JP3236000B2 - Optical disk substrate recovery method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a method for collecting a substrate of a broadly-defined optical disk including a write-once optical disk referred to as a so-called, read-only disk referred to as a CD-ROM, and a so-called magneto-optical disk.

[0002]

2. Description of the Related Art Recently, computer program development,
Increasingly, write-once optical discs called CD-Rs are used for confidential records such as corporate account books.
For example, in a company that develops computer programs,
Hundreds of CD-Rs may be used per day.

However, most of them are discarded and discarded because unfinished programs have been recorded or have been written incorrectly, and CD-Rs thus discarded are discarded. Since important data is written therein, confidential matters may leak to the outside unless the written data is destroyed before discarding.

In view of the above, with respect to data destruction of an optical disc to be discarded, conventionally, the following methods of destructing data or making data unreadable have been proposed.

A method of destroying data by applying a data destruction paint to the recording surface of the optical disk or irradiating the optical disk with a high-power laser beam (Japanese Patent Laid-Open No. 9-97432).

[0006] A method of applying a heat of 80 to 150 degrees Celsius to an optical disk to cause a thermal change around data pits to disable data reading (Japanese Patent Laid-Open No.
-214424).

Focusing on the fact that the adhesion between the reflective layer and the light absorbing layer (organic layer) constituting the recording layer is rather poor, an adhesive tape is adhered to the surface of the protective layer on the reflective layer, and the adhesive tape is pulled. A method in which the reflection layer is separated from the light absorption layer (organic layer) by peeling to make data unreadable (Japanese Patent Laid-Open No. 5-166231).

The recording layer and the reflective layer are polished with a polishing body obtained by mixing abrasive grains and an adhesive on a support and hot-pressing a polishing sheet processed into a cylindrical shape while supplying water to read data. Disabling method (Japanese Patent Laid-Open No. 5-210873)
No.).

[0009]

However, according to the above-mentioned method and the above-mentioned method, the disk after the disk data is destroyed has a light absorbing agent and a metal film such as aluminum or gold constituting a reflecting layer on a transparent synthetic resin substrate. Therefore, even if it is disposed of as garbage, it is not separated into plastic and metal, so that there is a problem in disposal processing. Further, in order to use such an optical disk as a resource, it is necessary to further separate the optical disk into a mode in which at least the synthetic resin substrate and the metal of the reflection film can be recovered.

Next, according to the above method, the light absorbing layer and the reflecting layer as recording layers are separated from each other, but the light absorbing layer and the synthetic resin substrate are not separated. In order to recycle the light-absorbing layer, the light-absorbing layer must be further separated and removed from the synthetic resin substrate. Of course, even if such a separation and removal is not technically difficult for a specialist, the separation between the light absorbing layer and the synthetic resin substrate must be performed separately, which is a troublesome task. Efficiency is poor.

Further, according to the above method, the optical disk is polished while supplying water, so that the treatment of the water containing the powder polished and separated from the optical disk and the case where the reflection layer is formed of a noble metal are used. In addition, the extraction of the noble metal is rather troublesome, and the electric system of the device using the method requires appropriate waterproofing measures, and the production of the device itself is also troublesome.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and it is impossible to mechanically and simultaneously perform data destruction of an optical disk and separation of a recording layer and a reflective layer from a substrate. It is another object of the present invention to provide a method of recovering a pure synthetic resin substrate to which the powder that has been polished and peeled is easily processed and to which the constituent materials of the recording layer and the reflective layer are not adhered.

[0013]

In order to achieve the above object, a method of recovering an optical disk substrate according to the present invention is directed to a method for recovering an optical disk having a recording layer and a reflective layer sequentially laminated on a transparent synthetic resin substrate. The layer and the reflective layer are removed from the substrate by polishing from the reflective layer side without supplying water using a polishing means, and the separated powder is polished and removed using a collecting means. An optical disk substrate recovery method that collects powder and recovers a pure and transparent synthetic resin substrate to which the materials constituting the recording layer and the reflective layer are not adhered.
In the polishing, the substrate at the polishing position is taken as the upper surface.
To be performed by the polishing means arranged below the optical disc
On the other hand, the powder that has been polished and peeled is collected using a vacuum pump.
The polishing member and the disc-shaped support constituting the polishing means by the step
The through holes in the thickness direction provided at the corresponding positions of the holding plate
A configuration is adopted in which the powder is collected after passing through .

According to this substrate collecting method, the recording layer and the reflective layer are reliably separated from the transparent synthetic resin substrate of the optical disk by polishing from the reflective layer side, and each material constituting the recording layer and the reflective layer is removed. Pure and transparent synthetic resin substrates that have not adhered can be recovered. In addition to this,
Since the polishing is performed without supplying water and the powder that has been polished and separated is collected using a powder collecting means, the processing of the powder that has been polished and separated is easy.

[0015] The collecting powder means that using a vacuum pump
When the powder that has been polished and separated from the optical disc is sucked,
In addition, by suctioning air around the polishing position , a temperature rise due to frictional heat generated by polishing can be reduced by air cooling. In addition, the powder that has been removed by polishing is
Corresponding positions of the polishing member and the disk-shaped support plate constituting the step
After passing through the thickness through hole provided in the
Since it is assumed that, would Atsumariko and air cooling is efficiently performed.

The optical disk is polished and peeled off by a polishing means.
Polishing and peeling position by air stirring means arranged below
It is preferable to carry out while stirring the periphery . This is because, by performing the stirring, the suction by the vacuum pump and the powder collection can be efficiently performed. And polishing peeling
The collected powder was provided on the side of the air stirring means.
In the case of performing by means of dust collection with a cavity
Can make the powder collection more efficiently.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A description will be given below of a substrate collecting apparatus (A) using a substrate collecting method according to the present invention with reference to an embodiment.

FIGS. 1 and 2 show the substrate recovery apparatus (A).
The substrate collection device (A) is housed in a box (8) about the size of a microwave oven for home use, and a large number of sheets are placed in the lower front part of the box (8). An optical disk storage part (10) for storing the optical disk (D); a polishing means (20) for polishing the optical disk (D);
A substrate storage part (50) is provided for storing the disk substrate (1) from which the recording layer (2) and the reflective layer (3) have been peeled off by (0). An openable and closable lid (9) that pivots up and down is provided on the front surface of the box (8).
When storing the optical disc in the optical disc storage section (10) and collecting the substrate (1), the lid (9) is flipped up to open the front surface of the box (8). It has been done.

The optical disk storage section (10) is shown in FIG.
As shown in (a), a large number of optical discs (D) and (D)
Positioning columns (11) contacting the outer periphery of the optical disk (D) are arranged upright at equal intervals so that... Positioning pillar (11)
(11) are arranged so as to be in contact with the outer periphery of the optical disk (D) in order not to hinder the lowering of the disk holder (41) of the transport means (40) described later. The optical disk (D) in the optical disk storage section (10) is to be stored with the disk substrate (1) facing upward.

The substrate storage section (50) is provided with a substrate holding column (51) standing upright in the center of the disk substrate (1) and inserted through the center hole of the disk substrate (1). The disc substrate (1) which has been transported and from which the recording layer (2) and the reflective layer (3) have been polished and peeled off is dropped from above, and the substrate holding column (51) is inserted into the center hole of the disc substrate (1). Is to be retained. The substrate holding column (51) has a conical upper end, so that it can be relatively easily inserted into the center hole of the disk substrate (1).

The polishing means (20) includes a pair of driving motors (21) (21) and polishing members (24) (24) rotated by the motors (21) (21). Motor (2
1) (21) is mounted in a suspended state with respect to the support plate (22), and each rotating shaft (21a) (21a) is attached to the support plate (22).
Project upward from below. At the center of the support plate (22), a column (23) having a hub (23a) fitted into the center hole of the optical disk (D) at the upper end is protruded,
The position where the hub (23a) fits into the center hole of the optical disk (D) is the polishing position (29).

The rotating shaft (21a) of the motor (21) has
A disk-shaped polishing member (24) and a rotating plate for stirring (25) are mounted via a mounting sleeve (26). The polishing member (24) is detachably attached to a disk-shaped support plate (27) integrated with the upper end of the sleeve (26) as shown in FIG. Polishing member (24) and disk-shaped support plate (2
7) have multiple through holes (24
a) (24a), (27a), (27a), etc., and the powder polished and separated from the optical disk (D) is a disc-shaped support plate (27).
It is made to fall below. The stirring rotary plate (25) disposed below the disk-shaped support plate (27) has a plurality of blades (25b) (25) on the upper surface of the substrate (25a).
b) are protrudingly provided to stir the air above the stirring rotary plate (25) in accordance with the rotation of the driving motor (21), and to feed through holes (24) of the upper polishing member (24) and the disc-shaped support plate (27). 24a) (24
a)... (27a) The powder falling from the (27a)... is directed to the cavity (31) so that the powder collection by the powder collecting means (30) is performed efficiently. Further, scattering prevention walls (28a) and (28b) of the powder polished and separated from the substrate (1) are provided above and below the stirring rotary plate (25).
A similar powder scattering prevention wall (28c) is provided slightly obliquely above the periphery of the polishing position (29).

As shown in FIG. 2, the powder collecting means (30) includes a hollow part (31) provided on the side of the stirring rotary plate (25).
Vacuum pump (32) provided at the tip of the cavity (31)
And a discharge pipe (33) for discharging the sucked powder to the outside of the box (8). The discharge pipe (33) is connected to a dust collecting container (not shown) outside the box. .

The transport means (40) includes an optical disk storage (1)
The optical disk (D) transports the optical disk (D) from the polishing position (29) to the polishing position (29) and the optical disk substrate (1) from the polishing position (29) to the substrate storage portion (50). And a disk holder (41) for holding the disk substrate (1), and the above-mentioned transfer is performed by moving the disk holder (41) up, down, left and right.

The disc holder (41) has a holder board (42) having a rubber plate (43) adhered to the surface of the optical disc substrate (1) at the lower end, and a rubber plate (43),
An air flow passage (45) communicating with an air flow hole (44) provided in the holder board (42) is provided. The air flow passage (45) is connected to a suction pipe (46), and the tip of the suction pipe (46) is connected to a vacuum pump (47). By operating the vacuum pump (47), The space between the optical disk substrate (1) and the rubber plate (43) is evacuated to suck the optical disk (D) or the optical disk substrate (1) onto the rubber plate (43). Also, this disc holder (41) itself is a geared motor (48)
, And is rotated horizontally. In FIG. 2, the disc holder (41) is
Although it is located above the polishing position (29), actually, before starting the substrate recovery device (A), the optical disk storage (1)
0) or the board storage (5
0).

The method of using the disk substrate collecting apparatus (A) having the above structure will be described. First, the lid (9) of the box (8) is opened to open the optical disk storage (10).
Optical disks (D) (D) for which data should be destroyed
Are stored in the space surrounded by the positioning columns (11), (11), (11) and (11) with the optical disk substrate (1) facing upward. ) (D) ... are stacked in order.

Next, when the cover (9) is closed, the switch is turned on and the transport means (40) is operated, the disk holder (41) located above the optical disk storage section (10) descends. The rubber plate (43) comes into contact with the uppermost optical disc (D). At this time or before that, the vacuum pump (47) of the transport means (40) is operated, and the uppermost one optical disk (D) is sucked into the disk holder (41). When the optical disk (D) is reliably sucked into the disk holder (41), the disk holder (41) is moved above the polishing means (20), and the optical disk (D) is also transported above the polishing means (20). You. 1 and 2 show the state. Then, from this height position, the disc holder (41) gradually descends, the center hole of the optical disc (D) is fitted to the hub (23a) of the column (23), and the optical disc (D) is polished to the polishing member (24). ) Lightly press against (24). Then, the driving motor (21) of the polishing means (20)
The polishing members (24) and (24) driven by (21) also rotate, and are polished from the protective layer (4) to the reflective layer (3) and further to the recording layer (2), and the material constituting each layer Is powdered from the substrate (1) and is polished and peeled off.

The powder generated by the polishing is applied to the through-holes (24a) (27) of the polishing member (24) and the disc-shaped support plate (27).
The powder is agitated at the same time as falling downward through a), and the powder collecting means (30) sucks the powder and collects it in an external powder collecting container. In the case of CD-R, since the metal constituting the reflective layer is gold, the powder collected in this powder collecting container is relatively easy to collect gold by performing an appropriate treatment separately. Can be done.

When the polishing of the predetermined thickness is completed, the disk holder (41) rises while holding the disk substrate (1), and separates the center hole of the disk substrate (1) from the hub (23a) of the column. . As shown in FIG. 2, it is sufficient that the raised position is located slightly above the powder scattering prevention wall (28c) above the polishing members (24) and (24).

Then, from the raised position, the disk holder (41) is horizontally moved to above the substrate storage portion (50) while holding the disk substrate (1), and the center hole of the disk substrate (1) is moved. When the disk holder (41) is moved to a position right above the disk substrate holding column (51), the lowering of the disk holder (41) is started, and the center hole of the disk substrate (1) faces the upper end of the disk substrate holding column (51). And the suction pump (47) of the transfer means (40) stops, and the suction of the disk substrate (1) by the disk holder (41) is stopped. The disk substrate holding column (51) falls downward so as to be relatively inserted into the center hole of the disk holder (41) away from the disk holder (41), and is stored in the substrate storage part (50). This is a series of operations up to collecting the disk substrate (1) from one optical disk (D) in the substrate collecting device (A).

When the recovery of the disk substrate (1) from one optical disk (D) is completed in this way, the disk holder (41) is raised to a position where it can be moved horizontally, and then the optical disk storage section (10). Move horizontally upward. Then, after the disk holder (41) arrives above the disk storage section (10), the disk holder (41) is lowered, the optical disk is sucked, etc., that is, from the one optical disk (D) as described above. 2) and reflective layer (3)
A series of operations is performed until the pure and transparent disk substrate (1) whose surface has been polished and peeled off is recovered. Thereafter, the operation is performed until the lowermost one of the optical disks (D) stored in the optical disk storage unit (10). This series of operations will be repeated.

[0032]

As described above, according to the method for recovering an optical disk substrate according to the present invention, the optical disk (D) includes the reflecting layer (3).
By polishing from the side, the reflective layer (3) and the recording layer (2) are separated from the disk substrate (1) in powder form and peeled off, so that data is destroyed and the pure disk substrate (1) is recovered. Mechanically at once, it is possible to reliably prevent leakage of confidential information recorded on the optical disc (D) that has become unnecessary, and to further facilitate the recycling of the disc substrate (1).

In addition, since the polishing and peeling are performed without supplying water, the processing of the powder that has been polished and peeled is facilitated, and the substrate collecting apparatus (A) using this substrate collecting method is used. In particular, no special waterproofing measures are required, and the manufacturing cost of the substrate recovery device (A) can be reduced.

Further, since the powder that has been polished and peeled off is collected using the powder collecting means (30), the powder can be treated more rationally.

When a vacuum pump (32) is used for the dust collecting means (30), the vacuum pump sucks air around the polishing position, so that the temperature rise due to frictional heat generated by polishing is reduced, and the powder is collected. The substrate (1) to be melted can be prevented from melting.

When the optical disk (D) is polished and peeled while being stirred around the polished and peeled position by the air stirring means, the suction by the vacuum pump (32) and the powder collection are efficiently performed. be able to. In addition, the stirring can contribute to a reduction in temperature rise due to frictional heat generated by the polishing.

[Brief description of the drawings]

FIG. 1 is a schematic front view of an apparatus using an optical disk substrate recovery method according to the present invention.

FIG. 2 is a schematic side view of the same.

FIG. 3 is a side view showing a cross section of a part of the polishing means and a disk holder.

FIG. 4A is a schematic plan view of an optical disk storage unit,
(B) is a schematic plan view of the substrate storage unit.

FIG. 5 is a plan view of a disk-shaped support plate of the polishing member.

FIG. 6A is a partially enlarged sectional view of an optical disk,
(B) is an enlarged sectional view of the optical disk substrate.

[Explanation of symbols]

 A: Substrate recovery device D: Optical disk 1: Transparent synthetic resin substrate 2: Recording layer 3: Reflective layer 20: Polishing means 25: Air stirring means 30: Powder collecting means 32: Vacuum pump 40: Transport means

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G11B 7/26 B29B 17/02 B09B 5/00

Claims (2)

(57) [Claims] 1. An optical disc (D) comprising a transparent synthetic resin substrate (1), on which a recording layer (2) and a reflective layer (3) are sequentially laminated, the recording layer (2) and the reflective layer (3). By polishing from the reflective layer (3) side without supplying water using a polishing means (20), the powder separated and polished from the substrate (1) is collected while the powder is separated from the substrate (1). The powder is collected using the means (30), and the recording layer (2) and the reflective layer (3)
For recovering an optical disk substrate that recovers a pure and transparent synthetic resin substrate (1) having no material attached thereto
In the above, the polishing is performed with the substrate (1) at the polishing position as an upper surface.
Polishing means (20) arranged below the optical disk (D)
On the other hand, the powder that has been polished and separated
Polishing means (20) by powder collecting means (30) using 2)
Of the polishing member (24) and the disk-shaped support plate (27)
Thickness direction through holes (24a) provided at corresponding positions
(24a) ... (27a) (27a) ...
A method for collecting a substrate of an optical disk, comprising: 2. The polishing and peeling of the optical disk (D) is performed by a polishing
Air stirring means (25) located below the step (20)
While agitating the area around the polishing stripping position.
The collected powder is placed on the side of the air stirring means (25).
By means of a dust collecting means provided with a hollow part (31)
The method for recovering a substrate of an optical disk according to claim 1.