JP3165046U - IC tag adhesive label and flat IC tag adhesive sheet - Google Patents

Abstract

An IC tag pressure-sensitive adhesive label and a plain IC tag pressure-sensitive adhesive sheet capable of performing beautiful printing even when printing is performed on an end of the surface of the IC tag. An outer frame label (2) is provided on the outer periphery of an IC tag (1), and a frame adhesive label (3) is provided on the outer periphery of the outer frame label (2) with a gap (7) therebetween. The frame body adhesive label 3 gives the release sheet 4 a stiffness and can reduce the difference in rigidity and the difference in thickness from the IC tag 1, so that the effect of facilitating printing work and other secondary processing can be obtained. is there. Further, the IC tag adhesive label 14 includes the IC tag 1 and the outer frame label 2. The cross section of the IC tag pressure-sensitive adhesive label 14 is such that the IC tag 1 provided with the pressure-sensitive adhesive layer 5 on the back surface is affixed to the front surface of the release sheet 4, and the pressure-sensitive adhesive layer 5 Is provided. Further, a frame body adhesive label 3 is provided on the outer periphery of the outer frame label 2 with a gap 7 therebetween. [Selection] Figure 2

Description

  The present invention relates to an IC tag pressure-sensitive adhesive label and a flat-format IC tag pressure-sensitive adhesive sheet. The present invention relates to a flat IC tag adhesive sheet.

In recent years, IC tags are attached to articles such as books, merchandise, stored items, and luggage to manage the articles. For example, information such as author's name, book field, book issuer, book content information such as issue date, purchase information such as purchase date and supplier name, price information, usage information such as loan status, etc. are recorded on the book. The recorded IC tag is affixed, and the recorded information is confirmed and managed by an interrogator (interrogator) as necessary.
And in order to affix an IC tag to articles | goods, the IC tag adhesive label which provided the adhesive layer in the back surface of an IC tag is used normally.

This IC tag pressure-sensitive label is formed by laminating an adhesive layer on a base material, providing an electronic circuit and an IC chip on the surface of the adhesive layer, further laminating an adhesive layer thereon, and further covering with a release sheet. Manufactured. In order to efficiently manufacture the IC tag adhesive label, usually, an IC tag is formed on a continuous sheet at a predetermined interval, and a sheet on which a plurality of IC tag adhesive labels are formed is manufactured. Yes.
If printing is performed on the surface of the base material of the sheet on which the plurality of IC tag adhesive labels are formed, an IC tag adhesive label having visible information can be obtained.

However, if there are defects in the electronic circuits of some of the IC tags in the sheet on which a plurality of IC tag adhesive labels are formed, there is a problem that printing of defective IC tags is wasted and manufacturing efficiency is deteriorated. It was.
Therefore, after selecting only normal IC tags in advance, only this normal IC tag is arrayed and pasted on another release sheet to create a release sheet having a plurality of normal IC tags attached thereto. Printing is performed (see Patent Document 1).
However, when printing is applied to the edge of the surface of the IC tag, the printing ink adheres to the release surface of the release sheet on the outer periphery of the IC tag, and the ink is repelled from the release surface. There was a problem that the tag adhesive label and the printing machine were soiled and it was impossible to print beautifully.

JP-A-7-276870

  An object of the present invention is to provide an IC tag pressure-sensitive adhesive label and a flat-format IC tag pressure-sensitive adhesive sheet that can be printed beautifully even when printing is applied to the edge of the surface of the IC tag.

As a result of intensive studies to solve the above problems, the inventor has found that the above problems can be solved by providing an outer frame label on the outer periphery of the IC tag, and has completed the present invention.
That is, the present invention provides an IC tag adhesive label characterized in that an outer frame label is provided on the outer periphery of the IC tag.

In addition, the present invention provides an IC tag pressure-sensitive adhesive label in which a frame pressure-sensitive adhesive label is provided on the outer periphery of the outer frame label.
The present invention also provides a flat-format IC tag pressure-sensitive adhesive sheet in which two or more IC tag pressure-sensitive adhesive labels are attached to a single flat-sheet release sheet.

  The IC tag pressure-sensitive adhesive label of the present invention can be printed beautifully even if printing is performed on the edge of the surface of the IC tag, and the printed IC tag pressure-sensitive adhesive label can be efficiently produced.

It is a top view of an example of the IC tag adhesive label of this invention. It is sectional drawing of the IC tag adhesive label of FIG. It is a top view of an example of the frame adhesive label used for preparation of the IC tag adhesive label of this invention. It is sectional drawing of the frame adhesive label of FIG. It is a top view of an example of the flat format IC tag adhesive sheet of this invention. It is a top view of the frame adhesive label used for preparation of the flat format IC tag adhesive sheet of FIG.

It is a top view of an example of a frame adhesive label. It is a top view of an example of a frame adhesive label. It is a top view of the flat format IC tag adhesive sheet obtained by sticking an IC tag adhesive label to the frame adhesive label of FIG. It is a top view of the flat format IC tag adhesive sheet obtained by sticking an IC tag adhesive label to the frame adhesive label of FIG. It is a top view of an example of the flat format IC tag adhesive sheet of this invention. It is a top view of an example of the flat-format IC tag adhesive sheet provided with the peeling crack part which can put the nail | claw of this invention. FIG. 13 is a cross-sectional view of a flat IC tag pressure-sensitive adhesive sheet provided with the peeling crack portion of FIG. 12.

In order to efficiently produce the IC tag adhesive label of the present invention, it is preferable to use the flat IC tag adhesive sheet of the present invention.
In the flat IC tag pressure-sensitive adhesive sheet of the present invention, it is preferable that two or more IC tag pressure-sensitive adhesive labels are affixed to a single flat-sheet release sheet. Thereby, printing can be performed efficiently.
Moreover, it is preferable that the flat format IC tag adhesive sheet of this invention is between each IC tag adhesive label, and the frame adhesive label is provided in the outer periphery of the outer frame label. Thereby, the rigidity of a peeling sheet can be improved and a printing operation and other secondary processing can be performed efficiently. Furthermore, the step between the IC tag pressure-sensitive adhesive label and the release paper can be eliminated, and the transportability of the flat-size IC tag pressure-sensitive adhesive sheet in a general-purpose small-sized printer is improved.

Further, the flat IC tag pressure sensitive adhesive sheet of the present invention has a plurality of IC tag pressure sensitive label placement section areas on the pressure sensitive adhesive sheet, and each IC tag pressure sensitive label placement section area is connected by a surface material and a pressure sensitive adhesive layer. The frame adhesive label provided with the IC tag adhesive label installation part by continuously removing the installation part area of each IC tag adhesive label and the connected surface material and adhesive layer between them. Preferably there is. Thereby, the installation part of an IC tag adhesive label can be efficiently provided in a peeling sheet.
Further, it is preferable that the flat IC tag pressure-sensitive adhesive sheet of the present invention has cut lines 9 on the frame pressure-sensitive adhesive label side or the release sheet side between the IC tag pressure-sensitive adhesive labels. Thereby, the curvature of a flat IC tag adhesive sheet can be prevented, and printing can be performed efficiently.

In addition, the flat IC tag pressure sensitive adhesive sheet of the present invention has a gap that allows a nail to be inserted between the non-printed end of the surface of the IC tag pressure sensitive adhesive label and the outer frame label on the outer periphery of the edge. It is preferable to provide it. Thus, when the IC tag pressure-sensitive adhesive label is affixed to the article, the IC tag pressure-sensitive adhesive label can be easily peeled off from the release sheet, and can be smoothly affixed to the article without impairing the function of the IC tag.
Further, the flat IC tag pressure-sensitive adhesive sheet of the present invention is provided near the IC tag pressure-sensitive adhesive label 1 in the vicinity of the IC tag pressure-sensitive adhesive label and printed with characters such as affixed characters and IC tag part numbers. Is preferred. Thereby, it is possible to manage the application of the IC tag pressure-sensitive adhesive label to the article.

An embodiment of the IC tag pressure-sensitive adhesive label of the present invention will be described with reference to the drawings.
FIG. 1 shows a plan view of an example of the IC tag adhesive label of the present invention, and FIG. 2 shows a cross-sectional view thereof.
In FIG. 1, an outer frame label 2 is provided on the outer periphery of the IC tag 1, and a frame adhesive label 3 is provided on the outer periphery of the outer frame label 2 with a gap 7 therebetween. Although this frame adhesive label 3 does not need to be provided, it can give the waist to the release sheet 4 and reduce the difference in rigidity and thickness from the IC tag 1, so that printing work and other secondary operations can be performed. There is an effect to facilitate processing. The IC tag adhesive label 14 of the present invention comprises an IC tag 1 and an outer frame label 2. As shown in FIG. 2, the IC tag pressure-sensitive adhesive label 14 has a cross section in which the IC tag 1 having the pressure-sensitive adhesive layer 5 provided on the back surface is affixed to the front surface of the release sheet 4. Is provided with an outer frame label 2 having a pressure-sensitive adhesive layer 5 provided on the back surface. Furthermore, a frame adhesive label 3 is provided on the outer periphery of the outer frame label 2 with a gap 7 therebetween.

The shape of the IC tag 1 is rectangular in FIG. 1, but can be various shapes such as a polygon such as a triangle, a quadrangle, a pentagon, a hexagon, an octagon, a circle, and an ellipse. The corners of the polygon may be rounded.
The outer frame label 2 is provided on the outer periphery of the IC tag 1, and the shape thereof may be appropriately selected according to the shape of the IC tag 1. Although the width | variety of an outer frame label is not specifically limited, Usually, 2-20 mm is preferable and 4-10 mm is more preferable.
The IC tag 1 can have various structures, but preferably has a structure in which a surface material, an adhesive layer, a base material, an adhesive layer, an electronic circuit, an IC chip, and an adhesive layer are sequentially laminated.

The outer frame label 2 can have various structures, but preferably has a structure in which a surface material, an adhesive layer, a base material, and an adhesive layer are sequentially laminated. In addition, you may provide a peeling sheet in the surface of the adhesive layer on the opposite surface to the surface material side of a base material. In addition, the base material may be omitted, but the IC tag 1 and the outer frame label 2 can be formed by punching an integral sheet material. In this case, the outer frame label 2 also has a base material.
The frame pressure-sensitive adhesive label 3 can have various structures, but preferably has a structure in which a surface material, an adhesive layer, and a release sheet are sequentially laminated. As with the outer frame label 2, a base material may or may not be present.
The surface material, the pressure-sensitive adhesive layer, the base material, and the release sheet used for the IC tag 1, the outer frame label 2, and the frame pressure-sensitive adhesive label 3 can be selected and used from the following group of materials. Hereinafter, it demonstrates collectively.

Examples of the surface material include paper materials such as high-quality paper and coated paper, polyester resins such as polyethylene terephthalate resin, polyolefin resins such as polypropylene resin, resins such as polyvinyl chloride resin and polycarbonate resin, and film materials such as synthetic paper. . The surface material is preferably concealable, and more preferably printable on the surface. Although the thickness of a surface material is not specifically limited, 5-500 micrometers is preferable normally.
The surface material serves to protect the base material, the electronic circuit, and the IC chip and to serve as a printing layer.
As an adhesive used for an adhesive layer, various adhesives, such as an acrylic resin adhesive, a rubber adhesive, a urethane resin adhesive, and a silicone resin adhesive, are mentioned. Although the thickness of an adhesive layer is not specifically limited, Usually, it may be 1-100 micrometers, Preferably it is 3-50 micrometers.

Examples of the substrate include paper materials such as high-quality paper and coated paper, various resins such as polyethylene terephthalate resin, polypropylene resin, polyvinyl chloride resin, polyimide resin and polycarbonate resin, and film materials such as synthetic paper. Although the thickness of a base material is not specifically limited, Usually, it may be 5-500 micrometers, Preferably it is 10-300 micrometers.
The substrate serves as a support for supporting the electronic circuit and the IC chip via the adhesive.
Examples of the adhesive used for the adhesive layer include various adhesives such as an acrylic resin adhesive, a polyester resin adhesive, a rubber adhesive, a urethane resin adhesive, and a silicone resin adhesive. The thickness of the adhesive layer is usually 1 to 100 μm, preferably 3 to 50 μm.

As release sheets, paper materials such as high-quality paper, coated paper, polyethylene laminated paper, polyester resins such as polyethylene terephthalate resin, polyolefin resins such as polypropylene resin, various resins such as polyvinyl chloride resin, polycarbonate resin, polyimide resin, etc. A film material is mentioned. The thickness of the release sheet is not particularly limited and may be appropriately selected. The release sheet may have a surface coated with a release agent such as a silicone-based release agent, a fluorine-based release agent, or a long-chain alkyl release agent as necessary. The thickness of the release agent layer is not particularly limited, and is preferably 0.01 to 5 μm, particularly preferably 0.03 to 3 μm.

FIG. 3 shows the frame pressure-sensitive adhesive label provided with the IC tag pressure-sensitive adhesive label setting portion 8 before the IC tag pressure-sensitive adhesive label 14 is attached. As shown in FIG. 4, the cross section is provided with the frame adhesive label 3 at the periphery of the surface of the release sheet 4, and the depression in the center is the IC tag adhesive label installation part 8. . Although the frame adhesive label 3 may not be provided around the IC tag adhesive label installation portion 8, it is usually preferable that the periphery is surrounded by the frame adhesive label 3.
The IC tag adhesive label 14 of the present invention shown in FIG. 1 is obtained by attaching the IC tag 1 with the outer frame label 2 to the IC tag adhesive label installation portion 8. Instead of attaching the IC tag 1 with the outer frame label 2, the outer frame label 2 and the IC tag 1 may be prepared separately and sequentially attached to the IC tag adhesive label installation part 8 from either one. Although it is good, it is preferable to affix the IC tag 1 integrated with the outer frame label 2 for affixing efficiently.

The outer frame label 2 and the IC tag 1 are pasted so that there is no gap. If there is a gap, the printing ink reaches the peeling surface of the release sheet 4 and the printing ink is repelled, so that clean printing cannot be performed. Since it is not repelled on the surface, it can be printed beautifully. It should be noted that there may be a slight gap such that the printing ink cannot reach the release surface of the release sheet 4.
The size of the IC tag adhesive label installation portion 8 needs to be larger than the size of the IC tag 1 with the outer frame label 2. In this way, when the IC tag 1 with the outer frame label 2 is attached to the IC tag adhesive label installation portion 8, a gap 7 is made between the two.

The width of the gap 7 is preferably 1 mm or less, but if it is too small, the IC tag 1 with the outer frame label 2 cannot be attached so as to fit into the installation portion 8 of the IC tag pressure-sensitive adhesive label 14. . In order to affix the IC tag pressure-sensitive adhesive label 14 to the IC tag pressure-sensitive adhesive label installation part 8, it is preferable to carry out continuously with a sticking machine.
It is preferable that the height of the IC tag 1 and the height of the outer frame label 2 are substantially the same because they are easy to handle during printing. The difference in height is preferably at most 200 μm.
Further, it is preferable that the height of the IC tag pressure-sensitive adhesive label 14 and the height of the frame pressure-sensitive adhesive label 3 are substantially the same because they are easy to handle during printing. The difference in height is preferably at most 200 μm.

The IC tag adhesive label 14 is preferably produced by the following production method. In this production method, first, an electronic circuit is provided on the surface of the adhesive layer on which the base material and the adhesive layer are laminated.
The electronic circuit is composed of circuit lines formed of a conductive material. Examples of the conductive substance include a metal simple substance such as a metal foil, a deposited film, and a thin film formed by sputtering. Gold, silver, nickel, copper, aluminum, etc. can be used as the metal simple substance. Further, as the conductive substance, a conductive paste in which metal particles such as gold, silver, nickel, and copper are dispersed in a binder can be used.

The thickness of the circuit line constituting the electronic circuit is not particularly limited, but is 5 to 50 μm for a metal foil, 0.01 to 1 μm for a deposited film or a metal film by sputtering, and 5 to 30 μm for a conductive paste. Preferably there is.
The width of the circuit line is not particularly limited, but is preferably 0.01 to 10 mm, particularly preferably 0.1 to 3 mm.
In order to form an electronic circuit on the surface of the adhesive layer, for example, an electronic circuit is formed by bonding a metal foil to a base material with an adhesive and etching the metal foil to remove portions other than the circuit. Methods and the like. The etching process can be performed by a process similar to a normal etching process. Moreover, the formation of the electronic circuit on the surface of the adhesive layer can also be performed by attaching the conductive paste to the shape of the electronic circuit by means such as printing or coating.

The electronic circuit is not particularly limited as long as it exhibits a predetermined function. For example, a circuit line made of a single conductive substance line is formed from a single layer toward the inside from the outer periphery of a rectangular base sheet. Examples thereof include an electronic circuit that functions as an antenna arranged at a predetermined interval in a ten-fold or more spiral shape. An IC tag having an antenna circuit is a non-contact IC tag.
In a preferable manufacturing method of the IC tag pressure-sensitive adhesive label 14, an IC chip is then mounted and connected to an electronic circuit, and further, a pressure-sensitive adhesive layer and a release sheet are formed on the surface of the substrate, and a pressure-sensitive adhesive layer is formed on the opposite substrate surface. The surface material is laminated to create an IC tag laminated sheet. Then, a cut 6 or the like is provided from the surface material side to the entire periphery of the electronic circuit of the IC tag laminated sheet from the surface material side. Specifically, the surface material, the pressure-sensitive adhesive layer, the base material, the adhesive layer, the pressure-sensitive adhesive layer The IC tag 1 is created by making a cut 6 in the laminated sheet and not making a cut in the release sheet.

  Next, the IC tag 1 is cut into the shape of the outer frame label 2 from the surface material side with a cutting blade or the like, specifically, the surface material, the pressure-sensitive adhesive layer, the base material, the adhesive layer, The IC tag pressure-sensitive adhesive label 14 is created by making a cut in the shape of the outer frame label 2 in the laminated sheet of the pressure-sensitive adhesive layer and not making a cut in the release sheet. It is preferable that the IC tag adhesive label 14 is continuously formed by a processing machine.

It is preferable to create the IC tag adhesive label installation part 8 by the following production method.
In this preparation method, a pressure-sensitive adhesive layer is laminated on the surface material, and from the surface material side of the pressure-sensitive adhesive sheet in which the release sheet is laminated on the pressure-sensitive adhesive layer, the surface material and Cut the adhesive layer, provide the IC tag adhesive label installation area, then remove (scrap) the surface material and adhesive layer in the IC tag adhesive label installation area, and install the IC tag adhesive label Provide a part.

A frame adhesive label is created by the above method. The frame pressure-sensitive adhesive label is preferably continuously produced by a punching machine and / or a labeling machine. When creating continuously with a punching machine and / or labeling machine, etc., use a continuous adhesive sheet wound up on a roll, etc., continuously remove the continuous surface material and adhesive layer, and install an IC tag adhesive label It is preferable to continuously wind up the pressure-sensitive adhesive sheet in the partial area on a roll or the like. The continuous frame pressure-sensitive adhesive label can be formed into a flat frame pressure-sensitive adhesive label by cutting it into an appropriate length as necessary.

FIG. 5 shows an example of the flat IC tag adhesive sheet of the present invention. In this flat IC tag pressure-sensitive adhesive sheet, six IC tag pressure-sensitive adhesive labels 14 are attached to a single flat-sheet release sheet. The number of IC tag pressure-sensitive adhesive labels 14 to be affixed to a single flat sheet is not particularly limited as long as it is 2 or more, but usually 4 to 12 is preferable. Thereby, printing can be performed efficiently.
The flat-format IC tag pressure-sensitive adhesive sheet of FIG. 5 is prepared by attaching the IC tag pressure-sensitive adhesive label 14 to the IC tag pressure-sensitive adhesive label setting portion 8 of the frame pressure-sensitive adhesive label shown in FIG. The frame pressure-sensitive adhesive label of FIG. 6 is provided with six IC tag pressure-sensitive adhesive label installation portions 8, and the periphery thereof is surrounded by the frame pressure-sensitive adhesive label 3. The frame pressure-sensitive adhesive label 3 can increase the rigidity of the release sheet, and the printing operation can be performed efficiently.

Further, the frame pressure-sensitive adhesive label shown in FIG. 7 is provided with a plurality of IC tag pressure-sensitive adhesive label placement areas on the pressure-sensitive adhesive sheet, and each IC tag pressure-sensitive label placement area is a surface material and an adhesive layer. Connected in the flow direction of the sheet, the installation area of each IC tag adhesive label and the connected surface material and adhesive layer between them are continuously removed to install the IC tag adhesive label connected It is a frame pressure-sensitive adhesive label provided with a portion 8. In FIG. 7, the IC tag pressure-sensitive adhesive label setting portion 8 is connected by a surface material and pressure-sensitive adhesive layer removal portion 11 between the IC tag pressure-sensitive adhesive label setting portions. As a result, the surface of the IC tag pressure-sensitive adhesive label installation portion 8 and the surface material and pressure-sensitive adhesive layer removal portion 11 is a release treatment surface of the release sheet.

This is because the installation area of each IC tag adhesive label is connected with the surface material and the adhesive layer in the flow direction of the adhesive sheet, so the installation area of each IC tag adhesive label and the connection between them By continuously removing the surface material and the pressure-sensitive adhesive layer in the flow direction of the pressure-sensitive adhesive sheet, it is possible to efficiently provide the installation portion of the IC tag pressure-sensitive adhesive label on the release sheet. It is efficient and preferable to continuously remove the connected surface material and the pressure-sensitive adhesive layer with a machine.
By attaching the IC tag 1 with the outer frame label 2 to the frame pressure-sensitive adhesive label of FIG. 7, the flat IC tag pressure-sensitive adhesive sheet shown in FIG. 9 can be obtained.
In FIG. 7, the installation area of each IC tag pressure-sensitive adhesive label is connected to the flow direction of the pressure-sensitive adhesive sheet by the surface material and the pressure-sensitive adhesive layer. It may be connected in another direction.

The frame pressure-sensitive adhesive label shown in FIG. 8 is provided with a plurality of IC tag pressure-sensitive label placement area on the pressure-sensitive adhesive sheet, and each IC tag pressure-sensitive label placement area is a surface material and a pressure-sensitive adhesive layer. It is connected in the width direction of the pressure-sensitive adhesive sheet with a pressure-sensitive adhesive sheet continuous in the flow direction outside the installation area of each IC tag pressure-sensitive label, and a surface material and a pressure-sensitive adhesive layer. The frame adhesive label in which the IC tag adhesive label installation portion area and the connected surface material and adhesive layer between them are continuously removed, and the IC tag adhesive label installation portion 8 is provided. It is. In FIG. 8, the IC tag pressure-sensitive adhesive label setting section 8 is connected by a surface material and pressure-sensitive adhesive layer removing section 11 between the IC tag pressure-sensitive adhesive label setting sections. As a result, the surface of the IC tag pressure-sensitive adhesive label installation portion 8 and the surface material and pressure-sensitive adhesive layer removal portion 11 is a release treatment surface of the release sheet.

This is because the adhesive sheet continuous in the flow direction outside the installation area of each IC tag adhesive label, and the installation area of each IC tag adhesive label is connected with the surface material and the adhesive layer in the width direction of the adhesive sheet Therefore, the IC tag adhesive label installation section area and the connected surface material and adhesive layer between them are continuously removed in the flow direction of the adhesive sheet, whereby the IC tag is attached to the release sheet. The installation part of an adhesive label can be provided efficiently.
The width of the surface material between the installation portions of each IC tag pressure-sensitive adhesive label and the removal portion 11 of the pressure-sensitive adhesive layer may be appropriately selected so as to have a strength not to be cut when continuously removed. 20 mm.
Moreover, there are strip-shaped frame adhesive labels 3 on both sides in the flow direction of the frame adhesive label. This is a state in which the surface material and the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet are not removed, the rigidity of the frame pressure-sensitive adhesive label can be increased, the transportability is excellent, and the printing work can be efficiently performed. it can. As for the width | variety of the strip | belt-shaped frame adhesive label 3 of an adhesive sheet, 1-20 mm is preferable normally. In addition, the strip | belt-shaped frame adhesive label 3 of an adhesive sheet may not be connected on the way.
By attaching the IC tag 1 with the outer frame label 2 to the frame pressure-sensitive adhesive label of FIG. 8, the flat IC tag pressure-sensitive adhesive sheet shown in FIG. 10 can be obtained.
In FIG. 8, the installation area of each IC tag pressure-sensitive adhesive label is connected in the width direction of the pressure-sensitive adhesive sheet with the surface material and the pressure-sensitive adhesive layer. It may be connected in another direction.

Further, in the flat-format IC tag pressure-sensitive adhesive sheet shown in FIG. 5, cut lines 9 are made in the frame pressure-sensitive adhesive label 3 between the IC tag pressure-sensitive adhesive labels 14. Thereby, the curvature of a peeling sheet can be prevented and printing can be performed efficiently.
It is preferable that the cut line 9 to the frame pressure-sensitive adhesive label is put in the surface material and the pressure-sensitive adhesive layer but not in the release sheet.
The cut line 9 to the frame pressure-sensitive adhesive label is preferably linear. Moreover, it is preferable to provide the joint part 10 which does not provide the cut line 9 by the desired space | interval in the middle of the cut line 9. The cut line 9 is interrupted by the joint portion 10.
Further, in FIG. 5, it is preferable that the cut lines 9 are provided so as to intersect vertically and horizontally between the IC tag adhesive labels. Furthermore, it is preferable to provide a joint 10 at the intersection of the score lines 9. Moreover, it is preferable to provide the seam part 10 also in the edge part of an adhesive sheet.
The length of the joint portion 10 is usually preferably 5 to 100 mm. Moreover, the length of the score line 9 is usually preferably 5 to 200 mm.

In addition, the flat IC tag pressure-sensitive adhesive sheet of the present invention is such that a human nail can be inserted between the non-printed end portion of the surface of the IC tag 1 and the outer frame label 2 on the outer periphery of the end portion. It is preferable to provide a peeling crack portion 13. In many cases, the IC tag 1 is affixed to an article by manually peeling the IC tag 1 from the flat IC tag adhesive sheet and attaching it to the article. By providing the peeling crack portion 13, when the IC tag 1 is stuck to the article, the IC tag can be easily peeled from the peeling sheet, and the IC tag can be stuck smoothly to the article without impairing the function of the IC tag. Can do. Further, since the printing ink does not adhere to the outer periphery of the non-printing end portion of the surface of the IC tag, there is no problem in performing clean printing.

The length and width of the peeling crack part 13 may be any length as long as a human nail can be inserted, but usually the length of the gap is preferably 3 to 20 mm, and the width of the peeling crack part 13 is 2 to 20 mm. preferable.
As the peeling crack portion 13 provided on the outer frame label on the outer periphery of the non-printing end portion of the surface of the IC tag, the one shown in FIG. 11 can be cited. This is because the outer frame label is not connected at the corner of the IC tag.
Further, as shown in FIG. 12, the peeling crack portion 13 may be one in which the width of the outer frame label on the outer periphery of the corner portion of the IC tag is small. FIG. 13 shows a cross-sectional view of the IC tag pressure-sensitive adhesive label provided with the peeling crack portion 13 of FIG.

The peeling crack part 13 is formed by providing a cut of the shape of the peeling crack part 13 when the cut for forming the outer frame label is provided, thereby forming an area of the peeling crack part 13, and the peeling crack part 13. The method can be performed by removing the surface material and the pressure-sensitive adhesive layer in the area.
It is preferable that the peeling crack portion 13 is provided at a location far from the position where the IC chip is mounted.
Specifically, it is preferably provided at a location 50% or more away from the maximum length from the IC chip to the outer periphery of the IC tag, more preferably 70% or more away, More preferably, the distance is more than%.

Further, as shown in FIG. 11, a label 12 on which characters such as affixed characters and characters such as product numbers of IC tags can be printed in the vicinity of the IC tag pressure-sensitive adhesive label 14 on the flat-format IC tag pressure-sensitive adhesive sheet. The IC tag adhesive label 1 may be provided in the vicinity. The label 12 can be created by cutting the shape of the label 12 into the surface material and the pressure-sensitive adhesive layer of the frame pressure-sensitive adhesive label 3 from the surface material side using a cutting blade or the like. When the IC tag 1 is attached to an article, the label 12 is peeled off from the release sheet 4 and attached to a work ledger or the like so that the attaching operation can be confirmed.

DESCRIPTION OF SYMBOLS 1 IC tag 2 Outer frame label 3 Frame body adhesive label 4 Release sheet 5 Adhesive layer 6 Cut 7 Gap 8 IC tag adhesive label installation part 9 Cut line 10 Seam part 11 Surface material and adhesive layer removal part 12 Label 13 Peeling crack 14 IC tag adhesive label

Claims (3)

  An IC tag adhesive label, wherein an outer frame label is provided on an outer periphery of the IC tag.   The IC tag adhesive label according to claim 1, wherein a frame adhesive label is provided on an outer periphery of the outer frame label. An IC tag adhesive sheet according to claim 1 or 2, wherein two or more IC tag adhesive labels are affixed to a single flat release sheet.

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