JP3189455B2 - Comparison method of semiconductor manufacturing conditions - Google Patents
Comparison method of semiconductor manufacturing conditionsInfo
- Publication number
- JP3189455B2 JP3189455B2 JP00976993A JP976993A JP3189455B2 JP 3189455 B2 JP3189455 B2 JP 3189455B2 JP 00976993 A JP00976993 A JP 00976993A JP 976993 A JP976993 A JP 976993A JP 3189455 B2 JP3189455 B2 JP 3189455B2
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- code
- conditions
- equipment
- standard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は多品種半導体の製造プロ
セス仕様を管理し比較する場合の支援方法に関する。特
に多品種少量のＬＳＩ製造プロセス仕様の設計や製造ラ
インでの作業において、任意に選択したロット、基準プ
ロセス、品種単位の製造工程フロ−及び製造条件を容易
に検索し、効率良く比較する方法に関連する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support method for managing and comparing the specifications of manufacturing processes for a wide variety of semiconductors. Especially in the design of LSI manufacturing process specifications for small lots of various products and work on the production line, it is easy to search for the arbitrarily selected lot, reference process, manufacturing process flow and manufacturing conditions for each product type, and to compare them efficiently. Related.
【０００２】[0002]
【従来の技術】多品種少量の半導体生産においてはプロ
セスフロ−や設備条件、検査仕様、ホトマスク仕様等の
製造プロセス条件は、計算機システムによる作成管理も
しくは人手管理のいずれかの方式で管理されてきた。し
かし計算機管理の場合は、特開昭63-200520や特開昭63-
280411の記載例のように半導体プロセスフロ−の作成や
製造条件の登録、変更上の報告はされているが、それら
の相違点抽出を狙った検索比較方式については言及され
ていなかった。一方紙をベ−スとした人手管理方式で
は、(1)工程名称や製造条件のタイトル名称等が必ずし
も標準化されていないため、目的とする既存の管理情報
がスム−ズに検索できない、(2)また検索できても定義
内容や記述範囲、まとめ方等が設計者に依存して必ずし
も一定ではないため理解できない、(3)それ故任意に選
択したロット、基準プロセス、品種単位の製造工程フロ
−や製造条件をスム−ズに比較できない、等の問題があ
った。したがって半導体製造プロセス仕様の標準化、共
通化を図りながら、計算機システム上で管理し効率的な
検索比較を行うための方式が必要になっている。2. Description of the Related Art In the production of semiconductors of various types and in small quantities, manufacturing process conditions such as process flows, equipment conditions, inspection specifications, photomask specifications, etc., have been managed by either computer system creation management or manual management. . However, in the case of computer management, JP-A-63-200520 and JP-A-63-200520
Although there are reports on the creation of semiconductor process flows, registration of manufacturing conditions, and changes, as in the description example of 280411, there is no mention of a search / comparison method aimed at extracting those differences. On the other hand, in the paper-based manual management method, (1) since the process names and the titles of the manufacturing conditions are not always standardized, the existing existing management information cannot be smoothly searched; In addition, even if a search can be performed, the definition content, description range, method of summarization, etc. are not necessarily constant depending on the designer and cannot be understood. (3) Therefore, the manufacturing process flow for each lot, reference process, and product type selected -And the production conditions cannot be compared smoothly. Therefore, there is a need for a system for managing and efficiently performing search and comparison on a computer system while standardizing and standardizing the semiconductor manufacturing process specifications.
【０００３】[0003]
【発明が解決しようとする課題】ＬＳＩの製造プロセス
は近年の高集積化、微細化に伴って複雑、長大なものに
なっている一方で少量多品種化を抱え、益々製造プロセ
スの設計並びにラインでの製造に作業効率向上が強く求
められるようになった。特に紙をベ−スとした半導体製
造条件の人手管理方式には、関係付け管理方式の標準
化、共通化の不足により前述したような問題点が顕在化
してきた。The LSI manufacturing process has become complicated and long with high integration and miniaturization in recent years. There has been a strong demand for improved work efficiency in manufacturing in the United States. In particular, in the manual management system of semiconductor manufacturing conditions based on paper, the above-mentioned problems have become apparent due to the lack of standardization and commonality of the association management system.
【０００４】したがって本発明の目的は、半導体製造に
おけるプロセスフロ−や設備条件、検査仕様、ホトマス
ク仕様等の各種製造プロセス条件に管理方式、関係付け
の標準化を狙いとするデ−タＩＤを設定することによ
り、有機的な管理と多数の人間が製造条件を効率良く検
索でき、容易に比較できる支援方法を提供するものであ
る。Accordingly, an object of the present invention is to set a data ID aiming at standardization of a management method and a relation to various manufacturing process conditions such as a process flow, equipment conditions, inspection specifications, and photomask specifications in semiconductor manufacturing. This provides an organic management method and a support method that enables many people to efficiently search for manufacturing conditions and easily compare them.
【０００５】[0005]
【課題を解決するための手段】上記目的は以下の方法に
より達成される。図１に半導体の製造プロセス条件を製
造工程、各工程での製造規格(プロセス設計上から設定
されている加工材料、寸法、形状、特性、許容範囲等と
対応する製造上の工程仕様)、該製造規格の設備対応条
件に分類し、それらをホトリソ工程やエッチング工程、
ＣＶＤ工程等の各要素プロセスグル−プの主要工程、作
業工程、製造設備単位の製造プロセス条件に関係付け
し、そしてロット、基準プロセス、品種単位の製造工程
フロ−や製造条件に対応付けて、計算機システム上で蓄
積管理する場合の本発明の基本概念を示す。The above object is achieved by the following method. FIG. 1 shows the manufacturing process conditions of the semiconductor, the manufacturing process, the manufacturing standard in each process (processing process specification corresponding to the processing material, dimensions, shape, characteristics, allowable range, etc. set from the process design), It is classified into the equipment corresponding to the manufacturing standard,
Correlate with the main process of each element process group such as CVD process, work process, manufacturing process condition of each manufacturing equipment, and correlate with manufacturing process flow and manufacturing condition of lot, reference process, product type, The basic concept of the present invention when storing and managing on a computer system will be described.
【０００６】図１に示すように、本発明では製造プロセ
ス条件をＸ軸（ロット、基準プロセス、品種等を表す
軸）、Ｙ軸（製造工程フロ−、要素プロセスグル−プの
主要工程、作業工程等を表す軸）そしてＺ軸(製造設備
を表す軸)で結び付けた立体的なデ−タ構造に関係付け
て表現する。すなわちＸ軸及びＹ軸で囲まれる面10に
は、例えば任意品種の或る製造工程におけるその製造規
格と対応する工程仕様を定義すると共に、該製造規格の
加工処理が実現できる製造設備のリストを位置付けるも
のである。そしてそのＺ軸方向には、該製造規格を満た
す複数設備（ここでは３台あり)それぞれの設備製造条
件11、12、13を関連付けて定義するものである。このよ
うに本発明は、半導体の各種製造プロセス条件を図１の
立体的なデ−タ構造に沿った概念で関係付けし蓄積管理
することを基本とする。As shown in FIG. 1, in the present invention, the manufacturing process conditions are represented by an X-axis (axis representing a lot, a reference process, a product type, etc.), a Y-axis (manufacturing process flow, a main process of an element process group, and an operation). It is expressed in relation to a three-dimensional data structure connected by an axis representing a process or the like) and a Z axis (an axis representing a manufacturing facility). That is, on the surface 10 surrounded by the X axis and the Y axis, for example, a process specification corresponding to a manufacturing standard in a certain manufacturing process of an arbitrary product is defined, and a list of manufacturing equipment capable of realizing the processing of the manufacturing standard is provided. It is positioned. In the Z-axis direction, equipment manufacturing conditions 11, 12, and 13 of a plurality of equipment (here, three equipment) satisfying the manufacturing standard are defined in association with each other. As described above, the present invention is based on associating various kinds of semiconductor manufacturing process conditions with a concept according to the three-dimensional data structure of FIG.
【０００７】そこで図１のデ−タ構造に沿って各製造プ
ロセス条件を関係付ける場合のキ−とする請求項１の工
程コ−ド、規格コ−ド、設備条件コ−ドの設定方法につ
いて説明する。本発明では半導体の製造工程を各要素プ
ロセスグル−プ単位に、またそれら各要素グル−プ内の
主要工程単位に、さらにはその主要工程の中の各作業工
程単位に識別可能とするため、それらのデ−タＩＤとし
て各製造工程を階層的に分類したコ−ド（例えばＡ〜Ｚ
の英字数桁と０〜９の数字数桁の組合せ）を、該製造工
程の名称に対応付けた工程コ−ドとして採番付加する。Therefore, a method for setting process codes, standard codes, and equipment condition codes according to claim 1, which is a key for associating respective manufacturing process conditions along the data structure of FIG. explain. In the present invention, the semiconductor manufacturing process can be identified in each element process group unit, in each main process unit in each element group, and in each work process unit in the main process. Codes (for example, AZ) that hierarchically classify each manufacturing process as their data ID
(A combination of several digits of alphabetic characters and several digits of 0-9) is assigned as a process code corresponding to the name of the manufacturing process.
【０００８】次に各製造規格を各要素プロセスグル−プ
単位の中で識別可能とするため、本発明では該製造規格
のデ−タＩＤとして、先の工程コ−ドにおける要素プロ
セスグル−プの識別子と該要素グル−プ内の製造規格対
応に採番した番号とを組合せた規格コ−ド(英数字数桁
の組合せ)をそれぞれに設定する。Next, in order to make each manufacturing standard identifiable in each element process group unit, in the present invention, the element process group in the previous process code is used as the data ID of the manufacturing standard. And a standard code (a combination of several alphanumeric characters) combining the identifier of the element group and the number assigned to the manufacturing standard in the element group.
【０００９】また本発明では各設備の製造条件を先の製
造規格とを結び付けるため、それぞれのデ−タＩＤとし
て該規格コ−ドと各設備対応の番号とを組合わせた設備
条件コ−ド(英数字数桁の組合せ)を設定する。これによ
り一品一様式にて定義された各設備の具体的な製造条
件、レシピ等が該設備条件コ−ドに結び付けて管理でき
るようになる。Further, in the present invention, in order to link the manufacturing conditions of each equipment with the previous manufacturing standard, an equipment condition code in which the standard code and the number corresponding to each equipment are combined as each data ID. (Combination of several alphanumeric characters). As a result, specific manufacturing conditions, recipes, and the like of each facility defined in a one-by-one manner can be managed in association with the facility condition code.
【００１０】このように本発明では、半導体の製造工
程、各工程における製造規格そして設備条件のデ−タＩ
Ｄを上記方法で採番設定することにより、各製造プロセ
ス条件が要素プロセスグル−プ、主要工程、作業工程、
製造規格、製造設備の単位にそれぞれユニ−クに分類さ
れることになる。さらに本発明の工程コ−ド、規格コ−
ド、設備条件コ−ドをロットや基準プロセス、品種単位
の各製造工程フロ−並びに各製造条件に対応付けること
によって、各種製造条件の有機的な蓄積管理が可能にな
る。同時に本発明の該３種類のコ−ドを半導体製造プロ
セス条件のデ−タＩＤとしてあるいは検索比較キ−とし
て利用することにより、各種製造プロセス条件の効率的
な検索と比較を行うための改善が可能になる。As described above, according to the present invention, the data I of the semiconductor manufacturing process, the manufacturing standard and the equipment condition in each process are provided.
By setting the numbering of D in the above-described manner, each manufacturing process condition can be defined as an element process group, a main process, a work process,
Each unit is classified into a unique unit of manufacturing standard and manufacturing equipment. Further, the process code of the present invention and the standard code
By associating codes and equipment condition codes with lots, reference processes, each kind of manufacturing process flow and each kind of manufacturing condition, organic storage management of various kinds of manufacturing conditions becomes possible. At the same time, by using the three kinds of codes of the present invention as a data ID of a semiconductor manufacturing process condition or as a search / comparison key, an improvement for efficiently searching and comparing various manufacturing process conditions can be achieved. Will be possible.
【００１１】なお、上述した工程コ−ド、規格コ−ド、
設備条件コ−ドの採番設定は、対象とする半導体製造ラ
インやそこでの要素プロセスグル−プの区分単位、工程
名称の種類数、製造条件の量的な規模、製造設備の台数
等に応じてその識別と分類方式、コ−ド桁数等を決定す
る必要がある。The above process code, standard code,
The equipment condition code numbering is set according to the target semiconductor manufacturing line, the division unit of the element process group there, the number of types of process names, the quantitative scale of manufacturing conditions, the number of manufacturing equipment, etc. It is necessary to determine the identification and classification method, the number of code digits, and the like.
【００１２】[0012]
【作用】本発明ではＬＳＩの製造プロセス条件を、立体
的なデ−タ構造の概念に沿って取り扱いかつそれらに工
程コ−ド、規格コ−ド、設備条件コ−ドのデ−タＩＤを
付加し、さらに各デ−タＩＤをロットや基準プロセス、
品種単位の製造工程フロ−と製造条件に対応付け、計算
機システム上で蓄積管理を行う。According to the present invention, the LSI manufacturing process conditions are handled in accordance with the concept of a three-dimensional data structure, and the process codes, the standard codes, and the data IDs of the equipment condition codes are assigned to them. Each data ID is added to the lot, the reference process,
Accumulation management is performed on the computer system in association with the manufacturing process flow and manufacturing conditions for each product type.
【００１３】このため各種製造プロセス条件を検索する
場合、それらはロットや基準プロセス、品種に着目しな
がら、あるいは要素プロセスグル−プもしくは設備に着
目しながら該工程コ−ド、規格コ−ド、条件コ−ドをキ
−として多面的に効率良く検索できる。このことは例え
ば半導体製造ラインから仕掛り品の品種、工程、設備を
キ−として製造条件を問い合わせる場合も同様である。For this reason, when searching for various manufacturing process conditions, they are searched for the process code, the standard code, and the standard process while focusing on the lot, the reference process, and the product type, or focusing on the element process group or the equipment. The condition code can be used as a key for efficient multifaceted retrieval. This is the same when, for example, inquiring the manufacturing conditions from the semiconductor manufacturing line by using the kind, process, and equipment of the work-in-progress as keys.
【００１４】次にロットや基準プロセス、品種単位に任
意に選択した製造工程フロ−や製造条件を比較する場
合、本発明の工程コ−ド、規格コ−ド、設備条件コ−ド
を検索比較キ−としてまた突合せキ−として利用するこ
とにより、それらの相違点抽出が可能になる。Next, when comparing manufacturing process flows and manufacturing conditions arbitrarily selected for each lot, reference process, and product type, the process code, standard code, and equipment condition code of the present invention are searched and compared. By using the key as the key and the matching key, it is possible to extract those differences.
【００１５】[0015]
【実施例】以下本発明の実施例について以下に説明す
る。まず工程コ−ド、規格コ−ド、設備条件コ−ドのそ
れぞれの設定方法について、実施例から説明する。表１
に半導体ウエハ処理工程における本発明の要素プロセス
グル−プの分類例と、それらに対応する識別子の設定例
を示す。表１に示すように、本発明ではウエハ処理工程
をホトリソ工程やエッチング工程、ＣＶＤ工程等の各要
素プロセスに分類し、それぞれに識別子として表１に併
記した英字２桁のコ−ドを設定する。この表１に示す各
要素プロセスの識別子は、先の工程コ−ド、規格コ−
ド、設備条件コ−ドのそれぞれ全てに含めるもので、そ
れらの様子と各コ−ドの設定方法を表２に示す。表２に
示すように本発明の各コ−ドには全て該要素プロセスの
識別子が付加され、工程コ−ドにはさらに各要素プロセ
ス内の主要工程(酸化ならば表面酸化、ゲ−ト酸化、プ
レ酸化、層間の酸化工程等を表す)を分類した識別子Ｙ
Ｙ(例えばＡ〜Ｚ、０〜９の英字もしくは数字２桁の組
合せ)と、それら主要工程内のコント単位もしくは作業
ステップ単位の前処理、本処理、後処理に相当する作業
工程の識別子Ｚ(Ａ〜Ｚ、０〜９の英数字１桁)とが設定
される。また製造規格コ−ドには該要素プロセスの識別
子の他に各要素プロセス単位に製造規格を分類した番号
(０〜９の数字３桁)を組合せて設定する。一方設備条件
コ−ドは表２に示すように、該規格コ−ドにそれが実現
できる製造設備対応の識別子(０〜９の数字３桁)を付加
設定する。Embodiments of the present invention will be described below. First, the method of setting the process code, the standard code, and the equipment condition code will be described from the embodiment. Table 1
FIG. 9 shows an example of the classification of the element process groups of the present invention in the semiconductor wafer processing step and an example of setting the identifiers corresponding to them. As shown in Table 1, in the present invention, a wafer processing step is classified into each element process such as a photolithography step, an etching step, a CVD step, and the like, and a 2-digit code written in Table 1 is set as an identifier for each. . The identifiers of the respective element processes shown in Table 1 are based on the process code and the standard code.
Table 2 shows the status and the setting method of each code. As shown in Table 2, each code of the present invention has an identifier of the element process added thereto, and the step code further includes major steps (surface oxidation and gate oxidation in the case of oxidation) in each element process. , Pre-oxidation, interlayer oxidation step, etc.)
Y (for example, A to Z, a combination of alphabetic characters of 0 to 9 or two digits of numbers) and an identifier Z of a work process corresponding to a pre-process, a main process, and a post-process in a control unit or a work step unit in the main process. A to Z, 0 to 9 alphanumeric characters) are set. In addition, the manufacturing standard code includes, in addition to the identifier of the element process, a number that classifies the manufacturing standard for each element process unit.
(3 digits from 0 to 9). On the other hand, in the equipment condition code, as shown in Table 2, an identifier (three digits from 0 to 9) corresponding to the manufacturing equipment that can be realized is added to the standard code.
【００１６】[0016]
【表１】 [Table 1]
【００１７】[0017]
【表２】 [Table 2]
【００１８】このような３種類のコ−ドを製造工程、各
工程での製造規格、そして該製造規格対応の設備条件の
それぞれに設定しデ−タＩＤとすることにより、半導体
の各製造プロセス条件を先の立体的なデ−タ構造に沿っ
た概念で有機的に具体的に関係付けることが可能にな
る。By setting these three types of codes in the manufacturing process, the manufacturing standard in each process, and the equipment conditions corresponding to the manufacturing standard, and setting them as data IDs, each semiconductor manufacturing process can be performed. The conditions can be organically and specifically related by the concept along the three-dimensional data structure.
【００１９】なお、これらコ−ドの採番設定は本発明の
方式に限るものではなく、前述したように、対象とする
半導体製造ラインやそこでの要素プロセスグル−プの区
分単位、工程名称の種類数、製造条件の量的な規模、製
造設備の台数等に応じてその識別子の選択や分類方式、
コ−ド桁数等を決定するものであることは云うまでもな
い。The numbering of these codes is not limited to the method of the present invention. As described above, as described above, the target unit of the semiconductor manufacturing line, the division unit of the elemental process group there, and the process name are set. Selection and classification method of the identifier according to the number of types, the quantitative scale of the manufacturing conditions, the number of manufacturing facilities, etc.
Needless to say, it determines the number of code digits.
【００２０】図２に本発明の製造条件管理システムの構
成を示す。同図に示すように、本システムは先のコ−ド
類を作成登録するプログラム21とそれらの管理表デ−タ
ベ−ス24、また各種ＬＳＩの製造プロセス条件をデ−タ
変換しながら新規条件には該コ−ドを設定して登録する
プログラム22とそれら条件デ−タベ−ス25、そして該デ
−タベ−ス25を用いてＬＳＩの製造プロセス条件を検索
比較するプログラム23から構成される。ここでは上記シ
ステム構成がスタンドアロン型の場合を示しているが、
他システムとの結合や処理分散化、機能拡張性にも対応
するためネットワ−ク上に配置された構成であっても構
わない。FIG. 2 shows the configuration of the manufacturing condition management system of the present invention. As shown in the figure, the system includes a program 21 for creating and registering the above-mentioned codes, a management table database 24 for them, and new conditions while converting the manufacturing process conditions of various LSIs into data. The program comprises a program 22 for setting and registering the code, a condition database 25 thereof, and a program 23 for retrieving and comparing LSI manufacturing process conditions using the database 25. . Here, the case where the above system configuration is a stand-alone type is shown,
The configuration may be arranged on a network in order to cope with coupling with other systems, disperse processing, and expand functions.
【００２１】図２において該コ−ド類の管理表24は、認
定されたデ−タを対象としてそれぞれプログラム21で次
のように登録されている。工程コ−ドは製造工程フロ−
で定義されている各製造工程の名称に対応付けて設定し
た先の階層化した分類コ−ドを、規格コ−ドは例えばSi
O2の酸化膜形成工程ならばその形成温度、膜厚、形成雰
囲気、膜特性等の具体的な製造規格と対応付けたコ−ド
を各要素プロセスでの分類単位に設定されている。また
設備条件コ−ドは該規格コ−ドのそれぞれに対応付けて
利用できる複数設備それぞれの管理番号を規格コ−ドと
ともに設定されている。一方製造プロセス条件デ−タ25
には、該設備条件コ−ドをデ−タＩＤとする各設備の具
体的な製造条件、レシピ等(一品一様式で定義)またロッ
ト、基準プロセス、品種単位の製造工程フロ−(工程コ
−ド、規格コ−ドを含む)が管理されている。In FIG. 2, the management table 24 of the codes is registered in the program 21 as follows for the recognized data. The process code is the manufacturing process flow.
The hierarchal classification code set in association with the name of each manufacturing process defined in the above is defined as a standard code such as Si.
O 2 oxide film forming step if it its forming temperature, film thickness, forming atmosphere, co associated with specific production standards such as film properties - is set to taxon of each element processes the de. In the equipment condition code, a management number of each of a plurality of equipment that can be used in association with each of the standard codes is set together with the standard code. On the other hand, manufacturing process condition data 25
In the table, specific manufacturing conditions, recipes, etc. (defined in one-by-one format) for each equipment with the equipment condition code as the data ID, and a manufacturing process flow (process code) for each lot, reference process, and product type , And standard codes) are managed.
【００２２】そこで本システムにおける検索比較プログ
ラム23を用いた製造プロセス条件の比較方式について説
明する。図３にＡ、Ｂ２種類の製造工程フロ−を先の図
２の条件デ−タベ−ス25から任意に選択し、一方を比較
基準に他方を比較対象(ここではＡが比較基準でＢを比
較対象とする)として、Ａに対するＢの相違点を抽出す
る方法を示す。本システムでは双方の主要工程31a、41a
並びにその中の初作業工程32b、42bの工程コ−ドが一致
するポイントを探索確認し、比較開始点を設定する。次
に該開始点から、Ｂの製造工程フロ−40のＡの製造工程
フロ−30に対する違いを、それらの主要工程及びその中
の各作業工程を順に工程コ−ド並びに規格コ−ドを突合
せながら比較し、その都度相違点を指摘して行く。この
ような手順により、本システムでは図３に示した作業
工程が余分にある〜作業工程の総数が違うの相違点ま
でを指摘するようにした。またここでは、、、
の相違点に対する判断の根拠として主要工程が同じで同
一位置、その中の作業工程の数、並び順も同じである等
を設定し、とに対しては指摘ポイントから後の主要
工程５種の範囲の中で比較するよう設定している。なお
指摘された個々の相違点は、印刷や表示等の再利用のた
め、本システムでは該比較プログラム23が実行終了まで
記録している。A description will now be given of a method of comparing manufacturing process conditions using the search and comparison program 23 in the present system. In FIG. 3, two types of manufacturing process flows A and B are arbitrarily selected from the condition database 25 shown in FIG. 2, and one of them is used as a comparison reference and the other is compared (here, A is a comparison reference and B is a comparison reference). A method of extracting the difference between B and A is described below. In this system, both main processes 31a, 41a
In addition, a point at which the process codes of the first work processes 32b and 42b coincide with each other is searched and confirmed, and a comparison start point is set. Next, from the starting point, the differences between the manufacturing process flow 40 of B and the manufacturing process flow A of A are compared with those of the main process and each work process in order by the process code and the standard code. While comparing, point out the differences each time. According to such a procedure, in the present system, the operation steps shown in FIG. 3 are redundant to the point that the total number of operation steps is different. Also here,
As the basis for the judgment on the differences, the main processes are the same and the same position, the number of work processes in them, the arrangement order is the same, and so on. It is set to compare within the range. The differences pointed out are recorded until the execution of the comparison program 23 in the present system in order to reuse the printing and display.
【００２３】以上のような本発明の支援方法により、半
導体製造条件の有機的な分類と蓄積管理、さらには本発
明の該コ−ド類を半導体製造プロセス条件のデ−タＩＤ
として、あるいは検索比較キ−として利用することによ
り、各種製造プロセス条件の効率的な検索と比較を行う
ための具体的な改善が可能である。According to the support method of the present invention as described above, organic classification and accumulation management of semiconductor manufacturing conditions, and furthermore, the codes of the present invention are converted to data IDs of semiconductor manufacturing process conditions.
Or as a search comparison key, it is possible to make specific improvements for efficient search and comparison of various manufacturing process conditions.
【００２４】[0024]
【発明の効果】本発明では以上説明したように構成され
ているので、次のような効果がある。半導体の各種製造
プロセス条件を、先の立体的なデ−タ構造に沿った概念
で取扱い、しかもそれらを工程コ−ド、規格コ−ド、設
備条件コ−ドの各デ−タＩＤで関係付けているため、多
種条件の中から特定の１条件を検索することが容易であ
り、その検索レスポンスも速い。しかも立体的なデ−タ
構造の概念と各デ−タＩＤの設定により、半導体製造条
件の管理方式、関係付けの標準化に寄与するとともにそ
れら条件の重複管理の最小化にも貢献する。The present invention has the following effects because it is configured as described above. Various semiconductor manufacturing process conditions are handled according to the concept based on the three-dimensional data structure described above, and they are related by the process ID, standard code, and equipment condition code. As a result, it is easy to search for one specific condition from among various conditions, and the search response is fast. In addition, the concept of the three-dimensional data structure and the setting of each data ID contribute to standardization of the management method and relation of semiconductor manufacturing conditions, and also to minimization of redundant management of those conditions.
【００２５】また該コ−ド類を用いた条件比較方式によ
って一義的な相違点が効率的に抽出されるため、作成し
た製造プロセス条件の新規性の確認や、製造結果の特性
有位差の原因究明の１検討手段としても利用できる。Further, since a unique difference is efficiently extracted by the condition comparison method using the codes, the novelty of the created manufacturing process conditions is confirmed, and the characteristic difference of the manufacturing result is evaluated. It can also be used as a means to investigate the cause.
【図１】半導体の製造プロセス条件を関係付けて蓄積管
理する本発明の基本概念を模式的に示す図である。FIG. 1 is a diagram schematically illustrating a basic concept of the present invention for storing and managing semiconductor process conditions in relation to each other.
【図２】本発明の製造条件管理システムの構成図であ
る。FIG. 2 is a configuration diagram of a manufacturing condition management system of the present invention.
【図３】２種類の製造工程フロ−及び製造条件の比較に
よる相違点抽出方法を示す図である。FIG. 3 is a diagram showing a difference extraction method by comparing two types of manufacturing process flows and manufacturing conditions.
10…任意品種の或る製造工程における製造規格と、それ
が実現できる製造設備のリストを位置付ける面、11、12、
13…各設備対応の製造条件、21…コ−ド類作成登録プロ
グラム、22…製造プロセス条件作成登録プログラム、23
…製造プロセス条件の検索比較プログラム、24…工程コ
−ド、規格コ−ド、設備条件コ−ドの管理デ−タベ−
ス、25…製造プロセス条件デ−タファイル、30、40…任
意に選択した２種類の製造工程フロ−及び製造条件、31
a、41b…２種類の製造工程フロ−におけるそれぞれの主
要工程、32a、42b…２種類の製造工程フロ−における主
要工程それぞれの中の作業工程。10 ... A surface that locates a list of manufacturing standards for a certain type of manufacturing process and the manufacturing equipment that can realize it.
13: Manufacturing conditions for each equipment, 21: Code creation and registration program, 22: Manufacturing process condition creation and registration program, 23
... Manufacturing process condition search and comparison program, 24 ... Management database of process code, standard code, and equipment condition code
, 25: Manufacturing process condition data file, 30, 40: arbitrarily selected two types of manufacturing process flow and manufacturing conditions, 31
a, 41b... main steps in each of the two types of manufacturing process flows, 32a, 42b... working steps in each of the main steps in the two types of manufacturing process flows.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 岡部 勉 東京都小平市上水本町五丁目20番１号株 式会社 日立製作所武蔵工場内 (72)発明者 中里 純 神奈川県横浜市戸塚区吉田町292番地株 式会社 日立製作所生産技術研究所内 (72)発明者 下社 貞夫 神奈川県横浜市戸塚区吉田町292番地株 式会社 日立製作所生産技術研究所内 (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/02 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tsutomu Okabe 5-20-1, Josuihonmachi, Kodaira-shi, Tokyo Inside the Musashi Plant of Hitachi, Ltd. (72) Inventor Jun Nakazato Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture 292, Hitachi, Ltd., Production Technology Laboratory (72) Inventor Sadao Shimosha 292, Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa, Japan Hitachi, Ltd.Production Technology Laboratory (58) Fields investigated (Int.Cl. 7) , DB name) H01L 21/02
Claims (1)
程、各工程での製造規格、そして該製造規格対応の設備
条件のそれぞれに分類し、かつそれぞれにデ−タＩＤと
して工程コ−ド、規格コ−ド、設備条件コ−ドを要素プ
ロセスグル−プの主要工程、作業工程単位、製造設備単
位に識別可能となるよう設定し、 (b)該３種類のコ−ドをロット、基準プロセス、品種単
位の製造工程フロ−や設備製造条件に対応付けて管理す
ることにより、任意に選択したロット、基準プロセス、
品種単位の製造工程フロ−及び製造条件を該３種類のコ
−ドを検索比較キ−として、相違点抽出を行うことを特
徴とする半導体製造条件の比較方式。(A) A semiconductor manufacturing process condition is classified into a manufacturing process, a manufacturing standard in each process, and equipment conditions corresponding to the manufacturing standard, and the process code is used as a data ID for each. , Standard code and equipment condition code are set so that they can be identified in the main process, work process unit, and manufacturing equipment unit of the element process group. (B) The three types of codes are lot, By managing the reference process and the manufacturing process flow and equipment manufacturing conditions for each product type, you can arbitrarily select lots, reference processes,
A method of comparing semiconductor manufacturing conditions, wherein a difference is extracted by using the three types of codes as a search comparison key for the manufacturing process flow and manufacturing conditions for each product type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00976993A JP3189455B2 (en) | 1993-01-25 | 1993-01-25 | Comparison method of semiconductor manufacturing conditions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00976993A JP3189455B2 (en) | 1993-01-25 | 1993-01-25 | Comparison method of semiconductor manufacturing conditions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06224093A JPH06224093A (en) | 1994-08-12 |
| JP3189455B2 true JP3189455B2 (en) | 2001-07-16 |
Family
ID=11729476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00976993A Expired - Lifetime JP3189455B2 (en) | 1993-01-25 | 1993-01-25 | Comparison method of semiconductor manufacturing conditions |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3189455B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101687343B1 (en) * | 2015-02-11 | 2016-12-16 | 이원정 | smartphone display protection guide jig |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100614573B1 (en) * | 2000-05-31 | 2006-08-25 | 주식회사 하이닉스반도체 | System for maintaining consistency for created information of lot in manufacturing semiconductor process and method using for the same |
-
1993
- 1993-01-25 JP JP00976993A patent/JP3189455B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101687343B1 (en) * | 2015-02-11 | 2016-12-16 | 이원정 | smartphone display protection guide jig |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06224093A (en) | 1994-08-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6185560B1 (en) | System for automatically organizing data in accordance with pattern hierarchies therein | |
| JP6754889B2 (en) | Printed circuit board metal mask manufacturing system | |
| US8015198B2 (en) | Method for automatically indexing documents | |
| CN100483333C (en) | Real time data warehousing | |
| CN108021683B (en) | Three-dimensional labeling-based similar model retrieval implementation method | |
| KR101455880B1 (en) | Primary server architectural networking arrangement and methods therefor | |
| CA2216589C (en) | Computer-assisted design analysis method for extracting device and interconnect information | |
| AU2002331728A1 (en) | A method for automatically indexing documents | |
| JP3189455B2 (en) | Comparison method of semiconductor manufacturing conditions | |
| US6363382B1 (en) | Data classification method and data management method, database and data storage medium based on that data classification method | |
| US7062345B2 (en) | Wafer lot identity management system and method thereof | |
| US7035862B2 (en) | Method for processing information from an information repository | |
| JPH07235617A (en) | Semiconductor device | |
| US7185009B2 (en) | IC foundry manufacturing technology master data management structure | |
| JPH1185260A (en) | Plant facility management device | |
| US6805283B2 (en) | Lithography rework analysis method and system | |
| US20040158344A1 (en) | Mask management device in semiconductor wafer production process | |
| CN113420062B (en) | Building electromechanical system BIM model information quick retrieval method | |
| JPH0721271A (en) | Control indicating method of manufacturing condition | |
| JPH0831887A (en) | System for detecting difference of fabrication process and method for detecting the difference | |
| JPH0934906A (en) | Book management device | |
| Tobin Jr et al. | Image retrieval in the industrial environment | |
| US20090248185A1 (en) | Production system creating system, production system creating method, and storage medium for storing production system creating program for allowing computer to execute production system creating method | |
| JP2003050809A (en) | Data recording and retrieving method by computer, data base and data recording medium | |
| JP2007334393A (en) | Method and system for managing parts list data |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080518 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080518 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090518 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100518 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110518 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110518 Year of fee payment: 10 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110518 Year of fee payment: 10 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120518 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120518 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130518 Year of fee payment: 12 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130518 Year of fee payment: 12 |