JP3195169B2 - Operation switch device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an operation switch device used for a VTR or the like, and more particularly, to an operation body for moving a movable contact to and away from a fixed contact, a switch wafer having a drawing pattern, and The present invention relates to an operation switch device including a switch terminal group led out of the switch wafer.

[0002]

2. Description of the Related Art FIGS. 25 and 26 illustrate a conventional example of this type of operation switch device. FIG. 25 is a side view showing a state in which the operation switch device is directly mounted on a printed circuit board, and FIG. FIG. 26 is a side view showing a state in which the operation switch device of FIG. 25 is mounted on a printed circuit board via a spacer.

The operation switch device 10 shown in these figures
Reference numeral 1 denotes a driving body 1 for driving a plurality of movable contacts (not shown).
02, a switch wafer 103 rotatably supporting the driving body 102, an operation body 104 for rotating the driving body 102, and a switch terminal group 105 led out from the switch wafer 103. I have. The switch wafer 103 has the switch terminal group 105
And a plurality of fixed contacts (not shown) are electrically connected to each other. When the operator rotates the operating body 104 with his / her finger, the movable contact rotates and drives on the switch wafer 103 via the driving body 102, so that the movable contact comes into contact with and separates from the fixed contact, and as a result, A signal is routed from the fixed contact and output via the switch terminal group 105.

The operation switch device 101 thus configured is used by being incorporated in various devices such as a VTR. At this time, the operation body 104 and a printed circuit board on which the operation switch device 101 is mounted are used. Is not necessarily constant depending on the specifications of the device into which the operation switch device 101 is incorporated. Therefore, when the distance is short, as shown in FIG.
Is directly mounted on the printed circuit board 106, and the tip of the switch terminal group 105 is inserted into the printed board 106, and then the tip of the switch terminal group 105 is soldered to a pattern (not shown) provided on the back surface of the printed board 106. It was connected by 107. On the other hand, when the distance is long, as shown in FIG. 26, a spacer 108 having a predetermined height is interposed between the switch wafer 103 and the surface of the printed board 106, and the connector 109 is soldered to the printed board 106. By inserting the tip of the switch terminal group 105 into the connector 109, the switch terminal group 105 is connected to the pattern on the printed circuit board 106 via the connector 109.

[0005]

In the above-described conventional operation switch device 101, a switch terminal group 105 having a fixed length and relatively high rigidity is led out from the switch wafer 103. Therefore, the relative position between the switch terminal group 105 and the printed circuit board 106 is uniquely determined by the length of the switch terminal group 105, and the lower surface of the operation switch device 101 is located at a position away from the surface of the printed circuit board 106. In the case of installation, a complicated operation of preparing spacers 108 and connectors 109 having different height dimensions each time and fixing these spacers 108 and connectors 109 on the printed circuit board 106 was required. Further, since the relative position between the switch terminal group 105 and the printed circuit board 106 is regulated not only in the height direction (up and down direction) but also in the horizontal direction (left and right direction), the operation switch device 101 is attached to the printed circuit board 106. There was a concern that the switch terminal group 105 would be subjected to an unreasonable load even if the degree of freedom of position was small and the mounting position of the operation switch device 101 was slightly shifted.

The present invention has been made in view of such circumstances in the prior art, and has as its object not only easy mounting on a printed circuit board, but also a load applied to a switch terminal group due to a shift in the mounting position. SUMMARY OF THE INVENTION An object of the present invention is to provide an operation switch device that can prevent such a problem.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a plurality of fixed contacts, a plurality of movable contacts respectively corresponding to the fixed contacts, and a method for moving the movable contacts to and from the fixed contacts. A switch wafer having a routing pattern connected to the fixed contact, and a switch terminal group led out of the switch wafer and connected to the routing pattern. The most main feature of the switch device is to provide a bendable flexible terminal group at the tip of the switch terminal group.

[0008]

A flexible terminal group is provided at the end of the switch terminal group so that the flexible terminal group can be bent in a desired direction when the operation switch device is mounted on a printed circuit board. A large degree of freedom is obtained in the horizontal and horizontal directions, and the operation switch device can be easily mounted on a printed circuit board. Further, since the switch terminal group is mounted on the printed circuit board via the bendable flexible terminal group, even if the mounting position of the operation switch device is slightly shifted, the shift is absorbed by bending the flexible terminal group. In addition, no excessive load is applied to the switch terminal group.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of an operation switch device according to an embodiment of the present invention, FIG. 2 is a side view showing a state where an operation body is removed from the operation switch device of FIG. 1, and FIG. 3 is an operation switch of FIG. FIG. 4 is a plan view showing a state where an operation body is removed from the operation switch of FIG. 3, FIG. 5 is a cross-sectional view showing an enlarged part A of FIG. 2, and FIG. FIG. 7 is a diagram illustrating a process of attaching a flexible terminal group to a switch terminal group provided in the switch device. FIG. 7 is a front view showing a state where the flexible terminal group is attached. FIG. FIG. 9 is a cross-sectional view of the caulked portion in FIG. 8 as viewed from the direction indicated by B.

The operation switch device 1 according to this embodiment is different from the conventional operation switch device 101 shown in FIGS. 25 and 26 in that the switch terminal group 2 has a bendable flexible terminal group 3 at its tip. Together with
A synthetic resin holder 5 is provided on the lower surface of the switch wafer 4.
And the other configuration is basically the same. The flexible terminal group 3 has a thickness of, for example, 0.3 mm.
It is made of a pressed material such as brass or phosphor bronze having a thickness of about 15 to 0.8 mm, and has, at one end, caulking portions 6 which are alternately arranged adjacent to each other as shown in FIG. Then, by swaging the swaging portion 6 in a state where the switch terminal group 2 is engaged with the swaging portion 6, the flexible terminal group 3 is connected to the switch terminal group 2. Further, a resin mold member 7 is integrally formed at the tip of the flexible terminal group 3 so that the flexible terminal group 3 is kept aligned by the resin mold member 7. Below the resin mold member 7, as shown in FIG.
A protruding portion 8 is formed to cover the outer periphery of the distal end of the flexible terminal group 3.
Can be inserted into

The holder 5 has a holder body 11 interposed between the switch wafer 4 and the printed circuit board 9.
And a holding portion 12 mounted on the upper surface of the printed circuit board 9 and to which the resin mold member 7 is attached, and the like. The upper surface of the holder body 11 extends in the lower surface direction of the switch wafer 4. Multiple height regulating projections 1
3, a pair of locking pieces 14 having elasticity and having their tips locked on the upper surface side of the switch wafer 4, and positioning projections 15 inserted through the switch wafer 4 are provided. Also, the cradle 1 of the holder body 11
A positioning projection 16 inserted into 6a is provided. A plurality of height regulating projections 17 extending in the upper surface direction of the printed circuit board 9 are provided on the lower surface side of the holder main body 11, and a pair of locking pieces having elasticity and having their tips locked on the lower surface side of the printed circuit board 9. 18 and a pair of positioning projections 19 inserted into the printed circuit board 9 are provided.

A plurality of fixed contacts (not shown) and a wiring pattern for electrically connecting the fixed contacts and the switch terminal group 2 are provided on the inner bottom portion 4a of the switch wafer 4, and the fixed contacts are A corresponding plurality of movable contacts (not shown) are provided on the annular driving body 21.
The driving body 21 is rotatable about a central axis 4 b projecting upward from the inner bottom 4 a of the switch wafer 4. A disk-shaped lid 22 that covers the protruding portion is attached. Further, the driving body 21
, A pair of push switches 23 is provided.

A hollow operating body 24 is fitted around the upper periphery of the driving body 21, and inside the operating body 24,
Another operating body 25 capable of pressing one of the push switches 23 is inserted, and the operating body 25 is supported by the center shaft 4b so as to be tiltable.

In the operation switch device 1 configured as described above, when the flexible terminal group 3 is provided at the tip of the switch terminal group 2, first, as shown in FIG. After the derived switch terminal group 2 is bent downward at right angles, as shown in FIG.
The flexible terminal group 3 integrally formed with the resin mold member 7 in advance is connected to the tip of the switch terminal group 2. The caulked portion 6 of the flexible terminal group 3 is initially formed in a plate shape as shown by a broken line in FIG. 9, and in this state, the tip of the switch terminal group 2 is brought into contact with the caulked portion 6,
Next, the central portion of the caulking portion 6 is cut into the surface of the switch terminal group 2, and both side ends of the caulking portion 6 are bent at a right angle to the switch terminal group 2 side, and further, until they contact the rear surface side of the switch terminal group 2. The both ends of the caulked portion 6 are bent.

Next, a holder 5 is placed on the switch wafer 4.
When mounting, the holder 5 is arranged on the lower surface side of the switch wafer 4, and the holder 5 is pushed in the direction of the switch wafer 4, so that the tip of the locking piece 14 slides on the side of the switch wafer 4, and The locking piece 14 is elastically deformed. In this state, the positioning projections 15 on the holder main body 11 side are inserted into the switch wafer 4 and the positioning projections 16 on the switch wafer 4 side are inserted through the receiving table 16a of the holder main body 11, whereby the holder 5
Positioning is performed. Next, by further pushing the holder 5 in the direction of the switch wafer 4, the tip of the height regulating projection 13 contacts the lower surface of the switch wafer 4, and the tip of the locking piece 14 engages with the upper surface of the switch wafer 4. Is stopped. Further, the flexible terminal group 3 is moved from the flat state shown in FIG.
The resin mold member 7 is bent at a desired position, and the resin mold member 7 is attached to the holding portion 12 of the holder 5.

Next, when mounting the operation switch device 1 on the printed circuit board 9, the height regulating protrusion 17 extending from the lower surface side of the holder main body 11 and the holding portion 1 on the printed circuit board 9.
2 is placed, and the positioning projection 19 is inserted into the positioning hole of the printed circuit board 9 to thereby operate the operation switch device 1.
And the leading end of the locking piece 18 is inserted into the locking hole of the printed circuit board 9 and locked on the lower surface side of the printed circuit board 9. Also, a projecting portion 8 projecting from the lower side of the resin mold member 7 is inserted into the through hole 10 of the printed circuit board 9,
With the tip of the flexible terminal group 3 protruding downward from the lower surface side of the printed circuit board 9, the flexible terminal group 3
Is soldered to a pattern (not shown) on the printed circuit board 9. Further, the operating body 24 is fitted on the outer periphery of the upper part of the driving body 21, and another operating body 25 inserted inside the operating body 24.
Is tiltably supported by the central shaft 4b.

As described above, in the above embodiment, by bending the flexible terminal group 3 provided at the tip of the switch terminal group 2 in a desired direction, a large degree of freedom in the vertical and horizontal directions can be obtained. Therefore, the operation switch device 1 can be easily attached to the printed circuit board 9. In addition, since the switch terminal group 2 is attached to the printed circuit board 9 via the bendable flexible terminal group 3, even if the operation switch device 1 is slightly misaligned, the misalignment is not affected by the flexible terminal group 3. It is absorbed by the bending, so that an unnecessary load is not applied to the switch terminal group 2.

In the above embodiment, the operation switch device 1 is fixed to the printed circuit board 9 by inserting the tip of the locking piece 18 into the locking hole of the printed circuit board 9 and locking the lower end thereof. This also makes the operation of mounting the operation switch device 1 easy. Furthermore, since the operation switch device 1 can be easily attached, as compared with a conventional device in which the operation switch device 1 is attached to a printed circuit board via a connector or a spacer, the operation cost can be reduced.

Further, in the above embodiment, the state in which the tips of the flexible terminal group 3 are aligned is held by the resin mold member 7, so that the strength of the flexible terminal group 3 is improved, and the flexible terminal group 3 is not deformed by external force or the like. To finish,
A short circuit accident of the flexible terminal group 3 can be reliably prevented. Further, the tip of the flexible terminal group 3 is reinforced by the protruding portion 8 of the resin mold member 7, and the tip of the flexible terminal group 3 is maintained in a predetermined shape without being deformed by external force or the like. 9 can be inserted into the through hole 10.

Further, in the above embodiment, the height dimension of the height regulating projection and the locking piece projecting from the upper surface side of the holder main body 11 are set in accordance with the mounting height of the switch wafer 4 with respect to the printed circuit board 9. Thereby, it can be used for various kinds of VTR devices having different specification dimensions. Therefore, it is not necessary to change the basic configuration of the switch wafer 4 and the like, and it is possible to cope with various devices such as a VTR by changing only the holder 5, so that the inexpensive and versatile operation switch device 1 is obtained. Can be

FIG. 10 is a cross-sectional view of an operation switch device having a modified example of the holder and the flexible terminal group.
1 is a side view showing a state where an operation body is removed from the operation switch device of FIG. 10, FIG. 12 is a front view showing a state before mounting a holder provided in the operation switch device of FIG. 10, and FIG. FIG. 9 is a side view showing a state before mounting, and in these figures, the same components as those shown in FIGS. 1 to 9 described above are denoted by the same reference numerals.

The difference between the holder 31 shown in FIG. 10 and the holder 5 described above is that the height regulating projections 33, the locking pieces 34, the positioning projections 35 and the heights of the receiving base 36 projecting from the upper surface side of the holder main body 32. The height dimension is determined by the height regulating projection 13, the locking piece 14, and the positioning projection 1 described above.
5 and larger than the cradle 16a.
Other configurations are basically the same. 10 is different from the above-mentioned flexible terminal group 3 in that the length of the flexible terminal group 37 is set to be larger than that of the above-mentioned flexible terminal group 3 and the tip of the flexible terminal group 37 The structure is basically the same as that of the first and second embodiments in that resin mold members 38 and 39 for reinforcement are provided in each of the intermediate portions. In the operation switch device 1 shown in FIGS.
Although the flexible terminal group 37 longer than the above-mentioned flexible terminal group 3 was used, when the mounting height of the switch wafer 4 to the printed circuit board 9 is not so high, the above-described flexible terminal group is used instead of using the long flexible terminal group 37. 3 can be used without being bent.

FIG. 14 is a sectional view of an operation switch device according to another embodiment of the present invention, FIG. 15 is a side view showing a state in which an operation body is removed from the operation switch device of FIG.
FIG. 17 is a plan view of the operation switch device of FIG. 14, and FIG.
FIG. 18 is a plan view showing a state in which the operation body is removed from the operation switch device of FIG. 6, FIG. 18 is a diagram illustrating a process of forming a terminal group provided in the operation switch device of FIG. 14, and FIG. FIG. 20 is a view for explaining a step of mounting the illuminating wafer of FIG. 19 on a switch wafer, and FIG. 21 is a front view showing a state where the illuminating wafer is mounted on the switch wafer. FIG. 22 is a side view showing a state where the intermediate portion of the dummy terminal group led out of the illumination wafer of FIG. 21 is bent, and FIG. 23 is a view of the caulked portion of the dummy terminal group shown in FIG. Figure,
FIG. 24 is a sectional view of the swaged portion of FIG. In these figures, the same components as those shown in FIGS. 1 to 13 are denoted by the same reference numerals.

The operation switch device 41 of this embodiment is different from the operation switch device 1 shown in FIGS. 1 to 13 described above in that an illumination wafer 43 having four LEDs 42 is provided on the switch wafer 4. It is mounted, and a translucent body 45 through which the colored light emitted from the LED 42 passes is fitted into a part of the inner operation body 44, and the other configuration is basically the same. As shown in FIG. 18, four illuminating terminal groups 46, one common terminal 47 and eight dummy terminal groups 48 are integrally formed on the illuminating wafer 43, and these illuminating terminals are formed. A group 46, a common terminal 47, and a dummy terminal group 48 are led out from the illumination wafer 43 to the outside. The illuminating terminal group 46, the common terminal 47, and the dummy terminal group 48 have a thickness of, for example, 0.15 to 0.8 mm similarly to the above-described flexible terminal group 3.
It is formed in an aligned state from a pressed material such as brass or phosphor bronze having a small thickness. Furthermore, these terminal groups 46
48, a reinforcing resin mold member 49 is provided at another end of the resin mold member 49, and another reinforcing resin mold member 50 is provided at a predetermined position away from the resin mold member 49 by a predetermined distance. , 50 keep the terminal groups 46 to 48 aligned. Also, another reinforcing resin mold member 51 is provided at an intermediate portion of the illumination terminal group 46,
By the reinforcing resin mold member 51, the alignment state of the illumination terminal group 46 is more reliably maintained. In the intermediate portion of the dummy terminal group 48, caulking portions 52 which are alternately arranged adjacent to each other are formed.
When the switch terminal group 2 is engaged with the
The dummy terminal group 48 is connected to the switch terminal group 2 by caulking. In addition, the illumination wafer 43
Has a plurality of positioning projections 53 and a plurality of locking pieces 54 having elasticity and having their tips locked to the lower surface of the switch wafer 4.

In the operation switch device 41 configured as described above, the illumination wafer 43 is placed on the switch wafer 4.
At the time of mounting, as shown in FIG. 18, the illuminating terminal group 46 and the common terminal 4 are attached to the illuminating wafer 43 in advance.
7 and the dummy terminal group 48 are integrally formed, and the terminal groups 46 to 48 are provided with resin mold members 49 and 50, and then the terminal groups 46 to 48 are positioned at positions indicated by broken lines 61 in FIG.
Are disconnected, and the terminal group 4 is set at the position indicated by the broken line 62 in FIG.
Fold 6-48 at a right angle. Thus, the terminal groups 46 to
Reference numeral 48 changes from the flat state shown by the broken line in FIG. 19 to the bent state shown by the solid line in FIG. Next, as shown in FIG. 20, the positioning of the illuminating wafer 43 is performed by engaging the positioning projections 53 of the illuminating wafer 43 with predetermined positions of the switch wafer 4, and the illuminating wafer 43 is moved in the direction of the switch wafer 4. After the end of the locking piece 54 slides on the side of the switch wafer 4 and elastically deforms, the tip of the locking piece 54 is locked to the lower surface of the switch wafer 4. As a result, the illumination wafer 43 is fixed to the switch wafer 4. Then
The tip of the switch terminal group 2 is brought into contact with the swaged portion 52 of the dummy terminal group 48, and the center of the swaged portion 52 is cut into the surface of the switch terminal group 2 as shown in FIG.
Both side ends of the caulking portion 52 are bent at right angles to the switch terminal group 2 side, and both side ends of the caulking portion 52 are further bent until they come into contact with the back surface side of the switch terminal group 2 as shown in FIG.

As described above, in the above embodiment, the illumination terminal group 46, the common terminal 47, and the switch terminal group 2
By bending the dummy terminal group 48 connected to the leading end of the device in a desired direction, a large degree of freedom is obtained in the vertical and horizontal directions, so that the operation switch device 41 can be easily attached to the printed circuit board 9. . Further, since the operation switch device 41 is attached to the printed circuit board 9 via the foldable illumination terminal group 46, the common terminal 47, and the dummy terminal group 48, it is assumed that the operation switch device 41 is slightly displaced. Also, since the terminal groups 46 to 48 are bent, an unnecessary load is not applied to the switch terminal group 2.

In the above embodiment, the illumination wafer 43 can be fixed to the switch wafer 4 by locking the tip of the locking piece 54 to the lower surface of the switch wafer 4. Easy to install. Further, an illumination terminal group 46 and a common terminal 47 derived from the illumination wafer 43 and a switch wafer 4
The dummy terminal group 48 connected to the switch terminal group 2 derived from the above is arranged in the vicinity, so that these terminal groups 46 to 4
It is easy to form a wiring pattern for connecting 8 on the printed circuit board 9.

In the above embodiment, the illumination terminal group 46 is used.
The resin mold members 49 and 50 hold a state in which the common terminals 47 and the dummy terminal group 48
By improving the strength of the terminal groups 46 to 48, deformation or short circuit accident due to external force or the like can be prevented. Further, the terminal group for illumination 4
6 is reinforced by the resin mold member 51, and from this point as well, deformation and short circuit of the illuminating terminal group 46 due to external force can be prevented more reliably. Furthermore, since the caulking portion 52 located in the middle of the dummy terminal group 48 is connected to the switch terminal group 2, the middle portion of the dummy terminal group 48 can be prevented from being deformed or short-circuited due to external force or the like.

[0029]

As described above, according to the present invention,
By bending the flexible terminal group provided at the tip of the switch terminal group in a desired direction, a large degree of freedom is obtained in the vertical and horizontal directions, so that the operation switch device can be easily mounted on the printed circuit board, Work efficiency can be improved. Further, even if the mounting position of the operation switch device is slightly displaced, the dislocation is absorbed by bending the flexible terminal group, so that an unnecessary load is not applied to the switch terminal group. The damage of the group can be prevented.

[Brief description of the drawings]

FIG. 1 is a sectional view of an operation switch device according to an embodiment of the present invention.

FIG. 2 is a side view showing a state where an operation body is removed from the operation switch device of FIG. 1;

FIG. 3 is a plan view of the operation switch device of FIG. 1;

FIG. 4 is a plan view showing a state where an operation body is removed from the operation switch device of FIG. 3;

FIG. 5 is an enlarged sectional view showing a portion A in FIG. 2;

FIG. 6 is a view illustrating a process of attaching a flexible terminal group to a switch terminal group provided in the operation switch device of FIG. 1;

FIG. 7 is a front view showing a state where the flexible terminal group is attached.

FIG. 8 is a view of the swaged portion of the switch terminal group of FIG.

FIG. 9 is a cross-sectional view of a caulked portion of FIG.

FIG. 10 is a cross-sectional view of an operation switch device including a modified example of a holder and a flexible terminal group.

FIG. 11 is a side view showing a state where an operation body is removed from the operation switch device of FIG. 10;

FIG. 12 is a front view showing a state before a holder provided in the operation switch device of FIG. 10 is mounted;

FIG. 13 is a side view showing a state before the holder is attached.

FIG. 14 is a sectional view of an operation switch device according to another embodiment of the present invention.

FIG. 15 is a side view showing a state where an operation body is removed from the operation switch device of FIG. 14;

FIG. 16 is a plan view of the operation switch device of FIG. 14;

FIG. 17 is a plan view showing a state in which an operation body is removed from the operation switch device of FIG. 16;

FIG. 18 is a view illustrating a process of forming an illumination wafer and a terminal group provided in the operation switch device of FIG. 14;

FIG. 19 is a view illustrating a step of bending the terminal group of FIG. 18;

20 is a view illustrating a step of mounting the illumination wafer of FIG. 19 on a switch wafer.

FIG. 21 is a front view showing a state in which the illumination wafer is mounted on a switch wafer.

22 is a side view showing a state where an intermediate portion of a dummy terminal group derived from the illumination wafer of FIG. 21 is bent.

FIG. 23 is a view of the caulked portion of the dummy terminal group in FIG.

FIG. 24 is a cross-sectional view of the caulked portion of FIG.

FIG. 25 is a side view showing a state in which a conventional operation switch device is directly mounted on a printed circuit board.

26 is a side view showing a state in which the operation switch device of FIG. 25 is mounted on a printed circuit board via a spacer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Operation switch apparatus 2 Switch terminal group 3 Flexible terminal group 4 Switch wafer 5 Holder 7 Resin mold member 8 Projection part 9 Printed circuit board 11 Holder body 12 Holding part 13 Height regulation projection 14 Locking piece 15, 16 Positioning projection 16a Receiving stand 17 Height regulating projection 18 Locking piece 19 Positioning projection 23 Push switch 24, 25 Operating body 31 Holder 33 Height regulating projection 34 Locking piece 35 Positioning projection 36 Receiving stand 37 Flexible terminal group 38, Reference Signs List 39 resin molding member 41 operation switch device 42 LED 43 illumination wafer 46 illumination terminal group 48 dummy terminal group 49 to 51 resin molding member

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-8-17278 (JP, A) JP-A-6-260047 (JP, A) JP-A-7-65921 (JP, A) JP-A-4- 95319 (JP, A) JP-A-4-92324 (JP, A) JP-A-2-98420 (JP, U) JP-A-6-31289 (JP, U) JP-A-6-31050 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01H 9/00-9/28 H01H 23/02

Claims (3)

(57) [Claims] 1. A plurality of fixed contacts, a plurality of movable contacts respectively corresponding to the fixed contacts, an operating body for bringing the movable contacts into and out of contact with the fixed contacts, and a routing connected to the fixed contacts An operation switch device comprising a switch wafer having a pattern, and a switch terminal group led out of the switch wafer and connected to the routing pattern, wherein a flexible bendable tip of the switch terminal group is provided. An operation switch device comprising a terminal group. 2. The operation switch device according to claim 1, wherein a resin mold member for maintaining a state in which the flexible terminal group is aligned is formed at a tip of the flexible terminal group. 3. The operation switch device according to claim 1, wherein the flexible terminal group is made of a pressed material containing at least one of brass and phosphor bronze.