JP3280421B2 - Electronic component storage tray - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage tray for electronic parts, and more particularly to an improvement in the storage structure.

[0002]

2. Description of the Related Art Conventionally, there has been known a flat package type electronic component in which a semiconductor device is sealed with an insulating resin or the like and integrally molded. This electronic component is usually formed in a rectangular parallelepiped or a rectangular parallelepiped, and has a plurality of lead pins projecting from a side surface for connecting a semiconductor device in a resin to an external circuit.

[0003] In this type of electronic component, especially in a surface mount board, if a lead pin is bent, a contact failure with an external circuit or an external component may occur at the time of mounting. Therefore, the electronic component is stored and protected in a predetermined tray and stored or transported. And so on. Such a tray has a plurality of recesses formed to accommodate electronic components, and the electronic components are supported by ribs in the recesses. Further, by forming at least the portion of the tray in contact with the lead pins with a conductive resin, the electric charge accumulated in the tray is prevented from being applied to the electronic component, thereby protecting the electronic component from electrostatic breakdown.

[0004] Generally, as a resin for packaging electronic parts, it is low in cost and flexible, and is preferable in manufacturing.
Epoxy resins are mainly used because they have heat resistance. However, epoxy resin has water absorbency, and when it is heated to about 250 degrees Celsius in a reflow oven to solder electronic components to external circuits, the moisture that has entered the resin package becomes steam and expands in the package. This increases the stress in the package. At this time, if the package itself is formed relatively thick, such a stress can be tolerated.However, from the viewpoint of mounting density improvement in recent years, since the flat package is made thinner, the package cannot withstand the stress. There is a problem that electronic components are defective, such as cracks being generated and wiring in the package being cut.

Therefore, in order to prevent such cracks from occurring, before mounting the electronic components, the electronic components must be mounted under relatively mild conditions, that is, at a temperature of 120 to 150 degrees Celsius.
Even when heating (baking) for 6 to 6 hours to remove water from the package gradually and performing heating using the reflow furnace, cracks do not occur in the package and a highly reliable electronic component is provided. Was.

The storage of electronic components before baking is
A tray made of a low-cost thermoplastic resin is sufficient, but if used directly in the baking process, the tray will be warped, making it impossible to accurately determine the address of the electronic component when mounting the electronic component with a machine. There is a problem that an error occurs when a component is attracted to the chuck, and there is also a problem that such a warped tray cannot be accommodated in a magazine. Therefore, when mounting electronic components, it has been recommended to take out individual electronic components from the tray, transfer them to a heat-resistant tray that can withstand the baking temperature, and bake the electronic components together with the heat-resistant tray.

[0007]

Generally, in order to manufacture a tray of this type, it is necessary to form a plurality of patterns corresponding to the recesses in a mold for manufacturing the tray. In general, if the storage volume of electronic components is increased, the size of the tray becomes larger, and as a result, the die for manufacturing the tray becomes larger, and the die processing cost also increases. Therefore, the initial investment amount for manufacturing the tray becomes large. There was a problem. If the type of the electronic component is different, the size and shape of the electronic component change. Therefore, it is necessary to design the size and arrangement of the concave portions of the tray and the arrangement of the ribs in the concave portion so as to accommodate these electronic components. Yes, a new mold must be prepared to match this.

[0008] Even though the total number of electronic components handled by electronic component mounting manufacturers is significantly smaller than that of electronic component manufacturers, the types of electronic components handled do not change. In addition, a heat-resistant tray for baking each type of electronic component was required, and a mold for manufacturing the heat-resistant tray had to be prepared separately from the manufacturer. . Therefore, an object of the present invention is to provide a storage tray for electronic components, which can simplify the structure of a mold and can manufacture the mold easily and at low cost.

[0009]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is configured to accommodate a plurality of electronic components, and comprises a tray main body and an electronic component formed separately from the tray main body. A storage body, wherein the storage body is mounted in a plurality of notches formed in the tray body, the tray body includes a first layer and a second layer, and the tray body is a first layer. And a second layer, wherein when the first layer and the second layer are overlapped, the cutout hole of the second layer and the first layer
The notch hole of the layer is aligned with the notch hole of the second layer, and the notch hole of the second layer is formed to be slightly larger than the notch hole of the first layer, and the storage body has a substantially U-shaped leg in the tray body direction. The notch groove formed at the end of the leg engages with the corner of the notch hole in the first layer of the tray main body, so that the storage component is mounted on the tray main body. It is a storage tray. In an embodiment described later, the tray body further includes a third layer, and the second layer includes
The first layer and the third layer are formed to be slightly larger than the third layer, and the protruding portions serve as flanges. The housing is provided with a rib on which the bent portion of the lead pin of the electronic component is placed .

[0010]

In the conventional configuration in which the storage tray for electronic components is integrated with the storage body and the tray, it is necessary to form a plurality of patterns corresponding to the recesses for storing the electronic components in a mold for manufacturing the tray. However, in a configuration in which a storage body for electronic components and a storage tray body to which the storage body is mounted are separated,
The pattern may be formed on the mold for manufacturing the container. The mold of the tray body only needs to have a pattern capable of forming a concave portion in which the storage body can be mounted, and it is not necessary to form a pattern corresponding to the concave portion in which the electronic component is stored. Then, for example, if the concave portion of the tray main body is formed by machining such as cutting, the mold itself for manufacturing the storage tray can be eliminated. Moreover, even if a new electronic component having a different size, shape, or the like is generated, it can be dealt with only by newly preparing a mold for a storage body that can store the electronic component. Then, the pattern to be formed on the mold for manufacturing the storage body requires only one or a small number, so that the structure of the mold can be simplified as compared with the case where a plurality of the patterns are formed on the tray body. The mold can be provided easily and at low cost.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of an electronic component storage tray according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view of a tray for storing a flat package type IC as an electronic component. The storage tray 10 includes a tray body 12 and a flat package formed separately from the tray body. And a resin piece 14 for accommodating the mold IC. This tray body 12
Is made of a heat-resistant metal, preferably lightweight aluminum. As shown in FIG. 2 which is a cross section taken along the line II-II of FIG. ing. Each cutout hole is formed by punching or cutting to have the same shape and size.

As shown in FIG. 2, the tray body is formed by stacking three aluminum plates 18, 20 and 22, and each plate is provided with the notch hole 16 so as to be aligned when the trays are stacked. Are formed respectively. As shown in FIG. 3, which is a cross section taken along the line III-III in FIG.
Notch holes 16B, 1B formed in the aluminum plate 20 of the layer and the aluminum plate 22 of the third layer, respectively.
6C is a notch hole 16A of the aluminum plate 18 of the first layer.
It is formed one size larger than that. The reason why three aluminum plates are used here is that if one thick plate is cut at a time, the plate may be warped.

As shown in FIG. 2, the aluminum plate 20 of the second layer is formed to be slightly larger than the plates of the first and third layers, and the protruding portion is formed by the flange 24.
It has become. This flange is effective for placing the tray on a belt conveyor for transporting the tray to a target position when mounting the IC.

The piece 14 corresponds to a storage body of the present invention, and is formed to be slightly larger than the notch hole 16A as shown in FIGS. 4 to 6 and a half sectional perspective view of FIG. Surface portion 26 and a groove portion 28 protruding in the back direction in a rectangular shape at the center of the surface portion.
From the center of the groove, a hollow cylindrical body 30 having a height lower than the depth of the groove 28 protrudes toward the surface of the piece, and has four sharp points around the cylindrical body 30. Ribs 32 are equally spaced from the cylindrical body 30,
They are arranged at equal angles.

A substantially U-shaped U-shaped leg 34 is formed around the groove 28 of the piece in a direction parallel to each of the ribs 32 and in the same direction as the direction in which the groove 28 is formed. Extends beyond the bottom surface of the groove 28.
The hole denoted by reference numeral 36 is formed for removing a portion of the die of the piece that forms the leg in a direction opposite to the resin piece.

This piece 14 is inserted into the notch hole 16 of the tray body.
If the piece is to be attached to the hole 16, the piece is made to face the hole 16 and then pushed. While the leg 34 is elastically deformed in the center direction of the piece, the piece 14 is pushed into the tray body side, and as shown in FIG. 3, a substantially L-shaped notch groove 38 formed at the upper end of the leg is formed in the tray body. At the time of engagement with the lower end corner of the notch hole 16A of the first layer plate, as shown in FIG. 8, the mounting of the piece 14 to the tray body 12 is completed, and
The storage tray of C is completed. In this state, the piece 14 is inserted into the notch 1 in the tray body due to the elastic deformation stress of the leg 34.
6 is irremovably supported.

In order to accommodate various ICs in the piece 14, the size of the groove 28 of the piece or the rib 32 depends on the type (size, shape) of the IC.
The width between the ribs and the arrangement pattern of the ribs are changed. And
The size and shape of the notched hole 16 of the aluminum plate are formed so that pieces that are enlarged by increasing the groove portions 28 of the pieces or various pieces having different shapes due to differences in the shape of the IC can be mounted. You.

FIG. 9 is a perspective view of a flat package type IC accommodated in the groove 28 of the resin piece. The epoxy resin package 40 in which semiconductor components are sealed and protrudes from the side surface of the package. As shown in FIG. 3, the bent portion 43 of the lead pin 42 of the flat package type IC is placed on the sharp rib 32 of the resin piece and the IC is housed in the groove. This makes it difficult for the IC to move in the groove.

Here, since the tray body 12 is formed of a heat-resistant metal material, the flat package type I
After containing C, it can be placed in a furnace as it is and baked. After baking, the tray is sent to an IC mounting system, and the IC is mounted on the substrate from the tray. At this time, the IC is transported from the tray to the substrate by vacuum-sucking the IC package surface.

After all the ICs in the tray are mounted, another IC to be baked on the piece 14 of the tray body 12 is mounted. Here, if the type of the IC is the same as the IC baked immediately before, the IC may be stored in a piece mounted on the tray body as it is. On the other hand, if the type of the IC is different from that of the IC and the size, shape, and the like are different, the resin piece is replaced with an IC capable of storing the IC.

When the pieces are exchanged, the pieces are detached from the tray body by elastically deforming the U-shaped legs 34 toward the center of the pieces so that the notch grooves 38 of the pieces and the plate 18 of the first layer of the tray body can be removed. Is released, and the back surface of the piece present in the cutout hole 16 is pressed from the back side of the tray body to the front side. By detaching the piece, another resin piece having a different size, shape, or the like of the groove portion 28 can be attached to the opened notch hole.

According to the above embodiment, since the notch holes 16 of the same shape and size are formed in the tray main body 12 by cutting, a die for forming the tray main body can be eliminated. Then, the groove 28 of the die for manufacturing a piece is formed.
Since only one pattern is formed, the structure of the mold is simplified, and the manufacture of the mold is easy and low cost. And even if the type of IC is different,
A mold for manufacturing a piece having a pattern corresponding to this may be prepared, and the tray body 12 can be used as it is. Even if the pieces have different sizes or different shapes, the corresponding cutout holes 16 in the tray body can be easily formed by cutting. Here, the notch 16 formed in the tray body is, as described above,
It is desirable to be formed at an equal pitch. IC in tray
When mounting is performed, the control device recognizes the address of each IC and specifies the IC to be mounted. This is because it is preferable for the address control that the notches 16 have the same pitch. The pitch is preferably small in order to improve the degree of storage of the IC, but the pitch can be increased or decreased as needed.
As shown in FIG. 1, since various types of pieces can be selected as the pieces mounted on the tray body, a plurality of types of ICs can be stored in one tray.

As described above, when mounting an IC, it is necessary to control the address of the IC accommodated in the tray in order to select a target IC, as described above. Pieces whose bottoms are closed by being mixed with pieces whose bottoms are open as described in the embodiment are mounted on the tray body in a predetermined pattern. Since this pattern differs depending on the type of IC to be mounted and the configuration of the mounting system, in the case where the piece, that is, the IC housing is formed integrally with the tray main body, the tray main body is formed in advance for each of various patterns. There is a need. On the other hand, according to the present embodiment, the resin piece having the closed bottom can be freely mounted on the tray body in a predetermined pattern, so that the tray body of the above embodiment can be used as it is.

In the above embodiment, both a known thermoplastic resin and a thermosetting resin can be used as the constituent material of the piece. When using a thermoplastic resin, the piece may be warped after baking,
Considering the small size of the piece, the amount of warpage is also small and does not cause any particular disadvantage when mounting the IC.

Next, a second embodiment will be described. This embodiment differs from the first embodiment in that, as means for mounting the piece to the tray body, a flange projecting from the side surface of the piece is provided, and this flange is fitted to the step of the tray body. It is. In this embodiment, as shown in FIG. 10, a flange 52 protrudes outward from the side wall 50 at a substantially intermediate position of the side wall 50 facing each other.

On the other hand, as shown in FIG. 11, the notch hole 16B formed in the plate 20 of the second layer of the tray main body 12 fits the plate 18 of the first layer and the second
Larger than the notches 16A, 16C of the layer plate 22 (first
The notch holes in the layer plate and the notch holes in the second layer plate are formed in the same size. ) Is formed. Therefore, the first
The flange 5 is provided at the step 54 between the layer plate and the second layer plate.
2 can be fitted and the piece can be mounted on the tray body.

In fitting the pieces, the first layer plate 18 and the second layer plate 20 are respectively inserted into the notches 16A,
16C are aligned so that they are aligned, and this is spot-welded. Then, the plate of the second layer is arranged so as to be on the surface, and the flange 52 of the piece is placed on the step portion 54 with the bottom surface of the piece facing upward. Then, the plate 22 of the third layer is put on the plate 20 of the second layer so that the cutouts 16C thereof are aligned with the cutouts 16A and 16B, and the plate 22 of the third layer and the plate 20 of the second layer are screwed. Or with rivets. As a result, the flange 52 of the piece is fitted to the step 54 so as not to fall off. When the screw between the third layer plate and the second layer plate is released, the pieces can be removed, and the pieces can be replaced.

In the second embodiment, the same effects as those of the first embodiment can be obtained, and the U-shaped legs need not be formed as in the piece of the first embodiment. The manufacture of the piece is facilitated, and consequently the structure of the manufacturing mold is simplified, and the manufacture of the mold can be performed easily and at low cost.

As described above, according to the present embodiment, the piece mold can be made compact and simple.
In addition, it is possible to prevent warpage due to heating during the tray baking process, and to use a low-cost material such as polypropylene or polyamide without using a high-cost material that does not warp as a piece material. . When an IC is housed as a piece material, a conductive material is preferable in terms of measures against static electricity. On the other hand, when capacitors and resistors are accommodated, there is no particular limitation.

In the above embodiment, the piece may be made of not only resin but also metal or ceramic. Further, as the tray body, not only aluminum but also other metals such as iron, other heat-resistant resins, and other heat-resistant members such as ceramics can be used. Further, the tray body may be made of a thermoplastic resin. Although the thermoplastic resin has a problem of deformation at the time of heating, the effect of the present invention can also be exerted by using the tray of this embodiment at the stage of manufacturing an IC in which baking is not usually performed.

Furthermore, the notch 16 of the above embodiment corresponds to the recess formed in the tray main body in the present invention, but can be formed in a groove shape that does not penetrate this, and the shape is the same as that of the above embodiment. However, the shape is not limited to a rectangle, and other shapes such as a circle can be selected. Further, the electronic components to be stored may be those that are stored in a tray, and may be not only those packaged with resin but also non-packaged ones.

[0032]

As described above, according to the present invention, there is provided a tray body, and a housing for electronic components formed separately from the tray body, and the housing is formed on the tray body. Provided is an electronic component storage tray that can be manufactured easily and at low cost because the structure of the mold can be simplified because the structure is configured to be mounted in the plurality of recesses. Can be.

[Brief description of the drawings]

FIG. 1 is a plan view of an IC storage tray according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a sectional view taken along the line III-III of FIG. 1;

FIG. 4 is a plan view of a piece.

FIG. 5 is a right side view of FIG.

FIG. 6 is a sectional view taken along the line VI-VI in FIG. 4;

FIG. 7 is a half sectional perspective view of a piece.

FIG. 8 is a partial perspective view of the IC storage tray with a piece mounted.

FIG. 9 is a perspective view of a flat package type IC.

FIG. 10 is a half sectional perspective view of a piece according to a second embodiment of the present invention.

11 is a partial perspective view showing a state in which the piece of FIG. 10 is stored in a main body tray.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Storage tray 12 Tray main body 14 Resin piece (storage body) 16 Notch hole (recess)

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-254584 (JP, A) JP-A-2-86137 (JP, U) JP-A 57-17144 (JP, U) (58) Investigation Field (Int.Cl. ⁷ , DB name) B65D 85/38 B65D 85/00

Claims (3)

(57) [Claims] 1. A tray body, comprising: a tray body; and an electronic component storage body formed separately from the tray body, wherein the storage body is formed in the tray body. And installed in the notches
The tray body includes a first layer and a second layer,
When the layer and the second layer are overlapped, the notch of the second layer is aligned with the notch of the first layer, and the notch of the second layer is one rounder than the notch of the first layer. Formed large,
The storage body has a substantially U-shaped leg in the direction of the tray main body, and a notch groove formed at an end of the leg is engaged with a corner of a notch hole in the first layer of the tray main body.
A storage tray for electronic components, wherein the storage body is mounted on the tray body. 2. The tray main body further includes a third layer, wherein the second layer is formed to be slightly larger than the first layer and the third layer, and a protruding portion serves as a flange. The electronic component tray according to claim 1. 3. The storage device according to claim 1, further comprising a rib on which the bent portion of the lead pin of the electronic component is placed.
Electronic component tray as described.