JP3206463U - Solid state drive module - Google Patents
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- JP3206463U JP3206463U JP2016003261U JP2016003261U JP3206463U JP 3206463 U JP3206463 U JP 3206463U JP 2016003261 U JP2016003261 U JP 2016003261U JP 2016003261 U JP2016003261 U JP 2016003261U JP 3206463 U JP3206463 U JP 3206463U
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0668—Interfaces specially adapted for storage systems adopting a particular infrastructure
- G06F3/0671—In-line storage system
- G06F3/0673—Single storage device
- G06F3/0679—Non-volatile semiconductor memory device, e.g. flash memory, one time programmable memory [OTP]
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
Abstract
【課題】光線の明暗や色彩の異なる変化を表すと共に、メモリモジュール全体の文字の陰影、画像の陰影の明暗の変化を表わしながら、視覚効果を改善並びに強化するソリッドステートドライブモジュールを提供する。【解決手段】ソリッドステートドライブモジュール１０は、基板１１と、フラッシュメモリ１３と、遮光膜１５と、発光ダイオードとを有し、遮光膜は、不透光性の銅箔からなると共に基板の上部辺縁に接近し、フラッシュメモリは、基板に設けられると共にエッジコネクタ１８に接近して電気回路に接続され、発光ダイオードは、基板に設けられると共に電気回路に接続され、くり貫き標示部１５Ａに接近し、とりわけ遮光膜とは基板の二つの異なる側の表面に位置する。よって、発光ダイオードから発する光線は遮光膜のくり貫き標示部に向かい、特定の光パターン、文字、または線を形成し、メモリモジュール全体の文字の陰影、画像の陰影の明暗の変化を表わしながら視覚効果を強化する。【選択図】図１A solid-state drive module that improves and enhances the visual effect while representing changes in brightness and color of light rays, as well as changes in the shadows of characters and shadows of images in the entire memory module. A solid state drive module 10 includes a substrate 11, a flash memory 13, a light shielding film 15, and a light emitting diode. Close to the edge, the flash memory is provided on the board and close to the edge connector 18 and connected to the electric circuit, and the light emitting diode is provided on the board and connected to the electric circuit, and closes to the cutout indicator 15A. In particular, the light shielding film is located on the surface of two different sides of the substrate. Therefore, the light emitted from the light-emitting diode is directed to the marking part of the light-shielding film, forming a specific light pattern, character, or line, and visually changing the shadow of the character of the entire memory module and the change of light and darkness of the image shadow. Strengthen the effect. [Selection] Figure 1
Description
本考案は、ソリッドステートドライブモジュールに関し、特に、不透光で複数のくり貫き標示部を有する遮光膜を基板に貼付し、発光ダイオードをくり貫き標示部付近に配置することで、発光ダイオードから発する光線をくり貫き標示部に向けて、特定の光パターン、文字、または線を表示し、光線の明暗や色彩の異なる変化を表すと共に、メモリモジュール全体の文字の陰影、画像の陰影の明暗の変化を表わしながら、視覚効果を改善並びに強化するソリッドステートドライブモジュールに関する。 The present invention relates to a solid state drive module, and in particular, emits light from a light-emitting diode by sticking a light-shielding film that is opaque and having a plurality of cut-out marking parts to a substrate and placing the light-emitting diodes in the vicinity of the marking parts. A specific light pattern, character, or line is displayed to cut through the light beam toward the marking part, indicating changes in the light's light and darkness and color, and changes in the light and darkness of the entire memory module. The present invention relates to a solid state drive module that improves and enhances visual effects.
プリント基板（ＰＣＢ）とその関連電子工業界で使用されている回路モジュールは通常、回路基板と回路装置を有し、回路装置は導電線を経由して電気マルチタップに接続され、複数の発光ダイオードは回路装置と電気マルチタップの間における導電線に設置され、発光ダイオードは導電線をオンまたはオフにすることで発光の明暗を制御して、現時点での回路モジュールの操作状態を表示する。然しながら、何等遮蔽物がなければ、発光ダイオードからの光線が目に直射して、眩しかったり不快感を起こしたりする。 A circuit module used in a printed circuit board (PCB) and its related electronics industry usually has a circuit board and a circuit device, and the circuit device is connected to an electric multi-tap via a conductive line, and a plurality of light emitting diodes. Is installed on a conductive line between the circuit device and the electric multi-tap, and the light emitting diode controls the brightness of light emission by turning on or off the conductive line, and displays the current operation state of the circuit module. However, if there is no shielding object, the light from the light-emitting diode is directly applied to the eyes, resulting in dazzling or uncomfortable feeling.
上記の問題を解決するため、周知技術の台湾実用新案登録Ｍ５０８０５３号公報には、基板と、少なくとも一つの発光ダイオードと、少なくとも半透明の導光体とを有する回路モジュールが開示されており、基板はＰＣＩ−Ｅマルチタップを有し、ＰＣＩ−ＥマルチタップはＰＣＩ−Ｅスロットに電気的に接続され、発光ダイオードは、基板におけるＰＣＩ−Ｅマルチタップに対向する側に配置されてＰＣＩ−Ｅマルチタップに電気的に接続され、特に、導光体は前記少なくとも一つの発光ダイオードを覆う。このため、発光ダイオードからの光線は導光体で屈折して吸収され、より柔和でむらのない光線になり、発光ダイオードからの光線が目に直射されて視力障害となるのを防止できる。 In order to solve the above problem, Taiwan Utility Model Registration No. M5088053, a well-known technology, discloses a circuit module having a substrate, at least one light emitting diode, and at least a translucent light guide. Has a PCI-E multi-tap, the PCI-E multi-tap is electrically connected to the PCI-E slot, and the light-emitting diode is disposed on the side of the substrate facing the PCI-E multi-tap so that the PCI-E multi-tap It is electrically connected to the tap, in particular the light guide covers the at least one light emitting diode. For this reason, the light beam from the light emitting diode is refracted and absorbed by the light guide, and becomes a softer and more uniform light beam. This prevents the light beam from the light emitting diode from being directly irradiated to the eyes and causing visual impairment.
しかし、上記の周知技術のデメリットは特定構成の導光体を配置する必要があることから、全体の構成が複雑になり、設計、生産、取り付けにも不向きなうえ、導光体の配置が材料コストを押し上げる原因となり、その結果、産業上の利用可能性に悪影響を与えるため、普及率が終始高まらない状況である。 However, the disadvantage of the above-mentioned well-known technology is that it is necessary to arrange a light guide with a specific configuration, which makes the overall configuration complicated and unsuitable for design, production, and installation. This is a situation where the penetration rate does not increase all the time because it increases costs and, as a result, adversely affects industrial applicability.
よって、簡単な遮光方法を提供し、不透光で複数のくり貫き標示部を有する遮光膜を基板に貼付し、発光ダイオードをくり貫き標示部付近に配置して、発光ダイオードから発する光線をくり貫き標示部に向けることで特定の光パターン、文字、または線を表示し、光線の明暗や色彩の異なる変化を表すと共に、メモリモジュール全体の文字の陰影、画像の陰影の明るさの変化を表わしながら、視覚効果を改善並びに強化して、背景技術における上記問題を全て解決する斬新なソリッドステートドライブモジュールが望まれている。 Therefore, a simple light-shielding method is provided, and a light-shielding film having a plurality of pierced marking parts is pasted on a substrate without being translucent, and a light-emitting diode is pierced and arranged in the vicinity of the marking part, so that light emitted from the light-emitting diodes is cut. A specific light pattern, character, or line is displayed by directing it to the penetrating marking part, indicating the change in brightness and color of light rays, and the change in brightness of characters and shadows of the image in the entire memory module. However, a novel solid state drive module that improves and enhances visual effects and solves all of the above problems in the background art is desired.
本考案の目的は、主として、基板と、少なくとも一つのフラッシュメモリと、遮光膜と、少なくとも一つの発光ダイオードとを有するソリッドステートドライブモジュールを提供することである。基板は、透光性と電気絶縁性を有すると共に電気回路を有し、基板の下部辺縁には、電気回路に接続するエッジコネクタが設けられ、エッジコネクタは外部装置のスロットに挿設される。 An object of the present invention is mainly to provide a solid state drive module having a substrate, at least one flash memory, a light shielding film, and at least one light emitting diode. The board has translucency and electric insulation, and has an electric circuit. An edge connector connected to the electric circuit is provided on the lower edge of the board, and the edge connector is inserted into a slot of an external device. .
遮光膜は不透光性で基板に設けられて基板の上部辺縁に接近し、特に、少なくとも一つのくり貫き標示部を有する。フラッシュメモリは、基板に設けられてエッジコネクタに接近し、電気回路に接続される。発光ダイオードは、基板に設けられて電気回路に接続され、遮光膜とは基板の二つの異なる側の表面に位置し、例えば、遮光膜が基板の正面に設けられると、発光ダイオードは基板の反面または裏面に設けられる。また、発光ダイオードは遮光膜のくり貫き標示部に接近している。 The light-shielding film is opaque and is provided on the substrate so as to approach the upper edge of the substrate, and in particular has at least one cut-out marking portion. The flash memory is provided on the substrate, approaches the edge connector, and is connected to an electric circuit. The light-emitting diode is provided on the substrate and connected to the electric circuit, and the light-shielding film is located on the surface on two different sides of the substrate. For example, when the light-shielding film is provided on the front surface of the substrate, the light-emitting diode is opposite to the substrate. Or it is provided on the back surface. Further, the light emitting diode is close to the cutout marking portion of the light shielding film.
なお、発光ダイオードは、エッジコネクタを介して外部装置からの電力により点灯して発光し、或いは、基板に設けられて電気回路に接続される電子素子からの電力により点灯して発光することで、発光ダイオードから発する光線が遮光膜のくり貫き標示部に向けられる。 In addition, the light emitting diode is turned on by the electric power from the external device through the edge connector to emit light, or is turned on by the electric power from the electronic element provided on the substrate and connected to the electric circuit to emit light, The light beam emitted from the light emitting diode is directed to the marking part of the light shielding film.
本考案は全体として簡単な構成でありながら、遮光膜は不透光性で、複数のくり貫き標示部を有するため、発光ダイオードから発する光線がくり貫き標示部を照射することにより、特定の光パターン、文字、または線を形成することで、メモリモジュール全体の文字の陰影、画像の陰影の明暗の変化を表わしながら、視覚効果を強化する。 Although the present invention has a simple structure as a whole, the light-shielding film is opaque and has a plurality of cut-out marking portions. By forming a pattern, character, or line, the visual effect is enhanced while representing the change in the shadow of the character and the shadow of the image in the entire memory module.
以下、図面と符号を参照しながら、本考案の好適な実施例について、当業者が明細書に照らして理解し実施できるよう詳しく説明する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings and symbols so that those skilled in the art can understand and implement the invention in light of the specification.
図１及び図２は、本考案のソリッドステートドライブモジュールの一実施例において異なる視角から見る２つの斜視図であり、それぞれソリッドステートドライブモジュールの第１表面と第２表面、例えば正面と裏面を示すものである。図１及び図２のように、本考案の実施例におけるソリッドステートドライブモジュール１０は、基板１１と、少なくとも一つのフラッシュメモリ１３と、遮光膜１５と、少なくとも一つの発光ダイオード１７とを有し、外部装置のスロット（図示せず）に挿設され、特に視覚効果を強化する効果を有する。 1 and 2 are two perspective views seen from different viewing angles in an embodiment of the solid state drive module of the present invention, showing a first surface and a second surface, for example, a front surface and a back surface, respectively, of the solid state drive module. Is. As shown in FIGS. 1 and 2, the solid state drive module 10 according to the embodiment of the present invention includes a substrate 11, at least one flash memory 13, a light shielding film 15, and at least one light emitting diode 17. It is inserted into a slot (not shown) of the external device, and has an effect of enhancing visual effects in particular.
基板１１は、透光性と電気絶縁性を有すると共に電気回路（図示せず）を有し、基板１１の下部辺縁には、電気回路に接続するエッジコネクタ１８が設けられ、エッジコネクタ１８は外部装置のスロットに挿設される。 The substrate 11 has translucency and electrical insulation and has an electric circuit (not shown). An edge connector 18 connected to the electric circuit is provided on the lower edge of the substrate 11. It is inserted into the slot of the external device.
遮光膜１５は不透光性で銅箔からなるのが好ましい。なお、遮光膜１５は、基板１１に設けられて基板１１の上部辺縁に接近し、少なくとも一つのくり貫き標示部１５Ａを有する。 The light shielding film 15 is preferably opaque and made of copper foil. The light shielding film 15 is provided on the substrate 11, approaches the upper edge of the substrate 11, and has at least one cutout marking portion 15 </ b> A.
フラッシュメモリ１３は、基板１１に設けられてエッジコネクタ１８に接近し、基板１１の電気回路に接続される。 The flash memory 13 is provided on the substrate 11, approaches the edge connector 18, and is connected to the electric circuit of the substrate 11.
発光ダイオード１７は基板１１に設けられて電気回路に接続され、遮光膜１５とは基板１１の二つの異なる側の表面に位置し、例えば、遮光膜１５が基板１１の正面に設けられると、発光ダイオード１７は基板１１の反面または裏面に設けられる。特に、発光ダイオード１７は、遮光膜１５のくり貫き標示部１５Ａの上部辺縁、下部辺縁、または周囲に接近して設置される。 The light emitting diode 17 is provided on the substrate 11 and connected to an electric circuit. The light shielding film 15 is located on the surface of the substrate 11 on two different sides. For example, when the light shielding film 15 is provided on the front surface of the substrate 11, the light emitting diode 17 emits light. The diode 17 is provided on the opposite side or the back side of the substrate 11. In particular, the light emitting diode 17 is installed close to the upper edge, the lower edge, or the periphery of the cutout marking portion 15A of the light shielding film 15.
また、更に少なくとも一つの電子素子１９を基板１１に配置することができ、電子素子１９は、基板１１に電気的に接続される電気回路であり、電源調節、フィルタリング、スイッチング、信号制御などといった所定の電気的機能を提供する。 Further, at least one electronic element 19 can be disposed on the substrate 11, and the electronic element 19 is an electric circuit electrically connected to the substrate 11, and includes predetermined power supply adjustment, filtering, switching, signal control, and the like. Provides the electrical function of
更に具体的には、発光ダイオード１７は、エッジコネクタ１８を介して外部装置からの電力により点灯して発光し、或いは、発光ダイオード１７は、前記基板１１上で電気回路に接続される電子素子１９からの電力により点灯して発光する。電子素子１９は、電気スイッチまたは電子コントローラであり、発光ダイオード１７から発する光線を遮光膜１５のくり貫き標示部１５Ａに向ける。 More specifically, the light-emitting diode 17 is lit by light from an external device via the edge connector 18 to emit light, or the light-emitting diode 17 is an electronic element 19 connected to an electric circuit on the substrate 11. Lights up and emits light with electric power from. The electronic element 19 is an electrical switch or an electronic controller, and directs the light emitted from the light emitting diode 17 through the light shielding film 15 toward the marking portion 15A.
そのため、くり貫き標示部１５Ａは、発光ダイオード１７から発する光線を介して所定の特定の光パターン、文字、または線を表し、光線の明暗や色彩の異なる変化を表すと共に、ソリッドステートドライブモジュール１０全体の文字の陰影、画像の陰影の明暗の変化を表して視覚効果を改善し強化する。 Therefore, the cutout marking portion 15A represents a predetermined specific light pattern, character, or line through the light beam emitted from the light emitting diode 17, and represents the change in light brightness and the color and the color, and the solid state drive module 10 as a whole. Improves and enhances visual effects by expressing the shading of characters and the changes in shading of image shading.
また、もう一つの実施例では、遮光膜１５は、基板１１の正面を完全に遮蔽して、フラッシュメモリ１３、エッジコネクタ１８、電子素子１９を露出させる。 In another embodiment, the light shielding film 15 completely shields the front surface of the substrate 11 to expose the flash memory 13, the edge connector 18, and the electronic element 19.
以上のとおり、本考案の主な特徴は、導光素子や遮光素子を何等使用する必要がなく、遮光作用を有する遮光膜を使用し、特に、不透光性を利用して複数のくり貫き標示部を有する遮光膜を基板に貼付し、発光ダイオードの光線がくり貫き標示部に向かうように発光ダイオードを配置することで、特定の光パターン、文字、または線を表わすことができ、これにより、光線の明暗や色彩の異なる変化を表して、メモリモジュール全体の文字の陰影、画像の陰影の明暗の変化を表す。よって、本考案のソリッドステートドライブモジュールは簡単な構成で、生産や取り付けが容易であり、発光ダイオードが眩しいという欠点を解消したと共に、全体の視覚効果を改善した。 As described above, the main feature of the present invention is that it is not necessary to use any light guide element or light shielding element, and a light shielding film having a light shielding effect is used. By attaching a light-shielding film having a marking part to the substrate and arranging the light-emitting diode so that the light beam of the light-emitting diode penetrates toward the marking part, a specific light pattern, character, or line can be represented. This represents the change in the light and darkness and the color of the light, and the change in the light and darkness of the character and the shadow of the image in the entire memory module. Therefore, the solid state drive module of the present invention has a simple configuration, is easy to produce and install, eliminates the disadvantage of dazzling light emitting diodes, and improves the overall visual effect.
本考案のもう一つの特徴は、遮光膜が銅箔からなるものであり、くり貫き標示部は周知のエッチング処理により形成可能なため、特定の処理技術を開発する必要がなく、信頼性がかなり高く、産業上の利用可能性を有するものである。 Another feature of the present invention is that the light-shielding film is made of copper foil, and the cut-through marking portion can be formed by a well-known etching process, so that it is not necessary to develop a specific processing technique, and the reliability is considerably high. It has high industrial applicability.
以上の記述は本考案の好ましい実施例の説明をしたに留まり、本考案を制限するものではない。当業者は上記の説明に基づき種々の改良を行うことができ、本考案の精神並びに下記の実用新案登録請求の範囲に含まれるものである。 The above description is merely illustrative of a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art can make various improvements based on the above description, and are included in the spirit of the present invention and the scope of the following utility model registration request.
１０ ソリッドステートドライブモジュール
１１ 基板
１３ フラッシュメモリ
１５ 遮光膜
１５Ａ くり貫き標示部
１７ 発光ダイオード
１８ エッジコネクタ
１９ 電子素子
DESCRIPTION OF SYMBOLS 10 Solid state drive module 11 Board | substrate 13 Flash memory 15 Light shielding film 15A Perforated marking part 17 Light emitting diode 18 Edge connector 19 Electronic element
Claims (4)
不透光性で前記基板に設けられて前記基板の上部辺縁に接近し、少なくとも一つのくり貫き標示部を有する遮光膜と、
前記基板に設けられて前記エッジコネクタに接近し、前記電気回路に接続される少なくとも一つのフラッシュメモリと、
前記基板に設けられて前記電気回路に接続され、前記遮光膜とは前記基板の二つの異なる側の表面に位置すると共に、前記少なくとも一つのくり貫き標示部に接近する少なくとも一つの発光ダイオードと、を有し、
前記発光ダイオードは、前記エッジコネクタを介して外部装置からの電力により点灯して発光し、或いは、前記発光ダイオードは、前記基板上に前記電気回路に接続される電子素子からの電力により点灯して発光することで、前記発光ダイオードから発する光線を前記遮光膜のくり貫き標示部に向けることを特徴とするソリッドステートドライブモジュール。 A substrate having translucency and electrical insulation and having an electrical circuit, and a lower edge connected to the electrical circuit and having an edge connector inserted into a slot of an external device;
A light-shielding film that is opaque and is provided on the substrate, approaches the upper edge of the substrate, and has at least one cut-out marking portion;
At least one flash memory provided on the substrate, approaching the edge connector and connected to the electrical circuit;
At least one light-emitting diode provided on the substrate and connected to the electrical circuit, wherein the light-shielding film is located on the surfaces of the two different sides of the substrate, and approaches the at least one cut-out marking portion; Have
The light emitting diode is lit by power from an external device through the edge connector to emit light, or the light emitting diode is lit by power from an electronic element connected to the electric circuit on the substrate. A solid state drive module characterized by emitting light to direct light emitted from the light emitting diode toward the marking portion of the light shielding film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105205639U TWM526098U (en) | 2016-04-21 | 2016-04-21 | Solid state disk module |
| TW105205639 | 2016-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3206463U true JP3206463U (en) | 2016-09-15 |
Family
ID=56897021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016003261U Expired - Fee Related JP3206463U (en) | 2016-04-21 | 2016-07-07 | Solid state drive module |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3206463U (en) |
| KR (1) | KR20170003750U (en) |
| TW (1) | TWM526098U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7041709B2 (en) | 2019-05-28 | 2022-03-24 | 技嘉科技股▲ふん▼有限公司 | Luminous memory device and memory module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM595787U (en) * | 2020-01-13 | 2020-05-21 | 全何科技股份有限公司 | Pseudo solid state drive circuit board |
-
2016
- 2016-04-21 TW TW105205639U patent/TWM526098U/en not_active IP Right Cessation
- 2016-06-30 KR KR2020160003820U patent/KR20170003750U/en not_active IP Right Cessation
- 2016-07-07 JP JP2016003261U patent/JP3206463U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7041709B2 (en) | 2019-05-28 | 2022-03-24 | 技嘉科技股▲ふん▼有限公司 | Luminous memory device and memory module |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170003750U (en) | 2017-10-31 |
| TWM526098U (en) | 2016-07-21 |
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