JP3187200B2 - Method for manufacturing plasma display panel - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a plasma display panel, and more particularly, to a method of forming a barrier pattern, which can easily remove residues and foreign substances at the bottom of the pattern and reduce the displacement of the barrier. The present invention relates to a method of manufacturing a plasma display panel which can be reduced in size and can have a large screen.

[0002]

2. Description of the Related Art As shown in FIG. 3, a plasma display panel has a front plate b on which an anode electrode a is formed,
A barrier e is formed inside the two insulating plates b and d of the rear plate d on which the cathode electrode c is formed, and the intersection of both electrodes a and c formed on the insulating plates b and d forms one pixel. It has a corresponding configuration.

[0003] The plasma display panel emits light by exciting gaseous gas atoms by electrons in a discharge space during discharge and returning the excited atoms to a ground state. At the time of this light emission, a barrier is provided to secure a discharge space and prevent crosstalk of ultraviolet rays. The shape of this barrier is generally about 100 μm in width and about 100 μm or more in height.

[0004] By the way, as a method of forming a barrier in this plasma display panel, (1) a printing method in which thick film printing is repeated, and (2) a method of forming a ceramic powder by the present inventors. A slip for forming a barrier mixed with an ultraviolet curable resin is coated on the insulating plate on which the electrodes are formed, and only a portion of the coating layer necessary for forming the barrier is exposed to ultraviolet light with a light-shielding mask and cured. Is repeated once or more times, to obtain a barrier layer of a required height, develop and pattern the barrier layer, elute unexposed portions, and then bake the UV-cured portion to form a barrier pattern. Method of forming barrier using photolithography method to form "
165538).

[0005]

However, this printing method has the following problems. That is, (1) The limit of the width of the barrier is about 100 μm. (2) The plate using a stainless steel mesh significantly impairs the positional accuracy in increasing the screen size due to its elasticity. (3) There is a limit to the high definition of the pattern width, and it is difficult to obtain pattern position accuracy when the panel size becomes large.
In addition, the bottom of the pattern is easy to bleed due to the thixotropic property of the paste, and it is difficult to form a sharp pattern. (4) The positional shift between the barrier patterns, bleeding, and foreign matter significantly lower the quality of the light emission characteristics of the plasma display panel. And other issues.

In the case of the barrier forming method using the photolithography method, although the problem of the printing method can be solved and the recent high precision of the display can be coped with, the coating is performed over the entire surface of the base material. However, there is a problem that the residue easily remains as a residue.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and has as its object to remove residues and foreign substances on a panel when the pattern width is increased when a barrier is formed by photolithography. Adhesion can be prevented, pattern position accuracy in the pattern width at the time of barrier formation by the printing method has been improved, and bleeding at the bottom of the pattern can be suppressed, enabling higher definition of the pattern width and enlargement of the display screen. An object of the present invention is to provide a method for manufacturing a plasma display panel.

[0008]

According to a first aspect of the present invention, there is provided a method of manufacturing a plasma display panel, comprising the steps of: disposing a pair of insulating plates with a predetermined space therebetween; A method of manufacturing a plasma display panel, comprising providing an anode electrode group and a cathode electrode group that intersect with each other, and forming a barrier between the two electrode groups, wherein a thickness of 100 μm is formed using a positive photosensitive resin on the insulating plate.
A film forming step of forming the following resin film and, after pre-baking the resin film, selectively irradiating ultraviolet rays to a portion where the barrier is to be formed through a light-shielding mask, and developing the resin film to form an opening. An opening forming step of forming a resin film provided with the resin film; a step of solubilizing a developing solution by irradiating the entire surface of the resin film with the opening with ultraviolet light to make the resin film finally soluble in a developing solution; After filling or applying an ultraviolet curable paste in the opening, and drying, the ultraviolet curable paste located in the opening is selectively irradiated with ultraviolet light to cure the exposed portion, and the process is sequentially repeated a plurality of times. A barrier pattern forming step of developing and removing the uncured ultraviolet curing paste to form a barrier pattern having a desired height; and after forming the barrier pattern, the entire surface is irradiated with the ultraviolet light in a previous step. Has finally developer solution and the resin film removing step of the positive photosensitive of the resin film becomes soluble to the developer removed, the barrier pattern firing step of firing the removed barrier pattern of the resin film. According to a second aspect of the present invention, there is provided a method for manufacturing a plasma display panel, wherein a pair of insulating plates are arranged with a certain space therebetween, and an anode electrode group and a cathode electrode group which face each other and cross each other are provided inside the insulating plate. And a method for manufacturing a plasma display panel for forming a barrier between the two electrode groups, wherein a film forming step of forming a resin film having a thickness of 100 μm or less using a positive photosensitive resin on the insulating plate; After pre-baking the coating, selectively irradiating ultraviolet rays to a portion forming the barrier through a light-shielding mask, and developing the resin coating to form a resin coating having an opening, After filling or applying the ultraviolet curing paste in the opening of the resin film and drying, the ultraviolet curing paste located in the opening is selectively irradiated with ultraviolet light to expose the exposed portion. Forming a barrier pattern of a desired height by developing and removing the uncured UV-cured paste, and forming the opening after forming the barrier pattern. The resin coating is irradiated with ultraviolet light over the entire surface to make it finally soluble in a developer, and a positive solution finally irradiated with the ultraviolet light over the entire surface in the previous step to become soluble in the developer. The method includes a resin film removing step of developing and removing the resin film having mold sensitivity, and a barrier pattern baking step of baking the barrier pattern from which the resin film has been removed.

[0009]

According to the method of manufacturing a plasma display panel of the present invention, a resin film such as a positive photosensitive resin film having an opening is formed on an insulating plate, a barrier layer is formed in the opening, and the barrier layer is formed. After formation, by removing the resin film,
Since the barrier pattern is formed, the portions other than the barrier pattern portion are protected by the resin film, so that the adhesion of foreign substances during the barrier formation step can be prevented. Further, when used for the configuration of the barrier utilizing the photolithography method, it acts so that residues other than the barrier pattern portion can be easily removed.

In addition, in order to form a barrier at the opening of the resin film patterned with high positional accuracy, misalignment during printing and bleeding at the bottom of the pattern are caused on the resin film at the time of lamination, and the portion after the formation of the barrier pattern is formed. When the resin film is removed, it acts so that it can be easily removed.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. Here, FIGS. 1 and 2
FIG. 1 shows an embodiment of the present invention, FIG. 1 is an explanatory view for explaining a step of forming a barrier by using a photolithography method, and FIG. 2 is an explanatory view for explaining a step of forming a barrier by a printing method. FIG.

Embodiment 1 This embodiment is an embodiment in which a plasma display panel having a basic configuration as shown in FIG. 3 is applied to formation of a barrier using a photolithography method. (1) a film forming step, (2) an opening forming step,
The barrier is formed by six steps of (3) a step of solubilizing a developer, (4) a barrier pattern forming step, (5) a resin film removing step, and (6) a barrier pattern baking step. Hereinafter, each step will be described with reference to FIG.

-Film Forming Step- This step is a step of forming a photosensitive resin film 2 on an anode-side insulating plate (front plate) 1 for forming a plasma display panel. In this step, a resin coating 2 having a thickness of 100 μm or less is formed on the insulating plate 1 by using a positive photosensitive resin by a doctor blade method or a roll coater method.
(See FIG. 1a). Here, the reason why the thickness of the resin film 2 is set to 100 μm or less is a numerical value in consideration that when the thickness exceeds 100 μm, when the barrier paste is formed in the opening 3 to be formed in a later step, the barrier paste cannot be sufficiently filled. Therefore, a range of about 1 to 30 μm is preferable.

-Step of Forming Opening- This step is a step of forming a film opening 3 for forming a barrier in the resin film 2 formed in the film forming step. In this step, after pre-baking the resin film, a portion where a barrier is to be formed is selectively irradiated with ultraviolet rays through a light shielding mask 4 made of glass (see FIG. 1B). To complete the patterning of the positive photosensitive resin film 2 having the openings 3 (see FIG. 1C).
Here, the width of the opening 3 is 60 μm. However, the opening 3 can have any numerical value according to the width of the barrier pattern.

-Solvent Solubilizing Step- This step is a step of making the patterned resin film 2 soluble in the developing solution in the opening forming step. In this step, after drying the resin film 2, the entire surface is irradiated with ultraviolet rays so as to be soluble in the developing solution (see FIG. 1d).
That is, in a later step, the resin film 2 can be removed by washing away with a developer.

-Barrier Pattern Forming Step- This step is a step of forming a barrier pattern 5 in the opening 3 of the resin film 2. In this step, after the ultraviolet curable paste is filled or applied to the openings 3 of the patterned resin film 2 (see FIG. 1E), the ultraviolet curable paste is dried, and the ultraviolet curable paste located in the openings 3 is made of glass light shielding. The barrier layer is formed by selectively irradiating ultraviolet rays through the mask 6 and curing the exposed portions 7 (see FIG. 1f). Reference numeral 8 denotes a non-exposed portion. In addition, this process
The barrier layers 9 having the desired height are sequentially repeated as necessary.
(See FIG. 1g) and barrier layers 9, 9,.
Is developed with a predetermined negative-type photosensitive resin developing solution of the ultraviolet curing paste to form a barrier pattern 5 having a desired height (see FIG. 1h). Then, in the present example, a barrier having a height of 180 μm was obtained by laminating 12 times. Here, as the ultraviolet curing paste, SiO ₂ : 15% by weight, Al
₂ O ₃ : 20%, Fe ₂ O ₃ : 10%, Cr ₂ O ₃ : 3%, MnO: 7%, CoO: 2%, Pb
_{O: 35%, B 2 O} 3: barrier powder consisting of 8%: 100 weight parts UV-curable resin: Using 50 parts by weight of the paste formed by mixing a solvent.

-Resin film removing step- This step is a step of removing the resin film. In this step, the positive photosensitive resin film 2 having a barrier formed in the opening 3 is formed.
Is spray-developed using a predetermined developer of a positive photosensitive resin to remove the positive photosensitive resin film 2 (see FIG. 1I). Then, by removing the resin film 2, it is possible to simultaneously remove the residue of the ultraviolet curing paste adhered to the resin film 2 when forming the barrier pattern 5. And
A barrier pattern having a width of about 60 μm was obtained.

-Barrier Pattern Firing Step-This step is a step of firing the ultraviolet-cured barrier pattern 5. In this step, the barrier pattern 5 (ultraviolet curing paste) is heated and fired, the organic binder in the ultraviolet curing paste is burned, and the glass ceramic material is sintered to obtain a black dense barrier (see FIG. 1j). In the present example, heating was performed at a firing temperature of 565 ° C. for 15 minutes.
The resulting barrier dimensions were 50 μm wide and 150 μm high. The barrier pattern 5 formed in the present embodiment is
The portion other than the barrier pattern portion is protected by the photosensitive resin film 2, and the attachment and residue of foreign matter during the formation of the barrier can be simultaneously removed by removing the resin film 2. Next, in order to confirm the effect of the present embodiment, a barrier pattern formed by the present embodiment,
Table 1 shows a comparison of the residue state of the barrier pattern according to the conventional method formed without using the positive photosensitive film.
The result as shown in FIG.

[0019]

[Table 1]

From the result, in the case of this embodiment,
For a barrier pattern having a pattern interval of 50 μm to 400 μm and a pattern height of 120 μm to 200 μm, a very good barrier could be formed without any residue, whereas in the case of the conventional example, the pattern interval was 50 μm or less. With respect to the barrier pattern, it was confirmed that the residue was very large, the quality of the light emission characteristics of the plasma display panel was reduced, and the residue increased as the pattern interval became narrower and the barrier height became higher. This is because in the case of the present embodiment, foreign substances and residues can be removed by removing the resin film when forming the barrier pattern.

Example 2 This example is an example in which the present invention is applied to the formation of a barrier by a printing method. (1) A film forming step, (2) an opening forming step, and (3) a developing solution. The barrier is formed by a solubilizing step, (4) a barrier pattern forming step, (5) a resin film removing step, and (6) a barrier pattern baking step. Less than,
Each step will be described with reference to FIG. Since the width of the opening 3 is set to 80 μm in the opening forming step and the barrier pattern forming step is the same as in the first embodiment, the description thereof is omitted.

In the barrier pattern forming step in this embodiment, for example, the weight% is applied to the opening of the positive photosensitive resin film.
Where, SiO ₂ : 15%, Al ₂ O ₃ : 20%, Fe ₂ O ₃ : 10%, Cr ₂ O ₃ : 3%, Mn
O: 7%, CoO: 2 %, PbO: 35%, B 2 O 3: consisting of 8% barrier powder 9
A paste consisting of 5% and 5% of the vehicle is printed and laminated to complete the formation of the barrier pattern 5 having a desired height (see FIG. 2F). In this embodiment, a barrier having a height of 165 μm was formed by 12 printing laminations. The barrier paste only needs to contain a ceramic powder that becomes black after firing and becomes dense. Then, a barrier pattern having a bottom width of 80 μm and a height of 150 μm was obtained.

In the barrier pattern 5 formed in the present embodiment, as in the case of the first embodiment, the portions other than the barrier pattern are protected by the photosensitive resin film 2, so that adhesion of foreign substances during formation of the barrier is prevented. In order to form a barrier at the opening 3 of the photosensitive resin film 2 which is formed with good positional accuracy, the positional deviation at the time of printing and laminating is changed because the displaced portion is located on the photosensitive resin film 2. It works so that it can be easily removed together with the removal of the photosensitive resin film 2 after pattern formation. Next, in order to confirm the effect of the present embodiment, a defect pattern was compared between a barrier pattern formed by the present embodiment and a barrier pattern formed by a method without using a positive photosensitive film, according to a conventional method. The results as shown in Table 2 were obtained.

[0024]

[Table 2]

From the result, in the case of this embodiment,
It can be seen that there is no bleeding of the pattern and a barrier with excellent positional accuracy can be formed. This is because in the case of the present embodiment, the positional deviation at the time of forming the barrier pattern and the bleeding at the bottom of the pattern can be removed simultaneously with the removal of the resin film.

It should be noted that the present invention is not limited to the above-described embodiment, but includes a configuration that can be modified and implemented without changing the gist of the present invention. Incidentally, in the above-described embodiment, the entire surface irradiation of the positive photosensitive film with ultraviolet rays in the step of solubilizing the developer is performed before the formation of the barrier pattern, but may be performed after the formation of the barrier pattern. is there. Further, in the above-described embodiment, the example in which the barrier is formed on the anode side has been described, but the same effect can be obtained in forming the barrier on the cathode side. Further, in the above-described embodiment, the configuration in which the resin film is formed by the photolithography method using the positive photosensitive film has been described, but a configuration in which the film having the opening is formed by ordinary printing may be adopted. .

[0027]

As is apparent from the above description, according to the method of manufacturing a plasma display of the present invention, a resin film having an opening is formed on an insulating plate, and a barrier layer is formed in the opening. Since the barrier pattern is formed by removing the resin film after the formation of the barrier layer, foreign matters can be prevented from adhering during the barrier formation step in order to protect portions other than the barrier pattern portion with the resin film, and When used for the configuration of the barrier using the photolithography method, residues other than the barrier pattern portion can be easily removed. Therefore, there is an effect that the yield at the time of forming the barrier pattern is improved.
According to the plasma display manufacturing method of the present invention, as the resin film, using a positive photosensitive resin film,
Since the resin film can be easily removed after the formation of the barrier pattern, residues other than the barrier pattern portion, misalignment of the pattern and bleeding at the bottom of the pattern can be easily removed, and the workability thereof can be improved. It has the effect of.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention and is an explanatory diagram for describing a step of forming a barrier using a photolithography method.

FIG. 2 shows another embodiment of the present invention and is an explanatory diagram for explaining a step of forming a barrier by a printing method.

FIG. 3 is a schematic view showing a basic unit of the plasma display panel.

[Explanation of symbols]

1 ... insulating plate (front plate), 2 ... photosensitive resin film,
3 opening, 4 light-shielding mask, 5 barrier pattern, 6 light-shielding mask, 7 exposure part, 8.
-Non-exposed part, 9 ... barrier layer, a ... anode electrode,
b: front plate, c: cathode electrode, d: back plate, e: barrier

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-109536 (JP, A) JP-A-2-165539 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01J 9/24 H01J 17/04 H01J 17/49

Claims (2)

(57) [Claims] A pair of insulating plates are arranged at a predetermined space, and an anode electrode group and a cathode electrode group that face each other and intersect with each other are provided inside the insulating plate, and a barrier is provided between the two electrode groups. In the method of manufacturing a plasma display panel to be formed, a positive photosensitive resin is used on the insulating plate to a thickness of
A film forming step of forming a resin film having a thickness of μm or less, and after pre-baking the resin film, selectively irradiating ultraviolet rays to a portion where the barrier is to be formed via a light shielding mask,
An opening forming step of developing the resin film to form a resin film having an opening; and irradiating the entire surface of the resin film having the opening with ultraviolet rays to make the resin film finally soluble in a developer. A developer solubilizing step, and after filling or applying an ultraviolet curable paste to the opening of the resin film and drying, the ultraviolet curable paste located at the opening is selectively irradiated with ultraviolet light to expose the exposed portion. Curing, repeating the process sequentially a plurality of times, developing and removing the uncured ultraviolet curing paste to form a barrier pattern of a desired height; and A resin film removing step of developing and removing the positive photosensitive resin film finally irradiated with the entire surface and becoming soluble in a developing solution; and baking the barrier pattern from which the resin film has been removed. A method for manufacturing a plasma display panel, comprising a step of firing a barrier pattern. 2. A pair of insulating plates are arranged with a certain space therebetween, and an anode electrode group and a cathode electrode group that face each other and cross each other are provided inside the insulating plate, and a barrier is provided between the two electrode groups. In the method of manufacturing a plasma display panel to be formed, a positive photosensitive resin is used on the insulating plate to a thickness of 100
A film forming step of forming a resin film having a thickness of μm or less, and after pre-baking the resin film, selectively irradiating ultraviolet rays to a portion where the barrier is to be formed via a light shielding mask,
An opening forming step of developing the resin film to form a resin film having an opening; filling or applying an ultraviolet curable paste to the opening of the resin film and drying; A barrier pattern for selectively irradiating the ultraviolet-curable paste with ultraviolet light to cure an exposed portion, repeating the process sequentially plural times, and developing and removing the uncured ultraviolet-curable paste to form a barrier pattern of a desired height A forming step, after forming the barrier pattern, irradiating the entire surface of the resin film on which the opening is formed with ultraviolet light so as to make the resin film finally soluble in a developing solution; A resin film removing step of developing and removing the positive photosensitive resin film finally irradiated with the entire surface and becoming soluble in a developing solution; and baking the barrier pattern from which the resin film has been removed. A method for manufacturing a plasma display panel, comprising a step of firing a barrier pattern.