JP3195463B2 - Oxide dispersion strengthened platinum or platinum-rhodium alloy - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to platinum or a platinum-rhodium alloy used in the glass industry, etc. and a method for producing the same, and more particularly, to an excellent high-temperature creep characteristic used in a glass melting apparatus used at a high temperature. The present invention also relates to a material having elongation and a method for producing the same.

[0002]

2. Description of the Related Art Conventionally, Th, Z
Oxide dispersion strengthened platinum and a platinum alloy in which oxides such as r, Y, Hf, Ti, and Al are dispersed have been used, but their creep strength at high temperatures is not necessarily sufficient, and the dispersion is not uniform. There were many. And those materials had remarkably small elongation at the time of creep rupture.

[0003]

An object of the present invention is to provide a novel material which is superior in the high-temperature creep characteristics, has an elongation and is stable in comparison with the conventional oxide dispersion strengthened platinum or platinum alloy.

[0004]

According to the present invention, in order to solve the above problems , a high
Oxide dispersion used in glass melting equipment used at high temperatures
In a reinforced platinum or platinum-rhodium alloy, 0.05 to
2 wt % Sm oxide is platinum or platinum-rhodium alloy
Dispersed inside and has excellent high-temperature creep properties.
The feature was adopted.

[0005]

According to the oxide dispersion-strengthened platinum or platinum-rhodium alloy of the present invention constituted as described above, the oxide of Sm is stably dispersed in the platinum or platinum-rhodium alloy, so that the conventional method can be used. The aspect ratio of the crystal was kept high by preventing the movement of dislocations more stably than the oxides of Zr, Y, and the like, and also by the oxide being unevenly distributed in the grain boundaries and in the grains of the crystal and further in the form of a layer. By doing so, the creep strength at high temperatures is strongly stabilized, and the material has excellent and stable creep characteristics at high temperatures. In particular oxides of Sm is valid 0.05～2Wt%, is less than 0.05 wt%, its effect is insufficient, and more than 2 wt% and the processing becomes difficult, when the process is Kasami particularly optical glass melting There is a concern that the glass may be contaminated by dissolution. In addition, not only platinum, but also platinum-rhodium alloy, platinum-gold alloy, platinum-palladium alloy, platinum-palladium-rhodium alloy, platinum-rhodium-gold alloy, and other platinum alloys that can achieve the same function and effect can be obtained. It is. In addition, the oxide dispersion strengthening means that the oxide is uniformly dispersed in platinum or a platinum alloy, or there is a case where the oxide is unevenly distributed in a crystal grain boundary or in a grain, and is further unevenly distributed in a layer shape. Cases are included.

[0006]

Embodiments and conventional examples will be described below. First, as Example 1, Pt (platinum) and Sm (samarium )
Arm) was dissolved cast, to give a PtSm0.3Wt% of the alloy body. This is melt-sprayed by the atomizing method and quenched in water,
A powder having a particle size of 0.01 to 0.2 mm was prepared. Thereafter, the powder was placed in the atmosphere (oxygen partial pressure 0.2 atm), temperature 1250 ° C,
After oxidizing Sm in the PtSm alloy at time 24H,
The powder is compressed by a press under a load of 60 to 90 kgw / mm ² , and subjected to a sintering heat treatment at a temperature of 1250 ° C. for 1 hour, and the above-described compression and sintering heat treatment is repeated again.
Hot forging was performed at 50 ° C., and then cold-rolled, and a 1-mm-thick test piece was collected from platinum in which Sm oxide was dispersed. Next, as Example 2, Pt, Rh (rhodium) and Sm were melted and cast to obtain an alloy body of 10 wt% PtRh and 0.3 wt% of Sm. Then, processing is performed in the same process as in Example 1,
A 1 mm-thick test piece was sampled from a PtRh alloy in which Sm oxide was dispersed. Further, as Example 3, Pt and Sm were melted and cast to obtain an alloy body of 0.3 wt% of PtSm.
Thereafter, it was rolled to obtain a plate material having a plate thickness of 0.1 mm. Next, after cutting into a length of 40 mm and a width of 30 mm, the temperature was reduced to 1 in air.
After oxidizing Sm in the PtSm alloy at 250 ° C. for 24 hours, it was compressed with a press at a load of 50 to 80 kgw / mm ² , then subjected to a sintering heat treatment at a temperature of 1250 ° C. for 1 hour, and then compressed again. , Sintering heat treatment is repeated, then hot forging at a temperature of 1250 ° C., then cold rolling,
A test piece having a plate thickness of 1 mm was collected from platinum in which m oxides were dispersed. On the other hand, as Conventional Example 1, Pt and Zr ( zirconium
Beam) dissolved, and cast to obtain a PtZr0.3Wt% of the alloy body. Thereafter, in the same process as in Example 1, a test piece having a thickness of 1 mm was sampled from platinum in which Zr oxide was dispersed. Further, as Conventional Example 2, Pt and Y (yttrium) were melted and cast to obtain an alloy body of 0.3 wt% PtY. Later example
In the same process as in Step 3 , plate thickness of 1 m
m test pieces were collected. However, the evaluation results for the rupture time at a temperature of 1400 ° C. and a load of 1.5 kgw / mm ² are shown below.

[0007]

[Table 1]

[0008]

As described above, according to the oxide dispersion-strengthened platinum or platinum-rhodium alloy of the present invention, Sm oxide is stably dispersed in platinum or a platinum-rhodium alloy, so that the transfer of transition can be prevented. An excellent and elongate material having strong and stable creep strength at a high temperature can be obtained.

Continuation of the front page (51) Int.Cl. ⁷ Identification symbol FI C22C 1/04 C22C 1/04 E // C22C 1/10 1/10 B 32/00 32/00 Z (56) References JP-A-3 -188231 (JP, A) Japanese Patent Publication No. 29-2604 (JP, B1) He, Huachun; Hu, Changyi; Guo Jinxin; Itt of Platinum, "Guijinshu (1991) 12 (2) 19-24 Okada, Goto," Platinum family and industrial use. " 222 Sangyo Tosho Co., Ltd. Published on December 20, 1956 (58) Field surveyed (Int.Cl. ⁷ , DB name) C22C 1/04-1/10 C22C 5/04 B22F 1/00-9/30

Claims (1)

(57) [Claims] 1. An oxide dispersion-strengthened platinum or platinum-rhodium alloy used in a glass melting apparatus used at a high temperature, wherein 0.05 to 2 wt% of Sm oxide is platinum or platinum-rhodium .
Oxide dispersion-strengthened platinum or platinum- alloy characterized by having excellent high-temperature creep characteristics dispersed in a lithium alloy .
Indium alloy.