JP3219034U - Substrate cutting device - Google Patents

Abstract

An apparatus for efficiently cutting an organic EL substrate with a cutter and a laser is provided. A first traveling body C that reciprocates, a first stage D that can move up and down on the lower surface side of the first traveling body C, and that holds a substrate X on the lower surface, and under the traveling path of the first stage D. A second traveling body C ′ that reciprocates in the left-right direction on the side, a cutter E that is provided on the second traveling body C ′ and that can freely move up and down and scribes the lower glass plate of the substrate X, and a forward stop position of the first stage D A third traveling body C ″ that reciprocates in the front-rear direction in front of the second traveling body C, a second stage H that is turnable on the upper surface side of the third traveling body C ″ and that holds the substrate X of the first stage D on the upper surface thereof. The fourth traveling body C ′ ″ reciprocating in the left-right direction on the upper side of the traveling path of the second stage H, and the upper film of the substrate X is cut from the upper surface side while being movable up and down to the fourth traveling body C ″ ′. It consists of a laser K. [Selection] Figure 1

Description

  The present invention relates to an apparatus for dividing an organic EL substrate into product sizes.

A conventional liquid crystal substrate (panel) is formed by bonding two glass substrates.
In order to divide (divide) such a liquid crystal substrate into product sizes, a cutting line is scribed on the A-side glass plate with a cutter, and a cutting line is scribed on the B-side glass plate with a cutter.

  Each of the scribed cutting lines is sequentially subjected to a folding process (see, for example, Patent Document 1).

Japanese Patent No. 3969992

  Recently, in addition to a liquid crystal substrate, an organic EL substrate (panel) has been used as a display device. This organic EL substrate is provided on a glass substrate and one surface of the glass substrate (multi-layered structure). Of the film).

  When the multilayer film constituting the organic EL is cut with a wheel-shaped cutter, the finished cutting edge is poor. In addition, when cutting with a cutter, the cutter becomes dull in a short period of time (due to wear of the blade edge, etc.), cutting is not smooth, and the finish of the cutting edge is poor, possibly causing defective products There were also problems such as becoming inefficiencies, and problems such as efficiency reduction.

  Accordingly, the present invention is to provide a cutting apparatus for a substrate such as an organic EL substrate which has solved the above-mentioned problems.

  In order to solve the above-described problems, the present invention provides a first traveling body that is travel-guided by the front-rear direction guiding means and is reciprocated by the first traveling means, and a lower surface of the first traveling body. A first stage that is moved up and down by a lifting means and turned 90 ° by a turning means, and has a suction holding function for holding and holding a supply substrate on the lower surface, and a lower side of a traveling path of the first stage And a second traveling body provided so as to travel back and forth by the second traveling means, and the left and right parallel positions can be adjusted to the second traveling body, and each of them is a lifting means. And a front and rear between a cutter provided so as to be scribed from the lower surface side of the lower glass plate constituting the substrate and a position immediately below and forward of the advance stop position of the first stage. And a third traveling body provided to travel and reciprocate by the third traveling means, and the turning means is turned 90 ° on the upper surface side of the third traveling body, and the upper surface is A second stage provided with a suction holding function for receiving and holding the substrate of one stage, and a traveling guide on the upper side of the traveling path of the second stage by a lateral guide means, and reciprocating by a fourth traveling means. A fourth traveling body provided to travel, and the left and right parallel positions of the fourth traveling body can be adjusted, and each of the fourth traveling body is moved up and down by lifting means, and the upper film constituting the substrate is cut from the upper surface side. The structure which consists of a laser provided in is adopted.

  As described above, according to the substrate cutting apparatus of the present invention, after the first traveling body is retracted and stopped immediately above the supplied substrate, the first stage is lowered by the lifting means, and the lower surface of the first stage is lowered. After receiving and holding the substrate, the substrate is moved forward together with the first stage.

  At this time, the lower glass of the substrate is scribed by the parallel cutter of the second traveling body, and this scribe is rectangular on the lower glass as the first stage reciprocates and the first stage turns 90 ° by the turning means. Scribing a cutting line (an irregular cutting line can also be scribed).

  When the first table holding the scribed substrate stops moving forward, the first table is lowered by the lifting means on the second table retracted and stopped immediately below, and the substrate is received on the second table. Hold by suction.

  Thereafter, the second stage is caused to travel forward together with the substrate, and the upper film of the substrate is cut by the parallel laser of the fourth traveling body in the middle of the traveling. The upper film is cut into a rectangle as the two stages are turned by 90 ° (an irregular cutting line can also be inserted).

  For this reason, glass scribing and film cutting can be performed very efficiently and smoothly on a single line, and the first stage and the second stage are arranged above and below, thereby eliminating the need for a substrate. There is a unique effect of reversing glass scribe and film cutting.

It is a side view showing an embodiment of this invention. It is a top view which shows the principal part same as the above. It is the same part notch enlarged front view. It is an enlarged side view which shows the part of the scribe by a cutter. It is an enlarged side view which shows the cutting part by a laser. It is a partially notched top view which divides | segments a board | substrate into a rectangle. It is a partially notched top view which divides | segments a board | substrate into an irregular shape.

Next, an embodiment of the invention will be described with reference to the accompanying drawings.
As shown in FIGS. 1 to 5, the travel guide is provided by the front and rear guide means A, and the first travel body C is reciprocated by the first travel means B.

  As shown in FIG. 1, the guide means A and the first traveling means B for reciprocating the first traveling body C are provided on the horizontal member 1 whose both ends are directed in the front-rear direction, and on both side edges of the horizontal member 1. The first traveling body C is slidably engaged with the rail 2 so that the sliders 3 on both side edges of the first traveling body C are slidably engaged with the rail 2. However, the present invention is not limited, and other configurations may be employed.

  In the illustrated case, the traveling first traveling means B of the first traveling body C is attached to the first traveling body C by a motor 5 that reversibly drives a male screw 4 that is supported by both ends of the horizontal member 1 at both ends. The first traveling body C is configured to reciprocate by the operation of the motor 5, but is not limited thereto. For example, the first traveling body C is reciprocated using a linear motor. Sometimes

  Further, on the lower surface side of the first traveling body C, there is provided a suction holding function 9 that turns 90 ° by a turning means 7 such as a motor, moves up and down by a lifting means 8 such as a cylinder, and holds the substrate X on the lower surface. One stage D is provided.

  In the case shown in the drawing, the first stage D uses a flat hollow box 10 and sucks the inside of the hollow box 10, thereby providing a myriad of small functions as the suction holding function 9 provided on the bottom wall of the hollow box 10. The substrate X is sucked and held on the lower surface of the bottom wall of the hollow box 10 by the holes.

  The organic EL substrate X is configured by laminating a glass plate Y on the lower side and a multilayer film Z on the upper side of the glass plate Y, as shown in FIGS.

  When configured as described above, as shown in FIG. 1, when the substrate X carried by the conveyor 11 stops, the first stage D is lowered by the lifting means 8, and then the hollow box 10 is connected (into the hollow box 10). By sucking (through a suction hose), the substrate X can be received by being sucked and held on the lower surface of the hollow box 10 of the first stage D.

  Further, a cutter E for scribing the lower surface of the glass plate Y constituting the substrate X sucked and held by the first stage D is provided below the traveling path of the first stage D.

  As shown in FIGS. 1, 2, and 4, the cutter E is provided with rails 13 as guide means A ′ on both sides (left and right directions) on a seating member 12 crossing the advancing and retreating direction of the first stage D. The sliders 15 on both sides of the lower surface of the base 14 are slidably engaged with each other, and both ends on the seating member 12 are supported by male screws 16 having both ends serving as second traveling means B ′ as second traveling bodies C ′. By screwing the female screw 17 provided on the lower surface of the motor, operating the motor 18 connected to one end of the male screw 16 and reversibly driving the male screw 16, the base of the second traveling body C ′ is moved in the left-right direction. 14 moves forward and backward.

  Of course, the method of advancing and retracting the base 14 is not limited to the above-described configuration, and may be performed by, for example, a linear motor.

  A rail 19 parallel to the base 12 is provided on the front side edge of the base 14, and the sliders 21 of the slide bases 20 arranged in a scattered manner corresponding to the number of scribes are slidably engaged with the rail 19. Each of the slide bases 20 has a vertical guide 22 comprising a vertical rail and a slider slidably engaged with the rail. A cutter E is provided.

  Then, as the first stage D travels forward, a rectangular cutting line 60 is scribed by the cutter E on the lower surface of the glass plate Y of the substrate X.

  Naturally, after the first stage D is turned 90 ° by the turning means 7, the first stage D is made to travel so that the cutting line 60 in the other direction of the rectangle intersects the cutting line 60 in the previous rectangular direction (perpendicular). 60 can be scribed by a cutter E to scribe a rectangular cutting line 60 for dividing the product into product sizes as shown in FIG.

  Of course, by running the first stage D and the cutter E by numerical control within the section of the cutting line 60, the odd-shaped cutting line 61 can be scribed as shown in FIG.

  In addition, the parallel position of the base 24 having each cutter E can be adjusted (changed) in accordance with the rectangular cutting line 60 to be scribed.

  In the above adjustment, the slide table 20 having the cutter E is manually slid to allocate the position, and the ball screw is driven or slid to a predetermined position by a linear motor (for example, the rail 19 in FIG. A method in which a linear motor is provided between the slider 21 and a method described in paragraph [0028] of Patent Document 1 (Japanese Patent No. 39699992), for example, is employed.

  As shown in FIG. 4, the mark provided on the substrate X is read by the camera P provided on the base 24, and the first stage D is turned by the turning means 7 along with the reading, and alignment is performed.

  Further, the third traveling body C ′ that travels and is reciprocated by the third traveling means B ″ while being travel-guided by the guide means A ″ in the front-rear direction between immediately below and in front of the forward stop position of the first stage D. 'Is provided.

  The guide means A is the same as the guide means A of the first traveling body C, and the third traveling means B ″ of the third traveling body C ″ is the first traveling means B of the first traveling body C. Detailed description of the configuration will be omitted.

  Further, the second stage H having a suction holding function for turning and holding the substrate X of the first stage D on the upper surface by turning 90 ° by the operation of the motor as the turning means 7 on the upper surface side of the third traveling body C ″. Is provided.

  The second stage H uses a hollow box 10 that sucks the same interior as the first stage D, and the suction holding function 9 of the second stage H is provided with innumerable small holes on the lower surface of the hollow box 10. Form.

  Then, after the substrate X scribed by the cutter E is carried out at the first stage D, the substrate X is unloaded by the lowering action of the elevating means 8 onto the second stage H waiting underneath, and suction is performed. The substrate A is held on the second stage H by the holding function.

  Further, on the upper side of the traveling path of the second stage H, there is provided a fourth traveling body C ′ ″ that travels by the left and right guide means A ″ and reciprocates by the fourth traveling means B ′ ″. It is.

  The driving method by the guide means A ″ of the fourth traveling body C ″ ″ and the traveling system by the fourth traveling means B ″ ′ of the fourth traveling body C ′ ″ are the same as those on the cutter E side, and are detailed. Description is omitted.

  The fourth traveling body C ″ ′ is provided with a laser K that cuts the film Z from above (in the X direction, the Y direction, and the deformed direction) from above the substrate X.

  Arrangement of this laser K, that is, a configuration in which it is installed on the parallel base 24, a configuration in which the position of the parallel base 24 can be changed, raising and lowering of the laser K by the lifting means 23, and a method of sliding the base 24 for adjusting the position of the laser K in the horizontal direction (Shown in FIG. 5) is the same as the cutter E described above (see FIG. 4), and a detailed description thereof will be omitted.

  Then, after the substrate X scribed by the cutter E is lowered by the lifting means 8 and the first stage D is lowered and received on the second stage H, the substrate X is held on the second stage H by the suction holding function 9. Then, the second stage H is caused to travel forward.

  At this time, the laser K is caused to travel together with the base 14 by the third traveling means B ″, and the film Z is irradiated with the laser K from above and cut.

  Of course, the cutting by the laser K is the same as the method by the cutter E, that is, the base and the cutter E are moved in the left-right direction, and the second stage H is turned 90 ° by the turning means 7 and cut into a rectangle. Similarly, the film Z can be cut into an irregular shape while moving the laser K by numerical control.

  In addition, the camera P is mounted on the fourth traveling body C ′ ″ side, the alignment mark on the substrate X is read by the camera P, and the second stage H is turned and aligned with the reading.

Further, when scribing the irregular cutting line with the cutter E, the cutter is swung so as to swing in the scribing direction of the irregular cutting line.
In the figure, reference numeral 63 denotes a cutting line provided on the film Z by the laser K.

  In the embodiment of the present invention, the film is processed on the upper side and the glass plate substrate is processed on the lower side. However, the glass plate may be processed on the upper side and the substrate on which the film exists may be processed on the lower side ( At this time, the upper cutter and the lower laser are arranged oppositely), and the glass plate can be cut with a laser, so that a laser can be used instead of the cutter.

A, A ′, A ″ Guide means B First traveling means B ′ Second traveling means B ″ Third traveling means C First traveling means C ′ Second traveling means C ″ Third traveling means C ′ ″ Fourth traveling means D First stage E Cutter H Second stage K Laser X Substrate Y Glass plate Z Film 1 Horizontal material 2 Rail 3 Slider 4 Male screw 5 Motor 6 Female screw 7 Turning means 8 Lifting means 9 Suction holding function 10 Hollow Box 11 Conveyor 12 Seat 13 Rail 14 Base 15 Slider 16 Male screw 17 Female screw 18 Motor 19 Rail 20 Slide base 21 Slider 22 Vertical guide 23 Lifting means 24 Base 60 Cutting line 61 Deformed cutting line

Claims (1)

  The first traveling body is guided by the front and rear guide means and is reciprocated by the first traveling means. The first traveling body is moved up and down by the elevating means on the lower surface side of the first traveling body, and 90 by the turning means. A first stage provided to have a suction holding function for turning and holding the supply substrate on the lower surface, and a traveling guide is provided by a lateral guide means below the traveling path of the first stage, A second traveling body provided to reciprocate by the second traveling means, and a lower glass that can adjust the left and right parallel positions on the second traveling body, and that is raised and lowered by the raising and lowering means and that constitutes the substrate. A travel guide is provided between the cutter provided so as to scribe from the lower surface side of the plate and the guide means in the front-rear direction between the position immediately below the forward stop position of the first stage and the front. A third traveling body provided so as to reciprocate by the third traveling means, and the turning means rotates 90 degrees on the upper surface side of the third traveling body, and the substrate of the first stage is received and held on the upper surface. A second stage provided so as to have a suction holding function, and a fourth travel provided so as to be guided by a lateral guide means on the upper side of the travel path of the second stage and reciprocally traveled by the fourth travel means. And a laser that can be adjusted in parallel on the left and right sides of the fourth traveling body, and each is moved up and down by lifting means and cuts the upper film constituting the substrate from the upper surface side. Characteristic substrate cutting device.

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