JP3159184B2 - Adjustment method of alignment unit in dicing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for adjusting an alignment unit in a dicing apparatus.

[0002]

2. Description of the Related Art In an alignment unit of a dicing apparatus, an image pickup means (CCD camera or the like) and a microscope are coaxially connected and incorporated. The connection means is conventionally shown in FIGS. 4 (a) and 4 (b). As shown, a cylindrical connecting means 2 is fitted into the mounting hole 1a on the upper part of the microscope 1 so that a flange 2a is formed.
Is fixed with screws 3, the coupled part 4 a of the imaging means 4 is inserted into the coupling means 2, and an image is taken with a plurality of tightening screws 5 attached radially (centripetally) to the side of the flange 2 a. The connected portion 4a of the means 4 is fastened and fixed.

[0003]

When the microscope 1 and the image pickup means 4 are incorporated in the dicing apparatus, it is necessary to prevent the image picked up by the image pickup means 4 and displayed on the monitor from being shifted. That is, as shown in FIGS. 5A and 5B, when the groove 7a on the dummy wafer 7 formed by the rotating blade 6 is captured by the microscope 1, the image is captured by the image capturing means 4, and is displayed on the monitor 8. Must be at least parallel to the cutting line L of the cutting groove 7a. For this reason, the imaging means 4 is rotated about the axis with respect to the microscope 1 fixed to the apparatus side (θ direction), and fine adjustment is performed so that the hair line C and the cutting line L are parallel. At the time of this fine adjustment work, the tightening screw 5 is loosened, and
After the adjustment, rotate the screw 5 again.
To fix the imaging means 4. However, the tip of the tightening screw 5 is strongly contacted with the coupled portion 4a of the imaging means 4 and is scratched, or the imaging means 4 is rotated due to the rotation of the screw.
Was distorted, and there was a problem in the fine adjustment work. The present invention has been made to eliminate such conventional disadvantages,
It is an object of the present invention to provide a method for preparing an alignment unit in a dicing apparatus capable of performing fine adjustment without damaging an imaging unit and without causing distortion.

[0004]

As a means for technically solving this problem, the present invention provides a microscope, imaging means, a fixing part for fixing to the microscope, and a coupled part of the imaging means. And a coupling means composed of a slit ring for tightening and fixing, and an alignment unit,
A method for adjusting an alignment unit in a dicing apparatus that performs adjustment between the microscope and an imaging unit, wherein a step of imaging a cutting line formed on a wafer by the alignment unit and projecting the cutting line on a monitor, and slitting the connection unit. Loosening the coupled part of the imaging means so as to be rotatable with respect to the microscope, and aligning the hairline displayed on the monitor with the cutting line projected on the monitor in parallel with the microscope. Rotating and adjusting the imaging means, and the cutting ring and the hairline projected on the monitor become parallel to each other, and after the adjustment is completed, the slit ring is used to fix the imaging means to the microscope. Fastening the dicing apparatus. Adjusting method Rye instrument unit in which the gist of the.

[0005]

The connecting means for connecting the microscope and the image pickup means has a slit ring, and the part to be joined of the image pickup means is entirely tightened and fixed by the slit ring so that the tightening screw does not contact the part to be joined. Therefore, no damage is caused, and no distortion occurs in the imaging means.

[0006]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. The same members as those in the related art are denoted by the same reference numerals. An alignment unit is composed of the microscope 1, the imaging means 4, and the connecting means 9 for connecting these components, and the connecting means 9 is integrally formed of aluminum, synthetic resin, or the like.
As shown in FIG. 1, there is a cylindrical portion 9a and a fixing portion 9b which bisects the cylindrical portion 9a substantially vertically, and the upper cylindrical portion is formed in a slit shape by a slit 9c. The slit 9
Cuts 9d are provided symmetrically along the upper surface of the fixed part 9b on both sides of the fixing part 9b. Thick fastening pieces 9e are provided on both sides of the slit 9c, and a tightening screw 10 is screwed therein. When the tightening screw 10 is tightened, the upper half cylindrical portion is narrowed. That is, the upper half cylindrical portion is formed in the slit ring portion 9f so that a rod-shaped object or the like inserted into the cylindrical portion 9a can be clamped. Further, the fixing portion 9b is provided with a plurality of mounting holes 9g along the circumferential direction.

The connecting means 9 is inserted into the mounting hole 1 a of the microscope 1, and the fixing portion 9 b is connected with the screw 11. Next, as shown in FIG. 2, the joined portion 4a of the imaging means 4 is inserted into the cylindrical portion 9a of the connecting means 9, and the fastening screw 10 is tightened to tighten the joined portion 4a by the slit ring portion 9f. Can be coaxially coupled.

At this time, since the distal end of the tightening screw 10 does not contact the coupled portion 4a of the imaging means 4 at all, no damage is caused, and no distortion occurs in the imaging means 4.
Moreover, since the to-be-coupled portion 4a of the imaging means 4 is entirely tightened and fixed by the slit ring portion 9f, a highly stable coupled state can be obtained.

The microscope 1 and the image pickup means 4 connected in this manner are used by being incorporated in an alignment means 13 of a dicing device 12 as shown in FIG. When the microscope 1 and the imaging unit 4 are combined and fixed, the fine adjustment of the imaging unit 4 with respect to the microscope 1 is performed in order to align the hair line C and the cutting line L in parallel as described above while watching the monitor 8.

At the time of this fine adjustment, a step of first taking an image of the cutting line L formed on the wafer by the alignment unit and projecting it on the monitor 8 is performed. If the cutting line L projected on the monitor 8 is not parallel to the hairline C formed on the monitor 8, the slit ring portion 9f of the connecting means 9 is loosened, and the coupled portion 4a of the imaging means 4 is moved to the microscope 1. And performing the step of making it rotatable.

Next, in order to align the hair line C displayed on the monitor 8 and the cutting line L projected on the monitor 8 in parallel, a step of rotating and adjusting the imaging means 4 with respect to the microscope 1 is performed. . If the tightening screw 10 is slightly loosened during this adjustment, the clamping of the slit ring portion 9f is released, and the imaging means 4 can be rotated in the θ direction, so that the adjustment work becomes very easy. In the related art, unless the plurality of tightening screws 5 are all loosened, the imaging unit 4 cannot be rotated in the θ direction, so that the adjustment operation is troublesome.

After the adjustment is completed, a step of fastening the slit ring portion 9f to fix the imaging means 4 to the microscope 1 is performed. Also in this case, since the operation can be performed only by the tightening screw 10, the operation is remarkably simpler than the conventional case.

In the dicing apparatus 12, wafers are unloaded one by one from a cassette 15 to a standby area 16 by a slidable loading / unloading means 14, and are transported to a chuck table 18 by a transporting means 17 having a rotating arm. Thereafter, the alignment unit 13 is moved to a lower portion to perform alignment. This alignment is performed by taking an image with the imaging means 4 in the conventional manner, and the situation is displayed on the monitor 8.

After the completion of the alignment, the chuck table 18 is further moved and the cutting means 19 provided with a rotating blade is provided.
Performs dicing. After the dicing, the chuck table 18 returns to the initial position, the wafer is transferred to the cleaning area 21 by the slide-type transfer means 20, and after being cleaned, is returned to the standby area 16 by the transfer means 17, and is transferred by the transfer-in / out means 14. The cassette 15
Will be stored again inside. This series of operations is performed continuously with a certain timing.

Reference numeral 22 denotes a transparent disk cover mounted on the upper surface of the tip of the turning arm of the transfer means 17 for preventing contamination of the wafer in the standby area 16. A transparent disk cover mounted on the suction mechanism is used to cover the opening of the cleaning area 21 at the time of cleaning to prevent scattering of the cleaning liquid.

[0016]

As described above, according to the method of the present invention, the microscope of the alignment unit to be incorporated in the alignment means of the dicing apparatus and the imaging means are connected by the connection means having a slit ring to perform fine adjustment work. As a result, a highly stable coupling state can be obtained, and the single screw for opening and closing the slit ring is operated without damaging the portion to be coupled of the imaging means or distorting the imaging means. It is possible to obtain an excellent effect such that fine adjustment in the θ direction of the image pickup means can be easily and reliably performed by only the above.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an attachment point of a connecting means according to an embodiment of the present invention.

FIG. 2 is a front view showing a connection state between the microscope and the imaging means.

FIG. 3 is a perspective view of a dicing apparatus incorporating an alignment unit.

FIGS. 4A and 4B show a conventional example, in which FIG. 4A is a perspective view showing the connection procedure between the microscope and the imaging means, and FIG. 4B is a front view showing the connection state.

FIG. 5A is a perspective view showing a manner in which a dummy wafer is grooved by a rotating blade, and FIG. 5B is an image in which a cutting line imaged by an imaging means is projected on a monitor, and the imaging means is compared with a hairline of the monitor in the θ direction. FIG. 7 is an explanatory diagram showing a state of fine adjustment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Microscope 2 ... Connection means 3 ... Screw 4 ... Imaging means 5 ... Tightening screw 6 ... Rotating blade 7 ... Dummy wafer 8 ... Monitor 9 ... Connection means 10 ... Tightening screw 11 ... Screw 12 ... Dicing device 13 ... Alignment means 14 ... Loading / unloading means 15 Cassette 12 Standby area 17 Transport means 18 Chuck table 19 Cutting means 20 Transport means 21 Cleaning area 22, 23 Transparent disk cover

Continuation of the front page (56) References JP-A-63-271215 (JP, A) JP-A-55-54157 (JP, A) JP-A-62-157760 (JP, A) JP-A-5-45135 (JP) , A) Fully open 1974-131237 (JP, U) Fully open 1974-63033 (JP, U) Fully open 1974-16323 (JP, U) Fully open 4-18833 (JP, U) Fully open 63-176062 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G02B 19/00-21/00 G02B 21/04-21/36

Claims (1)

(57) [Claims] 1. An alignment unit comprising a microscope, imaging means, a fixing part for fixing to the microscope, and a connecting means comprising a slit ring for tightening and fixing a joined part of the imaging means. A method for adjusting an alignment unit in a dicing apparatus for adjusting the microscope and the imaging means, wherein a cutting line formed on a wafer is imaged by the alignment unit and projected on a monitor; Loosening the coupled part of the imaging means so as to be rotatable with respect to the microscope; and adjusting the hairline displayed on the monitor and the cutting line projected on the monitor in parallel with the microscope. Rotating and adjusting the imaging means with respect to Fastening the slit ring to fix the imaging means to the microscope after the cut line and the hair line become parallel and the adjustment is completed, and an adjustment method of an alignment unit in the dicing apparatus, comprising: .