JP3208371B2 - Sensor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing which can be attached to a fixed support, and a detecting portion, which is housed and fixed in the housing such that the detecting portion is arranged at the tip of the housing. An IC module;
A plurality of signal lines are coated with an insulating coating material having one end coupled to the rear end of the housing, and the extension of each signal line from one end of the insulating coating is provided to the IC module in the housing. More particularly, the present invention relates to a sensor device suitably used as a wheel speed sensor of a vehicle.

[0002]

2. Description of the Related Art Conventionally, such an apparatus has been disclosed in
It is already known from, for example, Japanese Patent Publication No.

[0003]

SUMMARY OF THE INVENTION In the above prior art,
A housing for positioning and fixing the IC module at a fixed position while securing the sealing properties of the connection portion of the IC module and the signal line is provided to hold the case for accommodating the IC module and one end of the insulating covering material in the cord. Each signal line and IC are connected by connecting the holder attached to one end of the insulating coating material to the case and the holder.
It is composed of a synthetic resin mold part that covers the connection part of the module, and it is difficult to say that the number of parts constituting the housing is small.

[0004] Further, the case in which the housing accommodates the IC module, a holder which holds one end of the insulating covering material of the cord and is mounted on one end of the insulating covering material and positioned and mounted on the case, , A connecting portion of the IC module and each signal line, and a potting material filled in the case so as to cover a part of the holder. It is difficult to say that the number of components that make up is small.

The present invention has been made in view of the above circumstances, and provides a sensor device in which a housing can be configured with a small number of parts and the insulation of a connection portion between a signal line and an IC module is enhanced. With the goal.

[0006]

In order to achieve the above object, the present invention has a housing which can be attached to a fixed support, and a detecting portion, and the detecting portion is arranged at the tip of the housing. An IC module housed and fixed in the housing, and a plurality of signal lines covered with an insulating covering material having one end coupled to the rear end of the housing. A signal line extending from the one end of the insulating covering material, the signal line extending from the one end of the insulating covering material, and each signal. An insert body formed of a synthetic resin to cover a connecting portion of the wire to the IC module and the IC module and having a through hole formed between the connecting portions; In the outer shell so as to fill the through hole made of synthetic resin for covering said interposer while being more mold formed, the housing is characterized in that it is configured.

[0007] According to such a configuration, the housing is composed of the insert and the outer shell, and the case conventionally required for accommodating the IC module is unnecessary, and the number of parts constituting the housing is reduced. Can be reduced. Moreover, the through-holes formed in the insert between the connection portions of each signal line and the IC module are formed by disposing a mold between the connection portions when the insert is formed. Even if each connection part is in a position close to each other, it is possible to prevent short-circuiting between connection parts and short-circuiting caused by whiskers generated in the core wire of each signal line,
Insulation can be enhanced by reducing the size of the insert and thus the housing, and since the outer shell covering the insert fills the through hole, the insulation can be further enhanced. .

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below based on one embodiment of the present invention shown in the accompanying drawings.

FIGS. 1 to 10 show an embodiment in which the present invention is applied to a wheel speed sensor of a vehicle.
1 is a side view of the sensor device, FIG. 2 is a view taken in the direction of arrow 2 in FIG. 1, FIG. 3 is a longitudinal sectional view of the sensor device, FIG. 4 is a perspective view showing a connection state of an IC module and a cord, and FIG. FIG. 6 is a vertical sectional view of the body molding die apparatus, taken along line 5-5 in FIG. 6, FIG. 6 is a sectional view taken along line 6-6 in FIG. 5, FIG. 7 is a perspective view of the insert, and FIG. FIG. 9 is a perspective view of the insert seen from the direction of the arrow 8 in FIG. 7, FIG. 9 is an enlarged view of the insert in the direction of the arrow 9 in FIG. 8, and FIG.

1 to 3, this sensor device is used as a wheel speed sensor of a vehicle. An IC module 12 is housed and fixed in a housing 11 fixed to a fixed support 10. The cord 13 connected to the IC module 12 extends from the housing 11.

The IC module 12 includes a magnet and a Hall IC.
, A capacitor, a substrate, a pair of terminals 15, 15, and the like.
The housings 5 and 15 are housed and fixed in the housing 11 so as to face rearward.

The housing 11 includes an insert 16 molded from a soft synthetic resin such as polyurethane,
An outer shell 17 is formed from a synthetic resin that is harder than the insert 16, for example, a polyamide mixed with glass fiber and covers the insert 16.

In FIG. 4, a cord 13 is formed by covering a pair of bundled signal lines 18 with an insulating coating material 19 made of synthetic resin. Each signal from one end of the insulating coating material 19 is provided. The extending portions of the wires 18 are connected to the terminals 15 of the IC module 12 by caulking or welding using conductive metal joints 20.

ICs interconnected as shown in FIG.
The module 12 and the cord 13 are set in an insert molding die apparatus 35 shown in FIGS. The insert molding device 35 includes a pair of dies 36 and 37 which can be separated from each other. The insert 36 is inserted between the two dies 36 and 37 in the clamped state. A cavity 38 corresponding to the outer shape is formed. The mutually connected IC module 12 and cord 13 are inserted into the cavity 38 so as to position the IC module 12 between the two dies 36 and 37. In addition, both dies 3
6 and 37, for example, the mold 36, the terminals 15 and 15 of the IC module 12 and the signal lines 18 and
The protrusion 39 is provided integrally with the connection portion 18 between the connection portions.

By injecting a soft synthetic resin such as polyurethane into the cavity 38, one end of the insulating covering 19 of the cord 13 and a pair of signal lines extending from one end of the insulating covering 19 are formed. 18, an insert member 16 formed of a soft synthetic resin is obtained so as to cover the connection portions of the signal lines 18, 18 to the terminals 15, 15 of the IC module 12 and the IC module 12. become.

Referring also to FIGS. 7 to 9, the insert 16 includes a first cover 16 covering the IC module 12 so as to extend in a substantially polygonal column shape with the detector 14 facing the tip.
a and the second covering portion 1 covering one end of the insulating covering material 19
6b, each signal line 18, 18 and their signal lines 1
8 and 18 to cover the connection to the IC module 12
And a third covering portion 16c for connecting between the second covering portions 16a and 16b.

Further, in the third covering portion 16c, between the connecting portions of the terminals 15, 15 of the IC module 12 and the signal lines 18, 18 extending from one end of the insulating covering material 19, an insert 16 is provided. During the molding of the mold, the mold 3
6 are arranged, the projections 39
Is formed.

A pair of digging projections 23 are provided on the outer periphery of the first covering portion 16a over the entire circumference at positions spaced from each other, and a pair of digging projections 24 are provided on the outer periphery of the second covering portion 16b. It protrudes over the entire circumference at positions spaced from each other. These biting projections 23, 23; 24, 2
4 is covered with the outer shell 17 so as to cover the insert 16.
Is melted and molded into close contact with the inner surface of the outer shell 17 when the mold is formed.
Can be strengthened.

On the outer periphery of the first covering portion 16a, first and second engaging projections 25, 26 located on opposite sides of each other are provided.
And the third and fourth engaging projections 27 and 28 located on opposite sides of each other so as to be arranged on a straight line orthogonal to the straight line connecting the first and second engaging projections 25 and 26. Projected integrally. Moreover, the first, third and fourth engagement projections 25,
The control surfaces 27 and 28 are such that the control surfaces 25a, 27a and 28a facing the front end side of the first cover 16a and the control surfaces 25b, 27b and 28b facing the outside of the first cover 16a are continuous at right angles to each other. Respectively formed. The second engaging projection 26 has a regulating surface 26 facing the tip end of the first covering portion 16a.
a and the regulating surface 2 facing the outside of the first covering portion 16a.
A regulating surface 26b extending at right angles to the first regulating surface 6a;
a, 26b, a pair of regulating surfaces 26c, 2 which are perpendicular to each other and which face each other along the circumferential direction of the first covering portion 16a.
6c are formed.

By the way, when the outer shell 17 is formed, FIG.
As shown by 0, an outer shell molding die including a lower die 40 and an upper die 41 for forming a cavity 42 corresponding to the outer shape of the outer shell 17 between the lower die 40. Device 43
Inside, the interpolating body 16 is set.

The lower mold 4 of the outer shell forming mold device 43
0 are integrally provided with four positioning portions 30, 30... Corresponding to the engagement protrusions 25 to 28 of the insert body 16, respectively. .. Among the four positioning portions 30, 30,...
mold device 43 of insert 16 in the direction along the longitudinal direction of
The first, third and fourth engaging projections 25, 27, 28 engage with and abut against the regulating surfaces 25a, 27a, 28a of the first and second engaging projections 25, 27, 28, respectively. Mold device 43 of insert 16 in orthogonal direction
The first, third and fourth engagement projections 25, 27, 28 engage and abut with the regulating surfaces 25b, 27b, 28b of the first, third and fourth engagement projections 25, 27, 28, respectively. Also, four positioning parts 30,
One of the remaining positioning portions 30 among the 30... Of the second engaging projection 26 is used to position the insert 16 in the mold device 43 in the direction along the longitudinal direction of the first covering portion 16a. The first covering portion 16 engages with and abuts on the regulating surface 26a.
a engages with and abuts on the regulating surface 26b of the second engaging projection 26 in order to achieve positioning of the insert 16 in the mold device 43 in a direction perpendicular to the longitudinal direction of the first covering portion 16a. In order to achieve positioning of the insert 16 in the mold device 43 in the direction along the circumferential direction of the second engaging projection 26, the regulating surfaces 26c, 2
6c so as to engage with and abut on the second engaging protrusion 26.

By the way, as shown in FIGS. 1 to 3,
The outer shell 17 is integrally provided with a flange portion 17a extending outwardly.
A metal collar 31 through which a bolt (not shown) for fastening the outer shell 17, that is, the housing 11 to the support 10 is inserted is integrally embedded. Thus, the lower die 40 is provided integrally with a core 44 inserted into the collar 31.

In this manner, the insert 1 in the longitudinal direction of the first covering portion 16a and in a plane orthogonal to the longitudinal direction are provided.
In a state where the position of 6 is determined in the outer shell forming mold device 43, a hard synthetic resin such as polyamide mixed with glass fiber is provided on the upper mold 41 with the gate 4.
5 into the cavity 42, the outer shell 17 is molded by the outer shell molding die device 43.

The outer shell 17 is provided with the IC module 12.
So that the detecting section 14 of the
And a portion of the second covering portion 16b of the insert 16 is exposed to the outside.
6 will be covered. Thereby, the detecting unit 1 is placed in the housing 11 composed of the insert 16 and the outer shell 17.
The IC module 12 is housed and fixed by disposing the IC module 4 at the front end of the housing 11, and the cord 13 extends from the housing 11 by connecting one end of the insulating coating material 19 to the rear end of the housing 11. Issued
The extension of each of the signal lines 18 from one end of the insulating coating 19 is connected to the IC module 12 in the housing 11.

Further, at the time of molding the outer shell 17, the through holes 21 in the inner insert 16 are filled with a synthetic resin constituting the outer shell 17.

Next, the operation of this embodiment will be described. The housing 11 of this sensor device is composed of an insert 16 and an outer shell 17 which are respectively molded from a synthetic resin. Since the case in which the IC module is housed becomes unnecessary, the number of parts constituting the housing 11 can be reduced. Moreover, since the insert 16 is made of a soft synthetic resin, the insert 16 can be easily bent in an arbitrary direction before the outer shell 17 covering the insert 16 is molded. Therefore, it is possible to easily cope with a change in the extension direction of the cord 13 from the housing 11. In addition, the elasticity of the insert 16 allows the insert 16 and the outer shell 17 to be securely brought into close contact with each other to improve the sealing performance.

On the outer periphery of the inner insert 16, the outer shell 17 is engaged with and abuts with the positioning portions 30, 30... Provided on the outer shell forming die device 43 for forming the outer shell 17. Engaging projections 25 to 28 are provided for positioning the insert body 16 with respect to. Therefore, when molding the outer shell 17, the insert 1
6 is inserted into the mold device 43, the outer shell 1
7, the position of the insert 16 relative to the insert 7 can be easily determined.
In addition, the relative position of the outer shell 17 can be accurately determined, whereby the productivity of the housing 11 can be increased.

Further, in the interpolator 16, the signal lines 18,
A through-hole 21 is formed between the connection portions of the IC module 12 and the terminals 15 and 15 of the IC module 12.
Is formed by arranging a projection 39 integral with the mold 36 between the connecting portions when the insert body 16 is molded by the insert body molding die device 35. Therefore, even if the connecting portions are located close to each other, it is possible to prevent short-circuiting between the connecting portions and short-circuiting caused by whiskers generated in the core wires of the signal lines 18 and 18 due to mutual contact. The insulation can be enhanced by reducing the size of the insert 16 and thus the housing 11. Moreover, since the outer shell 17 covering the insert 16 fills the through-hole 21, the insulating property can be further improved.

Although the embodiments of the present invention have been described in detail, the present invention is not limited to the above embodiments, and various design changes can be made without departing from the present invention described in the appended claims. It is possible to do.

[0030]

As described above, according to the present invention, the number of parts constituting the housing can be reduced by forming the housing with the insert and the outer shell which are respectively molded by synthetic resin. By reducing the size of the insert and thus the housing, the insulation at the connection portions of the signal lines and the IC module can be enhanced.

[Brief description of the drawings]

FIG. 1 is a side view of a sensor device.

FIG. 2 is a view taken in the direction of arrow 2 in FIG. 1;

FIG. 3 is a longitudinal sectional view of the sensor device.

FIG. 4 is a perspective view showing a connection state of an IC module and a cord.

FIG. 5 is a vertical sectional view of the insert molding die apparatus, and FIG.
FIG. 5 is a sectional view taken along line 5-5 of FIG.

FIG. 6 is a sectional view taken along line 6-6 in FIG. 5;

FIG. 7 is a perspective view of an insert.

8 is a perspective view of the insert as viewed from the direction of arrow 8 in FIG. 7;

FIG. 9 is an enlarged view as viewed from arrow 9 in FIG. 8;

FIG. 10 is a longitudinal sectional view of a mold apparatus for molding an outer shell.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Support body 11 ... Housing 12 ... IC module 13 ... Code 14 ... Detection part 16 ... Insert body 17 ... Outer shell 18 ... Signal line 19 ..Insulation coating material 21

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G01P 3/487-3/488 G01D 5/245

Claims (1)

(57) [Claims] 1. A housing (11) which can be attached to a fixed support (10), and a detecting portion (14), and the detecting portion (14) is arranged at a tip portion of the housing (11). Stored in the housing (11)
An IC module (12) to be fixed and an insulating coating material (1) having one end coupled to the rear end of the housing (11).
9) a plurality of signal lines (18) are covered, and an extension of each signal line (18) from one end of the insulating covering material (19) is formed in the housing (11) in the IC module (12). , A signal line (18) extending from one end of the insulating covering material (19), and a signal line extending from one end of the insulating covering material (19). (18) IC module (12)
An insert (16) formed of a synthetic resin covering the connection portion to the IC module and the IC module (12) and having a through hole (21) formed between the connection portions; The housing (11) is characterized by being formed of a synthetic resin outer shell (17) covering the insert (16) so as to fill the through hole (21). Sensor device to do.