JP3158817U - Light emitting diode package structure with multiple light emitting surfaces - Google Patents

Abstract

Provided is a light emitting diode package structure that allows uniform emission by simultaneously emitting light emitted from a plurality of light emitting chips.
A first conductive support body 1 made of a plate material having a rectangular shape as a main body, a plurality of LED chips 3 distributed on the first conductive support body, and one of the first conductive support bodies. Second conductive support 1A provided on the outside, third conductive support 2 provided on the other outer side of the first conductive support, a plurality of fluorescent layers covering the surfaces of the plurality of LED chips, light It is made of a material having transparency. Furthermore, the conductive support, the plurality of LED chips, the plurality of conductive lines, and the plurality of fluorescent layers are all molded. In addition, the rectangular block 21 above the third conductive support, the series connection of the plurality of LED chips with the plurality of conductive wires, and connected to each other on both surfaces of the first conductive support, The plurality of LED chips on both sides of the first conductive support are simultaneously conducted, and uniform light emission is achieved by the plurality of light emitting surfaces.
[Selection] Figure 3

Description

The present invention relates to a light emitting diode, and more particularly to a light emitting diode package structure that can be extended by a bridge connection to have a plurality of light emitting surfaces.

The electronic science industry has become an indispensable industry in the 21st century. In particular, with the global shortage of energy resources on a global basis, the recent relocation of industries to foreign countries, intensifying dumping competition through relay trade, and the global economic recession have had a major impact on domestic companies and products. It has become essential to improve the energy-saving technology of products in order to make them more competitive.

Currently, a general LED lamp using a single light-emitting diode chip is widely applied to various electronic products as a light-emitting source. For example, a mobile phone, a PDA, an IPOD, a GPS navigator, a video camera, a camera, a liquid crystal display, a notebook computer, a traffic signal lamp, a street lamp, and the like.

As shown in FIG. 6, a conventional light emitting diode has a structure in which a chip is placed in a cup above a conductive pin to refract a light beam and collect the light forward. Therefore, in actual use, the light beam emitted from a single chip can be collected only in one direction, so that the light beam cannot be emitted in multiple directions and uniform light beam emission can be achieved. I can't. For this reason, it can be said that the conventional LED lamp structure has room for improvement for various practical applications.

  The present invention provides a light emitting diode package structure having a plurality of light emitting surfaces that can emit light simultaneously by bridging light emitting chips provided on a plurality of surfaces and can achieve uniform light emission. The purpose is to provide.

It is another object of the present invention to provide a light emitting diode package structure having a plurality of light emitting surfaces capable of changing the color of light emitted from a chip.

Accordingly, a package structure of a light emitting diode having a plurality of light emitting surfaces according to the present invention is provided in a body and a first conductive support made of a rectangular plate, and distributed on the top of the first conductive support. A plurality of LED chips, a second conductive support provided on one outer side of the first conductive support, a third conductive support provided on the other outer side of the first conductive support, and fluorescent powder A film layer comprising a plurality of fluorescent layers covering the surfaces of the plurality of LED chips and a material having light transmission properties, the conductive support, the plurality of LED chips, the plurality of conductive wires, A plurality of fluorescent layers, and a plurality of LED chips connected in series by the plurality of conductive wires by a rectangular block above the third conductive support. Composed on both sides Further, each series structure is bridge-connected, and the plurality of LED chips on both surfaces of the first conductive support can be made to conduct simultaneously, and uniform light radiation can be achieved by the plurality of light emitting surfaces. Configure as you can.

  Since the light emitting diode package structure according to the present invention can achieve uniform light emission, the light emitting diode package structure can be widely applied to various lighting fixtures that require uniform illumination, providing convenience, and an LED chip. Since the color of the light beam can be changed to correspond to various uses, there is an effect that a high degree of compatibility with industrial applications and a wide variety can be obtained.

1 is a perspective view illustrating an appearance of a light emitting diode according to the present invention. It is the exploded view which showed the structure of the light emitting diode disclosed in FIG. It is explanatory drawing which showed the structure of the light emitting diode by this invention. It is sectional drawing which showed the internal structure of the mold part in this invention. It is explanatory drawing which showed the state which the light emitting diode by this invention light-emitted. It is explanatory drawing of the conventional structure of this invention. 6 is an exploded view showing the structure of a light emitting diode in Example 2. FIG. FIG. 6 is an explanatory diagram showing a structure of a light emitting diode in Example 2. FIG. 6 is an exploded view showing a structure of a light emitting diode in Example 3. It is explanatory drawing which showed the structure of the light emitting diode in Example 3. FIG. 6 is an exploded view showing the structure of a light emitting diode in Example 4. FIG. It is explanatory drawing which showed the structure of the light emitting diode in Example 4. FIG. FIG. 10 is an exploded view showing a structure of a light emitting diode in Example 5. FIG. 10 is an explanatory diagram showing a structure of a light emitting diode in Example 5. FIG. 10 is an exploded view showing the structure of a light emitting diode in Example 6. It is explanatory drawing which showed the structure of the light emitting diode in Example 6. FIG.

As shown in FIGS. 1 to 5, the package structure of a light emitting diode having a plurality of light emitting surfaces according to the present invention includes a conductive support 1, 1A, 2, a plurality of LED chips 3, a plurality of conductive lines 5, and a plurality of fluorescent lights. The layer 6 and the mold part 7 are included.

The conductive support 1 is a first conductive support that is a main body, and is made of a rectangular plate. The conductive support 1 </ b> A is a second conductive support, and is installed outside the first conductive support 1. The conductive support 2 is a third conductive support, and is installed on the other outer side of the first conductive support 1. The plurality of LED chips 3 are light emitting diode chips that are semiconductor elements, and are dispersed and fixed on the surface of the conductive support 1. The plurality of conductive wires 5 are conductive wires, and in the embodiment, both ends thereof are electrically connected to the respective LED chips 3, the plurality of LED chips 3 are connected in series, and both ends of the series are connected. One end of the conductive wire 5 positioned at is electrically connected to the conductive supports 1A and 2 to form a series connection.

The plurality of fluorescent layers 6 are film layers containing fluorescent powder and cover the surface of each chip. The mold part 7 is made of a material having optical transparency such as resin or silica gel, and molds all of the conductive supports 1, 1A, 2, the plurality of LED chips 3, the plurality of conductive lines 5, and the plurality of fluorescent layers 6. It becomes. The above are the main structural features of the present invention.

That is, in the embodiment of the light emitting diode package structure having a plurality of light emitting surfaces according to the present invention, a plurality of LED chips 3 are evenly distributed on both surfaces of the first conductive support 1 as shown in FIGS. The plurality of LED chips 3 are connected in series by a conductive wire 5. A second conductive support 1 </ b> A is installed on one side of the first conductive support 1, and the second conductive support 1 </ b> A serves as an electrode and is positioned at both ends of a series connection structure including a plurality of LED chips 3. It is electrically connected to one end of the conductive wire 5 to be connected. A third conductive support 2 is installed on the other side of the first conductive support 1. In addition, the rectangular block 21 above the third conductive support 2 connects the other ends of the series structure in which the LED chips 3 are connected in series with the conductive wires 5 on both sides of the first conductive support 1 and are bridge-connected. The LED chips 3 on both surfaces of the one conductive support 1 can be made to conduct simultaneously. After the rectangular block 21 is bridge-connected, the rectangular block 21 is molded into the molding unit 7. As described above, a single LED is expanded by bridge connection, and the light emitting diode package structure has a plurality of light emitting surfaces, and these light emitting surfaces can emit light at the same time. It can be achieved and the industrial utility is improved.

In an embodiment of the present invention, the surface of each LED chip 3 is covered with a fluorescent layer 6, and the color of light emitted from the LED chip can be changed.

As shown in FIGS. 7 and 8, the light emitting diode package structure having a plurality of light emitting surfaces according to another embodiment of the present invention has a connecting hole 12 on the other side of the first conductive support 1. The third conductive support 2 that is drilled and has a corresponding shape is inserted. An insulating layer A is installed between the connection hole 12 and the third conductive support 2. The other end of the series structure in which the LED chip 3 is connected in series by the conductive wire 5 and configured on both surfaces of the first conductive support 1 is bridge-connected by the third conductive support 2. The LED chips 3 on both sides can be made to conduct simultaneously.

As shown in FIGS. 9 and 10, the light emitting diode package structure having a plurality of light emitting surfaces according to another embodiment of the present invention has a C-type third on the other side of the first conductive support 1. A conductive support 2 is provided, and a corresponding C-type insulating layer A is installed between the first conductive support 1 and the third conductive support 2. The other end of the series structure in which the LED chip 3 is connected in series by the conductive wire 5 and configured on both surfaces of the first conductive support 1 is bridge-connected by the third conductive support 2. The LED chips 3 on both sides can be made to conduct simultaneously.

As shown in FIGS. 11 and 12, the package structure of a light emitting diode having a plurality of light emitting surfaces according to another embodiment of the present invention includes three sets of first conductive supports using a triangular frame B and a triangular pedestal C. The body 1 can be combined to form a triangular support. A second conductive support 1A and a third conductive support 2, 2A are fitted at each end of the triangular support. Each third structure in which the LED chip 3 is connected in series with the conductive wire 5 and configured on the surface of each substrate by the third conductive support is bridge-connected next to each other so that the three surfaces can be conducted simultaneously. Become.

As shown in FIGS. 13 and 14, the light emitting diode package structure having a plurality of light emitting surfaces according to another embodiment of the present invention has four sets of first conductive supports by using a square frame B and a square base C. The body 1 can be combined to form a rectangular support. The second conductive support 1A and the third conductive supports 2, 2A, 2B are fitted on each end of the rectangular support. With the third conductive support, each series structure in which the LED chips 3 are connected in series with the conductive wires 5 and formed on the surface of each substrate is bridge-connected next to each other so that the four surfaces can be made conductive at the same time. Become.

As shown in FIGS. 15 and 16, the light emitting diode package structure having a plurality of light emitting surfaces according to another embodiment of the present invention includes six sets of first conductive supports using a hexagonal frame B and a hexagonal pedestal C. The body 1 can be combined to form a hexagonal support. The second conductive support 1A, the third conductive support 2, 2A, 2B, 2C, and 2D are fitted to each end of the hexagonal support. Each third structure in which the LED chip 3 is connected in series with the conductive wire 5 and configured on the surface of each substrate by the third conductive support is bridge-connected next to each other so that the six surfaces can be conducted simultaneously. become.

DESCRIPTION OF SYMBOLS 1, 1A 2, 2, 2A, 2B, 2C, 2D Conductive support body 3 LED chip 5 Conductive wire 6 Fluorescent layer 7 Mold part 12 Connection hole 21 Rectangular block A Insulating layer B Frame C Base

Claims (3)

A first conductive support made of a plate material that is a main body and has a rectangular shape;
A plurality of LED chips distributed on the top of the first conductive support;
A second conductive support provided on one outer side of the first conductive support;
A third conductive support provided on the other outer side of the first conductive support;
A film layer containing fluorescent powder, a plurality of fluorescent layers covering the surfaces of the plurality of LED chips;
It is made of a material having light transmissivity, and is constituted by the conductive support, the plurality of LED chips, the plurality of conductive lines, and a mold part that molds all of the plurality of fluorescent layers,
The rectangular blocks above the third conductive support are bridge-connected with each of the series structures in which the plurality of LED chips are connected in series with the plurality of conductive wires and configured on both sides of the first conductive support. A plurality of LED chips on both sides of one conductive support can be made to conduct at the same time, and a plurality of light emitting surfaces can achieve uniform light emission, Light emitting diode package structure with a light emitting surface. The first conductive support and the third conductive support can be expanded by bridge connection to form three or more light emitting surfaces, and the plurality of light emitting surfaces can be made conductive at the same time. A package structure of a light emitting diode having a plurality of light emitting surfaces according to claim 1. The said 3rd electroconductive support body can be made into a C-shaped clip shape or circular rod shape, and is insulated and installed in one side of a 1st electroconductive support body, The Claim 1 characterized by the above-mentioned. Light emitting diode package structure with multiple light emitting surfaces.

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