JP3216487B2 - Chip electronic component supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type electronic component supply apparatus for supplying a plurality of chip-type electronic components while aligning them in a predetermined direction. The present invention relates to an improvement for facilitating the introduction of chip-shaped electronic components into an alignment passage for guiding electronic components in an aligned state.

[0002]

2. Description of the Related Art FIG. 2 shows a bulk cassette 1 as an example of a chip-like electronic component supply apparatus which is of interest to the present invention. In a chip mounter for mounting a chip-shaped electronic component on a circuit board, a plurality of such bulk cassettes 1 are arranged so as to be arranged in a direction perpendicular to the plane of FIG.

Each bulk cassette 1 has a room 3 for storing a plurality of chip-like electronic components 2 in a random state. A chip-like electronic component storage case (not shown) is attached to the bulk cassette 1 with its outlet facing the room 3, and in this state, the chip-like electronic components 2 stored in the case are removed from the room 3. Supplied to Room 3
For example, it is divided into a large room 6 on the upstream side and a small room 7 on the downstream side by a gate 5 forming a narrowed path 4. The chip-shaped electronic component 2 supplied as described above is first stored in the large room 6, and then enters the small room 7 through the path 4 defined by the gate 5, and then reaches the alignment passage 8.

The alignment passage 8 guides the plurality of chip-shaped electronic components 2 so as to move in an aligned state in a predetermined direction after each of the plurality of chip-shaped electronic components 2 is received from the entrance 9 thereof. Are selected so that only the shortest side and the second shortest side of each chip-shaped electronic component 2 can be accepted. The chip-shaped electronic component 2 is discharged from the outlet 10 of the alignment passage 8 while maintaining the alignment state. Therefore, if the chip-shaped electronic components 2 are handled so as not to disturb the alignment, the process of mounting the chip-shaped electronic components 2 on the circuit board can be efficiently advanced.

The movement of the above-mentioned chip-like electronic component 2 is, as shown in FIG. 2, because the direction of the path of the chip-like electronic component 2 from the room 3 to the alignment passage 8 is inclined at about 45 degrees. Is substantially caused by gravity acting on the chip-shaped electronic component 2. In addition, the latter half of the alignment passage 8
Since the chip-shaped electronic component 2 is forcibly sent to the outlet 10 because it is oriented in the horizontal direction, a transfer means using a positive pressure or a negative pressure of air may be added.

In such a bulk cassette 1, the movement of the chip-shaped electronic components 2 in the room 3 and from the room 3 to the alignment passage 8 is made smooth, and the chip-shaped electronic components 2
The following various points have been devised so that the supply of high speed, high operation rate and high reliability can be performed. For example, near the inlet 9 of the alignment passage 8, there is provided a stirring air inlet 12 for intermittently blowing compressed air from an external compressed air source 11 into the room 3. Through the stirring air inlet 12, as shown by an arrow 13, compressed air flows upward from below into the chip-like electronic component 2 in the small room 7.
Is applied to the chip-like electronic component 2, whereby a stirring action is exerted on the chip-like electronic component 2, and the chip-like electronic component 2
Is introduced into the alignment passage 9.

A part of the upper wall of the small room 7 is provided by a movable block 14. The movable block 14
It can be displaced up and down within a predetermined range, for example,
It is driven so as to be displaced in the vertical direction by the compressed air that is intermittently blown from the above-described stirring air inlet 12. In this way, by displacing the movable block 14, the state in which the plurality of chip-shaped electronic components 2 abut against each other between the upper and lower wall surfaces in the small room 7 and the movement is hindered can be immediately broken.

The above-mentioned gate 5 is also for smoothing the movement of the chip-shaped electronic component 2. That is, when a large number of chip-shaped electronic components 2 are stored in the room 3, the gravity exerted by each of such chip-shaped electronic components 2 causes the chip-shaped electronic components 2 located relatively below, for example, small The chip-shaped electronic components 2 located in the room 7 may be clogged and their movement may be hindered. The gate 5 prevents such a phenomenon from occurring, and the chip-like electronic components 2 stored in the room 3
Irrespective of the quantity, the gravity applied to the chip-shaped electronic components 2 in the small room 7 is kept substantially constant, and the movement of the chip-shaped electronic components 2 particularly in the small room 7 is made smooth.

[0009]

In the above-described stirring of the chip-shaped electronic component 2 by the compressed air intermittently blown from the stirring air inlet 12, the chip-shaped electronic component 2 is discharged by the compressed air. Are blown upwards, then fall naturally when the compressed air stops, and are sequentially received in the inlet 9 of the alignment passage 8. Therefore, unless such an operation proceeds smoothly, the chip-shaped electronic component 2
The supply of the chip-shaped electronic component 2 cannot be accelerated unless the supply of the electronic component 2 is delayed and such an operation is not rapidly performed. Recently, with the increase in mounting speed of chip-shaped electronic components, a high-speed supply speed of 0.1 second or less, and further 0.08 seconds or less per one chip-shaped electronic component is required.

In order to satisfy the above requirements, it is necessary to strictly control the pressure of the compressed air introduced from the stirring air inlet 12. However, it is actually very difficult to strictly manage such pressure. That is, in supplying chip-shaped electronic components for mounting on a circuit board at a mass production level, a large number of bulk cassettes 1 are used at the same time, and the compressed air source 11 is common to these bulk cassettes 1. As a result, the pressure of the compressed air is relatively high in one bulk cassette 1 and relatively low in another bulk cassette 1 due to the unavoidable variation among the bulk cassettes 1. A situation arises. A similar situation can also be caused by variations between mounting machines.

When the pressure of the compressed air from the stirring air inlet 12 is low, the chip-like electronic component 2 cannot exert a sufficient stirring action on the chip-like electronic component 2 and the chip-like electronic component 2 moves
Tends to be clogged near the entrance 9. On the other hand, when the pressure of the compressed air is high, the chip-shaped electronic component 2 jumped up by the blowing of the compressed air does not immediately fall, and the introduction of the chip-shaped electronic component 2 to the alignment passage 8 may be stopped. In any case, supply of the chip-shaped electronic component 2 at a high speed is hindered. As an actual example, when the set value of the pressure is set to 0.3 MPa, it is known that the pressure must be controlled within an extremely strict range of 0.3 ± 0.02 MPa in consideration of the above-described variation and the like. However, it is no exaggeration to say that such delicate control is almost impossible in an actual process.

When observing the behavior of the chip-like electronic component 2 in the room 3, one chip-like electronic component 2 is supplied. It is known that the electronic component 2 is spent for the natural fall. Therefore, for example, even if the discharge control valve for compressed air is improved or the distance over which the chip-shaped electronic component 2 is thrown is reduced, unless the time for the natural fall is shortened, the above-mentioned high speed of, for example, 0.08 seconds or less is achieved. Supply cannot be handled at all.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a chip-type electronic component supply device capable of supplying a chip-type electronic component at a higher speed.

[0014]

According to the present invention, as in the bulk cassette 1 shown in FIG. 2, a room for storing a plurality of chip-shaped electronic components is communicated with the room and smaller than the room. While defining a space with a cross section,
After receiving a plurality of chip-shaped electronic components stored in this room from their entrances in an aligned state oriented in a predetermined direction, each is guided to move in this aligned state, and then the aligned state Intermittently pressurized air blown from the bottom to the top in order to exert an agitating action on the chip-like electronic components that are to enter the inlet of the alignment passage. And a stirring air introduction port for introducing into the chip-shaped electronic component supply device, and in order to solve the above-mentioned technical problem, jump up by blowing compressed air from the stirring air introduction port. Pressing air inlet for externally introducing compressed air that is blown downward from above to forcibly drop the chipped electronic components It is characterized by further comprising.

[0015]

According to the present invention, the discharge of compressed air from the pressurized air inlet reduces the jump-up distance of the chip-shaped electronic component by blowing compressed air from the stirring air inlet, and furthermore, the chip-shaped electronic component Is forced to return to the vicinity of the entrance of the alignment passage, so that the time from when the chip-shaped electronic component jumps up to when it falls can be reduced.

Further, as described above, since the discharge of the compressed air from the pressurized air introduction port causes the chip-shaped electronic components to fall positively, the pressure of the compressed air from the agitated air introduction port may be set higher. Possible, and the pressure tolerances are increased. Therefore, strict pressure management is not required, and without being affected by the above-mentioned variation,
It becomes easy to supply compressed air at an appropriate pressure to each chip-shaped electronic component supply device.

Thus, according to the chip-shaped electronic component supply device of the present invention, the movement of the chip-shaped electronic components in the room and from the room to the alignment passage is made smooth, and the supply of the chip-shaped electronic components is performed. , High speed, high operation rate and high reliability.

[0018]

FIG. 1 is a view corresponding to FIG. 2, showing a chip-like electronic component supply apparatus according to an embodiment of the present invention. FIG. 1 also shows a bulk cassette 21 as an example of a chip-shaped electronic component supply device. Since this bulk cassette 21 has many elements in common with the bulk cassette 1 shown in FIG. 2, it will be briefly described below, and the details not described above will be described with reference to FIG. The description is referred to.

The bulk cassette 21 has a room 23 for storing a plurality of chip-like electronic components 2 in a random state.
Is provided. The room 23 is divided into a large room 26 on the upstream side and a small room 27 on the downstream side by a gate 25 forming a narrowed path 24. Communicating with the end of the small room 27,
An alignment passage 28 is provided. The alignment passage 28 is a small room 2
7 is defined such that it can accept only the shortest side and the second shortest side of the individual chip-shaped electronic component 2.

The alignment passage 28 guides the plurality of chip-shaped electronic components 2 so as to move in an aligned state in a predetermined direction after receiving the plurality of chip-shaped electronic components 2 from the entrances 29 thereof.
While maintaining this alignment state, the chip-shaped electronic component 2
It is discharged from the outlet 30 of the alignment passage 28. The direction of the path of the chip-like electronic component 2 from the room 23 to the alignment passage 28 is inclined at about 45 degrees.

In the vicinity of the inlet 29 of the alignment passage 28, there is provided a stirring air inlet 32 for intermittently blowing compressed air from an external compressed air source 31 into the small room 27. Compressed air is blown from the lower side to the upper side through the stirring air inlet 32 toward the chip-like electronic component 2 in the small room 27 as indicated by an arrow 33, whereby the chip-like electronic component 2 is stirred. Action is exerted.

A part of the upper wall of the small room 27 is provided by a movable block 34. Movable block 34
Can be displaced in the vertical direction within a predetermined range, and is driven to be displaced in the vertical direction by compressed air blown intermittently from the above-described stirring air inlet 32, for example. The configuration described above is equivalent to the bulk cassette 1 shown in FIG.
And in common. In this embodiment, the following configuration is further provided.

A pressurizing air inlet 35 is provided through a part of the upper wall of the small room 27. Compressed air is also discharged from the holding air introduction port 35. This compressed air is
It is preferable to supply the compressed air from the compressed air source 31 for the compressed air supplied to the stirring air inlet 32 in order to simplify the mechanism. The compressed air from the pressurized air inlet 35 is for forcibly dropping the chip-shaped electronic component 2 jumped up by blowing the compressed air from the agitated air inlet 32 described above, as shown by an arrow 36. , Is sprayed downward from above.

As described above, by forcibly dropping the chip-shaped electronic component 2 by the compressed air from the pressurized air inlet 35, the distance over which the chip-shaped electronic component 2 jumps becomes short. But large room 26
Can be prevented, and the time required for falling can be reduced. Therefore, the supply speed of the chip-shaped electronic component 2 can be increased.

In a specific experiment, two holding air inlets 35 having a circular cross section are provided, each holding air inlet 35 has a diameter of 0.4 mm, and the inclination angle 37 of the holding air inlet 35 in FIG. Is 75 degrees, the compressed air is discharged from the holding air inlet 35 for 3 ms, 10 ms later than the discharge of the compressed air from the stirring air inlet 32, and the pressure of the compressed air is reduced to the holding air inlet 35 and the stirring. Assuming that both air inlets 32 are 0.32 ± 0.05 MPa,
When the chip-shaped electronic components 2 were supplied, it was possible to supply them at a high speed of 0.06 seconds per component.

In the above-mentioned experimental example, the pressure of the compressed air is 0.32 MPa and the conventional 0.3 MPa
It should be noted that it is higher. Conventionally, 0.02 MPa such as 0.3 ± 0.02 MPa
While pressure control within a narrow range of MPa was necessary, in this experimental example, pressure control within a relatively wide range of 0.05 MPa, such as 0.32 ± 0.05 MPa, was sufficient. It was also confirmed that there was.

Note that, regardless of the specific experimental example described above, the number of the holding air inlets 35 is arbitrary, and can be changed in a range of, for example, one to five.
Further, the size of the holding air inlet 35 is also arbitrary,
For example, the diameter can be changed in a range of 0.3 mm to 0.5 mm, and the inclination angle 37 of the holding air inlet 35 is also arbitrary, and is changed in a range of 45 degrees to 90 degrees, for example. be able to. Also, regarding the period of discharge of compressed air from the holding air introduction port 35,
It is optional and can be changed in a range such as 3 to 5 ms. The timing of the discharge of the compressed air from the pressurized air inlet 35 is also preferably slightly delayed from the discharge from the stirred air inlet 32,
The compressed air may be discharged at the same time, or always, not intermittently. The pressure of the compressed air from the holding air inlet 35 is equal to the pressure of the stirring air inlet 3.
It may not be equal to the pressure of the compressed air from 2.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional side view showing a bulk cassette 21 as an example of a chip-shaped electronic component supply device according to an embodiment of the present invention.

FIG. 2 is a vertical sectional side view showing a bulk cassette 1 as an example of a chip-shaped electronic component supply device which is interesting for the present invention.

[Explanation of symbols]

 2 Chip-shaped electronic component 21 Bulk cassette 23 Room 26 Large room 27 Small room 28 Alignment passage 29 Inlet 30 Outlet 31 Compressed air source 32 Stirred air inlet 35 Pressing air inlet

Claims (1)

(57) [Claims] 1. A room for storing a plurality of chip-shaped electronic components, and a space communicating with the room and having a smaller cross section than the room is defined, and a plurality of rooms stored in the room are defined. After receiving the chip-shaped electronic components from the entrance in an aligned state oriented in a predetermined direction, the chip-shaped electronic components are guided to move in the aligned state, and then are aligned in order to be discharged from the exit in the aligned state. A passage, and a stirring air inlet for intermittently introducing compressed air blown upward from below to exert a stirring action on the chip-shaped electronic component to be entered into the inlet of the alignment passage. The chip-shaped electronic component supply device, comprising: forcibly dropping the chip-shaped electronic component jumped up by blowing compressed air from the stirring air introduction port. A chip-shaped electronic component supply device, further comprising a pressurized air introduction port for introducing compressed air blown downward from above to the outside from the outside.