JP3215117U - Internal heat insulation structure of measuring device - Google Patents

Internal heat insulation structure of measuring device Download PDF

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JP3215117U
JP3215117U JP2017005615U JP2017005615U JP3215117U JP 3215117 U JP3215117 U JP 3215117U JP 2017005615 U JP2017005615 U JP 2017005615U JP 2017005615 U JP2017005615 U JP 2017005615U JP 3215117 U JP3215117 U JP 3215117U
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space
shielding wall
housing
internal heat
measuring apparatus
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▲トゥ▼盛展
▲ザン▼紹賢
洪振祐
謝源平
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Delta Electronics Inc
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Abstract

【課題】測定装置の内部断熱構造を提供する。【解決手段】筐体10が、内部空間100と、内部空間に設けられる第1遮蔽壁11及び第2遮蔽壁12を備え、第1遮蔽壁及び第2遮蔽壁は、内部空間を、第1空間101、第2空間102、及び第1遮蔽壁と第2遮蔽壁の間に形成される第3空間103に分割し、且つ、第3空間は、第1空間及び第2空間と連通しない。電子モジュール20が第1空間に配置され、回路基板と、回路基板に組み合わされる発熱電子素子を含む。センサ素子30が第2空間に配置され、回路基板に電気的に接続される。空気遮断層40が第3空間に位置し、発熱電子素子から発生した熱がセンサ素子に伝わることのないよう遮断する。これによれば、センサ素子の測定時における精度が維持される。【選択図】図6An internal heat insulating structure of a measuring device is provided. A housing 10 includes an internal space 100 and a first shielding wall 11 and a second shielding wall 12 provided in the internal space, and the first shielding wall and the second shielding wall define the first space. The space 101, the second space 102, and the third space 103 formed between the first shielding wall and the second shielding wall are divided, and the third space does not communicate with the first space and the second space. The electronic module 20 is disposed in the first space and includes a circuit board and a heat generating electronic element combined with the circuit board. The sensor element 30 is disposed in the second space and is electrically connected to the circuit board. The air blocking layer 40 is located in the third space and blocks the heat generated from the heat generating electronic element from being transmitted to the sensor element. According to this, the accuracy at the time of measurement of the sensor element is maintained. [Selection] Figure 6

Description

本考案は測定装置に関し、特に測定装置の内部断熱構造に関する。   The present invention relates to a measuring apparatus, and more particularly to an internal heat insulating structure of the measuring apparatus.

通常、測定装置には、筐体、筐体内に固定される回路基板、回路基板に設けられるマイクロプロセッサ等の電子部品、及び回路基板に電気的に接続されるセンサ素子が含まれる。このうち、当該センサ素子は温度センサ等の測定素子として設けられる。測定装置の動作過程では、内部の電子部品から発生した熱がセンサ素子の精度に影響し、測定誤差を招来する場合がある。   Usually, the measurement apparatus includes a housing, a circuit board fixed in the housing, an electronic component such as a microprocessor provided on the circuit board, and a sensor element electrically connected to the circuit board. Among these, the sensor element is provided as a measurement element such as a temperature sensor. During the operation process of the measuring apparatus, heat generated from the internal electronic components may affect the accuracy of the sensor element, leading to measurement errors.

現在のところ、前記測定装置の測定誤差については、ソフトウェアによる修正で低減させる場合がほとんどである。しかし、熱の蓄積時間があまりに長いと、センサ素子による測定誤差をソフトウェアで修正する方式では規定外の誤差値が生じてしまう。更には、蓄熱に起因するセンサの精度喪失のみならず、測定装置は配置角度の違いによって筐体内部に異なる流動場が発生し得る。そのため、筐体内の熱分布が異なるにもかかわらず同じソフトウェアで測定値を修正した場合、修正後の数値と実環境の数値とに極めて大きな誤差が存在することになる。   At present, the measurement error of the measuring apparatus is mostly reduced by correction by software. However, if the heat storage time is too long, an error value that is outside the specification is generated in the method of correcting the measurement error due to the sensor element by software. Furthermore, not only the loss of accuracy of the sensor due to heat storage but also the measurement apparatus can generate different flow fields inside the housing due to the difference in the arrangement angle. Therefore, when the measured value is corrected with the same software even though the heat distribution in the casing is different, there is a very large error between the corrected numerical value and the actual environment numerical value.

そこで、測定装置の蓄熱や配置位置の違いに起因するセンサ素子の精度喪失を如何に回避するかが本考案者にとっての動機となった。   Therefore, how to avoid the loss of accuracy of the sensor element due to the heat storage of the measuring device and the difference in the arrangement position became a motivation for the inventor.

本考案は、測定装置の蓄熱や配置位置の違いに起因するセンサ素子の精度喪失が回避される測定装置の内部断熱構造を提供することを目的とする。   An object of the present invention is to provide an internal heat insulation structure of a measuring device in which loss of accuracy of a sensor element due to heat storage of the measuring device or a difference in arrangement position is avoided.

上記の目的を達成すべく、本考案は、筐体、電子モジュール、センサ素子及び空気遮断層を含む測定装置の内部断熱構造に関する。筐体が、内部空間と、内部空間に設けられる第1遮蔽壁及び第2遮蔽壁を備え、第1遮蔽壁及び第2遮蔽壁は、内部空間を、第1空間、第2空間、及び第1遮蔽壁と第2遮蔽壁の間に形成される第3空間に分割し、且つ、第3空間は、第1空間及び第2空間と連通しない。電子モジュールが第1空間に配置され、回路基板と、回路基板に組み合わされる発熱電子素子を含む。センサ素子が第2空間に配置され、回路基板に電気的に接続される。空気遮断層が第3空間に位置し、発熱電子素子から発生した熱がセンサ素子に伝わることのないよう遮断する。   In order to achieve the above object, the present invention relates to an internal heat insulating structure of a measuring apparatus including a housing, an electronic module, a sensor element, and an air blocking layer. The housing includes an internal space, and a first shielding wall and a second shielding wall provided in the internal space, and the first shielding wall and the second shielding wall define the internal space as the first space, the second space, and the second space. The first space is divided into a third space formed between the shielding wall and the second shielding wall, and the third space does not communicate with the first space and the second space. An electronic module is disposed in the first space and includes a circuit board and a heat generating electronic element combined with the circuit board. The sensor element is disposed in the second space and is electrically connected to the circuit board. The air blocking layer is located in the third space and blocks heat generated from the heat generating electronic element from being transmitted to the sensor element.

従来と比較すると、本考案における測定装置の内部断熱構造には、第1遮蔽壁、第2遮蔽壁、及び第1遮蔽壁と第2遮蔽壁の間に位置する空気遮断層が設けられる。空気には極めて大きな熱遮断という物理特性があり、これにより断熱保護層が形成される。よって、発熱電子素子から発生した熱は空気遮断層により遮断され、センサ素子に伝わることがない。なお、空気遮断層は、熱を帯びた空気が対流によってセンサ素子に伝わらないよう遮断可能なだけではない。空気自体の熱伝導係数は従来の断熱材よりも低いことから、熱伝達においても、発熱素子からセンサ素子への影響を最小限に抑えることが可能となる。そのため、蓄熱によるセンサ素子の測定時精度への影響が回避される。   Compared with the prior art, the internal heat insulating structure of the measuring device according to the present invention is provided with a first shielding wall, a second shielding wall, and an air shielding layer located between the first shielding wall and the second shielding wall. Air has an extremely large physical property of heat insulation, which forms a heat-insulating protective layer. Therefore, the heat generated from the heat generating electronic element is blocked by the air blocking layer and is not transmitted to the sensor element. The air blocking layer is not only capable of blocking the heated air from being transmitted to the sensor element by convection. Since the heat conduction coefficient of air itself is lower than that of a conventional heat insulating material, it is possible to minimize the influence of the heating element on the sensor element even in heat transfer. Therefore, the influence on the measurement accuracy of the sensor element due to heat storage is avoided.

図1は、本考案における測定装置の外観を表す斜視図である。FIG. 1 is a perspective view showing an appearance of a measuring apparatus according to the present invention. 図2は、本考案における測定装置の一部を表す分解斜視図である。FIG. 2 is an exploded perspective view showing a part of the measuring apparatus according to the present invention. 図3は、本考案における測定装置の他の部分を表す分解斜視図である。FIG. 3 is an exploded perspective view showing another part of the measuring apparatus according to the present invention. 図4は、本考案における測定装置の組み付けを表す斜視図である。FIG. 4 is a perspective view showing the assembly of the measuring device according to the present invention. 図5は、本考案における測定装置の一方からの断面図である。FIG. 5 is a sectional view from one side of the measuring apparatus according to the present invention. 図6は、本考案における測定装置の他方からの断面図である。FIG. 6 is a sectional view from the other side of the measuring apparatus according to the present invention.

本考案の詳細及び技術内容について、図面を組み合わせて以下の通り説明する。ただし、図面は参考及び説明のためのものであって、本考案を限定する主旨ではない。   The details and technical contents of the present invention will be described as follows in combination with the drawings. However, the drawings are for reference and explanation, and are not intended to limit the present invention.

図1〜図4を参照する。これらは、それぞれ本考案における測定装置の外観を表す斜視図、測定装置の一部を表す分解斜視図、測定装置の他の部分を表す分解斜視図、及び測定装置の組み付けを表す図である。本考案は、筐体10、電子モジュール20、センサ素子30及び空気遮断層40(図6を参照してください)を含む測定装置1の内部断熱構造に関する。当該電子モジュール20及び当該センサ素子30は当該筐体10に内蔵され、当該空気遮断層40は、当該電子モジュール20と当該センサ素子30の間に設けられる。これにより、当該電子モジュール20の運転時に生じた熱が当該センサ素子30に伝達されないよう遮断されるため、当該センサ素子30が温度の影響を受けて測定時の精度を喪失するとの事態が回避される。なお、当該測定装置1の内部断熱構造の詳細については後述する。   Please refer to FIGS. These are a perspective view showing the external appearance of the measuring apparatus according to the present invention, an exploded perspective view showing a part of the measuring apparatus, an exploded perspective view showing another part of the measuring apparatus, and a diagram showing the assembly of the measuring apparatus. The present invention relates to an internal heat insulating structure of the measuring apparatus 1 including a housing 10, an electronic module 20, a sensor element 30, and an air blocking layer 40 (see FIG. 6). The electronic module 20 and the sensor element 30 are built in the housing 10, and the air blocking layer 40 is provided between the electronic module 20 and the sensor element 30. As a result, heat generated during operation of the electronic module 20 is blocked from being transmitted to the sensor element 30, thereby avoiding a situation where the sensor element 30 is affected by temperature and loses accuracy during measurement. The The details of the internal heat insulation structure of the measuring device 1 will be described later.

当該筐体10は、内部空間100と、当該内部空間100に設けられる第1遮蔽壁11及び第2遮蔽壁12を備える。当該第1遮蔽壁11及び当該第2遮蔽壁12は、当該内部空間100を、第1空間101、第2空間102、及び当該第1遮蔽壁11と第2遮蔽壁12の間に形成される第3空間103に分割する。当該第3空間103は、当該第1空間101及び当該第2空間102のいずれとも連通していない。好ましくは、当該第1遮蔽壁11の支持力を強化すべく、当該第1遮蔽壁11の一方の側面に複数の支持リブ111が備えられる。   The housing 10 includes an internal space 100 and a first shielding wall 11 and a second shielding wall 12 provided in the internal space 100. The first shielding wall 11 and the second shielding wall 12 form the internal space 100 between the first space 101, the second space 102, and the first shielding wall 11 and the second shielding wall 12. Dividing into a third space 103. The third space 103 does not communicate with either the first space 101 or the second space 102. Preferably, a plurality of support ribs 111 are provided on one side surface of the first shielding wall 11 in order to strengthen the supporting force of the first shielding wall 11.

本実施例において、当該筐体10は互いに組み合わされる第1筐体10aと第2筐体10bを含む。また、当該筐体10には複数の放熱孔13が設けられている。更に、当該内部空間100の放熱がなされるよう、当該第1空間101、当該第2空間102及び当該第3空間103は、それぞれ上記放熱孔13を介して外部と連通している。   In the present embodiment, the housing 10 includes a first housing 10a and a second housing 10b that are combined with each other. The casing 10 is provided with a plurality of heat radiation holes 13. Further, the first space 101, the second space 102, and the third space 103 communicate with the outside through the heat radiating holes 13 so that the internal space 100 can radiate heat.

当該電子モジュール20は、当該第1空間101に配置される。当該電子モジュール20は、回路基板21と、当該回路基板21に組み合わされる少なくとも1の発熱電子素子22を含む。   The electronic module 20 is disposed in the first space 101. The electronic module 20 includes a circuit board 21 and at least one heat generating electronic element 22 combined with the circuit board 21.

更に、当該センサ素子30は当該第2空間102に配置されて、当該回路基板21に電気的に接続される。本考案の一実施例において、当該センサ素子30は温度センサである。また、当該センサ素子30は外部の温度を測定しやすいよう、当該第2空間102のうち当該筐体10の一方の側に寄せて設けられる。   Further, the sensor element 30 is disposed in the second space 102 and is electrically connected to the circuit board 21. In one embodiment of the present invention, the sensor element 30 is a temperature sensor. Further, the sensor element 30 is provided close to one side of the casing 10 in the second space 102 so as to easily measure the external temperature.

当該空気遮断層40(図6を参照してください)は、当該第3空間103に位置する。当該電子モジュール20の運転時に、当該発熱電子素子22から発生した熱は当該空気遮断層40により遮断されるため、当該センサ素子30に伝わることがない。換言すれば、当該空気遮断層40は、当該第1遮蔽壁11と当該第2遮蔽壁12の間に充満する静止状態の空気である。空気には極めて大きな熱遮断という物理特性があり、これにより断熱保護層が形成される。   The air blocking layer 40 (see FIG. 6) is located in the third space 103. During operation of the electronic module 20, heat generated from the heat generating electronic element 22 is blocked by the air blocking layer 40, so that it is not transmitted to the sensor element 30. In other words, the air blocking layer 40 is stationary air that fills between the first shielding wall 11 and the second shielding wall 12. Air has an extremely large physical property of heat insulation, which forms a heat-insulating protective layer.

なお、当該空気遮断層40は、熱を帯びた空気が対流によって当該センサ素子30に伝わらないよう遮断可能なだけではない。空気自体の熱伝導係数は従来の断熱材よりも低いことから、熱伝達においても、発熱素子からセンサ素子への影響を最小限に抑えることが可能となる。   The air blocking layer 40 is not only capable of blocking heat from being transferred to the sensor element 30 by convection. Since the heat conduction coefficient of air itself is lower than that of a conventional heat insulating material, it is possible to minimize the influence of the heating element on the sensor element even in heat transfer.

このほか、本考案における測定装置1の内部断熱構造は、空気遮断層40を設けることで熱を帯びた空気が対流により当該センサ素子30に伝わらないよう遮断するものである。そのため、当該発熱電子素子22と当該センサ素子30の間には熱伝導経路のみが残され、熱対流による当該センサ素子30の測定精度喪失を回避可能となる。よって、当該センサ素子30の測定結果は、測定装置1の配置の仕方により変化することがない。   In addition, the internal heat insulation structure of the measuring device 1 according to the present invention is provided by providing the air blocking layer 40 to block the heated air from being transmitted to the sensor element 30 by convection. Therefore, only the heat conduction path is left between the heat generating electronic element 22 and the sensor element 30, and it is possible to avoid the measurement accuracy loss of the sensor element 30 due to thermal convection. Therefore, the measurement result of the sensor element 30 does not change depending on how the measurement apparatus 1 is arranged.

本考案の測定装置1における二方向からの断面図である図5及び図6を参照する。図示するように、本考案における測定装置1の内部断熱構造は、第1可撓体50及び第2可撓体60を更に含む。好ましくは、当該第1可撓体50及び当該第2可撓体60は発泡体又はゴムから構成される。   Reference is made to FIGS. 5 and 6 which are sectional views from two directions in the measuring apparatus 1 of the present invention. As shown in the figure, the internal heat insulating structure of the measuring apparatus 1 according to the present invention further includes a first flexible body 50 and a second flexible body 60. Preferably, the first flexible body 50 and the second flexible body 60 are made of foam or rubber.

より詳細には、当該第1遮蔽壁11は、当該第1筐体10aに設けられる第1仕切り板11a及び当該第2筐体10bに設けられる2つの第1支持板11bを含む。また、当該第1可撓体50の一方の側は当該第1仕切り板11aに設けられ、当該第1可撓体50の反対側は当該2つの第1支持板11bの間に挟持される。   More specifically, the first shielding wall 11 includes a first partition plate 11a provided in the first housing 10a and two first support plates 11b provided in the second housing 10b. One side of the first flexible body 50 is provided on the first partition plate 11a, and the opposite side of the first flexible body 50 is sandwiched between the two first support plates 11b.

更に、当該第2遮蔽壁12は、当該第1筐体10aに設けられる2つの第2支持板12a及び当該第2筐体10bに設けられる第2仕切り板12bを含む。このほか、当該第2可撓体60の一方の側は当該第2仕切り板12bに設けられ、当該第2可撓体60の反対側は当該2つの第2支持板12aの間に挟持される。   Further, the second shielding wall 12 includes two second support plates 12a provided in the first housing 10a and a second partition plate 12b provided in the second housing 10b. In addition, one side of the second flexible body 60 is provided on the second partition plate 12b, and the opposite side of the second flexible body 60 is sandwiched between the two second support plates 12a. .

具体的には、当該第1遮蔽壁11及び当該第2遮蔽壁12は、それぞれU型をなしている。また、当該第1遮蔽壁11及び当該第2遮蔽壁12は、それぞれ当該筐体10の内壁面を取り囲んでいる。好ましくは、当該第1遮蔽壁11は、平行に間隔を置いて当該第2遮蔽壁12の内側に位置する。   Specifically, the first shielding wall 11 and the second shielding wall 12 are each U-shaped. The first shielding wall 11 and the second shielding wall 12 surround the inner wall surface of the housing 10. Preferably, the said 1st shielding wall 11 is located inside the said 2nd shielding wall 12 at intervals in parallel.

これにより、当該第1筐体10aと第2筐体10bが組み付けられると、第1仕切り板11a、第1支持板11b、第1可撓体50、第2支持板12a、第2仕切り板12b及び第2可撓体60が組み合わされて、静止空気層を隔離する設計が実現される。これにより、静止状態の空気が当該第1遮蔽壁11と当該第2遮蔽壁12の間に封入されて、当該空気遮断層40を形成する。また、当該第1遮蔽壁11が設けられるため、当該第3空間103は当該第1空間101と連通することがない。更に、当該第2遮蔽壁12が設けられるため、当該第3空間103は当該第2空間102と連通することがない。   Thus, when the first housing 10a and the second housing 10b are assembled, the first partition plate 11a, the first support plate 11b, the first flexible body 50, the second support plate 12a, and the second partition plate 12b. And the second flexible body 60 is combined to realize a design for isolating the still air layer. Thereby, air in a stationary state is enclosed between the first shielding wall 11 and the second shielding wall 12 to form the air shielding layer 40. In addition, since the first shielding wall 11 is provided, the third space 103 does not communicate with the first space 101. Furthermore, since the second shielding wall 12 is provided, the third space 103 does not communicate with the second space 102.

以上述べたように、当該電子モジュール20の運転時に、当該発熱電子素子22から発生した熱は当該空気遮断層40により遮断されるため、当該センサ素子30に伝わることがない。また、当該空気遮断層40は、熱を帯びた空気が対流により当該センサ素子30に伝わることのないよう遮断可能であるとともに、熱伝達においても、当該発熱素子22から当該センサ素子30への影響を最小限に抑えることが可能である。   As described above, since the heat generated from the heat generating electronic element 22 is blocked by the air blocking layer 40 during the operation of the electronic module 20, it is not transmitted to the sensor element 30. In addition, the air blocking layer 40 can block the heated air from being transmitted to the sensor element 30 by convection, and the heat transfer from the heating element 22 to the sensor element 30 is also affected. Can be minimized.

以上は本考案の好ましい実施例にすぎず、本考案の請求の範囲を限定するものではない。このほか、本考案の主旨に基づく等価の変形は、いずれも本考案の請求の範囲に属する。   The above are only preferred embodiments of the present invention, and do not limit the scope of the claims of the present invention. In addition, any equivalent modifications based on the gist of the present invention belong to the claims of the present invention.

1 測定装置
10 筐体
10a 第1筐体
10b 第2筐体
100 内部空間
101 第1空間
102 第2空間
103 第3空間
11 第1遮蔽壁
11a 第1仕切り板
11b 第1支持板
111 支持リブ
12 第2遮蔽壁
12a 第2支持板
12b 第2仕切り板
13 放熱孔
20 電子モジュール
21 回路基板
22 発熱電子素子
30 センサ素子
40 空気遮断層
50 第1可撓体
60 第2可撓体
DESCRIPTION OF SYMBOLS 1 Measuring apparatus 10 Housing | casing 10a 1st housing | casing 10b 2nd housing | casing 100 Internal space 101 1st space 102 2nd space 103 3rd space 11 1st shielding wall 11a 1st partition plate 11b 1st support plate 111 Support rib 12 2nd shielding wall 12a 2nd support plate 12b 2nd partition plate 13 Heat radiation hole 20 Electronic module 21 Circuit board 22 Heating electronic element 30 Sensor element 40 Air shielding layer 50 1st flexible body 60 2nd flexible body

Claims (15)

内部空間と、当該内部空間に設けられる第1遮蔽壁及び第2遮蔽壁を備え、当該第1遮蔽壁及び当該第2遮蔽壁は、当該内部空間を、第1空間、第2空間、及び当該第1遮蔽壁と第2遮蔽壁の間に形成される第3空間に分割し、且つ、当該第3空間は、当該第1空間及び当該第2空間と連通しない筐体、
当該第1空間に配置され、回路基板と、当該回路基板に組み合わされる少なくとも1の発熱電子素子を含む電子モジュール、
当該第2空間に配置され、当該回路基板に電気的に接続されるセンサ素子、及び
当該第3空間に位置し、当該発熱電子素子から発生した熱が当該センサ素子に伝わることのないよう遮断する空気遮断層、を含む測定装置の内部断熱構造。
An internal space, and a first shielding wall and a second shielding wall provided in the internal space, the first shielding wall and the second shielding wall comprising the internal space, the first space, the second space, and the A housing that is divided into a third space formed between the first shielding wall and the second shielding wall, and the third space does not communicate with the first space and the second space;
An electronic module disposed in the first space and including a circuit board and at least one heat generating electronic element combined with the circuit board;
A sensor element disposed in the second space and electrically connected to the circuit board, and located in the third space, blocks heat from the heat generating electronic element from being transmitted to the sensor element. An internal heat insulating structure of the measuring device including an air blocking layer.
当該筐体は、互いに組み合わされる第1筐体及び第2筐体を含む請求項1記載の測定装置の内部断熱構造。   The internal heat insulating structure of the measurement apparatus according to claim 1, wherein the housing includes a first housing and a second housing combined with each other. 当該第1遮蔽壁は、当該第1筐体に設けられる第1仕切り板と、当該第2筐体に設けられる2つの第1支持板を含む請求項2記載の測定装置の内部断熱構造。   The internal heat insulating structure of the measurement apparatus according to claim 2, wherein the first shielding wall includes a first partition plate provided in the first housing and two first support plates provided in the second housing. 第1可撓体を更に含み、当該第1可撓体の一方の側は当該第1仕切り板に設けられ、当該第1可撓体の反対側は当該2つの第1支持板の間に挟持される請求項3記載の測定装置の内部断熱構造。   The first flexible body further includes one side of the first flexible body provided on the first partition plate, and the opposite side of the first flexible body is sandwiched between the two first support plates. The internal heat insulation structure of the measuring apparatus according to claim 3. 当該第1可撓体は、発泡体又はゴムからなる請求項4記載の測定装置の内部断熱構造。   The internal heat insulating structure of the measuring apparatus according to claim 4, wherein the first flexible body is made of foam or rubber. 当該第2遮蔽壁は、当該第1筐体に設けられる2つの第2支持板と、当該第2筐体に設けられる第2仕切り板を含む請求項2記載の測定装置の内部断熱構造。   The internal heat insulating structure of the measuring apparatus according to claim 2, wherein the second shielding wall includes two second support plates provided in the first housing and a second partition plate provided in the second housing. 第2可撓体を更に含み、当該第2可撓体の一方の側は当該第2仕切り板に設けられ、当該第2可撓体の反対側は当該2つの第2支持板の間に挟持される請求項6記載の測定装置の内部断熱構造。   A second flexible body is further included, and one side of the second flexible body is provided on the second partition plate, and the opposite side of the second flexible body is sandwiched between the two second support plates. The internal heat insulation structure of the measuring apparatus according to claim 6. 当該第2可撓体は、発泡体又はゴムからなる請求項7記載の測定装置の内部断熱構造。   The internal heat insulating structure of the measuring apparatus according to claim 7, wherein the second flexible body is made of foam or rubber. 当該第1遮蔽壁及び当該第2遮蔽壁は、それぞれU型をなしている請求項1記載の測定装置の内部断熱構造。   The internal heat insulation structure of the measuring apparatus according to claim 1, wherein each of the first shielding wall and the second shielding wall is U-shaped. 当該第1遮蔽壁及び当該第2遮蔽壁は、それぞれ当該筐体の内壁面を取り囲んでいる請求項1記載の測定装置の内部断熱構造。   The internal heat insulating structure of the measuring apparatus according to claim 1, wherein the first shielding wall and the second shielding wall respectively surround an inner wall surface of the housing. 当該第1遮蔽壁は、平行に間隔を置いて当該第2遮蔽壁の内側に位置する請求項10記載の測定装置の内部断熱構造。   The internal heat insulation structure of the measuring apparatus according to claim 10, wherein the first shielding wall is positioned inside the second shielding wall with a space in parallel. 当該第1遮蔽壁の一方の側面に複数の支持リブが備えられる請求項1記載の測定装置の内部断熱構造。   The internal heat insulating structure of the measuring apparatus according to claim 1, wherein a plurality of support ribs are provided on one side surface of the first shielding wall. 当該筐体には複数の放熱孔が設けられ、当該第1空間、当該第2空間及び当該第3空間は、それぞれこれらの放熱孔を介して外部と連通している請求項1記載の測定装置の内部断熱構造。   The measuring apparatus according to claim 1, wherein the housing is provided with a plurality of heat radiation holes, and the first space, the second space, and the third space communicate with the outside through the heat radiation holes, respectively. Internal heat insulation structure. 当該センサ素子は温度センサであり、且つ、当該温度センサは、当該第2空間のうち当該筐体の一方の側に寄せて設けられる請求項1記載の測定装置の内部断熱構造。   The internal heat insulating structure of the measuring apparatus according to claim 1, wherein the sensor element is a temperature sensor, and the temperature sensor is provided close to one side of the housing in the second space. 当該センサ素子は、当該第2空間のうち当該筐体の一方の側に寄せて設けられる請求項1記載の測定装置の内部断熱構造。   The internal heat insulating structure of the measuring apparatus according to claim 1, wherein the sensor element is provided close to one side of the housing in the second space.
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