JP3146749U - Multilayer chip LC filter with spatial overvoltage protection element - Google Patents

Abstract

The present invention provides a multilayer chip type LC filter that can solve electrostatic discharge and electromagnetic interference encountered during high-speed signal propagation, which has two functions of overvoltage protection and LC filter.
In the LC filter, a metal layer 41 on the second intermediate substrate 4 acts as an inductance, and a capacitance is formed between the first intermediate substrate 3 and the electrode layer 2 of the lower substrate 1. A type of filter is configured. The electrode layer 2 is cut by the two first grooves 21 and 22 formed on the electrodes of the cross-shaped electrode layer 2 and extended to the inside of the lower substrate 1 to form a space having an overvoltage protection function. .
[Selection] Figure 2

Description

  The present invention relates to a multilayer chip type LC (inductance-capacitance) filter, and more particularly to a multilayer chip type LC filter having a spatial overvoltage protection element formed by combining an LC filter and a spatial overvoltage protection element. It is.

  Current electronic devices focus on transmitting signals at high speed. And the requirements for the overvoltage protection device characteristics of electrostatic discharge (ESD) are particularly strict. An overvoltage protection device having a low capacitance value can avoid attenuation of a high-frequency signal having a high propagation speed. A noise signal in the atmosphere appears as interference on the signal line due to the coupling action, which causes a false signal recognition of the IC. Therefore, the combination of the filter and the overvoltage protection is very important with respect to high-speed signal propagation.

  In view of the above circumstances, an overvoltage protection device and a device having both functions of an LC filter will be developed to solve electrostatic discharge and electromagnetic interference (EMI) generated during high-speed signal propagation at once. Is the purpose of the present invention.

  As a means for solving the above problems, in the present invention, in an LC filter in which a plurality of substrates are stacked, an electrode layer separated by a first groove is formed on the surface, and the first groove is extended to the inside. A first intermediate substrate provided on the first substrate with an electrode layer interposed between the first substrate and a second groove having a width and length equal to the first groove at a position corresponding to the first groove; And a second intermediate substrate provided on the side of the first intermediate substrate opposite to the surface on which the first substrate is present, and a surface of the second intermediate substrate on the surface opposite to the surface on which the second intermediate substrate is present. And a metal layer having an inductance provided between the second intermediate substrate and the second intermediate substrate, and the electrode layer is a space formed by the first groove and the second groove. The direction connecting the two metal ends formed on the metal layer is the direction connecting the first groove We, between the metal layer and the electrode layer to have a role as a capacitance, to provide a laminated chip type LC filter having a spatial over-voltage protection device.

  In addition, the space provided between the first substrate and the first intermediate substrate is configured to be surrounded by the first substrate, the electrode layer, and the second substrate.

  The electrode layer has a cross shape, includes a transmission line and a ground line, and the first groove is formed on the transmission line.

  The metal layer formed between the second intermediate substrate and the second substrate has a shape that reciprocates in a meandering manner.

  The inductance value can be adjusted by changing the number of layers or the thickness of the first intermediate substrate.

  The metal layer is formed on the surface of the second intermediate substrate or the surface of the second substrate.

  The metal layer may be divided into a plurality of layers and formed into a three-dimensional spiral structure.

  The third intermediate substrate includes a third intermediate substrate between the second intermediate substrate and the second substrate, and the three-dimensional spiral metal layer includes a first spiral metal layer formed on the second intermediate substrate, and a third A second spiral metal layer formed on the intermediate substrate was connected to be configured.

  Further, a fourth connection hole having a through hole that connects the metal layer between the second intermediate substrate and the third intermediate substrate so as to extend the distance between the first spiral metal layer and the second spiral metal layer. An intermediate substrate was provided.

  For more detailed features, functions and applications of the LC filter of the present invention, please refer to the embodiments of the present invention described below with reference to the drawings attached to this specification.

  The multilayer chip type LC filter according to the present invention is mainly provided with one cross-shaped electrode layer on the upper surface of the lower substrate, and provided with spaces (air gaps) at both ends of the electrode line in any one direction, overvoltage protection. It was set as the element. Further, one intermediate substrate is prepared, and an inductance having a structure reciprocating in a meandering manner or an inductance having a three-dimensional spiral structure is formed thereon. A capacitance is formed between the intermediate substrate having the inductance and the electrode layer on the lower substrate.

  Please refer to FIGS. 1 (a) to 1 (d) and FIG. The multilayer chip type LC filter according to the present invention includes the following parts.

  A lower substrate 1 having a cross-shaped electrode layer 2 formed on the upper surface. The electrode layer 2 includes electrodes of a transmission line and a ground line. Two first grooves 21 and 22 are formed in the electrode line. The first grooves 21 and 22 cut the electrode layer 2 and further extend into the lower substrate 1.

  Second grooves 31 and 32 penetrating the first intermediate substrate 3 are formed in the first intermediate substrate 3. The positions of the second grooves 31 and 32 correspond to the first grooves 21 and 22 of the lower substrate 1, and the width and length thereof are the same as those of the first grooves 21 and 22.

  The second intermediate substrate 4 is provided on the first intermediate substrate 3, a reciprocating metal layer 41 is formed on the upper surface thereof, and the transmission line is divided into two parts. Both ends of the transmission line become the electrode layer 41, and the direction connecting both ends of the transmission line of the electrode layer 41 coincides with the direction connecting the spaces of the electrode layers provided on the lower substrate 1.

  The upper substrate 5 covers the second intermediate substrate 4.

  The upper substrate 5 covers the second intermediate substrate 4 and the first intermediate substrate 3 and further covers the lower substrate 1 and then covers the external electrode to constitute a device that also serves as overvoltage protection by a filter and space. .

  Refer to FIG. In the LC filter according to the present invention, the metal layer 41 on the second intermediate substrate 4 acts as an inductance, and a capacitance is formed between the first intermediate substrate 3 and the electrode layer 2 of the lower substrate 1. A type of filter is configured. The electrode layer 2 is cut by the two first grooves 21 and 22 formed on the electrode of the cross-shaped electrode layer 2 and extended to the inside of the lower substrate 1 to form a space having an overvoltage protection function. .

  The LC filter according to the present invention is not limited to the combination shown in FIGS. 1A to 1D and 2, and as shown in FIG. 4, a reciprocating metal layer 51 having inductance is provided on the lower surface of the upper substrate 5. Can be formed. At the time of combination, the upper substrate 5 is directly covered on the first intermediate substrate 3 to form an LC filter.

  A second embodiment of the present invention is shown in FIGS. 5 (a) to 5 (f), FIG. 6, and FIG. The apparatus in this embodiment includes the following parts.

  A cross-shaped electrode layer 110 formed on the surface of the lower substrate 100. Two first grooves 111 and 112 are formed on an electrode line in any one direction of the electrode layer 110, and the electrode layer 110 is cut and extended to the inside of the lower substrate 100. The intermediate substrate 200 is provided on the lower substrate 100. Second grooves 201 and 202 having the same width and length are formed on the first intermediate substrate 200 at positions corresponding to the first grooves 111 and 112.

  The second intermediate substrate 300 is provided on the first intermediate substrate 200. In order to form a planar metal functioning as an inductance on the surface of the second intermediate substrate 300 in a spiral shape, a first spiral metal layer 400 is formed and an input end 401 is provided thereon.

  The third intermediate substrate 500 is provided on the second intermediate substrate 300. A penetrating metal hole layer 501 is provided in the third intermediate substrate 500 so as to correspond to a position away from the input end of the metal layer 400 on the second intermediate substrate 300.

  The fourth intermediate substrate 600 is provided on the third intermediate substrate 500. Another second spiral metal layer 610 functioning as an inductance is formed on the fourth intermediate substrate 600. A penetrating metal layer 620 is provided at one end of the second spiral metal layer 610, a metal hole layer 501 of the third intermediate substrate 500, and a terminal that is not an input end of the metal layer 400 of the second intermediate substrate 300. One end of the second spiral metal layer 610 is connected as an output end 630. Such a solid vortex inductance is configured to provide a much higher inductance, and the number of windings can be increased according to the required inductance value.

  An upper substrate 700 is provided to cover the fourth intermediate substrate 600.

  FIG. 8 is an explanatory diagram in which a part of the second embodiment of the present invention is modified. According to this figure, the third intermediate substrate 500 is not used, the metal hole layer 620 that penetrates the spiral metal layer 610 of the fourth intermediate substrate 600 is directly used, and the input end of the metal layer 400 of the second intermediate substrate 300 is used. Connected with no terminal, and constitutes a three-dimensional vortex inductance.

  Alternatively, as shown in FIG. 9, the fourth intermediate substrate 600 is not used, and another one-stage spiral metal layer 710 having direct inductance is formed on the lower surface of the upper substrate 700, and one end thereof is connected to the third intermediate substrate. A solid vortex inductance can be formed by connecting the metal hole layer 501 of the substrate 500 and a terminal that is not the input end of the metal layer 400 of the second intermediate substrate 300.

  The electrode layer according to the present invention is formed of one of metals such as gold, silver, palladium, platinum, tungsten, copper, or an alloy that is an arbitrary combination of metals therein, or a mixed material. The electrode layers formed by cutting the grooves may each have a pointed shape and may have a discharge function.

  The metal layer according to the present invention is formed of one of metals such as gold, silver, palladium, platinum, tungsten, copper, or an alloy that is an arbitrary combination of metals therein, or a mixed material. The electrode layer and the metal layer may be formed of the same material or different materials.

Each of the substrates according to the present invention is formed into a multilayer thin film of an insulating material or a ferroelectric material. The insulating material includes at least one of aluminum element, for example, Al in Al ₂ O ₃ , titanium element, or silicon element.

  The device according to the present invention has two functions of an overvoltage, particularly electrostatic discharge protection, and an LC filter with a clever configuration such as a first groove provided in the electrode layer and a second groove in the intermediate layer, There is an effect that electrostatic discharge and electromagnetic interference generated during high-speed signal propagation can be solved at a time. The present invention is not only different in form, but can be added with the above-mentioned functions compared with the conventional similar devices, and it is considered that the present invention sufficiently meets the requirements of the legal utility model registration request for novelty and inventive step. .

  The above detailed description is a specific description of the feasible embodiments of the present invention. However, these examples do not limit the scope of claims of the present invention, and all implementations or modifications of equivalent effects made without departing from the technical spirit of the present invention are all within the scope of claims of the present invention. Shall be included.

FIG. 3 is an exploded plan view of a first embodiment of an LC filter according to the present invention. FIG. 3 is an exploded plan view of a first embodiment of an LC filter according to the present invention. FIG. 3 is an exploded plan view of a first embodiment of an LC filter according to the present invention. FIG. 3 is an exploded plan view of a first embodiment of an LC filter according to the present invention. FIG. 3 is a three-dimensional exploded view of a first embodiment of an LC filter according to the present invention. These are sectional drawings in 1st Example of LC filter based on this invention. FIG. 5 is another combination diagram in the first embodiment of the LC filter according to the present invention. These are the exploded top views in 2nd Example of LC filter based on this invention. These are the exploded top views in 2nd Example of LC filter based on this invention. These are the exploded top views in 2nd Example of LC filter based on this invention. These are the exploded top views in 2nd Example of LC filter based on this invention. These are the exploded top views in 2nd Example of LC filter based on this invention. These are the exploded top views in 2nd Example of LC filter based on this invention. These are the three-dimensional exploded views in 2nd Example of LC filter based on this invention. These are sectional drawings in 2nd Example of LC filter based on this invention. These are another combination figures in 2nd Example of LC filter based on this invention. These are another one combination figure in 2nd Example of LC filter based on this invention.

Explanation of symbols

1 Lower substrate,
2 Cross electrode layer,
21, 22 First groove,
3 first intermediate substrate,
31, 32 second groove,
4 Second intermediate substrate,
41 reciprocating metal layer,
5 Upper substrate,
100 lower substrate,
110 Cross electrode layer,
111, 112 first groove,
200 first intermediate substrate,
201, 202 second groove,
300 second intermediate substrate,
400 spiral metal layer,
401 input terminal,
500 third intermediate substrate,
501 metal pore layer,
600 fourth intermediate substrate,
610 spiral metal layer,
620 metal layer,
630 output end,
700 upper substrate,
710 A spiral metal layer.

Claims (13)

In LC filters with multiple substrates stacked,
An electrode layer separated by a first groove is formed on a surface, and the first substrate has the first groove extended to the inside;
A first intermediate substrate having a second groove having a width and length equal to the first groove at a position corresponding to the first groove and provided on the first substrate through the electrode layer When,
A second intermediate substrate provided on the surface of the first intermediate substrate opposite to the surface on which the first substrate is located;
A second substrate provided on a surface of the second intermediate substrate opposite to the surface on which the second intermediate substrate is located;
A metal layer provided between the second intermediate substrate and the second substrate and having an inductance;
Including
An electrode is constituted by the electrode layer separated by a space formed by the first groove and the second groove,
The direction connecting the two metal ends formed on the metal layer coincides with the direction connecting the first grooves,
A multilayer chip LC filter having a spatial overvoltage protection element, which has a role as a capacitance between the metal layer and the electrode layer.   The LC filter according to claim 1, wherein the space provided between the first substrate and the first intermediate substrate is surrounded by the first substrate, the electrode layer, and the second substrate. The electrode layer has a cross shape and includes a transmission line and a ground line,
The LC filter according to claim 1, wherein the first groove is formed on the transmission line.   4. The LC filter according to claim 1, wherein the metal layer formed between the second intermediate substrate and the second substrate has a shape reciprocating in a meandering manner. 5.   5. The LC filter according to claim 1, wherein the inductance value is adjusted by changing the number of layers or the thickness of the first intermediate substrate. 6.   The LC filter according to any one of claims 1 to 5, wherein the metal layer is formed on a surface of the second intermediate substrate.   The LC filter according to any one of claims 1 to 5, wherein the metal layer is formed on a surface of the second substrate.   The LC filter according to any one of claims 1 to 7, wherein the metal layer is divided into a plurality of layers and formed in a three-dimensional spiral structure. Including a third intermediate substrate between the second intermediate substrate and the second substrate;
The metal layer having the three-dimensional spiral structure includes a first spiral metal layer formed on the second intermediate substrate and a second spiral metal layer formed on the third intermediate substrate. The LC filter according to claim 8, wherein the LC filter is configured to be connected.   A through-hole that connects the metal layer between the second intermediate substrate and the third intermediate substrate so as to extend a distance between the first spiral metal layer and the second spiral metal layer. The LC filter according to claim 9, wherein a fourth intermediate substrate is provided.   The electrode layer and the metal layer are made of one kind of metal such as gold, silver, palladium, platinum, tungsten, copper, and an alloy that is an arbitrary combination of metals therein, or a mixed material. The LC filter according to claim 10.   The LC filter according to any one of claims 1 to 11, wherein the substrate is an insulating material or a ferroelectric material.   The LC filter according to claim 12, wherein the insulating material includes at least one of an aluminum element, a titanium element, or a silicon element.

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