JP3188950U - speaker - Google Patents

Abstract

When mounting a small speaker on a circuit board of an electronic device, it is possible to reduce mounting errors such as poor contact between pins or poor contact between pins and pads, which attaches a speaker pin to another pad. Provide speakers.
A speaker includes an attachment portion to be combined with a circuit board of an electronic device and two welding points provided on the attachment portion. The two welding points are provided symmetrically at two corners located on any one diagonal line of the attachment portion. The distance between the two welding points is increased, and each welding point of the speaker can be easily and accurately fixed to the corresponding pad of the circuit board.
[Selection] Figure 1

Description

  The present invention relates to a speaker, and more particularly to a speaker used in a portable electronic device.

  Currently, in order to reproduce audio, a portable speaker such as a mobile phone is generally provided with a small speaker. A conventional speaker has a circular shape, a rectangular shape, or an oval shape, and its pins are provided symmetrically or vertically symmetrical (that is, a plurality of pins of a speaker are usually provided on the same side).

  On the other hand, since the volume of the speaker mounted inside the electronic device is limited, when the pins are directly welded to the corresponding pads on the circuit board of the electronic device, the distance between the pins must be shortened. Don't be. Therefore, the distance between a plurality of pads installed on the circuit board is also shortened. Therefore, when the small speaker is attached to the circuit board of the electronic device, the speaker pin is attached to another pad due to an operator's mistake, poor contact between the pins, or poor contact between the pins and the pad. Is likely to occur. Further, the speaker cannot be easily attached to the circuit board, and there is a risk that the sound effect of the speaker will be poor.

  The present invention has been made in consideration of the above-described problems, and an object thereof is to provide a speaker that can reduce mounting errors.

  In order to achieve the above object, a speaker according to the present invention includes a mounting portion to be combined with a circuit board of an electronic device and two welding points provided in the mounting portion. The two welding points are provided symmetrically at two corners located on any one diagonal line of the attachment portion.

  Unlike the prior art, the present invention provides a welding point at each of two corners located on one diagonal line of the speaker, thereby increasing the interval between the two welding points. As a result, when the speaker is mounted on the circuit board of the electronic device, each welding point is in good contact with the pad on the circuit board, and each welding point on the speaker is easily and accurately attached to the corresponding pad on the circuit board. Can be fixed to.

1 is a perspective view of a speaker according to an embodiment of the present invention. It is the figure which looked at the speaker represented in FIG. 1 from the other side. It is a top view of the speaker represented in FIG.

  A speaker according to an embodiment of the present invention is used in portable electronic devices such as a mobile phone and a tablet personal computer, and reproduces audio and the like.

  As shown in FIGS. 1 and 2, the speaker 100 of the present invention is substantially rectangular and includes a mounting portion 10, a sound emission surface 20, and at least two welding points 30.

  The mounting portion 10 includes a peripheral wall 12 and a mounting surface 14. The mounting surface 14 is a surface facing the circuit board of the electronic device of the speaker 100, and the circuit board of the electronic device is attached to the mounting surface 14 in combination. The peripheral wall 12 protrudes so as to surround the peripheral edge of the mounting surface 14. The two circumferential walls 12 facing each other are provided with a plurality of receiving grooves 142, respectively. In the present embodiment, each housing wall 12 is provided with two housing grooves 142 at intervals. That is, the mounting portion 10 of the present invention includes four receiving grooves 142. The four receiving grooves 142 are provided in close proximity to substantially four corners of the mounting portion 10. Each accommodation groove 142 is formed to be recessed from the upper end of the peripheral wall 12 toward the sound emission surface 20, and the bottom of each accommodation groove 142 has an inverted trapezoidal shape.

  The sound emitting surface 20 is located on the opposite side of the mounting surface 14 and radiates and emits sound. That is, when the speaker 100 is mounted on the circuit board of the electronic device, the sound emitting surface 20 is separated from the circuit board.

  As shown in FIG. 3, the welding points 30 are located on one diagonal line of the mounting portion 10, are provided symmetrically to each other, and are used for welding to the pads of the circuit board of the electronic device. When the speaker 100 is welded to the circuit board, the distance between the two welding points 30 is relatively large so that each welding point 30 can reliably contact the pad of the circuit board. Therefore, it is possible to prevent poor welding contact of the welding point 30 or poor contact with the circuit board due to the distance limitation when welding, and also prevent product failure caused by attaching the welding point 30 to another pad. .

  When the welding point 30 is attached to the speaker 100, the speaker 100 is set on a rotatable jig, and the jig is rotated 180 degrees so that the two welding points 30 are positioned on the diagonal line of the mounting portion 10. Attach to two corners. In the present embodiment, the welding point 30 consists of a part of the metal elastic member 32. A part of the metal elastic member 32 is housed in two housing grooves 142 that are oblique to the longitudinal direction of the peripheral wall 12 and symmetrical. More specifically, one end of the metal elastic member 32 is housed in the housing groove 142, and the other end of the metal elastic member 32 extends from the inside of the housing groove 142 to the corner of the mounting portion 10. Further, a part of the metal elastic member 32 located at the corner of the mounting portion 10 protrudes to a predetermined height with respect to the mounting surface 14. A portion protruding from the mounting surface 14 of the metal elastic member 32 functions as a welding point 30. Accordingly, when the metal elastic member 32 is welded to the pad of the circuit board, the protruding portion (that is, the welding point 30) of the metal elastic member 32 can be reliably contacted (welded) with the pad. The entire member 32 supports the mounting portion 10 and promotes heat dissipation of the speaker 100 by separating the mounting portion 10 from the circuit board by a certain distance.

  As a modification, the welding point 30 may be a welding pad provided on the upper surface of a corner located on any one diagonal line of the peripheral wall 12. In this case, since the peripheral wall 12 protrudes from the mounting surface 14, when the welding pad of the speaker 100 is welded to the pad of the circuit board of the electronic device, the peripheral wall 12 supports the mounting surface 14 and supports the mounting surface 14. A certain distance is maintained between the circuit board and the circuit board. Thereby, the heat radiation of the speaker 100 can be promoted.

  As a modification, the welding point 30 may be a needle pin provided at a corner of the mounting portion 10. The needle pin extends vertically from the mounting portion 10. Further, the needle pin is welded to the circuit board so as to penetrate the through hole of the pad of the circuit board of the electronic device. Thereby, the speaker 100 can be more firmly attached to the circuit board.

  As an example of modification, the speaker 100 may be designed in an elliptical shape.

  As can be seen from the above embodiments, the present invention provides welding points 30 at two corners located on one diagonal line of the speaker 100 to increase the interval between the two welding points 30. Thus, when the speaker 100 is mounted on the circuit board of the electronic device, each welding point 30 is in good contact with the pad on the circuit board, and each welding point 30 on the speaker 100 is easily attached to the corresponding pad on the circuit board. And can be fixed accurately.

DESCRIPTION OF SYMBOLS 10 Mounting part 12 Perimeter wall 14 Mounting surface 20 Sound emission surface 30 Welding point 32 Metal elastic member 100 Speaker 142 Accommodating groove

Claims (5)

A speaker comprising an attachment portion to be combined with a circuit board of an electronic device, and two welding points provided on the attachment portion,
The speaker is characterized in that the two welding points are provided symmetrically at two corners located on one diagonal line of the mounting portion.   The speaker according to claim 1, further comprising a sound emission surface that is located on an opposite side of the attachment portion and emits audio.   The speaker according to claim 1, wherein the mounting portion includes a peripheral wall and a mounting surface, and the peripheral wall is protruded so as to surround a peripheral portion of the mounting surface. The peripheral wall is provided with at least two receiving concave grooves at an interval, and the speaker further includes at least two metal elastic members,
One end of each metal elastic member is housed in the housing groove, and the other end of each metal elastic member extends from the inside of the housing groove to the corner of the mounting portion, 4. The speaker according to claim 3, wherein a part located at a corner protrudes from the mounting surface to a predetermined height to form the welding point. 5.   The welding point is a needle pin provided at a corner of the mounting portion, and the needle pin extends vertically from the mounting portion, and is a through hole of a pad of a circuit board of the electronic device The speaker according to claim 1, wherein the speaker is welded to the circuit board so as to pass through the speaker.