１と同様にして重合したが、モノマー
の相溶性が悪く、重合出来なかった。Comparative Example 5 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
A monomer mixture consisting of 70.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid, and 3.0 parts by weight of heptadecafluorodecyl methacrylate was added. Polymerization was carried out in the same manner as in Example 1 except that 0.05 parts by weight of a compound obtained by adding an allyl group to the benzene ring of ammonium salt of ethylene nonyl phenyl ether sulfate (ethylene oxide 10 mol) was used. Was not good and could not be polymerized.
【００３８】比較例６ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル６３．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルアクリレート１０．０重量部からなる
モノマー混合物を添加し、反応性界面活性剤としてポリ
オキシエチレンノニルフェニルエーテル（エチレンオキ
サイド２０モル）のベンゼン環にアリル基を付加させた
化合物１０．０重量部用いた以外、実施例１と同様にし
た。この配合液を用い、実施例１と同様にしてウエハ加
工用テープを得た。こうして得たウエハ加工用テープを
実施例１と同様に評価した。結果は〔表１〕に示す如く
耐水性が悪かった。Comparative Example 6 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
A monomer mixture consisting of 63.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid and 10.0 parts by weight of heptadecafluorodecyl acrylate was added. Example 1 was repeated except that 10.0 parts by weight of a compound in which an allyl group was added to the benzene ring of ethylene nonylphenyl ether (20 mol of ethylene oxide) was used. Using this liquid mixture, a tape for processing a wafer was obtained in the same manner as in Example 1. The wafer processing tape thus obtained was evaluated in the same manner as in Example 1. The result was poor water resistance as shown in [Table 1].
【００３９】比較例７ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル７２．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルアクリレート１．０重量部からなるモ
ノマー混合物を添加し、反応性界面活性剤としてポリオ
キシエチレンノニルフェニルエーテル硫酸エステルのア
ンモニウム塩（エチレンオキサイド１０モル）のベンゼ
ン環にアリル基を付加させた化合物０．５重量部用いた
以外、実施例１と同様にした。この配合液を用い、実施
例１と同様にしてウエハ加工用テープを得た。こうして
得たウエハ加工用テープを実施例１と同様に評価した。
結果は〔表１〕に示す如く耐水性が悪かった。Comparative Example 7 Methyl methacrylate 22.5 parts by weight, acrylic acid-2-
A monomer mixture consisting of 72.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid, and 1.0 part by weight of heptadecafluorodecyl acrylate was added. Example 1 was repeated except that 0.5 part by weight of a compound obtained by adding an allyl group to the benzene ring of an ammonium salt of ethylene nonylphenyl ether sulfate (ethylene oxide 10 mol) was used. Using this liquid mixture, a tape for processing a wafer was obtained in the same manner as in Example 1. The wafer processing tape thus obtained was evaluated in the same manner as in Example 1.
The result was poor water resistance as shown in [Table 1].
【００４０】[0040]
【表１】 [Table 1]
【００４１】[0041]
【発明の効果】フッ素含有モノマーを含むモノマー混合
物を反応性界面活性剤を用いて重合したアクリル系樹脂
エマルジョン粘着剤を用いることにより、ウエハ加工用
テープの耐水性が優れ、ウエハを汚染しない。By using an acrylic resin emulsion pressure-sensitive adhesive obtained by polymerizing a monomer mixture containing a fluorine-containing monomer with a reactive surfactant, the wafer processing tape has excellent water resistance and does not contaminate the wafer.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−186832（ＪＰ，Ａ) 特開 平３−35011（ＪＰ，Ａ) 特開 昭61−141713（ＪＰ，Ａ) 特開 昭59−59764（ＪＰ，Ａ) 特開 平４−46979（ＪＰ，Ａ) 特開 昭63−296222（ＪＰ，Ａ) 特開 昭62−101678（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/301 H01L 21/304 C09J 7/02 ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-4-186832 (JP, A) JP-A-3-35011 (JP, A) JP-A-61-141713 (JP, A) JP-A-59-1986 59764 (JP, A) JP-A-4-46979 (JP, A) JP-A-63-296222 (JP, A) JP-A-62-101678 (JP, A) (58) Fields investigated (Int. 7 , DB name) H01L 21/301 H01L 21/304 C09J 7/02
Claims (2)
重量％であるモノマー混合物１００重量部に反応性界面
活性剤０．１〜５．０重量部を添加して重合し、アクリ
ル系樹脂エマルジョン粘着剤とした後、該アクリル系樹
脂エマルジョン粘着剤を基材フィルムに塗布してなるこ
とを特徴とするウエハ加工用テープ。1. The method according to claim 1, wherein the fluorine-containing monomer is 3.0 to 20.0.
0.1 to 5.0 parts by weight of a reactive surfactant is added to 100 parts by weight of the monomer mixture, which is 100% by weight, and polymerized to form an acrylic resin emulsion pressure-sensitive adhesive. Wafer processing tape characterized by being applied to a material film.
用することを特徴とするウエハ裏面研削方法。2. A wafer backside grinding method using the wafer processing tape according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22862092A JP3290471B2 (en) | 1992-08-27 | 1992-08-27 | Wafer processing tape and method of using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22862092A JP3290471B2 (en) | 1992-08-27 | 1992-08-27 | Wafer processing tape and method of using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0677192A JPH0677192A (en) | 1994-03-18 |
| JP3290471B2 true JP3290471B2 (en) | 2002-06-10 |
Family
ID=16879201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22862092A Expired - Lifetime JP3290471B2 (en) | 1992-08-27 | 1992-08-27 | Wafer processing tape and method of using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3290471B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6235387B1 (en) | 1998-03-30 | 2001-05-22 | 3M Innovative Properties Company | Semiconductor wafer processing tapes |
| WO2003081653A1 (en) | 2002-03-27 | 2003-10-02 | Mitsui Chemicals, Inc. | Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film |
| JP4676297B2 (en) * | 2005-01-24 | 2011-04-27 | 電気化学工業株式会社 | An adhesive, an adhesive sheet using the adhesive, and an electronic component manufacturing method using the adhesive sheet. |
| JP4640966B2 (en) * | 2005-08-11 | 2011-03-02 | 電気化学工業株式会社 | An adhesive, an adhesive sheet using the adhesive, and an electronic component manufacturing method using the adhesive sheet. |
| JP4680717B2 (en) * | 2005-08-11 | 2011-05-11 | 電気化学工業株式会社 | An adhesive, an adhesive sheet using the adhesive, and an electronic component manufacturing method using the adhesive sheet. |
| JP2011009425A (en) * | 2009-06-25 | 2011-01-13 | Sumitomo Bakelite Co Ltd | Method for manufacturing semiconductor element and method for manufacturing semiconductor device |
| CN102585739B (en) * | 2012-01-11 | 2013-07-31 | 合肥工业大学 | Adhesive for bonding fluoroplastics and metals and preparation method of adhesive |
-
1992
- 1992-08-27 JP JP22862092A patent/JP3290471B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0677192A (en) | 1994-03-18 |
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