JP3146583U - Transfer molding device with liquid supply mechanism - Google Patents

Abstract

Disclosed is a transfer molding apparatus provided with a liquid supply mechanism that can accelerate the production speed, reduce the raw material cost of additives, and eliminate the step of high-frequency preheating.
A transfer molding apparatus including a liquid supply mechanism includes a mold and a liquid supply mechanism. The mold 20 includes a lower mold core 21 and an upper mold core 22 disposed corresponding to the lower mold core 21, and a charge hole 211 is provided on the lower mold core 21. The liquid supply mechanism 30 includes a carry table 31 installed on one side of the lower mold core 21, a moving module 32 that slides relative to the carry table 31, and a pouring unit 33 that is fixed to the moving module 32. The pouring unit 33 includes a jet nozzle 332, and the jet nozzle 332 fills the liquid raw material corresponding to the charge hole 211 by the sliding movement of the moving module 32.
[Selection] Figure 2

Description

  The present invention relates to a molding apparatus, and more particularly to a transition molding apparatus having a liquid supply mechanism that is a transition molding apparatus used for enclosing a semiconductor or a light emitting diode.

Many of the conventional semiconductor and light-emitting diode transfer molded encapsulations are made from solid-state lock epoxy resin.
In the case of a tablet-like epoxy resin having a relatively large volume, first, high-frequency preheating is performed, and thereafter, it is put into a charge hole of a mold, and a telescopic rod is pushed into a flow channel by a piston.
In the case of a capsule having a small volume and a relatively large quantity, a plastic material is supplied by a solid material supply device.

As shown in FIG. 1, the solid supply device 30a mainly includes a rectangular frame 31a.
A large number of through holes 311a are formed on the rectangular frame 31a.
Two grips 32a are connected below the rectangular frame 31a, and a turn arm 33a movably connected to the rectangular frame 31a is installed on the right side of the left grip 32a.
A thrust bar assembly 34a is connected to one end of the turn arm 33a.
The thrust bar 34a controls the stop plate 35a, and performs blocking or opening movement in the through hole 311a of the rectangular frame 31a.

In use, each solid material 8a is filled in each through-hole 311a, and its bottom is stopped and restricted by the stop plate 35a.
Next, the solid material supply device 30a moves into a mold (not shown) of the molding machine.
When the turn arm 33a is turned, the stop plate 35a slides and each solid material 8a falls from the through hole 311a into a heating tube (not shown) of the mold and enters.

However, the conventional transfer molding apparatus has the following problems in actual use.
First, an additive must be added to a liquid plastic raw material to solidify it, and then the solid plastic material must be made into a tablet to produce solid materials 8a of various shapes. For the first time in this way, it is put into the heating tube of the mold manually or by the solid material supply device 30a.
This increases the number of processes and consumes a large amount of manufacturing costs, and further increases the raw material costs for additives and equipment costs for tools such as tablet processing.

In a capsule having a relatively large volume, first, it is necessary to heat soften the solid material 8a by a high-frequency preheating method. Thereafter, the solid material 8a is put again into the heating tube of the mold.
Accordingly, the production speed cannot be effectively increased, and the molding machine needs to be produced together with a high-frequency heater, so that it is not easy to reduce the production cost of the molding equipment.
The present invention has been made in view of the above-described drawbacks of the conventional transfer molding apparatus.
JP-A-5-192926

The first problem to be solved by the present invention is to provide a liquid material directly to the transfer molding device, thereby accelerating the production speed and omitting the high-frequency preheating process. Is to provide
The second problem to be solved by the present invention is to supply a liquid material that can eliminate the processing steps, reduce the manufacturing cost, reduce the raw material cost of the additive, and reduce the equipment cost of the tool such as tablet processing. It is to provide a transfer molding apparatus provided with a mechanism.

In order to solve the above-mentioned problems, the present invention provides a transfer molding apparatus including the following liquid supply mechanism.
The transfer molding apparatus provided with a liquid supply mechanism includes a mold and a liquid supply mechanism,
The mold includes a lower mold core and an upper mold core disposed corresponding to the lower mold core,
A charge hole is installed on the lower mold core,
The liquid supply mechanism includes a carry base installed on one side of the lower mold core, a moving module that slides relative to the carry base, and a pouring unit that is fixed to the moving module.
The pouring unit includes a jet nozzle, and the jet nozzle corresponds to the charge hole by sliding movement of the moving module, and is filled with a liquid raw material.
Further, the present invention has the following features.
The dispensing unit further includes a stock cylinder fixed to the moving module, and the jet nozzle is connected to the lower side of the stock cylinder.
The liquid supply mechanism further includes a transport pipe and a supply unit, and the stock cylinder obtains the liquid raw material from the supply unit through the transport pipe.
The transfer molding apparatus provided with the liquid supply mechanism further includes a propellant unit, the propellant unit is a fixed base installed below the lower mold core, a telescopic rod that performs telescopic movement relative to the fixed base, and the telescopic unit It includes a piston connected to the rod and penetrating into the charge hole.

  The present invention can accelerate the production speed, reduce the raw material cost of the additive, and eliminate the high frequency preheating process.

The best mode for carrying out the present invention will be described below in detail with reference to the drawings.
FIG. 2 is a combination model diagram of the inventive transfer molding apparatus and the airframe.

The transfer molding apparatus provided with the liquid supply mechanism mainly includes a mold 20 and a liquid supply mechanism 30.
The mold 20 and the liquid supply mechanism 30 are fixedly connected to the molding machine 1, respectively.
The molding machine 1 includes a lower bolster 1A and an upper bolster 1B which is connected to the lower bolster 1A and is positioned above the lower bolster 1A.

The mold 20 includes a lower mold core 21 that is fixed to the lower bolster 1A, and an upper mold core 22 that is connected to the upper bolster 1B and is disposed corresponding to the lower mold core 21.
A charging hole 211 is installed at the center of the lower mold core 21, and a plurality of concave pits 212 and 221 are installed at corresponding positions of the lower mold core 21 and the upper mold core 22, respectively. Any two mutually corresponding pits 212 and 221 together constitute a mold cavity a.
A plurality of injection paths 222 (see FIG. 5) communicating with the charge holes 211 and the mold cavities a are provided at positions corresponding to the charge holes 211 of the upper mold core 22.

The liquid supply mechanism 30 is connected to the lower bolster 1A, and further includes a carry table 31 formed on one side of the lower mold core 21, a moving module 32 that performs linear movement relative to the carry table 31, and a dispensing unit 33. Including.
The dispensing unit 33 includes a stock cylinder 331 fixed to the moving module 32 and a jet nozzle 332 connected to the lower side of the stock cylinder 331.
The jet nozzle 332 fills the liquid raw material corresponding to the charge hole 211 by the sliding movement of the moving module 32.
The stock cylinder 331 obtains the liquid raw material 8 from the supply unit 35 through the transport pipe 34 (see FIG. 3).

The present invention further includes an estimation unit 40.
The thrust unit 40 is fixed to the inside of the lower bolster 1A, a telescopic bar 42 that expands and contracts relative to the fixed base 41, and an articulated bar 42 that is connected to the telescopic bar 42 and passes through the lower bolster 1A. A piston 43 that enters the charge hole 211 is included.

3, 4, and 5 are model diagrams in which the transfer molding device of the present invention performs the injection, a model diagram in which the liquid supply mechanism is retracted, and the upper mold core is pressed downward, and FIG. FIG.
As shown in FIGS. 3, 4, and 5, in use, the moving module 32 interlocks the dispensing unit 33 and moves linearly in the direction of the mold 20 by driving a motor (not shown).
When the jet nozzle 331 just corresponds to the position of the charge hole 211, a valve (not shown) of the jet nozzle 331 is opened, and a fixed amount of the liquid raw material 8 is injected into the charge hole 211 from the jet nozzle 331. .
Subsequently, the pouring unit 33 is moved away from the mold 20 by a motor and is moved away (see FIG. 4).
Further, the upper bolster 1B interlocks the upper mold core 22 and presses it toward the lower mold core 21.
Based on the same principle, the lower mold core 21 can be interlocked and can be designed to press toward the upper mold core 22.

6 and 7 are a model diagram in which the piston of the inventive transfer molding apparatus pushes the raw material and enters the mold cavity, and a local enlarged view of the area shown in FIG. 6-B.
As shown in FIGS. 6 and 7, when the expansion and contraction bar 42 of the thrust unit 40 pushes the piston 43 and moves it upward, the liquid raw material 8 is compressed, and the liquid raw material 8 is fed from the injection passage 222 to each mold cavity a. Flows in.
A semiconductor product can be obtained after the liquid raw material 8 is cooled and solidified.

It is a combination model figure of a well-known solid material supply mechanism. It is the combination model figure of this invention transfer molding device and a body. It is a model figure which this invention transfer molding device performs a charge. It is a model figure in which the liquid supply mechanism of the present invention transfer molding device is retracted and the upper mold core is pressed downward. Fig. 4 is a partially enlarged view of the area A. It is a model figure in which the piston of this invention transfer molding device thrusts a raw material and enters a mold cavity. Fig. 4-B is a local enlarged view of the area B.

Explanation of symbols

30a Solid material supply mechanism
31a Rectangular frame
311a Through hole
32a grip
33a Turn arm
34a thrust bar assembly
35a Stop plate
8a Solid materials
1 Molding machine
1A Lower bolster
1B Upper bolster
20 mold
21 Lower mold core
211 Fee hole
212, 221
22 Upper mold core
222 Injection route
a Mold cavity
30 Fluid supply mechanism
31 Carry stand
32 Movement module
33 Pricing unit
331 Stock Tube
332 Jet nozzle
34 Transport pipe
35 Distribution unit
40 fee units
41 Fixed base
42 Telescopic rod
43 Piston
8 Liquid ingredients

Claims (4)

A transfer molding apparatus provided with a liquid supply mechanism,
Including at least a mold and a liquid supply mechanism,
The mold includes a lower mold core and an upper mold core disposed corresponding to the lower mold core, and a charge hole is provided on the lower mold core,
The liquid supply mechanism includes a carry base installed on one side of the lower mold core, a moving module that slides relative to the carry base, and a pouring unit that is fixed to the moving module.
The dispensing unit includes a jet nozzle, the jet nozzle corresponds to the charge hole by sliding movement of the moving module, and is filled with a liquid raw material,
A transfer molding device provided with a liquid supply mechanism.   2. The transfer molding apparatus having a liquid supply mechanism according to claim 1, wherein the pouring unit further includes a stock cylinder fixed to the moving module, and the jet nozzle is connected to the lower side of the stock cylinder.   The liquid supply mechanism according to claim 2, wherein the liquid supply mechanism further includes a transport pipe and a supply unit, and the stock cylinder acquires the liquid raw material from the supply unit through the transport pipe. A transfer molding apparatus comprising: The transfer molding apparatus provided with the liquid supply mechanism further includes a propellant unit, the propellant unit is a fixed base installed below the lower mold core, a telescopic rod that performs telescopic movement relative to the fixed base, and the telescopic unit The transfer molding apparatus having a liquid supply mechanism according to claim 1, further comprising a piston connected to the rod and penetrating into the charge hole.

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