JP3265704B2 - Evaluation method of adhesion of resin film applied on film - Google Patents

Evaluation method of adhesion of resin film applied on film

Info

Publication number
JP3265704B2
JP3265704B2 JP10169893A JP10169893A JP3265704B2 JP 3265704 B2 JP3265704 B2 JP 3265704B2 JP 10169893 A JP10169893 A JP 10169893A JP 10169893 A JP10169893 A JP 10169893A JP 3265704 B2 JP3265704 B2 JP 3265704B2
Authority
JP
Japan
Prior art keywords
film
resin
adhesion
resin film
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP10169893A
Other languages
Japanese (ja)
Other versions
JPH06308018A (en
Inventor
慎也 藤松
繁人 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Ink SC Holdings Co Ltd
Original Assignee
Toyo Ink SC Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Ink SC Holdings Co Ltd filed Critical Toyo Ink SC Holdings Co Ltd
Priority to JP10169893A priority Critical patent/JP3265704B2/en
Publication of JPH06308018A publication Critical patent/JPH06308018A/en
Application granted granted Critical
Publication of JP3265704B2 publication Critical patent/JP3265704B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、インキ,接着剤,塗料
などの分野において、フィルム上に塗工した樹脂皮膜の
密着性を評価する方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for evaluating the adhesion of a resin film applied on a film in the fields of inks, adhesives, paints and the like.

【0002】[0002]

【従来の技術】従来、基材フィルム上に塗工された樹脂
皮膜とフィルム間の付着性などの特性を評価する目的
で、各種の方法が提案されている。例えば、粘着テープ
を樹脂皮膜の上に圧着して、テープを引き剥がした際の
樹脂皮膜の剥がれ具合を比較する方法があるが、この方
法では、樹脂皮膜の付着力だけでなく樹脂皮膜の凝集力
の影響も受けてしまう。したがって、じん性の大きい樹
脂皮膜は凝集力が大きいので、付着力が大きくても測定
結果が悪く現れる傾向があり、一方、もろい樹脂皮膜は
付着力が小さくても凝集力も小さいので、見かけの付着
力は良く現れてしまう欠点を持っている。
2. Description of the Related Art Conventionally, various methods have been proposed for the purpose of evaluating properties such as adhesion between a resin film coated on a base film and the film. For example, there is a method to compare the degree of peeling of the resin film when the adhesive tape is pressed on the resin film and the tape is peeled off. It is also affected by power. Therefore, a resin film having a high toughness has a large cohesive force, so that the measurement result tends to be poor even if the adhesive force is large. Strength has the drawback that it appears well.

【0003】また、鋭利な切れ刃を用いて樹脂皮膜表面
部から界面部にかけて連続して切削し、その時の力を測
ることによって、樹脂皮膜内での切削力から剪断強度
を、界面での切削中の力から付着強度を求める方法も提
案されている。更に、樹脂皮膜の上に接着剤を塗布しそ
の上に被着体を乗せ、全体を垂直に引き上げたときの力
を測定する方法などが挙げられる。しかし、これらの方
法は塗膜とフィルムとの間の力を測っているため、密着
性即ち濡れ性、表面被覆率、それがどの様な形態で接着
しているかの情報は提供してない。また、試料を破壊し
なければ測定できないなどの問題を持っている。
[0003] In addition, by cutting continuously from the resin film surface to the interface using a sharp cutting edge, and measuring the force at that time, the shear strength from the cutting force in the resin film, cutting at the interface A method for determining the adhesive strength from the force in the middle has also been proposed. Further, there is a method in which an adhesive is applied on a resin film, an adherend is placed on the adhesive, and a force is measured when the whole is pulled up vertically. However, since these methods measure the force between the coating and the film, they do not provide any information on adhesion, ie, wettability, surface coverage, and in what form they adhere. In addition, there is a problem that measurement cannot be performed unless the sample is destroyed.

【0004】[0004]

【発明が解決しようとする課題】本発明者らは、上記の
問題に鑑み鋭意検討した結果、レーザー光を用いること
により、従来のように基材フィルム上に塗装された樹脂
皮膜を引き剥がすと言う手段に頼らず、基材フィルムと
樹脂皮膜の間の密着性を非破壊で測定できることを見出
し、本発明に至った。
SUMMARY OF THE INVENTION The present inventors have conducted intensive studies in view of the above problems, and as a result, have found that, by using a laser beam, a resin film coated on a substrate film as in the prior art was peeled off. The present invention has been found that the adhesion between the base film and the resin film can be measured without destruction without relying on such means.

【0005】[0005]

【問題を解決するための手段】すなわち、本発明は、樹
脂を塗工したフィルムの断面方向からフィルム断面に垂
直にレーザー光を照射し、フィルム内に入った光がフィ
ルムを通過する間にフィルム上に塗工した樹脂の密着性
の度合いにより樹脂層に漏れる光の量が異なることを利
用して、反対側の断面から出射した光の量を測定するこ
とにより密着性を評価する方法を提供する。
That is, the present invention provides a method of irradiating a laser beam from a cross-sectional direction of a resin-coated film to a direction perpendicular to the cross-section of the film so that the light entering the film passes through the film. Utilizing the fact that the amount of light leaking into the resin layer depends on the degree of adhesion of the resin applied above, a method is provided for evaluating the adhesion by measuring the amount of light emitted from the cross section on the opposite side I do.

【0006】以下に、本発明の原理を幾分解図的に示し
た図1〜4に基づき、本発明を説明する。図1は、基材
フィルムとフィルム上に塗工した樹脂皮膜との密着性が
高い場合を示している。この図において、Aはレーザー
光の軌跡を、Bは樹脂Cが塗工されたフィルムを示す。
基材フィルムとフィルム上に塗工した樹脂皮膜との密着
性が高い場合には、基材フィルムと樹脂の間には空気層
のようなものが存在せず、また樹脂も配向していると考
えられる。したがって、光は基材フィルムと樹脂皮膜の
間で反射せずに殆ど樹脂皮膜に入り込んでしまうため、
フィルム内に残る光の量は少なくなる。
Hereinafter, the present invention will be described with reference to FIGS. 1 to 4 which show the principle of the present invention in an exploded view. FIG. 1 shows a case where the adhesion between the base film and the resin film applied on the film is high. In this figure, A indicates a locus of a laser beam, and B indicates a film coated with a resin C.
When the adhesion between the base film and the resin film applied on the film is high, there is no air layer between the base film and the resin, and the resin is also oriented. Conceivable. Therefore, since light almost enters the resin film without being reflected between the base film and the resin film,
The amount of light remaining in the film is reduced.

【0007】それに対して、図2は、基材フィルムとフ
ィルム上に塗工した樹脂皮膜との密着性が低い場合を示
している。この図において、Aはレーザー光の軌跡を、
Bは樹脂Cが塗工されたフィルムを示す。基材フィルム
とフィルム上に塗工した樹脂皮膜との密着性が低い場合
には、基材フィルムと樹脂の間には空気層Dのようなも
のが存在しており、また樹脂も配向していないと考えら
れる。したがって、光は基材フィルムと樹脂皮膜の間で
反射してしまい樹脂皮膜に入り込む光の量は少ないた
め、フィルム内に残る光の量は多い。
On the other hand, FIG. 2 shows a case where the adhesion between the substrate film and the resin film applied on the film is low. In this figure, A represents the trajectory of the laser beam,
B shows a film coated with resin C. When the adhesion between the base film and the resin film applied on the film is low, there is an air layer D between the base film and the resin, and the resin is also oriented. It is thought that there is not. Accordingly, light is reflected between the base film and the resin film, and the amount of light that enters the resin film is small, so that the amount of light remaining in the film is large.

【0008】図3は、基材フィルムとフィルム上に塗工
した樹脂皮膜との密着性が高く樹脂皮膜の上に光吸収層
を設けた場合を示している。この図において、Aはレー
ザー光の軌跡を、Bは樹脂Cが塗工されたフィルムを、
Eは光吸収層を示す。基材フィルムとフィルム上に塗工
した樹脂皮膜との密着性が高い場合には、基材フィルム
と樹脂の間には空気層のようなものが存在せず、また樹
脂も配向していると考えられる。したがって、光は基材
フィルムと樹脂皮膜の間で反射せずに殆ど樹脂皮膜に入
り込んでしまう。樹脂皮膜に入り込んだ光は樹脂層中を
進むが、この場合に樹脂層に光を吸収する能力がない
と、光は樹脂皮膜の表面で反射してしまい、またフィル
ムに戻ってしまうことがある。そこで、樹脂層に光を吸
収する能力がない場合には、これを防止するために、樹
脂皮膜の表面に光吸収層を設ける必要がある。
FIG. 3 shows a case where a light absorbing layer is provided on the resin film because of high adhesion between the base film and the resin film coated on the film. In this figure, A is the trajectory of the laser beam, B is the film coated with resin C,
E indicates a light absorbing layer. When the adhesion between the base film and the resin film applied on the film is high, there is no air layer between the base film and the resin, and the resin is also oriented. Conceivable. Therefore, light almost enters the resin film without being reflected between the base film and the resin film. Light that has entered the resin film travels through the resin layer.In this case, if the resin layer does not have the ability to absorb light, the light may be reflected on the surface of the resin film and return to the film. . Therefore, if the resin layer does not have the ability to absorb light, it is necessary to provide a light absorbing layer on the surface of the resin film in order to prevent this.

【0009】図4は、基材フィルムとフィルム上に塗工
した樹脂皮膜との密着性が高い場合に樹脂皮膜の上に光
吸収層を設け、さらにフィルムを湾曲させた場合を示し
ている。この図において、Aはレーザー光の軌跡を、B
は樹脂Cが塗工されたフィルムを、Eは光吸収層を示
す。基材フィルムとフィルム上に塗工した樹脂皮膜との
密着性が高い場合には、基材フィルムと樹脂の間には空
気層のようなものが存在せず、また樹脂も配向している
と考えられる。したがって、光は基材フィルムと樹脂皮
膜の間で反射せずに殆ど樹脂皮膜に入り込んでしまうと
考えられる。
FIG. 4 shows a case where a light absorbing layer is provided on the resin film when the adhesion between the base film and the resin film coated on the film is high, and the film is further curved. In this figure, A is the trajectory of the laser beam, B
Denotes a film coated with resin C, and E denotes a light absorbing layer. When the adhesion between the base film and the resin film applied on the film is high, there is no air layer between the base film and the resin, and the resin is also oriented. Conceivable. Therefore, it is considered that light almost enters the resin film without being reflected between the base film and the resin film.

【0010】しかし、レーザー光は直進性が高くフィル
ム内をほぼ直進してしまうため、フィルムから樹脂層に
入り込む際の入射角を大きく取れない(フィルムを湾曲
させない)場合には、樹脂皮膜の密着性に係わらずほと
んど全ての入射したレーザー光がフィルム内を透過して
しまい、樹脂皮膜の密着性を評価することが困難にな
る。また、基材フィルムの屈折率が樹脂皮膜の屈折率よ
り高い場合には、全反射条件に到達してしまい、密着性
が高くても強度が減少しないこともある。したがって、
フィルムを湾曲させ入射角を変えられるようにすること
が好ましい。
However, since the laser beam has high rectilinearity and travels substantially straight in the film, if the angle of incidence when entering the resin layer from the film cannot be made large (the film is not curved), the adhesion of the resin film will not occur. Irrespective of the properties, almost all of the incident laser light passes through the film, making it difficult to evaluate the adhesion of the resin film. When the refractive index of the base film is higher than the refractive index of the resin film, the total reflection condition is reached, and the strength may not be reduced even if the adhesion is high. Therefore,
Preferably, the film is curved so that the angle of incidence can be changed.

【0011】[0011]

【実施例】以下に、図5〜13を参照して、本発明を実施
例に基づき更に詳細に説明する。図5及び図6は、本発
明のフィルム上に塗工した樹脂皮膜の密着性評価方法の
実施例の一つを幾分解図的に示す一部断面による平面図
及び側面図である。この図において、2は樹脂3が塗工
されたフィルムである。レーザー光発射光源1より放射
されたレーザー光は樹脂3を塗工したフィルム2の断面
よりフィルム内部に入り、フィルム内部を通り反対側の
断面に到達する。断面に達したレーザー光はフィルム断
面より外に出ていき、この光をフォトダイオード4で受
光する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail below with reference to FIGS. FIGS. 5 and 6 are a plan view and a side view of a partial cross section showing one of the embodiments of the method for evaluating the adhesion of a resin film applied on a film according to the present invention. In this figure, reference numeral 2 denotes a film coated with a resin 3. The laser light emitted from the laser light emitting light source 1 enters the inside of the film from the cross section of the film 2 coated with the resin 3, and reaches the cross section on the opposite side through the inside of the film. The laser beam that has reached the cross section goes out of the cross section of the film, and this light is received by the photodiode 4.

【0012】より詳細には、レーザー光発射光源1より
発射されたレーザー光をフィルム断面に正確に照射する
ため、レーザー光発射光源1は左右に微小な移動が可能
な台7の上に固定されている。更にフィルムを固定する
ために押さえ治具5、6を用いている。押さえ治具6は
フィルムの撓みを無くすため前後方向に微動が可能な台
8の上に乗せている。さらに、レーザー光発射光源、押
さえ治具5、6の3者の高さを一致させるためそれぞれ
を台9、10、11の上に乗せている。フォトダイオード4
はフィルム断面に達した光をより正確に受けるためにフ
ィルム断面からできるだけ近傍に設置する。
More specifically, in order to accurately irradiate the laser light emitted from the laser light emitting light source 1 to the cross section of the film, the laser light emitting light source 1 is fixed on a table 7 which can move minutely right and left. ing. Further, holding jigs 5 and 6 are used to fix the film. The holding jig 6 is placed on a table 8 which can be finely moved in the front-rear direction in order to eliminate bending of the film. Further, the laser light emitting light source and the holding jigs 5 and 6 are placed on the tables 9, 10 and 11, respectively, in order to make the heights of the three equal. Photodiode 4
Is installed as close as possible from the film cross section in order to receive the light reaching the film cross section more accurately.

【0013】図7及び図8は、図5及び図6に示す実施
例にフィルムが湾曲できる仕組みを組み込んだ実施例を
示す一部断面による側面図及び平面図である。この実施
例に於いては、フィルムに塗布した樹脂皮膜表面に光吸
収層12を設け、また押さえ治具5、6の下にフィルムが
湾曲できるように回転ステージ13を組み込んでいる。こ
の実施例に於いて押さえ治具5は回転ステージの上に位
置するが、回転しないように回転ステージの外側で固定
する必要がある。回転ステージ13は、押さえ治具5、6
の中間点を中心として回転するように設置する。何度か
回転した場合の平面図を図9に示す。この図に示すよう
に、回転ステージを回転させることでフィルムが湾曲し
入射角を変化させることが可能となる。
FIGS. 7 and 8 are a side view and a plan view, partly in section, showing an embodiment in which a mechanism capable of bending a film is incorporated in the embodiment shown in FIGS. 5 and 6. FIG. In this embodiment, a light absorbing layer 12 is provided on the surface of the resin film applied to the film, and a rotating stage 13 is incorporated under the holding jigs 5 and 6 so that the film can be curved. In this embodiment, the holding jig 5 is located on the rotary stage, but needs to be fixed outside the rotary stage so as not to rotate. The rotating stage 13 includes holding jigs 5 and 6
It is installed so as to rotate around the midpoint of. FIG. 9 shows a plan view in the case of several rotations. As shown in this figure, by rotating the rotary stage, the film is curved and the incident angle can be changed.

【0014】図10及び図11は、図7及び図8に示すフィ
ルムを湾曲できる装置が付いた密着性測定装置を用い
て、通常の手法で合成したウレタン樹脂A,B皮膜の基
材への密着性を測定した結果である。図に於いて縦軸は
センサーの出力を、横軸はフィルムの折り曲げ角、つま
り治具5、6の間の角度を示している。この場合、押さ
え治具5、6が一直線上に並んでいる場合、つまりフィ
ルムが真っ直ぐな状態を0度とし、光吸収層を内側に折
り曲げた場合を−90度、外側に折り曲げた場合を90度と
した。接着性の高いウレタン樹脂Aについて測定した結
果を図10に示す。図に示されているように、フィルムの
折り曲げ角度を変えるとセンサーの出力は大きく低下し
ほぼ0となっている。これは、レーザー光が樹脂皮膜の
方に入り込み樹脂皮膜上に設けている光吸収層に吸収さ
れたためと考えられる。したがって、この場合は密着性
は高いと考えられる。それに対して、接着性の低いウレ
タン樹脂Bを測定した結果を図11に示す。この場合はウ
レタンAで見られたようなフィルムの折り曲げ角度を変
えた場合のセンサー出力の低下は見られない。
FIGS. 10 and 11 show the adhesion of urethane resin A and B coatings to a base material synthesized by a usual method using an adhesion measuring device equipped with a device capable of bending the film shown in FIGS. 7 and 8. It is the result of measuring the adhesion. In the figure, the vertical axis represents the output of the sensor, and the horizontal axis represents the bending angle of the film, that is, the angle between the jigs 5 and 6. In this case, when the holding jigs 5 and 6 are arranged in a straight line, that is, when the film is in a straight state, it is set to 0 °, when the light absorbing layer is bent inward, −90 °, and when it is bent outward, 90 °. Degree. FIG. 10 shows the measurement results of the urethane resin A having high adhesiveness. As shown in the figure, when the bending angle of the film is changed, the output of the sensor is greatly reduced to almost zero. This is probably because the laser light entered the resin film and was absorbed by the light absorbing layer provided on the resin film. Therefore, in this case, it is considered that the adhesion is high. On the other hand, FIG. 11 shows the measurement result of urethane resin B having low adhesiveness. In this case, the sensor output does not decrease when the bending angle of the film is changed as in the case of urethane A.

【0015】図12及び図13は、図7及び図8に示すフィ
ルムを湾曲できる装置が付いた密着性測定装置を用い
て、通常の手法で合成したウレタン樹脂C皮膜の基材へ
の密着性について経時での変化を測定した結果である。
図に於いて縦軸及び横軸は図10と同様である。図12は塗
工直後の様子を表しており、この時の接着性は低い。ま
た図13は塗工してから3日後の様子を表しており、この
時の接着性は高い。これより塗工直後は密着性が低い
が、経時で密着性が上がっていることが分かる。
FIGS. 12 and 13 show the adhesion of the urethane resin C film to the substrate, which was synthesized by a usual method, using an adhesion measuring device equipped with a device capable of bending the film shown in FIGS. 7 and 8. 5 shows the results of measuring the change over time with respect to.
In the figure, the vertical and horizontal axes are the same as in FIG. FIG. 12 shows a state immediately after coating, and the adhesiveness at this time is low. FIG. 13 shows a state three days after the coating, and the adhesiveness at this time is high. From this, it can be seen that the adhesion is low immediately after coating, but the adhesion has increased over time.

【0016】以上、本発明を特定の実施例について詳細
に説明したが、本発明がかかる実施例にのみ限られたも
のではなく、本発明の範囲内にて他の種々の実施例が可
能であることは当業者にとって明らかであろう。
Although the present invention has been described in detail with reference to specific embodiments, the present invention is not limited to such embodiments, and various other embodiments are possible within the scope of the present invention. Some will be apparent to those skilled in the art.

【0017】[0017]

【発明の効果】本発明により、基材フィルムと樹脂皮膜
との間の密着性を非破壊で測定できるようになった。
According to the present invention, the adhesion between the substrate film and the resin film can be measured without destruction.

【0018】[0018]

【図面の簡単な説明】[Brief description of the drawings]

【図1】基材フィルムと樹脂皮膜との密着性が高い場合
の本発明の原理図。
FIG. 1 is a principle diagram of the present invention when the adhesion between a base film and a resin film is high.

【図2】基材フィルムと樹脂皮膜との密着性が低い場合
の本発明の原理図。
FIG. 2 is a diagram illustrating the principle of the present invention when the adhesion between a base film and a resin film is low.

【図3】基材フィルムと樹脂皮膜との密着性が高く、樹
脂皮膜上に光吸収層を設けた場合の本発明の原理図。
FIG. 3 is a principle diagram of the present invention in a case where the adhesion between a base film and a resin film is high and a light absorbing layer is provided on the resin film.

【図4】基材フィルムと樹脂皮膜との密着性が高く、樹
脂皮膜上に光吸収層を設け、さらにフィルムを湾曲させ
た場合の本発明の原理図。
FIG. 4 is a principle diagram of the present invention in a case where the adhesion between a base film and a resin film is high, a light absorbing layer is provided on the resin film, and the film is further curved.

【図5】本発明のフィルム上に塗工した樹脂皮膜の密着
性評価方法の一つの実施例を示す一部断面による平面
図。
FIG. 5 is a plan view of a partial cross section showing one embodiment of the method for evaluating the adhesion of a resin film applied on a film of the present invention.

【図6】上記実施例の一部断面による側面図。FIG. 6 is a side view of a partial cross section of the embodiment.

【図7】本発明のフィルム上に塗工した樹脂皮膜の密着
性評価方法の他の実施例を示す一部断面による平面図。
FIG. 7 is a partial cross-sectional plan view showing another embodiment of the method for evaluating the adhesion of a resin film applied on a film of the present invention.

【図8】上記他の実施例の一部断面による側面図。FIG. 8 is a side view of a partial cross section of the other embodiment.

【図9】本発明のフィルム上に塗工した樹脂皮膜の密着
性評価方法の他の実施例でフィルムを湾曲させた場合を
示す一部断面による平面図。
FIG. 9 is a partial cross-sectional plan view showing a case where a film is curved in another embodiment of the method for evaluating the adhesion of a resin film applied on a film according to the present invention.

【図10】図7および図8に示す樹脂皮膜の密着性測定装
置を用いて測定した接着性が良いウレタン樹脂皮膜の密
着性評価結果。
FIG. 10 shows the results of evaluation of the adhesion of a urethane resin film having good adhesion measured using the resin film adhesion measuring device shown in FIGS. 7 and 8.

【図11】図7および図8に示す樹脂皮膜の密着性測定装
置を用いて測定した接着性が悪いウレタン樹脂皮膜の密
着性評価結果。
FIG. 11 shows the results of the evaluation of the adhesion of a urethane resin film having poor adhesion measured using the resin film adhesion measurement device shown in FIGS. 7 and 8.

【図12】図7および図8に示す樹脂皮膜の密着性測定装
置を用いて測定した塗工直後のウレタン樹脂皮膜の密着
性評価結果。
FIG. 12 shows the results of the evaluation of the adhesion of the urethane resin film immediately after coating, measured using the resin film adhesion measuring device shown in FIGS. 7 and 8.

【図13】図7および図8に示す樹脂皮膜の密着性測定装
置を用いて測定した塗工3日後のウレタン樹脂皮膜の密
着性評価結果。
FIG. 13 shows the results of evaluation of the adhesion of the urethane resin film three days after application, which were measured using the resin film adhesion measurement device shown in FIGS. 7 and 8.

【符号の説明】[Explanation of symbols]

A・・・ レーザー光の軌跡 B・・・ 基材フィルム C・・・ 樹脂皮膜 D・・・ 空気層 E・・・ 光吸収層 1・・・ レーザー光発射光源 2・・・ 基材フィルム 3・・・ 樹脂皮膜 4・・・ フォトダイオード 5・・・ 押さえ治具 6・・・ 押さえ治具 7・・・ 左右に微小な移動が可能な台 8・・・ 前後に微小な移動が可能な台 9・・・ レーザー発射光源を乗せる台 10・・・ 押さえ治具5を乗せる台 11・・・ 押さえ治具6を乗せる台 12・・・ 光吸収層 13・・・ 回転ステージ A: Trace of laser light B: Base film C: Resin film D: Air layer E: Light absorbing layer 1: Laser light emitting light source 2: Base film 3 ... Resin film 4 ... Photodiode 5 ... Holding jig 6 ... Holding jig 7 ... A table that can move minutely right and left 8 ... It can move minutely forward and backward Table 9 ... Table on which laser emitting light source is mounted 10 ... Table on which holding jig 5 is mounted 11 ... Table on which holding jig 6 is mounted 12 ... Light absorbing layer 13 ... Rotating stage

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平2−228559(JP,A) 特開 平5−29423(JP,A) 特開 平3−12542(JP,A) 特開 昭61−148345(JP,A) 特開 平5−99840(JP,A) 特開 昭61−97551(JP,A) (58)調査した分野(Int.Cl.7,DB名) G01N 33/44 G01N 21/84 G01N 19/04 JICSTファイル(JOIS)────────────────────────────────────────────────── (5) Continuation of the front page (56) References JP-A-2-228559 (JP, A) JP-A-5-29423 (JP, A) JP-A-3-12542 (JP, A) JP-A-61- 148345 (JP, A) JP-A-5-99840 (JP, A) JP-A-61-97551 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) G01N 33/44 G01N 21 / 84 G01N 19/04 JICST file (JOIS)

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 樹脂を塗工したフィルムの断面方向から
フィルム断面に垂直にレーザー光を照射し、フィルム内
に入った光がフィルムを通過する間にフィルム上に塗工
した樹脂の密着性の度合いにより樹脂層に漏れる光の量
が異なることを利用して、反対側の断面から出射した光
の量を測定することにより密着性を評価する方法。
A laser beam is irradiated from the cross-sectional direction of the resin-coated film to the film cross-section perpendicular to the film cross-section, and the adhesion of the resin coated on the film while the light entering the film passes through the film. A method of evaluating the adhesion by measuring the amount of light emitted from the cross section on the opposite side, utilizing the fact that the amount of light leaking into the resin layer varies depending on the degree.
【請求項2】 樹脂皮膜表面に、樹脂層に入ってきた光
を吸収させるため光吸収層を設けることを特徴とする請
求項1記載の密着性評価法。
2. The method for evaluating adhesion according to claim 1, wherein a light absorbing layer is provided on the surface of the resin film for absorbing light entering the resin layer.
【請求項3】 フィルムから樹脂層に光が入射する際の
入射角を、フィルムを折り曲げることによって変えるこ
とを特徴とする請求項1または2記載の密着性評価法。
3. The method for evaluating adhesion according to claim 1, wherein the angle of incidence when light enters the resin layer from the film is changed by bending the film.
JP10169893A 1993-04-28 1993-04-28 Evaluation method of adhesion of resin film applied on film Expired - Fee Related JP3265704B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10169893A JP3265704B2 (en) 1993-04-28 1993-04-28 Evaluation method of adhesion of resin film applied on film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10169893A JP3265704B2 (en) 1993-04-28 1993-04-28 Evaluation method of adhesion of resin film applied on film

Publications (2)

Publication Number Publication Date
JPH06308018A JPH06308018A (en) 1994-11-04
JP3265704B2 true JP3265704B2 (en) 2002-03-18

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Country Link
JP (1) JP3265704B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW552188B (en) * 2001-11-16 2003-09-11 Towa Corp Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resin
JP4546861B2 (en) * 2005-03-23 2010-09-22 住友ゴム工業株式会社 Contact interface area evaluation method and contact interface area evaluation apparatus

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