JP3196074U - Touch electrode substrate structure - Google Patents

Abstract

A structure of a touch electrode substrate is provided. A structure of a touch electrode substrate includes a substrate layer and a conductive layer formed on a surface of the substrate layer. The conductive layer includes a first region 4 and a second region 5 adjacent to the first region 4. In the first region 4, at least one metal wiring block 41 is provided. The metal wiring block 41 has a metal wiring 42 on which a wiring pattern is formed. The metal wiring blocks 41 are arranged with a space therebetween. The second region 5 is a planar block. With the above-described configuration, at least one touch electrode substrate having the same wiring pattern with the same or different dimensions can be manufactured on the area of a single photomask. Around the metal wiring 42, a flat block is provided on which other manufacturers can process the connection wiring. [Selection] Figure 1A

Description

  The present invention relates to a structure of a touch electrode substrate, and in particular, a structure of a touch electrode substrate that has a metal wiring, can be applied in touch electronic products, and can be provided to other manufacturers for subsequent processing. About.

In the process of manufacturing a conventional touch electrode, generally, a material containing metal is used, and a conductive wiring patterned by printing, electroplating, or etching is manufactured.

In order to determine whether or not the user has touched the touch electronic product, or to which position of the touch electronic product the user has touched, a change in electric signal or capacitance in two or more directions between the conductive wirings is determined. The most commonly used method is currently used. Conductive wiring in various directions is electrically connected to external connection wiring, and connected to other circuit boards, IC chips, etc. of touch electronic products via external connection wiring, and detected signals are externally connected. To be processed.

In general, the aforementioned external connection wiring is connected to the conductive wiring by printing a material containing metal powder on the outside of the conductive wiring. However, in the case of the printing method, the wire diameter of the connection wiring becomes thick, and in recent years, the wiring with a large wire diameter has not been applied to touch electronic products. Further, due to the material used, the impedance value of the manufactured connection wiring is high, and the folding resistance (curved elasticity) is also inferior.

Further, the same conductive material and connection wiring of the conventional touch electrode are made of the same material, and are integrally formed once on the surface of the glass substrate or plastic substrate by printing, electroplating, sputtering or etching. .

  The method of forming the conductive wiring and the connection wiring at the same time can avoid the problem of alignment between the conductive wiring and the connection wiring, but simultaneously manufacture the conductive wiring with an extremely thin wire diameter and the connection wiring with a large wire diameter. Is difficult in practice, and it is not possible to reliably manufacture two stable wire diameters. Furthermore, during the manufacturing process, an expensive and precise glass photomask must be blended and manufactured for each pattern. Therefore, the process of forming the conductive wiring and the connection wiring at one time is intended to reduce the manufacturing cost. Can not be achieved reliably.

An object of the present invention is to form a conductive wiring having a predetermined wiring pattern and a planar area located around the metal wiring of the predetermined wiring pattern, and combine the conductive wiring and the processing space remaining at the periphery of the conductive wiring. This provides a structure of a touch electrode substrate that is applied in touch electronic products that can be connected to other connection wiring by performing subsequent processing using equipment and processes possessed by other manufacturers. There is.

  In order to solve the above-described problem, the structure of the touch electrode substrate of the present invention includes a substrate layer and a conductive layer formed on the surface of the substrate layer. The conductive layer includes a first region and a second region adjacent to the first region. At least one metal wiring block is provided in the first region. The metal wiring block has metal wiring on which a wiring pattern is formed. The metal wiring blocks are arranged with a space therebetween. The second region has a planar block structure.

  The metal wiring is configured by connecting a plurality of conductive electrodes to each other. The conductive electrode includes at least one adhesive layer forming a wiring pattern disposed on the surface of the substrate layer, and a metal conductive electrode layer connected to the surface of the adhesive layer and corresponding to the wiring pattern.

  A first weathering layer is provided on the surface of the metal wiring in the first region. The first weathering layer has a gate-shaped structure. A second weathering layer is provided on the upper surface of the second region.

  The metal wiring presents a grid. The width of the metal wiring is 0.5 μm to 10 μm.

  The manufacturer who purchased the touch electrode substrate of the present invention can process at least one connection wiring on the surface of the second region. In other words, the manufacturer has a wiring pattern in the second area using the equipment and manufacturing process already used, and has a connection wiring that can be electrically connected to the metal wiring in the first area. Can be provided. The connection wiring can be electrically connected to other circuit boards or chips in the touch electronic product. In addition, the metal wiring in the first region is etched into a strip-like or grid-like disconnection structure corresponding to the position of the connection wiring to be processed, and is connected to another circuit board or chip in the touch electronic product via the connection wiring. Connected. Thereby, the flexibility of the installation position in the touch electronic product of this invention can be improved.

The structure of the touch electrode substrate manufactured by the present invention has a metal wiring provided with a wiring pattern. In addition, since the manufacturer who has purchased the structure of the touch electrode substrate of the present invention can process the connection wiring in the planar area around the periphery of the metal wiring, flexibility can be given to subsequent processing. In addition, the structure of the touch electrode substrate of the present invention does not limit the corresponding positions connected to other circuit boards, connection wirings, or chips in the electronic product, so that the application range to the touch electronic product can be expanded.

1 is a plan view illustrating a structure of a touch electrode substrate according to a first embodiment of the present invention. It is a top view which shows the structure of the touch electrode substrate by 2nd Embodiment of this invention. It is sectional drawing of FIG. 1A. It is sectional drawing which shows the state which provided the weathering layer in FIG. 2A. It is sectional drawing of FIG. 1B. It is sectional drawing which shows the state which provided the weathering layer in FIG. 3A. It is a top view which shows the state which processes a connection wiring in the structure of the touch electrode substrate of this invention which has a metal wiring in a single surface. It is a top view which shows the state which processes a connection wiring in the structure of the touch electrode substrate of this invention which has a metal wiring in a single surface. It is a top view which shows the state which processes a connection wiring in the structure of the touch electrode substrate of this invention which has a metal wiring in a single surface. It is a top view which shows the state which processes a connection wiring in the structure of the touch electrode substrate of this invention which has a metal wiring in a single surface. It is a top view which shows the state which processes a connection wiring in the structure of the touch electrode substrate of this invention which has metal wiring on both surfaces. It is a top view which shows the state which processes a connection wiring in the structure of the touch electrode substrate of this invention which has metal wiring on both surfaces. It is a top view which shows the state which processes a connection wiring in the structure of the touch electrode substrate of this invention which has metal wiring on both surfaces. It is a top view which shows the state which processes a connection wiring in the structure of the touch electrode substrate of this invention which has metal wiring on both surfaces.

Embodiments showing the structure, features, and effects of the present invention will be described in detail with reference to the drawings.

Please refer to FIG. 1A, FIG. 2A and FIG. 2B. 1A, 2A and 2B, the structure of the touch electrode substrate 1 according to the first embodiment of the present invention mainly includes a substrate layer 2 and a conductive layer 3. 1A is a plan view, and FIGS. 2A and 2B are cross-sectional views.

The conductive layer 3 can be formed on one single surface (the upper surface 21 or the lower surface 22) of the substrate layer 2 based on the design. Alternatively, it can be formed on both upper and lower surfaces (not shown) of the substrate layer 2.

In the present embodiment, the conductive layer 3 is formed on the upper surface 21 of the substrate layer 2 and includes a first region 4 and a second region 5. As can be seen from the drawing, the first region 4 is constituted by distribution of at least one metal wiring block 41 spaced from each other. The metal wiring block 41 has a plurality of metal wirings 42, and each metal wiring block 41 has the same wiring pattern. The metal wiring 42 presents a grid 43.

Please refer to FIG. 1B, FIG. 3A and FIG. 3B. FIG. 1B, FIG. 3A, and FIG. 3B are 2nd Embodiment of the structure of the touch electrode substrate 1 of this invention. 1B is a plan view, and FIGS. 3A and 3B are cross-sectional views. Referring to FIGS. 1A and 2A, the difference between the first embodiment and the metal wiring block 41 having different dimensions is that the dimensions of each metal wiring block 41 are the same in the second embodiment. That is, the dimensions of each metal wiring block 41 in the first region 4 can be designed to be the same, different from each other, or partially the same.

Please refer to FIG. 2A and FIG. 3A. As can be seen from FIGS. 2A and 3A corresponding to FIGS. 1A and 1B, the metal wiring 42 is configured by connecting a plurality of conductive electrodes 44 to each other. The conductive electrode 44 is connected to at least one adhesive layer 441 that forms a wiring pattern on the upper surface 21, the lower surface 22, or both surfaces of the substrate layer 2, and a metal conductive material that is connected to the upper surface of the adhesive layer 441 and corresponds to the wiring pattern. An electrode layer 442.

Please refer to FIG. 2B and FIG. 3B. As shown in FIG. 2B and FIG. 3B, a weathering layer that protects the structure of the present invention can be formed on the upper surface, the lower surface, or both surfaces of the structure of the touch electrode substrate 1 of the present invention. The weathering layer is based on the difference in distribution position, the first weathering layer 45 having a gate-shaped structure located on the entire surface of the metal wiring 42, the second weathering layer 51 located on the upper surface of the second region 5, It is divided into.

The second region 5 surrounds the outer periphery of the first region 4 and is adjacent to the first region 4 and has a planar structure because it has a planar structure.

Reference is made to FIGS. After manufacturing the structure of the touch electrode substrate 1 having the metal wiring 42 on one or both sides by the manufacturing method of the present invention, the manufacturer who purchased the touch electrode substrate of the present invention has the facilities and processing steps in the factory that he originally has. Thus, the touch electrode substrate 1 can be processed. That is, the exposure process, the development process, and the etching process are performed on the touch electrode substrate 1 to etch the connection wiring 52 in the X-axis direction 521 or the Y-axis direction 522, and the second region 5 other than the connection wiring 52 to be left is left. Remove subrange. At the same time, a disconnection is formed by etching in the metal wiring 42 that originally exhibits the complete grid 43 corresponding to the position of the connection wiring 52 to be set, and a plurality of band-like structures or grid-like structures (FIGS. 4B to 4D). 4D). Subsequently, the connection wiring 52 is connected to a wiring or chip on another circuit board in the touch electronic product.

FIG. 4A is a plan view showing a structure having metal wiring 42 of a single grid 43 on a single surface in the structure of the touch electrode substrate 1 of the present invention.

The connection wiring 52 includes a connection wiring 52 connected in the X-axis direction 521 of the metal wiring 42 as shown in FIG. 4B, and a connection wiring 52 connected in the Y-axis direction 522 of the metal wiring 42 as shown in FIG. 4C. It is divided into.

Moreover, as shown in FIG. 4D, when the touch electrode substrate 1 having the metal wiring 42 on two single surfaces is bonded to each other with an optical transparent adhesive (OCA), a dense wiring pattern distribution of two layers is obtained. The structure of the touch electrode substrate 1 having the metal wiring 42 is formed, and has the connection wiring 52 in the X-axis direction 521 and the Y-axis direction 522 at the same time.

Reference is made to FIGS. 5A to 5D show a second embodiment of the present invention. After being purchased by another manufacturer, the metal wiring 42 in which the wiring patterns are distributed on both sides is obtained by the same processing steps as those of FIGS. 3A to 3D described above. It is a top view which shows the state which produces the structure of the touch electrode board | substrate 1 which has. The difference from the structure shown in FIGS. 4A to 4D is that metal wirings 42 are provided on both sides. Further, as shown in FIGS. 5B to 5D, the touch electrode substrate 1 having the metal wirings 42 on both surfaces separately connects the connection wirings 52 in the X-axis direction 521 and the Y-axis direction 522 located on the surface of the second region 5. The connection wiring 52 in the X-axis direction 521 and the Y-axis direction 522 can be processed and formed at the same time.

The touch electrode substrate manufacturing method of the present invention manufactures a flexible and curved substrate having metal wiring of a wiring pattern based on the size of the substrate to be produced and a predetermined wiring pattern. When one complete manufacturing process is completed, a substrate having a plurality of wiring patterns of metal wiring is manufactured. In addition, a manufacturer who purchased the touch electrode substrate of the present invention can perform a connection wiring processing process on the second region on at least one side surface of the peripheral edge of the metal wiring on the substrate. When the connection wiring is processed, the metal wiring in the first region is etched into a strip-like or grid-like disconnection structure corresponding to the position of the connection wiring to be processed. As a result, the touch electrode substrate of the present invention does not restrict the corresponding positions connected to other circuit boards, other connection wirings, or chips in the touch electronic product, thereby expanding the application range to the touch electronic product. it can.

The above-described embodiments are for explaining the present invention, and are not intended to limit the present invention. Claims and specifications of utility model registration claims of the present invention by those skilled in the art are within the scope of the present invention. Any changes and modifications based on the document are included in the claims of the utility model registration of the present invention.

DESCRIPTION OF SYMBOLS 1 Touch electrode board | substrate 2 Board | substrate layer 21 Upper surface 22 Lower surface 3 Conductive layer 4 1st area | region 41 Metal wiring block 42 Metal wiring 43 Grid 44 Conductive electrode 441 Adhesive layer 442 Metal conductive electrode layer 45 1st weathering layer 5 2nd area | region 51 Second weathering layer 52 Connection wiring 521 X-axis direction 522 Y-axis direction

Claims (8)

A substrate layer, and a conductive layer formed on the surface of the substrate layer,
The conductive layer includes a first region and a second region adjacent to the first region, and at least one metal wiring block is provided in the first region, and the metal wiring block includes: A structure of a touch electrode substrate having a metal wiring on which a wiring pattern is formed.   The structure of the touch electrode substrate according to claim 1, wherein the metal wiring blocks are arranged with a space therebetween.   The touch according to claim 1, wherein a first weathering layer is provided on a surface of the metal wiring in the first region, and a second weathering layer is provided on an upper surface of the second region. The structure of the electrode substrate.   The structure of the touch electrode substrate according to claim 1, wherein a width of the metal wiring is 0.5 μm to 10 μm.   The structure of the touch electrode substrate according to claim 3, wherein the first weather resistant layer has a gate-shaped structure.   The structure of the touch electrode substrate according to claim 1, wherein the metal wiring exhibits a grid.   The structure of the touch electrode substrate according to claim 1, wherein the second region has a planar block structure.   The structure of the touch electrode substrate according to claim 1, wherein the second region further includes a connection wiring having a wiring pattern and capable of being conductively connected to the metal wiring in the first region.

Images