JP3164389U - Wafer fixing pad - Google Patents

Abstract

A wafer that can be pivotally connected to a fixed seat for the purpose of assembling convenience and is further fixed in a lid for fixing a wafer, thereby reducing generation of fine dust during use. Provide a fixed pad. The wafer fixing pad is mainly provided with a fixing pad 1 and contact portions 11 provided on both sides of the fixing pad so as to make smooth contact with the wafer and prevent both from being damaged, and the fixing pad and the contact portion. Are provided with a plurality of support portions 12 for enhancing the strength of the fixed pad, and hollow portions 121 for enhancing elasticity are formed between the respective support portions for the convenience of assembly. In addition, a plurality of pivot portions 13 and 14 for pivotally mounting on the fixed seat 2 are formed on the fixed pad, and the wafer is fixed by fixing the fixed seat in the cover and rotated to the lower end of the fixed pad. The wheels are pivoted to reduce the generation of fine dust during use. [Selection] Figure 1

Description

  The present invention relates to a wafer fixing pad, and more particularly to a wafer fixing pad that is easy to assemble and can reduce fine dust during use.

Wafers are contaminated by the deposition of fine dust particles in the air during transportation, and the yield rate decreases, so wafers can be loaded and transported using a wafer case so that the wafers are not contaminated. It is necessary to perform this, and it is necessary to provide a wafer fixing device at an appropriate location in the wafer case so that the wafer does not hit and break in the middle of transportation.
For the above wafer fixing device, reference can be made to the patent invention of Taiwan Notice No. M291081, “Wafer Case and Upper Push Slide Structure Used in Wafer Case”. The invention is a wafer case suitable for mounting a plurality of wafers, the wafer case,
A pedestal,
A support seat disposed on the pedestal for supporting the wafer;
A housing that covers the support seat and the pedestal;
The upper push slide structure
A fixing plate fixed to one end in the housing, the fixing plate having a plurality of slide blocks located on opposite sides of the fixing plate;
A slider that is parallel to the fixed plate and that is positioned on opposite sides of the slider and has a plurality of slide grooves on which the slide block can slide. The slide block is located above the slide groove. When the slider moves from the dead center to the bottom dead center of the slide groove, the slider pushes and positions the wafer.
However, the above-described wafer fixing device is engaged and connected to the slide block of the fixed plate using the slide groove of the slider, so that the slider can move and position the wafer. However, the engagement connection and the slide system have the disadvantages that they lack flexibility in movement and have a large contact area, so that fine dust is easily generated.

  In view of the above-described drawbacks, the present invention has a plurality of pivot portions formed on a fixed pad so as to be able to pivot on the fixed seat for the purpose of assembling convenience, and a fixed seat for fixing a wafer. A wafer fixing pad that can reduce the generation of fine dust during use by being fixed in the lid.

  A specific embodiment of a wafer fixing pad according to the present invention includes a fixing pad, a contact portion that is provided on each side of the fixing pad, smoothly contacts the wafer, and prevents both from being damaged, and the fixing pad. A plurality of support portions that are provided between the contact portions and the contact portion to enhance the strength of the fixing pad, and a hollow portion that enhances elasticity is formed between the support portions, thereby improving the convenience of assembly. For the purpose of illustration, a plurality of pivot portions for pivotally mounting on the fixed seat are formed on the fixed pad, the wafer is fixed by fixing the fixed seat in the lid, and a rotating roller is provided at the lower end of the fixed pad. It is pivotally installed and can reduce generation of fine dust during use.

  According to a specific embodiment of the wafer fixing pad in the present invention, a plurality of support portions are installed correspondingly obliquely between the fixing pad and the contact portion so as to enhance the strength of the fixing pad. The

FIG. 3 is an exploded view according to Embodiment 1 of the present invention. The solid assembly figure which concerns on Embodiment 1 of this invention. The use reference figure which concerns on Embodiment 1 of this invention. The image figure in which the base which concerns on Embodiment 1 of this invention does not push a roller. The image figure with which the base which concerns on Embodiment 1 of this invention presses a roller. The image figure which the base which concerns on Embodiment 2 of this invention does not push a roller.

  In order to more fully and clearly disclose the technical contents used in the present invention, the purpose of the invention, and the effects achieved, the present invention will be described in detail below with reference to the drawings and the reference numerals of the drawings.

First, FIG. 1 is an image view showing a specific embodiment of a wafer fixing pad according to the present invention, and has a fixing pad (1) incorporated in a fixing seat (2) for fixing a wafer.
Both sides of the fixed pad (1) are contact portions (11) that form arcuate surfaces so that the wafers can be brought into contact smoothly and are not damaged. 12) and a plurality of support portions (12) are installed between the fixing pad (1) and the contact portion (11) at an oblique angle so that an acute angle is formed between the fixing pad (1) and the fixing pad (1). In order to reinforce the elasticity of each indicating portion (12), a hollow portion (121) is formed between each supporting portion (12), and also pivots to the fixed seat (2). In addition, a plurality of first pivot portions (13) and a plurality of second pivot portions (14) are provided on the upper and lower stages of the fixed pad (1), respectively, and further on the lower end of the fixed pad (1). The roller (15) is pivoted to reduce the generation of fine dust during use Kill.

  As shown in FIG. 3, fixing holes (21) are provided on both sides of the upper end of the fixing seat (2) in order to allow the screws to pass through and to be stably fixed in the lid (3). In order to pivot the pad (1), the first pivotal portion (13) and the second pivotal portion (14) corresponding to the stationary pad (1) on the stationary seat (2) are respectively positioned at the first pivotal portion (14). A rotating bar (22) and a second rotating bar (23) are provided, and in order to reduce the generation of fine dust and avoid wafer contamination, the first rotating bar (22) and the second rotating bar (23). Can rotate flexibly.

  As shown in FIGS. 2 to 4, in use, first, screws are passed through the fixing holes (21) on both sides of the fixing seat (2) and fixed to the inner wall of the lid (3). The first rotating bar (22) and the second rotating bar (23) of the fixed seat (2) with the fixing pad (1) sandwiched between the first pivoting part (13) and the second pivoting part (14), respectively. The base (4) on which the wafer is placed is covered with the lid (3). In this case, the upper surface of the pedestal (4) pushes the roller (15) of the fixed pad (1), the fixed pad (1) is centered on the first rotating bar (22) and the second rotating bar (23), By rotating and raising, the fixing pad (1) is pushed by the contact portion (11), so that the wafer can be fixed and the wafer can be stably positioned and not wobbling on the pedestal (4). In addition, the lid (3) covers the wafer on the pedestal (4), blocks fine dust in the outside air, and can reliably prevent the wafer from becoming dirty.

  FIG. 6 shows an image diagram of Embodiment 2 of the wafer fixing pad of the present invention. In the first embodiment, a first rotating bar (31) and a second rotating bar (32) are provided at appropriate positions on the inner wall of the lid (3), and the fixing pad (1) is attached to each first pad. The difference is that the pivot part (13) and each second pivot part (14) directly pivot to the first rotation bar (31) and the second rotation bar (32) on the inner wall of the lid (3). However, the embodiment or the drawings do not limit the aspect of the product of the present invention, the installation structure, or the method of use, and appropriate changes and modifications by those skilled in the art do not depart from the scope of the present invention. Not considered.

With the above structure and description, the present invention has the following advantages over the conventional structure.
1. The fixed pad of the present invention is provided with a plurality of first pivot portions and a plurality of second pivot portions for the purpose of easy assembly by pivoting the fixed seat, and the fixed seat is provided in the lid. The wafer is fixed by being fixed, and a roller is provided at the lower end of the fixed pad, so that generation of fine dust during use can be reduced.
2. Contact portions having arcuate surfaces are formed on both sides of the fixed pad of the present invention so as to smoothly contact the wafer so that both are not damaged. A plurality of support portions are provided, and the strength of the fixed pad is increased, and hollow portions are formed between the support portions to increase elasticity.
3. The fixed pad of the present invention fixes the wafer by fixing the fixed seat in the lid, and a roller is provided at the lower end of the fixed pad to reduce the generation of fine dust during use. it can.

DESCRIPTION OF SYMBOLS 1 Fixed pad 11 Contact part 12 Support part 121 Hollow part 13 1st pivot part 14 2nd pivot part 15 Roller 2 Fixed seat 21 Fixing hole 22 1st rotation bar 23 2nd rotation bar 3 Cover 31 1st rotation bar 32 2nd rotating bar 4 base

Claims (3)

A fixed pad,
Contact portions respectively formed on both sides of the fixed pad so that the wafer contacts;
A plurality of support portions provided between the fixed pad and the contact portion;
A hollow portion formed between each support portion;
A pivot formed on the fixed pad so as to be pivoted to the fixed seat and fixed in the lid;
A roller provided at the lower end of the fixed pad;
A wafer fixing pad.   The wafer fixing pad according to claim 1, wherein the contact portion has an arc surface.   The wafer fixing pad according to claim 1, wherein an acute angle is formed between the support portion and the fixing pad.

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