JP3204734B2 - Epoxy resin composition for sealing electronic parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for sealing electronic parts.

[0002]

[Prior art and its problems] Epoxy resins are generally excellent in moldability, adhesiveness, mechanical strength, electrical properties, heat resistance, etc., but when used for sealing electronic parts, they are used during heat molding and handling after molding. There is a problem that cracks easily occur due to the internal stress caused by the temperature change, which is a further problem when the electronic components are scaled up or when the package is reduced in size and thickness. As one of the methods of measuring the improvement of such a problem, an attempt was made to reduce the internal stress with a low thermal expansion by increasing the amount of the inorganic filler to be added.
Attempts have been made to solve the problem by using a spherical filler together with a crushed filler (Japanese Patent Laid-Open No. 58-1).
38740). However, when the amount of the spherical filler added is increased, there is a problem that the mechanical strength is reduced and burrs are easily generated at the time of molding, so that workability is significantly reduced.

[0003]

SUMMARY OF THE INVENTION An epoxy resin composition for encapsulating electronic parts according to the present invention is an epoxy resin comprising an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler to solve the above-mentioned problems. In the resin composition, the inorganic filler comprises crushed and spherical inorganic fillers, the spherical inorganic filler is contained in the inorganic filler in an amount of 5 to 90% by weight, and the crushed inorganic filler has an epoxy group in a molecule. The surface treatment is carried out with a silane coupling agent having the same, and the spherical inorganic filler is treated with a silane coupling agent having an amino group and / or an imino group in the molecule. The epoxy resin used in the present invention may be, for example, one or two or more of bisphenol A type, novolak type, alicyclic, linear fatty acid, and halogenated epoxy resins. It is not limited to those. The curing agent used in the present invention may be any of the curing agents used in the epoxy resin, for example, acid anhydrides such as phthalic anhydride, amines such as diaminodiphenylsulfone, phenol novolak resin, and cresol novolak resin. Etc. can be used, but it is not limited to these. The curing accelerator used in the present invention may be any as long as it promotes the reaction between the epoxy resin and the curing agent. Examples thereof include 2,4,6-tris (dimethylaminomethyl) phenol and benzyldimethyl. Tertiary amines such as amines, imidazoles such as 2-methylimidazole, organic phosphines such as triphenylphosphine, and 1,8-diazabicyclo (5,4,
0) Undecene-7 and its derivatives can be used, but it is not limited to these. Examples of the inorganic filler used in the present invention include fused silica, alumina, magnesia, and calcium carbonate. As the silane coupling agent having an epoxy group in the molecule used in the present invention, β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane and the like can be used. Without limitation, silane coupling agents having an amino group and / or imino group in the molecule include N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane and N-β
Phenyl-γ-aminopropyltrimethoxysilane or the like can be used, but is not limited thereto. The epoxy resin composition according to the present invention may optionally contain a release agent, a coloring agent, a flame retardant, and the like as needed.

[0004]

Example 1 240 parts of a crushed filler (fused silica FS-74 manufactured by Denki Kagaku Kogyo Co., Ltd.) was used as a silane coupling agent having an epoxy group in a molecule KBM303 (manufactured by Shin-Etsu Chemical Co., Ltd.) 2.4 Surface-treated at the part, and spherical filler (fused silica FB-74 manufactured by Denki Kagaku Kogyo Co., Ltd.) 3
An o-cresol novolak type epoxy resin (ESCN-195XL Sumitomo Chemical Co., Ltd.) 100 parts), 50 parts of phenol novolak resin (Tamanol 758, manufactured by Arakawa Chemical Industries, Ltd.), 1.5 parts of triphenylphosphine, and 5 parts of a release agent (manufactured by WAXOP Hoechst). The mixture was kneaded with a heating roll (100 ° C.), cooled and pulverized to obtain an epoxy resin composition.

[0005]

Embodiment 2 In the embodiment 2, a silane coupling agent (KBM) having 120 parts of a crushed inorganic filler (fused silica FS-74) and an epoxy group in a molecule is used.
303) Surface-treated with 1.2 parts and 480 parts of a spherical filler (fused silica FB-74) were surface-treated with a silane coupling agent having an imino group in a molecule (KBM573, manufactured by Shin-Etsu Chemical Co., Ltd.). An epoxy resin composition was obtained in the same manner as in Example 1 except that the epoxy resin composition was used.

[0006]

Comparative Example 1 In Comparative Example 1, 450 parts of the crushed inorganic filler (fused silica FS-74) in Example 1 was replaced with a silane coupling agent (KBM) having an epoxy group in the molecule.
303) An epoxy resin composition was obtained in the same manner as in Example 1 except that the surface-treated one in 4.5 parts was used.

[0007]

Comparative Example 2 In Comparative Example 2, 600 parts of a crushed filler (fused silica FS-74) was used as the inorganic filler in Example 1, and a silane coupling agent (K) having an epoxy group in the molecule was used.
BM303) An epoxy resin composition was obtained in the same manner as in Example 1 except that the surface-treated epoxy resin composition was used in 6 parts.

[0008]

Comparative Example 3 In Comparative Example 3, 240 parts of a crushed filler (fused silica FS-74) and 360 parts of a spherical filler (fused silica FB-74) were substituted for the inorganic filler in Example 1 in the molecule. Coupling Agent with Epoxy Group (KBM)
303) An epoxy resin composition was obtained in the same manner as in Example 1 except that the surface-treated epoxy resin was used in 6 parts.

[0009]

Comparative Example 4 In Comparative Example 4, 240 parts of a crushed filler (fused silica FS-74) and 360 parts of a spherical filler (fused silica FB-74) were used in place of the inorganic filler in Example 1 in the molecule. An epoxy resin composition was obtained in the same manner as in Example 1 except that a surface-treated silane coupling agent (KBM602) having an amino group and an imino group was used. The flowability (spiral flow), coefficient of linear expansion, bending strength, and burr of the six types of epoxy resin compositions for encapsulating electronic components thus obtained were measured, and the results were shown in Table 1 below.
Shown in

[0010]

[Table 1] (1) Flow condition (spiral flow) measurement conditions: EM
It was measured at a molding temperature of 175 ° C. and a molding pressure of 70 kgf / cm ² according to MI-1-66. (2) Measurement conditions of linear expansion coefficient: A test piece was prepared at a molding temperature of 175 ° C., a molding pressure of 70 kgf / cm ² , and a molding time of 90 seconds, and measured by a TMA method after heat curing at 175 ° C. × 5 hours. (3) Measuring conditions of bending strength: A test piece was prepared at a molding temperature of 175 ° C., a molding pressure of 70 kgf-cm ² , and a molding time of 90 seconds, and JIS K after heat curing at 175 ° C. × 5 hours.
It was measured according to 6911. (4) Burr measurement conditions: using a 16-pin DIP mold, a molding temperature of 175 ° C., a molding pressure of 70 kgf-cm ² ,
Molding was performed for a molding time of 90 seconds, and the burrs of the air vents were judged as ◎ when the length was less than 0.5 mm, as は when 0.5 mm or more and less than 1.5 mm, and as X when 1.5 mm or more.

[0011]

EFFECTS OF THE INVENTION A crushed filler surface-treated with a silane coupling agent having an epoxy group in the molecule as an inorganic filler and a surface treatment with a silane coupling agent having an amino group and / or an imino group in the molecule. By using an epoxy resin composition that is used in combination with a spherical filler, it becomes possible to highly fill an inorganic filler without lowering flowability, mechanical strength, molding workability, etc., and achieve low thermal expansion. Can be.

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-4-18445 (JP, A) JP-A-2-124925 (JP, A) JP-A-2-124923 (JP, A) JP-A 64-64 38451 (JP, A) JP-A-3-134405 (JP, A) JP-A-2-228354 (JP, A) JP-A-4-50222 (JP, A) JP-A-3-201470 (JP, A) JP-A-1-165655 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) C08L 63/00-63/10 C08K 3/36 C08K 9/06 H01L 23/29

Claims (1)

(57) [Claims] 1. A epoxy resin, curing agent, curing accelerator, in an epoxy resin composition comprising fused silica, spherical fused silica is 5-90 wt% to the molten silica made of fused silica is crushed or spherical fused silica And that the surface of the crushed fused silica was treated with a silane coupling agent having an epoxy group in the molecule, and the surface of the spherical fused silica was treated with a silane coupling agent having an amino group and / or an imino group in the molecule. An epoxy resin composition for sealing electronic components.