JP3168062U - Donor substrate assembly for electrical circuit repair - Google Patents

Abstract

A donor substrate assembly for use in electrical circuit repair is provided. A donor substrate assembly includes a donor substrate and a donor substrate support base. The donor substrate support base 202 is configured to hold the donor substrate 200 at a predetermined vertical distance from a conductor repair region on the printed circuit board. [Selection] Figure 4A

Description

(Refer to related applications)
Reference is now made to Israel Patent Application No. 197349, filed Mar. 2, 2009, whose name is “A Method and System for Electrical Circuit Repair”.

  This invention relates generally to electrical circuit repair.

  The following publications are considered to represent the current state of the prior art.

  U.S. Pat.Nos. 4,752,455, 4,970,196, 4,987,006, 5,173,441 and 5,292,559

“Metal deposition from a supported metal film”, Bohandy, B.F. Kim and F.J. Adrian, J. Appl. Phys. 60 (1986) 1538

“A study of the mechanism of metal deposition by the laser-induced forward transfer process”, FJ Adrian, J. Bohandy, BF Kim, and AN Jette, Journal of Vacuum Science and Technology B 5, 1490 (1989), pp. 1490-1494

  The present invention provides a donor substrate assembly for use in systems and methods for electrical circuit repair.

  That is, according to one embodiment of the present invention, a donor substrate assembly useful in a method and / or system for repairing an electrical circuit using a laser and at least one laser beam delivery pathway. And a donor substrate support base configured to hold the donor substrate at a predetermined vertical spacing from a donor substrate and at least one conductor repair region of a conductor formed on the circuit board. It has.

  In another preferred embodiment of the present invention, a donor substrate assembly useful in repairing an electrical circuit is provided, the donor substrate assembly including a donor substrate and at least one conductor repair on the electrical circuit. A donor substrate support base configured to hold the donor substrate at a predetermined vertical spacing from the region;

  Preferably, the donor substrate is formed from a plate coated on one side with a thin layer of conductive material. Furthermore, the thin layer of conductive material is formed from copper having a thickness of 0.5 to 3 microns. Further, the flat plate is made of 1 mm thick glass, and the conductor material layer is made of 1 micron thick copper.

  In a preferred embodiment of the present invention, the donor substrate support base is generally U-shaped and includes a central generally planar portion and a collar. Furthermore, an innermost concave portion is formed in the central outline plane portion, and an adhesive layer is disposed there. Furthermore, an outermost recess is formed in the central plane portion, and a disk formed of a paramagnetic material is disposed therein, and the disk is retained by the adhesive layer.

  In a preferred embodiment of the invention, the donor substrate support base has a pair of positioning guides (angled surfaces) disposed on its upper surface for accurate engagement with the corresponding surface of the docking module. a pair of positioning guides), which provides accurate and stable positioning of the donor substrate relative to the docking module.

  Preferably, the donor substrate support base includes a support surface for the donor substrate on an inner edge of the central substantially plane portion and the bottom portion of the collar portion toward the bottom portion. Further, an adhesive layer that engages corresponding edges of the donor substrate is provided on the bottom-facing inner edge, thereby holding the donor substrate on the base.

  In a preferred embodiment of the present invention, the bottom surface of the conductive material layer is accurately recessed from the bottom surface of the base by a predetermined distance corresponding to the predetermined separation. Furthermore, the exact predetermined distance is between 50 and 300 microns. Or the exact predetermined distance is 50 microns.

  Yet another preferred embodiment of the present invention provides a donor substrate assembly useful in the repair of electrical circuits, the donor substrate assembly comprising a donor substrate, a donor substrate support base that supports the donor substrate, and A magnetically engageable element mounted on the donor substrate support base for removably holding the donor substrate on the docking module.

  In still another preferred embodiment of the present invention, a donor substrate assembly useful in electrical circuit repair is provided, the donor substrate assembly comprising a donor substrate and a donor substrate support base that supports the donor substrate, the donor substrate The substrate support base includes a pair of positioning guides on its upper surface having inclined surfaces arranged to accurately engage the corresponding surfaces of the docking module, whereby the donor substrate relative to the docking module. It provides precise and stable positioning.

  The invention will be more fully understood and appreciated from the following detailed description in conjunction with the drawings.

1 is a schematic diagram of a donor substrate assembly constructed and operative in accordance with one embodiment of the present invention in the configuration of an electrical circuit repair system. 2 is a schematic view of the donor substrate assembly constructed and operative in accordance with one embodiment of the present invention prior to engaging a docking module that forms part of the electrical circuit repair system shown in FIG. 2 is a schematic view of the donor substrate assembly configured and operating in accordance with one embodiment of the present invention engaged with a docking module that forms part of the electrical circuit repair system shown in FIG. FIG. 4 is a schematic diagram illustrating the top surface of a donor substrate assembly constructed and operative in accordance with one embodiment of the present invention in the configuration of FIGS. 4 is a schematic diagram illustrating the bottom surface of a donor substrate assembly constructed and operative in accordance with one embodiment of the present invention in the configuration of FIGS. 1-3. FIG. 4B is a schematic cross-sectional view of the donor substrate assembly of FIGS. 4A and 4B, taken along line VV of FIG. 4A.

  Referring to FIG. 1, FIG. 1 shows a schematic diagram of a donor substrate assembly 100 constructed and operative in accordance with one embodiment of the present invention in the configuration of an electrical circuit repair system.

  As shown in FIG. 1, the system preferably includes a chassis 101 that is preferably mounted (mounted) on a conventional optical table 102. The chassis 101 defines an electrical circuit inspection / repair location 104 where an electrical circuit such as a printed circuit board (PCB) 106 to be inspected / repaired is placed. The PCB typically has one or more various types of defects, such as excess conductor defects and missing conductor defects, for example, disconnection (cut) 110.

  A bridge 112 is arranged for linear movement with respect to the inspection / repair position 104 along the first inspection / repair axis 114 defined for the chassis 101. An optical head assembly 116 is arranged for linear movement with respect to the bridge 112 along a second inspection / repair axis 118 perpendicular to the first inspection / repair axis 114.

  In one embodiment of the present invention, preferably the optical head assembly 116 includes a service / repair subassembly 120.

  Preferably, the system also includes a control assembly 124, which preferably has a user interface 128 and a computer 126 that includes a software module executed to operate the service / repair subassembly 120. It has. The control assembly 124 receives defect location inputs from an automated optical inspection system (not shown), such as the Discovery 8000 system, preferably commercially available from Orbotec Limited of Yafune, Israel.

  The inspection / repair subassembly 120 preferably includes a base 130 supported by a camera 132, such as a Basler CMOS camera provided by Basler, Inc. of Exton PA. Has been. The camera 132 may be a focus target lens 139 having a typical focal length of 100-150 mm, a partially reflective mirror 142 and a 5 × / 0.14 target lens module commercially available from Mitutoyo Ltd., Japan. The imaging position 134 on the PCB 106 is imaged along the optical axis 136 through the target lens module 144.

  Below the base 130 is the New Focus Model 9064, which is commercially available from New Focus Corporation or Newport Corporation (not shown for public order and morals violations) in Santa Clare, California, USA. Or a three-dimensional drive actuator such as 9065 is attached. The docking module 150 is mounted on the actuator 140 and is removably mounted on the donor substrate assembly 100. The drive actuator 140 provides selectable positioning of the docking module 150 or donor substrate assembly 100 relative to the base 130 in at least one direction, preferably two or three directions.

  The inspection / repair subassembly 120 is preferably a passive Q-switched microlaser, commercially available from Teem Photonics, Grenoble, France, which operates to generate a pulsed laser beam. A simple pulsed laser source 152. A suitable microlaser can be selected from laser heads that operate to output beams of 532 nm or 1064 nm wavelength, depending on the application.

  The pulsed beam 154 passes through a collimating optics 158 that can include two lenses 160 and 162 having focal lengths of 80 mm and 150 mm, respectively, and the laser beam 154 preferably has a spot size of 0.5 to 3.0 mm. Is collimated. The laser beam 154 is then reflected by a mirror 174 and adjusted to a specific diameter by a beam expander 176 with a multiple lens 178 arranged and adjusted for the required size of the collimated output beam. The The lens 178 may include lenses such as a 28 mm plano-convex lens, a -10 mm biconcave lens, and a 129 mm plano-convex lens, respectively.

  Laser beam 154 is then directed by lens 180 to be incident on a two-axis fast steering mirror (FSM) 182 commercially available from Newport Corporation, after which a 108 mm meniscus It passes through a lens 184 such as a lens, a mirror 186 and a lens 188 such as a plano-convex 338 mm lens. Lenses 180, 184 and 188 hold the position of the beam on the FSM 182. Beam 154 then enters beam splitter 190 that directs beam 154 through target lens module 154 along axis 136 and through donor substrate assembly 100 mounted on docking module 150; As a result, the repair function is executed.

  2 and 3, FIGS. 2 and 3 show the attachment of the donor substrate assembly 100 to the docking module 150. FIG. 2 is a schematic view of the donor substrate assembly 100 prior to engagement (coupling) with the docking module 150, and FIG. 3 is a schematic view of the donor substrate assembly 100 engaged with the docking module 150. It is. As shown in FIG. 2, the docking module 150 preferably includes a housing 192, to which a mounting bracket 194 having a mounting pin 196 is attached, which in turn can be attached to the actuator 140.

  The housing 192 preferably includes a pair of inclined side surfaces 197 that provide precise positioning of the donor substrate assembly 100 relative thereto, as described below.

  An electromagnet 198 is mounted in the housing 192 and, as will be described in detail below, the electromagnet 198 has a removable engagement between the docking module 150 and the donor substrate assembly 100 at its bottom (bottom). A magnetic engagement surface 199 is provided that is provided.

  Referring to FIGS. 4A and 4B, FIGS. 4A and 4B are schematic illustrations showing the top and bottom surfaces of the donor substrate assembly 100, respectively, and FIG. 5 and FIG. 4A schematically shows a cross section of the donor substrate assembly of FIGS. 4A and 4B along the line.

  As shown in FIGS. 4A, 4B, and 5, the donor substrate assembly 100 preferably includes a donor substrate 200 and a donor substrate support base 202, the donor substrate support base 202 on the PCB 106 (FIG. 1). The donor substrate 200 is configured to be held at a predetermined perpendicular separation from a conductor repair area of the formed conductor.

  The donor substrate 200 is preferably planar, has a thickness of 0.5-3 mm, and is typically made of a material that is transparent to the wavelength of the laser beam 154 (FIG. 1), such as glass or plastic. Formed from a flat plate 204, the bottom surface is coated with a layer 206 of at least a thin conductive material such as copper having a thickness of 0.5 to 3 microns. In the illustrated embodiment, the flat plate 204 is formed from 1 mm thick glass and the layer of conductive material 206 is 1 micron thick copper.

  In particular, as shown in FIG. 5, the donor substrate support base 202 is preferably generally U-shaped with a central generally planar portion 210 and arms 212. I have. The central generally planar portion 210 is preferably formed with an interiormost recess 214, at least a portion of which is, for example, Acapol S.P. A. (Akapol S.A.) ((not shown for violation of public order and morals) Adhesive (adhesive) 218 such as POXIPOL (registered trademark) 10 MINUTE CLEAR EPOXY commercially available from Villa Ballester Buenos Aires, Argentina. A disk 220 made of paramagnetic material is housed in an outermost recess 222 and held therein by an adhesive 218. The magnetic force between the electromagnet 198 and the disk 220 provides a removable mounting engagement of the donor substrate support assembly 100 on the docking module 150.

  As specifically shown in FIG. 4A, an inclined surface (located on the upper surface of the base 202 for precise engagement with the corresponding inclined surface (s) 197 of the docking module 150 ( A pair of positioning guides 230 including 232 are formed, which provides accurate positioning of the donor substrate 100 with respect to the docking module 150. The lie in precise toucing engagement is a characteristic feature of the present invention that the inclined surface 232 is positioned in the corresponding inclined surface 197 of the docking module 150 (see in particular FIG. 3). This precise contact engagement provides the desired precise and stable positioning of donor substrate assembly 100 with respect to docking module 150.

  As specifically shown in FIG. 4B, the bottom facing inner edges 240 of the central generally planar portion 210 and the ridge 212 define support surfaces for the donor substrate 200. The edge 240 is preferably Acapol S.P. A. (Akapol SA) Adhesive layer (adhesive layer) such as POXIPOL (registered trademark) 10 MINUTE CLEAR EPOXY (not listed for public order and morals violations) commercially available from Villa Ballester Buenos Aires, Argentina (not listed for public order and morals violations) ) 242 and the edges 240 engage the corresponding top facing edges of the plate 204, thereby securing the donor substrate 200 to the base 202. The outer surface of the layer 206 of conductive material is recessed from the bottom surface of the base 200 by a predetermined distance D between 50 and 300 microns, preferably 50 microns, which is particularly illustrated in FIG.

  It will be appreciated by those skilled in the art that the preferred embodiments described above have been given by way of example, and that the invention is not limited to what has been particularly shown and described hereinabove. Rather, the invention includes both the various feature combinations and subcombinations described, and those skilled in the art will recognize upon reading the above specification and are not disclosed in the prior art. Not including those variations and partial changes.

Claims (15)

A donor substrate assembly useful in the repair of electrical circuits,
A donor substrate and a donor substrate support base configured to hold the donor substrate in a predetermined vertical spacing from at least one conductor repair region on the electrical circuit;
Donor substrate assembly.   The donor substrate assembly according to claim 1, wherein the donor substrate is formed of a flat plate coated on one surface with a thin layer of a conductive material.   The donor substrate assembly of claim 2, wherein the thin layer of conductive material is formed from copper having a thickness of 0.5 to 3 microns.   4. The donor substrate assembly of claim 3, wherein the flat plate is formed from 1 mm thick glass and the layer of conductive material is formed from 1 micron thick copper.   5. The donor substrate assembly according to any one of claims 1 to 4, wherein the donor substrate support base is generally U-shaped and includes a central generally planar portion and a collar.   The donor substrate assembly according to claim 5, wherein an innermost recess is formed in the central plane portion, and an adhesive layer is placed therein.   The outermost concave portion is formed in the central schematic plane portion, a disk formed of a paramagnetic material is disposed therein, and the disk is held by the adhesive layer. Donor substrate assembly.   The donor substrate support base includes a pair of positioning guides on its upper surface having an inclined surface arranged for precise engagement with a corresponding surface of the docking module, thereby allowing the docking module to 8. The donor substrate assembly according to any one of claims 1 to 7, wherein precise and stable positioning of the donor substrate is provided.   The donor substrate support base according to any one of claims 1 to 8, wherein the donor substrate support base includes a support surface for the donor substrate on an inner edge of the center substantially plane portion and a bottom portion of the donor substrate. Board assembly.   The donor substrate assembly according to claim 9, wherein an adhesive layer that engages a corresponding edge of the donor substrate is provided on the inner edge facing the bottom, thereby holding the donor substrate on the base.   11. The donor substrate assembly according to any one of claims 2 to 10, wherein the bottom surface of the conductive material layer is recessed from the bottom surface of the base precisely by a predetermined distance corresponding to the predetermined separation.   12. The donor substrate assembly of claim 11, wherein the precise predetermined distance is between 50 and 300 microns.   12. The donor substrate assembly of claim 11, wherein the exact predetermined distance is 50 microns. A donor substrate assembly useful in the repair of electrical circuits,
A donor substrate;
A donor substrate support base for supporting the donor substrate;
A magnetically engageable element mounted on the donor substrate support base for removably holding the donor substrate on a docking module;
Donor substrate assembly. A donor substrate assembly useful in the repair of electrical circuits,
A pair of donor substrates, and a donor substrate support base that supports the donor substrate, the donor substrate support base having an inclined surface disposed on its upper surface so as to accurately engage with a corresponding surface of the docking module; Providing a precise and stable positioning of the donor substrate with respect to the docking module,
Donor substrate assembly.

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