JP3169941U - LED backlight module with extrusion cover - Google Patents

Abstract

An LED backlight module including an extrusion cover that can easily position a plurality of LED elements is provided. A container includes a plurality of perforations, and the plurality of LED elements are housed in the container and are respectively passed through the plurality of perforations and provided on the circuit layer. By accommodating and protecting the LED element using the extrusion cover 11 and the container, it is possible to effectively prevent the LED element from being damaged or displaced by an external impact. Further, by using the heat conduction band, the first elastic heat conduction medium 16 and the second elastic heat conduction medium 17 as a heat conduction medium, when the LED element emits light, the front of the circuit layer is formed by a “bidirectional heat dissipation” method. The heat generated in the LED element from both the back surface and the back surface can be removed. [Selection] Figure 3

Description

The present invention relates to an LED backlight module, and more particularly to an LED backlight module including an extrusion cover that can effectively protect an LED element and prevent the LED element from receiving an external impact.

  A liquid crystal display is a display product that is currently widely used. The liquid crystal display can accurately display an image by controlling the light transmittance at each pixel position with the liquid crystal layer of the liquid crystal panel. Currently, liquid crystal displays are used in large quantities in televisions, mobile phones, smart phones, notebook computers, and personal digital assistants (PDAs).

  However, since the liquid crystal panel itself is not a material that emits light, it is necessary to provide a backlight module as a light source in the liquid crystal display. Please refer to FIG. FIG. 1 is a schematic view showing the structure of a conventional LED backlight module mounted inside a liquid crystal display. As shown in FIG. 1, the conventional LED backlight module mainly includes a main frame 100 'and at least one bar lamp 200'. Among them, the main frame 100 ′ includes a bottom plate 110 ′ and four side edges 120 ′, 140 ′, 160 ′, and 180 ′, and the rod-shaped lamp 200 ′ has side edges 120 ′, 140 ′, and 180 by heat radiation adhesive. 'Provided on. Furthermore, a plurality of LED elements 210 ′ mounted on the circuit board 220 ′ are provided on the bar lamp 200 ′. In addition, as shown in FIG. 1, the light guide plate 300 ′ is mounted in the main frame 100 ′, the light guide plate 300 ′ includes four convex portions 350 ′, and each of the four convex portions 350 ′ has four side edges. Fit into the corners of the four main frames formed by 120 ', 140', 160 ', 180'. With the above structure, when the plurality of LED elements 210 ′ emit light, the backlight enters the light guide plate 300 ′ and diffuses.

The LED backlight module described above is used in a liquid crystal display. However, as shown in FIG. 1, the rod-shaped lamp 200 ′ is directly attached to the three sides 120 ′, 140 ′, and 180 ′ of the main frame 100 ′, and the rod-shaped lamp 200 ′ is not protected by a cover or a container. If the liquid crystal display receives an impact during transportation, the bar lamp 200 'may be damaged. In view of this, backlight module manufacturers provide LED backlight modules that include a cover. Please refer to FIG. FIG. 2 is a schematic view showing the structure of an LED backlight module with a cover attached inside the liquid crystal display. As shown in FIG. 2, two backlight modules 12 '' are mounted inside the liquid crystal display. Among them, the two backlight modules 12 ″ are provided to face the upper and lower side frames of the main frame 11 ″. Each backlight module 12 ″ includes a cover 121 ″, a circuit board 122 ″, and a plurality of LED elements 123 ″.

  Usually, the cover 121 ″ is made of a metal material such as aluminum. The shape of the cover 121 ″ made by press molding is roughly a gate shape or an L shape. The circuit board 122 ″ is attached inside the cover 121 ″, and the plurality of LED elements 123 ″ are provided on the circuit board 122 ″. In order to improve the light collection effect of the backlight module, a reflective layer (not shown) is attached to the inner surface of the cover 121 ″. With the above structure, when the LED element 123 ″ emits light, the reflection layer reflects the light emitted from the LED element 123 ″, so that all the light rays can enter the light guide plate.

  As described above, for the LED backlight module with a cover described above, the cover 121 ″ serves to protect the LED element 123 ″ by accommodating the circuit board 122 ″ and the plurality of LED elements 123 ″. Plays. However, since the cover 121 ″ is formed by press-molding a thin metal, if the liquid crystal display receives an excessively strong impact during transportation, the cover 121 ″ is deformed, and the circuit board 122 ″ or the LED element is deformed. 123 ″ may be damaged.

  As can be seen from the description of the two conventional LED backlight modules used in the above-mentioned liquid crystal display, the conventional LED backlight module has many drawbacks and deficiencies. In view of this, the inventor of the present invention has conducted research and finally completed an LED backlight module including the extrusion cover of the present invention. In the present invention, the LED element inside the cover can be protected more strongly by being housed in the extrusion cover.

  In the present invention, a container is provided in an extrusion cover having a constant thickness, and a plurality of LED elements can be accommodated by a plurality of perforations provided in the container, and the plurality of LED elements are welded. It is a first object of the present invention to provide an LED backlight module having an extrusion cover that can position the plurality of LED elements by the plurality of perforations.

  In addition, the present invention provides a container in an extrusion cover having a certain thickness, and accommodates a plurality of LED elements and a light guide plate by the container and the extrusion cover, and the LED element is extruded from the container. When the light guide plate is attached to the container and the extrusion cover, it can be prevented from colliding with the LED element and shifting the position of the LED element and deteriorating the light collecting effect of the backlight module. In addition, when the LED backlight module receives an impact, the extrusion cover can effectively protect the plurality of LED elements, and the LED element can be prevented from being damaged by the impact. A second object is to provide an LED backlight module.

  In the present invention, the container is provided in an extrusion cover having a certain thickness, and the plurality of LED elements and the light guide plate can be accommodated by the container and the extrusion cover. When the plurality of LED elements emit light by sticking a metal layer having a high thermal conductivity coefficient to the front and back surfaces of the circuit layer, the extrusion cover can remove heat generated from the LED elements in both directions. It is a third object to provide an LED backlight module comprising:

  The present invention also includes a plurality of LED elements and a light guide plate accommodated in an extrusion cover having a certain thickness, so that when the LED backlight module is impacted, the extrusion cover is the plurality of LED elements. The LED element can be prevented from being damaged by impact, and the light guide plate is sandwiched and fixed in the extrusion cover by a fixing support part provided in the extrusion cover. Accordingly, a fourth object of the present invention is to provide an LED backlight module having an extrusion cover in which the light guide plate is not displaced by the impact of the backlight module.

  The present invention also includes a plurality of LED elements and a light guide plate accommodated in an extrusion cover having a certain thickness, so that when the LED backlight module is impacted, the extrusion cover is the plurality of LED elements. Can effectively prevent the LED element from being damaged by an impact, and the circuit board provided on the plurality of LED elements can be extruded by a folding portion provided in the extrusion cover. LED with an extrusion cover that can be sandwiched and fixed between the outer surfaces of the cover, thereby preventing the circuit board from receiving an impact when the extrusion cover is attached to the main frame. The fifth purpose is to provide a backlight module.

  The present invention also includes a plurality of LED elements and a light guide plate accommodated in an extrusion cover having a certain thickness, so that when the LED backlight module is impacted, the extrusion cover is the plurality of LED elements. It is an object of the present invention to provide an LED backlight module with an extruded cover, which can effectively protect the LED element, thereby preventing the LED element from being damaged by impact, and having more usage. The purpose of the eye.

  In order to achieve the first object, the second object, and the third object of the present invention, an LED backlight module having an extruded cover according to the present invention includes an extruded cover, a circuit layer, It consists of a conduction band, a container, a plurality of LED elements, a first elastic heat conductive medium, and a second elastic heat conductive medium. The LED backlight module having the extrusion cover is mounted in a main frame having a bottom plate and at least one side frame, and the main frame is mounted in a liquid crystal display. The extrusion cover is provided on the side frame, and includes an attachment portion, two convex portions, and a bottom portion, and the attachment portion is connected to the bottom portion, and the two convex portions are the bottom portion. The attachment part and the bottom part have a certain thickness. The circuit layer is printed on the surface of the mounting portion, and at the same time, the circuit layer is also printed on the surface of the convex portion. The heat conduction band is provided on the convex portion and the bottom portion, and is extended and provided on the bottom plate. The container is provided on the attachment portion, and includes a housing recess and a plurality of perforations facing the housing recess, and the light guide plate accommodates the light incident surface in the housing recess so that the housing body includes the housing. Fixed to. The plurality of LED elements are respectively passed through the plurality of perforations and provided on the circuit layer, and the plurality of LED elements emit light and enter the light incident surface of the light guide plate. The first elastic heat transfer medium is provided in a first groove on the outer surface of the attachment portion. The second elastic heat conducting medium is provided in a second groove on the outer surface of the bottom. Among them, the perforation has a certain depth, so that when the LED element is placed over the circuit layer through the perforation, the LED element is completely embedded in the perforation. In addition, when the plurality of LED elements emit light, the circuit layer printed on the mounting portion and the inner surface of the convex portion transmits heat generated from the LED element onto the heat conduction band, the mounting portion, and the convex portion, Further, the heat conduction band conducts heat to the bottom plate, whereby the heat is evenly distributed on the bottom plate, and the first elastic heat conduction medium and the second elastic heat conduction medium cause the attachment portion and the convex portion to move. The conducted heat is transferred to the side frame and the bottom plate of the main frame by heat conduction, and is further released into the air through the main frame.

  In order to achieve the fourth object of the present invention, an LED backlight module including an extrusion cover according to the present invention includes an extrusion cover, a first thermal conduction band, a circuit layer, a plurality of LED elements, And a second heat conduction band. The LED backlight module having the extrusion cover is mounted in a main frame having a bottom plate and at least one side frame, and the main frame is mounted in a liquid crystal display. The extrusion cover is provided on the side frame, and includes an attachment portion, two convex portions, a bottom portion, and a fixed support portion, and the attachment portion is connected to the bottom portion and includes a plurality of portions. A first opening is provided, the two convex portions are formed on the bottom portion, the fixed support portion faces the convex portion and is formed at one end of the mounting portion, and the mounting portion and the bottom portion have a constant thickness. Is provided. The first heat conduction band is attached to the outer surface of the mounting portion and includes a plurality of second openings facing the plurality of first openings, and at the same time, the first heat conduction band is formed on the outer surface of the bottom portion. Stick further. The circuit layer is attached to the first heat conduction band. The plurality of LED elements are respectively passed through the plurality of first openings and the plurality of second openings and provided on the circuit layer, and the plurality of LED elements are accommodated in an extrusion cover. Light is emitted to the light guide plate. The second heat conduction band faces the first heat conduction band and sticks to the circuit layer, and an end of the second heat conduction band extends to the bottom plate to form a resuscitation shape. Among them, the first opening has a certain depth, and when the LED element is provided on the circuit layer through the first opening and the second opening, the LED element is completely embedded in the first opening. The light guide plate is accommodated and fixed in the extrusion cover by being fitted into an accommodation space formed by a fixed support portion and a convex portion. In addition, when the plurality of LED elements emit light, the circuit layer transmits heat generated from the LED elements to the first heat conduction band and the second heat conduction band, and the first heat conduction band further attaches heat. The second heat conduction band conducts heat on the side frame and the bottom plate, so that the heat conducted to the mounting portion and the convex portion is caused by heat conduction to the side frame and the bottom plate of the main frame. And is released into the air through the main frame, and the heat is evenly distributed to the bottom plate by the resuscitation of the end of the second heat conduction band.

  In order to achieve the fifth object of the present invention, an LED backlight module including an extrusion cover according to the present invention includes an extrusion cover, a first thermal conduction band, a circuit layer, a plurality of LED elements, And a second heat conduction band. The LED backlight module having the extrusion cover is mounted in a main frame having a bottom plate and at least one side frame, and the main frame is mounted in a liquid crystal display. The extrusion cover is provided on the side frame, and includes an attachment portion, two convex portions, a bottom portion, a fixed support portion, and a folding portion. A plurality of first openings, connected to the bottom portion, the two convex portions are formed on the bottom portion, the fixed support portion is opposed to the convex portion, and is formed at one end of the mounting portion; The folding part faces the fixed support part and is formed at one end of the attachment part, and the attachment part and the bottom part have a certain thickness. The first heat conduction band is attached to the outer surface of the mounting portion and includes a plurality of second openings facing the plurality of first openings, and at the same time, the first heat conduction band is formed on the outer surface of the bottom portion. Stick to. The circuit layer is attached to the first heat conduction band, and after the circuit layer is attached to the first heat conduction band, the circuit layer is sandwiched on the attachment part by folding the folding part. Fixed. The plurality of LED elements are respectively passed through the plurality of first openings and the plurality of second openings and provided on the circuit layer, and the plurality of LED elements are housed in an extrusion cover. Light is emitted to the light guide plate. The second heat conduction band faces the first heat conduction band and sticks on the folded portion, and the end of the second heat conduction band extends to the bottom plate to form a flow-through shape. Among them, the first opening has a certain depth, so that when the LED element is provided in the circuit layer through the first opening and the second opening, the LED element is completely embedded in the first opening. It is. The light guide plate is accommodated and fixed in the extrusion cover by being fitted into an accommodation space formed by a fixed support portion and a convex portion. When the plurality of LED elements emit light, the circuit layer conducts heat generated from the LED elements to the first heat conduction band and the second heat conduction band. Conducted on the bottom, the second heat conduction band conducts heat on the side frame and the bottom plate, so that the heat conducted to the mounting part and the convex part is caused by heat conduction to the side frame of the main frame. The heat is transmitted to the bottom plate, further released into the air by the main frame, and the heat is evenly distributed to the bottom plate by the resuscitation at the end of the second heat conduction band.

In order to achieve the sixth object of the present invention, an LED backlight module having an extrusion cover according to the present invention includes an extrusion cover, a circuit layer, an insulating heat conductive layer, a reflective element, and a plurality of LEDs. It consists of an element and a heat conductive layer. The LED backlight module having the extrusion cover is attached in a main frame having a bottom plate and at least one side frame, and the main frame is attached in a liquid crystal display.
The extrusion cover is provided on the side frame, the surface of the extrusion cover is subjected to surface treatment, and the extrusion cover includes a mounting portion, two convex portions, and a bottom portion, The attaching part is connected to the bottom part, the two convex parts are formed on the bottom part, and the attaching part and the bottom part have a certain thickness. The circuit layer is printed on the surface of the attachment portion. The insulating heat conductive layer is attached to the surface of the circuit layer, and is stretched and attached to the inner surface of the extrusion cover. Among them, the insulating heat conductive layer includes a plurality of first holes. The reflective element faces the circuit layer, is provided in the attachment portion, and includes a plurality of second holes facing the plurality of first holes, and a part of the first surface of the reflective element is A thermally conductive adhesive is applied, and a separation member having a plurality of third holes is provided on the second surface of the reflective element, and the plurality of third holes face the plurality of second holes. The plurality of LED elements are respectively provided on the circuit layer through the plurality of third hole portions, the plurality of second hole portions, and the plurality of first hole portions, and the plurality of LED elements emit light. Emitted and incident on the light guide plate. The heat conduction layer is provided on the outer surface of the extrusion cover, and one end of the heat conduction layer forms a heat conduction flow reed portion. Among them, the separation member has a certain thickness, whereby when the LED element is provided on the circuit layer through the third hole, the second hole, and the first hole, The element is completely embedded in the third hole. Further, when the extrusion cover is provided on the main frame, the heat conduction reflow part sticks on the bottom plate of the main frame. In addition, when the plurality of LED elements emit light, the circuit layer conducts heat generated from the LED elements onto the insulating heat conductive layer and the mounting portion, and the insulating heat conductive layer and the mounting portion extrude heat. Conducted throughout the molded cover, and further, the heat conducting layer conducts heat to the side frame of the main frame, and the heat conducting reflow part conducts heat on the bottom plate, so that heat is evenly distributed on the bottom plate. Sprayed on.

It is the schematic which showed the structure of the conventional LED backlight module attached to the inside of a liquid crystal display. It is the schematic which showed the structure of the LED backlight module with a cover attached inside the liquid crystal display. It is an exploded view of Example 1 of an LED backlight module provided with the extrusion molding cover of this invention. It is a side view of Example 1 of an LED backlight module provided with the extrusion molding cover of this invention. It is a 2nd side view of Example 1 of an LED backlight module provided with the extrusion molding cover of this invention. It is an exploded view of Example 2 of an LED backlight module provided with the extrusion molding cover of this invention. It is a side view of Example 2 of an LED backlight module provided with the extrusion molding cover of this invention. It is a 2nd side view of Example 2 of an LED backlight module provided with the extrusion molding cover of this invention. It is a 2nd side view of Example 2 of an LED backlight module provided with the extrusion molding cover of this invention. It is a 3rd side view of Example 2 of an LED backlight module provided with the extrusion molding cover of this invention. It is an exploded view of Example 3 of an LED backlight module provided with the extrusion molding cover of this invention. It is a side view of Example 3 of an LED backlight module provided with the extrusion molding cover of this invention. It is an exploded view of Example 4 of an LED backlight module provided with the extrusion molding cover of this invention. It is a side view of Example 4 of an LED backlight module provided with the extrusion molding cover of this invention. It is a 2nd side view of Example 4 of an LED backlight module provided with the extrusion molding cover of this invention. It is a side view of Example 5 of an LED backlight module provided with the extrusion molding cover of this invention. It is a 2nd side view of Example 5 of an LED backlight module provided with the extrusion molding cover of this invention. It is a side view of Example 6 of an LED backlight module provided with the extrusion molding cover of this invention. It is a 2nd side view of Example 6 of an LED backlight module provided with the extrusion molding cover of this invention.

  For a clearer understanding of an LED backlight module with an extrusion cover according to the present invention, a detailed description of a preferred embodiment of the present invention will be given below with reference to the drawings.

Example 1
The present invention has a plurality of embodiments. First, referring to FIG. FIG. 3 is an exploded view of Embodiment 1 of the LED backlight module including the extrusion cover according to the present invention. As shown in FIG. 3, the LED backlight module 1 having an extrusion cover is mounted in a main frame 2 having a bottom plate 21 and at least one side frame 22 (the main frame 2 shown in FIG. 3 has four sides). Side frame 22). The main frame 2 is attached in the liquid crystal display. The LED backlight module 1 including an extrusion cover includes an extrusion cover 11, a circuit layer 12, a heat conduction band 13, a container 14, a plurality of LED elements 15, a first elastic heat conduction medium 16, and The second elastic heat conducting medium 17 is used.

  The material of the extrusion cover 11 can be copper, aluminum, electrogalvanized steel sheet, or hot dip galvanized steel sheet. As shown in FIG. 3, the extrusion cover 11 is provided on the side frame 22 and includes an attachment portion 111, two convex portions 113, and a bottom portion 112. The attachment part 111 is connected to the bottom part 112, the two convex parts 113 are formed on the bottom part 112, and the attachment part 111 and the bottom part 112 have a certain thickness.

  The circuit layer 12 is printed on the surface of the attachment portion 111, and at the same time, the circuit layer 12 is also printed on the surface of the convex portion 113. Here, the points that require particular explanation are described below. Since the circuit layer 12 is formed on the surfaces of the attachment portion 111 and the convex portion 113 by printing, lithography, and etching, before the circuit layer 12 is printed, the surface of the extrusion cover 11 is anodized or coated. It is necessary to perform an acid-alkali treatment first, so that the surface of the extrusion cover 11 is not eroded by etching when the circuit layer 12 is etched. Alternatively, the surface of the extrusion cover 11 can be prevented from being eroded by applying an acid-alkali coating to the surface of the extrusion cover 11. As described above, after the surface of the extrusion cover 11 is anodized, the circuit layer 12 is formed on the surface of the attachment portion 111 when the printing, lithography, and etching manufacturing processes are performed. The area can be increased.

  The heat conduction band 13 is provided on the convex portion 113 and the bottom portion 112 and is provided on the bottom plate 21 by extending. The container 14 is a metal cover, a reflection plate cover, or a cover obtained by combining a metal and a reflection plate. The accommodating body 14 is provided on the attachment portion 111 of the extrusion cover 11 by a coupling structure (not shown), an insulating heat conductive adhesive (not shown), or welding, and an accommodating recess 141 and an accommodating portion. And a plurality of perforations 142 facing the recess 141. The light guide plate 23 is fixed in the housing 14 by housing the light incident surface 231 in the housing recess 141.

  4A is referred to simultaneously with FIG. FIG. 4A is a side view of Example 1 of the LED backlight module including the extrusion cover. The plurality of LED elements 15 are respectively passed through the plurality of perforations 142 and provided on the circuit layer 12. The LED element can be a direct type LED element or an edge type LED element, and the LED element emits light and enters the light incident surface 231 of the light guide plate 23. Further, as shown in the figure, one end of the accommodating recess 141 forms a flow relieving part 1411, so that when the light guide plate 23 is accommodated and fixed in the accommodating body 14, the reflow recurrent part 1411 sticks to the light guide plate 23. As a result, light does not leak from the gap between the accommodating recess 141 and the light guide plate 23.

  The first elastic heat conducting medium 16 is provided in the first concave groove 1111 on the outer surface of the attachment portion 111, and a thin metal layer having a high heat conduction coefficient is laid on the surface. Further, in order to improve the elasticity of the first elastic heat conductive medium 16, the first elastic heat conductive medium 16 is cut into a plurality of stages in the first embodiment. As described above, when the extrusion cover 11 including the first elastic heat conductive medium 16 is attached to the main frame 2, it can be tightly bonded to the bottom plate by the plurality of first elastic heat conductive media 16. The second elastic heat conducting medium 17 is provided in the second concave groove 1121 on the outer surface of the bottom 112. Similarly, a thin metal layer having the above high heat conduction coefficient is formed on the surface of the second elastic heat conducting medium 17. Similarly, in order to improve the elasticity of the second elastic heat conducting medium 17, the second elastic heat conducting medium 17 is cut into a plurality of stages in the first embodiment.

  Also, it should be emphasized here that the perforations 142 have a certain depth, as shown in FIG. 4A. With this structure, when the LED element 15 is passed through the perforations 142 and provided on the circuit layer 12, the LED elements 15 are embedded in the perforations 142. As a result, when the plurality of LED elements 15 emit light, the circuit layer 12 printed on the inner surface of the attachment portion 111 and the protrusion 113 causes the heat generated from the LED element 15 to be transferred to the heat conduction band 13, the attachment portion 111, and the protrusion. In addition, the heat conduction band 13 conducts heat to the bottom plate 21 so that the heat is evenly distributed on the bottom plate 21. Further, the heat conducted to the mounting portion 111 and the convex portion 113 by the first elastic heat conducting medium 16 and the second elastic heat conducting medium 17 is transmitted to the side frame 22 and the bottom plate 21 of the main frame 2 by heat conduction. Further, it is released into the air through the main frame 2.

  Next, as shown in FIG. 3, the attachment portion 111 includes a plurality of first screw holes 1112 provided in the first groove 1111, and the bottom 112 has a plurality of holes provided in the second groove 1121. The second screw hole 1122 is provided. The plurality of first screw holes 1112 and the plurality of second screw holes 1122 are used to screw the extrusion cover 11 into the side frame 22 and the bottom plate 21 of the main frame 2. Further, as shown in FIGS. 3 and 4A, if a metal cover made of a non-reflective material is used as the container 14, the reflective layer 18 is provided in the container 14 in order to improve the light collecting effect of the entire backlight module. Provided. The reflective layer 18 is formed by bending the reflector and placing it in the container 14, and can also be formed by applying white lacquer in the container 14.

  Besides the light collecting effect, the inventor of the present invention also considers how to avoid the occurrence of short paths. As shown in FIGS. 3 and 4A, a plurality of insulating pieces 1 </ b> B are respectively provided on the inner walls of the plurality of perforations 142. Thereby, when the LED element 15 is welded to the circuit layer 12 through the perforations 142, the insulating pieces 1B cause the solder to diffuse out through the inner side walls of the perforations 142, and the LED elements 15 and the container 14 are short-circuited. Can be prevented. In Example 1 of the LED backlight module 1 including the extrusion cover, the surface of the extrusion cover 11 is anodized, and the circuit layer 12 is formed on the attachment portion 111 by a printing, lithography, or etching manufacturing process. By forming the front surface and the rear surface, the arrangement area of the circuit layer 12 is increased. Refer to FIG. 4B. FIG. 4B is a second side view of Example 1 of the LED backlight module including the extrusion cover. For the same reason as described above, as shown in FIG. 4B, in order to further expand the arrangement area of the circuit layer 12, the extrusion cover further includes an extending portion 116 formed by extending the attachment portion 111. In addition, the extending | stretching part 116 can increase a circuit arrangement area, and, thereby, the arrangement area of the circuit layer 12 is expanded further. In addition, the length of the extending portion 116 can be adjusted by the difference in the layout area of the circuit layer 12.

  Since there are many embodiments of the present invention, after describing each embodiment in the present specification, in order to allow a person skilled in the field related to the present invention to easily understand the effect of each embodiment, Next, the effect of the embodiment will be described. So far, Example 1 of the LED backlight module 1 including the extrusion cover of the present invention has been described with reference to exploded views and side views. Therefore, the effect produced by Example 1 of the LED backlight module 1 having an extrusion cover will be described below.

  1. By housing the plurality of LED elements 15 and the light guide plate 23 by the extrusion cover 11 and the housing 14, the extrusion cover 11 reliably protects the LED elements 15 when the LED backlight module receives an impact. The LED element 15 can be prevented from being damaged by an external impact.

  2. Since the LED element 15 is embedded in the perforation 142 of the container 14, when the light guide plate 23 is attached to the container 14 and the extrusion cover 11, the position of the LED element 15 is shifted due to an unexpected impact and the backlight. It can prevent affecting the light collecting effect of the module.

  3. In connection with the second effect described above, when the plurality of LED elements 15 are welded, the plurality of LED elements 15 can be positioned by the plurality of perforations 142.

  4. The heat conduction band 13 is provided on the convex portion 113, the bottom portion 112, and the bottom plate 21, and the first elastic heat conduction medium 16 and the second elastic heat conduction medium 17 are respectively provided with the first concave groove 1111 and the second concave groove. By providing in the groove 1121, when the plurality of LED elements 15 emit light, the circuit layer 12 printed on the inner surface of the mounting portion 111 and the convex portion 113 transmits heat generated from the LED elements 15 to the heat conduction band 13, and The heat conduction band 13 conducts heat to the bottom plate 21 so that the heat is evenly distributed on the bottom plate 21. At the same time, the heat conducted to the mounting portion 111 and the convex portion 113 by the first elastic heat conducting medium 16 and the second elastic heat conducting medium 17 is further conducted to the side frame 22 and the bottom plate 21 of the main frame 2. The air is discharged through the main frame 2 into the air. Unlike the conventional LED backlight module, the embodiment 1 of the LED backlight module 1 having the extrusion cover of the present invention employs a “bidirectional heat dissipation” method, and heat generated from the LED element is transferred to the circuit layer 12. It is the point of removing from the front and back of the.

  5. The difference from the conventional technique is that the circuit layer 12 is directly formed on the surface of the extrusion cover 11 by lithography and etching.

  6. Since the attachment portion 111 is extended to form the extended portion 116, the arrangement area of the circuit layer 12 is further expanded, so that it can meet the demands of various LED element control circuits.

(Example 2)
In addition, the present invention further provides Example 2 of the LED backlight module 1 having an extrusion cover so that the LED backlight module 1 having an extrusion cover can have a different assembly structure. Please refer to FIG. 5 and FIG. 6A simultaneously. 5 and 6A are an exploded perspective view and a side view of a second embodiment of an LED backlight module having an extrusion cover according to the present invention. As shown in FIGS. 5 and 6A, Example 2 of the LED backlight module 1 having an extrusion cover includes an extrusion cover 11, a first heat conduction band 19, a circuit layer 12, a container 14, It comprises a plurality of LED elements 15 and the second heat conduction band 1A.

  The material of the extrusion cover 11 can be copper, aluminum, electrogalvanized steel sheet, hot dip galvanized steel sheet, and the extrusion cover 11 is provided on the side frame 22 and has an attachment portion 111, two A convex portion 113 and a bottom portion 112 are provided. The attachment portion 111 is connected to the bottom portion 112 and includes a plurality of first openings 1113. The two convex portions 113 are formed on the bottom portion 112. Further, the attachment portion 111 and the bottom portion 112 have a certain thickness.

The first heat conduction band 19 is an insulating heat conductive adhesive, and is attached to the outer surface of the attachment portion 111 and includes a plurality of second openings 191 facing the plurality of first openings 1113. At the same time, the first heat conduction band 19 is also attached to the outer surface of the bottom portion 112. The circuit layer 12 is attached to the first heat conduction band 19. The container 14 is a metal cover, a reflective plate cover, or a cover in which a metal and a reflective plate are combined. The container 14 is provided on the attachment portion 111 and faces the storage concave portion 141 and the storage concave portion 141. A plurality of perforations 142. The light guide plate is fixed in the housing 14 by housing the light incident surface 231 in the housing recess 141.

  The plurality of LED elements 15 are respectively passed through the plurality of perforations 142, the plurality of first openings 1113, and the plurality of second openings 191, and provided on the circuit layer 12. The LED element can be a direct type LED or an edge type LED, and the LED element emits light and enters the light incident surface 231 of the light guide plate 23. Furthermore, as shown in the figure, one end of the accommodating recess 141 forms a flow relieving part 1411. Therefore, when the light guide plate 23 is accommodated and fixed in the accommodating body 14, the reflow referential part 1411 sticks to the light guide plate 23, Thus, light can be prevented from leaking from the gap between the accommodating recess 141 and the light guide plate 23.

  Moreover, as shown to FIG. 6A, the perforation 142 and the 1st opening 1113 are provided with a fixed depth. Thereby, when the LED element 15 is provided on the circuit layer 12 through the perforation 142, the first opening 1113, and the second opening 191, the LED element 15 is completely embedded in the perforation 142 and the first opening 1113. It is.

  The second heat conduction band 1 </ b> A is a metal having a high heat conduction coefficient, and the second heat conduction band 1 </ b> A faces the first heat conduction band 19 and sticks to the circuit layer 12. Further, the end of the second heat conduction band 1A extends to the bottom plate 21 to form a flow-like shape. The flow-like end assists the second heat conduction band 1 </ b> A sticking to the bottom plate 21 of the main frame 2. In Example 2, when the plurality of LED elements 15 emit light, the circuit layer 12 conducts heat generated from the LED elements 15 to the first heat conduction band 19 and the second heat conduction band 1A, and further, the first heat conduction band. 19 transfers heat to the attachment portion 111 and the bottom portion 112, and the second heat conduction band 1 </ b> A conducts heat onto the side frame 22 and the bottom plate 21. The heat conducted to the attachment portion 111 and the convex portion 113 as described above is transmitted to the side frame 22 and the bottom plate 21 of the main frame 2 by heat conduction, and further, the heat is released into the air by the main frame 2. Further, heat is uniformly distributed to the bottom plate 21 by the resuscitation at the end of the second heat conduction band 1A.

  Similarly, if the material of the container 14 is a non-reflective metal, as shown in FIGS. 5 and 6A, in order to enhance the light collecting effect of the LED backlight module 1 having an extrusion cover, A layer 18 is provided in the container 14. Moreover, in order to make it easy to attach the LED backlight module 1 including the extrusion cover to the main frame 2, the bottom portion 112 further includes a plurality of second screw holes 1122. The plurality of second screw holes 1122 are provided in the concave groove formed by the two convex portions 113, and the attachment portion convex ear portion 1114 including the plurality of third screw holes 1115 is formed in the attachment portion 111. A bottom convex ear 1123 having a plurality of fourth screw holes 1124 is formed in the bottom 112. The plurality of second screw holes 1122, the plurality of third screw holes 1115, and the plurality of fourth screw holes 1124 make it easy to attach the extrusion cover 11 onto the main frame 2. As in the first embodiment, also in the second embodiment of the LED backlight module 1 including the extrusion cover, a plurality of insulating pieces 1B are provided on the inner side walls of the plurality of perforations 142, respectively. Note that when the LED element 15 is welded to the circuit layer 12 through the perforations 142, the insulating pieces 1 </ b> B can prevent the solder from diffusing outside from the inner side walls of the perforations 142.

  Reference is made to FIG. 6B. FIG. 6B is a second side view of Example 2 of the LED backlight module including the extrusion cover. In order to accommodate and protect the container 14 in Example 2 of the LED backlight module including the extrusion cover, the attachment portion 111 of the extrusion cover 11 is stretched to form the stretched portion 116 as shown in FIG. 6B. . And the extending | stretching part 116 can accommodate the accommodating cover 14 with the convex part 113. FIG.

  Refer to FIG. 7A. FIG. 7A is a second side view of Example 2 of the LED backlight module including the extrusion cover. In the second embodiment, the reinforcing member 1D is used to improve the protection capability of the extrusion cover 11 against the LED element 15 and the circuit layer 12. As shown in FIG. 7A, the reinforcing member 1D is connected to the extrusion cover 11, and the circuit layer 12 is covered with the reinforcing member 1D. With the above structure, the reinforcing member 1D protects the circuit layer 12, and thus the protection capability of the extrusion cover 11 with respect to the LED element 15 and the circuit layer 12 is improved.

  Further, the reinforcing member 1D can be coupled onto the extrusion cover 11 with the aid of a coupling device. Refer to FIG. 7B. FIG. 7B is a third side view of Example 2 of the LED backlight module including the extrusion cover. As shown in FIG. 7B, the two coupling members 1E are used to couple the reinforcing member 1D onto the attachment portion 111 of the extrusion cover 11. When the reinforcing member 1D is coupled to the extrusion cover 11 by the two coupling members 1E, the circuit layer 12 is covered and protected by the reinforcing member 1D.

  So far, Example 2 of the LED backlight module 1 including the extrusion cover of the present invention has been described with reference to exploded views and side views. Next, the effect of Example 2 of the LED backlight module 1 provided with an extrusion cover is shown below.

  1. By housing the plurality of LED elements 15 and the light guide plate 23 with the extrusion cover 11 and the container 14, the LED element 15 is reliably protected and the LED element 15 is prevented from being damaged by an external impact. Can do.

  2. Since the LED element 15 is embedded in the perforation 142 and the first opening 1113 of the housing 14, when the light guide plate 23 is attached to the housing 14, the position of the LED element 15 is shifted due to an unexpected impact. It can prevent affecting the light collecting effect of the module.

3. In connection with the second effect described above, when the plurality of LED elements 15 are welded, the plurality of LED elements 15 can be positioned by the plurality of perforations 142 and the first openings 1113.

  4. Since the first thermal conduction band 19 and the second thermal conduction band 1A are provided on the front and back surfaces of the circuit layer 12, respectively, when the plurality of LED elements 15 emit light, the first thermal conduction band 19 and the second thermal conduction band The band 1A removes heat generated in the LED element from “bidirectional” on the front and back sides of the circuit layer 12, respectively.

  5. In relation to the effect of the fourth point described above, the second heat conduction band 1A has a flow-like end that assists the second heat conduction band 1A sticking to the bottom plate 21 of the main frame 2 and It helps to spread evenly on the bottom plate 21.

  6. The extrusion cover 11 further includes a mounting portion convex ear portion 1114 and a bottom portion convex ear portion 1123, whereby the extrusion cover 11 and the main frame 2 are easily attached.

  7. The extrusion cover 11 is further coupled to the reinforcing member 1D, and the reinforcing member 1D protects the circuit layer 12, thereby improving the protection capability of the extrusion cover 11 with respect to the LED element 15 and the circuit layer 12. Let

(Example 3)
The present invention further provides Example 3 of an LED backlight module with an extrusion cover. Please refer to FIG. 8 and FIG. 8 and 9 are an exploded view and a side view of Example 3 of the LED backlight module including the extrusion cover. As shown in FIG. 8, Example 3 of the LED backlight module 1 including an extrusion cover includes an extrusion cover 11, a first heat conduction band 19, a circuit layer 12, a plurality of LED elements 15, It consists of two heat conduction bands 1A.

  The extrusion cover 11 is provided on the side frame 22 and includes an attachment portion 111, two convex portions 113, a bottom portion 112, and a fixed support portion 114. The attachment portion 111 is connected to the bottom portion 112 and includes a plurality of first openings 1113. The two convex portions 113 are formed on the bottom portion 112, and the fixed support portion 114 faces the convex portion 113 and is formed at one end of the attachment portion 111. Moreover, the attachment part 111 and the bottom part 112 are provided with fixed thickness.

  The first heat conduction band 19 is an insulating heat conductive adhesive, and is attached to the outer surface of the attachment portion 111 and includes a plurality of second openings 191 facing the plurality of first openings 1113. The first heat conduction band 19 is further attached to the outer surface of the bottom portion 112. The circuit layer 12 is attached to the first heat conduction band 19. The plurality of LED elements 15 are provided on the circuit layer 12 while being passed through the plurality of first openings 1113 and the plurality of second openings 191, respectively. The plurality of LED elements 15 emit light to the light guide plate 23 accommodated in the extrusion cover 11. The second heat conduction band 1 </ b> A faces the first heat conduction band 19 and is attached to the circuit layer 12. Further, the end of the second heat conduction band 1A extends to the bottom plate 21 to form a flow-through shape.

  As shown in FIG. 9, in Example 3, the first opening 1113 has a certain depth. Accordingly, when the LED element 15 is provided in the circuit layer 12 through the first opening 1113 and the second opening 191, the LED element 15 is completely embedded in the first opening 1113. Further, the light guide plate 23 is accommodated and fixed in the extrusion cover 11 by being fitted into an accommodation space formed by the fixed support portion 114 and the convex portion 113. With the above structure, when the plurality of LED elements 15 emit light, the circuit layer 12 conducts the heat generated from the LED elements 15 to the first heat conduction band 19 and the second heat conduction band 1A, and further to the first heat conduction. The conduction band 19 transfers heat to the attachment portion 111 and the bottom portion 112, and the second heat conduction band 1 </ b> A conducts heat onto the side frame 22 and the bottom plate 21. As described above, the heat transmitted to the mounting portion 111 and the convex portion 113 is transmitted to the side frame 22 and the bottom plate 21 of the main frame 2 by heat conduction, and further, the heat is released into the air through the main frame 2. Is done. In addition, heat is evenly distributed to the bottom plate 21 by resuscitation at the end of the second heat conduction band 1A.

  Similarly, in order to improve the light condensing effect, as shown in FIGS. 8 and 9, in Example 3 of the LED backlight module 1 including the extrusion cover, the reflective layer 18 is provided in the attachment portion 111. It is done. Moreover, in order to make it easy to attach the LED backlight module 1 having an extrusion cover to the main frame 2, a plurality of second screw holes 1122 are further provided in the bottom portion 112. The second screw hole 1122 is provided in a concave groove formed by the two convex portions 113.

Example 4
The present invention further provides a fourth embodiment of the LED backlight module including the extrusion cover. Please refer to FIG. 10 and FIG. 10 and 11 are an exploded view and a side view of Example 4 of the LED backlight module including the extrusion cover. As shown in FIG. 10, the configuration of Example 4 of the LED backlight module 1 including the extrusion cover is similar to that of Example 3. However, in Example 4, the extrusion cover 11 further includes a folding portion 115, and the folding portion 115 faces the fixed support portion 114 and is formed at one end of the attachment portion 111. As shown in FIG. 11, after the circuit layer 12 is affixed to the first heat conduction band 19, the circuit layer 12 is sandwiched and fixed by the attachment portion 111 by folding the folding portion 115. As described above, when the extrusion cover 11 is attached to the main frame 2, it is possible to prevent a situation in which the circuit layer 12 of the attachment portion 111 is removed due to an external impact.

  So far, Example 3 and Example 4 of the LED backlight module 1 including the extrusion cover of the present invention have been described with reference to exploded views and side views. Next, the effect of Example 3 and Example 4 of the LED backlight module 1 provided with an extrusion cover is shown below.

  1. By accommodating the plurality of LED elements 15 and the light guide plate 23 in the extrusion cover 11, the LED elements 15 can be reliably protected and the LED elements 15 can be prevented from being damaged by an external impact.

  2. Since the light guide plate 23 is sandwiched and fixed in the extrusion cover 11 by the fixed support portion 114 and the convex portion 113, it is possible to prevent the position of the light guide plate from being shifted due to the impact of the backlight module.

  3. Since the first heat conduction band 19 and the second heat conduction band 1A are provided on the front and back surfaces of the circuit layer 12, respectively, when the plurality of LED elements 15 emit light, the first heat conduction band 19 and the second heat conduction band The band 1A removes heat generated in the LED element from “bidirectional” on the front and back sides of the circuit layer 12, respectively.

  4. In relation to the effect of the third point described above, the flow-like end provided in the second heat conduction band 1A helps the second heat conduction band 1A stick to the bottom plate 21 of the main frame 2 and It helps to spread evenly on the bottom plate 21.

  5. The folding portion 115 can fix the circuit layer 12 provided with the plurality of LED elements 15 sandwiched between the outer surfaces of the extrusion cover 11. As described above, when the extrusion cover 11 is attached to the main frame 2, it is possible to prevent a situation in which the circuit layer 12 is removed due to an external impact.

  Regarding Example 4 of the LED backlight module 1 including the above-described extrusion-molded cover, a supplementary explanation is necessary here in that the folding portion 115 is not limited to being formed at the upper end of the attachment portion 111. . Please refer to FIG. FIG. 12 is a second side view of Example 4 of the LED backlight module 1 including an extrusion cover. As shown in FIG. 12, the folding part 115 can be formed at the lower end of the attachment part 111. Thereby, the circuit layer 12 can be sandwiched and fixed to the outer surface of the attachment portion 111 by a folding method.

(Example 5)
In order to further expand the use range of the LED backlight module including the extrusion cover of the present invention, the inventor of the present invention further provides a fifth embodiment of the LED backlight module including the extrusion cover. Refer to FIG. 13A. FIG. 13A is a side view showing Example 5 of an LED backlight module including the extrusion cover of the present invention. As shown in FIG. 13A, Example 5 of the LED backlight module 1 including an extrusion cover includes an extrusion cover 11a, a circuit layer 12a, an insulating heat conductive layer 17a, a reflective element 14a, and a plurality of LED elements. 15a and the heat conductive layer 16a.

  The extrusion cover 11a is provided on the side frame 22 of the main frame 2, and the surface thereof is subjected to surface treatment by anodizing or coating acid-alkali treatment. The extrusion cover 11a includes an attachment portion 111a, two convex portions 113a, and a bottom portion 112a. The attachment portion 111a is connected to the bottom portion 112a, and the two convex portions 113a are formed on the bottom portion 112a. Further, the attachment portion 111a and the bottom portion 112a have a certain thickness.

  The circuit layer 12a is printed on the surface of the attachment portion 111a. The insulating heat conductive layer 17a is affixed to the surface of the circuit layer 12a, and is stretched and affixed to the inner surface of the extrusion cover 11a. The insulating heat conductive layer 17a includes a plurality of first hole portions 171a. As shown in FIG. 13A, the reflective element 14 a is bent to form an L-shaped cover, faces the circuit layer 12 a and is provided on the attachment portion 111 a, and the reflective element 14 a is used to accommodate the light guide plate 23. . The reflection element 14a includes a plurality of second holes 141a facing the plurality of first holes 171a, and a heat conductive adhesive is applied to a part of the first surface 142a of the reflection element 14a to reflect the reflection. The second surface 143a of the element 14a is provided with a separation member 13a including a plurality of third hole portions 131a, and the plurality of third hole portions 131a face the plurality of second hole portions 141a.

  The plurality of LED elements 15a are respectively passed through the plurality of third hole portions 131a, the plurality of second hole portions 141a, and the plurality of first hole portions 171a, and are provided on the circuit layer 12a. The plurality of LED elements 15 a emit light and enter the light guide plate 23. Also, as shown in FIG. 13A, one end of the reflector 14a forms a reflector flow 145a, so that when the light guide plate 23 is accommodated in an L-shaped cover formed by the reflector 14a, the reflector 145a Since it sticks to 23 and covers, it can prevent that light leaks from the clearance gap between the light-guide plate 23 and an L-shaped cover. Moreover, the heat conductive layer 16a is provided on the outer surface of the extrusion cover 11a, and one end of the heat conductive layer 16a forms a heat conductive flow recirculating portion 161a.

  In Example 5 of the LED backlight module 1 having an extrusion cover, the separation member 13a has a certain thickness. Accordingly, when the LED element 15a is provided on the circuit layer 12a through the third hole 131a, the second hole 141a, and the first hole 171a, the LED element 15a is disposed in the third hole 131a. Completely embedded. Further, when the extrusion cover 11 a is provided on the main frame 2, the heat conduction flow recirculating portion 161 a is stuck on the bottom plate 21 of the main frame 2. Most importantly, when the plurality of LED elements 15a emit light, the circuit layer 12a transmits the heat generated from the LED elements 15a onto the insulating heat conductive layer 17a and the mounting portion 111a, and the insulating heat conductive layer 17a and the mounting portion. 111a conducts heat to the entire extrusion cover 11a, and further, the heat conducting layer 16a conducts heat to the side frame 22 of the main frame 2, and the heat conducting reflow part 161a transmits heat to the bottom plate 21. The heat is uniformly distributed on the bottom plate 21.

  Moreover, in order to make it easier to assemble the product, in Example 5 of the LED backlight module 1 including an extrusion cover, the reflector 14a further includes at least one notch 144a. The reflective plate 14a can be bent by the notches 144a to form a portal container or an L-shaped container. Refer to FIG. 13B. FIG. 13B is a second side view of Example 5 of the LED backlight module including the extrusion cover. As shown in FIG. 13B, an extending portion 116a is added to the extrusion cover 11a, and the extending portion 116a is formed by extending from the attachment portion 111a. The extending portion 116 is used for stably fixing the reflective element 14a to the attachment portion 111a.

  Reference is also made to FIG. 14A. FIG. 14A is a side view of Example 6 of an LED backlight module including an extrusion cover according to the present invention. As shown in FIG. 14A, the inventor of the present invention further provides Example 6 of the LED backlight module 1 including an extrusion cover. Example 6 of the LED backlight module 1 including an extrusion cover includes an extrusion cover 11b, an insulating heat conductive layer 17b, a circuit layer 12b, a reflective element 14b, a plurality of LED elements 15b, and a heat conductive layer 16b. And make up.

  The extrusion cover 11b is provided on the side frame 22 of the main frame 2, and includes an attachment portion 111b, two convex portions 113b, and a bottom portion 112b. The attachment portion 111b is connected to the bottom portion 112b and includes a plurality of first hole portions 1111b, and the two convex portions 113b are formed on the bottom portion 112b. Further, the attachment portion 111b and the bottom portion 112b have a certain thickness. The insulating heat conductive layer 17b is attached to the outer surface of the extrusion cover 11b and includes a plurality of second hole portions 171b facing the plurality of first hole portions 1111b. The circuit layer 12b is provided on the insulating heat conductive layer 17b.

  As shown in FIG. 14A, the reflective element 14b is bent to form an L-shaped cover, faces the circuit layer 12b, and is provided on the attachment portion 111b. The reflective element 14b is used to accommodate the light guide plate 23. It is done. The reflective element 14b includes a plurality of third hole portions 141b facing the plurality of first hole portions 1111b. A part of the first surface 142b of the reflective element 14b is coated with a heat conductive adhesive, and the reflective element 14b. A separation member 13b having a plurality of fourth holes 131b is provided on the second surface 143b. The plurality of fourth hole portions 131b face the plurality of third hole portions 141b.

  The plurality of LED elements 15b are respectively passed through the plurality of fourth hole portions 131b, the plurality of third hole portions 141b, the plurality of first hole portions 1111b, and the plurality of second hole portions 171b, and within the circuit layer 12b. Provided on the surface. Note that the plurality of LED elements 15 b emit light and enter the light guide plate 23. The heat conduction layer 16b is provided on the outer surface of the circuit layer 12b, and one end of the heat conduction layer 16b forms a heat conduction flow recirculation part 161b. Further, as shown in FIG. 14A, one end of the reflecting plate 14b forms a reflecting plate flow 145b. Therefore, when the light guide plate 23 is accommodated in the L-shaped cover formed by the reflecting plate 14b, the reflecting plate flow 145b is guided. Since it sticks to and covers the optical plate 23, it is possible to prevent light from leaking from the gap between the light guide plate 23 and the L-shaped cover.

(Example 6)
In Example 6 of the LED backlight module 1 having an extrusion cover, the separation member 13b has a constant thickness. Accordingly, when the LED element 15b is provided in the circuit layer 12b through the fourth hole 131b, the third hole 141b, the first hole 1111b, and the second hole 171b, the LED element 15b It is completely embedded in 131b. Further, when the extrusion cover 11 b is provided on the main frame 2, the heat conduction flow recirculating portion 161 b is stuck on the bottom plate 21 of the main frame 2. Most importantly, when the plurality of LED elements 15b emit light, the circuit layer 12b conducts heat generated from the LED elements 15b onto the insulating heat conductive layer 17b and the extrusion cover 11b, and further, the heat conductive layer 16b transfers heat. The heat is transmitted to the side frame 22 of the main frame 2 and the heat conduction flow recirculating portion 161b conducts heat onto the bottom plate 21, so that the heat is evenly distributed on the bottom plate 21.

  Similarly to the above-described fifth embodiment, also in the sixth embodiment of the LED backlight module including the extrusion cover, the reflector 14b includes at least one notch 144b in order to make the product easier to assemble. The reflecting plate 14b can be bent by the notches 144b to form a gate-shaped container or an L-shaped container. Finally, refer to FIG. 14B. FIG. 14B is a second side view of Example 6 of the LED backlight module including the extrusion cover. As shown in FIG. 14B, the extending part 116b is added to the extrusion cover 11b, and the extending part 116b is formed by extending from the attachment part 111b. The extending portion 116 is used to stably fix the reflective element 14b to the attachment portion 111b.

  By the above Example, description of the LED backlight module provided with the extrusion molding cover of this invention was performed completely and clearly. Further, it should be emphasized here that the above detailed description is only a specific description of the working examples of the present invention, and these examples are not intended to request the utility model registration of the present invention. It does not limit the range. Any changes that have the same effect as long as they do not depart from the technical spirit of the present invention shall be included in the scope of the claims of the present invention.

DESCRIPTION OF SYMBOLS 1 LED backlight module 100 ', 11''provided with an extrusion cover 2 Main frame 11, 11a, 11b Extrusion cover 110', 21 Bottom plate 111, 111a, 111b Attachment part 1111 1st ditch | groove 1111b, 171a 1st Hole 1112 First screw hole 1113 First opening 1114 Mounting portion convex ear 1115 Third screw hole 112 Bottom 1121 Second concave groove 1122 Second screw hole 1123 Bottom convex ear 1124 Fourth screw holes 113, 113a, 113b, 305 ′ convex portion 114 fixed support portion 115 folding portions 116, 116a, 116b extending portions 12, 12a, 12b circuit layer 12 ″ backlight module 120 ′, 140 ′, 160 ′, 180 ′ side 121 ”cover 220 ′ , 122 ″ circuit board 123 ″, 15, 15a, 15b, 210 ′ LED element 1 Thermal conduction bands 13a, 13b Separating members 131a, 141b Third hole 131b Fourth hole 14 Containers 14a, 14b Reflecting element 141 Housing recesses 141a, 171b Second hole 1411 Flow resuscitation part 142 Perforations 142a, 142b First surface 143a , 143b Second surface 144a, 144b Notch 145a, 145b Reflector plate flow 16 First elastic heat conduction medium 16a, 16b Heat conduction layer 161a, 161b Heat conduction flow portion 17 Second elastic heat conduction medium 17a, 17b Insulating heat conduction layer 18 Reflective layer 19 First heat conduction band 191 Second opening 1A Second heat conduction band 1B Insulating piece 1D Reinforcing member 1E Joining member 200 'Bar lamp 22 Side frame 23, 300' Light guide plate 231 Light incident surface

Claims (29)

LED backlight comprising an extrusion cover comprising an extrusion cover, a circuit layer, a heat conduction band, a container, a plurality of LED elements, a first elastic heat conduction medium, and a second elastic heat conduction medium A module,
The LED backlight module having the extrusion cover is attached in a main frame having a bottom plate and at least one side frame, and the main frame is attached in a liquid crystal display.
The extrusion cover is provided on the side frame, and the extrusion cover is a metal material,
And the surface is subjected to a surface treatment, the extrusion cover includes an attachment portion, two convex portions, and a bottom portion,
The attachment part is connected to the bottom part, the two convex parts are formed on the bottom part, and the attachment part and the bottom part have a certain thickness,
The circuit layer is printed on the surface of the mounting portion, and at the same time, the circuit layer is also printed on the surface of the convex portion,
The heat conduction band is provided on the convex portion and the bottom portion, and is provided on the bottom plate by extending.
The container is provided on the attachment portion, and includes a housing recess and a plurality of perforations facing the housing recess, and the light guide plate accommodates the light incident surface in the housing recess so that the housing body includes the housing. Fixed to
The plurality of LED elements are respectively passed through the plurality of perforations and provided on the circuit layer, and the plurality of LED elements emit light and enter the light incident surface of the light guide plate,
The first elastic heat transfer medium is provided in a first groove on the outer surface of the attachment part,
The second elastic heat transfer medium is provided in a second groove on the outer surface of the bottom,
Among them, the perforation has a certain depth, so that when the LED element is passed through the perforation and provided on the circuit layer, the LED element is completely embedded in the perforation,
When the plurality of LED elements emits light, the circuit layer printed on the attachment portion and the inner surface of the convex portion transmits heat generated from the LED element onto the heat conduction band, the attachment portion, and the convex portion, and The heat conduction band conducts heat to the bottom plate, whereby heat is evenly distributed on the bottom plate, and is conducted to the mounting portion and the convex portion by the first elastic heat conduction medium and the second elastic heat conduction medium. The heat is transmitted to the side frame and the bottom plate of the main frame by heat conduction, and is further released into the air through the main frame.
LED backlight module with an extrusion cover.   The attachment portion further includes a plurality of first screw holes, and the plurality of first screw holes are provided in the first concave groove to be used for screwing the extrusion cover to the side frame. The bottom portion further includes a plurality of second screw holes, and the plurality of second screw holes are provided in the second concave groove for use in screwing the extrusion cover to the bottom plate. An LED backlight module comprising the extrusion cover according to claim 1, wherein the LED backlight module is provided.   The extrusion molding according to claim 1, wherein the first elastic heat conducting medium is cut into a plurality of stages, a thin metal layer is laid on the surface, and the thin metal layer has a high heat conduction coefficient. LED backlight module with a cover.   The extrusion molding according to claim 1, wherein the second elastic heat conducting medium is cut into a plurality of stages, a thin metal layer is laid on the surface, and the thin metal layer has a high heat conduction coefficient. LED backlight module with a cover. The LED backlight module including the extrusion cover further includes a reflective layer and a plurality of insulating pieces,
The reflective layer is provided in the container;
The plurality of insulating pieces are respectively provided on inner walls of the plurality of perforations,
Among them, when the LED element is welded to the circuit layer through the perforation, the insulating piece can prevent the solder from diffusing out from the inner side wall of the perforation. An LED backlight module comprising the extrusion cover according to 1.   The LED backlight having an extrusion cover according to claim 5, wherein the container is one of a metal cover, a reflector cover, or a composite cover of a metal and a reflector. module.   One end of the accommodating recess forms a flow-relief portion, and when the light guide plate is accommodated / fixed in the container, the resuscitation portion sticks to the light guide plate, thereby allowing light to pass through the gap between the accommodation recess and the light guide plate. The LED backlight module comprising the extrusion cover according to claim 6, wherein the LED backlight module does not leak from the LED cover.   The extrusion molding cover further includes an extending portion extending from the attachment portion, and the extending portion increases a circuit arrangement area, thereby further expanding an arrangement area of the circuit layer. An LED backlight module comprising the extrusion cover described in 1. An LED backlight module comprising an extrusion cover comprising an extrusion cover, a first thermal conduction band, a circuit layer, a container, a plurality of LED elements, and a second thermal conduction band,
The LED backlight module having the extrusion cover is attached in a main frame having a bottom plate and at least one side frame, and the main frame is attached in a liquid crystal display.
The extrusion cover is made of a metal material and is provided on the side frame, and includes an attachment portion, two convex portions, and a bottom portion, and the attachment portion is connected to the bottom portion and includes a plurality of portions. A first opening, the two convex portions are formed on the bottom, the attachment portion and the bottom have a certain thickness,
The first heat conduction band is attached to the outer surface of the mounting portion and includes a plurality of second openings facing the plurality of first openings, and at the same time, the first heat conduction band is formed on the outer surface of the bottom portion. In addition,
The circuit layer is attached to the first heat conduction band,
The container is provided on the attachment portion, and includes a housing recess and a plurality of perforations facing the housing recess, and the light guide plate accommodates the light incident surface in the housing recess so that the housing body includes the housing. Fixed to
The plurality of LED elements are respectively passed through the plurality of perforations, the plurality of first openings, and the plurality of second openings, and provided on the circuit layer, and the plurality of LED elements emit light. Emitted and made incident on the light incident surface of the light guide plate,
The second heat conduction band is made of a metal material and faces the first heat conduction band, and is attached to the circuit layer. The end of the second heat conduction band extends to the bottom plate to form a flow-through shape. ,
Among them, the perforation and the first opening have a certain depth, and when the LED element is provided on the circuit layer through the perforation, the first opening and the second opening, the LED element is in the perforation and the first opening. Completely embedded,
When the plurality of LED elements emit light, the circuit layer transfers heat generated from the LED elements to the first heat conduction band and the second heat conduction band, and the first heat conduction band further transfers the heat to the attachment part and the bottom part. The second heat conduction band conducts heat on the side frame and the bottom plate, and the heat conducted to the mounting part and the convex part reaches the side frame and the bottom plate of the main frame by heat conduction. An LED backlight module having an extruded cover, wherein the LED backlight module is further transmitted to the air through the main frame, and heat is evenly distributed to the bottom plate by resuscitation at the end of the second heat conduction band.   10. The extrusion molding according to claim 9, wherein the bottom portion further includes a plurality of second screw holes, and the plurality of second screw holes are provided in a concave groove formed by the two convex portions. LED backlight module with a cover. The LED backlight module including the extrusion cover further includes a reflective layer and a plurality of insulating pieces,
The reflective layer is provided in the container;
The plurality of insulating pieces are respectively provided on inner walls of the plurality of perforations,
Among them, when the LED element is welded to the circuit layer through the perforation, the insulating piece can prevent the solder from diffusing out from the inner side wall of the perforation. An LED backlight module comprising the extrusion cover according to claim 9.   The mounting portion further includes a mounting portion convex ear portion, the mounting portion convex ear portion includes a plurality of third screw holes, the bottom portion further includes a bottom convex ear portion, and the bottom convex ear portion includes a plurality of bottom convex ear portions. The LED backlight module comprising the extrusion cover according to claim 9, comprising the fourth screw hole.   The LED backlight having an extrusion cover according to claim 9, wherein the container is one of a metal cover, a reflector cover, or a composite cover of a metal and a reflector. module.   One end of the accommodating recess forms a flow-relief portion, and when the light guide plate is accommodated / fixed in the container, the resuscitation portion sticks to the light guide plate, thereby allowing light to pass through the gap between the accommodation recess and the light guide plate. The LED backlight module comprising the extrusion cover according to claim 9, wherein the LED backlight module does not leak from the LED cover.   The LED backlight module including the extrusion cover according to claim 9, wherein the extrusion cover further includes an extending portion extending from the attachment portion.   The LED backlight module including the extrusion cover further includes a reinforcement member coupled to the extrusion cover, and the reinforcement member enhances the protection capability of the extrusion cover against the LED element and the circuit layer. An LED backlight module comprising the extrusion cover according to claim 9.   The LED backlight module comprising the extrusion cover further comprises at least one coupling member used for coupling a reinforcing member onto the extrusion cover. LED backlight module with a cover. An LED backlight module comprising an extrusion cover comprising an extrusion cover, a first heat conduction band, a circuit layer, a plurality of LED elements, and a second heat conduction band,
The LED backlight module having the extrusion cover is attached in a main frame having a bottom plate and at least one side frame, and the main frame is attached in a liquid crystal display.
The extrusion cover is made of a metal material and is provided on the side frame, and includes an attachment portion, two convex portions, a bottom portion, and a fixed support portion,
The attachment portion is connected to the bottom portion and includes a plurality of first openings, the two convex portions are formed on the bottom portion, the fixed support portion faces the convex portion, and one end of the attachment portion The mounting part and the bottom part have a certain thickness,
The first heat conduction band is attached to the outer surface of the mounting portion and includes a plurality of second openings facing the plurality of first openings, and at the same time, the first heat conduction band is formed on the outer surface of the bottom portion. In addition,
The circuit layer is attached to the first heat conduction band,
The plurality of LED elements are respectively passed through the plurality of first openings and the plurality of second openings and provided on the circuit layer, and the plurality of LED elements are accommodated in an extrusion cover. Emit light to the light guide plate,
The second heat conduction band is made of a metal material and faces the first heat conduction band, and is attached to the circuit layer. The end of the second heat conduction band extends to the bottom plate to form a flow-through shape. ,
Among them, the first opening has a certain depth, and when the LED element is provided on the circuit layer through the first opening and the second opening, the LED element is completely embedded in the first opening,
The light guide plate is accommodated and fixed in the extrusion molding cover by fitting into the accommodation space formed by the fixed support portion and the convex portion,
When the plurality of LED elements emit light, the circuit layer transfers heat generated from the LED elements to the first heat conduction band and the second heat conduction band, and the first heat conduction band further transfers the heat to the attachment part and the bottom part. The second heat conduction band conducts heat on the side frame and the bottom plate, so that the heat conducted to the mounting part and the convex part is conducted on the side frame and the bottom plate of the main frame by heat conduction. The LED backlight module having an extruded cover, wherein the LED backlight module has an extruded cover, wherein the heat is evenly distributed to the bottom plate by resuming at the end of the second heat conduction band.   The extrusion according to claim 18, wherein the bottom portion further includes a plurality of second screw holes, and the plurality of second screw holes are provided in a groove formed by the two protrusions. LED backlight module with a cover. The LED backlight module including the extrusion cover further includes a reflective layer and a plurality of insulating pieces,
The reflective layer is provided in the container;
The plurality of insulating pieces are respectively provided on inner walls of the plurality of perforations,
Among them, when the LED element is welded to the circuit layer through the perforation, the insulating piece can prevent the solder from diffusing out from the inner side wall of the perforation. 18. An LED backlight module comprising the extrusion cover according to 18. An LED backlight module comprising an extrusion cover comprising an extrusion cover, a first heat conduction band, a circuit layer, a plurality of LED elements, and a second heat conduction band,
The LED backlight module having the extrusion cover is attached in a main frame having a bottom plate and at least one side frame, and the main frame is attached in a liquid crystal display.
The extrusion cover is made of a metal material and is provided on the side frame, and includes an attachment portion, two convex portions, a bottom portion, a fixed support portion, and a folding portion, The attachment portion is attached to the bottom portion and includes a plurality of first openings, the two convex portions are formed on the bottom portion, the fixed support portion faces the convex portion, and one end of the attachment portion The folding part faces the fixed support part and is formed at one end of the attachment part, and the attachment part and the bottom part have a constant thickness,
The first heat conduction band is attached to the outer surface of the mounting portion and includes a plurality of second openings facing the plurality of first openings, and at the same time, the first heat conduction band is formed on the outer surface of the bottom portion. Stick to
The circuit layer is attached to the first heat conduction band, and after the circuit layer is attached to the first heat conduction band, the circuit layer is sandwiched on the attachment part by folding the folding part. Fixed,
The plurality of LED elements are respectively passed through the plurality of first openings and the plurality of second openings and provided on the circuit layer, and the plurality of LED elements are housed in an extrusion cover. Emit light to the light guide plate,
The second heat conduction band is made of a metal material, faces the first heat conduction band and sticks on the folded portion, and the end of the second heat conduction band extends to the bottom plate to form a flowing shape. And
Among them, the first opening has a certain depth, so that when the LED element is provided in the circuit layer through the first opening and the second opening, the LED element is completely embedded in the first opening. And
The light guide plate is accommodated and fixed in the extrusion molding cover by fitting into the accommodation space formed by the fixed support portion and the convex portion,
When the plurality of LED elements emit light, the circuit layer conducts heat generated from the LED elements to the first heat conduction band and the second heat conduction band. Conducted on the bottom, the second heat conduction band conducts heat on the side frame and the bottom plate, so that the heat conducted to the mounting part and the convex part is caused by heat conduction to the side frame of the main frame. Provided with an extruded cover, characterized in that it is transferred onto the bottom plate, further released into the air by the main frame, and heat is evenly distributed to the bottom plate by resuscitation at the end of the second heat conduction zone LED backlight module.   The extrusion molding according to claim 21, wherein the bottom portion further includes a plurality of second screw holes, and the plurality of second screw holes are provided in a concave groove formed by the two convex portions. LED backlight module with a cover. The LED backlight module including the extrusion cover further includes a reflective layer and a plurality of insulating pieces,
The reflective layer is provided in the container;
The plurality of insulating pieces are respectively provided on inner walls of the plurality of perforations,
Among them, when the LED element is welded to the circuit layer through the perforation, the insulating piece can prevent the solder from diffusing out from the inner side wall of the perforation. An LED backlight module comprising the extrusion cover according to 21. An LED backlight module comprising an extrusion cover comprising an extrusion cover, a circuit layer, an insulating heat conductive layer, a reflective element, a plurality of LED elements, and a heat conductive layer,
The LED backlight module having the extrusion cover is attached in a main frame having a bottom plate and at least one side frame, and the main frame is attached in a liquid crystal display.
The extrusion cover is made of a metal material and is provided on the side frame. The surface of the extrusion cover is subjected to surface treatment. The extrusion cover includes an attachment portion, two convex portions, and a bottom portion. The attachment portion is connected to the bottom portion, the two convex portions are formed on the bottom portion, and the attachment portion and the bottom portion have a certain thickness,
The circuit layer is printed on the surface of the attachment portion,
The insulating heat conductive layer sticks to the surface of the circuit layer, and extends and sticks to the inner surface of the extrusion cover. Among them, the insulating heat conductive layer includes a plurality of first holes,
The reflective element includes a plurality of second hole portions facing the circuit layer, provided in the attachment portion, and facing the plurality of first hole portions,
A part of the first surface of the reflection element is coated with a heat conductive adhesive, and a separation member having a plurality of third holes is provided on the second surface of the reflection element, and the plurality of third holes The portion faces the plurality of second holes,
The plurality of LED elements are respectively provided on the circuit layer through the plurality of third hole portions, the plurality of second hole portions, and the plurality of first hole portions, and the plurality of LED elements emit light. Emitted and made incident on the light guide plate,
The heat conductive layer is a metal material and is provided on the outer surface of the extrusion cover, and one end of the heat conductive layer forms a heat conduction flow re-energized part,
Among them, the separation member has a certain thickness, whereby when the LED element is provided on the circuit layer through the third hole, the second hole, and the first hole, The element is completely embedded in the third hole,
Among them, when the extrusion cover is provided on the main frame, the heat conduction flow part sticks on the bottom plate of the main frame,
When the plurality of LED elements emit light, the circuit layer conducts heat generated from the LED elements onto the insulating heat conductive layer and the mounting portion, and the insulating heat conductive layer and the mounting portion extrude heat. The heat conduction layer conducts heat to the side frame of the main frame, and the heat conduction part conducts heat on the bottom plate, so that heat is evenly distributed on the bottom plate. An LED backlight module comprising an extrusion cover. The reflector further comprises at least one notch and a reflector drainage,
The reflector can be bent by the notches to form a container,
The reflector plate is formed at one end of a reflector, and when the light guide plate is disposed in the container formed by the reflector, the reflector plate is completely attached to and covered with the light guide plate. An LED backlight module comprising the extrusion cover according to claim 24.   The LED backlight module including the extrusion cover according to claim 24, wherein the extrusion cover further includes an extension part formed by extending the attachment part. An LED backlight module comprising an extrusion cover comprising an extrusion cover, an insulating heat conductive layer, a circuit layer, a reflective element, a plurality of LED elements, and a heat conductive layer,
The LED backlight module having the extrusion cover is attached in a main frame having a bottom plate and at least one side frame, and the main frame is attached in a liquid crystal display.
The extrusion cover is made of a metal material and is provided on the side frame, and includes an attachment portion, two convex portions, and a bottom portion, and the attachment portion is connected to the bottom portion. And a plurality of first hole portions, the two convex portions are formed on the bottom portion, the attachment portion and the bottom portion have a certain thickness,
The insulating heat conductive layer is attached to the outer surface of the extrusion cover and includes a plurality of second holes facing the plurality of first holes,
The circuit layer is provided on the insulating heat conductive layer,
Among them, the separation member has a certain thickness, whereby the LED element is passed through the fourth hole portion, the third hole portion, the first hole portion, and the second hole portion to the circuit layer. When provided, the LED element is completely embedded in the fourth hole,
Among them, when the extrusion cover is provided on the main frame, the heat conduction flow part sticks on the bottom plate of the main frame,
When the plurality of LED elements emit light, the circuit layer conducts heat generated from the LED elements onto the insulating heat conductive layer and the extrusion cover, and the heat conductive layer further transfers heat to a side of the main frame. An LED backlight module having an extruded cover, wherein the LED frame is conducted to a side frame, and the heat conduction unit conducts heat on the bottom plate, whereby heat is uniformly distributed to the bottom plate. . The reflector further comprises at least one notch and a reflector drainage,
The reflector can be bent by the notches to form a container,
The reflector plate is formed at one end of a reflector, and when the light guide plate is disposed in the container formed by the reflector, the reflector plate is completely attached to and covered with the light guide plate. An LED backlight module comprising the extrusion cover according to claim 27.   28. The LED backlight module including the extrusion cover according to claim 27, wherein the extrusion cover further includes an extension part formed by extending the attachment part.

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