JP3168705B2 - Bonding method for narrow pitch lead device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for bonding a narrow pitch lead device, and more particularly to a method for easily maintaining the flatness of a pressing tool used in this method, and the durability of the pressing tool. The present invention relates to a method for bonding a narrow-pitch lead device having improved characteristics.

[0002]

2. Description of the Related Art In recent years, panel elements such as liquid crystal panels and plasma display panels have been frequently used as displays for computers and word processors. In this panel element, a circuit is provided on the inner surface of a set of laminated glass plates, and a large number of panel electrodes are exposed on the surface of the outer edge portion other than the corners. The panel electrodes are usually arranged in rows with a narrow pitch of several tens of microns, and a narrow pitch lead device such as a TAB device having similar narrow pitch leads is bonded to the panel electrodes.

One of the means for bonding the leads of the narrow pitch lead device to the panel electrodes is made of a photo-curable resin, particularly an ultraviolet-curable insulating resin. This conventional means will be described with reference to FIGS.

In FIGS. 7 to 9, PN denotes a panel element,
PNb is a panel electrode arranged at the edge of the panel element PN through the narrow pitch, D is a TAB device, P is a chip of this device D, F is a film of polyimide or the like, and L is this device D The lead and Fa are films for preventing the tip of the lead L from scattering. Reference numeral 1 denotes a pressure tool, 3 denotes a nozzle for applying the ultraviolet curable resin B, and 4 denotes an irradiator for irradiating ultraviolet UV.

First, as shown in FIG. 7, the lead L and the panel electrode PNb are polymerized, and an ultraviolet curable resin B is applied on the lead L. Next, as shown in FIG.
Are pressed directly by the bottom surface 1a and the downward slopes 1b and 1c of the pressure tool 1. Then, the resin B is irradiated with ultraviolet rays UV by the irradiator 4 to cure the resin B. Then, the pressing is released to complete the bonding (FIG. 9).

[0006]

In order to uniformly press the upper surfaces of a large number of leads, it is indispensable to maintain a high flatness of the pressing surface including the bottom surface and the downward slope of the pressing tool. However, according to the above conventional means, there is a problem that it is difficult to maintain the flatness of the pressing surface. That is, in the conventional means, the pressing surface of the pressing tool is directly in contact with the upper surfaces of a large number of leads, and the pressing tool has a certain elasticity in order to apply an equal force to each lead. It must be formed of a soft material such as a resin.

However, it is generally very difficult to process the pressing surface of a pressing tool made of a material having elasticity so as to have a high flatness (several μm). In addition, since the pressing surface having elasticity comes into direct pressure contact with a lead that is harder than the pressing surface, an indentation is left on the pressing surface, flatness is easily reduced, and it is necessary to frequently change the pressing tool. there were. Further, since the pressing surface is directly pressed against the curable resin, the curable resin adheres to the pressing surface, and the flatness is reduced. Therefore, it is necessary to constantly clean the pressing surface. As described above, according to the conventional means, it is difficult to maintain the flatness of the pressing surface of the pressing tool, and there is a problem that the durability of the pressing tool is low.

Further, after bonding, the leads and the resin are exposed to the outside, and there is a problem that the durability is low.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, the present invention provides a narrow-pitch lead device which can easily maintain the flatness of a pressing surface of a pressing tool and can improve the durability of the pressing tool and a panel element after bonding. It is an object of the present invention to provide a bonding method.

[0010]

According to the present invention, there is provided a process of aligning a lead group of a narrow pitch lead device with a panel electrode group of a panel element, and applying a photo-curing resin to the panel electrode group to form a panel electrode group. and the gap between the lead group, a process of interposing the light-curing resin, as well as placing the sheet over bets on the photocurable on the resin, the sheet over preparative this was pressed by the pressing tool, these The bonding method includes a process of curing the photocurable resin while keeping the lead group and the panel electrode group pressed against each other, and a process of releasing the pressing. Also preferably, the pressing is
After release, the sheet is left on the photocurable resin. Ma
Preferably, the sheet has moisture resistance and heat resistance, and
It has a thermal expansion coefficient similar to that of the photocurable resin.

[0011]

According to the above arrangement, the pressing force of the pressure tool, through the sheet <br/> over preparative spans leads or photocurable resin. As described above, since the pressing surface of the pressing tool does not directly contact the lead or the photocurable resin, the flatness of the pressing surface of the pressing tool is not easily reduced, and the durability can be improved. Also, if a sheet having moisture resistance and heat resistance and having a thermal expansion coefficient similar to that of the photocurable resin is left on the resin even after bonding, the sheet is deformed similarly to the photocurable resin.
Therefore, the joint between the lead and the panel element is protected.

[0012]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a bonding apparatus used in the bonding method of the present embodiment, and FIGS. 2 to 6 are process explanatory views of the bonding method of the present embodiment.

In FIG. 1, D is a TAB device, P is a chip, L is a lead, F is a film made of polyimide or the like, and Fa is a film for preventing the tip of the lead L from coming apart. PN is a panel element such as a liquid crystal panel or a plasma panel. This panel element PN is composed of a transparent and plate-shaped panel main material PNa and a panel electrode PNb formed in a row on the edge surface of the panel main material PNa. And

Reference numeral H denotes a transfer head having a base end mounted on a table movable in XYZθ directions (not shown) and having a nozzle N at its front end for sucking the TAB device D.

Referring to FIG. 4 and FIG.
Is a pressing tool, 1a is a lower surface of the pressing tool 1,
1b and 1c are downward slopes, and 1P is this downward slope 1b and 1c.
The suction hole 1 </ b> P communicates with the vacuum system 5. S is a sheet made of polyethylene or the like, which serves as a cushion against the pressing force when pressed by the pressing tool 1, so that no indentation is formed on the lower surface 1 a of the pressing tool 1 and no excessive force is applied to the lead L. You can do so. Therefore, according to the present embodiment, even if the hardness of the lower surface 1a of the pressing tool 1 is increased, no inconvenience is likely to occur, and the durability of the pressing tool 1 can be improved.

The sheet S has moisture resistance and heat resistance, and has a thermal expansion coefficient similar to that of the photocurable resin. Therefore, this sheet S is
If the lead L and the panel electrode PNb are left on the photocurable resin after bonding, as the resin hardens, the sheet S also deforms in the same manner as the resin. To protect the part.

If the sheet S has the property of reflecting the violet ray UV as shown by the dashed arrow (indicating the ultraviolet ray UV) in FIG. 5, the ultraviolet curable resin B is quickly cured to the inside. This is more preferable because it can be easily performed. The moisture-proof sheet S is prepared in a predetermined place as shown in the lower part of FIG. 1, and the pressing tool 1 is moved to press the prepared sheet S as described above, 5, the sheet S is sucked by the suction hole 1P. Reference numeral 2 denotes a dispenser into which the ultraviolet curable resin B has been injected, and reference numeral 3 denotes a nozzle thereof. Reference numeral 4 denotes an ultraviolet irradiator.

The structure used in the bonding method of this embodiment is as described above. Next, the bonding method of this embodiment will be described with reference to FIGS.

First, as shown in FIG. 2, the TAB device D is sucked to the nozzle N of the transfer head H, and the panel electrode PN is sucked.
The lead L is aligned with b. In this state, the lead L rests on the panel electrode PNb, and a narrow gap K is left between the leads L, L and between the panel electrodes PNb, PNb.

Next, as shown in FIG. 3, an ultraviolet curable resin B is applied from the nozzle N to the middle of the lead L not covered by the film F. Here, the TAB device D in which the leads L are completely covered with the film F and are not exposed to the outside
The resin B is applied to the tip of the lead L (in the vicinity of the anti-separation film Fa in FIG. 3), and the resin B reaches the right side of the lead L and the panel electrode PNb in FIG. It is good to make it.

Next, as shown in FIG. 4, the pressure tool 1 on which the moisture-proof sheet S is sucked is moved to the resin B side. Here, the lower surface 1a of the pressing tool 1, the downward slope 1b,
1c is covered with the moisture-proof sheet S, so that these surfaces 1a, 1b, 1c (that is, the pressing tool 1)
There is no direct contact with resin B.

Then, as shown in FIG.
Is applied to the resin B, the lead L, and the panel electrode PNb via the moisture-proof sheet S. Here, the pressing force does not directly extend from the pressing tool 1 to the leads L, but is transmitted while the moisture-proof sheet S is crushed to some extent. In this state,
As shown in the partially enlarged view of FIG. 5, the lead L and the panel electrode P
Nb is pressed with a sufficient force, and the gap K is filled with the resin B. Then, ultraviolet rays UV are irradiated toward the resin B from the ultraviolet irradiator 4 to cure the resin B. Here, as described above, if the moisture-proof sheet S reflects ultraviolet UV, not only the linearly irradiated ultraviolet UV but also the reflected ultraviolet UV can be reflected by the resin B (in particular, the pressing tool 1). The bottom surface of the resin B is pushed laterally and penetrates the accumulated portion, so that the entire view of the resin B can be quickly cured, which is convenient.

Next, as shown in FIG.
Is released, and the bonding is completed.

[0025]

According to the present invention, there is provided a process of aligning a lead group of a narrow pitch lead device with a panel electrode group of a panel element, and applying a photocurable resin to the panel electrode group and between the panel electrode group and the lead group. The process of interposing this photo-curable resin in the gap between the two, and placing a sheet on the photo-curable resin, pressing the sheet with a pressing tool, and connecting these lead group and panel electrode group Bonding is performed by a process of curing the photocurable resin while maintaining the pressure contact, and a process of releasing the pressing. Therefore, since the pressing tool does not directly contact the lead or the photocurable resin, the flatness of the pressing tool is hardly reduced due to the indentation of the lead and the adhesion of the resin, and the durability of the pressing tool is maintained high. can do. Also, the sheet can be left at the joint between the lead group and the panel electrode group, and this joint can be protected by the sheet. Also, the sheet has moisture resistance and heat resistance,
Has the same coefficient of thermal expansion as photo-curable resin.
The sheet deforms in the same way as the photocurable resin, and leads and
Thus, the junction of the tunneling element can be protected.

[Brief description of the drawings]

FIG. 1 is a perspective view of an apparatus using a bonding method according to an embodiment of the present invention.

FIG. 2 is a process explanatory view of a bonding method according to one embodiment of the present invention.

FIG. 3 is a process explanatory view of a bonding method according to an embodiment of the present invention.

FIG. 4 is a process explanatory view of a bonding method according to an embodiment of the present invention.

FIG. 5 is a process explanatory view of a bonding method according to one embodiment of the present invention.

FIG. 6 is a process explanatory view of a bonding method according to one embodiment of the present invention.

FIG. 7 is a process explanatory view of a conventional bonding method.

FIG. 8 is an explanatory view of a step of a bonding method of a conventional means.

FIG. 9 is a process explanatory view of a bonding method of a conventional means.

[Description of Signs] 1 Press tool PN Panel element PNb Panel electrode D Narrow pitch lead device L Lead B Photocurable resin K Gap S Moistureproof sheet

Claims (3)

(57) [Claims] 1. A process of aligning a lead group of a narrow pitch lead device with a panel electrode group of a panel element, and applying a photocurable resin to a gap between these panel electrode groups and a gap between the lead groups. The process of interposing this photocurable resin, and placing a sheet on this photocurable resin, pressing this sheet with a pressing tool, and keeping these lead groups and panel electrode groups pressed against each other A process for curing the photocurable resin and a process for releasing the pressing. 2. The method according to claim 1, wherein the sheet is left on the photocurable resin after the pressing is released. Wherein said sheet has moisture resistance, heat resistance, yet the photocurable resin and those having a thermal expansion coefficient comparable claim 1 or 2 pitch bonding method of the lead device according.